201225826 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤其涉及一種散熱裝置的導 風罩。 【先前技術】 [0002] 隨著電子技術的不斷發展，顯卡等電子元件集成度較高 的電子裝置在運行時會產生大量的熱量，該等熱量如果 不能被有效地散去，將直接導致溫度急劇上升，而嚴重 影響到電子裝置的工作效率。為此，通常在電子裝置上 安裝散熱裝置來進行散熱。 [0003] 常見的散熱裝置一般包括與電子元件導熱接觸的一散熱 器及安裝於該散熱器附近的一風扇。為了提升風扇氣流 的利用率，還在散熱器上加裝一導風罩，以將風扇所產 生的氣流集中地引導至散熱器，使散熱器迅速與氣流換 熱。然而，針對不同功率的電子元件，需要合理地搭配 不同高度或寬度的散熱器，於是針對不同高度或寬度的 散熱器，需要對應設計不同高度或寬度的導風罩來與散 熱器相匹配，整體上增加了散熱裝置的設計成本。 【發明内容】 [0004] 有鑒於此，實有必要提供一種可與不同高度或寬度的散 熱器相配合使用的導風罩及應用該導風罩的散熱裝置。 [0005] 一種導風罩，包括一導風罩本體及連接於該導風罩本體 上的一導風板，該導風罩具有一氣流出口及一氣流入口 ，其中氣流入口用於供氣流流入導風罩，氣流出口用於 供氣流流出導風罩，該導風板的一端枢接於導風罩本體 099143572 表單編號A0101 第4頁/共14頁 0992075475-0 201225826 鄰近氣流入口處’該導風板的另一端可固定在導風罩本 體的不同位置。 [0006] ❹ [0007] [0008]201225826 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipating device, and more particularly to an air hood of a heat dissipating device. [Prior Art] [0002] With the continuous development of electronic technology, electronic devices with high integration of electronic components such as video cards generate a large amount of heat during operation. If such heat cannot be effectively dissipated, it will directly cause temperature. It has risen sharply, which seriously affects the working efficiency of electronic devices. For this reason, a heat sink is usually mounted on the electronic device for heat dissipation. [0003] A common heat sink generally includes a heat sink in thermal contact with the electronic component and a fan mounted adjacent the heat sink. In order to improve the utilization of the fan airflow, an air hood is further installed on the radiator to centrally guide the airflow generated by the fan to the radiator, so that the radiator quickly exchanges heat with the airflow. However, for different power electronic components, it is necessary to properly match heat sinks of different heights or widths. Therefore, for radiators of different heights or widths, it is necessary to design air deflectors of different heights or widths to match the heat sinks. The design cost of the heat sink is increased. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide an air hood that can be used with heat sinks of different heights or widths and a heat sink using the air hood. [0005] An air hood includes a hood body and a wind deflector connected to the hood body, the air hood having an air outlet and an air inlet, wherein the air inlet is used for airflow Air duct cover, air outlet for airflow out of the air duct, one end of the air deflector is pivotally connected to the air duct body 099143572 Form No. A0101 Page 4 / 14 pages 0992075475-0 201225826 Near the air inlet entrance The other end of the wind deflector can be fixed at different positions of the air duct body. [0006] [0008] [0008]
[0009] 099143572 一種散熱裝置，包括一散熱器、及罩設該散熱器的一導 風罩，所述導風罩包括一導風罩本體及連接於該導風罩 本體上的一導風板，該導風罩具有鄰近散熱器的一氣流 出口及鄰近該導風板的一氣流入口，其中氣流入口用於 供氣流流入導風罩，氣流出口用於供氣流流出導風罩， 該導風板的一端樞接於導風罩本體鄰近氣流入口處，該 導風板的另一端可固定在導風罩本體的不同位置，以與 不同高度或寬度的散熱器配合。 與習知技術相比，本發明的散熱裝置的導風罩内設置的 導風板可藉由調節固定在導風罩的不同位置，使得同一 個導風罩可與不同高度或寬度的散熱器相配合，降低了 整個散熱裝置的設計成本。 【實施方式】 請參照圖1為本發明一實施例的散熱裝置的使用狀態圖。 本實施例中，該散熱裝置安裝在一電路板30上，用來為 該電路板30上的一電子元件32散熱。該散熱裝置包括一 散熱器10及罩設該散熱器10的一導風罩20。 請同時參照圖2，該散熱器10包括與電子元件32導熱接觸 的一吸熱板12、置於吸熱板12上方的一鰭片組16、及導 熱連接吸熱板12和鰭片組16的四根熱管18。上述鰭片組 16由複數鰭片162堆疊而成，該鰭片162由銅等金屬材料 製成。各鰭片162間隔排列，相鄰的鰭片162間形成複數 氣流通道（未標號）。 表單編號Α0101 第5頁/共14頁 0992075475-0 201225826 [0010]該導風罩20可採用塑膠等材料製成，其包括一導風罩本 體21及一導風板23。該導風罩本體21包括一頂板22及從 該頂板22的相對兩側外緣垂直向下延伸的二側板24。該 二側板24之間的距離大致等於該散熱器1〇的寬度，該散 熱器10位於二侧板24之間。頂板22的一端開設一矩形開 口 220，所述散熱器10安裝於該導風罩2〇内位於該頂板 22遠離開口 220的另一端處，該導風板23安裝於該導風罩 本體21内位於該開口 220處。該導風罩20鄰近開口 220的 一端具有一氣流入口 25，導風罩20遠離開口 220的一端具 有一氣流出口 26。該導風罩2〇的二娜板24與該頂板22的 連接處開設一對相對的樞接孔240，該柩接孔240位於該 開口 220與該氣流入口 25之間。該導風罩20的每一侧板 24鄰近散熱器10處間隔開設四個定位孔242，該四個定位 孑L242在側板24上呈弧形排列。該二側板24的定位孔242 從上向下分別沿水平方向對齊，形成四對分別對應不同 高度散熱器的定位孔242。該導風板23包括位於二側板24 之間的一矩形的本體232、自該本體232 —端的邊緣水平 向外延伸的一樞轴234及自該本體232另一端的邊緣垂直 向下延伸的二卡置部236。每一卡置部236上凸伸出一圓 形凸點237。該導風板23的本體232的面積略大於開口 220的面積。該導風板23的樞軸234樞接於柩接孔240， 該二卡置部236的凸點237對應卡置於該側板24最上面的 一對定位孔242内，以將導風板23固定，並使該導風板23 的本體232搭靠在該散熱器1〇頂部，以引導氣流沿導風板 23吹向散熱器10。可以理解地，該卡置部236上可開設一 鎖孔’以供螺釘穿過將該卡置部236固定在該侧板24上。 099143572 表單編號 A〇l〇i 第 6 頁/共 14 頁 0992075475-0 201225826 [0011] [0012] θ [0013] Ο [0014] [0015] [0016] 如圖3所不’當更換另—高度較小的散熱器1〇a時，僅需 沿枢轴234向下旋轉導風板23，將卡置部236的凸點237 卡置於該側板24的另一對定位孔242内，使導風板的本 體232搭靠在該散熱器1〇a上。從而將氣流向下導引至散 熱器10内，與散熱器1〇進行充分的熱交換。 可以理解地’該導風罩2〇的其中一側板24底部可向内侧 延伸出一凸起，該凸起和頂板22鄰近氣流入口 25處開設 該對枢接孔240，上述定位孔242間隔地開設於導風罩20 的頂板22鄰近散熱器1〇處，該導風板23的樞軸234樞接 於樞接孔240 ’該二卡置部236的凸點237對應卡置於該 頂板22的其中一定位孔242内，以將導風板23固定，使該 導風板23的本體232搭靠在該散熱器1〇側部，這樣該導風 罩20可與不同寬度的散熱器相配合。 與習知技術相比，本發明的散熱裝置的導風罩20内設置 的導風板23可藉由調節固定在導風罩20的不同位置，使 得同一個導風罩可與不同高度或寬度的散熱器相配合， 降低了整個散熱裝置的設計成本。 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士 ’在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明一實施例的散熱裝置的使用狀態圖。 圖2係圖1的分解圖。 099143572 表單編號A0101 第7買/共Η頁 0992075475-0 201225826 [0017] 圖3係散熱裝置的另一形態的示意圖。 【主要元件符號說明】 [0018] 散熱器：10、10a [0019] 導風罩：20 [0020] 電路板：30 [0021] 電子元件：32 [0022] 吸熱板：12 [0023] 鰭片組：1 6 [0024] 熱管：18 [0025] 鰭片：162 [0026] 導風罩主體：21 [0027] 頂板：22 [0028] 侧板：24 [0029] 開口 ： 2 2 0 [0030] 導風板：23 [0031] 氣流入口 ： 25 [0032] 氣流出口 ： 2 6 [0033] 枢接孔：240 [0034] 定位孔：242 [0035] 本體：232 099143572 表單編號A0101 第8頁/共14頁 0992075475-0 201225826 [0036] 枢軸： [0037] 卡置部 [0038] 凸點： 234 ：236 237[0009] 099143572 A heat dissipating device includes a heat sink and an air guiding cover covering the heat sink, the air guiding cover includes an air guiding cover body and a wind deflecting plate connected to the air guiding cover body The air hood has an airflow outlet adjacent to the heat sink and an airflow inlet adjacent to the air deflector, wherein the airflow inlet is used for airflow into the air hood, and the airflow outlet is used for airflow out of the air hood. One end of the plate is pivotally connected to the air hood body adjacent to the airflow inlet, and the other end of the air deflector can be fixed at different positions of the air hood body to cooperate with the heat sinks of different heights or widths. Compared with the prior art, the air deflector provided in the air hood of the heat dissipating device of the present invention can be fixed at different positions of the air hood by adjusting, so that the same air hood can be combined with the radiator of different height or width. Together, the design cost of the entire heat sink is reduced. [Embodiment] FIG. 1 is a view showing a state of use of a heat sink according to an embodiment of the present invention. In this embodiment, the heat sink is mounted on a circuit board 30 for dissipating heat from an electronic component 32 on the circuit board 30. The heat sink includes a heat sink 10 and a wind deflector 20 that covers the heat sink 10. Referring to FIG. 2 at the same time, the heat sink 10 includes a heat absorbing plate 12 in thermal contact with the electronic component 32, a fin set 16 disposed above the heat absorbing plate 12, and four heat conductive connection heat absorbing panels 12 and fin sets 16. Heat pipe 18. The above fin group 16 is formed by stacking a plurality of fins 162 made of a metal material such as copper. The fins 162 are spaced apart, and a plurality of air flow channels (not labeled) are formed between adjacent fins 162. Form No. Α0101 Page 5 of 14 0992075475-0 201225826 [0010] The air hood 20 can be made of a plastic or the like, and includes an air hood body 21 and a wind deflector 23. The hood body 21 includes a top panel 22 and two side panels 24 extending vertically downward from opposite outer edges of the top panel 22. The distance between the two side panels 24 is substantially equal to the width of the heat sink 1 , and the heat sink 10 is located between the two side panels 24. One end of the top plate 22 defines a rectangular opening 220. The heat sink 10 is mounted in the air guiding cover 2 at the other end of the top plate 22 away from the opening 220. The air guiding plate 23 is mounted in the air guiding cover body 21. Located at the opening 220. The air hood 20 has an air flow inlet 25 adjacent one end of the opening 220, and an air outlet 26 is provided at one end of the air hood 20 away from the opening 220. A pair of opposite pivot holes 240 are defined in the junction of the slabs 24 of the air hood 2 and the top plate 22. The splicing holes 240 are located between the opening 220 and the airflow inlet 25. Each of the side plates 24 of the air hood 20 is provided with four positioning holes 242 spaced apart from the heat sink 10, and the four positioning 孑L242 are arranged in an arc shape on the side plates 24. The positioning holes 242 of the two side plates 24 are respectively aligned from the top to the bottom in the horizontal direction to form four pairs of positioning holes 242 respectively corresponding to the heat sinks of different heights. The air deflector 23 includes a rectangular body 232 between the two side plates 24, a pivot 234 extending horizontally outward from an edge of the end of the body 232, and a vertical downward extending from an edge of the other end of the body 232. The card portion 236. A circular bump 237 protrudes from each of the latching portions 236. The body 232 of the air deflector 23 has an area slightly larger than the area of the opening 220. The pivot 234 of the air deflector 23 is pivotally connected to the boring hole 240. The bump 237 of the two latching portions 236 is correspondingly disposed in a pair of positioning holes 242 of the uppermost side of the side plate 24 to guide the wind deflector 23 The body 232 of the air deflector 23 is fixed against the top of the heat sink 1 to guide the airflow along the wind deflector 23 to the heat sink 10. It can be understood that a locking hole ‘ can be formed in the locking portion 236 for the screw to pass through the locking portion 236 to the side plate 24 . 099143572 Form No. A〇l〇i Page 6 of 14 0992075475-0 201225826 [0012] [0012] [0014] [0016] [0016] As shown in FIG. 3, when replacing another height When the heat sink 1a is smaller, the wind deflector 23 only needs to be rotated downward along the pivot 234, and the bump 237 of the latching portion 236 is inserted into the other pair of positioning holes 242 of the side plate 24 to guide the guide. The body 232 of the wind plate rests on the heat sink 1A. Thereby, the air flow is guided downward into the heat radiator 10, and sufficient heat exchange is performed with the heat sink 1〇. It can be understood that the bottom of one side plate 24 of the air hood 2 可 can extend inwardly, and the protrusion and the top plate 22 open the pair of pivot holes 240 adjacent to the air inlet 25, and the positioning holes 242 are spaced apart. The top plate 22 of the air hood 20 is adjacent to the heat sink 1 . The pivot 234 of the air deflector 23 is pivotally connected to the pivot hole 240 ′. The bump 237 of the two latching portions 236 is correspondingly placed on the top plate 22 . One of the positioning holes 242 is fixed to fix the air deflector 23 such that the body 232 of the air deflector 23 abuts against the side of the heat sink 1 such that the air deflector 20 can be combined with the heat sink of different widths. Cooperate. Compared with the prior art, the air deflector 23 disposed in the air guiding cover 20 of the heat dissipating device of the present invention can be fixed at different positions of the air guiding cover 20 by adjusting, so that the same air guiding cover can be different in height or width. The combination of the heat sink reduces the design cost of the entire heat sink. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a state of use of a heat sink according to an embodiment of the present invention. Figure 2 is an exploded view of Figure 1. 099143572 Form No. A0101 No. 7 Buy/Total Page 0992075475-0 201225826 [0017] FIG. 3 is a schematic view showing another form of the heat sink. [Main component symbol description] [0018] Heat sink: 10, 10a [0019] Air hood: 20 [0020] Circuit board: 30 [0021] Electronic component: 32 [0022] Heat absorbing plate: 12 [0023] Fin set :1 6 [0024] Heat pipe: 18 [0025] Fin: 162 [0026] Windshield body: 21 [0027] Top plate: 22 [0028] Side plate: 24 [0029] Opening: 2 2 0 [0030] Wind deflector: 23 [0031] Airflow inlet: 25 [0032] Airflow outlet: 2 6 [0033] Pivot hole: 240 [0034] Positioning hole: 242 [0035] Body: 232 099143572 Form No. A0101 Page 8 of 14 Page 0992075475-0 201225826 [0036] Pivot: [0037] Cartridge [0038] Bump: 234: 236 237
099143572 表單編號A0101 第9頁/共14頁 0992075475-0099143572 Form No. A0101 Page 9 of 14 0992075475-0