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TW201214054A - Proximity exposure device, its stage temperature control method, and manufacturing method of a display panel substrate - Google Patents

Proximity exposure device, its stage temperature control method, and manufacturing method of a display panel substrate Download PDF

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Publication number
TW201214054A
TW201214054A TW100105822A TW100105822A TW201214054A TW 201214054 A TW201214054 A TW 201214054A TW 100105822 A TW100105822 A TW 100105822A TW 100105822 A TW100105822 A TW 100105822A TW 201214054 A TW201214054 A TW 201214054A
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Taiwan
Prior art keywords
stage
warm
substrate
temperature
chuck
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TW100105822A
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Chinese (zh)
Inventor
Manabu Minegishi
Ryugo Sato
Yuta Yambe
Ichirou Edaki
Hiraku Watanabe
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Hitachi High Tech Corp
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Publication of TW201214054A publication Critical patent/TW201214054A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60Substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)

Abstract

In a proximity exposure device, when a stage used for moving a substrate is driven by a linear motor, the temperature change of the stage is small and the burning-in of patterns can be performed with good precision. The temperature of the stage is detected, and when the operation starts or during operation, masks 2 are kept on a mask holder 20, and in a state when substrates 1 are not carried on a chuck 10, and the temperature of the detected stage is under a lower limit value, the stage is driven by a linear motor, and a first warming up operation is performed, so as to raise the temperature of the stage to be larger than a base value that is higher than the lower limit value by means of the heat of the linear motor. Before the operation starts or during operation, even if the temperature of the stage is under the lower limit value, the temperature change of the stage during exposure processing is small and the burning-in of the patterns is performed with good precision.

Description

201214054 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種在液晶顯示器(display)裝置等 的顯示用面板(panel)基板的製造中,使用鄰近(proximity ) 方式來進行基板的曝光的鄰近曝光裝置、鄰近曝光裝置的 載台溫度控制方法以及使用這些装置和方法的顯示用面板 基板的製造方法,尤其是涉及一種通過線性馬達(linear motor)來驅動用來移動基板的載台的鄰近曝光裝置、鄰近 曝光裝置的載台溫度控制方法以及使用這些裝置和方法的 顯示用面板基板的製造方法。 【先前技術】 用作顯示用面板的液晶顯示器裝置的薄膜電晶體 (Thin Film Transistor,TFT)基板或彩色濾光器(color filter)基板、電漿(piasma)顯示器面板用基板、有機電 致發光(Electroluminescence ’ EL)顯示面板用基板等的 疋使用曝光裝置’通過微影(photolithography)技術 在基板上形成圖案(pattern)而進行。作為曝光裝置,有 使用透鏡(lens)或鏡子來將遮罩(mask)的圖案投影到 基板上的投影(Projection)方式、以及在遮罩與基板之間 設置微小的間隙(鄰近間隙(proxiniity gap))而將遮罩 的圖案轉印到基板上的鄰近方式。與投影方式相比,鄰近 方式的圖案析象性能較差,但是照射光學系統的結構簡 單’且處理能力高,適合於量產用途。 近年來,在顯示用面板的各種基板的製造中,為了對 201214054 應於大型化以及尺寸的多樣化’須準備相對較大的基板, 並根據顯示用面板的尺寸來從1片基板中製造出1片或多 片顯示用面板基板。此時,對於鄰近方式而言,如果要包 括曝光基板的一面,則需要與基板相同大小的遮罩,從而 導致高價的遮罩成本(cost)進一步增大。因此,使用相 對於基板較小的遮罩,通過载台來使基板向χγ方向步進 移動,將基板的一面分成多次照射(shot)來進行曝光的 方式成為主流。 以往,在鄰近曝光裝置中,對於載台的驅動使用滾珠 螺杆(ball screw)等的進給螺杆。但是,隨著顯示用面板 的大晝面化,基板越大型化,要讓基板的移動高速且高精 度地進行的要求越強烈,而以往的載台對於移動基板的速 度以及精度的提高有限。 、作為取代進給螺杆的機構,開發出了一種使用内置有 磁鐵或線目(C〇il)的定子和内置有線圈或磁鐵的轉子的 線性馬達。定子與轉子被設置成隔著微小的間隙而不接 觸,當電流流經線圈時,根據弗萊明左手定則(Fiemin left_hand rule),由線圈的電流與磁鐵的磁場對轉子 1 力(洛倫兹力(L0rentzf0rce))。由於定子與轉子 觸而無摩擦’因此可實現高速且高精度的移動。作為 f種線性馬達的鄰近曝絲置,在專利文獻1以及專利女 獻2中有所記載。 專利文 [先前技術文獻] [專利文獻] 1 201214054 [專利文獻1]曰本專利特開2009-258195號公報 [專利文獻2]日本專利特開2〇〇9_2581%號公報 =近曝域置巾’ t通過雜馬絲軸移動基板 的载。載台的重量會變大㈣動距離也變長,因此線 =馬達的負載大,從線性馬達產生大量的熱1此,在通 系的運轉時與停止基板的供給㈣止載台的移動時載台 的溫度會發生較大變化。-Μ台的溫度發生較大變化, 則因熱膨脹引起的載台的變形量會發生較大變化,因此由 载台所移動的基板的位置以及㈣于水平方向的斜度會發 生變動,從而存在圖案的燒附精度下降的問題。 【發明内容】 本發明的課題在於,在鄰近曝光裝置中,當通過線性 馬達來驅動用移動基板的載台肖,可減小載台的溫度變 化,以精度良好地進行圖案的燒附。而且,本發明的課題 在於,精度良好地進行圖案的燒附,從而製造高品質的顯 示用面板基板。 ‘ 本發明的鄰近曝光裝置包括:夾盤(chuck),搭載基 板;遮罩架(maskholder),保持遮罩;載台,移動夾盤; 以及線性馬達,驅動該載台,此鄰近曝光裝置包括:檢测 機構,檢測該載台的溫度;以及控制機構,控制線性馬達, 且控制機構當在運轉開始時或運轉中,在遮罩架上保持有 遮罩且夾盤上未搭載基板的狀態下’由檢測機構所檢測出 的載台的溫度小於下限值時,通過線性馬達來驅動該載 台’以進行利用線性馬達的熱來將載台的溫度提高至比下 201214054 限值高的基準值以上的第i暖機運動(warming up operation) ° 而且’本發明的鄰近曝光裝置的載台溫度控制方法 中,鄰近曝光裝置包括:夾盤’搭載基板;遮罩架,保持 遮罩;載台,移動夾盤;以及線性馬達,驅動該載台,此 鄰近曝光裝置的載台溫度控制方法是’檢測該載台的溫 度,當在運轉開始時或運轉中,在遮罩架上保持有遮罩且201214054 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate exposure process using a proximity method in the manufacture of a display panel for a liquid crystal display device or the like. A proximity exposure device, a stage temperature control method adjacent to the exposure device, and a method of manufacturing a display panel substrate using the same, and more particularly to a stage for driving a stage for moving a substrate by a linear motor A method of controlling a stage temperature adjacent to an exposure device, an adjacent exposure device, and a method of manufacturing a panel substrate for display using the same. [Prior Art] A Thin Film Transistor (TFT) substrate or a color filter substrate, a substrate for a plasma display panel, and an organic electroluminescence of a liquid crystal display device used as a display panel (Electroluminescence ' EL) The display panel substrate or the like is formed by forming a pattern on the substrate by a photolithography technique using an exposure device '. As an exposure device, there is a projection method in which a lens or a mirror is used to project a pattern of a mask onto a substrate, and a small gap (proxiniity gap) is provided between the mask and the substrate. )) The manner in which the pattern of the mask is transferred to the substrate. Compared with the projection method, the patterning performance of the adjacent mode is poor, but the structure of the illumination optical system is simple and the processing capability is high, which is suitable for mass production. In recent years, in the manufacture of various substrates for display panels, in order to increase the size and size of 201214054, a relatively large substrate has to be prepared, and it is manufactured from one substrate according to the size of the display panel. One or more panel substrates for display. At this time, in the case of the proximity mode, if one side of the substrate is to be exposed, a mask of the same size as the substrate is required, resulting in a further increase in the cost of the mask. Therefore, a method in which the substrate is moved stepwise in the χγ direction by the stage with respect to the mask having a small substrate, and one side of the substrate is divided into a plurality of shots to perform exposure is mainstream. Conventionally, in the proximity exposure apparatus, a feed screw such as a ball screw has been used for driving the stage. However, as the size of the display panel is increased, the size of the substrate is increased, and the demand for high-precision and high-precision movement of the substrate is increased. However, the conventional stage has limited improvement in speed and accuracy of the moving substrate. As a mechanism for replacing the feed screw, a linear motor using a stator having a magnet or a wire mesh and a rotor having a coil or a magnet built therein has been developed. The stator and the rotor are arranged so as not to be in contact with each other through a small gap. When current flows through the coil, according to the Fleming left-hand rule, the current from the coil and the magnetic field of the magnet oppose the rotor 1 (Lorentz) Force (L0rentzf0rce)). Since the stator and the rotor are in contact without friction, high speed and high precision movement can be achieved. The proximity of the f-type linear motor is described in Patent Document 1 and Patent No. 2. [Patent Document] [Patent Document] 1 201214054 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-258195 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2 〇〇 9_2581% 'T move the substrate through the miscellaneous horse shaft. The weight of the stage is increased (4) The moving distance is also long, so the line = the load of the motor is large, and a large amount of heat is generated from the linear motor. This is the case when the operation of the system is stopped and the supply of the substrate is stopped (4) when the stage is moved. The temperature of the stage will change greatly. - If the temperature of the platform changes greatly, the amount of deformation of the stage caused by thermal expansion will change greatly. Therefore, the position of the substrate moved by the stage and (4) the inclination in the horizontal direction will change, and the pattern exists. The problem of the accuracy of the burnout is reduced. SUMMARY OF THE INVENTION An object of the present invention is to reduce the temperature change of a stage and to accurately burn a pattern by driving a stage of a moving substrate by a linear motor in a proximity exposure apparatus. Further, an object of the present invention is to produce a high-quality display panel substrate by performing pattern baking with high precision. The proximity exposure apparatus of the present invention includes: a chuck, a mounting substrate; a mask holder, a mask; a stage, a moving chuck; and a linear motor that drives the stage, the proximity exposure device includes a detecting mechanism that detects the temperature of the stage; and a control mechanism that controls the linear motor, and the control mechanism maintains a mask on the mask frame and the substrate is not mounted on the chuck at the start of operation or during operation When the temperature of the stage detected by the detecting means is less than the lower limit value, the stage is driven by a linear motor to increase the temperature of the stage to a higher limit than the 201214054 limit by using the heat of the linear motor. The i-th warming up operation above the reference value ° and in the stage temperature control method of the proximity exposure apparatus of the present invention, the proximity exposure apparatus includes: a chuck 'mounting substrate; a mask holder to hold the mask; a stage, a moving chuck; and a linear motor that drives the stage, the stage temperature control method of the proximity exposure device is 'detecting the temperature of the stage, when the operation starts Or operation, the rack holding the mask and the mask

夾盤上未搭載基板的狀態下’檢測出的載台的溫度小於下 限值時,通過線性馬達來驅動該載台,以進行利用線性馬 達的熱來將該载台的溫度提高至比下限值高的基準值以上 的第1暖機運動。 由於檢測該載台的溫度,當在運轉開始時或運轉中, 在遮罩架上保持有遮罩且夾盤上未搭載基板的狀態下,檢 測出的载台的溫度小於下限值時,通過線性馬達來驅動該 載台以進行冑魏’目此在帛1韻魏結束之後, 一旦準備好搭载於夾盤上的基板,便可立即開始曝光處 理。並士,由於通過第1暖機運動將載台的溫度提高至比 下限值N的基準值以上,因此即使在運轉開始前或運轉中 度降低至小於下限值,曝光處理+的載台的溫度 父也較小,從而可精度良好地進行圖案的燒附。 由吐進:、’本發明的鄰近曝光裝置巾,控制機構當在運轉 下心=架上保持有遮罩且夾盤上未搭載基板的狀態 :”斤檢測出的載台的溫度為下限值以上且小 、土準值向的上限值時’通過線性馬達來鶴載台,以When the temperature of the detected stage is less than the lower limit value in a state where the substrate is not mounted on the chuck, the stage is driven by a linear motor to increase the temperature of the stage to the lower limit by the heat of the linear motor. The first warm-up motion above the reference value with a high limit. When the temperature of the stage is detected, when the mask is held on the mask frame and the substrate is not mounted on the chuck at the start of the operation or during operation, if the temperature of the detected stage is less than the lower limit value, The stage is driven by a linear motor to perform the exposure process. Once the substrate mounted on the chuck is prepared, the exposure process can be started immediately. In the first warm-up exercise, the temperature of the stage is increased to be higher than the reference value of the lower limit value N. Therefore, even before the start of the operation or during the operation, the degree is reduced to less than the lower limit value, and the stage of the exposure processing + The temperature of the parent is also small, so that the pattern can be burned with high precision. From the spit:, the proximity exposure device of the present invention, the control mechanism maintains a mask on the lower side of the operation, and the substrate is not mounted on the chuck: "the temperature of the stage detected by the pound is the lower limit value" Above and small, the upper limit of the value of the soil is 'the crane is carried by the linear motor to

S 7 201214054 的溫度保持為下限值以上 直至準備好搭載於夾盤上 進行利用線性馬達的熱來將载台 且小於上限值的第2暖機運動, 的基板為止。 中,〜、軍二二•光裝置的载台溫度控制方法 =態:’檢測出的載台的溫度為下限值以上 比基準值㈣上限值時,通過線性馬達來驅喊台,以進 订利用線性馬賴絲㈣料溫聽持為下限值以上且 限值的第2暖機運動,直至準備好搭載於夾盤上的 基扳為止。 由於當在運射’麵轉上縣有料且爽盤上未 搭載基板的狀態下,檢測出的載台的溫度為下限值以上且 小於比基準值高的上祕時,通過祕馬達來驅動載台, 以進行利祕性馬達的絲將載台的溫度麟為下限值以 上且小於上限_第2暖機運動,直至準備好搭載於夹盤 上的基板為it,因此運轉中的载台的溫度變化較小,從而 可精度良好地進行圖案的燒附。並且,在運轉中,一旦準 備好搭載於夾盤上的基板,便可立即開始曝光處理。一 。進而,本發明的鄰近曝光裝置中,控制機構存儲第j 暖機運動以及第2暖機勒的結束時刻料丨暖機運動以 及第2暖機運動中的載台的移動次數,當在運轉開始時, 在^罩架上歸有遮罩且缝上未搭載基板驗態下,從 之4的第1暖機運動或第2暖機運動的結束時刻經過規定 時間時’或之前的第1暖機運動$第2暖機運動中的载台 201214054 的移動次數祕蚊錢時,㈣線 進行第1暖機運動。 動載σ以 而且,本發明的鄰近曝光裝置 中’存儲第1暖機運動以及第 1度控制方法 暖機運動中的載台的移動次數,當! 從上保持有遮罩且夾盤上未搭載基板 的狀態下攸之_^暖機運動或第 時刻經過規定時間時,妓前_ 1 η觀聊、’。采 ϋ ㈣讀運動或第2暖機 運動中的載σ的移動次數小於規定次數時,通過線性馬達 來驅動載台以進行第1暖機運動。 ,即使在運轉開始前載台的溫度未下降至小於下限值, 但當在運轉開始時,從之前的第丨暖機運動或第2暖機運 動的結束時刻經過規定時間時,或者之前的第丨暖機運動 或第2暖機運動中的載台的移動次數小於規定次數時進行 第1暖機運動,因此載台的溫度變化會變得更小,從而可 進一步精度良好地進行圖案的燒附。 Φ 本發明的顯示用面板基板的製造方法是’使用上述的 任一種鄰近曝光裝置來進行基板的曝光,或者,使用上述 的任一種鄰近曝光裝置的載台溫度控制方法來控制載台的 溫度’以進行基板的曝光。由於载台的溫度變化較小,可 精度良好地進行圖案的燒附,因此可製造高品質的顯示用 面板基板。 【發明的效果】 根據本發明的鄰近曝光裝置以及鄰近曝光裝置的載台 201214054 ,度控制方法’通過檢測載台的溫度,且當在運轉開始時 =轉t,在鮮架上保財麵且缝上未搭載基板的 、、匕、下’檢測出的載台的溫度小於下限值時,通過線性馬 達來驅動載台’以進行線性馬達的絲將載台的溫度 提南至比下限值高的基準值以上的第i暖機運動,從而即 使在運轉開始«運轉中載台的溫度降低至小於下限值, 也能夠減小曝域理中的載㈣溫度變化,從而可精度良 好地進行圖案的燒附。 進而,根據本發明的鄰近曝光裝置以及鄰近曝光裝置 的載台溫度㈣方法’當在運射,在遮罩架上保持有遮 罩且失盤上未搭載基板的狀態下,檢測出的載台的溫度為 下限值以上且小於比基準值高的上限值時,通過線性馬達 來驅動載台,以進行利用線性馬達的熱來將载台的溫度保 持為下限值以上且小於上限值的第2暖機運動,直至準備 好搭載於夾盤上的基板為止,因此可減小運轉中的載台的 溫度變化,從而可精度良好地進行圖案的燒附。並且,在 運轉中,一旦準備好搭載於夾盤上的基板,便可立即開始 曝光處理。 ° 進而’根據本發明的鄰近曝光裝置以及鄰近曝光裝置 的載台溫度控制方法,通過存儲第丨暖機運動以及第2暖 機運動的結束時刻與第1暖機運動以及第2暖機運動中的 載台的移動次數,且當在運轉開始時,在遮罩架上保持有 遮罩且夾盤上未搭載基板的狀態下,從之前的第丨暖機運 動或第2暖機運動的結束時刻經過規定時間時,或者之前 201214054 的$ 1暖機運動或第2暖機運動中的載台的移動次數小於 規定次數時’通過線性馬達來驅動載台以進行第1暖機運 動由此可進一步減小載台的溫度變化,從而可進一步精 度良好地進行圖案的燒附。 根據本發明的顯示用面板基板的製造方法,可減小载 台的溫度變化’從而可精度良好地進行圖案的燒附,因此 可製造高品質的顯示用面板基板。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說 明如下。 【實施方式】 圖1是表示本發明的一個實施方式的鄰近曝光裝置的 概略結構的圖。而且,圖2是本發明的一個實施方式的鄰 近曝光裝置的侧面圖,圖3是本發明的一個實施方式的鄰 近曝光裝置的正面圖。鄰近曝光裝置包括底座(base) 3、 X導向器(guide) 4、X載台5、Y導向器6、Y載台7、θ 載台8、炎盤支樓台9、夾盤10、遮罩架20、多個線性馬 達、定子安裝底座33、43、轉子安裝底座34、溫度感測器 (sensor) 50、驅動電路60以及主控制裝置70而構成。另 外’圖2以及圖3中,省略了驅動電路60以及主控制裝置 7〇。除了這些構件以外’鄰近曝光裝置還包括將基板1搬 入到夾盤10上或將基板1從夾盤10上搬出的基板搬送機 器人(robot)、照射曝光用光的照射光學系統、進行裝置 内的溫度管理的溫度控制單元(unit)等。 201214054 另外,以下所說明的實施方式中的χγ方向僅為 示,也可將X方向與γ方向予以調換。 ?, 基板1在遠離進行基板1的曝光的曝光位置的骏載/ 卸載(load/unload)位置處,由未圖示的基板搬送棬 搬入至夾盤10上,或從夾盤1〇上搬出。基板丨向夾盤1〇 上的裝載以及基板1從夾盤10上的卸載是使用夾盤1〇上 所設的多個上頂銷(pin)來進行。上頂銷被收納於夾盤 10的内部,當從夾盤1〇的内部上升而將基板丨裝载於夾 盤10時,該上頂銷從基板搬送機器人接納基板丨,當從夾 盤10上卸載基板1時,該上頂銷將基板丨交付給基板搬 機器人。 ' 在圖1以及圖2中,夾盤1〇位於進行基板丨的曝光的 曝光位置。在曝光位置的上空,設置著保持遮罩2的遮罩 架20。在圖1中,在遮罩架2〇上設有讓曝光用光通過的 開口 20a,在開口 20a的下方安裝著遮罩2。在遮罩架2〇 的下表面的開口 20a的周圍,設有吸附槽,遮罩架2〇通過 吸附槽來真空吸附以保持遮罩2的周邊部。在由遮罩架2〇 所保持的遮罩2的上空,配置著未圖示的照射光學系統。 在曝光時,來自照射光學系統的曝光用光透過遮罩2而照 射至基板1,由此來將遮罩2的圖案轉印到基板!的表面 上,從而在基板1上形成圖案。 在圖2以及圖3中,夾盤10經由夾盤支樓台9而搭載 於Θ載台8,在Θ載台8的下方設置著γ載台7以及X載台 5。X载台5被搭載於底座3上所設的X導向器4上,並 12 201214054 沿著X導向器4而向X方向移動。γ栽台7被搭載於χ 載台5上所設的γ導向器6上,並沿著丫導向器6而向γ 方向移動。Θ載台8被搭载於γ載台7上,並向θ方向旋 支撐# 9被搭載於θ載台8上’並在多處支撐著 夾盤10。 通過X載台5向X方向的移動以及¥載台7向γ方 向的移動,失盤1〇在裝载/卸載位置與曝光位置之間移 動。在裝載/卸載位置處,通過X載台5向乂方向的移動、 γ載台7向Υ方向的移動以及0載台8向0方向的旋轉, 來進行搭載於夾盤10上的基板丨的預對準 (Pre_allgnment)。在曝光位置處,通過χ載台$向X方 向的移動以及Υ載台7向Υ方而沾栽:&amp; + 軾门Y万向的移動,來進行搭載於夾 ^ 〇的基板WXY方向的步進軸。並且,通過 I = x方向的移動、γ載台7向γ方向的移動以及㈣ ^向Θ方向的旋轉’以進行基板i的對準。而且,通過 示的Z-傾斜(tilt)機構來使遮罩架2〇向z方向移動 以及傾斜,由此,進行鮮2與基板Μ _對準。 另外在本貫施方式中,通過使遮罩架20向ζ方向 及4員斜,彳之而進行遮罩2與基板丨的間隙對準,但也 =在夹盤支#台9上設置2_傾斜機構,並使爽盤1〇向2 移動及傾斜,由此來進行遮罩2與基板丨關隙對準。 在本實施方式中,作為驅動χ載台5的驅動機構,使 個線性馬達。各祕馬達具有‘内置有磁鐵的板狀的 疋子31 ;以及内置有線圈的板狀的轉子%。 13 201214054 在圖3中,在底座3上,設置有向又方向(圖3的圖 式縱深方向)延伸的槽。在底座3的槽的左右角上,分別 安裝著向X方向延伸的定子安裝底座在各定子安裝底 座33上’安裝著各線性馬達的定子3卜各線性馬達的定 子31通過定子安裝底座33,以豎立在底座3上所設的槽 内的狀態而向X方向延伸安裴著。另一方面,在χ载台= 的下表面,安裝著剖面呈τ字型的轉子安裝底座34。在轉 子安裝底座34的左右侧面,安裝著各線性馬達的轉子32。 各線性馬達的轉子32通過共用的轉子安裝底座34,與該 線性馬達的定子31相向而安裝在χ載台5上。2個線j生馬 達使疋子31與轉子32沿橫向相向而左右對稱地配置著。 使用使疋子31與轉子32沿橫向相向而左右對稱地配 置的2個線性馬達,且沿著χ導向器4來移動χ載台5, 以進行基板1向X方向的移動。各線性馬達所產生的磁性 吸引力彼此抵消,X導向器4所承受的負載得以減輕。並 且,在底座3上設有向χ方向延伸的槽,將各線性馬達的 内置有磁鐵的板狀的定子31以豎立在底座3的槽内的狀態 2向X方向延伸安裝,並將各線性馬達的内置有線圈的板 /的轉子32與該線性馬達的定子31相向地安裝在χ載台 上’因此無須在底座3與又載台5之間設置用於確保配 線性馬達的定子31以及轉子32的空間的台,從而裝置 整體的高度得以抑制。 圖4是表示從本發明的一個實施方式的鄰近曝光裝置 拆除Υ載台以上的部分後的狀態的俯視圖。在本實施方 201214054 f Π為查載台7的驅動機構’使用2個線性馬達。 内置有磁鐵的板狀的定子41;以及内置 有線圈的板狀的轉子42。 # A 以及圖4中’各線性馬達的轉子42被安裝在¥ 方向(圖2的圖式縱深方向)延伸的側面。 在5的上表面的左右端’分別安裝著向γ方向延伸 的疋安裝底座43。各線性馬達蚊子4丨通過各定子安 裝底座43’以t立在χ載台5上的狀態而與該線性馬達的 轉子42相向地向丫方向延伸而安㈣。2個線性馬達使定 子41與轉子42沿橫向相向而左右對稱地配置著。 使用使定子41與轉子42沿橫向相向而左右對稱地配 置的2個線性馬達,且沿著γ導向器6來移動γ載台7, 以進灯基板1向γ方向的移動。各線性馬達所產生的磁性 吸引力彼此抵消,Y導向器6所承受的負載得以減輕。並 且,將各線性馬達_置祕_板㈣轉子42安裳在γ 載台7的沿Υ方向延伸賴面上,將各線性馬達的内置有 磁鐵的板狀的定子^與該線性馬達的轉子42相向地向γ 方向延伸而安裝在Χ载台5上,因此無須在χ載台5與Υ 載台7之’置驗雜配置雜馬達蚊子41以及轉子 42的空間的台。因此,載台整體的重心不會變高,载台敕 體的運動性能不會降低。而且,無須在χ载台5上設置槽二 X載台5的剛性不會降低。 曰 在圖1 t,驅動電路60通過主控制裝置7〇的控制, 對線性馬達的轉子32、42的線圈供給電流,以驅動線性馬The temperature of the S 7 201214054 is kept at the lower limit or more until the substrate is mounted on the chuck, and the substrate is moved by the heat of the linear motor to move the second warmer that is smaller than the upper limit. Medium, ~, military 22: optical unit control method = state: 'When the detected stage temperature is below the lower limit value than the reference value (four) upper limit, the linear motor is used to drive the floor, The second warm-up exercise using the linear Marais (4) material temperature to the lower limit or more and the limit is used until the base plate mounted on the chuck is prepared. When the temperature of the detected stage is greater than or equal to the lower limit value and smaller than the reference value in the state in which the substrate is transferred to the container and the substrate is not loaded on the plate, the motor is driven by the secret motor. The stage is used to carry out the temperature of the stage, and the temperature of the stage is less than the lower limit value and less than the upper limit _ the second warm-up motion until the substrate mounted on the chuck is ready, so the load during operation The temperature change of the stage is small, so that the pattern can be burned accurately. Further, during the operation, once the substrate mounted on the chuck is prepared, the exposure process can be started immediately. One . Further, in the proximity exposure apparatus of the present invention, the control means stores the jth warm-up motion and the end time of the second warm-up machine and the number of movements of the stage during the second warm-up exercise, when the operation starts. When the mask is placed on the mask and the substrate is not mounted, the first warm-up motion of the 4th or the end of the second warm-up motion is over the predetermined time. When the number of movements of the stage 201214054 in the second warm-up exercise is 2, the first warm-up exercise is performed on the (four) line. In the proximity exposure apparatus of the present invention, the number of movements of the stage in the first warm-up motion and the first-degree control method in the warm-up motion is stored, and the mask is kept on the chuck and is not on the chuck. In the state in which the substrate is mounted, the _^ warm-up exercise or the first time passes the predetermined time, before the _1 η chat, '.采 (4) When the number of movements of the load σ during the read motion or the second warm-up motion is less than the predetermined number of times, the stage is driven by the linear motor to perform the first warm-up motion. Even if the temperature of the stage does not fall below the lower limit before the start of the operation, when the operation is started, the predetermined time is elapsed from the end of the previous third warm-up exercise or the second warm-up exercise, or before When the number of movements of the stage in the second warm-up exercise or the second warm-up exercise is less than the predetermined number of times, the first warm-up motion is performed, so that the temperature change of the stage is made smaller, and the pattern can be further accurately performed. Burned. Φ The method for manufacturing the panel substrate for display of the present invention is to perform exposure of the substrate using any of the above-mentioned proximity exposure devices, or to control the temperature of the stage using the above-described substrate temperature control method of any adjacent exposure device. To perform exposure of the substrate. Since the temperature change of the stage is small, the pattern can be burned with high precision, so that a high-quality display panel substrate can be manufactured. [Effects of the Invention] According to the proximity exposure apparatus of the present invention and the stage 201214054 adjacent to the exposure apparatus, the degree control method 'by detecting the temperature of the stage, and when the operation starts = turning t, the wealth is saved on the fresh rack. When the temperature of the stage where the substrate is not mounted and the 匕 and ' are detected is less than the lower limit value, the stage is driven by the linear motor to linearize the temperature of the stage to the lower limit of the stage. The i-th warm-up movement of the reference value higher than the reference value enables the accuracy of the load (four) in the exposure domain to be reduced even if the temperature of the stage is reduced to less than the lower limit during the start of the operation. The pattern is burned. Further, according to the proximity exposure apparatus of the present invention and the stage temperature (fourth method) adjacent to the exposure apparatus, the detected stage is in a state in which the mask is held on the mask frame and the substrate is not mounted on the disk. When the temperature is equal to or higher than the lower limit value and smaller than the upper limit value, the stage is driven by the linear motor to maintain the temperature of the stage to be lower than the lower limit and less than the upper limit by the heat of the linear motor. Since the second warm-up motion of the value is prepared until the substrate is mounted on the chuck, the temperature change of the stage during operation can be reduced, and the pattern can be accurately baked. Further, during the operation, once the substrate mounted on the chuck is prepared, the exposure processing can be started immediately. ° Further, 'the proximity exposure device according to the present invention and the stage temperature control method adjacent to the exposure device, by storing the second warm-up motion and the end time of the second warm-up motion, and the first warm-up motion and the second warm-up motion The number of movements of the stage, and when the operation is started, the mask is held on the mask frame and the substrate is not mounted on the chuck, the movement from the previous second warm-up or the end of the second warm-up movement When the predetermined time is passed, or when the number of movements of the stage during the $1 warm-up exercise or the second warm-up exercise in 201214054 is less than the predetermined number of times, the stage is driven by the linear motor to perform the first warm-up motion. Further, the temperature change of the stage is further reduced, so that the pattern can be further accurately baked. According to the method of manufacturing a panel substrate for display of the present invention, the temperature change of the stage can be reduced, and the pattern can be accurately baked. Therefore, a high-quality display panel substrate can be manufactured. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment] FIG. 1 is a view showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. 2 is a side view of a proximity exposure apparatus according to an embodiment of the present invention, and FIG. 3 is a front view of the proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure device includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, an inflammation support stand 9, a chuck 10, and a mask. The frame 20, a plurality of linear motors, stator mounting bases 33, 43, a rotor mounting base 34, a temperature sensor 50, a drive circuit 60, and a main control unit 70 are formed. In addition, in Fig. 2 and Fig. 3, the drive circuit 60 and the main control unit 7 are omitted. In addition to these members, the proximity exposure device further includes a substrate transfer robot that carries the substrate 1 onto the chuck 10 or carries the substrate 1 out of the chuck 10, and an illumination optical system that irradiates the exposure light, and performs the illumination in the device. Temperature control unit (unit), etc. 201214054 In addition, the χγ direction in the embodiment described below is merely shown, and the X direction and the γ direction may be exchanged. The substrate 1 is carried into the chuck 10 by a substrate transfer (not shown) at a load/unload position away from the exposure position at which the exposure of the substrate 1 is performed, or is carried out from the chuck 1 . The loading of the substrate toward the chuck 1 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of upper pins provided on the chuck 1 . The upper top pin is housed inside the chuck 10, and when the substrate 丨 is loaded on the chuck 10 from the inside of the chuck 1〇, the upper top pin receives the substrate 从 from the substrate transfer robot, and when the slave ejector 10 is received from the chuck 10 When the substrate 1 is unloaded, the upper top pin delivers the substrate 给 to the substrate transfer robot. In Fig. 1 and Fig. 2, the chuck 1 is placed at an exposure position where exposure of the substrate 进行 is performed. Above the exposure position, a mask 20 holding the mask 2 is provided. In Fig. 1, an opening 20a through which exposure light passes is provided in the mask frame 2, and a mask 2 is attached below the opening 20a. An adsorption groove is provided around the opening 20a of the lower surface of the mask frame 2, and the mask frame 2 is vacuum-adsorbed by the adsorption groove to hold the peripheral portion of the mask 2. An illumination optical system (not shown) is disposed above the mask 2 held by the mask frame 2''. At the time of exposure, the exposure light from the illumination optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the substrate! On the surface, a pattern is formed on the substrate 1. In Figs. 2 and 3, the chuck 10 is mounted on the cymbal stage 8 via the chuck support stand 9, and the γ stage 7 and the X stage 5 are provided below the cymbal stage 8. The X stage 5 is mounted on the X guide 4 provided on the base 3, and 12 201214054 moves in the X direction along the X guide 4. The gamma stage 7 is mounted on the γ-guide 6 provided on the cymbal stage 5, and moves in the γ direction along the 丫 guide 6. The cymbal stage 8 is mounted on the gamma stage 7, and is mounted on the θ stage 8 in the θ direction. #9 is supported on the θ stage 8 and supports the chuck 10 at a plurality of places. By the movement of the X stage 5 in the X direction and the movement of the ¥ stage 7 in the γ direction, the lost disk 1〇 is moved between the loading/unloading position and the exposure position. At the loading/unloading position, the substrate 丨 mounted on the chuck 10 is moved by the movement of the X stage 5 in the 乂 direction, the movement of the γ stage 7 in the Υ direction, and the rotation of the 0 stage 8 in the 0 direction. Pre-alignment (Pre_allgnment). At the exposure position, the movement of the loading table $ in the X direction and the loading of the yoke 7 to the yoke are carried out: &amp; + the movement of the yoke Y universal direction is performed in the WXY direction of the substrate mounted on the yoke Stepper axis. Further, alignment of the substrate i is performed by movement in the I = x direction, movement of the γ stage 7 in the γ direction, and (4) rotation in the ? direction. Further, the shield frame 2 is moved and tilted in the z direction by the Z-tilt mechanism shown, whereby the substrate 2 is aligned with the substrate Μ. Further, in the present embodiment, by arranging the mask frame 20 in the ζ direction and the four members, the gap between the mask 2 and the substrate 对准 is aligned, but also = on the chuck support #9 The tilting mechanism moves and tilts the panel 1 to 2, thereby aligning the mask 2 with the substrate gap. In the present embodiment, as the drive mechanism for driving the cymbal stage 5, a linear motor is used. Each of the secret motors has a plate-shaped dice 31 in which a magnet is incorporated, and a plate-shaped rotor % in which a coil is built. 13 201214054 In Fig. 3, a groove extending in the other direction (the depth direction of the drawing of Fig. 3) is provided on the base 3. At the left and right corners of the groove of the base 3, stator mounting bases extending in the X direction are respectively mounted on the stator mounting bases 33. The stators of the respective linear motors are mounted. The stators 31 of the linear motors pass through the stator mounting base 33. The yoke is extended in the X direction in a state of being erected in the groove provided in the base 3. On the other hand, a rotor mounting base 34 having a τ-shaped cross section is attached to the lower surface of the cymbal stage. On the left and right sides of the rotor mounting base 34, rotors 32 of the respective linear motors are mounted. The rotors 32 of the respective linear motors are mounted on the cymbal stage 5 via a common rotor mounting base 34, facing the stator 31 of the linear motor. The two wires j are arranged such that the die 31 and the rotor 32 face each other in the lateral direction and are bilaterally symmetric. Two linear motors arranged in a bilaterally symmetrical manner with the rotor 31 and the rotor 32 facing each other are used, and the cymbal stage 5 is moved along the χ guide 4 to move the substrate 1 in the X direction. The magnetic attractive forces generated by the respective linear motors cancel each other out, and the load on the X guide 4 is alleviated. Further, a groove extending in the χ direction is provided in the base 3, and a plate-shaped stator 31 having a magnet built therein is extended in the X direction in a state 2 erected in the groove of the base 3, and each linear The plate/rotor 32 of the motor in which the coil is built is mounted on the cymbal stage opposite to the stator 31 of the linear motor. Therefore, it is not necessary to provide the stator 31 for securing the wiring motor between the base 3 and the stage 5 and The stage of the space of the rotor 32 is such that the height of the apparatus as a whole is suppressed. Fig. 4 is a plan view showing a state in which a portion above the pallet is removed from the proximity exposure device according to the embodiment of the present invention. In the present embodiment, 201214054 f is a drive mechanism for the table 7 using two linear motors. A plate-shaped stator 41 having a magnet built therein; and a plate-shaped rotor 42 having a coil built therein. In the #A and Fig. 4, the rotor 42 of each linear motor is attached to the side surface extending in the ¥ direction (the depth direction of the drawing of Fig. 2). A cymbal mounting base 43 extending in the γ direction is attached to the left and right ends ' of the upper surface of the upper surface 5, respectively. Each of the linear motor mosquitoes 4 is extended in the 丫 direction toward the rotor 42 of the linear motor by the respective stator mounting bases 43' so as to stand on the cymbal stage 5 (4). The two linear motors are arranged such that the stator 41 and the rotor 42 face each other in the lateral direction and are bilaterally symmetrical. Two linear motors that are arranged bilaterally symmetrically with respect to the rotor 41 and the rotor 42 are used, and the γ stage 7 is moved along the γ-guide 6 to move the lamp substrate 1 in the γ direction. The magnetic attractive forces generated by the respective linear motors cancel each other out, and the load on the Y guide 6 is alleviated. Further, each linear motor_secret_plate (four) rotor 42 is mounted on the y-stage 7 extending in the Υ direction, and the linear stator has a magnet-shaped plate-shaped stator and the rotor of the linear motor. Since the 42 is extended in the γ direction and attached to the cymbal stage 5, it is not necessary to dispose the space of the motor mosquito 41 and the rotor 42 in the cymbal stage 5 and the cymbal stage 7. Therefore, the center of gravity of the entire stage does not become high, and the motion performance of the stage body does not decrease. Further, it is not necessary to provide the groove on the crucible table 5. The rigidity of the X stage 5 is not lowered.曰 In FIG. 1 t, the drive circuit 60 supplies current to the coils of the rotors 32 and 42 of the linear motor through the control of the main control unit 7〇 to drive the linear horse.

S 15 201214054 達。此時,尤其由於X載台5的重量大而移動距離也長, 因此線性馬達的負載大’會從線性馬達的轉子32產生大量 的熱。因此’在通常的運轉時與停止基板i的供給而停= X載台5的移動時,X載台5的溫度會發生較大變化。一S 15 201214054 达. At this time, in particular, since the weight of the X stage 5 is large and the moving distance is long, the load of the linear motor is large, and a large amount of heat is generated from the rotor 32 of the linear motor. Therefore, the temperature of the X stage 5 largely changes when the operation of the substrate i is stopped and the movement of the X stage 5 is stopped during the normal operation. One

旦X載台5的溫度發生較大變化,因熱膨脹引起的X 5的變形量則會發生較大變化,因此由χ載台5移: 板二的位置以及相對于水平方向的斜度發生變動,從而^ 圖案的燒附精度降低。 在本實施方式中,進行載台的暖機運動, X載台5的溫度㈣在規定範_。叮,對本發 固=方控制方法進行說明。在圖2以及圖 器感測器5〇。溫度感測 主控制裝置7〇m^結果輸出至圖1的 ,重絲此〜“本實方式巾,對應於鄰近曝光裝置的 運轉狀l(自動運轉開始時或自動 器50所檢測出的χ載Α 5 ) η由/皿度感剩 或第2暖,動這來進行第1暖機運動 程園圖圖5 ^表二判斷是否進行暖機運動的處理的一例的流 為自動、軍Mp/做置7G首先判斷該鄰近曝光裝置是否 則主控制裝置%判斷 機運動也無法開始曝 暖機運動,直至在遮罩架20上安裝遮罩2為止。不進仃 201214054 如果遮罩架20上保持著遮罩2,則主控制裝置70判 斷夾盤ίο上是否搭载著基板1(步驟3〇3)。自動運轉開 始時夾盤10上應该未搭載基板】,但當因任何理由而在 夾盤10搭載有基板1時,將夾盤10上搭載的基板1搬出 至裝置外之後,返回步驟303。 虽夹盤10上未搭載基板1時,主控制裝置70判斷由 溫度感測器50檢測出的χ載台5的溫度是否小於預定的 下限值(步驟304)。當X載台5的溫度小於下限值時, 主控制裝置70進行第1暖機運動。 s X載台5的溫度未小於下限值時,主控制裝置% 判斷是否已從之前的第i暖機運動或第2暖機運動的結束 時刻經過規定時間(步驟3〇5)。如果在自動運轉開始時, 已從之前的第1暖機運動或第2暖機運動的結束時刻經過 規定時間,則主控制裝置70進行第i暖機運動。 如果尚未從之前的第1暖機運動或第2暖機運動的結 束時刻經過規定時間,則主控制裝置7〇判斷之前的第1 鲁 暖機運動或第2暖機運動中的χ載台5的移動次數是否小 於規定次數(步驟306)。如果在自動運轉開始時,之前 的第1暖機運動或第2暖機運動中的X載台5的移動次數 小於規定次數,則主控制裝置70進行第丨暖機運動。如果 之前的第1暖機運動或第2暖機運動中的χ載台5的移動 -欠數並非小於規定次數,則前進至步驟311。 如果在步驟301中該鄰近曝光裝置並非自動運轉開始 時、以及在步驟306中之前的第1暖機運動或第2暖機運When the temperature of the X stage 5 changes greatly, the amount of deformation of X 5 due to thermal expansion changes greatly. Therefore, the position of the plate 2 and the inclination with respect to the horizontal direction change. Thus, the burning accuracy of the pattern is lowered. In the present embodiment, the warm-up motion of the stage is performed, and the temperature (four) of the X stage 5 is in a predetermined range.叮, the method of this fat=square control is explained. In Fig. 2 and the sensor 5 〇. The result of the temperature sensing main control device 7〇m^ is output to the one of FIG. 1, and the present embodiment corresponds to the operation mode of the adjacent exposure device (the 检测 detected by the automatic device 50 or the automatic device 50) Α ) ) η 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 /Set 7G first to determine that the proximity exposure device is otherwise the main control device% judgment machine movement can not start the warmer movement until the mask 2 is installed on the mask frame 20. Do not enter 201214054 if the mask frame 20 When the mask 2 is held, the main control unit 70 determines whether or not the substrate 1 is mounted on the chuck ίο (step 3〇3). The substrate 10 should not be mounted on the chuck 10 at the start of the automatic operation, but for any reason When the substrate 1 is mounted on the chuck 10, the substrate 1 mounted on the chuck 10 is carried out to the outside of the apparatus, and then the process returns to step 303. When the substrate 1 is not mounted on the chuck 10, the main controller 70 determines that the temperature sensor 50 is used. Whether the detected temperature of the crucible table 5 is less than a predetermined lower limit value (step 304) When the temperature of the X stage 5 is less than the lower limit value, the main control unit 70 performs the first warm-up motion. s When the temperature of the X stage 5 is not less than the lower limit value, the main control unit % judges whether or not it has The end time of the i-th warm-up exercise or the second warm-up exercise passes for a predetermined period of time (step 3〇5). If the automatic start is started, the first warm-up or the second warm-up is over. When the predetermined time elapses, the main control unit 70 performs the i-th warm-up movement. If the predetermined time has not elapsed from the previous first warm-up motion or the second warm-up motion, the main control unit 7 determines the first one before. Whether the number of movements of the cymbal stage 5 in the warm-up machine exercise or the second warm-up exercise is less than a predetermined number of times (step 306). If the automatic operation starts, the previous first warm-up exercise or the second warm-up exercise When the number of movements of the X stage 5 is less than the predetermined number of times, the main control unit 70 performs the second warm-up movement. If the previous first warm-up motion or the second warm-up motion, the movement of the cymbal stage 5 is not smaller than the number of movements. If the number of times is specified, proceed to step 311. The step 301 is not adjacent to the exposure means at the start of automatic operation, and in step 306 prior to the first movement or the second warm-warming operation

S 17 201214054 #$ 、5的移動次數並非小於規定次數,則主控制 ^ 箱近曝光裝置是否處於自動運轉中(步棘 牛赖:果轉魏域置並非處於自滅轉中,則返回 二胜® 1 °、如果該鄰近曝光裝置處於自動運轉中,則主控 上7G雜料架2()上是碌持著遮罩2(步 驟 312)。 架20上並未保持著遮罩2,則即使進行暖機運動 法開始曝光處理,因此不進行暖機運動, 架2〇上安裝遮罩2為止。 如果遮罩架2G上保持著遮罩2,則主控制|置7〇判 斷夾盤10上是否搭載有基板1(步驟3⑴。如果在自動 ,轉中爽盤1G上搭載有基板卜則進行夾盤ig上搭載的 土板1的曝辑理’將基板1搬出至裝置外之後,返回步 驟 313 〇 如果夾盤10上未搭載基板丨,則主控制裝置7〇判斷 由溫度感測器5G所檢測出的x载台5的溫度是否小於賴 定的下限值(步驟314)。如果x載台5的溫度小於下限 值,則主控制裝置70進行第1暖機運動。 如果X載台5的溫度並非小於下限值,則主控制裝置 70判斷X載台5的溫度;%否為下限值以上且小於預定的上 P艮值(步驟315)。如果χ^5的溫度為下限值以上且 小於上限值,壯控職置7G進行第2暖機運動。如果χ 載台5的溫度為上限值以上,則主控制裝£7〇+進行暖機 運動。 另外,判斷是否進行暖機運動的處理並不限於圖5所 201214054 不的例子,只要是判斷是否滿足下述 以變更判斷的順序。 ㈣處理’則也可 進行第1暖機運動的條件: 碑置ΐ,自十動^轉開始時或自動運轉中’遮罩架2G上保持有 ’、、’夾盤10上未搭載基板】,且χ 译' ' 下限值。 執σ 3的溫度小於 或者’在自動運轉開始時,鮮架2 夾盤10上未搭載基板i,且已從之前㈣ϋ有遮罩2, 2暖機運動㈣束時難過規定相。 運動或第 或者,在自動運轉開始時,遮罩架2 夾盤U)上未搭魁板i,且讀 罩2 ’ 機運動巾的X载台5的移動缝小於規定次數。 進行第2暖機運動的條件: 上未轉中’遮罩架2〇上保持有遮罩2,夾盤10 上限i X載台5的溫度為下限值以上且小於 ❿ ㈣=是表示第1暖機運動的動作的—例的流程圖。主 設置(⑻基板供給停止旗標(㈣(步 ^01)。在設置有基板供給停趨標的細,停止基板丨 ==搬送機器人的供給。該基板供給停止旗標引起的基 ^供給停止可通過裝置_作員(啊咖相操作來取 消 C cancel)。 繼=’主控制裝置70設置暖機運動中旗標(步驟 41〇)。在設置有暖機運動中旗標的期間,基板搬送機器人 201214054 不進行基板1向夾盤ίο的搬入。 Z傾為進行暖機運動的準備,主控制裝置使 z-傾斜機構向原點位置移動(步驟42()),使遮罩架加上 升。而且’作為進行暖機運動的準備,主控制褒置70使失 盤10上所設的多個上頂銷向原點位置移動(步驟), 將上頂銷收納至夾盤1G的㈣。紐,主控姆置控 制驅動電路6G來驅動線性馬達,以進行第〗暖機運動。 於第1暖機運動中,X載台5以及γ載台7是與基板 1的曝光處理時同樣地移動。主控制裝置7〇首先藉由線性 馬達來驅動Χ載台5以及γ載台7,使夾盤1G向裝載/卸 载位置移動(步驟440)。繼而,主控制裝置70使X載台 5以及Υ载台7在裝載/卸載位置處待機與基板1向夾盤10 的装載所需的時間相同的時間(步驟441)。然後,主控 制裝置70藉由線性馬達來驅動χ載台5以及γ載台7, 使夹盤10向曝光位置中的進行第丨次照射的位置移動(步 驟442)。然後,主控制裝置70使X載台5以及γ載台7 在該位置處待機’其時間與遮罩2和基板1的間隙對準、 基板1的對準以及基板丨的曝光所需的時間相同(步驟 443) 〇 繼而’主控制裝置70判斷夾盤10是否位於曝光位置 中的進行最後的照射的位置(步驟444)。如果夾盤1〇並 非位於曝光位置中的進行最後的照射的位置,則主控制襞 置70藉由線性馬達來驅動X載台5以及γ載台7,以使 夾盤丨〇向曝光位置中的進行下次照射的位置移動(步驟 201214054 445),並返回步驟443。 如果夾盤10位於曝光位置中的進行最後的 置,則主控制裝置70對第i暖機運動中的χ載台$ = Υ載台7的移動次數進行更新(步驟446)。繼而 制裝置70判斷是否結束第1暖機運動(步驟447)。控 圖7是表示判斷是否結束第!暖機運動的處理的 的流程圖。主控制裝置7G首先判斷基板供給停止旗」S 17 201214054 #$ , 5 The number of movements is not less than the specified number of times, then the main control box near exposure device is in automatic operation (steps and thorns: If the result is not in the self-extinguishing, then return to the second wins® 1 °, if the proximity exposure device is in automatic operation, the main control upper 7G miscellaneous rack 2 () is holding the mask 2 (step 312). The cover 20 does not hold the mask 2, even if The warm-up motion method starts the exposure process, so the warm-up motion is not performed, and the mask 2 is attached to the frame 2. If the mask 2 is held on the mask frame 2G, the main control|set 7〇 determines the chuck 10 Whether or not the substrate 1 is mounted (step 3 (1). If the substrate is loaded on the transfer medium 1G, the exposure of the soil plate 1 mounted on the chuck ig is carried out], and the substrate 1 is carried out to the outside of the apparatus, and then returns to the step. 313 〇 If the substrate 未 is not mounted on the chuck 10, the main control unit 7 determines whether the temperature of the x stage 5 detected by the temperature sensor 5G is smaller than the lower limit value (step 314). When the temperature of the stage 5 is less than the lower limit value, the main control unit 70 performs the first warm-up operation. If the temperature of the X stage 5 is not less than the lower limit value, the main control unit 70 determines the temperature of the X stage 5; % is less than the lower limit value and less than the predetermined upper P value (step 315). The temperature of ^5 is above the lower limit value and less than the upper limit value, and the second warm-up exercise is performed by the Z-control position 7G. If the temperature of the 载 stage 5 is above the upper limit value, the main control is loaded with 7 〇 + for warming. In addition, the process of determining whether or not to perform warm-up exercise is not limited to the example of 201214054 in Fig. 5, and it is determined whether or not the following determination is made to change the order of judgment. (4) Processing 'The first warm-up exercise can also be performed. Condition: The monument is set to ΐ, from the beginning of the turn to the start or during the automatic operation, 'the cover is held on the 2G, the 'the substrate 10 is not mounted on the chuck 10', and the lower limit of the ''. The temperature is less than or 'At the beginning of the automatic operation, the substrate i is not mounted on the chuck 2 of the fresh frame 2, and the predetermined phase has been lost from the previous (four) 遮 mask 2, 2 warm-up movement (four) bundle. Movement or the first or At the beginning of the automatic operation, the mask 2 is not on the chuck U), and the reading cover 2 'machine movement The movement of the X stage 5 is less than the predetermined number of times. The conditions for the second warm-up movement are: The upper cover is not turned over. The mask 2 is held on the cover 2, and the upper limit of the chuck 10 is the temperature of the stage 5. The lower limit value is equal to or greater than ❿ (4) = is a flowchart showing an example of the operation of the first warm-up motion. The main setting ((8) substrate supply stop flag ((4) (step ^01). Fine, stop the substrate 丨 == the supply of the transport robot. The base supply stop caused by the base supply stop flag can be canceled by the device _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The flag of the machine movement (step 41〇). During the period in which the warm-up motion flag is set, the substrate transfer robot 201214054 does not carry in the substrate 1 to the chuck ίο. Z is tilted for warm-up motion, and the main control unit moves the z-tilt mechanism to the home position (step 42()) to raise the mask. Further, as a preparation for warm-up exercise, the main control unit 70 moves the plurality of upper pins provided on the lost disk 10 to the home position (step), and the upper top pins are housed in the fourth plate of the chuck 1G. New, the master controls the drive circuit 6G to drive the linear motor to perform the warm-up motion. In the first warm-up motion, the X stage 5 and the γ stage 7 move in the same manner as in the exposure processing of the substrate 1. The main control unit 7 first drives the cassette 5 and the gamma stage 7 by a linear motor to move the chuck 1G to the loading/unloading position (step 440). Then, the main control unit 70 causes the X stage 5 and the cassette stage 7 to stand by at the loading/unloading position for the same time as the time required for the loading of the substrate 1 to the chuck 10 (step 441). Then, the main control unit 70 drives the crucible stage 5 and the γ stage 7 by a linear motor to move the chuck 10 to the position where the first irradiation is performed in the exposure position (step 442). Then, the main control device 70 causes the X stage 5 and the gamma stage 7 to stand by at this position 'the time required to align with the gap between the mask 2 and the substrate 1, the alignment of the substrate 1 and the exposure of the substrate 丨. The same (step 443) 〇 then the main control device 70 determines whether the chuck 10 is in the position of the last illumination in the exposure position (step 444). If the chuck 1 is not in the position of the last illumination in the exposure position, the main control unit 70 drives the X stage 5 and the gamma stage 7 by a linear motor to cause the chuck to be tilted toward the exposure position. The positional movement of the next irradiation is performed (step 201214054 445), and the process returns to step 443. If the last position of the chuck 10 in the exposure position is made, the main control unit 70 updates the number of movements of the χ stage $ = Υ stage 7 in the i-th warm-up motion (step 446). The relay device 70 determines whether or not the first warm-up motion is ended (step 447). Control Figure 7 shows whether or not to judge the end! Flow chart of the processing of warm-up exercises. The main control device 7G first determines the substrate supply stop flag.

的基板的供給停止是否已通過裝置的操作㈣操作而取^ (步驟501)。如果基板的供給停止已被取消,則主押 置70結束第1暖機運動。 卫J哀 如果基板的供給停止未被取消,則主控制裝置7〇判 第1暖機運動中的X載台5的移動次數是否達到預定 ^次數(步驟502)。如果X載台5的移動次數已達到規 疋次數,則主控制裝置70結束第1暖機運動。 如果X載台5的移動次數未達到規定次數,則主控制 裝置70判斷由溫度感測器5〇所檢測出的χ載台5的溫度 是否為預定的基準_上(步驟則。祕準值是設為 下限值與上限值之間的值^如果χ載台5的溫度為基準值 以上,則主控制裝置7〇結束第1暖機運動。 ,如果X載台5的溫度並非基準值以上,則主控制裝置 70判斷震置是否發生任何異f,或裝置是否已停止(步驟 5〇4)。如果裳置發生任何異常或者裝置已停止,則主控制 裝置70結束第1暖機運動。如果並非如此,則主控制裝置 7〇繼續第1暖機運動。Whether or not the supply stop of the substrate has been taken by the operation (4) of the apparatus is taken (step 501). If the supply stop of the substrate has been canceled, the master urging 70 ends the first warm-up motion. When the supply stop of the substrate is not canceled, the main control unit 7 determines whether or not the number of movements of the X stage 5 in the first warm-up motion has reached a predetermined number of times (step 502). If the number of movements of the X stage 5 has reached the predetermined number of times, the main control unit 70 ends the first warm-up motion. If the number of movements of the X stage 5 has not reached the predetermined number of times, the main control unit 70 determines whether or not the temperature of the crucible table 5 detected by the temperature sensor 5 is a predetermined reference value (step: secret value). When the temperature of the cymbal stage 5 is equal to or greater than the reference value, the main controller 7 ends the first warm-up motion. If the temperature of the X stage 5 is not the reference. Above the value, the main control unit 70 determines whether any abnormality f has occurred, or whether the device has stopped (step 5〇4). If any abnormality occurs in the skirt or the device has stopped, the main control device 70 ends the first warm-up Movement. If this is not the case, the main control unit 7 continues the first warm-up motion.

S 21 201214054 7新-»旬斷是否結束第1暖機運動的處理並不限於圖 ml心子’只要是判斷是否滿足下述條件的處理,則 也可以變更判斷的順序。 处 結束第1暖機縣的條件: 、給停止旗標引起的基板的供給停_£已被取消。-' X载台5的移動次數已達到規定次數。 或者’x载台5的溫度為基準值以上。 或者’裝置發生異常或者裝置已停止。 ㈣6的步驟447中,如果結束第1暖機運動,則主 控制裝置70藉由線性馬達來驅動χ載台5以及 :=1〇向_載位置移動(步驟45〇)。繼而, j裝置70清除(dear)基板供給停止 暖機運動中旗標(步驟)。繼而,二裝置 ,儲第1_運_結束時顯第丨 、 載台7的移動次數。如果未結束第1暖機運動 則返回步驟440。 叹例丈利 自動的溫度進行檢測,當在自動運轉開始時或 二架2〇上保持有遮罩2且失盤10上未 =基板i的狀態下’檢測出的χ載台5的溫度小於下限 值時’错由線性馬達來驅動χ載台5以及γ載纟7 =暖機運動,因此在第!暖機運動結束之後^一美 供給基板1 ’便可立即開始曝光處理。 機運動將Χ載台5的溫度提高至比下限值 同的基準值以上,因此即使在自動運轉開始前或自動運轉 22 201214054 :5的溫度降低至小於下限值,曝光處理中的x載 :。、溫度變化也較小,從而可精度良好地進行圖案的燒 W、你進而,即使在自動運轉開始前x載台1的溫度降低至 運叙值1但*在自動運轉開始時,從之前的第1暖機 a或弟2暖機運動的結束時刻經過規定時間時,或者之S 21 201214054 7New-»Turning off whether or not the processing of the first warm-up motion is completed is not limited to the map. The heart of the heart can be changed as long as it is a process of determining whether or not the following conditions are satisfied. At the end of the conditions of the first warm-up county: The supply of the substrate caused by the stop flag has been canceled. -' The number of movements of the X stage 5 has reached the specified number of times. Alternatively, the temperature of the 'x stage 5 is equal to or greater than the reference value. Or 'The device has an abnormality or the device has stopped. In step 447 of (4) 6, if the first warm-up motion is ended, the main control unit 70 drives the pallet 5 by a linear motor and: = 1 移动 moves to the _-load position (step 45 〇). Then, the j device 70 clears the substrate supply to stop the warm-up motion flag (step). Then, the second device stores the number of movements of the stage 7 at the end of the first time. If the first warm-up motion has not ended, the process returns to step 440. The temperature of the singer is automatically detected. When the automatic operation starts or the mask 2 is kept on the two shelves, and the substrate 10 is not = the substrate i, the detected temperature of the cymbal stage 5 is smaller than At the lower limit, 'the wrong motor is driven by the linear motor 5 and the gamma carrier 7 = warm-up movement, so at the first! After the end of the warm-up exercise, the first substrate is supplied to the substrate 1 ′ and the exposure process can be started immediately. The machine movement raises the temperature of the crucible table 5 to be equal to or higher than the reference value of the lower limit value. Therefore, even before the automatic operation starts or the automatic operation 22 201214054 : 5 temperature falls below the lower limit value, the x-load in the exposure process :. The temperature change is also small, so that the pattern can be burned accurately, and further, even before the start of the automatic operation, the temperature of the x stage 1 is lowered to the value of 1 but * at the start of the automatic operation, from the previous When the end time of the first warm-up a or the second warm-up exercise is over a predetermined period of time, or

ΓΓ ϊ機運動或第2暖機運動中的x載台1的移動次 声作/規疋★數時進行第1暖機運動,因此x載台1的溫 S化會變得更小’從而可進—步精度良好地進行圖案的 圖8是表示第2暖機運動的動作的一例的流程圖。主 ,制裝置70首先設置暖機運動中旗標(㈣61〇)。在設 f暖機運財旗標的躺,基板搬送機器人不進行基板 1向夾盤10的搬入。 繼而,作為進行暖機運動的準備,主控制裝置70使 傾斜機構向原點位置移動(步驟62〇),使遮罩架2〇上 2。而且,主控制裝置70作為進行暖機運動的準備,使夾 10上所設的多個上頂銷向原點位置移動(步驟630), 將頂銷收納至夾盤1〇的内部。然後,主控制裝置川控 制驅動電路60 I驅動線性馬達,以進行第2暖機運動。 '與第1暖機運動同樣地,於第2暖機運動中,乂載台 5以及Y載台7與基板丨的曝光處理時同樣地移動。主控 制袭置70 f先藉由雜馬達來驅動χ載台5以及γ載台 7使夾盤1〇向裝載/卸載位置移動(步驟640)。繼而, 23 1 201214054 主控制裝置70使X載台 5以及Y載台7 + &amp;&amp; ^ 處待機’其時間與基板1向夾盤ίο的裝栽H位置 。然後’主控制裝置70藉由線性馬 二=及¥載台;’使細向曝光位置中的進行第 =射的位置移動(步驟642)。繼而,主控制裝置70 =載台5以m在触置鱗機,其時間與遮罩 矛基板1的間隙對準、基板i的對準以及 所需的時間相同(步驟643)。 土 、 繼而,主控制裝置70判斷夾盤1〇是 =3最後的照射的位置(步驟Μ。如果失盤10並 恤於曝絲置巾的進行最後的照射 藉由線性馬達來轉x載台 盤〇向曝光位置中的進行下次照射的位置 645),並返回步驟643。 ^ 如果夾盤10位於曝光位置中的進行最後的照射的位 奋則主控制裝置7G對第2暖機運動中的χ載台5以及 Υ载台7的移動次數進行更新(步驟646)。繼而, 制農置70判斷是否結束第2暖機運動(步驟⑷)。二 圖9是表示判斷是否結束第2暖機運動的處理的 的流程圖。主㈣裝置7G首先騎是否已對基板搬送機器 ^供給基板1(步驟7G1)。如果已對基板搬送機器人供給 基板卜㈣控織置7〇結束第2暖機運動。 如果尚未對基板搬送機器人供給基板丄,則主控制裝 置70判斷由溫度_器5()檢測出的χ載台$的溫度是否 24 201214054 λ!、於下限值(步驟702)。如果X載台5的溫度小於下限 值,則主控制裝置70結束第2暖機運動。 如果X載台5的溫度並非小於下限值,則主控制裝置 70判斷X载台5的溫度是否為上限值以上(步驟7〇3)。 如果X載台5的溫度為上限值以上,則主控制裝置結 束第2暖機運動。 如果X載台5的溫度並非上限值以上,則主控制裝置 70判斷裝置是否發生任何異常,或者裝置是否已停止(步 鲁.驟7〇4)。如果裝置發生任何異常或者裝置已停止,則主 控制裝置70結束第2暖機運動。如果並非如此,則主控制 裝置70繼續第2暖機運動。 另外,判斷是否結束第2暖機運動的處理並不限於圖 9所不的例子,只要是判斷是否滿足下述條件的處理, 也可以變更判斷的順序。 結束第2暖機運動的條件: 已對基板搬送機器人供給基板1。 # 或者,X載台5的溫度小於下限值。 或者’ X載台5的溫度為上限值以上。 或者,裝置發生異常或者裝置已停止。 於圖8的步驟647巾,如果結束第2暖機運動,則主 控制裝置7G藉由線性馬達來驅動又載台5以及γ載台7, 使炎盤10向裝载/卸载位置移動(步驟65〇卜繼而,主 控制裝置70清除暖機運動中旗標(步驟66〇)。然後 控制裝置7G存儲第2暖機運動的結束_與第2暖機運動第 When the movement of the x stage 1 in the second warm-up exercise or the second in-motion movement of the stage 1 is performed, the first warm-up motion is performed, so that the temperature of the x stage 1 becomes smaller. FIG. 8 which is a pattern in which the pattern can be accurately performed is a flowchart showing an example of the operation of the second warm-up motion. The main assembly device 70 first sets the flag for the warm-up movement ((4) 61〇). The substrate transfer robot does not carry in the substrate 1 to the chuck 10 while lying on the warm-up flag. Then, as preparation for the warm-up exercise, the main control unit 70 moves the tilt mechanism to the home position (step 62), and causes the mask frame 2 to be up 2. Further, the main control unit 70 prepares the warm-up motion to move the plurality of upper pins provided on the clip 10 to the home position (step 630), and accommodates the top pins inside the chuck 1〇. Then, the main control unit Kawasaki control drive circuit 60 I drives the linear motor to perform the second warm-up motion. In the second warm-up exercise, the cymbal stage 5 and the Y stage 7 move in the same manner as in the exposure processing of the substrate 。 in the second warm-up exercise. The master control device 70f first drives the pallet 5 and the gamma carrier 7 by the motor to move the chuck 1 to the loading/unloading position (step 640). Then, 23 1 201214054 main control unit 70 causes X stage 5 and Y stage 7 + &amp;&amp; ^ to stand by 'the time and the substrate 1 to the chuck H position of the chuck. Then, the main control unit 70 moves the position in the fine exposure position to perform the first shot by the linear horse 2 = and the ¥ carrier (step 642). Then, the main control unit 70 = the stage 5 is at the touch scale, the time is aligned with the gap of the mask lance substrate 1, the alignment of the substrate i, and the time required (step 643). Soil, and then, the main control unit 70 determines that the chuck 1〇 is the position of the last illumination of =3 (step Μ. If the disc is lost 10 and the final illumination of the towel is carried out by the linear motor, the x-stage is rotated. The disk is moved to the position 645 where the next irradiation is performed in the exposure position, and the process returns to step 643. ^ If the chuck 10 is in the exposure position for the last illumination, the main control unit 7G updates the number of movements of the cymbal stage 5 and the cymbal stage 7 in the second warm-up motion (step 646). Then, the farmer 70 determines whether or not the second warm-up exercise is ended (step (4)). Fig. 9 is a flowchart showing a process of determining whether or not to end the second warm-up motion. The main (4) device 7G first rides whether or not the substrate 1 has been supplied to the substrate transfer machine (step 7G1). If the substrate transfer robot has been supplied with the substrate (4), the second weaning motion is completed. If the substrate transfer robot has not been supplied to the substrate transfer robot, the main control unit 70 determines whether or not the temperature of the load stage $ detected by the temperature sensor 5 () is 24 201214054 λ! and is lower than the lower limit value (step 702). If the temperature of the X stage 5 is less than the lower limit value, the main control unit 70 ends the second warm-up motion. When the temperature of the X stage 5 is not less than the lower limit value, the main controller 70 determines whether or not the temperature of the X stage 5 is equal to or higher than the upper limit value (step 7〇3). If the temperature of the X stage 5 is equal to or higher than the upper limit value, the main control unit ends the second warm-up motion. If the temperature of the X stage 5 is not above the upper limit value, the main control unit 70 determines whether the apparatus has any abnormality or whether the apparatus has stopped (step 7:4). If any abnormality occurs in the device or the device has stopped, the main control device 70 ends the second warm-up motion. If this is not the case, the main control unit 70 continues the second warm-up motion. Further, the process of determining whether or not to end the second warm-up motion is not limited to the example shown in Fig. 9, and the order of the determination may be changed as long as it is a process of determining whether or not the following conditions are satisfied. Condition for ending the second warm-up motion: The substrate 1 has been supplied to the substrate transfer robot. # Alternatively, the temperature of the X stage 5 is less than the lower limit. Alternatively, the temperature of the X stage 5 is equal to or greater than the upper limit. Or, the device has an abnormality or the device has stopped. In step 647 of FIG. 8, if the second warm-up motion is ended, the main control device 7G drives the further stage 5 and the gamma stage 7 by the linear motor to move the disk 10 to the loading/unloading position (steps). 65. Then, the main control device 70 clears the warm-up motion flag (step 66〇). Then the control device 7G stores the end of the second warm-up motion _ and the second warm-up motion

S 25 201214054 中的X載台5以及γ載台7的移動次數。如果未結束第2 暖機運動,則返回步驟640。 當在自動運轉中,在遮罩架20上保持有遮罩2且夾盤 10上未搭載基板1的狀態下,檢測出的χ載台5的溫度為 下限值以上且小於比基準值高的上限值時,通過線性馬達 來驅動X載台5,以進行利用線性馬達的熱來將父載台5 的/凰度保持為下限值以上且小於上限值的第2暖機運動, 直至對基板搬送機器人供給基板丨為止,因此自動運轉中 的X載台5的溫度變化較小,從而可精度良好地進行圖案 的燒附。並且,在自動運轉中,一旦對基板搬送機器人供 給基板1,便可立即開始曝光處理。 根據以上說明的實施方式,對x載台5的溫度進行檢 測,g在自動運轉開始時或自動運轉中,在遮罩架上保 持有遮罩2且夾盤1〇上未搭载基板丨的狀態下,檢測出的 X載台5的溫度小於下限值時,藉由線性馬達來驅動又載 台5,以進行利用線性馬達的熱來將χ載台5的溫度提高 至比下限值南的基準值以上的第丨暖機運動,由此,即使 在自動運轉開始前或自動運轉中χ載台5的溫度降低至小 於下限值,曝光處理中的χ載台5的溫度變化也較小從 而可精度良好地進行圖案的燒附。 進而’當在自動運轉中,在遮罩架2〇上保持有遮罩2 且夹盤10上未搭載基板丨的狀態下,檢測出的χ載台5 的溫度為下限值以上且小於比基準值高的上限值時,通過 線性馬達來驅動χ載台5,以進行利用線性馬達的熱來將 26 201214054 ==溫度保持為下限值以上且小於上限值的第2暖 ^動’直至對基板搬送機器人供給基板i為止,由此, 的X載台5的溫度變化較小,從而可精度良好 送:ϊΐίϋϊ:。並且’在自動運轉中,-旦對基板搬 送機斋人供、,δ基板卜便可立即開始曝光處理。 幻^進Γ’存鮮1暖機運動以及第2暖機運動的結束時 幻暖機運動以及第2暖機運動中的X載台5的移 ^ ’且當在自動運轉開始時,在遮罩架Μ上保持有遮 ^且夾盤1G上未搭餘板1的狀態下,從之前的第! =機^動或第2暖機運動的結束時刻經過規定時間時,或 2的第1暖機運動或第2暖機運動中的χ载台5的移 ^於規定次數時,通過線性馬達來鶴X載台1以 及丫载口 7以進行第!暖機運動,由此,可使 么$ 得更小’從而可進一步精度良好地進行圖^ -产^ ί偽在丨以上說明的實施方式中,設置對X载台1的 溫度感測器5G ’進行第1暖機運動或第2 置對7控制X載台1的溫度’但同樣地,也可以設 機雜H的溫度進行檢測的溫度感測11,進行第1暖 機運動或第2暖機運動,以控制γ载台7的溫度。 通過使縣發明的鄰近曝錄絲進行基板的曝光, 的鄰近置的載台溫度控制方法來 2載台的溫度,以進行基板的曝光,由此,可使載台的 &gt;皿度變化較小,從而可精度良好地進行圖案的燒附,因此 27 1 201214054 可製造高品質的顯示用面板基板。 例如,圖ίο是表示液晶顯示器裝置的TFT基板的製 造過程的一例的流程圖。在薄膜形成過程(步驟ι〇ι)中, 通過濺鍍法或電漿化學氣相沉積(Chemicd ν^〇ΓThe number of movements of the X stage 5 and the γ stage 7 in S 25 201214054. If the second warm-up motion has not ended, return to step 640. In the automatic operation, when the mask 2 is held on the mask frame 20 and the substrate 1 is not mounted on the chuck 10, the detected temperature of the cymbal stage 5 is equal to or higher than the lower limit value and smaller than the reference value. When the upper limit is used, the X stage 5 is driven by a linear motor to perform the second warm-up movement in which the galvanicity of the parent stage 5 is kept below the lower limit value and less than the upper limit value by the heat of the linear motor. Since the substrate 供给 is supplied to the substrate transfer robot, the temperature change of the X stage 5 during the automatic operation is small, and the pattern can be accurately baked. Further, in the automatic operation, once the substrate transfer robot is supplied to the substrate 1, the exposure processing can be started immediately. According to the embodiment described above, the temperature of the x stage 5 is detected, and in the automatic operation start or the automatic operation, the mask 2 is held on the mask frame, and the substrate 未 is not mounted on the chuck 1 丨. When the detected temperature of the X stage 5 is less than the lower limit value, the stage 5 is driven by the linear motor to perform the heat of the linear motor to increase the temperature of the crucible stage 5 to the lower limit value. The second warm-up movement of the reference value or more, whereby the temperature of the crucible 5 in the exposure processing is changed even if the temperature of the crucible 5 is lowered to less than the lower limit before the start of the automatic operation or during the automatic operation. Smallly, the pattern can be burned with high precision. Further, in the state in which the mask 2 is held on the mask frame 2 and the substrate 丨 is not mounted on the chuck 10 during the automatic operation, the detected temperature of the cymbal stage 5 is equal to or less than the lower limit value and smaller than the ratio. When the upper limit value of the reference value is high, the cymbal stage 5 is driven by the linear motor to perform the second heating operation by using the heat of the linear motor to maintain the temperature of 26 201214054 == above the lower limit value and less than the upper limit value. 'After the substrate i is supplied to the substrate transfer robot, the temperature change of the X stage 5 is small, and the accuracy can be accurately transmitted: ϊΐίϋϊ:. And, in the automatic operation, the exposure processing can be started immediately after the substrate transfer machine is supplied.幻^进Γ 'Save fresh 1 warm-up exercise and the end of the 2nd warm-up exercise, the movement of the X-stage 5 in the second warm-up exercise and when the automatic operation starts, the cover The cover frame is kept in a state where it is covered and the plate 1G is not attached to the plate 1 from the previous one! = When the end time of the machine or the second warm-up motion has elapsed for a predetermined period of time, or when the first warm-up motion of 2 or the second warm-up motion is moved to the predetermined number of times, the linear motor is used. Crane X stage 1 and 丫 port 7 to carry out the first! Warm-up motion, thereby making it possible to make it smaller, so that the image can be further accurately performed. In the embodiment described above, the temperature sensor 5G for the X stage 1 is set. 'The first warm-up motion or the second set-up 7 controls the temperature of the X stage 1', but similarly, the temperature sensing 11 for detecting the temperature of the machine H may be set, and the first warm-up motion or the second warm-up may be performed. Warm up to control the temperature of the gamma stage 7. By subjecting the adjacent exposed wire of the invention to exposure of the substrate, the adjacent stage temperature control method takes the temperature of the two stages to expose the substrate, thereby making it possible to change the degree of the stage. Since it is small, the pattern can be burned with high precision, so 27 1 201214054 can manufacture a high-quality display panel substrate. For example, FIG. 1 is a flowchart showing an example of a manufacturing process of a TFT substrate of a liquid crystal display device. In the film formation process (step ι〇ι), by sputtering or plasma chemical vapor deposition (Chemicd ν^〇Γ

Deposition ’ CVD)法#,在基板上形成作為液晶驅動用透 明電極的導電體膜或絕緣體膜等的薄膜。在光阻(1^以) 塗布過程(步驟_中,通過輥(rcll)式塗布法等來塗 布感光樹脂材料(光致光阻(photo resist)),以在薄膜 形成過程(步驟101)中所形成的薄膜上形成光致光阻膜: 鲁 在曝光過程(步驟103)中’使用鄰近曝光裝置或投影曝 光裝置等來將遮罩的圖案轉印到光致光阻膜上。在顯影過 程(步驟104)中,通過淋浴式(sh〇wer)顯影法等,^ 顯影液供給至光致光阻膜上,以去除光致光阻膜的不要部 分。在蝕刻(etching)過程(步驟105)中,通過濕式(wet) 蝕刻,將薄膜形成過程(步驟101)中形成的薄膜内、未 被光致光阻膜所遮掩的部分予以去除。在剝離過程(步驟 106)中,將在蝕刻過程(步驟1〇5)中完成遮罩作用的光 致光阻膜通過剝離液而剝離。在這些過程之前或之後根 據需要而實施基板的清洗/乾燥過程。反復進行數次這些過 程’從而在基板上形成TFT陣列(aiTay)。 而且,圖11是表示液晶顯示器裝置的彩色濾光器基板 的製造過程的一例的流程圖。在黑色矩陣(blackmatrix) 开&gt;成過程(步驟201)中,通過光阻塗布、曝光、顯影、 蝕刻、剝離等的處理而在基板上形成黑色矩陣。在著'色圖 28 201214054 案形成過程(步驟202)中,通過染色法、顏料分散法、 印席】法、電鏟法等等,在基板上形成著色圖案。針對汉、 G、B的著色圖案,反復進行該過程。在保護膜形成過程 (y驟203)中,在著色圖案之上形成保護膜,在透明電極 膜形成過程(步驟2〇4)中,在保護膜之上形成透明電極 膜。在這些過程之前、中途或之後,根據需要而實施基板 的清洗/乾燥過程。 在圖10所示的TFT基板的製造過程中,在曝光過程 (,驟103)中,在圖u所示的彩色濾光器基板的製造過 程中,在黑色矩陣形成過程(步驟2〇丨)以及著色圖案形 成過程(步驟202)的曝光處理中,能夠適用本發明的鄰 近曝光裝置或本發明的鄰近曝光裴置的載台溫度控制方 法。 雖本發明已以較佳實施例揭露如上,然其並非用以 限,發明,任何熟習此技藝者,在不脫離本^明之精神 =範圍内,當可作些許之更動與潤飾,因此本發明之保護 • 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是表示本發明的一個實施方式的鄰近曝光裝置的 概略結構的圖。 圖2是本發明的一個實施方式的鄰近曝光裝置的側 圖。 圖3是本發明的一個實施方式的鄰近曝光裝置的正面 圖。In the Deposition CVD method, a film such as a conductor film or an insulator film which is a transparent electrode for driving a liquid crystal is formed on a substrate. In a photoresist (1) coating process (step _, a photosensitive resin material (photoresist) is applied by a roll coating method or the like to be in a film forming process (step 101) Forming a photo-resist film on the formed film: In the exposure process (step 103), the pattern of the mask is transferred onto the photo-resist film using a proximity exposure device or a projection exposure device or the like. (Step 104), the developer is supplied onto the photo-resist film by a shower method or the like to remove unnecessary portions of the photo-resist film. In an etching process (step 105) In the film forming process (step 101), the portion not covered by the photo-resist film is removed by wet etching. In the stripping process (step 106), The photo-resist film that completes the masking process in the etching process (step 1〇5) is peeled off by the stripping liquid. The cleaning/drying process of the substrate is performed as needed before or after these processes. These processes are repeated several times. Forming a TFT array on a substrate (aiTay) Fig. 11 is a flowchart showing an example of a manufacturing process of a color filter substrate of a liquid crystal display device. In a black matrix opening process (step 201), a photoresist coating, A black matrix is formed on the substrate by treatment such as exposure, development, etching, peeling, etc. In the process of forming the color map 28 201214054 (step 202), the dyeing method, the pigment dispersion method, the printing method, and the electric shovel method are used. Etc., a colored pattern is formed on the substrate. This process is repeated for the coloring patterns of Han, G, and B. In the protective film forming process (y step 203), a protective film is formed over the colored pattern, in the transparent electrode film. In the formation process (step 2〇4), a transparent electrode film is formed over the protective film. Before, during or after these processes, the cleaning/drying process of the substrate is performed as needed. The fabrication of the TFT substrate shown in FIG. In the process, in the exposure process (step 103), in the manufacturing process of the color filter substrate shown in FIG. u, in the black matrix forming process (step 2〇丨) and the color pattern forming process In the exposure processing of (step 202), the proximity exposure apparatus of the present invention or the stage temperature control method of the adjacent exposure apparatus of the present invention can be applied. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit It is to be understood that the scope of protection of the present invention is subject to the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. Fig. 2 is a side elevational view of an adjacent exposure apparatus according to an embodiment of the present invention. A front view of a proximity exposure apparatus of an embodiment.

S 29 201214054 圖4是表示從本發明的一個實施方式的鄰近曝光裝置 在拆除Y載台以上的部分後的狀態的俯視圖。 圖5是表示判斷是否進行暖機運動的處理的一例的流 程圖。 圖6是表示第1暖機運動的動作的一例的流程圖。 圖7是表示判斷是否結束第1暖機運動的處理的一例 的流程圖。 圖8是表示第2暖機運動的動作的一例的流程圖。 圖9是表示判斷是否結束第2暖機運動的處理的一例 的流程圖。 圖10是表示液晶顯示器裝置的TFT基板的製造過程 的一例的流程圖。 圖11是表示液晶顯示器裝置的彩色濾光器基板的製 造過程的一例的流程圖。 【主要元件符號說明】 1 :基板 2 :遮罩 3 :底座 4: X導向器 5 : X載台 6 : Y導向器 7 : Y載台 8 : Θ載台 9:夾盤支撐台 30 201214054 ίο :夾盤 20 :遮罩架 20a :開口 31、 41 :定子 32、 42 :轉子 33、 43 :定子安裝底座 34 :轉子安裝底座 50 :溫度感測器 • 60:驅動電路 主控制裝置 70S 29 201214054 FIG. 4 is a plan view showing a state in which a portion adjacent to the Y stage is removed from the proximity exposure apparatus according to the embodiment of the present invention. Fig. 5 is a flowchart showing an example of a process of determining whether or not to perform warm-up exercise. FIG. 6 is a flowchart showing an example of an operation of the first warm-up motion. Fig. 7 is a flowchart showing an example of a process of determining whether or not to end the first warm-up motion. FIG. 8 is a flowchart showing an example of an operation of the second warm-up motion. Fig. 9 is a flowchart showing an example of a process of determining whether or not to end the second warm-up motion. Fig. 10 is a flowchart showing an example of a manufacturing process of a TFT substrate of a liquid crystal display device. Fig. 11 is a flow chart showing an example of a manufacturing process of a color filter substrate of a liquid crystal display device. [Description of main component symbols] 1 : Substrate 2 : Mask 3 : Base 4 : X Guide 5 : X Stage 6 : Y Guide 7 : Y Stage 8 : Θ Stage 9 : Clamp Support Table 30 201214054 ίο : chuck 20 : mask frame 20 a : opening 31 , 41 : stator 32 , 42 : rotor 33 , 43 : stator mounting base 34 : rotor mounting base 50 : temperature sensor • 60 : drive circuit main control unit 70

Claims (1)

201214054 七、申請專利範圍: 1. 一種鄰近曝光裝置,包括: 夾盤’搭載基板; 遮罩架,保持遮罩; 載台,移動所述夾盤;以及 線性馬達,軸所述載台,蘭近曝絲置的特徵在 於枯· 檢測機構,檢測所述载台的溫度;以及 控制機構,控制所述線性馬達,且 所述控制機構當在運轉開始時或轉中 ^所述遮罩μ所述夾盤上未搭載基板的狀態== 乂測機構所檢測出的所述載台的溫度小於下限值時 =所述線性馬達來驅動所述載台,以進行姻所述線性馬 的,來將所賴台的溫度提高至比下限值高的基準值二 上的第1暖機運動。 2. 如申請專利範圍第1項所述的鄰近曝光裝置,並中, 加所述控制機構當在運轉中’在遮罩被保持於所述遮罩 ^述夾盤上未搭載基板的狀態下,由所述檢測機構所 檢測出的所述載台的溫度為下限值以上 =上限值時,通過所述線性馬達來驅動所述載台 利用所述線性馬達的熱來將所職台的溫度簡為下限值 上限值的第2暖機運動,直至準備好搭載於所 述夾盤上的基板為止。 3·如申請專利朗第〗或2項所述的鄰近曝光裝置, 32 201214054 其中, 所述控制機構存儲第i暖機運動以及第2暖機運動的 結束時刻與第1暖機運_及第2暖_動㈣所述載台 的移動次數,201214054 VII. Patent application scope: 1. A proximity exposure device comprising: a chuck 'mounting substrate; a mask frame, holding a mask; a stage, moving the chuck; and a linear motor, a shaft of the stage, blue The proximity wire is characterized by a dry detecting mechanism for detecting the temperature of the stage; and a control mechanism for controlling the linear motor, and the control mechanism is at the beginning of the operation or during the turning of the mask The state in which the substrate is not mounted on the chuck == When the temperature of the stage detected by the detecting means is less than the lower limit value = the linear motor drives the stage to perform the linear horse The first warm-up motion of the temperature of the table is raised to a reference value two higher than the lower limit value. 2. The proximity exposure device according to claim 1, wherein the control mechanism is in operation while the mask is held on the mask and the chuck is not mounted on the substrate. When the temperature of the stage detected by the detecting means is equal to or greater than the lower limit value, the linear motor drives the stage to use the heat of the linear motor to operate the stage. The temperature is simply the second warm-up motion of the upper limit of the lower limit value until the substrate mounted on the chuck is prepared. 3. The proximity exposure device according to claim 25 or claim 2, wherein the control mechanism stores the end time of the i-th warm-up exercise and the second warm-up exercise, and the first warm-up and the second Warm_moving (4) the number of movements of the stage, 當在運轉開始時,在麵被於所述鮮架且所述 夾盤上未搭载基板的狀_下,從之前㈣〖暖機運動或第 2暖機運動的結束_經過規定時間時,或之前的第i暖 機運動或第2暖機運動中的所述载台的移動次數小於規定 -人數時’杨所述線性馬達來鶴所職台以進工暖 機運動。 4.-種鄰近曝光裝置的載台溫度控制方法,此鄰近曝 光襞置包括: 夾盤,搭載基板; 遮罩架,保持遮罩; 载台’移動所述夾盤;以及 線性馬達’驅動所述载台,此鄰近曝光裝置的載台温 度控制方法的特徵在於, 檢測載台的溫度, 當在運轉開始時或運轉中,在所述遮罩架上保持有遮 。所述夾盤上未搭載基板的狀態下,檢測出的所述载台 、、二度小於下限值時,通過線性馬達來驅動所述载台,以 ,二利用雜馬達的熱來將所述載㈣溫度提高至比下限 值高的基準值以上的第1暖機運動。 5_如申請專利範圍第4項所述的鄰近曝光裝置的載台 33 201214054 溫度控制方法,其中, 上未’在所述遮罩架上保持有遮罩且所述夾般 =態下:檢測出的所述载台的溫度為下; 動所、f“ 土準值關上限值時,通過線性馬達來驅 動所述載。,以進行利用所述線性 的溫度保持為下限值以上且小:3將:述载台 直至準備好搭餅所糊上的基板^ 運動’When the operation is started, the surface is placed on the fresh frame and the substrate is not mounted on the chuck, and the predetermined time is passed from the previous (four) warm-up exercise or the end of the second warm-up exercise, or When the number of movements of the stage in the previous i-th warm-up exercise or the second warm-up exercise is less than the prescribed number of people, the linear motor of the above-mentioned crane is used to work in the warm-up machine. 4. A method for controlling a stage temperature of a proximity exposure apparatus, the proximity exposure apparatus comprising: a chuck, a substrate; a mask holder, holding a mask; a stage 'moving the chuck; and a linear motor' drive In the stage, the stage temperature control method of the proximity exposure device is characterized in that the temperature of the stage is detected, and the cover is kept covered when the operation starts or during operation. In a state where the substrate is not mounted on the chuck, when the detected stage is twice less than the lower limit, the stage is driven by a linear motor, and the heat of the hybrid motor is used. (4) The first warm-up motion in which the temperature is increased to a reference value higher than the lower limit value. The method of controlling the temperature of the stage 33 201214054 of the proximity exposure device according to claim 4, wherein the mask is held on the mask frame and the clip is in the state of the clamp: detecting The temperature of the stage is lower than the temperature of the stage. When the value of the ground value is turned off, the load is driven by a linear motor to maintain the temperature lower than the lower limit by the linear temperature. :3 will: describe the stage until the substrate on which the cake is prepared. 載台==4或5項所述的鄰侧置的 f儲第!暖機運動以及第2暖機運動的結束時刻虚第 暖31及第2暖機運動中的所輯㈣移動次數, 爽般:ί2=Γ寺’在所述遮罩架上保持有遮罩且所述 2 ί機ίίΓί”狀態下’從之前的第1暖機運動或第 刻經過規定時間時,或之前的第1暖 ,=或4 2暖機運動中的所賴㈣移動次數小於規定 =數時’通過線性馬達來驅動所賴台以進行第丨暖機運 動0The staged == 4 or 5 items of the adjacent side of the f store! The number of movements during the warm-up exercise and the end of the second warm-up exercise in the virtual warmth 31 and the second warm-up exercise. (4) The number of movements is as follows: ί2=Γ寺' has a mask on the mask frame and The 2 机 machine ίίΓί state is less than the specified number of movements from the previous 1st warm-up exercise or the first passing of the specified time, or the previous 1st warm, or 4 2 warm-up exercise (4) When the time is 'driven by the linear motor to carry out the first warm-up movement 0 7. -麵示用面板基板的製造方法,其特徵在於, 使用如申請專利範圍第1至3項中任-項所述的鄰近 曝光裝置來進行基板的曝光。 8. —種顯示用面板基板的製造方法,1特徵在於, ,使用如ΐ請專利範圍第4至6項中任—項所述的鄰近 曝光裝置的料溫度控制方法來控的溫度,以進行 基板的曝光。 347. A method of manufacturing a panel substrate for surface display, characterized in that exposure of a substrate is performed using a proximity exposure device as described in any one of claims 1 to 3. 8. A method of manufacturing a panel substrate for display, characterized in that a temperature controlled by a material temperature control method of an adjacent exposure device as described in any one of claims 4 to 6 is used for performing Exposure of the substrate. 34
TW100105822A 2010-03-16 2011-02-22 Proximity exposure device, its stage temperature control method, and manufacturing method of a display panel substrate TW201214054A (en)

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