201213700 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種以led (發光二極體）作爲光源的 LED燈泡者。 【先前技術】 近年來，省能源化被當成地球暖化對策的一環而被推 展著’以照明機器的領域而言，相較於白熾燈泡消耗電力 非常小的燈泡型螢光燈逐漸普及、且亦有相較於該燈泡型 螢光燈，消耗電力非常小且壽命相當長的LED燈泡被商品 化。 該LED燈泡具備有：具有作爲發光源的複數個LED (發 光二極體）之LED模組、用以使LED模組的各LED點亮的電 源單元、以可讓電源單元供電地螺入既有的燈泡插座的燈 頭、一端部被裝設於燈頭的開口端部之筒狀保持部 '以及 開口端部被裝設於筒狀保持部的另一端部之透光性的燈球 (或蓋），電源單元及LED模組通常配置於筒狀保持部的 內側（例如參照專利文獻1或2 )。 先行技術文獻 專利文獻 專利文獻1:日本特開2008-91140號公報 專利文獻2 :日本特開2009 - 267082號公報 【發明內容】 發明所欲解決之課題 201213700 然而，由於LED燈泡在點亮時各LED (發光二極體） 會發熱，所以若其放熱對策不夠充分時，各LED (發光二 極體）會變得高溫使其壽命大幅降低。關於這點，以專利 文獻1記載的LED燈泡而言，因爲是作成將被裝設於基板 (7)的各發光二極體（2)之發熱，經由重疊於基板（7 )上的傳熱性金屬製的基台（11)而朝作爲筒狀保持部的 傳熱性金屬製的蓋（4 )自然放熱，故難謂各發光二極體（ 2)的放熱效率夠充分。 另一方面，在專利文獻2記載的LED燈泡中，係建構 成以傳熱性良好的金屬構成外側本體（1 2 )且在其外表面 形成放熱用的複數個肋（16)，俾將各LED元件（36)的 發熱，經由形成在作爲筒狀保持部的外側本體（1 2 )及內 側本體（5 8 )之間的放熱路徑朝外部放熱，且可由外側本 體（12)的表面進行熱輻射。 然而，在專利文獻2記載的LED燈泡中，是利用形成 有複數個肋（16)之金屬製的外側本體（12)、以及嵌合 於其內側的內側本體（5 8 )來構成筒狀保持部，因而具有 所謂重量增大的問題。 此外，在專利文獻1記載的LED燈泡中，爲維持放熱 機能’筒狀的蓋（4 )成爲又長又大的樣子，該程度，讓各 發光二極體（2)的點亮光透過的燈球（3)成爲小型的半 球狀’因而具有所謂各發光二極體（2 )的點亮光之照射區 域狹窄的問題。同樣地，在專利文獻2記載的LED燈泡中 201213700 ’爲維持放熱機能’筒狀的外側本體（丨2)成爲又長又大 的樣子’該程度，讓各LED元件（36 )的點亮光透過的蓋 (44 )成爲小型的半球狀，因而具有所謂各LED元件（36 )的點亮光之照射區域狹窄的問題。 本發明係對應此種習知技術的問題點而作成者，且以 提供一種能使LED的放熱效率更加提升以達成其高壽命化 、同時亦有助於輕量化及照射區域的擴大化之LED燈泡爲 課題。 解決課題之手段 爲解決這樣的課題，本發明相關的LED燈泡係具備：螺 入燈泡插座的燈頭、一端部被裝設在燈頭的開口端部的筒 狀保持部、和開口端部被裝設在筒狀保持部的另一端部的 燈球、及具有朝燈球側照射點亮光的複數個LED的LED模組 :電源單元’其直流輸出側連接於LED模組、且交流輸入 側連接於前述燈頭，該LED燈泡之特徵爲，將各LED之發熱 予以放熱用的熱管單元，係接合於LED模組並被裝入筒狀 保持部內’且在筒狀保持部中，開設有與熱管單元的放熱 端部面對的放熱窗。 在本發明相關的LED燈泡中，於既有的燈泡插座螺入 並裝設燈頭的狀態下，透過開啓其點燈開關，使得LED模 組的複數個LED點亮，其點亮光通過燈球而被照射。 在此，當複數個LED經點亮而發熱時，其發熱係瞬間 地朝與LED模組接合的熱管單元之放熱端部移動，且從面 201213700 對該放熱端部的筒狀保持部之放熱窗朝外部有效率地放熱 。其結果，各LED的高溫化受抑制使各LED的壽命延長。 本發明相關的LED燈泡中，係將電源單元配置於燈頭 的內側，將筒狀保持部的長度作成收容LED模組及熱管單 元所需限度的長度，藉此可將燈球形成超出半球狀的球狀 。在此情況，通過燈球照射的各LED的點亮光之照射區域 會擴大。又，藉由將長度短的筒狀保持部作成比習知例的 金屬製品還輕量的合成樹脂製品，以大幅地減低重量。 又，本發明的LED燈泡中，LED模組係作成具備形成有 將各LED嵌入並裝設的複數個安裝孔之模組基板的構成， 熱管單元可作成具有受熱板部之構成，該受熱板部係與嵌 入於模組基板的各安裝孔之各LED面接觸且接合於模組基 板。在此情況，由於各LED經點亮所產生的發熱，係被有 效率且確實地朝和各LED面接觸的熱管單元之受熱板部傳 熱，所以各LED的放熱效率確實地提升。 再者，本發明的LED燈泡中，模組基板係以形成爲朝 燈球側突出的曲面板狀者較佳。在此情況，由於各LED被 排列配置於朝燈球側突出的凸曲面上，所以通過燈球照射 的各LED的點亮光之照射區域更加擴大。 又，本發明的LED燈泡中，熱管單元可作成具有在受 熱板部連續地突出的複數根熱管之構成。在此情況，可從 與筒狀保持部的放熱窗面對的各熱管之放熱端部均一地放 熱。 201213700 在此，當複數根熱管的放熱端部之位置設有高低差時 ，在其放熱端部之間產生熱對流，由於該熱對流會促進來 自放熱端部的放熱，所以較佳。 發明效果 在本發明相關的LED燈泡中，當複數個LED經點亮而發 熱時，其發熱係瞬間地朝接合於LED模組的熱管單元之放 熱端部移動，且從與該放熱端部面對的筒狀保持部之放熱 窗朝外部有效率地放熱。其結果，各LED的高溫化受抑制 得以延長各LED的壽命。亦即，依據本發明，能更加提升 各LED的放熱效率，可達成其高壽命化。 又，依據本發明，由於無需如同習知例那様讓筒狀保 持部自體具有放熱機能，所以筒狀保持部可作成比金屬製 品還輕量的合成樹脂製品，其長度，係以將電源單元配置 在燈頭的內側而能縮短成收容LED模組及熱管單元所需之 限度的長度。其結果，相較於習知例，可達成大幅的輕量 化。 再者，依據本發明，由於亦可因應筒狀保持部之縮短 將燈球形成爲超出半球狀的球狀，故能擴大通過燈球照射 的各LED的點亮光之照射區域。特別是將LED模組的各LED 排列配置在於燈球側突出的凸曲面上，藉此可更加擴大各 LED的點亮光之照射區域。 【實施方式】 以下，茲參照附件之圖面來説明本發明相關的LED燈 201213700 泡之實施形態。如第1圖所示，一實施形態的LED燈泡係具 備：燈頭1，被螺入未圖示之既有的燈泡插座；筒狀保持部 2，一端部被裝設在燈頭1的開口端部；透光性的燈球3，開 口端部被裝設在筒狀保持部2的另一端部。且，如第2圖所 示，在燈頭1的內側收容有電源單元4’在筒狀保持部2的內 側配設有LED模組5及熱管單元6。 燈頭1，係具有殻部1A及孔眼部1B的愛迪生型、例如E26 型，且在其殼部1A及孔眼部1B，焊接有電源單元4之交流輸 入側的2根導線（圖示省略）。且在該燈頭1的開口端部之 內周，筒狀保持部2的一端部係利用矽樹脂或環氧樹脂等的 接著劑而接著固定。 筒狀保持部2，係利用具耐熱性的例如ABS樹脂等之熱 可塑性樹脂而一體成型。在該筒狀保持部2的一端部，形成 有被嵌合於燈頭1的開口端部之內周並接著固定之小徑的 嵌合固定部2A，而在另一端部，形成有被嵌合於燈球3的開 口端部之外周並接著固定之大徑的嵌合固定部2B。又，在 筒狀保持部2的另一端部的內周，支持LED模組5用的複數個 支持片2C係形成突出。且在筒狀保持部2的呈和緩錐度狀的 外周，複數個縫狀的放熱窗2D順著周向排列配置並開口。201213700 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an LED bulb using LED (Light Emitting Diode) as a light source. [Prior Art] In recent years, energy-saving is being promoted as a part of global warming measures. In the field of lighting equipment, bulb-type fluorescent lamps that consume very little power compared to incandescent bulbs are becoming more popular. There are also LED bulbs that consume very little power and have a relatively long life compared to the bulb-type fluorescent lamps. The LED light bulb includes: an LED module having a plurality of LEDs (light emitting diodes) as a light source, and a power supply unit for lighting each LED of the LED module to be screwed into the power supply unit a lamp holder having a bulb socket, a cylindrical holding portion at one end of the opening end of the lamp cap, and a translucent lamp ball (or a cover having an open end portion attached to the other end portion of the cylindrical holding portion) The power supply unit and the LED module are usually disposed inside the cylindrical holding portion (for example, refer to Patent Document 1 or 2). CITATION LIST Patent Literature Patent Literature 1: JP-A-2008-91140 Patent Literature 2: JP-A-2009-267082 SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION 201213700 However, since the LED bulbs are lit at each time LEDs (light-emitting diodes) generate heat, so if the heat-dissipation measures are insufficient, the LEDs (light-emitting diodes) become high-temperature and their life is greatly reduced. In this regard, the LED bulb described in Patent Document 1 generates heat by superimposing the light-emitting diodes (2) mounted on the substrate (7), and is superimposed on the substrate (7). Since the base (11) made of a metal is naturally radiated to the heat-transfer metal cover (4) which is a cylindrical holding part, it is difficult to sufficiently radiate the heat-emitting efficiency of each of the light-emitting diodes (2). On the other hand, in the LED light bulb described in Patent Document 2, the outer body (1 2 ) is formed of a metal having good heat conductivity, and a plurality of ribs (16) for heat dissipation are formed on the outer surface thereof. The heat generation of the LED element (36) radiates heat to the outside via a heat release path formed between the outer body (1 2 ) and the inner body (58) as the cylindrical holding portion, and can be heated by the surface of the outer body (12) radiation. However, in the LED light bulb described in Patent Document 2, the outer body (12) made of a metal having a plurality of ribs (16) and the inner body (58) fitted to the inner side thereof are configured to form a cylindrical shape. And thus has the problem of so-called weight increase. Further, in the LED light bulb described in Patent Document 1, in order to maintain the heat radiation function, the cylindrical cover (4) is long and large, and the lighting light of each of the light-emitting diodes (2) is transmitted to such an extent. Since the bulb (3) has a small hemispherical shape, there is a problem that the irradiation region of the illumination light of each of the light-emitting diodes (2) is narrow. In the same manner, in the LED light bulb described in Patent Document 2, the illumination of the LED elements (36) is made to the extent that the outer body (丨2) of the tubular shape is maintained to be long and large. Since the transmitted cover (44) has a small hemispherical shape, there is a problem that the irradiation area of the lighting light of each of the LED elements (36) is narrow. The present invention is made in accordance with the problems of the prior art, and provides an LED capable of further increasing the heat release efficiency of the LED to achieve a longer life, and also contributing to weight reduction and enlargement of the irradiation area. The bulb is the subject. In order to solve such a problem, the LED light bulb according to the present invention includes a base that is screwed into the bulb socket, a cylindrical holding portion that is provided at one end of the opening end of the base, and an open end that is installed. a lamp ball at the other end of the tubular holding portion and an LED module having a plurality of LEDs that illuminate the lighting light toward the bulb side: the power supply unit has a DC output side connected to the LED module and connected to the AC input side. In the above lamp cap, the LED bulb is characterized in that a heat pipe unit for radiating heat generated by each LED is bonded to the LED module and is housed in the cylindrical holding portion, and in the cylindrical holding portion, the heat pipe is opened The heat release window facing the heat release end of the unit. In the LED light bulb according to the present invention, in the state in which the existing bulb socket is screwed into and mounted with the lamp cap, the plurality of LEDs of the LED module are lit by turning on the lighting switch, and the lighting light passes through the light bulb. It is illuminated. Here, when a plurality of LEDs are illuminated to generate heat, the heat generation is instantaneously moved toward the heat releasing end portion of the heat pipe unit that is joined to the LED module, and the heat is released from the cylindrical holding portion of the heat releasing end portion from the surface 201213700. The window is efficiently radiated toward the outside. As a result, the temperature increase of each LED is suppressed to extend the life of each LED. In the LED light bulb according to the present invention, the power supply unit is disposed inside the base, and the length of the cylindrical holding portion is set to a length required to accommodate the LED module and the heat pipe unit, thereby forming the light ball beyond the hemispherical shape. Spherical. In this case, the irradiation area of the lighting light of each of the LEDs illuminated by the lamp ball is enlarged. Further, the cylindrical holding portion having a short length is made into a synthetic resin product which is lighter than the metal product of the conventional example, so that the weight is greatly reduced. Further, in the LED light bulb of the present invention, the LED module is configured to include a module substrate having a plurality of mounting holes in which the LEDs are embedded and mounted, and the heat pipe unit can be configured to have a heat receiving plate portion, the heat receiving plate The part is in contact with each LED surface of each mounting hole embedded in the module substrate and bonded to the module substrate. In this case, since the heat generated by the lighting of each of the LEDs is efficiently and reliably transmitted to the heat receiving plate portion of the heat pipe unit that is in contact with each of the LED faces, the heat radiation efficiency of each of the LEDs is surely improved. Further, in the LED light bulb of the present invention, the module substrate is preferably formed into a curved panel shape that protrudes toward the bulb side. In this case, since the LEDs are arranged side by side on the convex curved surface which protrudes toward the bulb side, the irradiation area of the illumination light of each LED irradiated by the bulb is further enlarged. Further, in the LED light bulb of the present invention, the heat pipe unit can be constructed to have a plurality of heat pipes that continuously protrude from the heat receiving plate portion. In this case, heat can be uniformly radiated from the heat releasing end portions of the respective heat pipes facing the heat releasing window of the cylindrical holding portion. 201213700 Here, when a height difference is provided at a position of a heat releasing end portion of a plurality of heat pipes, heat convection is generated between the heat releasing ends, and since the heat convection promotes heat generation from the heat releasing end portion, it is preferable. Advantageous Effects of Invention In the LED light bulb according to the present invention, when a plurality of LEDs are heated to emit heat, the heat generation is instantaneously moved toward the heat releasing end portion of the heat pipe unit joined to the LED module, and from the heat releasing end portion The heat release window of the pair of cylindrical holding portions is efficiently radiated toward the outside. As a result, the high temperature of each LED is suppressed to extend the life of each LED. That is, according to the present invention, the heat dissipation efficiency of each LED can be further improved, and the life thereof can be attained. Further, according to the present invention, since the cylindrical holding portion does not need to have a heat releasing function as in the conventional example, the cylindrical holding portion can be made into a synthetic resin product which is lighter than the metal product, and the length thereof is a power supply. The unit is disposed inside the base and can be shortened to the length required to accommodate the LED module and the heat pipe unit. As a result, a significant weight reduction can be achieved as compared with the conventional example. According to the present invention, since the bulb spherical shape can be made to exceed the hemispherical shape in accordance with the shortening of the cylindrical holding portion, the irradiation region of the illumination light of each of the LEDs irradiated by the bulb can be enlarged. In particular, the LEDs of the LED module are arranged in a convex curved surface on which the bulb side protrudes, whereby the illumination area of the LEDs can be further enlarged. [Embodiment] Hereinafter, an embodiment of an LED lamp 201213700 according to the present invention will be described with reference to the drawings of the attached drawings. As shown in Fig. 1, an LED bulb according to an embodiment includes a base 1 that is screwed into an existing bulb socket (not shown), and a cylindrical holding portion 2 that is attached to an open end of the base 1 at one end. The translucent bulb 3 has an open end that is attached to the other end of the tubular holding portion 2. Further, as shown in Fig. 2, the power supply unit 4' is housed inside the base 1, and the LED module 5 and the heat pipe unit 6 are disposed on the inner side of the cylindrical holding portion 2. The base 1 is an Edison type having a case portion 1A and an eyelet portion 1B, for example, an E26 type, and two wires on the AC input side of the power supply unit 4 are welded to the case portion 1A and the eyelet portion 1B (illustration omitted ). Further, at one end of the opening end portion of the base 1, the one end portion of the cylindrical holding portion 2 is fixed by a subsequent agent such as silicone resin or epoxy resin. The cylindrical holding portion 2 is integrally molded by a heat-resistant thermoplastic resin such as ABS resin. A fitting fixing portion 2A having a small diameter that is fitted to the inner periphery of the opening end portion of the base 1 and then fixed is formed at one end portion of the cylindrical holding portion 2, and is formed at the other end portion. A fitting fixing portion 2B having a large diameter which is fixed to the outer periphery of the opening end of the bulb 3 is then fixed. Further, on the inner circumference of the other end portion of the cylindrical holding portion 2, a plurality of support pieces 2C for supporting the LED module 5 are formed to protrude. Further, in the outer circumference of the tubular holding portion 2 which is formed in a gentle taper shape, a plurality of slit-like heat releasing windows 2D are arranged side by side and open.
燈球3，係用以讓LED模組5的點亮光透過的蓋楱件，例 如於聚碳酸酯（PC)或丙烯酸樹脂等的透明樹脂混入適宜 的光擴散劑而成形’呈現所謂毛玻璃狀的外觀。在該燈球3 的開口端部，形成有被嵌合於筒狀保持部2的嵌合固定部2B 201213700 之內周的嵌合段部3A，該嵌合段部3A係利用矽樹脂或環氧 樹脂等的接著劑而被接著固定於筒狀保持部2的嵌合固定 部2B之內周。 在電源單元4中，裝入有：將從燈頭1的殼部1 A及孔眼部 1 B經由未圖示之導線所供給之交流電變換成直流電的二極 體電橋電路等之整流電路、將整流後的直流電電壓控制成 指定電壓的電壓控制電路 '具有遮斷過電流的保險絲或遮 斷突波電流的熱敏電阻等之保護電路等。而且’該電源單 元4之直流輸出側的2根導線（圖示省略）被焊接在後述的 LED模組5之電路圖案5E。 如第3圖及第4圖所示，LED模組5係具有用以裝設作爲 發光源的複數個LED的模組基板5A。該模組基板5A，係藉 具耐熱性且傳熱性高的聚碳酸酯（PC )等之合成樹脂而一 體成型爲外表面朝燈球3側呈3次元突出的曲面板狀。亦即 ，模組基板5A爲，在剖面是形成圓弧狀的球面板狀的LED 裝設部5B之外周上接續有剖面是平板狀的環狀支持部5C的 形狀，舉例來說，形成所謂的草帽狀之形狀。而且，在該 LED裝設部5B，將LED裝設用的複數個安裝孔5 D例如係形成 同心圓狀排列配置。 如第2圖所示，模組基板5A的環狀支持部5C，係螺固於 被形成在筒狀保持部2的另一端部之內周的複數個支持片 2C。一方面，各個LED封裝體7被以其投光方向會朝向燈球 3側的半突出狀態嵌入模組基板5A的LED裝設部5B的各安 •10· 201213700 裝孔5D(參照第5圖）。且對各LED封裝體7供電用的電路 圖案5E係跨環狀支持部5C和LED裝設部5而形成。該電路圖 案5E，例如是由依序將銅（Cu )、鎳（Ni )、及銀（Ag ) 之鍍層疊層後的3層構造之導電鍍層所構成。 如第5圖所示，LED封裝體7,係具有在由聚碳酸酯（PC )或陶瓷構成之薄型匣狀的空腔基體7A所形成的反射體凹 部7B的底部配置有LED晶片7C，且該LED晶片7C被充塡於反 射體凹部7B的密封樹脂7D密封的構造。 在LED封裝體7之反射體凹部7B的底部，在形成於模組 基板5A的LED裝設部5B之電路圖案5E，用於連接LED晶片7C 的電極層7E以露出狀態形成。此外，雖圖示省略，但在反 射體凹部7B的周壁面上，形成有將LED晶片7C的點亮光反 射之反射體用的鍍層。 在此，熱管單元6,係用以將被裝設於LED模組5的模組 基板5A之各LED封裝體7的發熱予以放熱者。如第3圖及第6 圖所示’該熱管單元6係具有：與模組基板5A的LED裝設部 5B的內面之凹球面接合且形成爲曲面板狀之受熱板部6A、 及各個基端部在該受熱板部6A的內面連續地呈同心圓狀植 設的複數根熱管6B。各熱管6B係相互平行地從受熱板部6A 的內面突出，其末端部被對齊成平面狀。 受熱板部6A及複數根熱管6B，係藉由在採用可經後處 理溶解的合成樹脂材料所成型的型心的表面上，以無電解 電鍍處S形成銅或鎳等之導電性金屬的鍍層，之後再使芯 201213700 材溶解而形成。亦即，受熱板部6A係由導電性金屬的鍍層 自體所構成，該導電性金屬的鍍層被形成於型心的曲面板 狀部分的內面，複數根熱管6B係藉由在形成於型心的複數 根棒狀部分外周面之導電性金屬的鍍層所成的複數根管內 ’分別充塡毛細管材（wick)及作動液（冷媒液），且將內部 真空化並密封基端部的開口而形成。 此外’有關作爲成型前述的型心之合成樹脂材料方面 ，可使用例如經浸泡於維持在_2 5〜9 5 °C的水中2〜3 5小時左 右可溶解的聚乙烯醇（PVA )、或經浸泡於維持在25〜70 °C的鹼溶液（氫氧化鈉溶液或氫氧化鉀溶液）或酸性溶液 中1〜120分鐘左右可溶解的聚丙醇酸樹脂，再者，亦可使 用藉N -甲基-2 -吡咯啶酮的溶液溶解的A B S樹脂。 在此，由傳熱性高的銅或鎳等所形成之熱管單元6的受 熱板部6A，係接著於構成LED模組5的模組基板5A的LED裝 設部5B之內面，在該受熱板部6A中，各LED封裝體7的電極 層7E係以面接觸狀態接著。此外，作爲接著材，是使用導 熱性高的矽樹脂或環氧樹脂等。 在以上那樣構成的一實施形態相關的LED燈泡中，在 未圖示之既有的燈泡插座螺入有燈頭1的裝設狀態中，其點 燈開關一被開啓時，來自電源單元4的直流輸出側之被控制 成指定電壓的直流電流係朝LED模組5的電路圖案5E供給 ，藉此，被裝設於模組基板5A的複數個LED封裝體7的各LED 晶片7C係點亮，其點亮光通過燈球3而被照射。 -12- 201213700 在此，當各LED封裝體7的LED晶片7C經點亮而發 熱時，其發熱係瞬間地從熱管單元6的受熱板部6A朝一群 的熱管6B的放熱端部移動，且從和其放熱端部面對的筒狀 保持部2之放熱窗2C'朝外部有效率地放熱，而該熱管單元 6的受熱板部6A係與在各LED封裝體7的反射體凹部7B 之底部露出的電極層7E面接觸。其結果，各LED晶片7C 的高溫化受抑制而延長各LED晶片7C的壽命》 又，在一實施形態的LED燈泡中，燈球3並非如同習 知例那樣的半球狀，而是被形成爲和一般的燈泡大致同樣 的球狀，而且，由於各LED封裝體7是以半突出狀態嵌裝 於被形成在朝燈球3側呈3次元突出的球面板狀（曲面板 狀）上的LED裝設部5B的各安裝孔5D，所以各LED封裝 體7之LED晶片7C的點亮光係成爲通過燈球3而廣範圍 地照射，其照射區域會擴大。 再者，在一實施形態的LED燈泡中，筒狀保持部2並 非如同習知例那樣的金屬製品，而是作成輕量的合成樹脂 製品’而且，筒狀保持部2的長度設定成收容LED模組5 及熱管單元6所需之限度的長度且比習知例的長度來得短 ，故重量大幅減輕。 亦即’依據一實施形態的LED燈泡，可讓複數個LED 封裝體7的各LED晶片7C的放熱效率更加提升，可達成 高壽命化。又，相較於習知例，可達成大幅的輕量化。再 者’能更加擴大各LED晶片7C的點亮光之照射區域。 -13- 201213700 本發明的LED燈泡未受限於前述的一實施形態。例如 亦可作成爲：構成熱管單元6的一群的熱管6B當中，至少 呈環狀排列配置於外周側的熱管之放熱端部是朝面向筒狀 保持部2的放熱窗2C的放射方向彎曲成L字型者，以提升 放熱效率。 又，一群的熱管6B，亦可在放熱端部的位置設高低差 使放熱端部之間產生熱對流。例如在呈環狀排列配置的一 群的熱管6B當中，若在外周側和內周側之間，於放熱端部 的位置設高低差，則在外周側和內周側之間產生熱對流， 藉該熱對流促進來自各熱管6B的放熱端部之放熱。 再者，一群的熱管6B，係可變更成具有如第7圖所示 那樣的剖面形狀的1根熱管6C，亦即，內部空間呈放射狀 連續的熱管6C。 在此，如第8圖所示，筒狀保持部2亦可作成：將用以螺 固LED模組5的環狀支持部5C的支持片2C之位置，設定在大 徑的嵌合固定部2B之端部的位置附近’而且LED模組5的 LED裝設部5B呈半球狀並朝燈球3側大大地突出。在此情況 ，從裝設於LED模組5的LED裝設部5B的複數個LED封裝體7 的各LED晶片7 C所照射之點亮光的配光角度，係大大地擴 大到例如細鏈線間的角度0。 又，如第9圖所示，筒狀保持部2亦可作成在小徑的嵌 合固定部2A附近一體形成有傳熱板2E的鋁合金等之傳熱金 屬製品，且亦可將一群的熱管6B的放熱端部以抵接或嵌合 -14- 201213700 方式接合於該傳熱板2E。在此情況，各LED晶片7C經點亮 所產生的發熱，係從一群的熱管6B的放熱端部經由傳熱板 2D而朝筒狀保持部2整體放熱，故放熱效率更加提升°此外 ，可將傳熱板2E作爲電源單元4的支持構件。 另一方面，燈球3亦可爲未混入光擴散劑之呈透明的外 觀者、或呈乳白色等之半透明的外觀者。又，燈球3亦可爲 毛玻璃或乳白色或透明的玻璃製品。 【圖式簡單說明】 第1圖係顯示本發明的一實施形態相關的LED燈泡之 外觀的前視圖。 第2圖係顯示第1圖所示之LED燈泡的內部構造之縱剖 視圖。 第3圖係顯示第2圖所示之LED模組及熱管單元之放大 前視圖。 第4圖係顯示第3圖的IV箭頭方向視圖。 第5圖係顯示第4圖所示的LED封裝體的構造之縱剖視 圖。 第6圖係顯示第3圖的VI箭頭方向視圖。 第7圖係對應第6圖顯示一實施形態中的熱管單元的變 形例之圖。 第8圖係對應第2圖顯示一實施形態中的筒狀保持部 及LED模組的變形例之縱剖視圖。 第9圖係對應第2圖顯示一實施形態中的筒狀保持部 -15- 201213700 及熱管單元的變形例之縱剖視圖。 【主要元件符號說明】 1 燈頭 1 A 殼部 1 B 孔眼部 2 筒狀保持部 2A 嵌合固定部 2B 嵌合固定部 2C 支持片 2D 放熱窗 2E 傳熱板 3 燈球 3 A 嵌合段部 4 電源單元 5 LED模組 5A 模組基板 5B LED裝設部 5C 環狀支持部 5D 安裝孔 5E 電路圖案 6 熱管單元 6A 受熱板部 6B 熱管 -16- 201213700 6C 埶管 7 LED封裝體 7A 空腔基體 7B 反射體凹部 7C LED晶片 7D 密封樹脂 7E 電極層 -17The bulb 3 is a cover member for transmitting the illumination light of the LED module 5, for example, a transparent resin such as polycarbonate (PC) or acrylic resin is mixed with a suitable light diffusing agent to form a so-called ground glass shape. Appearance. At the opening end of the bulb 3, a fitting portion 3A that is fitted to the inner circumference of the fitting fixing portion 2B 201213700 of the cylindrical holding portion 2 is formed, and the fitting portion 3A is made of a resin or a ring. An adhesive such as an oxygen resin is then fixed to the inner circumference of the fitting fixing portion 2B of the cylindrical holding portion 2 . In the power supply unit 4, a rectifier circuit such as a diode bridge circuit that converts the AC power supplied from the case portion 1 A of the base 1 and the eyelet portion 1 B via a lead wire (not shown) into a DC power is incorporated. A voltage control circuit that controls the rectified DC voltage to a predetermined voltage, a protection circuit that has a fuse that blocks an overcurrent or a thermistor that blocks a surge current. Further, two wires (not shown) on the DC output side of the power supply unit 4 are soldered to the circuit pattern 5E of the LED module 5 to be described later. As shown in Figs. 3 and 4, the LED module 5 has a module substrate 5A for mounting a plurality of LEDs as a light source. The module substrate 5A is integrally molded into a curved plate shape in which the outer surface protrudes toward the bulb 3 side by a third dimension by a synthetic resin such as polycarbonate (PC) having high heat resistance and high heat conductivity. In other words, the module substrate 5A has a shape in which a circular support portion 5C having a flat cross section is formed on the outer periphery of the LED mounting portion 5B having a spherical shape in a circular arc shape, for example, a so-called annular support portion 5C is formed. The shape of a straw hat. Further, in the LED mounting portion 5B, a plurality of mounting holes 5D for mounting LEDs are arranged in a concentric arrangement, for example. As shown in Fig. 2, the annular support portion 5C of the module substrate 5A is screwed to a plurality of support pieces 2C formed on the inner circumference of the other end portion of the cylindrical holding portion 2. On the other hand, each of the LED packages 7 is embedded in each of the LED mounting portions 5B of the module substrate 5A in a semi-protruding state in which the light projecting direction thereof faces the light bulb 3 side (see FIG. 5). ). The circuit pattern 5E for supplying power to each of the LED packages 7 is formed across the annular support portion 5C and the LED mounting portion 5. This circuit pattern 5E is composed of, for example, a three-layer conductive plating layer in which copper (Cu), nickel (Ni), and silver (Ag) are laminated. As shown in Fig. 5, the LED package 7 has an LED chip 7C disposed at the bottom of the reflector recess 7B formed of a thin dome-shaped cavity base 7A made of polycarbonate (PC) or ceramic, and This LED wafer 7C is sealed in a structure in which the sealing resin 7D of the reflector recess 7B is sealed. At the bottom of the reflector recess 7B of the LED package 7, the electrode pattern 7E for connecting the LED chip 7C is formed in an exposed state in the circuit pattern 5E formed in the LED mounting portion 5B of the module substrate 5A. Further, although not shown in the drawings, a plating layer for a reflector for reflecting the lighting light of the LED wafer 7C is formed on the peripheral wall surface of the reflector concave portion 7B. Here, the heat pipe unit 6 is for radiating heat generated by each of the LED packages 7 mounted on the module substrate 5A of the LED module 5. As shown in Fig. 3 and Fig. 6, the heat pipe unit 6 has a heat receiving plate portion 6A formed in a curved plate shape and joined to a concave spherical surface of the inner surface of the LED mounting portion 5B of the module substrate 5A. The base end portion is continuously formed in a plurality of heat pipes 6B concentrically on the inner surface of the heat receiving plate portion 6A. Each of the heat pipes 6B protrudes from the inner surface of the heat receiving plate portion 6A in parallel with each other, and the end portions thereof are aligned in a planar shape. The heat receiving plate portion 6A and the plurality of heat pipes 6B are formed by forming a conductive metal such as copper or nickel at the electroless plating portion S on the surface of the core formed by the synthetic resin material which can be dissolved by the post-treatment. Then, the core 201213700 material is dissolved to form. In other words, the heat receiving plate portion 6A is made of a plating layer of a conductive metal, and the plating layer of the conductive metal is formed on the inner surface of the curved plate-shaped portion of the core, and the plurality of heat pipes 6B are formed in the shape. The plurality of tubes formed by the plating of the conductive metal on the outer peripheral surface of the plurality of rod-shaped portions of the heart are filled with a capillary tube (wick) and an activator (refrigerant liquid), respectively, and the inside is vacuumed and sealed at the base end. Formed by the opening. Further, as for the synthetic resin material for molding the above-mentioned core, for example, polyvinyl alcohol (PVA) which is soluble in immersion in water maintained at _2 5 to 9 5 ° C for about 2 to 3 hours, or Soaked in an alkali solution (sodium hydroxide solution or potassium hydroxide solution) or an acidic solution maintained at 25 to 70 ° C for about 1 to 120 minutes to dissolve the polypropionic acid resin, and further, you can also use N - A solution of methyl-2-pyrrolidone dissolved in ABS resin. Here, the heat receiving plate portion 6A of the heat pipe unit 6 formed of copper or nickel having high heat conductivity is attached to the inner surface of the LED mounting portion 5B of the module substrate 5A constituting the LED module 5, In the heat receiving plate portion 6A, the electrode layer 7E of each LED package 7 is in a surface contact state. Further, as the binder, an enamel resin or an epoxy resin having high heat conductivity is used. In the LED light bulb according to the embodiment configured as described above, in the installation state in which the existing bulb socket is screwed into the base 1 and the light switch 1 is turned on, the DC power from the power supply unit 4 is turned on. The DC current controlled to a predetermined voltage on the output side is supplied to the circuit pattern 5E of the LED module 5, whereby the LED chips 7C of the plurality of LED packages 7 mounted on the module substrate 5A are lit. The lighting light is illuminated by the light ball 3. -12-201213700 Here, when the LED chip 7C of each LED package 7 is heated to emit heat, the heat generation instantaneously moves from the heat receiving plate portion 6A of the heat pipe unit 6 toward the heat releasing end portion of the heat pipe 6B of the group, and The heat releasing window 2C' of the cylindrical holding portion 2 facing the heat releasing end portion is efficiently radiated outward, and the heat receiving plate portion 6A of the heat pipe unit 6 is coupled to the reflector recess portion 7B of each LED package 7. The electrode layer 7E exposed at the bottom is in surface contact. As a result, the temperature of each of the LED chips 7C is suppressed and the life of each of the LED chips 7C is extended. Further, in the LED bulb of the embodiment, the bulb 3 is not formed in a hemispherical shape as in the conventional example, but is formed as In the same manner as a general bulb, the LED package 7 is embedded in a spherical panel shape (curved panel shape) formed in a three-dimensional projection toward the bulb 3 in a semi-protruding state. Since the respective mounting holes 5D of the mounting portion 5B are provided, the lighting light of the LED chip 7C of each of the LED packages 7 is widely irradiated by the bulb 3, and the irradiation area thereof is enlarged. Further, in the LED light bulb of the embodiment, the cylindrical holding portion 2 is not made of a metal product as in the conventional example, but is made of a lightweight synthetic resin product. Further, the length of the cylindrical holding portion 2 is set to accommodate the LED. The length of the limit required for the module 5 and the heat pipe unit 6 is shorter than the length of the conventional example, so that the weight is greatly reduced. In other words, the LED light bulb according to one embodiment can increase the heat dissipation efficiency of each of the LED chips 7C of the plurality of LED packages 7 and achieve a longer life. Moreover, a significant weight reduction can be achieved compared to the conventional example. Furthermore, it is possible to further enlarge the irradiation area of the lighting light of each of the LED chips 7C. -13- 201213700 The LED bulb of the present invention is not limited to the above-described one embodiment. For example, among the heat pipes 6B of the group constituting the heat pipe unit 6, the heat radiation end portion of the heat pipe disposed at least on the outer circumference side in a ring shape may be curved in the radial direction of the heat release window 2C facing the cylindrical holding portion 2 to be L. Font type to enhance the heat release efficiency. Moreover, a group of heat pipes 6B may also have a height difference at the position of the heat releasing end to cause heat convection between the heat releasing ends. For example, in a group of heat pipes 6B arranged in a ring shape, if a height difference is provided between the outer peripheral side and the inner peripheral side at the position of the heat radiating end portion, heat convection is generated between the outer peripheral side and the inner peripheral side. This heat convection promotes the exotherm from the heat release end of each heat pipe 6B. Further, a group of heat pipes 6B can be changed into one heat pipe 6C having a cross-sectional shape as shown in Fig. 7, that is, a heat pipe 6C in which the internal space is radially continuous. Here, as shown in FIG. 8, the cylindrical holding portion 2 may be formed such that the position of the support piece 2C for screwing the annular support portion 5C of the LED module 5 is set to a fitting portion of a large diameter. The vicinity of the position of the end portion of 2B' and the LED mounting portion 5B of the LED module 5 are hemispherical and protrude largely toward the side of the light bulb 3. In this case, the light distribution angle of the illumination light irradiated from each of the LED chips 7 C of the plurality of LED packages 7 mounted in the LED mounting portion 5B of the LED module 5 is greatly expanded to, for example, a thin chain. The angle between the lines is 0. Further, as shown in Fig. 9, the cylindrical holding portion 2 may be formed as a heat transfer metal product such as an aluminum alloy in which the heat transfer plate 2E is integrally formed in the vicinity of the fitting portion 2A having a small diameter, and may also be a group of The heat releasing end of the heat pipe 6B is joined to the heat transfer plate 2E in a manner of abutting or fitting -14-201213700. In this case, the heat generated by the lighting of each of the LED chips 7C is radiated from the heat releasing end portion of the heat pipe 6B to the entire tubular holding portion 2 via the heat transfer plate 2D, so that the heat release efficiency is further improved. The heat transfer plate 2E is used as a supporting member of the power source unit 4. On the other hand, the bulb 3 may be a transparent appearance that is not mixed with a light diffusing agent, or a translucent appearance such as milky white. Further, the light ball 3 may be a frosted glass or a milky white or transparent glass product. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing the appearance of an LED light bulb according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing the internal structure of the LED bulb shown in Fig. 1. Fig. 3 is an enlarged front elevational view showing the LED module and the heat pipe unit shown in Fig. 2. Fig. 4 is a view showing the direction of the arrow IV of Fig. 3. Fig. 5 is a longitudinal sectional view showing the structure of the LED package shown in Fig. 4. Fig. 6 is a view showing the direction of the arrow VI of Fig. 3. Fig. 7 is a view showing a modification of the heat pipe unit in an embodiment corresponding to Fig. 6. Fig. 8 is a vertical cross-sectional view showing a modification of the cylindrical holding portion and the LED module in the embodiment, corresponding to Fig. 2; Fig. 9 is a vertical cross-sectional view showing a modification of the cylindrical holding portion -15 - 201213700 and the heat pipe unit in the first embodiment, corresponding to Fig. 2 . [Description of main component symbols] 1 Lamp cap 1 A Shell part 1 B Eyelet section 2 Cylindrical holding section 2A Mating fixing section 2B Mating fixing section 2C Supporting piece 2D Heat releasing window 2E Heat transfer plate 3 Light ball 3 A fitting section Part 4 Power supply unit 5 LED module 5A Module substrate 5B LED mounting part 5C Ring support part 5D Mounting hole 5E Circuit pattern 6 Heat pipe unit 6A Heat receiving plate part 6B Heat pipe-16- 201213700 6C Tube 7 LED package 7A Empty Cavity base 7B Reflector recess 7C LED wafer 7D Sealing resin 7E Electrode layer-17