201213142 六、發明說明： 【發明所屬之技術領域】 一種貼合光學基板與載板之方法及使用該方法 之軟性基板製程，特別是指一種可提昇良率及降低 生產成本之貼合光學基板與載板之方法及使用該方 法之軟性基板製程。 【先前技術】 一般而言，於軟性基板的製程上，都會使用玻 璃或塑膠所製成的載板，作為加工或搬運等用途。 而於s知技術中，基板表面係藉由塗佈梦膠，將其 烘烤乾燥後，以貼附載板，以利基板進行多層結構 的製程，如 color filter、TFT array 或 touch sens〇r 等後段製程。而載板之主要功能在於可於後段製程 上作為承載體，以利製程對位與避免光學基板在運 送時發生碎裂的問題。 請參閱第1圖所示，其係為習知技術軟性基板 之部分流程，以說明多層結構的貼合與分離。 為了於生產線上加工，以及廠房内輸送的方 便，軟性基板1於生產或組合時，多以塗佈液態石夕 膠’將其烘烤乾燥後’形成一妙膠層12，而將塑膠 基板13黏貼於一載板11表面，以載板丨丨作為承載 體，進而進行多層結構14之製程。而塑膠基板Η 表面之多層結構，其可用以製成彩色濾光片（c〇1〇r 201213142 filter)、薄膜晶體陣列面板（tft array)、觸控感測器 (Touch sensor)等等。 當塑膠基板13完成上述後製程後，便可將塑膝 基板13與載板1丨分離，然後於塑膠基板13底部的 矽膠層1 2表面貼附塑膠薄膜1 5，以避免矽膠層i 2 吸附粉塵。 然而’由於上述石夕穆層1 2係以液態方式進行塗 佈，由於其所使用的有機溶劑，其部份成份容易導 致某些膜材霧化（腐钱）。此外，碎膠於塗佈或烘烤 時，不但須於無塵室内進行作業，且烘烤時的溫度 需達到1 5〇°C以上’才會達到足夠的密著性，如此 將大幅增加設備成本及生產成本。再者，由於此種 液態梦膠加熱乾燥後將緊密黏接塑膠基板13與載 板11，於撕除分離過程中，可能造成其他層產生脆 裂的情況。 請參閱第2圖、第3圖及第4圖所示，其係為 習知技術軟性基板製程用雙面膠帶之第一示意圖、 第二示意圖及第三示意圖。有鑑於上述缺點，目前 本案申請人曾提出一種軟性基板製程用之雙面膠帶 2，其多以聚乙烯對苯二甲酸酯（p〇lyethylenet erephthalate，PET)所製成，並具有一第一表面21 與一第二表面22，該第一表面21塗佈一減黏著劑 21 0，如UV減黏膠，該減黏著劑2丨〇用以貼合一光 學基板3，而可於該光學基板3上設置一後段製程 201213142 結構4 ;該第二表面22塗佈一矽膠220，該矽膠22〇 用以接合一載板5。藉此，此雙面膠帶應用於多層 結構之製程時’本身具有良好的貼覆性。於分離多 層結構時’僅需以紫外光照射該雙面膠帶，便可降 低位於該第一表面21減黏著劑之黏性，而可輕易進 行分離的步驟。 然而’由於此雙面膠帶，其所使用之PET材質， 因膨脹係數較大的關係’易受熱而翹曲變形，因而 鲁 將影響後續製程的進行，導致良率下降。 【發明内容】 本發明之主要目的’旨在提供一種貼合光學基 板與載板之方法及使用該方法之軟性基板製程，其 可增加良率並降低製造成本。 為達上述目的，本發明之貼合光學基板與載板 之方法包含下列步驟： Φ 提供一光學基板；提供一固態石夕膠層，其具有 一靜電吸引力；將該固態矽膠層利用靜電吸附力而 設置於該光學基板上；提供一載板；及將該載板利 用靜電吸附力設置於該固態矽膠層上。 其中’該固態石夕膠層係以聚石夕氧烧（polysiloxane) 所製成。 其中’該載板之材質為玻璃或塑膠。 其中，該固態矽膠層具有一第一表面及相對該 5 201213142 第一表面之一第二表面，該第一表面係以靜電吸附 力吸附貼合該光學基板，該第二表面係以靜電吸附 力吸附貼合該載板。 為達上述目的，本發明使用該方法之軟性基板 製程，包含下列步驟： 提供一光學基板；提供一固態矽膠層，其具有 一靜電吸附力；將該固態矽膠層利用靜電吸附力而 設置於該光學基板上；提供一載板；將該載板利用 靜電吸附力而設置於該固態矽膠層上；於該光學基 板上進行一後段製程；將該光學基板、該載板與該 固態矽膠層分離。 其中，該固態矽膠層係以聚矽氧烷（polysiloxane) 所製成。 其中，該載板之材質為玻璃或塑膠。 其中，該固態矽膠層具有一第一表面及相對該 第一表面之第二表面，該第一表面係以靜電吸附力 吸附貼合該光學基板，該第二表面係以靜電吸附力 吸附貼合該載板。 其中，該後段製程之步驟係為彩色濾光片（color filter)、設置薄膜晶體陣列面板（tft array)及設置觸 控感測器之群組之其中一者。 藉此’本發明之貼合光學基板與載板之方法及 使用該方法之軟性基板製程，可避免使用液態矽膠 於塗佈時導致某些膜材霧化的問題，也不需烘烤使 201213142 成本。也可避免 裎的進行，導致 其密著’進而減少設備成本及生產 雙面膠帶因翹曲變形而影響後續製 良率下降的問題。 【實施方式】201213142 VI. Description of the Invention: [Technical Field of the Invention] A method of bonding an optical substrate and a carrier board, and a flexible substrate process using the same, in particular, a laminated optical substrate capable of improving yield and reducing production cost A method of carrying a board and a flexible substrate process using the method. [Prior Art] In general, a carrier made of glass or plastic is used for the processing of a flexible substrate for processing or handling. In the s knowing technology, the surface of the substrate is coated with a dream gel, baked and dried, and then attached to the carrier to facilitate the multilayer structure of the substrate, such as color filter, TFT array or touch sens〇r. The latter process. The main function of the carrier board is to serve as a carrier on the back-end process to facilitate process alignment and avoid the problem of chipping of the optical substrate during transport. Referring to Fig. 1, it is a partial flow of a conventional flexible substrate to illustrate the lamination and separation of the multilayer structure. In order to facilitate the processing on the production line and the convenience of transportation in the factory, when the flexible substrate 1 is produced or combined, the liquid substrate is coated with a liquid stone, and then baked and dried to form a layer of a rubber layer 12, and the plastic substrate 13 is formed. The process of the multilayer structure 14 is performed by adhering to the surface of a carrier 11 and using the carrier raft as a carrier. The multilayer structure of the surface of the plastic substrate can be used to form a color filter (c〇1〇r 201213142 filter), a thin film crystal array panel (tft array), a touch sensor, and the like. After the plastic substrate 13 completes the above-mentioned post-process, the plastic knee substrate 13 can be separated from the carrier plate 1 and then the plastic film 15 is attached to the surface of the silicone layer 12 at the bottom of the plastic substrate 13 to avoid adsorption of the silicone layer i 2 . dust. However, since the above-mentioned Shi Ximu layer 12 is coated in a liquid state, some of the components are likely to cause atomization (corruption) of some of the films due to the organic solvent used therein. In addition, when the glue is applied or baked, it is not only necessary to work in a clean room, but the temperature at the time of baking needs to reach above 15 °C to achieve sufficient adhesion, which will greatly increase the equipment. Cost and production costs. Moreover, since the liquid crystal gel is heated and dried, the plastic substrate 13 and the carrier 11 are closely adhered, which may cause brittle cracking of other layers during the tearing and separation process. Please refer to FIG. 2, FIG. 3 and FIG. 4, which are a first schematic view, a second schematic view and a third schematic view of a double-sided tape for a flexible substrate process of the prior art. In view of the above shortcomings, the present applicant has proposed a double-sided tape 2 for a flexible substrate process, which is mostly made of polyethylene terephthalate (PET) and has a first a surface 21 and a second surface 22, the first surface 21 is coated with an anti-adhesive agent 210, such as a UV-reducing adhesive, which is used to bond an optical substrate 3 to be optical A back-end process 201213142 structure 4 is disposed on the substrate 3; the second surface 22 is coated with a silicone 220 for bonding a carrier 5. Thereby, the double-sided tape has a good applicability when applied to the process of the multilayer structure. When the multi-layer structure is separated, the double-sided tape is irradiated with ultraviolet light, and the viscosity of the adhesive on the first surface 21 can be lowered, and the separation can be easily performed. However, due to the double-sided tape, the PET material used has a large expansion coefficient, which is easily deformed by heat, and thus Lu will affect the subsequent process, resulting in a decrease in yield. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method of bonding an optical substrate and a carrier and a flexible substrate process using the same, which can increase yield and reduce manufacturing cost. In order to achieve the above object, the method for bonding an optical substrate and a carrier of the present invention comprises the steps of: Φ providing an optical substrate; providing a solid layer of slick having an electrostatic attraction; and utilizing the electrostatic adsorption of the solid silicone layer a force is disposed on the optical substrate; a carrier is provided; and the carrier is disposed on the solid silicone layer by electrostatic adsorption. Wherein the solid core layer is made of polysiloxane. The material of the carrier is glass or plastic. Wherein, the solid silicone layer has a first surface and a second surface opposite to the first surface of the 5 201213142, the first surface is adhered to the optical substrate by electrostatic adsorption, and the second surface is electrostatically adsorbed The carrier is adhered to the carrier. To achieve the above object, the flexible substrate process of the present invention comprises the steps of: providing an optical substrate; providing a solid silicone layer having an electrostatic adsorption force; the solid silicone layer being disposed on the electrostatic adsorption force Providing a carrier plate; the carrier plate is disposed on the solid silicone layer by electrostatic adsorption; performing a back-end process on the optical substrate; separating the optical substrate and the carrier from the solid silicone layer . Among them, the solid silicone layer is made of polysiloxane. The carrier is made of glass or plastic. Wherein the solid silicone layer has a first surface and a second surface opposite to the first surface, the first surface is adhered to the optical substrate by electrostatic adsorption, and the second surface is adsorbed by electrostatic adsorption. The carrier board. The step of the back-end process is one of a color filter, a thin film crystal array panel (tft array), and a set of touch sensors. Therefore, the method of bonding the optical substrate and the carrier of the present invention and the flexible substrate process using the same can avoid the problem that the liquid silicone is used to cause atomization of some films during coating, and does not need to be baked to make 201213142 cost. It is also possible to avoid the problem that the crucible is carried out, which leads to a tightness, thereby reducing the equipment cost and producing a double-sided tape which is affected by the warping deformation and affecting the subsequent yield reduction. [Embodiment]
為使貴審查委員能清楚了解本發明之内容 以下列說明搭配圖式，敬請參閱。 合光學基 包含下列In order for your review board to clearly understand the contents of the present invention, please refer to the following description. Optical base
請參閲第5圖所示，其係為本發明貼 板與載板之方法較佳實施例之流程圖，其 步驟 --- 八干签低 w S12:提供一固態矽膠層，其具有— 砰电吸附力 S 1 3 :將該固態矽膠層利用靜電 人刀而設詈 該光學基板上。 S14 :提供一載板。 置於該固態矽 S 1 5 :將該載板利用靜電吸附力設 膠層上。 板與載板之方法較佳實施例之示意圖。 該固態矽膠層6可以矽氧烷為主體， 由 作用而成為高分子量之聚矽氧烷，且 儿邊固態矽耀 6具有一第一表面61及相對該第一表面μ " 二表面62，該第一表面61係以靜電吸附力貼么 光學基板7，該第二表面62係以靜電吸附力貼▲ 201213142 載板8。該載板8之材質為玻璃或塑膠。 由於該固態矽膠層6係以靜電吸附力吸附該光 學基板7及該載板6，而可於平行該固態矽膠層6 之方向產生高吸附力’而不易受此方向之作用力之 拉扯而鬆脫。然而’由於於垂直該固態矽膠層6方 向之吸附力小於平行該固態矽膠層6方向之吸附 力，因此可輕易將其剝離於該光學基板7與該載板 6’不會產生如習知於撕除分離過程中，可能造成其 他積層產生脆裂的情況。此外，本發明僅藉由固態 石夕膠6層貼合光學基板7與載板6，而不需使用習 用多層結構之雙面膠帶加以貼合，也沒有雙面膠帶 所使用之PET材質’容易受熱而翹曲變形的問題。 接著請參閱第7 、第8圖及第9圖，其為本發 明軟性基板製程之較佳實施例之流程圖、第一結構 示意圖及第二結構示意圖，包含下列步驟： 521 :提供一光學基板。 522 :提供一固態矽膠層，具有一靜電吸附力。 523 :將該固態矽膠層利用靜電吸附力而設置於 該光學基板上。 S24·提供一載板。 S25 :將該載板利用靜電吸附力而設置於該固態 矽膠層上。 S26:於該光學基板上進行一後段製程。 S27 :將該光學基板、該載板與該固態矽膠層分 201213142 離。 本發明之軟性基板製程，係採用如第五圖所示 之貼合光學基板與載板之方法，於該光學基板7與 載板8貼合後，更進—步在該光學基板了上進行一 後段製程，該後段製程之步驟係為彩色濾光片㈣μ filter)、設置薄臈晶體陣列面板（tft &的力及設置 觸控感測器之群組之其中一者。 藉由進行該後段製程以設置一後段製程結構9 而完成本發明之IU生基板製冑。該|段製程結構9 可包括彩色濾光片（c〇l〇r filter)、薄膜晶體電路板 (TFT array)、觸控感測器（T〇uch sens〇r)等等，但不 以此為限。舉凡面板製程中，利用該載板上承載各 面板製程之基礎層或底層，然後進行後段加工者， 均屬於本說明書之保護範圍。 綜上所述，本發明之軟性基板製程及其貼合光 學基板與載板之方法，其功效在於可使用固態矽膠 層貼合光學基板及軟性基板，較習知使用液態矽膠 而言，不需無塵設備及經過烘烤，成本較低，且其 以靜電吸附力作膠合，因而撕除剝離方便，不會導 致其他製程基板碎裂。 本發明之軟性基板製程及其貼合光學基板與栽 板之方法，其另一功效在於直接使用單層固態矽膠 層貼合光學基板及軟性基板，較習知使用uv減黏 性雙面膠帶而言，結構簡單，且無須使用耐熱性不 201213142 佳之PET基材，而不會因受熱而翘曲變形。 唯，以上所述者，僅為本發明 ^ 4由 义权1圭實施例而 ，並非用以限定本發明實施之範圍，在不脫離本 發明之精神與範圍下所作之均等變化與修飾，皆應 涵蓋於本發明之專利範圍内。 综上所述，本發明之軟性基板製程及其貼合光 學基板與載板之方法，係具有專利之發明性，及對 產業的利用價值；申請人爰依專利法之規定，向鈞 局提起發明專利之_請。Please refer to FIG. 5, which is a flow chart of a preferred embodiment of the method for attaching a board and a carrier board, the steps of which are: - eight dry sign low w S12: provide a solid silicone layer, which has -砰Electrical adsorption force S 1 3 : The solid silicone layer is provided on the optical substrate by means of an electrostatic knives. S14: Provide a carrier board. The solid layer 1 S 1 5 is placed on the adhesive layer by electrostatic adsorption. A schematic diagram of a preferred embodiment of a method of board and carrier. The solid silicone layer 6 can be a main component of the oxime, which acts as a high molecular weight polyoxyalkylene, and the solid swell 6 has a first surface 61 and a second surface 62 opposite to the first surface. The first surface 61 is attached to the optical substrate 7 by electrostatic adsorption, and the second surface 62 is attached to the carrier plate 8 by the electrostatic attraction force ▲ 201213142. The carrier 8 is made of glass or plastic. Since the solid silicone layer 6 adsorbs the optical substrate 7 and the carrier 6 by electrostatic adsorption, the high adsorption force can be generated in the direction parallel to the solid silicone layer 6 and is not easily pulled by the force in this direction. Take off. However, since the adsorption force in the direction perpendicular to the solid silicone layer 6 is smaller than the adsorption force in the direction parallel to the solid silicone layer 6, it can be easily peeled off from the optical substrate 7 and the carrier 6' without generating a conventional During the tear-off separation process, other laminates may be brittle. In addition, in the present invention, the optical substrate 7 and the carrier 6 are bonded only by the solid layer of the stone, and the double-sided tape of the conventional multilayer structure is not used for bonding, and the PET material used for the double-sided tape is not easy. The problem of warping and deformation due to heat. Please refer to FIG. 7, FIG. 8 and FIG. 9 , which are a flow chart, a first structural diagram and a second structural diagram of a preferred embodiment of the flexible substrate process of the present invention, comprising the following steps: 521 : providing an optical substrate . 522: providing a solid silicone layer having an electrostatic adsorption force. 523: The solid silicone layer is provided on the optical substrate by electrostatic adsorption. S24· Provide a carrier board. S25: The carrier plate is placed on the solid silicone layer by electrostatic adsorption. S26: performing a back-end process on the optical substrate. S27: The optical substrate, the carrier plate and the solid silicone layer are separated by 201213142. The flexible substrate process of the present invention is a method of bonding an optical substrate and a carrier as shown in FIG. 5, and after the optical substrate 7 is bonded to the carrier 8, the optical substrate is further advanced on the optical substrate. a post-stage process, the step of the back-end process is a color filter (4) μ filter), and a thin-twist crystal array panel (a force of the tft & and a set of touch sensors is set. The rear stage process is completed by setting a back-end process structure 9 to complete the IU substrate manufacturing process of the present invention. The |-stage process structure 9 may include a color filter (c〇l〇r filter), a thin film crystal circuit board (TFT array), Touch sensor (T〇uch sens〇r), etc., but not limited to this. In the panel manufacturing process, the base layer or the bottom layer carrying the various panel processes on the carrier board, and then the latter processing, The invention relates to the scope of protection of the present specification. In summary, the flexible substrate process of the present invention and the method for bonding the optical substrate and the carrier plate have the effect that the optical substrate and the flexible substrate can be bonded together using a solid silicone layer, which is more conventionally used. Liquid silicone The utility model does not require dust-free equipment and is baked, has low cost, and is glued by electrostatic adsorption force, so that the peeling and peeling is convenient, and the other process substrates are not broken. The flexible substrate process and the bonded optical substrate of the invention are Another method of the method of planting the board is to directly use the single-layer solid silicone layer to bond the optical substrate and the flexible substrate. Compared with the conventional uv-reducing double-sided tape, the structure is simple, and the heat resistance is not required. The PET substrate is not warped and deformed by heat. However, the above description is only for the purpose of the present invention, and is not intended to limit the scope of the practice of the present invention. The equivalent changes and modifications made by the spirit and scope of the invention are all included in the scope of the patent of the present invention. In summary, the flexible substrate process of the present invention and the method for bonding the optical substrate and the carrier are patented. The invention and the value of the use of the industry; the applicant filed a patent for invention in accordance with the provisions of the Patent Law.
10 201213142 【圖式簡單說明] 第1圖’為習知技術軟性基板之部分流程圖。 第2圖，為習知技術軟性基板製程用雙面膠帶之第 一示意圖。 第3圖，為習知技術軟性基板製程用雙面膠帶之第 二示意圖。 第4圖’為習知技術軟性基板製程用雙面膠帶之第 三不意圖。 第5圖，為本發明貼合光學基板與載板之方法較佳 實施例之流程圖。 第6圖，為本發明貼合光學機板與載板之方法較佳 實施例之示意圖。 第7圖’為本發明軟性基板製程之較佳實施例之流 程圖。 第8圖，其為本發明軟性基板製程之較佳實施例之 第一結構示意圖。 第9圖，其為本發明軟性基板製程之較佳實施例之 第二結構示意圖。 【主要元件符號說明】 I 軟性基板 II 載板 12 石夕膠層 13 塑膠基板 11 201213142 14 多層結構 15 塑膠薄膜 2 雙面膠帶 21 第一表面 210 減黏著劑 220 矽膠 22 第二表面 3 光學基板 4 後段製程結構 5 載板 6 固態矽膠層 61 第一表面 62 第二表面 7 光學基板 8 載板 9 後段製程結構 S 11〜S 15步驟流程 S21〜S27步驟流程10 201213142 [Simple description of the drawings] Fig. 1 is a partial flow chart of a conventional flexible substrate. Fig. 2 is a first schematic view showing a double-sided tape for a flexible substrate process of the prior art. Fig. 3 is a second schematic view showing a double-sided tape for a flexible substrate process of the prior art. Fig. 4 is a third schematic view of a double-sided tape for a flexible substrate process of the prior art. Fig. 5 is a flow chart showing a preferred embodiment of a method of bonding an optical substrate and a carrier according to the present invention. Figure 6 is a schematic view showing a preferred embodiment of a method of laminating an optical plate and a carrier of the present invention. Fig. 7 is a flow chart showing a preferred embodiment of the flexible substrate process of the present invention. Figure 8 is a first schematic view showing a preferred embodiment of the flexible substrate process of the present invention. Figure 9 is a second schematic view showing a preferred embodiment of the flexible substrate process of the present invention. [Main component symbol description] I Soft substrate II Carrier plate 12 Shixi glue layer 13 Plastic substrate 11 201213142 14 Multilayer structure 15 Plastic film 2 Double-sided tape 21 First surface 210 Adhesive agent 220 Silicone 22 Second surface 3 Optical substrate 4 Back-end process structure 5 carrier board 6 solid silicone layer 61 first surface 62 second surface 7 optical substrate 8 carrier 9 rear-stage process structure S 11~S 15 step flow S21~S27 step flow