201210457 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置，尤指一種散熱性好之電子裝 置。 【先前技射ί】 [0002] 隨著電腦技術之飛速發展，一體機於市場上越來越流行 ，其設計基本上均是將主機板、硬碟機等電子元件與顯 示器整合於一個殼體裏，如此，所述電子元件集成度極 為高，中央處理器之晶片的功率亦成倍增加，熱密度急 劇上升，所述一體機於長時間之運行過程中會產生大量 熱量。 [0003] 為解決上述問題，一般均會於上述中央處理器上安裝一 散熱裝置及一與所述散熱裝置配合之風扇。工作時，散 熱裝置吸收中央處理器產生之熱量，再利用風扇吸收到 之冷風來冷卻散熱裝置。由於這樣之對流方式中的空氣 流通速度大於1米/秒，所述散熱裝置上之兩散熱鰭片之 間的距離不宜太大，多維持於1. 2-1. 6毫米之間。然而， 隨著人類對社會環保之意識逐漸提高，降低生產成本已 成了第一課題，因此，生產商考慮於上述電子裝置中取 消安裝風扇。取消掉風扇之後，這樣自然對流之散熱方 式就僅能藉由散熱裝置之傳導與輻射來完成，而自然對 流方式中之空氣流通速度遠遠小於1米/秒，遠遠不能滿 足散熱需求。 【發明内容】 [0004] 鑒於以上内容，有必要提供一種散熱性能好之電子裝置 099129202 表單編號 Α0101 第 4 頁/共 15 頁 0992051235-0 201210457 [0005] Ο 一種電子裝置，包括有殻體，所述殼體包括有底壁及蓋 合於所述底壁上之蓋板，所述底壁内裝設有主機板及第 一散熱裝置，所述主機板固定有用以為中央處理器散熱 之第二散熱裝置，所述第二散熱裝置藉由熱管與第一散 熱裝置速接於一起，所述第—散熱裝置包括有複數用以 散熱之第〆散熱鰭片，所述蓋板開設有進風口及出風口 ，每兩個相鄰之第一散熱鰭片之間的間距在5. 3_5. 7毫米 之間，由所述進風口進入殼體杓之空氣流經所述第二散 熱裝置及第〆散熱鑛片，經過所述出風口流出所述殼體 [0006] Ο [0007] [0008] 099129202 “技術相比，上述電子裝置中之第一散熱裴置的第 習知技術 7臺书之問。於不需要使 Γ科下，由所述進風口進人殼體内 風扇之 》裝置及第^散熱韓片 述為中炎處理器散热之第-:，，’、 處理 經過一風口副述殼^樣即了對 進行很好I織。 Ία圓2,本發明電子装置之一較佳d 參閱二-裝設於所述殼體1〇内之罩體3〇 一殼體中，所述電子裝置為^〇(一體機）。 實施方μ底扣及4合所述絲11之蓋板13 述殼雜10包括-底壁”及 板4〇。 ^11内裝設一第〆散熱裝 m 所述底散熱裝置2〇位於所述主機板40之-树二 遠' 多稀之第-散熱錄片21每兩相鄰J :_。 複數相J第5頁/共# 輩編號A〇l〇1 201210457 鰭片21之間的間距於5. 3-5. 7毫米之間。於一較佳實施 方式中，每兩相鄰之第一散熱鰭片21之間的最佳間距為 5. 5毫米。所述主機板40上裝設有一中央處理器（CPU， Central Processing Unit) 41，並於所述中央處理 器41周圍開設四安裝孔43。所述主機板40藉由所述安裝 孔43可於所述中央處理器41之正上方安裝一第二散熱裝 置50。所述第二散熱裝置50包括一基座51及複數固定於 所述基座51上且相互平行之第二散熱鰭片53。所述基座 51之四個角落各開設一固定孔511。 [0009] 所述第二散熱裝置50與第一散熱裝置20藉由一熱管60固 定一起。所述熱管60之一端固定於第一散熱裝置20之複 數第一散熱鰭片21上，另一端固定於所述第二散熱裝置 50之兩相鄰第二散熱鰭片53之間。於一較佳實施方式中 ，所述熱管60大致呈L形。 [0010] 所述蓋板13之下方開設有複數進風口（圖未示），並於 上方開設複數出風口 133。 [0011] 所述罩體30上開設有複數進風口 31，並包括有兩相對之 折邊33。位於下方之折邊33有複數用以供空氣進入所述 殼體10内之進風口（圖未示）。位於上方之折邊33開設 有複數用以供空氣流出所述殼體10之出風口 331。 [0012] 請參閱圖2及圖3，組裝時，將第一散熱裝置20放置於所 述殼體10上並位於所述主機板40之一側，並將所述第二 散熱裝置50放置於所述中央處理器41上。對齊中央處理 器41周圍之安裝孔43與第二散熱裝置50之基座51的固定 099129202 表單編號A0101 第6頁/共15頁 0992051235-0 201210457 孔511，四鎖固件70分別鎖入安裝孔43及與之對應的固定 孔511中’從而將第二散熱裝置5{)固定於中央處理1541上 。再將第-散熱裝置20藉由卡扣或鎖等方式固定於所 述殼體1G上並位於所述主機板4〇之，K將所述單體30 藉由鎖固等方式固定於殼體1〇之底璧11上，並罩設於主 機板40、第一散熱裝置20及第二散熱裴襄50之上方。 [0013] Ο 使用時，所述殼體10外部之空氣經由所述殼體10的蓋板 13之進風口進入殼體1〇内，並藉由所述覃體30上之進風 口 31、及下方之折邊33上的進風口進入主機板40周圍， 流經所述主機板4〇上之中央處理器41、第一散熱裝置20 及第二散熱裝置50，經過罩體3〇之折邊W上的出風口 331排出。 v *厂’ [0014] ◎ 圖4是藉由Icepak軟體測試仿真類比所述電子裝置於正常 工作時（測試環境溫度為35攝氏度）#兩相鄰之第一散 熱鰭片21間之間距與CPU工作時之溫度的曲線關係。從圖 4中可看出，當兩第^散熱鰭片21之:間的間距從5. 1減小 到5. 5毫米之間時^，辦述中央處理器41上之溫度從90. 3 逐漸降低至86攝氏度；當兩第一散熱鰭片21之間的間距 從5. 5增加到5. 9毫米時，所述中央處理器41上之溫度從 86逐漸升高到90. 8攝氏度；當兩第^散熱韓片21之間的 間距為5. 5毫米時，所述中央處理器41上之溫度達到最低 點，為86攝氏度。經過多次驗證可知，所述令央處理器 41之溫度控制於86-86. 6攝氏度時，不易被損壞。從圖4 中可看出，當兩第一散熱鰭片21之間的間距分別為5. 3毫 米及5. 7毫米時，所述中央處理器41之溫度均為86. 6攝 099129202 表單編號A0101 第7 0992051235-0 201210457 氏度；當兩第一散熱鰭片21之間的間距從5. 3增加到5. 5 毫米時，所述中央處理器41之溫度均為86. 6逐漸降低至 86攝氏度；當兩第一散熱鰭片21之間的間距從5. 5增加到 5. 7毫米時，所述中央處理器41之溫度均為86逐漸升高至 86. 6攝氏度。由此可見，兩第一散熱鰭片21之間的間距 為5. 3-5. 7毫米時，散熱效果極佳，此時之中央處理器 41之溫度控制於86-86. 6攝氏度，且兩第一散熱鰭片21 之間的間距為5. 5毫米時，散熱效果最佳，此時之中央處 理器41之溫度為86攝氏度。 [0015] 綜上所述，本發明確已符合發明專利要求，爰依法提出 專利申.請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0016] 圖1是本發明電子裝置之較佳實施方式之一立體分解圖。 [0017] 圖2是本發明電子裝置之較佳實施方式之另一立體分解圖 〇 [0018] 圖3是圖1之一立體組裝圖。 [0019] 圖4是藉由I cepak軟體測試仿真類比本發明電子裝置中之 每兩相鄰第一散熱鰭片之間距與中央處理器工作時的溫 度之間的曲線關係圖。 【主要元件符號說明】 [0020] 殼體：10 099129202 表單編號A0101 第8頁/共15頁 0992051235-0 201210457201210457 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an electronic device, and more particularly to an electronic device having good heat dissipation. [Previous technology] [0002] With the rapid development of computer technology, all-in-one machines are becoming more and more popular in the market. The design is basically to integrate electronic components such as motherboards and hard disk drives into a single housing. Thus, the electronic component is extremely highly integrated, the power of the wafer of the central processing unit is multiplied, and the heat density is sharply increased. The integrated machine generates a large amount of heat during long-term operation. In order to solve the above problems, a heat sink and a fan matched with the heat sink are generally mounted on the central processing unit. During operation, the heat sink absorbs the heat generated by the central processing unit and then uses the cold air absorbed by the fan to cool the heat sink. The distance between the two heat-dissipating fins is not too large, and is maintained between 1. 2-1. 6 mm. However, as human awareness of social environmental protection has gradually increased, reducing production costs has become the first issue. Therefore, manufacturers are considering eliminating the installation of fans in the above electronic devices. After the fan is removed, the natural convection heat dissipation method can only be accomplished by the conduction and radiation of the heat sink, and the air circulation speed in the natural convection mode is much less than 1 m/sec, which is far from satisfying the heat dissipation requirement. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide an electronic device with good heat dissipation performance. 099129202 Form No. 1010101 Page 4 of 15 0992051235-0 201210457 [0005] Ο An electronic device including a housing, The housing includes a bottom wall and a cover plate covering the bottom wall, wherein the bottom wall is provided with a main board and a first heat dissipating device, and the main board is fixed for use as a second heat dissipation of the central processing unit. a heat dissipating device, wherein the second heat dissipating device is fast-connected to the first heat dissipating device by a heat pipe, wherein the first heat dissipating device comprises a plurality of second fins for dissipating heat, and the cover plate is provided with an air inlet and The air outlet, the distance between each of the two adjacent first heat dissipating fins is between 5.3 and 5. 7 mm, and the air entering the casing through the air inlet flows through the second heat dissipating device and the third a heat-dissipating piece that flows out of the casing through the air outlet [0006] Ο [0007] [0008] 099129202 "Technical comparison, the first conventional heat-dissipating device in the above-mentioned electronic device Don’t need to make it The device that the air inlet enters the fan in the casing and the second piece of the heat-dissipating Korean film are described as the heat-dissipating of the medium-inflammation processor-:,, ', and the processing is performed through a tuyere. Ία圆2, one of the electronic devices of the present invention is preferably referred to as a casing 3 mounted in the housing 1〇, and the electronic device is an integrated device. The implementer bottom buckle and the cover plate 13 of the wire 11 are described as the bottom wall and the plate 4〇. ^11 is provided with a second heat sink. The bottom heat sink 2 is located at the tree-side of the motherboard 40. The thinner-heat-dissipating film 21 is adjacent to each other J:_. Between the 3-5. 7 mm. The spacing between the fins is between 5. 3-5. 7 mm. In a preferred embodiment, the optimum spacing between each two adjacent first fins 21 is 6.5 mm. A central processing unit (CPU) 41 is mounted on the motherboard 40, and four mounting holes 43 are formed around the central processing unit 41. The motherboard 40 can be mounted with a second heat dissipating device 50 directly above the central processing unit 41 via the mounting hole 43. The second heat dissipating device 50 includes a base 51 and a plurality of second heat dissipating fins 53 fixed to the base 51 and parallel to each other. A fixing hole 511 is defined in each of the four corners of the base 51. [0009] The second heat sink 50 and the first heat sink 20 are fixed together by a heat pipe 60. One end of the heat pipe 60 is fixed on the plurality of first heat dissipation fins 21 of the first heat dissipation device 20, and the other end is fixed between the two adjacent second heat dissipation fins 53 of the second heat dissipation device 50. In a preferred embodiment, the heat pipe 60 is substantially L-shaped. [0010] A plurality of air inlets (not shown) are opened under the cover plate 13, and a plurality of air outlets 133 are opened at the upper side. [0011] The cover body 30 is provided with a plurality of air inlets 31 and includes two opposite flanges 33. The underlying hem 33 has a plurality of air inlets (not shown) for air to enter the housing 10. The upper hem 33 is provided with a plurality of air outlets 331 for air to flow out of the casing 10. Referring to FIG. 2 and FIG. 3, when assembling, the first heat sink 20 is placed on the casing 10 and located on one side of the motherboard 40, and the second heat sink 50 is placed on The central processor 41 is on. The mounting hole 43 around the central processing unit 41 and the base 51 of the second heat sink 50 are fixed. 099129202 Form No. A0101 Page 6 / 15 pages 0992051235-0 201210457 Hole 511, the four locking fasteners 70 are respectively locked into the mounting holes 43 And the corresponding fixing hole 511 'and the second heat sink 5{) is fixed to the central processing 1541. The first heat dissipating device 20 is fixed to the casing 1G by means of a buckle or a lock, and is located on the main body plate 4, and K fixes the single body 30 to the casing by locking or the like. The bottom plate 11 is placed over the motherboard 40, the first heat sink 20, and the second heat sink 50. [0013] Ο When in use, the air outside the casing 10 enters the casing 1 through the air inlet of the cover 13 of the casing 10, and through the air inlet 31 on the body 30, and The air inlet on the lower flange 33 enters the periphery of the motherboard 40, flows through the central processing unit 41, the first heat sink 20 and the second heat sink 50 on the motherboard 4, and passes through the flange of the cover 3 The air outlet 331 on the W is discharged. v *厂' [0014] ◎ Figure 4 is simulated by the Icepak software test analogy of the electronic device during normal operation (test environment temperature is 35 degrees Celsius) # two adjacent first heat sink fins 21 between the CPU and the CPU The curve relationship of the temperature at work. The temperature on the central processing unit 41 is from 90. 3 when the distance between the two heat-dissipating fins 21 is reduced from 5.1 to 5. 5 mm. The temperature of the central processing unit 41 is gradually increased from 86 to 90.8 degrees Celsius when the distance between the two first heat dissipating fins 21 is increased from 5.5 to 5.9 mm; When the distance between the two heat-dissipating Korean sheets 21 is 5.5 mm, the temperature on the central processing unit 41 reaches a minimum point of 86 degrees Celsius. After many verifications, the temperature of the central processing unit 41 is controlled to be 86-86. 6 degrees Celsius, which is not easily damaged. The number of the central processing unit 41 is 86. 6 to 099129202. The form number is shown in Fig. 4, when the distance between the two first heat dissipating fins is 5.3 mm and 5.7 mm, respectively. The gradual decrease of the temperature of the central processing unit 41 is 86. 6 gradually decreases to the temperature of the central processing unit 41 when the distance between the two first heat dissipating fins 21 is increased from 5.3 to 5. 5 mm. The temperature of the central processing unit 41 is gradually increased to 86. 6 degrees Celsius when the distance between the two first heat dissipating fins 21 is increased from 5.5 to 5. 7 mm. The temperature of the central processing unit 41 is controlled at 86-86. 6 degrees Celsius, and the distance between the two first heat-dissipating fins is 5. 3-5. When the distance between the two first heat dissipating fins 21 is 5.5 mm, the heat dissipation effect is optimal, and the temperature of the central processing unit 41 at this time is 86 degrees Celsius. [0015] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0016] FIG. 1 is an exploded perspective view of a preferred embodiment of an electronic device of the present invention. 2 is another perspective exploded view of a preferred embodiment of the electronic device of the present invention. [0018] FIG. 3 is an assembled, isometric view of FIG. 4 is a graph showing the relationship between the distance between each two adjacent first heat dissipating fins in the electronic device of the present invention and the temperature at which the central processing unit operates by the I cepak software test simulation. [Description of main component symbols] [0020] Housing: 10 099129202 Form No. A0101 Page 8 of 15 0992051235-0 201210457
[0021] 底壁：11 [0022] 蓋板：13 [0023] 散熱裝置：20 [0024] 第一散熱鰭片 ：21 [0025] 主機板：40 [0026] 中央處理器：41 [0027] 安裝孔：43 [0028] 第二散熱裝置 ：50 [0029] 基座：51 [0030] 第二散熱鰭片 ：53 [0031] 固定孔：511 [0032] 熱管：60 [0033] 罩體：30 [0034] 進風口 ： 31 [0035] 折邊：33 [0036] 出風口 ： 331、 133 [0037] 鎖固件：70[0021] Bottom wall: 11 [0022] Cover: 13 [0023] Heat sink: 20 [0024] First heat sink fin: 21 [0025] Motherboard: 40 [0026] Central Processing Unit: 41 [0027] Installation Hole: 43 [0028] Second heat sink: 50 [0029] Base: 51 [0030] Second heat sink fin: 53 [0031] Fixing hole: 511 [0032] Heat pipe: 60 [0033] Shell: 30 [ 0034] Air inlet: 31 [0035] Folding: 33 [0036] Air outlet: 331, 133 [0037] Locking: 70
099129202 表單編號A0101 第9頁/共15頁 0992051235-0099129202 Form No. A0101 Page 9 of 15 0992051235-0