201210455 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱系統，尤指一種能有效降低電腦機 箱内之電子零組件溫度之電腦機箱散熱系統。 【先前技術】 [0002] 隨著電腦技術之快速發展，目前之台式機中小機箱系統 之使用越來越普遍。由於機箱之體積越來越小，多數小 機箱系統使用筆記本之平躺式記憶體模組（平行於主機 _ 板）來減速少系統之體積。冷空氣從機箱前面板之進風 ❹ ^ 口進入機箱，流經硬碟機與主機板構成之風道，再進入 中央處理器之散熱器後藉由系統風扇排出。由於採用的 是平躺式筆記本記憶體模組，不利於氣體流入記憶體模 組，導致記憶體模組之晶片溫度上升，習知之小機箱系 統中於記憶體模組上方安裝一風扇，專門用以為記憶體 模組散熱，增加了生產成本。 【發明内容】 Q [〇〇〇3] 鑒於以上内容，有必要提供一種能有效降低電腦機箱内 之記憶體溫度之電腦機箱散熱系統。 [0004] —種電腦機箱散熱系統，包括一機箱，該機箱包括一底 板及一裝設於該底板上之電腦主機板，該電腦主機板上 裝有一第一發熱元件及位於該第一發熱元件上之散熱器 ，該電腦主機板上於散熱器之一側裝設一第二發熱元件 ，該第二發熱元件於該電腦主機板所在之平面上以一大 於0度且小於90度之角度設置，使得由外界進入機箱之一 部分氣流斜向流經該第二發熱元件表面為第二發熱元件 099128179 表單編號 A0101 第 3 頁/共 11 頁 0992049539-0 201210455 散熱。 [0005] 與習知技術相比，上述電腦機箱散熱系統將該第二發熱 元件斜向安裝於電腦主機板上，使得由外界進入電腦機 箱之一部分氣流斜向流經該第二發熱元件表面為第二發 熱元件散熱。 【實施方式】 [0006] 請參閱圖1，本發明電腦機箱散熱系統包括一機箱10，該 機箱10包括一底板11、兩側板12、13、一前板14及一後 板15。該兩側板12、13、前板14與後板15均垂直於該底 板11設置。 [0007] 該底板11上平行裝設了 一電腦主機板20，該電腦主機板 20上安裝有一第一發熱元件（圖未示）與一安裝於該第一 發熱元件上之散熱器21。該散熱器21包括複數散熱片211 ，該散熱器21上兩侧散熱片211之長度小於中間散熱片 211之長度。該散熱器21之一侧裝設一第二發熱元件22， 該電腦主機板20上於散熱器21背向該第二發熱元件22之 另一侧裝有一導風罩23及一風扇24，該散熱器21藉由導 風罩23與風扇24與該機箱10外部連通，用以將流經該第 二發熱元件22與散熱器21之氣流導出機箱10。該第二發 熱元件22於底板11上以一大於0度且小於90度之角度設置 ，使得由外界進入機箱10之一部分氣流斜向流經該第二 發熱元件22之表面為第二發熱元件22散熱。該第二發熱 元件22包括兩記憶體221、222。該前板14上相對第二發 熱元件22之位置處開設一進風開孔141。 [0008] 該導風罩23具有一進風開口231及一出風開口 232，該導 099128179 表單編號 A0101 第 4 頁/共 11 頁 0992049539-0 201210455 [0009] Ο201210455 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipation system, and more particularly to a computer chassis heat dissipation system capable of effectively reducing the temperature of electronic components in a computer case. [Prior Art] [0002] With the rapid development of computer technology, the use of small and medium-sized chassis systems is becoming more and more popular. Due to the smaller and smaller size of the chassis, most small chassis systems use the notebook's flat-mounted memory module (parallel to the host_board) to reduce the size of the system. The cold air enters the chassis from the air inlet of the front panel of the chassis, flows through the air duct formed by the hard disk drive and the motherboard, and then enters the heat sink of the central processor and is discharged by the system fan. Because the flat-bed notebook memory module is used, it is not conducive to gas flowing into the memory module, resulting in a rise in the temperature of the memory module. In the conventional small-chassis system, a fan is installed above the memory module, and is specially used. The memory module is cooled, which increases production costs. SUMMARY OF THE INVENTION Q [〇〇〇3] In view of the above, it is necessary to provide a computer chassis cooling system that can effectively reduce the temperature of the memory in the computer case. [0004] A computer chassis heat dissipation system includes a chassis, the chassis includes a bottom plate and a computer motherboard mounted on the bottom plate, the computer motherboard is provided with a first heating element and the first heating element a heat sink on the computer motherboard is provided with a second heating element on one side of the heat sink, and the second heating element is disposed at an angle greater than 0 degrees and less than 90 degrees on a plane where the computer motherboard is located Therefore, a part of the airflow entering the chassis from the outside is obliquely flowing through the surface of the second heating element as the second heating element 099128179 Form No. A0101 Page 3 of 11 0992049539-0 201210455 Heat dissipation. Compared with the prior art, the computer chassis heat dissipation system obliquely mounts the second heating element on the computer motherboard, so that a part of the airflow from the outside into the computer case flows obliquely through the surface of the second heating element. The second heating element dissipates heat. [0006] Referring to FIG. 1, a computer chassis heat dissipation system of the present invention includes a chassis 10, which includes a bottom plate 11, two side plates 12, 13, a front plate 14, and a rear plate 15. The two side panels 12, 13, the front panel 14 and the rear panel 15 are each disposed perpendicular to the bottom panel 11. A base panel 20 is mounted on the bottom plate 11 in parallel with a first heat generating component (not shown) and a heat sink 21 mounted on the first heat generating component. The heat sink 21 includes a plurality of fins 211, and the length of the fins 211 on both sides of the heat sink 21 is smaller than the length of the intermediate fins 211. A heat generating component 22 is disposed on one side of the heat sink 21 , and an air guiding cover 23 and a fan 24 are mounted on the other side of the heat sink 21 facing away from the second heat generating component 22 . The heat sink 21 communicates with the outside of the chassis 10 via the air hood 23 and the fan 24 for discharging the airflow flowing through the second heat generating component 22 and the heat sink 21 to the chassis 10. The second heating element 22 is disposed on the bottom plate 11 at an angle greater than 0 degrees and less than 90 degrees, such that a portion of the airflow entering the chassis 10 from the outside is obliquely flowing through the surface of the second heating element 22 as the second heating element 22 Cooling. The second heating element 22 includes two memories 221, 222. An air inlet opening 141 is defined in the front plate 14 at a position opposite to the second heat generating element 22. [0008] The air hood 23 has an air inlet opening 231 and an air outlet opening 232. The guide 099128179 Form No. A0101 Page 4 of 11 0992049539-0 201210455 [0009] Ο
[0010] 099128179 風罩23之進風開口 231與散熱器21背向該第二發熱元件 22之一側對齊，該風扇24安裝於導風罩23之出風開口 232上。該後板15上開設複數出風開孔151，該出風開孔 151與風扇24相對，用以將流經該記憶體221、222與散 熱器21之氣流排出機箱10。於本實施方式中，該第二發 熱元件22與底板11之間的角度為30度。該第一發熱元件 為中央處理器。 當電腦主機運行時，該風扇24開始工作。該機箱10外較 低溫度之空氣由前板14上之進風開孔141進入機箱10，並 於該風扇24之作用下加速流經記憶體221、222與散熱器 21。由於該記憶體221、222與底板11之間呈一大於0度 且小於90度之角度設置，使得該記憶體221、222傾斜安 裝於電腦主機板20上。此時一部分氣流斜向流經該記憶 體221之下表面與記憶體222之上表面，並藉由該記憶體 221、222之間的間隙斜向流經該記憶體221之上表面與 記憶體222之下表面。較低溫度之空氣吸收了該記憶體 221、222與散熱器21之熱量並經由該導風罩23、風扇24 與出風開孔151排出機箱10，由於機箱10内之壓強低於外 部壓強，因而於機箱10内產生之負壓作用使得機箱10外 較低溫度之空氣可經由前板14上之進風開孔141源源不斷 之進入機箱10内，並帶走該記憶體221、222與散熱器21 之熱量後藉由該導風罩23、風扇24與出風開孔151迅速被 排出。 藉由一業界熟知之電子產品熱分析軟體Icepak對該電腦 機箱散熱系統之效能進行仿真。模擬條件設定為：初始 表單編號A0101 第5頁/共11頁 0992049539-0 201210455 環境溫度為35度，該第一發熱元件之散熱效率為95W，該 第二發熱元件22之散熱效率為20W，該散熱器21之尺寸為 85. 3mmx81mmx87. 7mm，該風扇 24之尺寸為92_x92mmx 2 5mm，轉速為2000rpm，最大風流量為35.32cfm，最大 靜壓為0. 084 inch-H20。根據上述之類比條件，應用本 電腦機箱散熱系統後，得出之結果為：該記憶體221、 222表面之最高溫度為71.9354度，而沒有應用本電腦機 箱散熱系統時，該記憶體221、222表面之最高溫度為 67. 0709度。由此看出，改進後，該記憶體221、222之 表面溫度沒有顯著之升高。而該記憶體221、222之表面 溫度上限值通常為85度以内，因此71. 9354度仍然於該 記憶體221、222之表面溫度之安全值範圍内。且使用本 電腦機箱散熱系統後，節省了習知之電腦機箱散熱系統 中安裝於該記憶體221、222上方之散熱風扇，降低了生 產成本。 [0011] 综上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0012] 圖1係本發明電腦機箱散熱系統一較佳實施方式之分解圖 〇 [0013] 圖2係圖1中電腦機箱散熱系統之組裝圖。 【主要元件符號說明】 099128179 表單編號A0101 第6頁/共11頁 0992049539-0 201210455 [0014] 機箱：10 [0015] 底板：11 [0016] 側板：12、1 3 [0017] 前板：14 [0018] 後板：15 [0019] 電腦主機板：20 [0020] 散熱器：21 Ο [0021] 第二發熱元件：22 [0022] 導風罩：23 [0023] 風扇：24 [0024] 進風開孔：141 [0025] 出風開孔· 151 [0026] G [0027] 散熱片：211 1 . t己‘It體：221 、222 [0028] 進風開口 ： 231 [0029] 出風開口 ： 232 099128179 表單編號A0101 第7頁/共11頁 0992049539-0[0010] 099128179 The air inlet opening 231 of the windshield 23 is aligned with the side of the heat sink 21 facing away from the second heat generating component 22, and the fan 24 is mounted on the air outlet opening 232 of the air guiding cover 23. A plurality of air outlet openings 151 are defined in the rear panel 15, and the air outlet openings 151 are opposite to the fan 24 for discharging the airflow flowing through the memory bodies 221, 222 and the heat sink 21 out of the chassis 10. In the present embodiment, the angle between the second heat generating element 22 and the bottom plate 11 is 30 degrees. The first heating element is a central processing unit. When the host computer is running, the fan 24 starts to work. The air of the lower temperature outside the chassis 10 enters the chassis 10 from the air inlet opening 141 of the front panel 14, and is accelerated by the fan 24 to flow through the memories 221, 222 and the heat sink 21. Since the memory 221, 222 and the bottom plate 11 are disposed at an angle greater than 0 degrees and less than 90 degrees, the memory 221, 222 is obliquely mounted on the computer motherboard 20. At this time, a part of the airflow flows obliquely through the lower surface of the memory 221 and the upper surface of the memory 222, and flows obliquely through the upper surface of the memory 221 and the memory by the gap between the memories 221 and 222. 222 under the surface. The air of the lower temperature absorbs the heat of the memory 221, 222 and the heat sink 21 and exits the chassis 10 through the air hood 23, the fan 24 and the air outlet 151. Since the pressure inside the chassis 10 is lower than the external pressure, Therefore, the negative pressure generated in the chassis 10 causes the air of the lower temperature outside the chassis 10 to continuously enter the chassis 10 through the air inlet opening 141 of the front panel 14, and takes away the memory 221, 222 and the heat dissipation. The heat of the device 21 is quickly discharged by the air hood 23, the fan 24, and the air outlet 151. The performance of the computer chassis cooling system was simulated by a well-known electronic product thermal analysis software Icepak. The simulation condition is set to: initial form number A0101, page 5/total 11 page 0992049539-0 201210455, the ambient temperature is 35 degrees, the heat dissipation efficiency of the first heating element is 95W, and the heat dissipation efficiency of the second heating element 22 is 20W. 084英寸-H20。 The size of the heat sink 21 is 85. 3mmx81mmx87. 7mm, the size of the fan 24 is 92_x92mmx 2 5mm, the speed is 2000rpm, the maximum wind flow is 35.32cfm, the maximum static pressure is 0. 084 inch-H20. According to the above analogous conditions, after applying the heat dissipation system of the computer case, the result is that the maximum temperature of the surface of the memory 221, 222 is 71.9354 degrees, and the memory 221, 222 is not used when the heat dissipation system of the computer case is not applied. The maximum temperature of the surface is 67. 0 degrees. It can be seen from this that after the improvement, the surface temperatures of the memories 221, 222 are not significantly increased. The upper limit of the surface temperature of the memory 221, 222 is usually within 85 degrees, so that 71.354 degrees is still within the safe range of the surface temperatures of the memories 221, 222. Moreover, after using the heat dissipation system of the computer case, the heat dissipation fan installed on the memory 221 and 222 in the conventional computer chassis heat dissipation system is saved, which reduces the production cost. [0011] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0012] FIG. 1 is an exploded view of a preferred embodiment of a computer chassis heat dissipation system of the present invention. [0013] FIG. 2 is an assembled view of the computer chassis heat dissipation system of FIG. [Main component symbol description] 099128179 Form No. A0101 Page 6 of 11 0992049539-0 201210455 [0014] Chassis: 10 [0015] Base plate: 11 [0016] Side plate: 12, 1 3 [0017] Front plate: 14 [ 0018] Rear panel: 15 [0019] Computer motherboard: 20 [0020] Radiator: 21 Ο [0021] Second heating element: 22 [0022] Air hood: 23 [0023] Fan: 24 [0024] Air intake Opening: 141 [0025] Outlet opening · 151 [0026] G [0027] Heat sink: 211 1 . t own 'It body: 221, 222 [0028] Air inlet: 231 [0029] Outlet opening: 232 099128179 Form No. A0101 Page 7 of 11 0992049539-0