201207315 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種製造燈具的 明燈具之製造方法。 方法纟其疋-種LED照 【先前技術】 目前一般現有的UD照明燈具為 設有散熱罩60、位於散敎罩6〇:為:5式，如圖6所示’ 7n q 政熱罩60内部的電路基板組、燈罩 1°、心柱座與燈座8〇,散熱罩6。的頂緣與燈罩7〇固…罩 電路基板組位於燈罩70及散熱罩6。内，芯柱 ： 裝地與散熱罩6〇結合並愈 於-枉庙… 並，、電路基板組固設，燈座80套固 於心柱座，其中’散熱罩6〇用於雷 罩通常為金屬製成且不透光 ’散熱’散熱 燈具存有下列缺點： &而現有技術的UD照明 1.組合式設計導致產线縫而易受潮或氧化：由於散 …罩60與燈罩70是組合後以膠黏的方式固定若 全仍會產生微小接縫，導致料7Q及散熱罩Μ内的: 密閉性不佳’而芯柱座可拆卸組裝地與散熱罩㈣結合= 產生接縫，造成電路基板組易受外界環境影響其可靠戶， 如PCB、導體易氧化受潮而老受 又 壽命減低，極不實用。 使仔⑽照明燈具的 2.組合式設計無變化彈性··由於現有技術是屬於組八 ，設計’散熱罩6G及燈罩7G的形式固定才利於组裝^ 是卻無法靈活地改變形狀，若要改變形狀則需花費报高= 成本製作新的形式的散熱罩60,極不實用。 〇 3.照明效率不佳：現有技術的LED照明燈具發 Θ 勻 F r· 201207315 下 光疋藉由燈罩70内塗所反射而成’散熱罩6q也會遮住 照的光線’會減低亮度，使得照明效率及效果不佳。 4.絕緣性不佳：由於散熱罩60為了散埶，士夕， …、 八夕由金屬 製成’但是會造成現有技術的LED照明燈具的絕緣性不 導致使用者有可能會觸電的安全性問題。 【發明内容】 為解決現有技術的LED照明燈具有關於易受潮或氧 化、無變化彈性、照明效率不佳及絕緣性不佳的不足與虱 制，本發明的目的在於提供一種LED照明燈具之製造方法: 疋製備由玻璃一體成型的燈罩，且於封泡的步驟中將絕緣 基座的耳部與燈罩的頸部以燒結方式結合後並以融斷導管 的方式使得燈罩内部空間能夠氣密；由於燈罩内部空間= 夠氣密，所以經由烘乾、抽氣及灌氣的處理後所製作出2 的LED照明燈具内部的電路基板組不易受外界環境影響其 可靠度，不易氧化或受潮，能夠延長LED照明燈具的壽命， 極為實用。201207315 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of manufacturing a luminaire for manufacturing a luminaire. Method 纟 疋 种 种 种 种 种 先前 先前 先前 先前 先前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前 目前The internal circuit board group, the lamp cover 1°, the stem holder and the lamp holder 8〇, and the heat dissipation cover 6. The top edge and the lamp cover 7 are sturdy... The cover circuit board group is located in the lamp cover 70 and the heat sink cover 6. Inside, the stem: The grounding is combined with the heat-dissipating cover 6并 and the more the 枉 枉 temple... And, the circuit board group is fixed, the lamp holder 80 is sleeved on the stem post, wherein the 'heat-dissipating cover 6 〇 is used for the lightning hood The heat-dissipating heat-dissipating lamp made of metal has the following disadvantages: & UD lighting of the prior art 1. The combined design causes the seam to be wet or oxidized: since the cover 60 and the lamp cover 70 are After the combination, it will be glued to form a small seam, which will result in the material 7Q and the heat sink cover: the airtightness is poor. The core post is detachably assembled and combined with the heat sink cover (4) = seam is produced. The circuit board group is easily affected by the external environment, and the reliable households, such as PCBs and conductors, are easily oxidized and dampened, and the old life is reduced, which is extremely impractical. 2. The combination design of the Aberdeen (10) lighting fixture has no change elasticity. · Because the prior art belongs to the group eight, the design of the heat-dissipating cover 6G and the lampshade 7G is fixed in order to facilitate assembly, but it is not flexible to change the shape. Changing the shape requires a high cost = cost to create a new form of heat shield 60, which is extremely impractical. 〇 3. Poor lighting efficiency: the prior art LED lighting fixtures 匀 F r · 201207315 The lower light 疋 by the inner cover of the lamp cover 70 reflected that the 'heat shield 6q will also cover the light of the light' will reduce the brightness, The lighting efficiency and effect are not good. 4. Poor insulation: Since the heat shield 60 is used for dissipation, the eve, ..., the october is made of metal, but the insulation of the prior art LED lighting fixture does not cause the user to be electrically shocked. problem. SUMMARY OF THE INVENTION In order to solve the problem that the LED lighting lamp of the prior art has the disadvantages of being susceptible to moisture or oxidation, no change in elasticity, poor lighting efficiency, and poor insulation, the present invention aims to provide an LED lighting fixture. Method: preparing a lampshade integrally formed of glass, and combining the ear of the insulating base and the neck of the lamp cover in a sintering manner in a step of sealing, and making the inner space of the lamp cover airtight by melting the conduit; Since the inner space of the lampshade is airtight, the circuit board group inside the LED lighting fixture produced by the drying, pumping and gas filling processes is not easily affected by the external environment, and is not easily oxidized or damp. Extending the life of LED lighting fixtures is extremely practical.
本發明所運用的技術手段在於提供一種LED照明燈具 之製造方法，其步驟包括： 結合芯柱及電路基板組：將一芯柱與一電路基板組結 σ固疋，其中，該Ά柱设有一絕緣基座、兩導絲及一導管， S亥絕緣基座是由玻璃製成的一殼體並設有一耳部，該耳部 呈徑向凸出狀；該兩導絲分別穿固於該絕緣基座並各設有 一支撐端及一結合端，各支撐端是外露於該絕緣基座；該 導管由玻璃製成並穿固於該絕緣基座；該電路基板組是固 設並電連結於該兩支撐端並包括有一個以上的U]); 201207315 供乾：將該電路基板組烘乾； 封泡：製備一燈罩，將該電路基板組置於該燈罩内， 該燈罩是由玻璃一體成型製成並設有一開口及一頸部，該 頸部鄰接於該燈罩的開口；使該耳部抵靠於該頸部鄰接= 該燈罩的開口之處，旋轉該燈罩和該芯柱，並利用高溫火 焰將該耳部及該頸部燒結固定；其中該導管是部份外露於 該燈罩且該燈罩的内部空間透過該導管而與外界相通； 抽氣：利用該導管將該燈罩内的殘餘空氣抽出；The technical method used in the present invention is to provide a method for manufacturing an LED lighting fixture, the steps comprising: combining a core column and a circuit substrate group: a core pillar and a circuit substrate assembly σ, wherein the pillar is provided with a Insulating base, two guide wires and a duct, the Shai insulating base is a casing made of glass and is provided with an ear portion, the ear portion is radially convex; the two guide wires are respectively fixed on the The insulating bases are respectively provided with a supporting end and a joint end, and each supporting end is exposed to the insulating base; the duct is made of glass and is fixed to the insulating base; the circuit board set is fixed and electrically connected At the two supporting ends and including more than one U]); 201207315 for drying: drying the circuit substrate group; sealing: preparing a lamp cover, the circuit substrate group is placed in the lamp cover, the lamp cover is made of glass Integrally formed and provided with an opening and a neck adjacent to the opening of the lamp cover; the ear portion is abutted against the neck adjacent to the opening of the lamp cover, and the lamp cover and the stem are rotated And sintering the ear and the neck with a high temperature flame Fixing; wherein the duct is partially exposed to the lampshade and the inner space of the lampshade is communicated with the outside through the duct; pumping: using the duct to extract residual air in the lampshade;
灌氣.將氮氣或惰性氣體由該導管灌入該燈罩内； 封口 .用尚溫火焰融斷該導管而使該燈罩的内部空間 成氣密狀態；以及 結合燈座與燈罩：將一燈座套固於該頸部，將該燈座及 該兩結合端依相對應的極性電連結固定。 所述的LED照明燈具之製造方法， 丹甲於前述的烘乾 步驟中，烘乾前述的電路基板組的時間為分鐘而 烘乾前述的電路基板組的溫度為12〇〇c〜125^。 中於前述的封泡的 高溫火焰水平射出 所述的LED照明燈具之製造方法，其 步驟中’倒置前述的燈罩而呈倒立狀態， 並對準前述的耳部。 所述的LED照明燈具之製造方法，其中於前述的封泡 步驟中，前述的燈罩呈直立狀態，高溫火焰朝下傾斜射出 對準前述的耳部，高溫火焰與該耳 ^ 1 m在的水平面所夾的 度為〆焰角，δ玄焰角的範圍為5。〜15。。 本發明所提供的LED照明燈具之傲、Α 、 〜衣万法，可以稽； 的具體效益及功效增進至少包括. 201207315 成型1的^内密空間：由於本發明製備由玻璃-體 的頸部以燒結方=::驟中將絕緣基座的耳部與燈罩 部空間能夠氣密： 融斷導管的方式使得燈罩内 & & + ^ 由於燈罩内部空間能夠氣密，所以經由 丸、乾'抽氣及灌u 步 '的處理後所製作出來的LED照明燈具内 :的：路基板組不易受外界環境影響其可靠度，不易氧化 此夠延長LED照明燈具的壽命，極為實用。 θ 2.燈罩變化彈性佳：由於本發明的燈罩非組合式設計 .璃體成型製成，燈罩能夠利用加熱而靈活地改變 形狀易於製作出各種不同的形式及配置於不同型式的燈 座’變化彈性極佳。 .照明效率佳：由於本發明所製作出來可均勻四面發 光的LED照明燈具並不是靠燈罩内塗反射而發光且發出的 光不會被散熱罩擋住’大部份的光線皆可投射出，照明效 率佳。 4.絕緣性佳：由於本發明沒有現有技術的LE1)照明燈 鲁具的散熱罩，且燈罩是由玻璃的絕緣體製成，能夠避免使 用者有可能會觸電的安全性問題。 【實施方式】 為能詳細瞭解本發明的技術特徵及實用功效，並可依 照說明書的内谷來貫施’兹進一步以如圖式所示的較佳實 施例，詳細說明如后： 本發明所提供的一種LED照明燈具之製造方法的較佳 實施例’如圖1、2所示，其步驟包括： 結合芯枉及電路基板組：將一芯柱1 〇與一電路基板組r 201207315 20結合固定；其中，該芯柱1 〇設有一絕緣基座11、兩導 絲1 2及一導管1 3，該絕緣基座11由玻璃製成的一圓形殼 體並設有一頂部、一底部及一耳部111，該耳部Π1是位於 該絕緣基座11的底部並呈徑向凸出狀，該耳部1丨丨大致呈 漏斗狀；該兩導絲12分別穿固於該絕緣基座11並各設有 一支撐端121及一結合端122’各支撐端121是外露於該絕 緣基座11的頂部並由硬料鋼料製成；該導管13由玻璃製 成並穿固於該絕緣基座11 ;該電路基板組2〇焊固並電連結 • 於該兩支撐端121;由於支撐端121是以硬質鋼料製成，能 夠支撐該電路基板組20的重量； 該電路基板組20包括有一個以上的LED(Light Emi tting Diode)； 烘乾：將該電路基板組20烘乾；烘乾電路基板組2〇 的目的在於避免基板所吸收的水氣將來揮發出來凝結於基 板零件面或燈罩30内表面並減損電路基板組2〇的壽命； 現有技術的LED照明燈具之製造方法中，即使將電路基板Injecting nitrogen or inert gas into the lampshade from the conduit; sealing. The inner space of the lampshade is made airtight by a flame of a warm flame; and the lamp holder and the lampshade are combined: a lamp holder The sleeve is fixed to the neck, and the socket and the two joint ends are electrically connected and fixed according to corresponding polarities. In the manufacturing method of the LED lighting fixture, in the drying step, the temperature of the circuit board group is dried to 12 〇〇c~125^. The method for manufacturing the LED lighting fixture is fired at the high temperature flame level of the above-mentioned sealed foam, and in the step, the aforementioned lampshade is inverted and placed in an inverted state, and aligned with the aforementioned ear portion. The manufacturing method of the LED lighting fixture, wherein in the foregoing sealing step, the foregoing lampshade is in an upright state, and the high temperature flame is obliquely directed downward to align the ear portion, and the high temperature flame is at a horizontal plane of the ear. The degree of clamping is the 〆 flame angle, and the range of the δ phantom angle is 5. ~15. . The LED lighting fixture provided by the present invention is proud of the arrogance, the 衣, and the clothing, and the specific benefits and effects of the improvement include at least. 201207315 The inner dense space of the molding 1: since the invention is prepared by the glass-body neck Sintering side =:: The inner part of the insulating base and the space of the lampshade can be airtight: the way of melting the pipe makes the inside of the lampshade && + ^ because the inner space of the lampshade can be airtight, so through the pill, dry ' The LED lighting fixtures produced after the pumping and filling process are: The road substrate group is not easily affected by the external environment, and its reliability is not easy to be oxidized. This is enough to extend the life of the LED lighting fixtures, which is extremely practical. θ 2. Lamp cover change elasticity is good: Due to the non-combined design of the lamp cover of the present invention, the glass body is formed by molding, the lamp cover can be flexibly changed by heating, and it is easy to produce various forms and configurations in different types of lamp holders. Excellent elasticity. The illumination efficiency is good: the LED illumination lamp which can be uniformly illuminated by the invention is not illuminated by the reflection inside the lampshade and the emitted light is not blocked by the heat dissipation cover. Most of the light can be projected, and the illumination can be projected. Good efficiency. 4. Excellent insulation: Since the present invention does not have the heat-dissipating cover of the prior art LE1) illuminating lamp, and the lamp cover is made of a glass insulator, it can avoid the safety problem that the user may be shocked. [Embodiment] In order to understand the technical features and practical effects of the present invention in detail, and in accordance with the embodiments of the specification, the present invention will be further described in detail as follows: A preferred embodiment of a method for manufacturing an LED lighting fixture is provided as shown in FIGS. 1 and 2, and the steps thereof include: combining a core stack and a circuit substrate set: combining a stem 1 〇 with a circuit substrate set r 201207315 20 Fixing; wherein the stem 1 is provided with an insulating base 11, two guide wires 12 and a duct 13 which is made of a circular casing made of glass and has a top and a bottom and An ear portion 111 is located at the bottom of the insulating base 11 and is radially convex. The ear portion 1 is substantially funnel-shaped; the two guide wires 12 are respectively fastened to the insulating base. 11 and each having a support end 121 and a joint end 122'. Each support end 121 is exposed on the top of the insulating base 11 and made of hard steel; the duct 13 is made of glass and is fixed to the insulation. a base 11; the circuit substrate group 2 is soldered and electrically connected to the two support ends 121; since the support end 121 is made of hard steel material, the weight of the circuit substrate group 20 can be supported; the circuit substrate group 20 includes more than one LED (Light Emitting Diode); drying: the circuit substrate group 20 drying; the purpose of drying the circuit substrate group 2〇 is to prevent the moisture absorbed by the substrate from volatilizing in the future to condense on the surface of the substrate part or the inner surface of the lamp cover 30 and to detract from the life of the circuit substrate group 2; prior art LED lighting fixture In the manufacturing method, even if the circuit substrate
組洪乾也沒有什麼實質功效’因為外界的水氣仍會由散熱 罩60與燈罩70之間無氣密的接縫進入； 較佳地，烘乾電路基板組2〇的時間為 的底部’該頸部31鄰接於該燈罩 抵靠於該頸部31鄰接於該燈罩 烘乾電路基板組20的溫度為 封泡：製備一燈罩30[如 20置於該燈罩30内，該燈罩 設有一底部、一開口及一頸部 10~15分鐘，而 120〇C ~125〇C ； 圖3所示]’將該電路基板組 30是由玻璃一體成型製成並 31，該開口形成於該燈罩3〇 的開口；使該耳部1 Π 的開口之處，旋轉該燈 201207315 罩30和該芯柱】。，並利用一火焰搶F的高溫火焰ρι將該 耳部ill及該頸部31燒結固定；其中該導管13是部份外 露於該燈罩30且贫炉^ 这燈罩30的内部空間透過該導管13而與 外界相通； ' 較佳地’如圖3所示，該燈罩30呈直立狀態，該火焰 搶F所噴出的高溫火焰η朝下傾斜射出並對準該耳部 ’高溫火焰F1與該耳部lu所在的水平面所夾的角度 疋義為焰角0，較佳地，該焰角Θ的範圍為5。] 5 '形 成心角Θ的目的在於：利用高溫火焰F1傾斜使得溫度分佈 改變，讓電路基板組2〇不致燒壞； a較佳地’或是如圖4所示，倒置該燈罩30而呈倒立狀 f ’該火焰所喷出的高溫火焰η水平射出並對準該耳 丨11 *於问’皿火焰F1燒結時會加熱燈罩3〇内的殘餘氣 體，倒置燈罩30的目的在於避免升溫後的氣體對流至電路 土板、· 20進而避免南溫氣體造成電路基板組的損壞； 抽氣：利用該導管13將該燈罩3〇内的殘餘空氣抽出； :隹氣：將惰性氣體’例如氖氣' 氬氣等，或是氮氣， 由該導官13灌入該擦 ，灌氣的步驟的目的在於避 免電路基板組2〇氧化的風險，能夠延長電路基板組2。、的 使用可命，並且所灌氣體能夠增加該電路基板組的散熱 效果’而不需要裝設現有技術的LED照明燈具的散熱罩6〇 ; H月：牛由於燈罩30内部空間能夠氣密，才能進行抽氣 及灌氣的步驟； 封口 ··用高溫火焰F1融斷該導管13而使該燈罩30的 内部空間成氣密狀態； 201207315 結合燈座與燈罩：如圖5所示，將一燈座4〇用燈頭膠 高溫硬化的方式套固於該頸部31的外周面，將該燈座仙 及該兩結合端1 2 2依相對應的極性電連結固定。 惟以上所述者，僅為本發明的較佳實施例而已，當不能 以此限定本發明實施的範圍，及大凡依本發明申請專利範= 及說明書㈣所作的簡單的等效變化與修飾，皆應仍屬本發 明專利涵蓋的範圍内。 【圖式簡單說明】 圖1是本發明較佳實施例的流程圖。 圖2是本發明較佳實施例芯柱與電路基板組結合後的 立體圖。 圖3是本發明較佳實施例封泡步驟的剖面示意圖。 圖4疋本發明較佳實施例封泡步驟的剖面示意圖。 Q 5疋本發明較佳實施例[Ερ照明燈具的立體外觀圖。 圖6是現有技術LED照明燈具的側視圖。 【主要元件符號說明】 111耳部 121支撐端 13導管 1 〇芯柱 11絕緣基座 12導絲 1 2 2結合端 31頸部 60散熱罩 80燈座 20電路基板組 30燈罩 4 0燈座 70燈軍 201207315 F火焰搶 F1高溫火焰 0焰角There is no substantial effect of the group of Honggans' because the external moisture will still enter through the airtight joint between the heat shield 60 and the lampshade 70; preferably, the time of drying the circuit substrate group 2〇 is the bottom ' The temperature of the neck portion 31 adjacent to the lamp cover abutting the neck portion 31 adjacent to the lampshade drying circuit substrate group 20 is a bubble: a lamp cover 30 is prepared [if 20 is placed in the lamp cover 30, the lamp cover is provided with a bottom portion An opening and a neck for 10 to 15 minutes, and 120 〇C to 125 〇C; FIG. 3] 'The circuit substrate group 30 is integrally formed of glass and 31, and the opening is formed in the lampshade 3 The opening of the cymbal; the opening of the ear 1 ,, rotate the lamp 201207315 cover 30 and the stem]. And the ear ill and the neck 31 are sintered and fixed by using a high temperature flame ρ of a flame grabbing F; wherein the duct 13 is partially exposed to the lampshade 30 and the inner space of the lampshade 30 passes through the duct 13 And communicating with the outside; 'better' as shown in FIG. 3, the lampshade 30 is in an upright state, and the high temperature flame η ejected by the flame rushing F is obliquely projected downward and aligned with the ear 'high temperature flame F1 and the ear The angle of the horizontal plane where the part lu is located is defined as the flame angle 0. Preferably, the angle of the flame angle 为 is 5. 5' The purpose of forming the corner of the heart is to use the high temperature flame F1 to tilt so that the temperature distribution changes, so that the circuit substrate group 2 does not burn out; a preferably 'or as shown in FIG. 4, the lampshade 30 is inverted The inverted high temperature flame η emitted by the flame is horizontally emitted and aligned with the deafness 11 * When the flame of the dish F1 is sintered, the residual gas in the lamp cover 3 is heated, and the purpose of inverting the lamp cover 30 is to avoid heating up. The gas convections to the circuit board, and further avoids damage to the circuit substrate group caused by the south temperature gas; pumping: the residual air in the lampshade 3 is extracted by the duct 13;: helium gas: an inert gas such as 氖The gas 'argon gas or the like, or nitrogen gas, is injected into the wipe by the guide 13, and the purpose of the gas filling step is to avoid the risk of oxidation of the circuit substrate group 2, and the circuit substrate group 2 can be extended. The use of the gas can be increased, and the gas to be filled can increase the heat dissipation effect of the circuit substrate group' without the need to install the heat-dissipating cover of the prior art LED lighting fixture; H: The cow can be airtight due to the internal space of the lampshade 30, The step of pumping and filling the air can be carried out; sealing the high-temperature flame F1 to melt the duct 13 to make the inner space of the lampshade 30 airtight; 201207315 combining the lamp holder and the lampshade: as shown in FIG. The lamp holder 4 is sleeved on the outer peripheral surface of the neck portion 31 by means of high-temperature hardening of the base rubber, and the lamp holder and the two joint ends 12 2 are electrically connected and fixed according to corresponding polarities. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the simple equivalent changes and modifications made by the patent application and the specification (4) of the present invention are All should remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart of a preferred embodiment of the present invention. 2 is a perspective view of a core post and a circuit board assembly in accordance with a preferred embodiment of the present invention. Figure 3 is a schematic cross-sectional view showing a foam sealing step in accordance with a preferred embodiment of the present invention. Figure 4 is a cross-sectional view showing the foam sealing step of the preferred embodiment of the present invention. Q 5 is a perspective view of a preferred embodiment of the present invention [Ερ lighting fixture. Figure 6 is a side view of a prior art LED lighting fixture. [Main component symbol description] 111 ear 121 support end 13 catheter 1 〇 core column 11 insulated base 12 guide wire 1 2 2 joint end 31 neck 60 heat sink 80 lamp holder 20 circuit board group 30 lampshade 4 0 lamp holder 70 Lamp army 201207315 F flame grab F1 high temperature flame 0 flame angle
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