201205027 六、發明說明： 【發明所屬之技術領域】 本發明係提供一種散熱設計，尤指其技術上提供一種 方形散熱座由高穿透性之多孔性金屬介質與實心之熱導柱 所構成，且方形散熱座以無間隙的陣列排列所組合成之新 型陣列式多孔性介質散熱設計。 【先前技術】 隨著電子科技製程的進步，由於各類型電子資訊產品 持續朝向輕薄 '短小、高效能、多功能的趨勢演進，例如 :微型投影機、超級電腦、多核心中央處理器及專業伺服 器等，因此許多商品均朝向微型化、高效 但隨著商品的微小化及效能不斷提升，其電子散::術進亦 須於有效空間達到最佳之散熱效果。可預見電子資訊產 品的散熱問題，在短期内絕不會有和緩的趨勢，因此對於 …盗效^的提升將會嚴格要求。相對的，散熱器在電子 貝π產叫中所扮演的角色，將會日益凸顯其重要性。如今 !·、速有效的解決電裝冷卻散熱技術的問題，是相關業界 傾全力投入研究的重要課題，當電子產品不斷的微小化而 其功率卻不斷的提升，使得平均發熱量增高，在2〇〇3年約 僅5〇W/Cm ’但到2010年估計將達250W/CH12，成長了 5倍 ’對於電裝散熱的要求將會愈來愈嚴格。因此，開發研製 ， 之呵效率散熱器，乃是解決電腦散熱問題勢在必 3 201205027 行的要務 一般最φ見之散熱器構型為氣冷式散熱座，因其架設 均較為簡單’亦較不受空間所限制，因此其相容性亦較其 他之散熱系統高，甚至可運用於空間較受限之裝置上。若 依照散熱器之外型來區分，就我們最常見之構型可區分為 大面積金屬板散熱、片（柱)狀鰭片及加裝散熱風扇等構型 ，請參閱第七圖’我們常運用於LED面板、中央處理器上 之散熱器大部分均以片（柱）狀鰭片散熱座（4〇)並結合 散熱風扇（4 1 利用片(柱)狀散熱縛片所展延之散熱面 積及散熱風扇（41)《強制對流特性使熱能夠有效發散 出去。 但就上述之散熱器均為較傳統之設計’均利用金屬韓 片以及方形正向陣列式排列的方式製#，使散熱效率無法 突破’目前並無運用金屬多孔性介f並建構—轉向式 列式散熱之散熱·器。 企盼 是以，針對上述習知結構所存在之問題點，如何開發 -種更具理想實用性之創新結構’實消費者所殷切 亦係相關業者須努力研發突破之目標及方向。 關產品之製造開發 計與審慎評估後， 有鑑於此，發明人本於多年從事相 與設計經驗，針對上述之目標，詳加設 終得一確具實用性之本發明。 【發明内容】 201205027 欲解決之技術問題點：傳統設計之散熱器，均利用金 屬鰭片以及方形正向陣列式排列的方式製作，使散熱效率 無法突破。 解決問題之技術特點：提供一種新型陣列式多孔性介 質散熱設計，係包括一冷卻系統與一散熱系統，該冷卻系 統係由數風扇所組成，且置於一電子資訊產品之外殼上， 可將空氣導入及導出該電子資訊產品；該散熱系統係置於 該電子資訊產品内之發熱元件上，該散熱系統由數個方形 散熱座所組成，其特徵在於： 每一該方形散熱座係自冑f透性之多孔性金屬介質所 構成，且數該方形散熱座係呈方型旋轉45。之陣列排列或方 型交錯之陣列排列，每1方形散熱座與鄰近之該方形散 熱座間無任何間隙。 對照先前技術之功效：本發明藉由多孔性金屬介質所 構成之方形散熱座與無間隙的陣列排列，提升冷卻流場之 资亂性，增加橫向熱散逸之特性，改善散熱效率。 有關本發明所採用之技術、手段及其功效，兹舉一較 佳實施例並配合圖式詳細說明於后，相信本發明上述之目 的、構造及特徵’當可由之得一深入而具體的瞭解。 【實施方式】 參閱第-至第六圓所示，本發明係提供一種新型陣列 式多孔性介質散熱設計，包括： 201205027 一冷卻系統（1 f)、，y、人欠n么 0) 5亥冷郃系·紙（10)係、由數風扇 (1 1 )所組成，且置於一雷早 '電子資讯產品之外殼（3工） 上’可將空氣導人及導出該電子資訊產品； 一散熱系統（2 D、，a At # < — …錢熱系統（2 〇 )係置於該電201205027 VI. Description of the Invention: [Technical Field] The present invention provides a heat dissipation design, in particular, a technically provided square heat sink is composed of a highly penetrating porous metal medium and a solid heat guide column. The square heat sink is a new array type porous medium heat dissipation design which is combined in a gapless array arrangement. [Prior Art] With the advancement of electronic technology manufacturing, various types of electronic information products continue to evolve toward a thin and light, short, high-performance, multi-functional trend, such as: micro projectors, supercomputers, multi-core CPUs and professional servos. Devices, etc., so many products are oriented toward miniaturization, high efficiency, but with the miniaturization of products and the improvement of performance, the electronic dispersion:: surgery must also achieve the best heat dissipation effect in the effective space. It is foreseeable that the heat dissipation problem of electronic information products will not be moderated in the short term, so the improvement of ... theft will be strictly required. In contrast, the role of the radiator in the electronic shell production will increasingly highlight its importance. Nowadays!······································································································ 〇〇3 years is only about 5 〇W/Cm 'but by 2010 it is estimated to reach 250W/CH12, which has grown 5 times'. The requirements for electric equipment cooling will become more and more strict. Therefore, the development and development of the efficiency of the heat sink is to solve the problem of computer heat dissipation is imperative 3 201205027 line of general affairs, the most φ see the radiator configuration is air-cooled heat sink, because its erection is relatively simple 'also It is not limited by space, so its compatibility is higher than other heat dissipation systems, and it can even be applied to devices with limited space. According to the different types of heat sinks, our most common configuration can be divided into large-area metal plate heat dissipation, sheet (column) fins and retrofit fans. Please refer to the seventh picture 'We often Most of the heat sinks used in LED panels and central processing units are cooled by a chip (column) fin heat sink (4〇) combined with a cooling fan (4 1 using a sheet (column) heat sinking tab to dissipate heat. Area and cooling fan (41) "Forced convection characteristics enable heat to be effectively dissipated. However, the above-mentioned heat sinks are of a more conventional design" using a metal Korean film and a square forward array arrangement to make heat dissipation. The efficiency can't break through. At present, there is no metal porosity and construction. The heat dissipation device of the steering column heat dissipation is hoped that the problem lies in the above-mentioned conventional structure, how to develop - a more ideal practicality The innovative structure of 'the consumer's eagerness is also the goal and direction of the relevant industry players to work hard to develop breakthroughs. After the manufacturing development and careful evaluation of the products, in view of this, the inventors have been engaged in many years. Based on the experience, the invention has been put into practical use for the above-mentioned objectives. [Summary of the Invention] 201205027 Technical problem to be solved: The conventionally designed heat sink utilizes metal fins and square forward arrays. The arrangement of the arrangement makes the heat dissipation efficiency impossible to break. Technical features of the problem: providing a novel array type porous medium heat dissipation design, comprising a cooling system and a heat dissipation system, the cooling system is composed of a plurality of fans, and Placed on an outer casing of an electronic information product, the air can be introduced into and exported to the electronic information product; the heat dissipation system is disposed on the heating element in the electronic information product, the heat dissipation system is composed of a plurality of square heat sinks, The utility model is characterized in that: each of the square heat dissipation seats is formed by a porous metal medium which is permeable, and the number of the square heat dissipation seats is square rotation 45. The array arrangement or the square-shaped interlaced array is arranged, each square There is no gap between the heat sink and the adjacent square heat sink. Compared with the prior art: the present invention is made of porous metal The square heat sink and the gapless array are arranged to enhance the turbulence of the cooling flow field, increase the lateral heat dissipation characteristics, and improve the heat dissipation efficiency. The techniques, means and effects of the invention are as follows. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) The following is a detailed description of the objects, structures and features of the present invention. The invention provides a novel array type porous medium heat dissipation design, including: 201205027 A cooling system (1 f), y, a person owing a 0) 5 hai cold · series paper (10) system, by a number of fans (1 1) The composition is placed on the outer shell of the electronic information product (3 workers), which can direct and export the electronic information product; a heat dissipation system (2 D,, a At # < ...the money heat system (2 〇) is placed in the electricity
子資§孔產品内之發轨元株γ L U件（3 2 )上，該散熱系統（2 〇 )由數個多孔性金屬介暂所爐占+ + 绮1丨質所構成之方形散熱座（2 1 )所 — 双‘，，、厓（2 1 )係呈方型旋轉45。之陣列排 列’且每一該方形散埶 …座（21)與鄰近之該方形散熱座 (2 1 )間無任何間隙，藉Α卜摇4、人^ 悚藉此梃升冷部流場之紊亂性，增 加橫向熱散逸之特性。 其中，該多孔性金屬介質之方形散熱座（2工）中央 可設有-實心之熱導柱（22)’以增加將熱從發熱元件： 32)導向多孔性金屬介質之熱傳導效率；其中，該熱導 柱（22)可為紹柱或鋼柱。 其中，該方形散熱座（2 1 )係由高穿透性之多孔性 金属介質所構成，該多孔性介質可為發泡鋁材，多孔性金 屬介質構造可參閱第六圖。 其中，請參閱第五圖，數該方形散熱座（2 i )係可 呈方型交錯之陣列排列，且每一該方形散熱座（2丄）與 鄰近之該方形散熱座（2 1 )間無任何間隙，同樣的可以 達到提升冷卻流場之紊亂性，增加橫向熱散逸之特性。 〔實施例〕 201205027 凊參閱第一至第三圖，本發明製作開發之新型陣列式 .散熱座模型’主要包括冷卻系統（工〇 )及散熱系統（2 0 )。其中，冷卻系統（1 0 )係由6組3 cm*3 cm之12V J孓風扇（1 1 )所建構而成，其分別於入口及出口處裝 «又3組，並以串連方式連接一直流電源供應器所驅動。而 散熱系統（2 0 )則分別由9組3〇随木3〇咖木28 5咖發 泡銘材構成之方形散熱座（2工）連接均熱板所構成，方 •形散熱座（21)中央可設有一實心之熱導柱（22)，以 增加將熱從發熱元件（3 2)導向多孔性金屬介質之熱傳 導效率，而本散熱器所採用之發泡鋁材構型為〇. 93孔隙率 之發泡鋁材，本構型所建置之均熱板可設定為發熱晶片， 此外’均熱板與多孔性介f方形散熱座（2工）分別以㈣ 之陣列式排列，且其排列方式均以旋轉45度，且方形散熱 座（2 1 )間並無任何間隙。其中本構型之發熱源為一 籲流明之1W之LED㉟，並分別貼附數顆於散熱器之均熱板上 冷部用3αη木3cm風扇計六個分別裝置於本構型入口與出 口端，入口端與出口端風扇分別採用吹式與吸式送風，達 成對系統之強制冷卻，此外，因本散熱平台為對稱之構型 因此我們僅於其中一個散熱座上貼附高功率LED燈。 本發明之新型陣列式多孔性介質散熱設計，其主要之 構型係由開放性發泡鋁材以旋轉45度之無間隙陣列式排列 為架構，採用氣冷式側吹之冷卻方式。發泡銘材之特殊及 201205027 複雜之結構可大幅增加有效之熱交換面積、提升冷卻流體 之蒼亂性及橫向熱散逸特性，因此可大幅提升散熱效果。 此外，本發明以方形散熱座旋轉45度無間隙陣列排列之構 型可在增加較少的流動阻力下增加冷卻流場之紊亂性，以 加強熱交換率，獲得最大的熱傳增益^果，並使旁通效應 對熱傳增益之不利影響降至最低，其此，開放性發泡鋁材 冬重量僅為原體積《1〇%以下，且多孔性介質之複雜結構 有助於冷卻流場之紊流性，並可大幅提升橫向熱散逸之特 性，因此基於上述之熱流特性，並結合冷卻系統，可大幅 提升散熱之效能及特性。 综合以上所述，本發明之新型陣列式多孔性介質散熱 設計有以下幾點優點： 1.利用旋轉45度無間隙之多孔性介質散熱座，提供電 子資訊產品最佳之散熱機制，可較傳統之散熱模組具更有 效之散熱效果。 2 ·陣列式散熱器中間採用多孔性介質做為散熱架構， 且為無間隙之排列方式建構而成，可有效利用流場之物理 特性提升冷卻流場之紊亂性，有助於提升熱傳特性。 3.多孔性介質散熱座中央設有實心之熱導柱，可有效 增加將熱從發熱元件導向多孔性金屬介質之熱傳導效率。 前文係針對本發明之較佳實施例為本發明之技術特徵 進行具體之說明；惟，熟悉此項技術之人士當可在不脫離 201205027 本發明之精神與原則下對本發明進行變更與修改，而該等 • ’變更與修改’皆應涵蓋於如下申請專利範圍所界定之範疇 中。 【圖式簡單說明】 第一圖：本發明其一實施例之立體外觀示意圖。 第二圖：本發明其一實施例之俯視圖。 第三圖：本發明其一實施例之側視圖。 •第四圖：本發明其一實施例之方形散熱座剖面圖。 第五圖.本發明另一實施例之俯視圖。 第’、圖：本發明使用之發泡鋁材顯微照片圖。 第七圖：習知之專業伺服器散熱器示意圖。 【主要元件符號說明】 .習用部分： (4〇)片狀鰭片散熱座 鲁（41)散熱風扇 .本創作部分： (1 0 )冷卻系統 (11)風扇 (2 〇 ) %& J政熱系統 (2 1 ) _- 方形散熱座 (2 2 )熱導柱 (3 1 )外殼 201205027On the γ LU piece (3 2 ) of the trajectory element in the § hole product, the heat dissipation system (2 〇) consists of a number of porous metal plates, and the square heat sink is composed of + + 绮1 丨(2 1 ) - Double ',,, cliff (2 1 ) is a square rotation 45. The array is arranged in a row and there is no gap between the seat (21) and the adjacent square heat sink (2 1 ), so as to raise the cold flow field by means of shaking Disruptive, increasing the characteristics of lateral heat dissipation. Wherein, the center of the rectangular heat sink (2) of the porous metal medium may be provided with a solid thermal guide column (22)' to increase the heat transfer efficiency of guiding heat from the heat generating component: 32) to the porous metal medium; The heat guide column (22) can be a column or a steel column. The square heat sink (2 1 ) is composed of a highly penetrating porous metal medium, which may be a foamed aluminum material, and the porous metal medium structure can be referred to the sixth figure. Referring to the fifth figure, the square heat sinks (2 i ) can be arranged in a square-shaped staggered array, and each of the square heat sinks (2丄) and the adjacent square heat sinks (2 1 ) Without any gap, the same can be achieved to improve the turbulence of the cooling flow field and increase the characteristics of lateral heat dissipation. [Embodiment] 201205027 Referring to the first to third figures, the novel array type developed by the present invention. The heat sink model 'includes mainly includes a cooling system (work) and a heat dissipation system (20). Among them, the cooling system (10) is constructed by 6 sets of 3cm*3 cm 12V J孓 fans (1 1 ), which are respectively installed at the entrance and exit, and are connected in series. Driven by a DC power supply. The cooling system (20) is composed of 9 sets of 3 〇 〇 3 3 〇 28 28 28 28 28 28 28 28 28 28 方形 方形 方形 方形 方形 方形 方形 方形 方形 方形 方形 方形 21 21 21 21 21 21 21 21 The center may be provided with a solid thermal guide column (22) to increase the heat transfer efficiency of guiding heat from the heating element (32) to the porous metal medium, and the foamed aluminum structure used in the heat sink is 〇. 93 foamed aluminum material with porosity, the soaking plate built by the configuration can be set as a heat-generating wafer, and the 'heating plate and the porous medium-shaped square heat sink (2 workers) are arranged in an array of (4) respectively. And the arrangement is rotated by 45 degrees, and there is no gap between the square heat sinks (2 1 ). The heat source of the configuration is a 1W LED35, which is attached to a plurality of heat-dissipating heat plates on the heat sink, and is respectively arranged in a 3αη wood 3cm fan with six fans in the inlet and outlet ends of the configuration. The inlet and outlet fans respectively use blown and suction air supply to achieve forced cooling of the system. In addition, because the heat dissipation platform has a symmetrical configuration, we only attach high-power LED lamps to one of the heat sinks. The heat dissipation design of the novel array type porous medium of the present invention is mainly composed of an open foamed aluminum material arranged in a gapless array of 45 degrees rotation, and an air-cooled side blowing cooling method. The special features of the foaming material and the 201205027 complex structure can greatly increase the effective heat exchange area, improve the dissipating effect of the cooling fluid and the lateral heat dissipation characteristics, thus greatly improving the heat dissipation effect. In addition, the present invention adopts a configuration in which the square heat sink rotates by 45 degrees without a gap array to increase the turbulence of the cooling flow field with less flow resistance, thereby enhancing the heat exchange rate and obtaining the maximum heat transfer gain. And the adverse effect of the bypass effect on the heat transfer gain is minimized. Therefore, the winter weight of the open foamed aluminum is only less than 1% of the original volume, and the complex structure of the porous medium contributes to the cooling flow field. The turbulence and the ability to greatly improve the lateral heat dissipation, so based on the above heat flow characteristics, combined with the cooling system, can greatly improve the efficiency and characteristics of heat dissipation. In summary, the heat dissipation design of the novel array type porous medium of the present invention has the following advantages: 1. The use of a porous medium heat sink that rotates 45 degrees without gaps provides the best heat dissipation mechanism for electronic information products, which is more conventional. The heat dissipation module has a more effective heat dissipation effect. 2 · The array type heat sink adopts porous medium as the heat dissipation structure, and is constructed by the arrangement without gaps. It can effectively utilize the physical characteristics of the flow field to improve the turbulence of the cooling flow field and help to improve the heat transfer characteristics. . 3. The center of the porous medium heat sink is provided with a solid heat guide column, which can effectively increase the heat transfer efficiency of guiding heat from the heat generating component to the porous metal medium. The present invention has been described with reference to the preferred embodiments of the present invention. However, those skilled in the art can change and modify the present invention without departing from the spirit and principles of the invention. These • 'Changes and Modifications' should be covered by the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a stereoscopic appearance of an embodiment of the present invention. Second Figure: A top view of an embodiment of the invention. Third Figure: A side view of an embodiment of the invention. • Fourth Figure: A cross-sectional view of a square heat sink according to an embodiment of the present invention. Fig. 5 is a plan view showing another embodiment of the present invention. Fig., Fig.: Photomicrograph of foamed aluminum used in the present invention. Figure 7: Schematic diagram of a professional server radiator. [Main component symbol description]. Conventional part: (4〇) Fin-shaped fin heat sink Lu (41) Cooling fan. This creative part: (1 0) Cooling system (11) Fan (2 〇) %& J Zheng Thermal system (2 1 ) _- Square heat sink (2 2 ) Thermal guide column (3 1 ) Housing 201205027