TW201204828A - Photoresist stripper composition - Google Patents
Photoresist stripper composition Download PDFInfo
- Publication number
- TW201204828A TW201204828A TW100116482A TW100116482A TW201204828A TW 201204828 A TW201204828 A TW 201204828A TW 100116482 A TW100116482 A TW 100116482A TW 100116482 A TW100116482 A TW 100116482A TW 201204828 A TW201204828 A TW 201204828A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- weight
- stripper composition
- photoresist stripper
- polyhydric alcohol
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 46
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000003118 aryl group Chemical group 0.000 claims abstract description 15
- 239000002798 polar solvent Substances 0.000 claims abstract description 11
- 125000005210 alkyl ammonium group Chemical group 0.000 claims abstract description 7
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 49
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 25
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 17
- 229940074391 gallic acid Drugs 0.000 claims description 13
- 235000004515 gallic acid Nutrition 0.000 claims description 13
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 9
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 9
- 239000000811 xylitol Substances 0.000 claims description 9
- 235000010447 xylitol Nutrition 0.000 claims description 9
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 9
- 229960002675 xylitol Drugs 0.000 claims description 9
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 8
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 8
- 239000000600 sorbitol Substances 0.000 claims description 8
- 235000010356 sorbitol Nutrition 0.000 claims description 8
- ZTHYODDOHIVTJV-UHFFFAOYSA-N Propyl gallate Chemical compound CCCOC(=O)C1=CC(O)=C(O)C(O)=C1 ZTHYODDOHIVTJV-UHFFFAOYSA-N 0.000 claims description 6
- 235000011187 glycerol Nutrition 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- 235000010388 propyl gallate Nutrition 0.000 claims description 4
- 239000000473 propyl gallate Substances 0.000 claims description 4
- 229940075579 propyl gallate Drugs 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 150000003852 triazoles Chemical class 0.000 claims description 4
- 150000002009 diols Chemical class 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 claims description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 claims description 2
- QGCDUBGOXJTXIU-UHFFFAOYSA-N 3-(2h-benzotriazol-4-yl)propane-1,1-diol Chemical class OC(O)CCC1=CC=CC2=NNN=C12 QGCDUBGOXJTXIU-UHFFFAOYSA-N 0.000 claims description 2
- UTMDJGPRCLQPBT-UHFFFAOYSA-N 4-nitro-1h-1,2,3-benzotriazole Chemical compound [O-][N+](=O)C1=CC=CC2=NNN=C12 UTMDJGPRCLQPBT-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 2
- 229930195725 Mannitol Natural products 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000594 mannitol Substances 0.000 claims description 2
- 235000010355 mannitol Nutrition 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 2
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 2
- VFPFQHQNJCMNBZ-UHFFFAOYSA-N ethyl gallate Chemical compound CCOC(=O)C1=CC(O)=C(O)C(O)=C1 VFPFQHQNJCMNBZ-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- WOQLPPITHNQPLR-UHFFFAOYSA-N 1-sulfanylpyrrolidin-2-one Chemical compound SN1CCCC1=O WOQLPPITHNQPLR-UHFFFAOYSA-N 0.000 claims 1
- UVNSFSOKRSZVEZ-UHFFFAOYSA-N 2-(2-decoxyethoxy)ethanol Chemical compound CCCCCCCCCCOCCOCCO UVNSFSOKRSZVEZ-UHFFFAOYSA-N 0.000 claims 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims 1
- 239000004386 Erythritol Substances 0.000 claims 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 claims 1
- 239000004262 Ethyl gallate Substances 0.000 claims 1
- KLBDTWACTBHOBL-UHFFFAOYSA-N SN1C(N(CC1)S)=O Chemical compound SN1C(N(CC1)S)=O KLBDTWACTBHOBL-UHFFFAOYSA-N 0.000 claims 1
- 125000005907 alkyl ester group Chemical group 0.000 claims 1
- XOPOEBVTQYAOSV-UHFFFAOYSA-N butyl 3,4,5-trihydroxybenzoate Chemical compound CCCCOC(=O)C1=CC(O)=C(O)C(O)=C1 XOPOEBVTQYAOSV-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- AOTRKUOCGUXQCY-UHFFFAOYSA-N decyl 3,4,5-trihydroxybenzoate Chemical compound CCCCCCCCCCOC(=O)C1=CC(O)=C(O)C(O)=C1 AOTRKUOCGUXQCY-UHFFFAOYSA-N 0.000 claims 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 claims 1
- 235000019414 erythritol Nutrition 0.000 claims 1
- 229940009714 erythritol Drugs 0.000 claims 1
- 235000019277 ethyl gallate Nutrition 0.000 claims 1
- 229960005150 glycerol Drugs 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 150000003951 lactams Chemical class 0.000 claims 1
- 229960001855 mannitol Drugs 0.000 claims 1
- DXFXMYYJKFIEGI-UHFFFAOYSA-N n-decylacetamide Chemical compound CCCCCCCCCCNC(C)=O DXFXMYYJKFIEGI-UHFFFAOYSA-N 0.000 claims 1
- IKVDMBQGHZVMRN-UHFFFAOYSA-N n-methyldecan-1-amine Chemical compound CCCCCCCCCCNC IKVDMBQGHZVMRN-UHFFFAOYSA-N 0.000 claims 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims 1
- 229960002920 sorbitol Drugs 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 25
- 239000002184 metal Substances 0.000 abstract description 25
- 230000000052 comparative effect Effects 0.000 description 24
- 238000000034 method Methods 0.000 description 22
- 230000007797 corrosion Effects 0.000 description 19
- 238000005260 corrosion Methods 0.000 description 19
- 239000003112 inhibitor Substances 0.000 description 15
- 239000002585 base Substances 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- -1 alcohol amine Chemical class 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- 230000005764 inhibitory process Effects 0.000 description 7
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 229960004889 salicylic acid Drugs 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 2
- FBSFWRHWHYMIOG-UHFFFAOYSA-N gallic acid methyl ester Natural products COC(=O)C1=CC(O)=C(O)C(O)=C1 FBSFWRHWHYMIOG-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- IBKQQKPQRYUGBJ-UHFFFAOYSA-N methyl gallate Natural products CC(=O)C1=CC(O)=C(O)C(O)=C1 IBKQQKPQRYUGBJ-UHFFFAOYSA-N 0.000 description 2
- 239000002052 molecular layer Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- PFTAWBLQPZVEMU-DZGCQCFKSA-N (+)-catechin Chemical compound C1([C@H]2OC3=CC(O)=CC(O)=C3C[C@@H]2O)=CC=C(O)C(O)=C1 PFTAWBLQPZVEMU-DZGCQCFKSA-N 0.000 description 1
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- CPXAVMWHYAGLNU-UHFFFAOYSA-N 2-(2-decoxypropoxy)propan-1-ol Chemical compound CCCCCCCCCCOC(C)COC(C)CO CPXAVMWHYAGLNU-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- WWYXQDHOXQYEJX-UHFFFAOYSA-N CNC=O.NN Chemical compound CNC=O.NN WWYXQDHOXQYEJX-UHFFFAOYSA-N 0.000 description 1
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 description 1
- WNSCCOVBRRRASE-UHFFFAOYSA-N N(N)N1C(CCC1)=O.NN Chemical compound N(N)N1C(CCC1)=O.NN WNSCCOVBRRRASE-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- XOBANOSLKMFMHP-UHFFFAOYSA-N SN(CCCCCCCCCC)S Chemical compound SN(CCCCCCCCCC)S XOBANOSLKMFMHP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- ADRVNXBAWSRFAJ-UHFFFAOYSA-N catechin Natural products OC1Cc2cc(O)cc(O)c2OC1c3ccc(O)c(O)c3 ADRVNXBAWSRFAJ-UHFFFAOYSA-N 0.000 description 1
- 235000005487 catechin Nutrition 0.000 description 1
- 229950001002 cianidanol Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- AWKZQVYCCQCKBH-UHFFFAOYSA-N hydrazine 1-methylpyrrolidin-2-one Chemical compound CN1C(CCC1)=O.NN AWKZQVYCCQCKBH-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
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- NJTGANWAUPEOAX-UHFFFAOYSA-N molport-023-220-454 Chemical compound OCC(O)CO.OCC(O)CO NJTGANWAUPEOAX-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
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- HOBBGWUQJYXTQU-UHFFFAOYSA-N sulfurodithioic O,O-acid Chemical compound OS(O)(=S)=S HOBBGWUQJYXTQU-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
201204828 六、發明說明: 【發明所屬之技彳軒領域】 技術領域 本發明係有關於一種於一半導體、1^£]0或1^1:)裝置之 製造方法中用以移除光阻劑之光阻剝離劑組成物。 C先前j 背景技藝 /取,一铽笔峪牛導體、LED或LCD裝置係經由一系列 之微衫方法生產。此微影方法包含步驟:於—基材上形成一 f屬層或—絕緣層等;將—光阻觸展於金>1層上;藉由將 阻1且仏左由一具圖案之遮罩選擇性曝光而形成一所欲之光 藉理。於此方法’金屬層或絕緣層之圖案係 核職㈣光賴料為 後,光阻圖案藉由剥離方法移除。 ▲热 ::劑:依據曝光時於溶解度及顯影劑之變 型光阻劑劑變成可溶於顯影劑之光叫^ 劑之光阻劑。曝光雜之光_變成何溶於顯影 劑,可:法藉岐用f遍之剝離 或變性時’係難以移除光阻或離子植人法期間硬化 生異向性圖案轉移:: 々圖案控制之輕易性及產 較佳-是二=:刻法對於形成1_ ⑷吏用電浆氣體與如導電層之材料層 201204828 間之氣-固反應’結果,電漿氣體之離子及自由基與光阻劑 反應’因而使光阻劑硬化及變性。再者,半導體、LED或LCD 裝置之製造方法中之離子植入係一種使諸如P、As、B等之 摻合原子進入矽晶圓之一所欲區域以產生導性之方法,因 此’正型光阻劑係藉由與此等離子之化學反應而變性。 同時,負型光阻劑係用於拋除方法。負型光阻劑之曝光 部份藉由交聯作用而變不可溶,因此,不能使用一般溶劑 完全移除’且清洗方法需於嚴苛條件下實施,諸如,超過 1 〇〇 c之南溫及長的浸潰時間。 各種含水之剝離劑已被建議於乾式蝕刻或離子植入法 期間用以移除一經硬化及變性之光阻劑。例如,已報導包含 羥基胺類、院醇胺類及水之一剝離劑組成物(日本專利公開 第1992-289866號案);包含羥基胺類、烷醇胺類、水,及一 腐#抑制劑之一剝離劑組成物(日本專利公開第1994_266119 號案);包含極性溶劑(諸如,丁内酯、二甲基甲醯胺、二 甲基乙醢胺、Ν-甲基吡咯烷酮等)、胺基醇類(諸如,2甲基 胺基乙醇)及水一剝離劑組成物(日本專利公開第1995 69618 號案);包含醇胺類(諸如,單乙醇胺/胺基乙氧基乙醇)、羥 基胺、二甘醇單烷基醚、醣類(山梨糖醇)及水之一剝離劑組 成物(曰本專利公開第1997-152721號案);及包含羥基胺類、 水、具有pKa 7.5〜13之胺類、一水可溶之有機溶劑,及一腐 蚀抑制劑之一剝離劑組成物(日本專利公開第丨997_969丨i號 案)。但是,該等組成物不具有足夠之用以剝離負型光阻劑 之能力,即使其等可用於剝離經交聯或變性之正型光阻劑。 4 201204828 酸剝離劑或鹼剝離劑傳統上已被用於移除負型光 劑。包含烷基苯磺酸鹽類、酚化合物、氣化溶劑及芳香扩阻 類之-剝_係-代表性讀剝離劑,但其嶋負型光^ 之能力並不足夠。再者,包含水溶性有機胺類及有機溶劑之 一驗剝離劑不僅具有差的剝離負型光阻劑之能力,而且生 金屬腐触。 為解決此問題,包含肼、極性有機溶劑、鹼化合物, 及 水之一剝離劑組成物已於韓國專利第718527號案中建議。作 是,雖然此化合物具有良好之剝離負型光阻劑之能力其私 制於光阻劑下之金屬佈線之腐蝕並不足夠。 最近,因為製造半導體、LED或LCD裝置之方法變得更 精細及複雜,此等方法會使用正型及負型光阻劑。因此,若 無用於正型及負塑光阻劑之共同剝離劑,則會需要個別之剝 離劑及加工處理設備,造成製造成本及時間之增加。因此, 需要能有效率地移除正型及負型之光阻劑且不會造成夫^且 層下之金屬佈線腐蝕之一剝離劑組成物。 【發明内容】 發明之概要說明 因此,本發明之一目的係提供一種剝離劑絚成物,其 具有優異之剝離正型光阻劑及負型光阻劑之能力,且不會 腐蝕於一光阻層下之一金屬佈線。 依據本發明之一方面’提供一種光阻剝離劑組成物, 包含0.5至5重量%之一烷基氫氧化銨;60至90重量%之—非 質子性極性溶劑;〇·1至3重量%之一芳香族多羥基醇;〇1 201204828 至5重量%之一線性多羥基醇;以及5至30重量%之水。 依據本發明之光阻剝離劑組成物具有優異之剝離藉由 一乾式蝕刻或離子植入方法硬化及變性之一正型光阻劑及 用於一拋除方法之一負型光阻劑之能力,且其於剝離方法 及超純水沖洗方法中不會腐蝕於一光阻層下之一金屬佈 線。 C實施方式3 實行本發明之最佳模式 例示之用於本發明組成物中之烷基氫氧化銨包括四甲 基氫氧化銨、四乙基氫氧化銨、四丙基氫氧化銨,及其等 之混合物。由於其内之交聯,藉由一乾式触刻、触刻或離 子植入方法硬化及變性之正型光阻劑,及於一曝光方法期 間交聯之負型光阻劑不會溶於一溶劑。因此,需藉由使用 一用以切斷交聯之鹼組份而將經交聯之光阻劑改變成可溶 型十生0 烷基氫氧化銨之含量較佳係0.5至5重量%。若烷基氫氧 化銨之含量少於0.5重量%,移除光阻劑之效率變較低,因 為係難以切斷經變性及交聯之聚合物鏈;且若超過5重量 %,非質子性極性溶劑之相對含量變減少,因此,減少光 阻劑溶解度且增加於底下之金屬膜之腐蝕。 本發明組成物之非質子性極性溶劑可為N,N-二曱基曱 醯胺、Ν,Ν-二曱基乙醯胺、Ν,Ν’-二乙基乙醯胺、二曱基亞 砜、Ν-甲基甲醯胺、Ν,Ν·-二曱基乳醯胺、Ν-曱基吡咯烷酮、 7-丁内酯、丙烯碳酸酯、1,3-二甲基-2-咪唑烷酮,及其等 6 201204828 之混合物。 非質子性極性溶劑之含量可為60至9〇重量%。若非質 子性極性溶劑之含量少於师量% ’對於妹之可溶性滅 少;且若超過90重量%,水之相對含量減少,因此,降低 烷基氫氧化銨之活性且減少剝離經變性或交聯之正塑及負 型光阻劑之能力。 、 組成物中之水含量較佳範圍係從5至3〇重量%。若水含 量少於5重量% ’烧基氫氧傾之解離度變較低,造成減二 剝離經變性或交聯之正型及貞型光阻劑之能力1水含二 超過30重量%,烧基氫氧化敍之活 里 八呵因而造成對 ;在底下之金屬膜之不足的腐姓抑制能力。 芳香族多羥基醇及線 於本發明組成物之主要組份間, 性多羥基醇作為一腐蝕抑制劑。 芳香族多經基醇之含量可為O.m重量% 含量少於CU重量%’底下層之金屬 二 :::::造:r 線性多羥基醇之含量可為01至5重 醇之含量少於〇]重量%,對於底下層之金屬:二多羥基 能力減少;且若超過5重量%,殘餘 、、蝕抑制 後方法會造成缺陷。 腐《卩制劑本身於其 絲基團。若經基基團之數量少於3,此 々個 吸附性變較低’會造成从之腐蚀抑制能力之 201204828 紅夕ι基醇輕抑制劑較佳係具有至少 基醋基團。若緩基基團或烧基酷基團之,基基團或燒 至今Μ袁二 里·^於1’此等醇 減少,會造成不足之腐蚀抑制能力。 ,、五=基醇之例子包括五倍子酸、五倍子酸甲 等之能、五倍子酸丙醋、五倍子酸丁醋,及其 物’且線性多減醇之例子係丙 ^ 山梨糖醇、甘露糖醇、木糖醇,及其等之現合物醇、 由於藉由組合使用芳香族多羥基醇 := 獲得之協同效果,本發明之έ ^ '、基醇而 果。為⑽ 、讀物錢優異之賴抑制效 諸如=了驗化合物’ 增加:’且添加驗化合物至-_劑組成物 古 而要腐蝕抑制劑。於一 πρ之條件’芳香族多經基醇及 # 腐餘抑制能力。 Μ紅展現較佳之 表面:t广之抑制係藉由將一腐敍抑制剤吸附於金屬 而2達成。於吸附時’數個额抑制缺附於金屬表面 之成4子層制劑之性能係依對金屬表 力^及附能力及分子層密度而定,且腐财P制性能於吸附 刀及分子增密度增加時變較高。 芳香族多經基醇腐敍抑制劑形成具有_苯環之一轉 結構,同時將氫原子自其經基基團解離,因此,俜以二; ^生板狀結構吸附於金屬。線性多經基醇腐餘抑制劑未形 成—共振結構,即使於其經基基圏中之氫原子被解離,因 8 201204828 lib 5 ρ» 醇〜:=Γ於金屬。因此,線性多· 的及附面積而具有吸附於―鸩 ::其具有-低吸附力。因為剝離劑中二部份之優點, 金屬表面(表面遷移)之趨勢較大,吸附輕抑制劑移至 抑制增加,造成較高之脑抑=力表面上之脑 -,==:=:,⑽結構 制劑由於其 香族多羥基醇腐蝕抑 時由於7 狀八振、°構而可強烈地吸附於金屬“ 寺由於可繞性結構而具有低密度之、金屬表面,同 腐名虫衣Ρ制劍 層。線性多經基醇 但不能強2於其可撓性鏈結構而具有高密度之分子層, 附於金屬:㈣於一金屬表面,因為此結構不能強烈吸 為達成優異之腐⑽制, —金屬表面縣W 錢抑咖㈣烈吸附於 香族多羥基醇t一、屬層之密度需較高。由於芳 香族多_不能被線性多羥基 —較佳之腐^之組合使用於整個金屬層上提供 地’當芳二光阻劑之能力。相反 之腐蝕抑制且唯::醇’“生夕鉍基醇單獨使用時,優異 用時,需剝離光阻劑之能力不能被獲得。單獨使 。千夕腐链抑制劑以獲棍 此減少極性溶劑之相對含量“人之腐飯抑制能力, 於使光阻劑溶解之能力,或由’降低剝離劑組成物用 低溶解度而難以使用此組成物·抑制劑於組成物中之 201204828 本發明之組成物依據一所欲目的可進一步含有二醇類 及三唑類,只要本發明之效果不會退化。 適合之二醇不受限地包括二甘醇甲基醚、二甘醇乙基 醚、二甘醇丁基醚、二丙甘醇曱基醚、己二醇、具有範圍 從100至400之重量平均分子量之聚乙二醇等,且適合之三 唑不受限地包括苯并三唑、羧基苯并三唑、1-羥基苯并三 唑、硝基苯并三唑、二羥基丙基苯并三唑等。 如上所述,依據本發明之光阻剝離劑組成物具有優異 之剝離藉由乾式蝕刻或離子植入方法硬化及變性之一正型 光阻劑及用於拋除方法之一負型光阻劑之能力,且於一剝 離方法及一超純水沖洗方法中不會腐蝕於一光阻層下之一 金屬佈線。特別地,由於自芳香族多羥基醇腐蝕抑制劑及 線性多羥基醇腐蝕抑制劑產生之協同效果,一優異之腐蝕 抑制效果可僅以一小量之腐蝕抑制劑而獲得,且不會減少 剝離光阻劑之能力。 實施例 其後,下列實施例係意欲進一步例示說明本發明,且 不會限制其範圍。 實施例1至9及比較例1至21 實施例1至9及比較例1至21之組成物係藉由混合第1表 中所示之組份而製備。 混合係於室溫下進行1小時或更久,以充份溶解固體腐 蝕抑制劑,然後,經由一鐵氟隆過濾器過濾。 實驗例 10 201204828 於實施例1至9及比較例1至21獲得之組成物之制離能 力及腐链抑制能力係如下般評估: (1) 製備一正型光阻樣本 一正型光阻劑(THMR-iP 33〇〇,TOK)塗覆於一以氮化 矽塗覆之矽晶圓上,其後,藉由曝光及顯影方法形成一光 阻圖案。圖案藉由乾式蝕刻方法轉移至光阻劑下之氮化矽 層而獲得正型光阻樣本。 (2) 製備一負型光阻樣本 TOK)塗覆於一石夕石夕 一負型光阻劑(PMER N-HC600, 圓上,其後,藉由曝光、顯影及烘烤方法形成—光阻圖案 鋁及鈦依序鋪展於矽晶圓上獲得一抛除之負型光阻圖案 測試例1 ·剝離能力評估 測試組成物維持於60t:,且正贱阻縣及負型光阻 樣本於其内浸潰20分鐘,以去離子水沖洗3〇秒,然後,以 氮氣乾乾餘樣本中殘餘之光阻劑於_光學顯 倍率:X200)及一FE-SEM(放大倍率:xl〇〇〇 ,喝〜x50,〇〇〇)下 觀察。 測試樣本2.腐触抑制能力評估 測試組成物維持於6(TC,且負切朵如这, 貝1九阻樣本於其内淨清 90分鐘。形成之樣本以去離子水沖洗3 热後,以翁翕 乾燥10秒。乾燥樣品之表面及載 <屬麵度係於一 FE-SEM(放大倍率:xl〇,〇〇〇 ~ x5〇()() 、 規察。於士卜,.目,丨4 例,使用20分鐘之比一般剝離條件更嚴芗 、此而5式 發現雜度之差異。 1 Μ條件以便 11 201204828 評估 腐蝕抑制能 力 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 0 < X X X < X ◎ ◎ 〇 〇 ◎ 〇 剝離能力 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 〇 ◎ ◎ ◎ 〇 ◎ X X <3 X 正型 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ < 〇 〇 < 〇 組成物(重量%) 10.0 10.0 15.0 15.0 20.0 20.0 15.0 20.0 20.0 12.0 17.0 22.0 10.0 15.0 15.0 1_120 13.0 20.0 13.0 | 10.0 15.0 15.0 15.0 : 腐触抑制劑 線性多羥基醇 ρ d »0 d 1〇 〇 c5 d Ο d 1 1 1 ρ 对· q ρ — 1 1 1 〇 〇ό 〇 〇6 〇 〇6 1 1 丙三醇 山梨糖醇 木糖醇 丙三醇 木糖醇 丙三醇 丙三醇 山梨糖醇 木糖醇 1 1 1 丙三醇 山梨糖醇 木糖醇 • 1 • 丙三醇 山梨糖醇 木糖醇 1 1 ! 芳香族多羥基醇 〇 ρ q ρ ρ q q q q 〇 CO 〇 〇 1 1 < 〇 〇 〇 1 1 1 〇 〇 i五倍子酸 i五倍子酸 五倍子酸 i五倍子酸曱酯 五倍子酸曱酯 |五倍子酸甲酯 1五倍子酸丙酯 1五倍子酸丙酯 五倍子酸丙酯 1五倍子酸 五倍子酸曱酯 五倍子酸丙酯 1 1 1 五倍子酸 五倍子酸甲酯 五倍子酸丙酯 1 1 1 焦五倍子酸 兒茶酚 非質子性極性溶劑 86.0 86.5 I 81.5 I I 81.5 I 1 76.5 I I 76.5 I 1 81.5 1 I 76.5 I I 76.5 I 83.0 78.0 I 73.0 I 84.0 79.0 79.0 80.0 79.0 I 72.0 I I 77.0 I I 80.0 I I 75.0 I I 77.0 1 75.0 DMSO NMP DMSO 1 NMP DMSO DMSO 1 1 DMSO DMSO _ DMSO DMSO NMP DMSO _ DMSO DMSO ΝΜΡ 1 DMSO NMP 烷基氫氧化銨 〇 (N 〇 c-i 〇 CN 〇 <N ο <Ν 〇 〇 〇 〇 (N 〇 (N 〇 <N 〇 <N 〇 (N 〇 CN 〇 CN 〇 CN 〇 Η 〇 CN 〇 CN 〇 (N 〇 CN ΤΜΑΗ TMAH _ 1 TMAH TEAH ΤΕΛΗ TEAH TEAH 1 1 1 TMAH _ 1 TEAH TEAH _ _ _ 1 1 1 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 比較例1 |比較例2 1 比較例3 比較例4 比較例5 比較例6 比較例7 比較例8 |比較例9 I 比較例10 比較例11 比較例12 |比較例13 I 比較例14 12 201204828 < < X X ◎ ◎ 〇 PI 邀戔Φ I 1 1 <Hi s ^ ^ ^ ^ ^ B ^ ^ 芝◎〇< X ◎ ◎ ◎ ◎ X X X ◎ ◎ ◎ ◎ < < <3 15.0 in 卜 1 ο CN p p ο CN 〇 ο <Ν 1 丙三醇 木糖醇 山梨糖醇 1木糖醇 山梨糖醇 木糖醇 ^里朵采$ ^ ^ ^ 1 ¢-f ®0<3 X ο \ό Ο <Ν ο Ο (Ν p 寸· q — q 水楊酸 焦五倍子酸 水揚酸 焦五倍子酸 兒茶酚 水楊酸 75.0 79.0 78.0 80.0 78.0 I 76.0 I 76.0 DMSO ΝΜΡ DMSO DMSO 1 DMSO i | 1 S ^ ^ ^ ^ &- Τη ¢- ^ B 0 ;l J ^ ^ 5 S Oh fiiSi ο (Ν ο ο (Ν ο CN 〇 (N 〇 <N O (N 1 1 ΤΕΑΗ ΤΕΑΗ TMAH I I 比較例15 比較例16 比較例17 比較例18 比較例19 比較例20 比較例21 13 201204828 由第1表可看出,依據本發明之實施例1至9展現優異之 剝離正型及負型光阻劑之能力,且未腐蝕Al/Ti,下金屬膜。 然而,超出本發明範圍之比較例1至21展現低剝離能力及增 加腐触。 雖然本發明已關於如上特別實施例作說明,但需瞭解 亦落於藉由所附申請專利範圍界定之本發明範圍内之各種 修改及變化可由熟習此項技藝者為之。 【圖式簡單說明3 (無) 【主要元件符號說明】 (無) 14201204828 VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a semiconductor, a device, or a device for removing a photoresist. The photoresist stripper composition. C Previous J Background Art / Take, a 峪 峪 导体 导体 conductor, LED or LCD device is produced through a series of micro-shirt methods. The lithography method comprises the steps of: forming a genus layer or an insulating layer on the substrate; exposing the photoresist to the layer of gold > 1 layer; The mask is selectively exposed to form a desired light. In this method, the pattern of the metal layer or the insulating layer is after the core material is removed, and the photoresist pattern is removed by a lift-off method. ▲Heat::According agent: According to the solubility and the change of the developer during exposure, the photoresist becomes a photoresist which is soluble in the developer. Exposure of the ray of light _ becomes soluble in the developer, can be: 岐 岐 岐 f f f 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以The ease and yield is better - is two =: the result of the gas-solid reaction between the formation of 1_ (4) 电 plasma gas and the material layer such as conductive layer 201204828, plasma gas ions and free radicals and light The resist reaction' thus hardens and denatures the photoresist. Furthermore, ion implantation in a method of fabricating a semiconductor, LED or LCD device is a method of causing a blending atom such as P, As, B, etc. to enter a desired region of a germanium wafer to produce a conductivity, thus The type of photoresist is denatured by chemical reaction with the plasma. At the same time, a negative photoresist is used for the throwing method. The exposed portion of the negative photoresist is rendered insoluble by cross-linking, therefore, it cannot be completely removed using a general solvent' and the cleaning method needs to be carried out under severe conditions, such as a south temperature of more than 1 〇〇c. And long dipping time. Various aqueous strippers have been proposed to remove a hardened and denatured photoresist during dry etching or ion implantation. For example, a composition comprising a hydroxylamine, a hospital amine, and a water stripper has been reported (Japanese Patent Publication No. 1992-289866); comprising a hydroxylamine, an alkanolamine, water, and a rot # inhibitor One of the release agent compositions (Japanese Patent Publication No. 1994_266119); containing a polar solvent (such as butyrolactone, dimethylformamide, dimethylacetamide, hydrazine-methylpyrrolidone, etc.), an amine a base alcohol (such as 2-methylaminoethanol) and a water-release agent composition (Japanese Patent Publication No. 1995 69618); comprising an alcohol amine (such as monoethanolamine/aminoethoxyethanol), a hydroxyl group a stripping agent composition of an amine, a diethylene glycol monoalkyl ether, a saccharide (sorbitol) and water (Japanese Patent Publication No. 1997-152721); and comprising a hydroxylamine, water, having a pKa of 7.5~ An amine of 13, an organic solvent which is soluble in water, and a release agent composition which is one of corrosion inhibitors (Japanese Patent Publication No. 997_969丨i). However, such compositions do not have sufficient ability to strip negative photoresists, even if they are useful for stripping crosslinked or denatured positive photoresists. 4 201204828 Acid strippers or alkaline strippers have traditionally been used to remove negative light. The inclusion of an alkylbenzene sulfonate, a phenol compound, a gasification solvent, and a flavonoid-degradable-representative read release agent, but the ability of the negative-type light is not sufficient. Further, a peeling agent containing a water-soluble organic amine and an organic solvent not only has a poor ability to peel off a negative photoresist, but also has a metal corrosion. In order to solve this problem, a composition containing ruthenium, a polar organic solvent, an alkali compound, and water is proposed in Korean Patent No. 718527. As a result, although this compound has a good ability to peel off a negative photoresist, the corrosion of the metal wiring under the photoresist is not sufficient. Recently, as methods for fabricating semiconductor, LED or LCD devices have become more sophisticated and complex, such methods use positive and negative photoresists. Therefore, without a common stripper for positive and negative photoresists, individual strippers and processing equipment would be required, resulting in increased manufacturing costs and time. Therefore, there is a need for a stripper composition which is capable of efficiently removing positive and negative photoresists without causing corrosion of the metal wiring under the layers. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a release agent composition which has excellent ability to peel off a positive photoresist and a negative photoresist without corroding a light. One of the metal wiring under the barrier layer. According to one aspect of the invention, there is provided a photoresist stripper composition comprising 0.5 to 5% by weight of one alkylammonium hydroxide; 60 to 90% by weight of an aprotic polar solvent; 〇·1 to 3% by weight One of aromatic polyhydric alcohols; 〇1 201204828 to 5% by weight of one linear polyhydric alcohol; and 5 to 30% by weight of water. The photoresist stripper composition according to the present invention has excellent peeling ability to harden and denature a positive-type photoresist by a dry etching or ion implantation method and a negative photoresist for a throwing method And it does not corrode one of the metal wirings under a photoresist layer in the stripping method and the ultrapure water rinsing method. C Embodiment 3 The alkyl ammonium hydroxide used in the composition of the present invention, which is exemplified in the best mode of the present invention, comprises tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and a mixture of such. Due to the cross-linking therein, the positive photoresist which is hardened and denatured by a dry etch, touch or ion implantation method, and the negative photoresist which is crosslinked during an exposure method are not soluble in one Solvent. Therefore, it is preferred to change the content of the crosslinked photoresist to the soluble C-alkylammonium hydroxide by using a base component for cutting the crosslinked base component in an amount of preferably 0.5 to 5% by weight. If the content of the alkylammonium hydroxide is less than 0.5% by weight, the efficiency of removing the photoresist becomes lower because it is difficult to cut the denatured and crosslinked polymer chain; and if it exceeds 5% by weight, the aproticity The relative content of the polar solvent is reduced, thereby reducing the solubility of the photoresist and increasing the corrosion of the underlying metal film. The aprotic polar solvent of the composition of the present invention may be N,N-dimercaptodecylamine, hydrazine, fluorenyl-dimercaptoacetamide, hydrazine, Ν'-diethylacetamide, dimercapto Sulfone, hydrazine-methylformamide, hydrazine, hydrazine-dihydrazinyl decylamine, hydrazine-hydrazinopyrrolidone, 7-butyrolactone, propylene carbonate, 1,3-dimethyl-2-imidazolidine Ketone, and a mixture of 6 201204828. The aprotic polar solvent may be present in an amount of from 60 to 9% by weight. If the content of the aprotic polar solvent is less than the amount of the teacher, 'the solubility of the sister is less; and if it exceeds 90% by weight, the relative content of the water is reduced, thereby reducing the activity of the alkylammonium hydroxide and reducing the peeling or denaturation or The ability of Lianzhi plastic and negative photoresist. The water content in the composition is preferably in the range of from 5 to 3 % by weight. If the water content is less than 5% by weight, the degree of dissociation of the base hydrogen hydroxide becomes lower, resulting in the ability to reduce the stripping of the denatured or crosslinked positive and bismuth type resist. 1 water contains more than 30% by weight, burning The base of the hydrogen hydroxide in the live eight ah is thus caused by the right; the underlying metal film is insufficient to suppress the surname. The aromatic polyhydric alcohol and the main component of the composition of the present invention, the polyhydric alcohol acts as a corrosion inhibitor. The content of the aromatic polyhydric alcohol may be 0% by weight of the content of less than CU% by weight. The metal of the bottom layer is two::::: Manufactured: r The content of the linear polyhydric alcohol may be less than the content of the 01 to 5 heavy alcohol. 〇]% by weight, for the metal of the bottom layer: the dihydroxyl group has a reduced ability; and if it exceeds 5% by weight, the residual, etch inhibiting method causes defects. The rot recipe itself is in its silk group. If the amount of the radical group is less than 3, the adsorption resistance becomes lower, and the 201204828 red oxime light light inhibitor preferably has at least a base vine group. If the base group or the base group is burned, the base group or the so-called "Yuan Erli" is reduced in 1', which may cause insufficient corrosion inhibition ability. Examples of the pentane-based alcohol include gallic acid, gallic acid, etc., gallic acid propyl vinegar, gallic acid butyl vinegar, and the likes thereof, and examples of linear polyhydric alcohols are propylene sorbitol, mannitol , xylitol, and the like of the present invention, because of the synergistic effect obtained by using an aromatic polyhydric alcohol in combination: =, the alcohol of the present invention. For (10), reading money is superior to the inhibitory effect. For example, the test compound 'increased:' and the test compound was added to the -_agent composition to erode the inhibitor. Under the condition of πρ, the aromatic polyhydric alcohol and #腐腐余 inhibiting ability. Eosin exhibits a better surface: t-suppression is achieved by adsorbing a sulphide to the metal. During the adsorption, the performance of the four sub-layer preparations which are inhibited from being attached to the metal surface depends on the strength of the metal surface and the adhesion capacity and the molecular layer density, and the performance of the P-capacity in the adsorption knife and the molecular growth It becomes higher as the density increases. The aromatic polyhydric alcohol alcohol inhibitor forms a one-turn structure of a benzene ring, and at the same time dissociates the hydrogen atom from the group via the base group. Therefore, the ruthenium is adsorbed to the metal. The linear polyhydric alcohol residue inhibitor does not form a resonance structure, even if the hydrogen atom in the base ruthenium is dissociated, since 8 201204828 lib 5 ρ» alcohol ~: = Γ metal. Therefore, the linearity of the area and the attached area have an adsorption to "鸩 :: which has a low adsorption force. Because of the advantages of the two parts in the stripping agent, the metal surface (surface migration) tends to be larger, and the adsorption of the light inhibitor is increased to the inhibition increase, resulting in a higher brain inhibition = force on the surface of the brain -, ==:=:, (10) The structural preparations can be strongly adsorbed to the metal due to the corrosive inhibition of the aromatic polyhydric alcohol due to the 7-shaped eight-vibration and the structure. The temple has a low-density, metal surface due to the wrapable structure. Sword layer. Linear poly-methanol, but not strong in its flexible chain structure, has a high-density molecular layer, attached to the metal: (d) on a metal surface, because this structure can not be strongly absorbed to achieve excellent corrosion (10) System, - metal surface county W money suppression coffee (four) strongly adsorbed to the aromatic polyhydric alcohol t, the density of the genus layer needs to be higher. Because aromatic more _ can not be used by the combination of linear polyhydroxy - preferred rot The metal layer provides the ability to be a dianthic photoresist. Conversely, the corrosion is suppressed and only: When the alcohol is used alone, the ability to strip the photoresist cannot be obtained when it is excellent. Make it alone. The stagnation of the chain inhibitor to obtain the relative content of the polar solvent, "the ability of the human rice to inhibit rice, the ability to dissolve the photoresist, or the use of the composition to reduce the solubility of the stripper composition with low solubility" Inhibitor in composition 201204828 The composition of the present invention may further contain a diol and a triazole according to a desired purpose, as long as the effect of the present invention is not degraded. Suitable diols include, without limitation, gans Alcohol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, dipropylene glycol decyl ether, hexanediol, polyethylene glycol having a weight average molecular weight ranging from 100 to 400, and the like The triazole includes, without limitation, benzotriazole, carboxybenzotriazole, 1-hydroxybenzotriazole, nitrobenzotriazole, dihydroxypropylbenzotriazole, etc. As described above, according to the present The photoresist stripper composition of the invention has excellent ability to harden and denature one of the positive photoresists and one of the negative photoresists used in the throwing method by dry etching or ion implantation, and Peeling method and an ultra-pure water rinsing method will not corrode One of the metal wirings under a photoresist layer. In particular, due to the synergistic effect produced by the aromatic polyhydric alcohol corrosion inhibitor and the linear polyhydric alcohol corrosion inhibitor, an excellent corrosion inhibition effect can be only a small amount. The corrosion inhibitor is obtained without reducing the ability to strip the photoresist. EXAMPLES Hereinafter, the following examples are intended to further illustrate the invention without limiting its scope. Examples 1 to 9 and Comparative Example 1 to 21 The compositions of Examples 1 to 9 and Comparative Examples 1 to 21 were prepared by mixing the components shown in Table 1. The mixing was carried out at room temperature for 1 hour or longer to fully dissolve solid corrosion. The inhibitor was then filtered through a Teflon filter. Experimental Example 10 201204828 The compositions obtained in Examples 1 to 9 and Comparative Examples 1 to 21 were evaluated for the ability to separate and inhibit the mash resistance as follows: (1) Preparing a positive photoresist sample - a positive photoresist (THMR-iP 33, TOK) is applied to a tantalum nitride coated silicon wafer, and thereafter formed by exposure and development methods a photoresist pattern. The pattern is dry etched Move to the tantalum nitride layer under the photoresist to obtain a positive photoresist sample. (2) Prepare a negative photoresist sample TOK) coated on a Shishi Xishi-negative photoresist (PMER N-HC600, On the circle, thereafter, by exposure, development and baking methods - the photoresist pattern aluminum and titanium are sequentially spread on the germanium wafer to obtain a thrown negative resist pattern test example 1 · peeling ability evaluation test composition The material was maintained at 60t:, and the positive resistive and negative resist samples were immersed in the bath for 20 minutes, rinsed with deionized water for 3 sec seconds, and then dried with nitrogen to dry the residual photoresist in the sample. Optical magnification: X200) and one FE-SEM (magnification: xl〇〇〇, drink ~x50, 〇〇〇). Test sample 2. Corrosion inhibition ability evaluation test composition was maintained at 6 (TC, and If the negative cut is like this, the sample of the shell 1 is blocked for 90 minutes. The formed sample was rinsed with deionized water for 3 hours and then dried for 10 seconds. The surface of the dried sample and the loading surface are attached to an FE-SEM (magnification: xl〇, 〇〇〇~x5〇()(), inspection. Yushibu, . The 20-minute ratio is more severe than the general peeling condition, and the difference in the hybridity is found in the formula 5. 1 Μ Condition for 11 201204828 Evaluation of corrosion inhibition ability ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 0 < XXX < X ◎ ◎ 〇 〇 ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ < 〇 composition (% by weight) 10.0 10.0 15.0 15.0 20.0 20.0 15.0 20.0 20.0 12.0 17.0 22.0 10.0 15.0 15.0 1_120 13.0 20.0 13.0 | 10.0 15.0 15.0 15.0 : Corrosion inhibitor linear polyhydric alcohol ρ d »0 d 1〇〇 C5 d Ο d 1 1 1 ρ 对 · q ρ — 1 1 1 〇〇ό 〇〇6 〇〇6 1 1 glycerin sorbitol xylitol glycerol xylitol glycerol glycerol sorbitol Alcohol xylitol 1 1 1 glycerol sorbitol xylitol • 1 • glycerol sorbose Alcohol xylitol 1 1 ! Aromatic polyhydric alcohol 〇ρ q ρ ρ qqqq 〇CO 〇〇1 1 < 〇〇〇1 1 1 〇〇i gallic acid i gallic acid gallic acid i gallic acid ate gallate gallate Ester|Methyl gallate 1 Propyl gallate 1 Propyl gallate propyl gallate 1 Gallic acid Gallate gallate Gallic acid 1 1 1 Gallic acid gallic acid methyl gallate propyl ester 1 1 1 Pyro- gallic acid Catechol aprotic polar solvent 86.0 86.5 I 81.5 II 81.5 I 1 76.5 II 76.5 I 1 81.5 1 I 76.5 II 76.5 I 83.0 78.0 I 73.0 I 84.0 79.0 79.0 80.0 79.0 I 72.0 II 77.0 II 80.0 II 75.0 II 77.0 1 75.0 DMSO NMP DMSO 1 NMP DMSO DMSO 1 1 DMSO DMSO _ DMSO DMSO NMP DMSO _ DMSO DMSO ΝΜΡ 1 DMSO NMP alkyl ammonium hydroxide 〇 (N 〇ci 〇CN 〇 <N ο <Ν 〇〇〇〇 (N 〇 (N 〇<N 〇<N 〇(N 〇CN 〇CN 〇CN 〇Η 〇CN 〇CN 〇(N 〇CN ΤΜΑΗ TMAH _ 1 TMAH TEAH ΤΕΛΗ TEAH TEAH 1 1 1 TMAH _ 1 TEAH TEAH _ _ _ 1 1 1 Embodiment 1 Embodiment 2 Embodiment 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Comparative Example 1 Comparative Example 2 1 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 | Comparative Example 9 I Comparison Example 10 Comparative Example 11 Comparative Example 12 | Comparative Example 13 I Comparative Example 14 12 201204828 << XX ◎ ◎ 〇PI Invitation Φ I 1 1 <Hi s ^ ^ ^ ^ ^ B ^ ^ 芝 ◎ 〇 < X ◎ ◎ ◎ ◎ XXX ◎ ◎ ◎ ◎ <<<3 15.0 in 卜 1 ο CN pp ο CN 〇ο <Ν 1 glycerol xylitol sorbitol 1 xylitol sorbitol xylose醇^里采采$ ^ ^ ^ 1 ¢-f ®0<3 X ο \ό Ο <Ν ο Ο (Ν p 寸· q — q salicylic acid pyrophoric acid salicylic acid gallic acid catechin Salicylic acid 75.0 79.0 78.0 80.0 78.0 I 76.0 I 76.0 DMSO ΝΜΡ DMSO DMSO 1 DMSO i | 1 S ^ ^ ^ ^ &- Τη ¢- ^ B 0 ;l J ^ ^ 5 S Oh fiiSi ο (Ν ο ο ( ο ο CN 〇 (N 〇 <NO (N 1 1 ΤΕΑΗ ΤΕΑΗ TMAH II Comparative Example 15 Comparative Example 16 Comparative Example 17 Comparative Example 18 Comparative Example 19 Comparative Example 20 Comparative Example 21 13 201204828 As can be seen from the first table, The invention exhibits an excellent ability to release positive and negative photoresist of Example 1-9, and no corrosion of Al / Ti, the lower metal film. However, Comparative Examples 1 to 21 which are outside the scope of the present invention exhibited low peeling ability and increased corrosion. Although the present invention has been described with respect to the specific embodiments thereof, it is to be understood that various modifications and changes can be made within the scope of the invention as defined by the appended claims. [Simple description of the figure 3 (none) [Description of main component symbols] (none) 14
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