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TW201204828A - Photoresist stripper composition - Google Patents

Photoresist stripper composition Download PDF

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Publication number
TW201204828A
TW201204828A TW100116482A TW100116482A TW201204828A TW 201204828 A TW201204828 A TW 201204828A TW 100116482 A TW100116482 A TW 100116482A TW 100116482 A TW100116482 A TW 100116482A TW 201204828 A TW201204828 A TW 201204828A
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TW
Taiwan
Prior art keywords
group
weight
stripper composition
photoresist stripper
polyhydric alcohol
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Application number
TW100116482A
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Chinese (zh)
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TWI545190B (en
Inventor
Young-Jin Park
Doo-Seok Han
Sang-Dai Lee
Hyo-Seop Shin
Original Assignee
Enf Technology Co Ltd
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Publication of TW201204828A publication Critical patent/TW201204828A/en
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Publication of TWI545190B publication Critical patent/TWI545190B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A photoresist stripper composition comprising 0.5 to 5 % by weight of alkyl ammonium hydroxide; 60 to 90 % by weight of aprotic polar solvent; 0.1 to 3 % by weight of aromatic polyhydric alcohol; 0.1 to 5 % by weight of linear polyhydric alcohol; and 5 to 30 % by weight of water has an excellent capacity for stripping a positive and a negative photoresists, and dose not corrode a metal wiring under the photoresist.

Description

201204828 六、發明說明: 【發明所屬之技彳軒領域】 技術領域 本發明係有關於一種於一半導體、1^£]0或1^1:)裝置之 製造方法中用以移除光阻劑之光阻剝離劑組成物。 C先前j 背景技藝 /取,一铽笔峪牛導體、LED或LCD裝置係經由一系列 之微衫方法生產。此微影方法包含步驟:於—基材上形成一 f屬層或—絕緣層等;將—光阻觸展於金>1層上;藉由將 阻1且仏左由一具圖案之遮罩選擇性曝光而形成一所欲之光 藉理。於此方法’金屬層或絕緣層之圖案係 核職㈣光賴料為 後,光阻圖案藉由剥離方法移除。 ▲热 ::劑:依據曝光時於溶解度及顯影劑之變 型光阻劑劑變成可溶於顯影劑之光叫^ 劑之光阻劑。曝光雜之光_變成何溶於顯影 劑,可:法藉岐用f遍之剝離 或變性時’係難以移除光阻或離子植人法期間硬化 生異向性圖案轉移:: 々圖案控制之輕易性及產 較佳-是二=:刻法對於形成1_ ⑷吏用電浆氣體與如導電層之材料層 201204828 間之氣-固反應’結果,電漿氣體之離子及自由基與光阻劑 反應’因而使光阻劑硬化及變性。再者,半導體、LED或LCD 裝置之製造方法中之離子植入係一種使諸如P、As、B等之 摻合原子進入矽晶圓之一所欲區域以產生導性之方法,因 此’正型光阻劑係藉由與此等離子之化學反應而變性。 同時,負型光阻劑係用於拋除方法。負型光阻劑之曝光 部份藉由交聯作用而變不可溶,因此,不能使用一般溶劑 完全移除’且清洗方法需於嚴苛條件下實施,諸如,超過 1 〇〇 c之南溫及長的浸潰時間。 各種含水之剝離劑已被建議於乾式蝕刻或離子植入法 期間用以移除一經硬化及變性之光阻劑。例如,已報導包含 羥基胺類、院醇胺類及水之一剝離劑組成物(日本專利公開 第1992-289866號案);包含羥基胺類、烷醇胺類、水,及一 腐#抑制劑之一剝離劑組成物(日本專利公開第1994_266119 號案);包含極性溶劑(諸如,丁内酯、二甲基甲醯胺、二 甲基乙醢胺、Ν-甲基吡咯烷酮等)、胺基醇類(諸如,2甲基 胺基乙醇)及水一剝離劑組成物(日本專利公開第1995 69618 號案);包含醇胺類(諸如,單乙醇胺/胺基乙氧基乙醇)、羥 基胺、二甘醇單烷基醚、醣類(山梨糖醇)及水之一剝離劑組 成物(曰本專利公開第1997-152721號案);及包含羥基胺類、 水、具有pKa 7.5〜13之胺類、一水可溶之有機溶劑,及一腐 蚀抑制劑之一剝離劑組成物(日本專利公開第丨997_969丨i號 案)。但是,該等組成物不具有足夠之用以剝離負型光阻劑 之能力,即使其等可用於剝離經交聯或變性之正型光阻劑。 4 201204828 酸剝離劑或鹼剝離劑傳統上已被用於移除負型光 劑。包含烷基苯磺酸鹽類、酚化合物、氣化溶劑及芳香扩阻 類之-剝_係-代表性讀剝離劑,但其嶋負型光^ 之能力並不足夠。再者,包含水溶性有機胺類及有機溶劑之 一驗剝離劑不僅具有差的剝離負型光阻劑之能力,而且生 金屬腐触。 為解決此問題,包含肼、極性有機溶劑、鹼化合物, 及 水之一剝離劑組成物已於韓國專利第718527號案中建議。作 是,雖然此化合物具有良好之剝離負型光阻劑之能力其私 制於光阻劑下之金屬佈線之腐蝕並不足夠。 最近,因為製造半導體、LED或LCD裝置之方法變得更 精細及複雜,此等方法會使用正型及負型光阻劑。因此,若 無用於正型及負塑光阻劑之共同剝離劑,則會需要個別之剝 離劑及加工處理設備,造成製造成本及時間之增加。因此, 需要能有效率地移除正型及負型之光阻劑且不會造成夫^且 層下之金屬佈線腐蝕之一剝離劑組成物。 【發明内容】 發明之概要說明 因此,本發明之一目的係提供一種剝離劑絚成物,其 具有優異之剝離正型光阻劑及負型光阻劑之能力,且不會 腐蝕於一光阻層下之一金屬佈線。 依據本發明之一方面’提供一種光阻剝離劑組成物, 包含0.5至5重量%之一烷基氫氧化銨;60至90重量%之—非 質子性極性溶劑;〇·1至3重量%之一芳香族多羥基醇;〇1 201204828 至5重量%之一線性多羥基醇;以及5至30重量%之水。 依據本發明之光阻剝離劑組成物具有優異之剝離藉由 一乾式蝕刻或離子植入方法硬化及變性之一正型光阻劑及 用於一拋除方法之一負型光阻劑之能力,且其於剝離方法 及超純水沖洗方法中不會腐蝕於一光阻層下之一金屬佈 線。 C實施方式3 實行本發明之最佳模式 例示之用於本發明組成物中之烷基氫氧化銨包括四甲 基氫氧化銨、四乙基氫氧化銨、四丙基氫氧化銨,及其等 之混合物。由於其内之交聯,藉由一乾式触刻、触刻或離 子植入方法硬化及變性之正型光阻劑,及於一曝光方法期 間交聯之負型光阻劑不會溶於一溶劑。因此,需藉由使用 一用以切斷交聯之鹼組份而將經交聯之光阻劑改變成可溶 型十生0 烷基氫氧化銨之含量較佳係0.5至5重量%。若烷基氫氧 化銨之含量少於0.5重量%,移除光阻劑之效率變較低,因 為係難以切斷經變性及交聯之聚合物鏈;且若超過5重量 %,非質子性極性溶劑之相對含量變減少,因此,減少光 阻劑溶解度且增加於底下之金屬膜之腐蝕。 本發明組成物之非質子性極性溶劑可為N,N-二曱基曱 醯胺、Ν,Ν-二曱基乙醯胺、Ν,Ν’-二乙基乙醯胺、二曱基亞 砜、Ν-甲基甲醯胺、Ν,Ν·-二曱基乳醯胺、Ν-曱基吡咯烷酮、 7-丁内酯、丙烯碳酸酯、1,3-二甲基-2-咪唑烷酮,及其等 6 201204828 之混合物。 非質子性極性溶劑之含量可為60至9〇重量%。若非質 子性極性溶劑之含量少於师量% ’對於妹之可溶性滅 少;且若超過90重量%,水之相對含量減少,因此,降低 烷基氫氧化銨之活性且減少剝離經變性或交聯之正塑及負 型光阻劑之能力。 、 組成物中之水含量較佳範圍係從5至3〇重量%。若水含 量少於5重量% ’烧基氫氧傾之解離度變較低,造成減二 剝離經變性或交聯之正型及貞型光阻劑之能力1水含二 超過30重量%,烧基氫氧化敍之活 里 八呵因而造成對 ;在底下之金屬膜之不足的腐姓抑制能力。 芳香族多羥基醇及線 於本發明組成物之主要組份間, 性多羥基醇作為一腐蝕抑制劑。 芳香族多經基醇之含量可為O.m重量% 含量少於CU重量%’底下層之金屬 二 :::::造:r 線性多羥基醇之含量可為01至5重 醇之含量少於〇]重量%,對於底下層之金屬:二多羥基 能力減少;且若超過5重量%,殘餘 、、蝕抑制 後方法會造成缺陷。 腐《卩制劑本身於其 絲基團。若經基基團之數量少於3,此 々個 吸附性變較低’會造成从之腐蚀抑制能力之 201204828 紅夕ι基醇輕抑制劑較佳係具有至少 基醋基團。若緩基基團或烧基酷基團之,基基團或燒 至今Μ袁二 里·^於1’此等醇 減少,會造成不足之腐蚀抑制能力。 ,、五=基醇之例子包括五倍子酸、五倍子酸甲 等之能、五倍子酸丙醋、五倍子酸丁醋,及其 物’且線性多減醇之例子係丙 ^ 山梨糖醇、甘露糖醇、木糖醇,及其等之現合物醇、 由於藉由組合使用芳香族多羥基醇 := 獲得之協同效果,本發明之έ ^ '、基醇而 果。為⑽ 、讀物錢優異之賴抑制效 諸如=了驗化合物’ 增加:’且添加驗化合物至-_劑組成物 古 而要腐蝕抑制劑。於一 πρ之條件’芳香族多經基醇及 # 腐餘抑制能力。 Μ紅展現較佳之 表面:t广之抑制係藉由將一腐敍抑制剤吸附於金屬 而2達成。於吸附時’數個额抑制缺附於金屬表面 之成4子層制劑之性能係依對金屬表 力^及附能力及分子層密度而定,且腐财P制性能於吸附 刀及分子增密度增加時變較高。 芳香族多經基醇腐敍抑制劑形成具有_苯環之一轉 結構,同時將氫原子自其經基基團解離,因此,俜以二; ^生板狀結構吸附於金屬。線性多經基醇腐餘抑制劑未形 成—共振結構,即使於其經基基圏中之氫原子被解離,因 8 201204828 lib 5 ρ» 醇〜:=Γ於金屬。因此,線性多· 的及附面積而具有吸附於―鸩 ::其具有-低吸附力。因為剝離劑中二部份之優點, 金屬表面(表面遷移)之趨勢較大,吸附輕抑制劑移至 抑制增加,造成較高之脑抑=力表面上之脑 -,==:=:,⑽結構 制劑由於其 香族多羥基醇腐蝕抑 時由於7 狀八振、°構而可強烈地吸附於金屬“ 寺由於可繞性結構而具有低密度之、金屬表面,同 腐名虫衣Ρ制劍 層。線性多經基醇 但不能強2於其可撓性鏈結構而具有高密度之分子層, 附於金屬:㈣於一金屬表面,因為此結構不能強烈吸 為達成優異之腐⑽制, —金屬表面縣W 錢抑咖㈣烈吸附於 香族多羥基醇t一、屬層之密度需較高。由於芳 香族多_不能被線性多羥基 —較佳之腐^之組合使用於整個金屬層上提供 地’當芳二光阻劑之能力。相反 之腐蝕抑制且唯::醇’“生夕鉍基醇單獨使用時,優異 用時,需剝離光阻劑之能力不能被獲得。單獨使 。千夕腐链抑制劑以獲棍 此減少極性溶劑之相對含量“人之腐飯抑制能力, 於使光阻劑溶解之能力,或由’降低剝離劑組成物用 低溶解度而難以使用此組成物·抑制劑於組成物中之 201204828 本發明之組成物依據一所欲目的可進一步含有二醇類 及三唑類,只要本發明之效果不會退化。 適合之二醇不受限地包括二甘醇甲基醚、二甘醇乙基 醚、二甘醇丁基醚、二丙甘醇曱基醚、己二醇、具有範圍 從100至400之重量平均分子量之聚乙二醇等,且適合之三 唑不受限地包括苯并三唑、羧基苯并三唑、1-羥基苯并三 唑、硝基苯并三唑、二羥基丙基苯并三唑等。 如上所述,依據本發明之光阻剝離劑組成物具有優異 之剝離藉由乾式蝕刻或離子植入方法硬化及變性之一正型 光阻劑及用於拋除方法之一負型光阻劑之能力,且於一剝 離方法及一超純水沖洗方法中不會腐蝕於一光阻層下之一 金屬佈線。特別地,由於自芳香族多羥基醇腐蝕抑制劑及 線性多羥基醇腐蝕抑制劑產生之協同效果,一優異之腐蝕 抑制效果可僅以一小量之腐蝕抑制劑而獲得,且不會減少 剝離光阻劑之能力。 實施例 其後,下列實施例係意欲進一步例示說明本發明,且 不會限制其範圍。 實施例1至9及比較例1至21 實施例1至9及比較例1至21之組成物係藉由混合第1表 中所示之組份而製備。 混合係於室溫下進行1小時或更久,以充份溶解固體腐 蝕抑制劑,然後,經由一鐵氟隆過濾器過濾。 實驗例 10 201204828 於實施例1至9及比較例1至21獲得之組成物之制離能 力及腐链抑制能力係如下般評估: (1) 製備一正型光阻樣本 一正型光阻劑(THMR-iP 33〇〇,TOK)塗覆於一以氮化 矽塗覆之矽晶圓上,其後,藉由曝光及顯影方法形成一光 阻圖案。圖案藉由乾式蝕刻方法轉移至光阻劑下之氮化矽 層而獲得正型光阻樣本。 (2) 製備一負型光阻樣本 TOK)塗覆於一石夕石夕 一負型光阻劑(PMER N-HC600, 圓上,其後,藉由曝光、顯影及烘烤方法形成—光阻圖案 鋁及鈦依序鋪展於矽晶圓上獲得一抛除之負型光阻圖案 測試例1 ·剝離能力評估 測試組成物維持於60t:,且正贱阻縣及負型光阻 樣本於其内浸潰20分鐘,以去離子水沖洗3〇秒,然後,以 氮氣乾乾餘樣本中殘餘之光阻劑於_光學顯 倍率:X200)及一FE-SEM(放大倍率:xl〇〇〇 ,喝〜x50,〇〇〇)下 觀察。 測試樣本2.腐触抑制能力評估 測試組成物維持於6(TC,且負切朵如这, 貝1九阻樣本於其内淨清 90分鐘。形成之樣本以去離子水沖洗3 热後,以翁翕 乾燥10秒。乾燥樣品之表面及載 <屬麵度係於一 FE-SEM(放大倍率:xl〇,〇〇〇 ~ x5〇()() 、 規察。於士卜,.目,丨4 例,使用20分鐘之比一般剝離條件更嚴芗 、此而5式 發現雜度之差異。 1 Μ條件以便 11 201204828 評估 腐蝕抑制能 力 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 0 < X X X < X ◎ ◎ 〇 〇 ◎ 〇 剝離能力 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 〇 ◎ ◎ ◎ 〇 ◎ X X <3 X 正型 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ < 〇 〇 < 〇 組成物(重量%) 10.0 10.0 15.0 15.0 20.0 20.0 15.0 20.0 20.0 12.0 17.0 22.0 10.0 15.0 15.0 1_120 13.0 20.0 13.0 | 10.0 15.0 15.0 15.0 : 腐触抑制劑 線性多羥基醇 ρ d »0 d 1〇 〇 c5 d Ο d 1 1 1 ρ 对· q ρ — 1 1 1 〇 〇ό 〇 〇6 〇 〇6 1 1 丙三醇 山梨糖醇 木糖醇 丙三醇 木糖醇 丙三醇 丙三醇 山梨糖醇 木糖醇 1 1 1 丙三醇 山梨糖醇 木糖醇 • 1 • 丙三醇 山梨糖醇 木糖醇 1 1 ! 芳香族多羥基醇 〇 ρ q ρ ρ q q q q 〇 CO 〇 〇 1 1 < 〇 〇 〇 1 1 1 〇 〇 i五倍子酸 i五倍子酸 五倍子酸 i五倍子酸曱酯 五倍子酸曱酯 |五倍子酸甲酯 1五倍子酸丙酯 1五倍子酸丙酯 五倍子酸丙酯 1五倍子酸 五倍子酸曱酯 五倍子酸丙酯 1 1 1 五倍子酸 五倍子酸甲酯 五倍子酸丙酯 1 1 1 焦五倍子酸 兒茶酚 非質子性極性溶劑 86.0 86.5 I 81.5 I I 81.5 I 1 76.5 I I 76.5 I 1 81.5 1 I 76.5 I I 76.5 I 83.0 78.0 I 73.0 I 84.0 79.0 79.0 80.0 79.0 I 72.0 I I 77.0 I I 80.0 I I 75.0 I I 77.0 1 75.0 DMSO NMP DMSO 1 NMP DMSO DMSO 1 1 DMSO DMSO _ DMSO DMSO NMP DMSO _ DMSO DMSO ΝΜΡ 1 DMSO NMP 烷基氫氧化銨 〇 (N 〇 c-i 〇 CN 〇 <N ο <Ν 〇 〇 〇 〇 (N 〇 (N 〇 <N 〇 <N 〇 (N 〇 CN 〇 CN 〇 CN 〇 Η 〇 CN 〇 CN 〇 (N 〇 CN ΤΜΑΗ TMAH _ 1 TMAH TEAH ΤΕΛΗ TEAH TEAH 1 1 1 TMAH _ 1 TEAH TEAH _ _ _ 1 1 1 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 比較例1 |比較例2 1 比較例3 比較例4 比較例5 比較例6 比較例7 比較例8 |比較例9 I 比較例10 比較例11 比較例12 |比較例13 I 比較例14 12 201204828 < < X X ◎ ◎ 〇 PI 邀戔Φ I 1 1 <Hi s ^ ^ ^ ^ ^ B ^ ^ 芝◎〇< X ◎ ◎ ◎ ◎ X X X ◎ ◎ ◎ ◎ < < <3 15.0 in 卜 1 ο CN p p ο CN 〇 ο <Ν 1 丙三醇 木糖醇 山梨糖醇 1木糖醇 山梨糖醇 木糖醇 ^里朵采$ ^ ^ ^ 1 ¢-f ®0<3 X ο \ό Ο <Ν ο Ο (Ν p 寸· q — q 水楊酸 焦五倍子酸 水揚酸 焦五倍子酸 兒茶酚 水楊酸 75.0 79.0 78.0 80.0 78.0 I 76.0 I 76.0 DMSO ΝΜΡ DMSO DMSO 1 DMSO i | 1 S ^ ^ ^ ^ &- Τη ¢- ^ B 0 ;l J ^ ^ 5 S Oh fiiSi ο (Ν ο ο (Ν ο CN 〇 (N 〇 <N O (N 1 1 ΤΕΑΗ ΤΕΑΗ TMAH I I 比較例15 比較例16 比較例17 比較例18 比較例19 比較例20 比較例21 13 201204828 由第1表可看出,依據本發明之實施例1至9展現優異之 剝離正型及負型光阻劑之能力,且未腐蝕Al/Ti,下金屬膜。 然而,超出本發明範圍之比較例1至21展現低剝離能力及增 加腐触。 雖然本發明已關於如上特別實施例作說明,但需瞭解 亦落於藉由所附申請專利範圍界定之本發明範圍内之各種 修改及變化可由熟習此項技藝者為之。 【圖式簡單說明3 (無) 【主要元件符號說明】 (無) 14201204828 VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a semiconductor, a device, or a device for removing a photoresist. The photoresist stripper composition. C Previous J Background Art / Take, a 峪 峪 导体 导体 conductor, LED or LCD device is produced through a series of micro-shirt methods. The lithography method comprises the steps of: forming a genus layer or an insulating layer on the substrate; exposing the photoresist to the layer of gold > 1 layer; The mask is selectively exposed to form a desired light. In this method, the pattern of the metal layer or the insulating layer is after the core material is removed, and the photoresist pattern is removed by a lift-off method. ▲Heat::According agent: According to the solubility and the change of the developer during exposure, the photoresist becomes a photoresist which is soluble in the developer. Exposure of the ray of light _ becomes soluble in the developer, can be: 岐 岐 岐 f f f 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以 难以The ease and yield is better - is two =: the result of the gas-solid reaction between the formation of 1_ (4) 电 plasma gas and the material layer such as conductive layer 201204828, plasma gas ions and free radicals and light The resist reaction' thus hardens and denatures the photoresist. Furthermore, ion implantation in a method of fabricating a semiconductor, LED or LCD device is a method of causing a blending atom such as P, As, B, etc. to enter a desired region of a germanium wafer to produce a conductivity, thus The type of photoresist is denatured by chemical reaction with the plasma. At the same time, a negative photoresist is used for the throwing method. The exposed portion of the negative photoresist is rendered insoluble by cross-linking, therefore, it cannot be completely removed using a general solvent' and the cleaning method needs to be carried out under severe conditions, such as a south temperature of more than 1 〇〇c. And long dipping time. Various aqueous strippers have been proposed to remove a hardened and denatured photoresist during dry etching or ion implantation. For example, a composition comprising a hydroxylamine, a hospital amine, and a water stripper has been reported (Japanese Patent Publication No. 1992-289866); comprising a hydroxylamine, an alkanolamine, water, and a rot # inhibitor One of the release agent compositions (Japanese Patent Publication No. 1994_266119); containing a polar solvent (such as butyrolactone, dimethylformamide, dimethylacetamide, hydrazine-methylpyrrolidone, etc.), an amine a base alcohol (such as 2-methylaminoethanol) and a water-release agent composition (Japanese Patent Publication No. 1995 69618); comprising an alcohol amine (such as monoethanolamine/aminoethoxyethanol), a hydroxyl group a stripping agent composition of an amine, a diethylene glycol monoalkyl ether, a saccharide (sorbitol) and water (Japanese Patent Publication No. 1997-152721); and comprising a hydroxylamine, water, having a pKa of 7.5~ An amine of 13, an organic solvent which is soluble in water, and a release agent composition which is one of corrosion inhibitors (Japanese Patent Publication No. 997_969丨i). However, such compositions do not have sufficient ability to strip negative photoresists, even if they are useful for stripping crosslinked or denatured positive photoresists. 4 201204828 Acid strippers or alkaline strippers have traditionally been used to remove negative light. The inclusion of an alkylbenzene sulfonate, a phenol compound, a gasification solvent, and a flavonoid-degradable-representative read release agent, but the ability of the negative-type light is not sufficient. Further, a peeling agent containing a water-soluble organic amine and an organic solvent not only has a poor ability to peel off a negative photoresist, but also has a metal corrosion. In order to solve this problem, a composition containing ruthenium, a polar organic solvent, an alkali compound, and water is proposed in Korean Patent No. 718527. As a result, although this compound has a good ability to peel off a negative photoresist, the corrosion of the metal wiring under the photoresist is not sufficient. Recently, as methods for fabricating semiconductor, LED or LCD devices have become more sophisticated and complex, such methods use positive and negative photoresists. Therefore, without a common stripper for positive and negative photoresists, individual strippers and processing equipment would be required, resulting in increased manufacturing costs and time. Therefore, there is a need for a stripper composition which is capable of efficiently removing positive and negative photoresists without causing corrosion of the metal wiring under the layers. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a release agent composition which has excellent ability to peel off a positive photoresist and a negative photoresist without corroding a light. One of the metal wiring under the barrier layer. According to one aspect of the invention, there is provided a photoresist stripper composition comprising 0.5 to 5% by weight of one alkylammonium hydroxide; 60 to 90% by weight of an aprotic polar solvent; 〇·1 to 3% by weight One of aromatic polyhydric alcohols; 〇1 201204828 to 5% by weight of one linear polyhydric alcohol; and 5 to 30% by weight of water. The photoresist stripper composition according to the present invention has excellent peeling ability to harden and denature a positive-type photoresist by a dry etching or ion implantation method and a negative photoresist for a throwing method And it does not corrode one of the metal wirings under a photoresist layer in the stripping method and the ultrapure water rinsing method. C Embodiment 3 The alkyl ammonium hydroxide used in the composition of the present invention, which is exemplified in the best mode of the present invention, comprises tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and a mixture of such. Due to the cross-linking therein, the positive photoresist which is hardened and denatured by a dry etch, touch or ion implantation method, and the negative photoresist which is crosslinked during an exposure method are not soluble in one Solvent. Therefore, it is preferred to change the content of the crosslinked photoresist to the soluble C-alkylammonium hydroxide by using a base component for cutting the crosslinked base component in an amount of preferably 0.5 to 5% by weight. If the content of the alkylammonium hydroxide is less than 0.5% by weight, the efficiency of removing the photoresist becomes lower because it is difficult to cut the denatured and crosslinked polymer chain; and if it exceeds 5% by weight, the aproticity The relative content of the polar solvent is reduced, thereby reducing the solubility of the photoresist and increasing the corrosion of the underlying metal film. The aprotic polar solvent of the composition of the present invention may be N,N-dimercaptodecylamine, hydrazine, fluorenyl-dimercaptoacetamide, hydrazine, Ν'-diethylacetamide, dimercapto Sulfone, hydrazine-methylformamide, hydrazine, hydrazine-dihydrazinyl decylamine, hydrazine-hydrazinopyrrolidone, 7-butyrolactone, propylene carbonate, 1,3-dimethyl-2-imidazolidine Ketone, and a mixture of 6 201204828. The aprotic polar solvent may be present in an amount of from 60 to 9% by weight. If the content of the aprotic polar solvent is less than the amount of the teacher, 'the solubility of the sister is less; and if it exceeds 90% by weight, the relative content of the water is reduced, thereby reducing the activity of the alkylammonium hydroxide and reducing the peeling or denaturation or The ability of Lianzhi plastic and negative photoresist. The water content in the composition is preferably in the range of from 5 to 3 % by weight. If the water content is less than 5% by weight, the degree of dissociation of the base hydrogen hydroxide becomes lower, resulting in the ability to reduce the stripping of the denatured or crosslinked positive and bismuth type resist. 1 water contains more than 30% by weight, burning The base of the hydrogen hydroxide in the live eight ah is thus caused by the right; the underlying metal film is insufficient to suppress the surname. The aromatic polyhydric alcohol and the main component of the composition of the present invention, the polyhydric alcohol acts as a corrosion inhibitor. The content of the aromatic polyhydric alcohol may be 0% by weight of the content of less than CU% by weight. The metal of the bottom layer is two::::: Manufactured: r The content of the linear polyhydric alcohol may be less than the content of the 01 to 5 heavy alcohol. 〇]% by weight, for the metal of the bottom layer: the dihydroxyl group has a reduced ability; and if it exceeds 5% by weight, the residual, etch inhibiting method causes defects. The rot recipe itself is in its silk group. If the amount of the radical group is less than 3, the adsorption resistance becomes lower, and the 201204828 red oxime light light inhibitor preferably has at least a base vine group. If the base group or the base group is burned, the base group or the so-called "Yuan Erli" is reduced in 1', which may cause insufficient corrosion inhibition ability. Examples of the pentane-based alcohol include gallic acid, gallic acid, etc., gallic acid propyl vinegar, gallic acid butyl vinegar, and the likes thereof, and examples of linear polyhydric alcohols are propylene sorbitol, mannitol , xylitol, and the like of the present invention, because of the synergistic effect obtained by using an aromatic polyhydric alcohol in combination: =, the alcohol of the present invention. For (10), reading money is superior to the inhibitory effect. For example, the test compound 'increased:' and the test compound was added to the -_agent composition to erode the inhibitor. Under the condition of πρ, the aromatic polyhydric alcohol and #腐腐余 inhibiting ability. Eosin exhibits a better surface: t-suppression is achieved by adsorbing a sulphide to the metal. During the adsorption, the performance of the four sub-layer preparations which are inhibited from being attached to the metal surface depends on the strength of the metal surface and the adhesion capacity and the molecular layer density, and the performance of the P-capacity in the adsorption knife and the molecular growth It becomes higher as the density increases. The aromatic polyhydric alcohol alcohol inhibitor forms a one-turn structure of a benzene ring, and at the same time dissociates the hydrogen atom from the group via the base group. Therefore, the ruthenium is adsorbed to the metal. The linear polyhydric alcohol residue inhibitor does not form a resonance structure, even if the hydrogen atom in the base ruthenium is dissociated, since 8 201204828 lib 5 ρ» alcohol ~: = Γ metal. Therefore, the linearity of the area and the attached area have an adsorption to "鸩 :: which has a low adsorption force. Because of the advantages of the two parts in the stripping agent, the metal surface (surface migration) tends to be larger, and the adsorption of the light inhibitor is increased to the inhibition increase, resulting in a higher brain inhibition = force on the surface of the brain -, ==:=:, (10) The structural preparations can be strongly adsorbed to the metal due to the corrosive inhibition of the aromatic polyhydric alcohol due to the 7-shaped eight-vibration and the structure. The temple has a low-density, metal surface due to the wrapable structure. Sword layer. Linear poly-methanol, but not strong in its flexible chain structure, has a high-density molecular layer, attached to the metal: (d) on a metal surface, because this structure can not be strongly absorbed to achieve excellent corrosion (10) System, - metal surface county W money suppression coffee (four) strongly adsorbed to the aromatic polyhydric alcohol t, the density of the genus layer needs to be higher. Because aromatic more _ can not be used by the combination of linear polyhydroxy - preferred rot The metal layer provides the ability to be a dianthic photoresist. Conversely, the corrosion is suppressed and only: When the alcohol is used alone, the ability to strip the photoresist cannot be obtained when it is excellent. Make it alone. The stagnation of the chain inhibitor to obtain the relative content of the polar solvent, "the ability of the human rice to inhibit rice, the ability to dissolve the photoresist, or the use of the composition to reduce the solubility of the stripper composition with low solubility" Inhibitor in composition 201204828 The composition of the present invention may further contain a diol and a triazole according to a desired purpose, as long as the effect of the present invention is not degraded. Suitable diols include, without limitation, gans Alcohol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, dipropylene glycol decyl ether, hexanediol, polyethylene glycol having a weight average molecular weight ranging from 100 to 400, and the like The triazole includes, without limitation, benzotriazole, carboxybenzotriazole, 1-hydroxybenzotriazole, nitrobenzotriazole, dihydroxypropylbenzotriazole, etc. As described above, according to the present The photoresist stripper composition of the invention has excellent ability to harden and denature one of the positive photoresists and one of the negative photoresists used in the throwing method by dry etching or ion implantation, and Peeling method and an ultra-pure water rinsing method will not corrode One of the metal wirings under a photoresist layer. In particular, due to the synergistic effect produced by the aromatic polyhydric alcohol corrosion inhibitor and the linear polyhydric alcohol corrosion inhibitor, an excellent corrosion inhibition effect can be only a small amount. The corrosion inhibitor is obtained without reducing the ability to strip the photoresist. EXAMPLES Hereinafter, the following examples are intended to further illustrate the invention without limiting its scope. Examples 1 to 9 and Comparative Example 1 to 21 The compositions of Examples 1 to 9 and Comparative Examples 1 to 21 were prepared by mixing the components shown in Table 1. The mixing was carried out at room temperature for 1 hour or longer to fully dissolve solid corrosion. The inhibitor was then filtered through a Teflon filter. Experimental Example 10 201204828 The compositions obtained in Examples 1 to 9 and Comparative Examples 1 to 21 were evaluated for the ability to separate and inhibit the mash resistance as follows: (1) Preparing a positive photoresist sample - a positive photoresist (THMR-iP 33, TOK) is applied to a tantalum nitride coated silicon wafer, and thereafter formed by exposure and development methods a photoresist pattern. The pattern is dry etched Move to the tantalum nitride layer under the photoresist to obtain a positive photoresist sample. (2) Prepare a negative photoresist sample TOK) coated on a Shishi Xishi-negative photoresist (PMER N-HC600, On the circle, thereafter, by exposure, development and baking methods - the photoresist pattern aluminum and titanium are sequentially spread on the germanium wafer to obtain a thrown negative resist pattern test example 1 · peeling ability evaluation test composition The material was maintained at 60t:, and the positive resistive and negative resist samples were immersed in the bath for 20 minutes, rinsed with deionized water for 3 sec seconds, and then dried with nitrogen to dry the residual photoresist in the sample. Optical magnification: X200) and one FE-SEM (magnification: xl〇〇〇, drink ~x50, 〇〇〇). Test sample 2. Corrosion inhibition ability evaluation test composition was maintained at 6 (TC, and If the negative cut is like this, the sample of the shell 1 is blocked for 90 minutes. The formed sample was rinsed with deionized water for 3 hours and then dried for 10 seconds. The surface of the dried sample and the loading surface are attached to an FE-SEM (magnification: xl〇, 〇〇〇~x5〇()(), inspection. Yushibu, . The 20-minute ratio is more severe than the general peeling condition, and the difference in the hybridity is found in the formula 5. 1 Μ Condition for 11 201204828 Evaluation of corrosion inhibition ability ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 0 < XXX < X ◎ ◎ 〇 〇 ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ < 〇 composition (% by weight) 10.0 10.0 15.0 15.0 20.0 20.0 15.0 20.0 20.0 12.0 17.0 22.0 10.0 15.0 15.0 1_120 13.0 20.0 13.0 | 10.0 15.0 15.0 15.0 : Corrosion inhibitor linear polyhydric alcohol ρ d »0 d 1〇〇 C5 d Ο d 1 1 1 ρ 对 · q ρ — 1 1 1 〇〇ό 〇〇6 〇〇6 1 1 glycerin sorbitol xylitol glycerol xylitol glycerol glycerol sorbitol Alcohol xylitol 1 1 1 glycerol sorbitol xylitol • 1 • glycerol sorbose Alcohol xylitol 1 1 ! Aromatic polyhydric alcohol 〇ρ q ρ ρ qqqq 〇CO 〇〇1 1 < 〇〇〇1 1 1 〇〇i gallic acid i gallic acid gallic acid i gallic acid ate gallate gallate Ester|Methyl gallate 1 Propyl gallate 1 Propyl gallate propyl gallate 1 Gallic acid Gallate gallate Gallic acid 1 1 1 Gallic acid gallic acid methyl gallate propyl ester 1 1 1 Pyro- gallic acid Catechol aprotic polar solvent 86.0 86.5 I 81.5 II 81.5 I 1 76.5 II 76.5 I 1 81.5 1 I 76.5 II 76.5 I 83.0 78.0 I 73.0 I 84.0 79.0 79.0 80.0 79.0 I 72.0 II 77.0 II 80.0 II 75.0 II 77.0 1 75.0 DMSO NMP DMSO 1 NMP DMSO DMSO 1 1 DMSO DMSO _ DMSO DMSO NMP DMSO _ DMSO DMSO ΝΜΡ 1 DMSO NMP alkyl ammonium hydroxide 〇 (N 〇ci 〇CN 〇 <N ο <Ν 〇〇〇〇 (N 〇 (N 〇<N 〇<N 〇(N 〇CN 〇CN 〇CN 〇Η 〇CN 〇CN 〇(N 〇CN ΤΜΑΗ TMAH _ 1 TMAH TEAH ΤΕΛΗ TEAH TEAH 1 1 1 TMAH _ 1 TEAH TEAH _ _ _ 1 1 1 Embodiment 1 Embodiment 2 Embodiment 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Comparative Example 1 Comparative Example 2 1 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 | Comparative Example 9 I Comparison Example 10 Comparative Example 11 Comparative Example 12 | Comparative Example 13 I Comparative Example 14 12 201204828 << XX ◎ ◎ 〇PI Invitation Φ I 1 1 <Hi s ^ ^ ^ ^ ^ B ^ ^ 芝 ◎ 〇 < X ◎ ◎ ◎ ◎ XXX ◎ ◎ ◎ ◎ <<<3 15.0 in 卜 1 ο CN pp ο CN 〇ο <Ν 1 glycerol xylitol sorbitol 1 xylitol sorbitol xylose醇^里采采$ ^ ^ ^ 1 ¢-f ®0<3 X ο \ό Ο <Ν ο Ο (Ν p 寸· q — q salicylic acid pyrophoric acid salicylic acid gallic acid catechin Salicylic acid 75.0 79.0 78.0 80.0 78.0 I 76.0 I 76.0 DMSO ΝΜΡ DMSO DMSO 1 DMSO i | 1 S ^ ^ ^ ^ &- Τη ¢- ^ B 0 ;l J ^ ^ 5 S Oh fiiSi ο (Ν ο ο ( ο ο CN 〇 (N 〇 <NO (N 1 1 ΤΕΑΗ ΤΕΑΗ TMAH II Comparative Example 15 Comparative Example 16 Comparative Example 17 Comparative Example 18 Comparative Example 19 Comparative Example 20 Comparative Example 21 13 201204828 As can be seen from the first table, The invention exhibits an excellent ability to release positive and negative photoresist of Example 1-9, and no corrosion of Al / Ti, the lower metal film. However, Comparative Examples 1 to 21 which are outside the scope of the present invention exhibited low peeling ability and increased corrosion. Although the present invention has been described with respect to the specific embodiments thereof, it is to be understood that various modifications and changes can be made within the scope of the invention as defined by the appended claims. [Simple description of the figure 3 (none) [Description of main component symbols] (none) 14

Claims (1)

201204828 七、申請專利範圍: 1. 一種光阻剝離劑組成物,包含: 0.5至5重量%之烷基氫氧化銨; 60至90重量%之非質子性極性溶劑; 0.1至3重量%之芳香族多羥基醇; 0.1至5重量%之線性多羥基醇;以及 5至30重量%之水。 2. 如申請專利範圍第1項之光阻剝離劑組成物,其中,該 芳香族多羥基醇包含至少一個羧基基團或烷基酯基 團,及至少三個羥基基團。 3. 如申請專利範圍第1項之光阻剝離劑組成物,其中,該 芳香族多羥基醇係選自由五倍子酸、五倍子酸曱酯、五 倍子酸乙酯、五倍子酸丙酯、五倍子酸丁酯,及其等之 混合物所構成之族群。 4. 如申請專利範圍第1項之光阻剝離劑組成物,其中,該 線性多羥基醇包含至少三個羥基基團。 5. 如申請專利範圍第1項之光阻剝離劑組成物,其中,該 線性多羥基醇係選自由丙三醇、赤藻糖醇、山梨糖醇、 甘露糖醇、木糖醇,及其等之混合物所構成之族群。 6. 如申請專利範圍第1項之光阻剝離劑組成物,其中,該 烷基氫氧化銨係選自由四曱基氫氧化銨、四乙基氫氧化 銨、四丙基氫氧化銨,及其等之混合物所構成之族群。 7. 如申請專利範圍第1項之光阻剝離劑組成物,其中,該 非質子性極性溶劑係選自由Ν,Ν-二曱基甲醯胺、Ν,Ν-二 15 201204828 曱基乙醯胺、Ν,Ν'-二乙基乙醯胺、二曱基亞砜、N-甲基 曱醯胺、N,Ν’-二曱基乳醯胺、N-曱基吡咯烷酮、7 -丁 内酯、丙烯碳酸酯、1,3-二曱基-2-咪唑烷酮,及其等之 混合物所構成之族群。 8. 如申請專利範圍第1項之光阻剝離劑組成物,其進一步 包含二醇類及三唑類。 9. 如申請專利範圍第8項之光阻剝離劑組成物,其中,該 二醇係選自由二甘醇曱基醚、二甘醇乙基醚、二甘醇丁 基醚、二丙甘醇甲基醚、己二醇、具有範圍從100至400 之重量平均分子量之聚乙二醇,及其等之混合物所構成 之族群。 10.如申請專利範圍第8項之光阻剝離劑組成物,其中,該 三唑係選自由苯并三唑、羧基苯并三唑、1-羥基苯并三 唑、硝基苯并三唑、二羥基丙基苯并三唑,及其等之混 合物所構成之族群。 16 201204828 四、指定代表圖: (一) 本案指定代表圖為:第( )圖。(無) (二) 本代表圖之元件符號簡單說明: 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式:201204828 VII. Patent application scope: 1. A photoresist stripper composition comprising: 0.5 to 5% by weight of alkylammonium hydroxide; 60 to 90% by weight of aprotic polar solvent; 0.1 to 3% by weight of aromatic a polyhydric alcohol; 0.1 to 5% by weight of a linear polyhydric alcohol; and 5 to 30% by weight of water. 2. The photoresist stripper composition of claim 1, wherein the aromatic polyhydric alcohol comprises at least one carboxyl group or alkyl ester group, and at least three hydroxyl groups. 3. The photoresist stripper composition of claim 1, wherein the aromatic polyhydric alcohol is selected from the group consisting of gallic acid, decyl gallate, ethyl gallate, propyl gallate, and butyl gallate. And the ethnic group formed by a mixture of them. 4. The photoresist stripper composition of claim 1, wherein the linear polyhydric alcohol comprises at least three hydroxyl groups. 5. The photoresist stripper composition of claim 1, wherein the linear polyhydric alcohol is selected from the group consisting of glycerol, erythritol, sorbitol, mannitol, xylitol, and a group of equal parts. 6. The photoresist stripper composition of claim 1, wherein the alkyl ammonium hydroxide is selected from the group consisting of tetrakis ammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and a group of such mixtures. 7. The photoresist stripper composition of claim 1, wherein the aprotic polar solvent is selected from the group consisting of ruthenium, osmium-dimercaptocarbamide, hydrazine, hydrazine-II 15 201204828 decyl acetamide , Ν, Ν'-diethyl acetamide, dimethyl sulfoxide, N-methyl decylamine, N, Ν'-dimercapto lactam, N-mercaptopyrrolidone, 7-butyrolactone a group of propylene carbonate, 1,3-dimercapto-2-imidazolidinone, and mixtures thereof. 8. The photoresist stripper composition of claim 1, further comprising a glycol and a triazole. 9. The photoresist stripper composition of claim 8, wherein the diol is selected from the group consisting of diethylene glycol decyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, dipropylene glycol A group of methyl ether, hexanediol, polyethylene glycol having a weight average molecular weight ranging from 100 to 400, and mixtures thereof. 10. The photoresist stripper composition of claim 8, wherein the triazole is selected from the group consisting of benzotriazole, carboxybenzotriazole, 1-hydroxybenzotriazole, and nitrobenzotriazole. a group of dihydroxypropylbenzotriazoles, and mixtures thereof. 16 201204828 IV. Designation of representative drawings: (1) The representative representative of the case is: ( ). (None) (2) A brief description of the symbol of the representative figure: 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention:
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629351B (en) * 2015-08-05 2018-07-11 慧盛材料美國責任有限公司 Photoresist cleaning composition used in photolithography and a method for treating substrate therewith

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103425003A (en) * 2013-07-19 2013-12-04 杨桂望 Resist stripping agent
CN103425002A (en) * 2013-07-19 2013-12-04 杨桂望 Resist stripping agent
CN103441086B (en) 2013-08-29 2016-01-06 京东方科技集团股份有限公司 Detect the method for photoresist layer ion implantation blocking capability
JP6233779B2 (en) * 2013-11-18 2017-11-22 富士フイルム株式会社 Modified resist stripping method, modified resist stripping solution used therefor, and semiconductor substrate product manufacturing method
KR102023052B1 (en) * 2014-03-26 2019-09-19 동우 화인켐 주식회사 Resist stripper composition
KR101700631B1 (en) * 2015-07-10 2017-01-31 재원산업 주식회사 Photoresist stripper
KR102414295B1 (en) * 2016-01-22 2022-06-30 주식회사 이엔에프테크놀로지 Photoresist stripper composition
WO2017205134A1 (en) * 2016-05-23 2017-11-30 Fujifilm Electronic Materials U.S.A., Inc. Stripping compositions for removing photoresists from semiconductor substrates
CN108424818A (en) * 2017-02-14 2018-08-21 东友精细化工有限公司 Cleaning masks liquid composition
KR102512488B1 (en) 2017-03-03 2023-03-22 주식회사 이엔에프테크놀로지 Photoresist stripper composition
CN107271450A (en) * 2017-06-20 2017-10-20 深圳市华星光电技术有限公司 A kind of detection method of polyamide/silicon nitride film compactness
US11448966B2 (en) 2017-08-03 2022-09-20 Huaying Research Co., Ltd Photoresist-removing liquid and photoresist-removing method
KR20220005037A (en) 2019-04-24 2022-01-12 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. Stripping Composition for Removing Photoresist from a Semiconductor Substrate
CN110396315B (en) * 2019-07-22 2020-11-10 深圳市华星光电技术有限公司 Modified repair liquid, preparation method and method for repairing color resistance
KR102794011B1 (en) * 2020-10-30 2025-04-15 주식회사 이엔에프테크놀로지 Photoresist stripper composition
KR102781663B1 (en) 2021-03-04 2025-03-17 케이피엑스케미칼 주식회사 Photo resist stripper composition
JP2023107071A (en) 2022-01-21 2023-08-02 関東化学株式会社 photoresist stripping composition
TW202437031A (en) 2023-03-13 2024-09-16 台灣芯電應用科技股份有限公司 Stripper composition and cleaning method

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06348040A (en) * 1993-06-08 1994-12-22 Sumitomo Metal Mining Co Ltd Method for managing peeling solution of acrylic photoresist
TW426816B (en) * 1996-04-17 2001-03-21 Ekc Technology Inc Hydroxylamine-gallic compound composition and process
KR19990007139A (en) * 1997-06-19 1999-01-25 이시하라 고로 Photoresist Peeling Composition
JP2001022096A (en) * 1999-07-02 2001-01-26 Nippon Zeon Co Ltd Stripper for positive resist
US6475966B1 (en) * 2000-02-25 2002-11-05 Shipley Company, L.L.C. Plasma etching residue removal
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
JP2002357908A (en) * 2001-05-31 2002-12-13 Tokyo Ohka Kogyo Co Ltd Photoresist removing solution
JP3738992B2 (en) * 2001-12-27 2006-01-25 東京応化工業株式会社 Photoresist stripping solution
JP4035701B2 (en) * 2002-03-12 2008-01-23 三菱瓦斯化学株式会社 Resist stripper and method of using the same
JP2004348103A (en) * 2003-03-27 2004-12-09 Sumitomo Chem Co Ltd Photoresist stripper
JP3953476B2 (en) * 2003-06-26 2007-08-08 ドングウー ファイン−ケム カンパニー、 リミテッド Photoresist stripping liquid composition and photoresist stripping method using the same
US7671001B2 (en) * 2003-10-29 2010-03-02 Mallinckrodt Baker, Inc. Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
JP4367636B2 (en) * 2004-06-10 2009-11-18 信越化学工業株式会社 Sacrificial film forming composition, pattern forming method, sacrificial film and removal method thereof
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
KR20060025338A (en) * 2004-09-16 2006-03-21 주식회사 동진쎄미켐 Photoresist Stripper Composition
KR100913048B1 (en) * 2006-05-26 2009-08-25 주식회사 엘지화학 Stripper composition for photoresist
JP2008058625A (en) * 2006-08-31 2008-03-13 Tokyo Ohka Kogyo Co Ltd Photoresist stripping liquid, and substrate treatment method using the same
US20080096785A1 (en) * 2006-10-19 2008-04-24 Air Products And Chemicals, Inc. Stripper Containing an Acetal or Ketal for Removing Post-Etched Photo-Resist, Etch Polymer and Residue
KR101341754B1 (en) * 2006-11-13 2013-12-16 동우 화인켐 주식회사 Composition for Removing Resist and Dry Etching Residue and Method for Removing Them Using the Same
JP2008176098A (en) * 2007-01-19 2008-07-31 Sumitomo Chemical Co Ltd Developer and pattern forming method
JP2009014938A (en) * 2007-07-03 2009-01-22 Toagosei Co Ltd Resist release agent composition
KR101488265B1 (en) * 2007-09-28 2015-02-02 삼성디스플레이 주식회사 Peeling composition and peeling method
JP2009115929A (en) * 2007-11-02 2009-05-28 Nagase Chemtex Corp Stripper for color resist
JP5441148B2 (en) * 2008-09-01 2014-03-12 学校法人東京電機大学 RESIST LAMINATED STRUCTURE AND METHOD FOR FORMING RESIST PATTERN

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629351B (en) * 2015-08-05 2018-07-11 慧盛材料美國責任有限公司 Photoresist cleaning composition used in photolithography and a method for treating substrate therewith

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