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TW201203632A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
TW201203632A
TW201203632A TW100113292A TW100113292A TW201203632A TW 201203632 A TW201203632 A TW 201203632A TW 100113292 A TW100113292 A TW 100113292A TW 100113292 A TW100113292 A TW 100113292A TW 201203632 A TW201203632 A TW 201203632A
Authority
TW
Taiwan
Prior art keywords
light
emitting
wiring portion
emitting device
emitting elements
Prior art date
Application number
TW100113292A
Other languages
Chinese (zh)
Inventor
Haruaki Sasano
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of TW201203632A publication Critical patent/TW201203632A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

A light emitting device (100) has a substrate (1), a light emitting portion (20) having a plurality of light emitting elements (2) disposed on a mounting region (1a) on the substrate, each terminal having a pad portion (3a) and a wiring portion (3b), a positive terminal (3) and a negative terminal (4) for applying electric power to the light emitting portion through the wiring portion and a light reflective resin (6) formed on the substrate covering the wiring portion at least. A junction wiring (8) is disposed along a peripheral portion of the mounting region and is covered with the reflective resin.

Description

201203632 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種可用於LED(Light Emitting Diode，發 光二極體）燈等照明器具、顯示裝置、顯示器、液晶顯示 . 器之背光光源等的發光裝置。 【先前技術】 « 近年來，開發出各種將發熱量、消耗電力較白織燈等照 明光源更少、且寿命長之發光二極體（LED: Light Emitting Diode)用作發光元件之發光裝置。 例如’於專利文獻1中，提出有一種發光二極體光源單 元’其具備：基台，其安裝有複數個發光二極體元件；印 刷基板，其配設於基台上表面；以及端子電極，其包含於 印刷基板上以夾持安裝有複數個發光二極體元件之區域之 方式形成的陰極及陽極。 又，於專利文獻2中，提出有一種發光裝置，其具備： 基板’其上部形成有玻璃層；複數個LEd晶片，該等設置 於玻璃層上；以及正電極外部連接端子及負電極外部連接 端子，該等係於玻璃層上以夾持複數個lED晶片之方式形 成。201203632 VI. Description of the Invention: [Technical Field] The present invention relates to a lighting fixture, a display device, a display, a backlight of a liquid crystal display, etc., which can be used for an LED (Light Emitting Diode) lamp, etc. Light emitting device. [Prior Art] In recent years, various light-emitting devices have been developed which use light-emitting diodes (LEDs) which generate less heat and consume less power than white ray lamps and have a long life. For example, in Patent Document 1, a light-emitting diode light source unit is provided which includes: a base on which a plurality of light-emitting diode elements are mounted; a printed circuit board which is disposed on an upper surface of the base; and a terminal electrode The cathode and the anode are formed on the printed circuit board to sandwich a region in which a plurality of light emitting diode elements are mounted. Further, Patent Document 2 proposes a light-emitting device comprising: a substrate having a glass layer formed thereon; a plurality of LEd wafers disposed on the glass layer; and a positive electrode external connection terminal and a negative electrode external connection Terminals, which are formed on the glass layer to hold a plurality of lED wafers.

先前技術文獻 專利文獻 專利文獻1 ·日本專利特開2006_295085號公報（參照圖U 專利文獻2 :曰本專利特開2〇1〇_〇34487號公報（參照圖 7(b)) 155454.doc 201203632 【發明内容】 發明所欲解決之問題 先前，為了提高發光裝置之亮度，積極地開發一種於基 板上配置有數十個發光元件之發光裝置《然後，於此種安 裝有複數個發光元件之發光裝置中會產生如下問題：無法 藉由連接於發光裝置之電源之電容及輸出電壓而驅動發光 裝置、或者必需提昇電壓、或者發光效率變差。例如於串 聯連接有10個順向電壓Vf為3 V之發光元件之發光裝置 中’較佳為使用輸出電壓為30 V之電源，若使用輸出電壓 為20 V之電源’則必需提昇電壓來進行驅動，又，若使用 輸出電壓為60 V之電源，則發光效率變差。即，較理想的 是適合連接於發光裝置之電源之電容的發光裝置，於配置 有複數個發光元件之發光裝置中，取決於將幾個發光元件 進行串聯連接。然而’於要求提高亮度之過程中，發光裝 置之大小亦存在極限，設置於固定大小之發光裝置申之串 聯連接之發光元件的數量亦存在極限。 本發明係鑒於上述問題點而完成者，其課題在於提供一 種適合各種電容及輸出電壓之電源之發光裝置，又，提供 一種可增加_聯連接之數量、且光之提取效率提高的發光 裝置。 解決問題之技術手段 為了解決上述課題，本發明之發光裝置包括：基板；發 光部，其包含配置於上述基板上之安裝區域中之複數個發 光元件；正極及負極’該等分別具有焊墊部與配線部，並 I55454.doc •4- 201203632 經由該配線部而對上述發光部施加電壓；以及反光樹脂， 其以至少覆蓋上述配線部之方式形成於上述基板上；且設 定為沿著上述安裝區域之周圍形成中繼配線部，上述中繼 配線部被上述反光樹脂覆蓋之構成。 ' 根據此種構成，於安裝區域之有限之面積内，可使經由 • 中繼配線部而串聯連接之發光元件之數量增加，並且可減 輕出射光之損耗，從而可獲得光之提取效率提高的發光裝 置。 又，較佳為設定成如下之構成：上述複數個發光元件分 別具備形成於一側之P電極、及形成於另一側之n電極，且 上述複數個冑光元#包含相對於上4中繼配線#而與上述 p電極連接之發光元彳、及與上述4極連接之發光元件。 根據此種構成’可將自正極串聯連接之發光元件、及向 負極串聯連接之發光元件經由中繼配線部而連接，作為發 光裝置，可使串聯連接之發光元件之數量增加。進而，於 安裝區域之有限之面積内，可緊密地配置複數個發光元 件’從而可獲得消耗電力相對於固定之亮度提高之發光裝 置、或者發光效率相對於固定之消耗電力提高之發光裝 、. 置。 . 又，較佳為設定成如下之構成：於上述正極之配線部與 上述中繼配線部之間，上述P電極以相對於上述安裝區域 朝向一方向之方式排列，於上述負極之配線部與上述中繼 配線部之間，上述p電極以相對於上述安裝區域朝向另一 方向之方式排列。 155454.doc 201203632 根據此種構成，沿著安裝區域之周圍而形成中繼配線 部，且將發光元件配置成方向以該中繼配線部為邊界而反 轉，藉此連接發光元件彼此之配線不會變得複雜，於安裝 區域之有限之面積内，可使經由中繼配線部而串聯連接之 發光元件之數量增加。進而，於安裝區域之有限之面積 内，可緊密地配置複數個發光元件，從而可獲得消耗電力 相對於固疋之冗度知尚之發光裝置、或者發光效率相對於 固定之消耗電力提高之發光裝置。 又，較佳為设定成具有複數個上述中繼配線部，上述複 數個發光元件之一部分被兩個上述中繼配線部夾持而成之 構成。 根據此種構成，經由中繼配線部而連接發光元件彼此之 配線不會變得複雜，於安裝區域之有限之面積内，可進一 步增加發光元件彼此經由中繼配線部而串聯連接之數量。 進而，於安裝區域之有限之面積内，可緊密地配置複數個 發光元件’從而可獲得消耗電力相對於固定之亮度提高之 發光裝置、或者發光效率相對於固定之消耗電力提高之發 光裝置。 又，本發明之發光裝置較佳為設定成如下之構成：上述 複數個發光元件係藉由金屬線而彼此串聯及並聯地電性連 接。 根據此種構成，不僅將複數個發光元件彼此串聯連接， 而且將複數個發光元件彼此並聯連接，因此，即便於複數 個發光元件各自之順向壓降存在不均之情形時，亦可使並 155454.doc 201203632 聯連接之發光元件之順向壓降相等。藉此，可抑制由發光 元件間之順向壓降之不均所引起的發光不均。 又，本發明之發光裝置較佳為設定成如下之構成：上述 反射性樹脂係以包圍上述安裝區域之周圍之方式形成。 根據此種構成，以包圍安裝區域之周圍之方式形成反光 ㈣’藉此朝向基板之安裝區域之周圍之光亦可由反光樹 脂反射。因此，可減輕出射光之損耗，可使發光裝置之光 之提取效率提高。 又’本發明之發光裝置較佳為設定成如下之構成：於上 述安裝區域上形成有金屬膜，並經由該金屬膜而配置有上 述複數個發光元件。 根據此種構成’於安裝區域上形成有金屬膜並於其上配 置複數個&光TG件’藉此朝向基板之安裝區域側之光亦可 由金屬膜反射。因此，可、、士、击_山f 了減輕出射光之損耗，可使發光裝 置之光之提取效率提高。 又本發明之發光褒置較佳為設定成如下之構成：上述 反光樹月日係以覆蓋上述安裂區域之周緣之—部分之方式形 成。 根據此種構成，以覆簦立壯 復盖女裝區域之周緣之一部分之方式 形成反光樹脂，藉此不舍於 會於配線部與安裝區域上之金屬膜 之間形成基板露出之區域。m ^ L境。因此’可使自發光元件出射之 光於形成有反光樹脂之内 之區域中全部反射，因此可最 大限度地減輕出射光之指紅 导貝耗’可使發光裝置之光之提取效 率進一步提高。 155454.doc 201203632 發明之效果 根據本發明之發光裝置，可獲得如下之發光裝置：於安 裝區域之有限之面積内，可使經由中繼配線部而串聯連接 之發光元件之數量增加，並且可減輕出射光之損耗，提高 光之提取效率。 【實施方式】 以下’ 一面參照圖式，一面對本發明之實施形態之發光 裝置進行說明。再者，為使說明變得明確，各圖式所示之 構件之尺寸及位置關係等有誇張。進而，於以下之說明 中’相同之名稱、符號原則上表示相同或同質之構件，適 當省略詳細說明。又，於以下之說明中所參照之圖2、圖 5〜圖7中’為了表示各發光元件之方向，發光元件之p電極 及η電極（參照圖3)僅圖示出安裝區域上之4個部位或6個部 位’安裝區域上之其他部位則省略圖示。 [第1實施形態] 一面參照圖1〜圖5，一面對第1實施形態之發光裝置1〇1 進行詳細說明。於以下之說明中，首先對發光裝置101之 整體構成進行說明，其後對各構成進行說明。再者，為便 於說明，圖2、圖5中之反光樹脂6係藉由線而僅表示其外 形，並以穿透之狀態圖示。對於其他實施形態中所說明之 圖6〜8，亦同樣地以穿透之狀態圖示。 <整體構成> •發光裝置101係用於LED燈等照明器具、顯示裝置、顯 示器、液晶顯示器之背光光源等之裝置。如圖丨、圖2及圖 155454.doc 201203632 4所示，發光裝置m主要具備如下構成：基板ι;複數個 發光元件2,該等配置於基板1之安裝區域u上；正極3及 負極4,該等形成於基板1上；中'繼配線部8,其獨立於正 極3及負極4而形成；發光元件2等電子零件；金屬線w， 其將正極3或負極4及中繼酉己線部8與發光元件以口以連接， 進而將發光元件2彼此加 於基板1上。又，此處， 以連接；以及反光樹脂6，其形成 發光裝置101係設定為以反光樹脂 6為周緣並於其内側填充有密封構件7之構成。 <基板> 基板1係用以配置發光元件2等電子零件者。如圖丨及圖2 所示，基板1形成為矩形平板狀。又，於基板丨上，如圖2 所示區劃有用以配置複數個發光元件2之安裝區域u。再 者，基板1之尺寸並無特別限定，可根據發光元件2之數量 等目的及用途而適當選擇。 作為基板1之材料，較佳為使用絕緣性材料，且較佳為 使用自發光元件2發出之光或外光等難以穿透之材料。 又’較佳為使用具有某種程度之強度之材料。具體而言， 可列舉：陶瓷（AhO3、A1N等）、紛樹脂、環氧樹脂、聚醯 亞胺樹脂、BT樹脂（bismaleimide triazine resin，雙馬來醯 亞胺三嗪樹脂）、聚鄰苯二甲醯胺（PPA，Polyphthalamide) 專樹脂。 <安裝區域> 安裝區域1 a係用以配置複數個發光元件2之區域。如圖2 所示，安裝區域la被區劃成基板1之中央之區域。安裝區 155454.doc 201203632 域la係以具有彼此對向之邊之特定形狀而形成，更具體而 言，如圖2所不，形成為使角部變圓之大致矩形狀。再 者，安裝區域la之尺寸並無特別限定，可根據發光元件2 之數量或排列間隔等目的及用途而適當選擇。 於正面觀察圖2之情形時，在安裝區域la之周圍，沿著 安裝區域la之左側之邊形成有配線部％之一部分及配線部 4b之一部分，沿著安裝區域la之下側之邊形成有配線部扑 之一部分，沿著安裝區域丨3之右側之邊形成有中繼配線部 8。再者，如圖2所示，此處之安裝區域1&之周圍係指與安 裝區域la之周緣隔開特定間隙之周圍。 安裝區域la可設定成為了配置複數個發光元件2而於基 板1上所區劃出之區域，即，以與基板丨相同材料構成之區 域’但較佳為例如於安裝區域13上形成使光反射之金屬 膜，並經由該金屬膜而配置複數個發光元件2。藉由如上 述般於安裝區域la上形成金屬膜且於其上配置複數個發光 元件2，自發光元件2出射之光之中，朝向基板1之安裝區 域1 a側的光亦可由金屬膜反射。因此，可減輕出射光之損 耗，可使發光裝置101之光之提取效率提高。 形成於安裝區域la上之金屬膜較佳為藉由電解電鍍或無 電解電鍍而形成。作為金屬膜之材料，只要係可進行電鍵 者’則無特別限定，例如’較佳為使用Ag(銀）或Au(金）， 特佳為使用Ag(銀）。Au具備易於吸收光之特性，但例如藉 由於鍍Au之表面進而形成Ti〇2膜，可提高光反射率。又， Ag之光反射率較Au更高’因此與單獨利用Au進行電鍵相 155454.doc -10· 201203632 比，可使發光裝置101之光之提取效率更加提高。再者， 形成於安裝區域la上之金屬膜之厚度並無特別限定，可根 據目的及用途而適當選擇。 再者’於本貫施形態中’如圖1及圖4所示’呈如下之構 成：於安裝區域la之上部填充有下述之密封構件7，從而 保護安裝區域la上之複數個發光元件2、及連接於該複數 個發光元件2之金屬線W免於受塵垢、水分、外力等之影 響。 <發光元件> 發光元件2係藉由施加電壓而自發光之半導體元件。如 圖2所示，於基板1之安裝區域la上配置有複數個發光元件 2，該複數個發光元件2成為一體而構成發光裝置1〇1之發 光部20。再者，發光元件2藉由未圖示之接合構件而與安 裝區域la接合，作為其接合方法，可採用例如使用樹脂或 焊錫膏作為接合構件之接合方法。再者，圖示之發光部2〇 係表示僅使發光元件2載置之區域者，發光部2〇申之發光 當然係指自發光元件2發出之光。 如圖3所示，發光元件2各自形成為矩形狀。又，如圖3 所示，發光元件2係於其上表面之一側設置有p電極2 a、於 發光元件2之另一側設置有n電極28之面朝上（FU , up) 元件。於本實施形態中，如圖4所示，將載置發光元件2之 金屬膜與構成正極3及負極4之金屬構件分開配置，因此較 佳為使用如圖3所示之p電極與形成於同一面側之發 光元件，並將其安裝於發光元件2之與電極形成面相反側 155454.doc 201203632 之面成為金屬膜的安裝區域13中。如圖3所示，p電極2A及 η電極2B分別具備：作為電極端子之p焊墊電極2Aa&n焊 墊電極2Ba、以及作為用以使投入至發光元件2之電流整體 擴散之輔助電極的延伸導電部2Ab、2Bb。再者，發光元 件中’只要至少p焊墊電極2Aa與η焊墊電極2Ba位於同一面 側即可，亦可不設置延伸導電部2Ab、2Bb。又，雖然省 略了圖示，但發光元件2於側視時，具有使包含11型半導體 層及p型半導體層之複數個半導體層積層而成之構造。 作為發光元件2 ’具體而言，較佳為使用發光二極體， 可根據用途而選擇任意波長者。例如，作為藍色（波長為 430 nm〜490 nm之光）、綠色（波長為49〇 nm〜57〇 nm之光）之發 光元件2 ’可使用ZnSe、氮化物系半導體（InxAlYGai_x_YN， X，OS Y，X+Yg 〇、GaI^。又，作為紅色（波長為 620 nm〜750 nm之光）之發光元件2，可使用GaA1As、 AlInGaP 等。 又’如下所述’於將螢光物質導入至密封構件7(參照圖 1)中之情形時’較佳為使用可高效地激發該螢光物質且可 進行短波長之發光之氮化物半導體（InxAlYGaix_YN， 〇SX，〇SY, X+YS1)。但是，發光元件2之成分組成或 發光色、尺寸等並不限定於以上所述，可根據目的而適當 選擇。又’發光元件2不僅可藉由輸出可見光區域之光之 元件構成，亦可藉由輸出紫外線或紅外線之元件而構成。 又，為了實現高輸出化，發光元件2之個數較佳為設定成 例如10個以上，且20〜150個之範圍内。 155454.doc 201203632 如圖2所示，發光元件2係於安裝區域1&上，在縱方向及 杈方向上分別等間隔地排列，此處，配置有縱8個^橫^個 之共計40個發光元件2。又，發光元件2如圖2所示，相對 於安裝區域la在橫方向上鄰接之發光元件2彼此藉由導電 、 性之金屬線W而電性連接，且進行奉聯連接。再者，此處 之串聯連接如圖2所示，係指鄰接之發光元件2中之p電極 2A與η電極2B藉由金屬線W而電性連接之狀態。 進而，發光件2較佳為如圖2所示，相對於安裝區域“PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1 Japanese Patent Laid-Open No. Hei. No. 2006-295085 (refer to FIG. 9 Patent Document 2: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION Problems to be Solved by the Invention In order to improve the brightness of a light-emitting device, a light-emitting device in which tens of light-emitting elements are disposed on a substrate is actively developed. Then, a plurality of light-emitting elements are mounted in such a manner. In the device, there is a problem that the light-emitting device cannot be driven by the capacitance and the output voltage of the power source connected to the light-emitting device, or the voltage must be raised, or the luminous efficiency is deteriorated. For example, 10 forward voltages Vf are connected in series to 3 In the light-emitting device of the light-emitting element of V, it is preferable to use a power supply with an output voltage of 30 V, and if a power supply with an output voltage of 20 V is used, it is necessary to increase the voltage for driving, and if a power supply with an output voltage of 60 V is used. The luminous efficiency is deteriorated. That is, it is preferable that the light-emitting device is suitable for the capacitance of the power source connected to the light-emitting device, and is configured with plural In the light-emitting device of the light-emitting element, several light-emitting elements are connected in series. However, in the process of requiring the brightness to be increased, the size of the light-emitting device is also limited, and the light-emitting device disposed in a fixed-size light-emitting device is connected in series. The present invention has been made in view of the above problems. The object of the present invention is to provide a light-emitting device suitable for a power source of various capacitors and output voltages, and to provide an increase in the number of connections and extraction of light. In order to solve the above problems, a light-emitting device according to the present invention includes a substrate, and a light-emitting portion including a plurality of light-emitting elements disposed in a mounting region on the substrate; a positive electrode and a negative electrode Each of the pads has a pad portion and a wiring portion, and I55454.doc •4-201203632 applies a voltage to the light-emitting portion via the wiring portion; and a reflective resin that is formed on the substrate so as to cover at least the wiring portion; It is set to form a relay wiring portion along the periphery of the above-mentioned mounting area, The relay wiring portion is covered by the reflective resin. According to this configuration, the number of light-emitting elements connected in series via the relay wiring portion can be increased within a limited area of the mounting region, and the number of light-emitting elements can be reduced. In addition, it is preferable to set a light-emitting device in which the light-emitting efficiency is improved, and the plurality of light-emitting elements each include a P electrode formed on one side and n on the other side. And the plurality of x-rays # include the illuminating element connected to the p-electrode with respect to the upper 4 relay wiring # and the illuminating element connected to the 4th pole. According to the configuration, the self-positive connection can be connected The connected light-emitting elements and the light-emitting elements connected in series to the negative electrode are connected via a relay wiring portion, and as the light-emitting device, the number of light-emitting elements connected in series can be increased. Further, in a limited area of the mounting area, a plurality of light-emitting elements can be closely arranged to obtain a light-emitting device with increased power consumption with respect to a fixed brightness, or a light-emitting device with improved luminous efficiency with respect to a fixed power consumption. Set. Further, it is preferable to be configured such that the P electrode is arranged in a direction with respect to the mounting region between the wiring portion of the positive electrode and the relay wiring portion, and is formed in the wiring portion of the negative electrode The p-electrodes are arranged in the other direction with respect to the mounting region between the relay wiring portions. 155454.doc 201203632 According to such a configuration, the relay wiring portion is formed along the periphery of the mounting region, and the light-emitting elements are arranged such that the direction is reversed with the relay wiring portion as a boundary, thereby connecting the wirings of the light-emitting elements to each other. This becomes complicated, and the number of light-emitting elements connected in series via the relay wiring portion can be increased within a limited area of the mounting area. Further, in a limited area of the mounting area, a plurality of light-emitting elements can be closely arranged, thereby obtaining a light-emitting device that consumes power with respect to the complexity of the solid-state, or a light-emitting device with improved luminous efficiency with respect to a fixed power consumption. . Further, it is preferable to be provided with a plurality of the above-mentioned relay wiring portions, and one of the plurality of light-emitting elements is sandwiched by the two relay wiring portions. According to this configuration, the wiring connecting the light-emitting elements via the relay wiring portion does not become complicated, and the number of the light-emitting elements connected in series via the relay wiring portion can be further increased in a limited area of the mounting region. Further, in a limited area of the mounting area, a plurality of light-emitting elements can be closely arranged to obtain a light-emitting device in which the power consumption is increased with respect to the fixed brightness, or a light-emitting device in which the luminous efficiency is improved with respect to the fixed power consumption. Further, the light-emitting device of the present invention is preferably configured such that the plurality of light-emitting elements are electrically connected in series and in parallel to each other by a metal wire. According to this configuration, not only a plurality of light-emitting elements are connected in series but also a plurality of light-emitting elements are connected in parallel to each other. Therefore, even when the forward pressure drop of each of the plurality of light-emitting elements is uneven, 155454.doc 201203632 The forward voltage drop of the connected light-emitting elements is equal. Thereby, unevenness in light emission caused by unevenness in the forward voltage drop between the light-emitting elements can be suppressed. Further, the light-emitting device of the present invention is preferably configured such that the reflective resin is formed to surround the periphery of the mounting region. According to this configuration, the light reflection (four) is formed so as to surround the periphery of the mounting region. Thus, the light that is directed toward the periphery of the mounting region of the substrate can also be reflected by the reflective resin. Therefore, the loss of the emitted light can be alleviated, and the light extraction efficiency of the light-emitting device can be improved. Further, the light-emitting device of the present invention is preferably configured such that a metal film is formed on the mounting region, and the plurality of light-emitting elements are disposed via the metal film. According to this configuration, a metal film is formed on the mounting region, and a plurality of & light TG members are disposed thereon, whereby light toward the mounting region side of the substrate can be reflected by the metal film. Therefore, it is possible to reduce the loss of the outgoing light and improve the extraction efficiency of the light of the light-emitting device. Further, the illuminating device of the present invention is preferably configured such that the illuminating tree is formed so as to cover a portion of the periphery of the rupture zone. According to this configuration, the reflective resin is formed so as to cover a part of the periphery of the women's wear region, thereby preventing the area where the substrate is exposed between the wiring portion and the metal film on the mounting region. m ^ L environment. Therefore, the light emitted from the light-emitting element can be totally reflected in the region in which the light-reflecting resin is formed. Therefore, the light-emitting efficiency of the light emitted from the light can be minimized to further improve the light extraction efficiency of the light-emitting device. 155454.doc 201203632 According to the light-emitting device of the present invention, it is possible to obtain a light-emitting device in which the number of light-emitting elements connected in series via the relay wiring portion can be increased and reduced in a limited area of the mounting region The loss of light emitted, improving the efficiency of light extraction. [Embodiment] Hereinafter, a light-emitting device according to an embodiment of the present invention will be described with reference to the drawings. Further, in order to clarify the description, the dimensions and positional relationships of the members shown in the respective drawings are exaggerated. Further, in the following description, the same names and symbols are used to denote the same or homogeneous members, and the detailed description is omitted as appropriate. In addition, in FIG. 2 and FIG. 5 to FIG. 7 referred to in the following description, 'in order to indicate the direction of each light-emitting element, the p-electrode and the n-electrode (see FIG. 3) of the light-emitting element only show the mounting area. The other parts on the mounting area or the six parts are omitted. [First Embodiment] A light-emitting device 1A1 according to the first embodiment will be described in detail with reference to Figs. 1 to 5 . In the following description, the overall configuration of the light-emitting device 101 will be described first, and then the respective configurations will be described. Further, for convenience of explanation, the light-reflecting resin 6 in Figs. 2 and 5 shows only the outer shape by a line, and is illustrated in a state of penetration. Figs. 6 to 8 described in the other embodiments are also similarly shown in a state of penetration. <Overall Configuration> • The light-emitting device 101 is used for a lighting fixture such as an LED lamp, a display device, a display device, a backlight source of a liquid crystal display, or the like. As shown in FIG. 2, FIG. 2 and FIG. 155454.doc 201203632 4, the light-emitting device m mainly has a configuration in which a substrate ι, a plurality of light-emitting elements 2 are disposed on the mounting region u of the substrate 1, and a positive electrode 3 and a negative electrode 4; These are formed on the substrate 1; the intermediate wiring portion 8 is formed independently of the positive electrode 3 and the negative electrode 4; the electronic component such as the light-emitting element 2; the metal wire w, which connects the positive electrode 3 or the negative electrode 4 and the relay electrode The line portion 8 is connected to the light-emitting element by a port, and the light-emitting element 2 is further applied to the substrate 1. Here, the connection and the light-reflecting resin 6 are formed so that the light-emitting device 101 is configured such that the reflective resin 6 has a peripheral edge and the sealing member 7 is filled inside. <Substrate> The substrate 1 is for arranging electronic components such as the light-emitting element 2. As shown in FIG. 2 and FIG. 2, the substrate 1 is formed in a rectangular flat plate shape. Further, on the substrate ,, as shown in FIG. 2, a mounting area u for arranging a plurality of light-emitting elements 2 is used. Further, the size of the substrate 1 is not particularly limited, and may be appropriately selected depending on the purpose and use of the number of the light-emitting elements 2. As the material of the substrate 1, an insulating material is preferably used, and a material which is hard to penetrate, such as light emitted from the light-emitting element 2 or external light, is preferably used. Further, it is preferred to use a material having a certain degree of strength. Specific examples include ceramics (AhO3, A1N, etc.), various resins, epoxy resins, polyimine resins, BT resins (bismaleimide triazine resins), and poly(orthophenylene). Polymethylamide (PPA, Polyphthalamide). <Installation Area> The mounting area 1a is an area for arranging a plurality of light-emitting elements 2. As shown in FIG. 2, the mounting area la is divided into an area in the center of the substrate 1. Mounting area 155454.doc 201203632 The field la is formed by a specific shape having sides facing each other, and more specifically, as shown in Fig. 2, it is formed in a substantially rectangular shape in which the corners are rounded. Further, the size of the mounting region 1a is not particularly limited, and may be appropriately selected depending on the purpose and use of the number or arrangement interval of the light-emitting elements 2. When the front view of FIG. 2 is viewed, a portion of the wiring portion % and a portion of the wiring portion 4b are formed along the left side of the mounting region la around the mounting region la, and are formed along the lower side of the mounting region 1a. One of the wiring portions is provided with a relay wiring portion 8 along the right side of the mounting region 丨3. Further, as shown in Fig. 2, the periphery of the mounting region 1& here means a periphery spaced apart from the periphery of the mounting region la by a specific gap. The mounting area la can be set to a region where a plurality of light-emitting elements 2 are arranged and which are defined on the substrate 1, that is, a region which is formed of the same material as the substrate ', but is preferably formed, for example, on the mounting region 13 to reflect light. The metal film is provided with a plurality of light-emitting elements 2 via the metal film. By forming a metal film on the mounting region 1a as described above and arranging a plurality of light-emitting elements 2 thereon, among the light emitted from the light-emitting element 2, the light toward the mounting region 1a side of the substrate 1 can also be reflected by the metal film. . Therefore, the loss of the emitted light can be reduced, and the light extraction efficiency of the light-emitting device 101 can be improved. The metal film formed on the mounting region 1a is preferably formed by electrolytic plating or electroless plating. The material of the metal film is not particularly limited as long as it can be electrically connected. For example, it is preferable to use Ag (silver) or Au (gold), and it is particularly preferable to use Ag (silver). Au has a property of easily absorbing light, but the light reflectance can be improved by, for example, forming a Ti〇2 film by plating the surface of Au. Further, the light reflectance of Ag is higher than that of Au. Therefore, the light extraction efficiency of the light-emitting device 101 can be further improved as compared with the use of Au alone for the key phase 155454.doc -10·201203632. Further, the thickness of the metal film formed on the mounting region 1a is not particularly limited, and may be appropriately selected depending on the purpose and use. Further, 'in the present embodiment, as shown in FIG. 1 and FIG. 4', the upper portion of the mounting region 1a is filled with the sealing member 7 described below, thereby protecting a plurality of light-emitting elements on the mounting region la. 2. The metal wire W connected to the plurality of light-emitting elements 2 is protected from dust, moisture, external force, and the like. <Light-emitting element> The light-emitting element 2 is a semiconductor element that emits light by applying a voltage. As shown in Fig. 2, a plurality of light-emitting elements 2 are disposed on the mounting region 1a of the substrate 1, and the plurality of light-emitting elements 2 are integrated to constitute the light-emitting portion 20 of the light-emitting device 1A1. Further, the light-emitting element 2 is bonded to the mounting region la by a bonding member (not shown), and as a bonding method, for example, a bonding method using a resin or a solder paste as a bonding member can be employed. Further, the light-emitting unit 2 shown in the figure indicates a region in which only the light-emitting element 2 is placed, and the light-emitting portion 2 preferably emits light from the light-emitting element 2. As shown in FIG. 3, the light-emitting elements 2 are each formed in a rectangular shape. Further, as shown in Fig. 3, the light-emitting element 2 is provided with a p-electrode 2a on one side of the upper surface and a face-up (FU) element on the other side of the light-emitting element 2 with the n-electrode 28. In the present embodiment, as shown in FIG. 4, the metal film on which the light-emitting element 2 is placed is disposed separately from the metal member constituting the positive electrode 3 and the negative electrode 4. Therefore, it is preferable to use a p-electrode as shown in FIG. The light-emitting element on the same surface side is mounted on the surface of the light-emitting element 2 opposite to the electrode formation surface 155454.doc 201203632 to be the metal film mounting region 13. As shown in FIG. 3, each of the p-electrode 2A and the n-electrode 2B includes a p-pad electrode 2Aa & n-pad electrode 2Ba as an electrode terminal, and an auxiliary electrode for diffusing the current integrated into the light-emitting element 2 as a whole. The conductive portions 2Ab, 2Bb are extended. Further, in the light-emitting element, at least the p pad electrode 2Aa and the n pad electrode 2Ba may be located on the same surface side, and the extended conductive portions 2Ab and 2Bb may not be provided. Further, although the illustration is omitted, the light-emitting element 2 has a structure in which a plurality of semiconductor layers including the 11-type semiconductor layer and the p-type semiconductor layer are laminated in a side view. Specifically, as the light-emitting element 2', a light-emitting diode is preferably used, and any wavelength can be selected depending on the application. For example, ZnSe or a nitride-based semiconductor (InxAlYGai_x_YN, X, OS) can be used as the light-emitting element 2' of blue (light having a wavelength of 430 nm to 490 nm) or green (light having a wavelength of 49 〇 nm to 57 〇 nm). Y, X+Yg 〇, GaI^. Further, as the light-emitting element 2 of red (light having a wavelength of 620 nm to 750 nm), GaA1As, AlInGaP, or the like can be used. Further, 'the following is used to introduce the fluorescent substance to In the case of the sealing member 7 (refer to FIG. 1), it is preferable to use a nitride semiconductor (InxAlYGaix_YN, 〇SX, 〇SY, X+YS1) which can efficiently excite the fluorescent substance and emit light of a short wavelength. However, the component composition, the luminescent color, the size, and the like of the light-emitting element 2 are not limited to the above, and may be appropriately selected depending on the purpose. Further, the 'light-emitting element 2 may be constituted not only by an element that outputs light in a visible light region, but also by In order to achieve high output, the number of the light-emitting elements 2 is preferably set to, for example, 10 or more and 20 to 150. 155454.doc 201203632 As shown, the light-emitting element 2 The mounting area 1 & is arranged at equal intervals in the longitudinal direction and the 杈 direction. Here, a total of 40 light-emitting elements 2 are arranged in a vertical direction. Further, the light-emitting element 2 is as shown in FIG. It is to be noted that the light-emitting elements 2 adjacent to each other in the lateral direction with respect to the mounting region 1a are electrically connected to each other by a conductive metal wire W, and are connected in a connected manner. Further, the series connection here is as shown in FIG. The state in which the p-electrode 2A and the n-electrode 2B in the adjacent light-emitting elements 2 are electrically connected by the metal wire W. Further, the light-emitting member 2 is preferably as shown in FIG. 2 with respect to the mounting area.

在橫方向上鄰接之發光元件2彼此藉由導電性之金屬線W 而電性連接，且不僅進行串聯連接，亦進行並聯連接。再 者，如圖4所示，此處之並聯連接係指鄰接之發光元件2令 之P電極2A彼此或n電極2B彼此藉由金屬線冒而電性連接的 狀態。 如此，不僅將複數個發光元件2彼此串聯連接，而且將 複數個發光元件2彼此並聯連接，藉此即便於複數個發光 元件2各自之順向壓降（以了，稱為Vf)存在不均之情形 時’亦可消除該Vf之不均。再者，所謂Vf，係指為使電流 相對於發光二極體進行順向流動所必要之電壓，即，為使 發光一極體照射光所必要之電壓。 此處，若複數個發光元件2各自之竹存在不肖，則電流 易於流入至Vf較低之發光元件2中，發光元件2間容易產生 輸出差異而產生發光不均。因此’如上所述，冑由將複數 個發光元件2彼此並聯連接，可減輕由經串聯連接之發光 元件2間之Vf之不均所引起的各發光元件之輸出差，從而 155454.doc •13- 201203632 可抑制發光不均。 再者，於如上述般將複數個發光元件2並聯連接之情形 時，如圖2所示，較佳為複數個發光元件2之中，與配線部 3b、4b及中繼配線部8直接連接之發光元件2彼此不進行並 聯連接。即，於發光裝置101中，與配線部3b直接連接之 安裝區域la上之第1列第1行、第2列第1行之發光元件22p 電極2A未並聯連接。又，於發光裝置1〇1中，與配線部仆 直接連接之安裝區域la上之第7列第1行、第8列第丨行之發 光元件2之η電極2B未並聯連接。進而，於發光裝置 中，與中繼配線部8直接連接之第1列第5行、第2列第5 行、第3列第5行、第4列第5行之η電極2Β未並聯連接。而 且，於發光裝置101中，與中繼配線部8直接連接之第5列 第5行、第6列第5行、第7列第5行、第8列第5行之ρ電極2Α 未並聯連接。藉此，於發光裝置1〇1中，可減輕由金屬線 W所施加之負載。 <正極及負極> 正極3及負極4係用以將基板丨上之複數個發光元件2等電 子零件與未圖式之外部電源進行電性連接，並對該等電子 零件施加來自外部電源之電壓者 以自外部進行通電之電極、或3 者。 I者。即，正極3及負極4係用 或承擔作為其一部分之功能The light-emitting elements 2 adjacent in the lateral direction are electrically connected to each other by the conductive metal wires W, and are connected not only in series but also in parallel. Further, as shown in Fig. 4, the parallel connection here means a state in which the adjacent light-emitting elements 2 are such that the P electrodes 2A or the n electrodes 2B are electrically connected to each other by a metal wire. In this way, not only the plurality of light-emitting elements 2 are connected to each other in series, but also a plurality of light-emitting elements 2 are connected in parallel to each other, whereby even the respective forward voltage drops (referred to as Vf) of the plurality of light-emitting elements 2 are uneven. In the case of 'can also eliminate the unevenness of the Vf. In addition, Vf means a voltage necessary for causing a current to flow in the forward direction with respect to the light-emitting diode, that is, a voltage necessary for irradiating the light-emitting body with light. Here, when the bamboo of each of the plurality of light-emitting elements 2 is inconvenient, the current easily flows into the light-emitting element 2 having a low Vf, and the difference in output between the light-emitting elements 2 is likely to occur, resulting in uneven light emission. Therefore, as described above, by connecting a plurality of light-emitting elements 2 in parallel with each other, the output difference of each of the light-emitting elements caused by the unevenness of Vf between the light-emitting elements 2 connected in series can be alleviated, thereby 155454.doc •13 - 201203632 Can suppress uneven illumination. Further, when a plurality of light-emitting elements 2 are connected in parallel as described above, as shown in FIG. 2, it is preferable that one of the plurality of light-emitting elements 2 is directly connected to the wiring portions 3b and 4b and the relay wiring portion 8. The light-emitting elements 2 are not connected in parallel to each other. In other words, in the light-emitting device 101, the light-emitting elements 22p and the electrode 2A of the first row and the first row of the first row and the second row of the mounting region la directly connected to the wiring portion 3b are not connected in parallel. Further, in the light-emitting device 1A1, the n-electrode 2B of the light-emitting element 2 of the seventh row and the eighth row on the mounting region la directly connected to the wiring portion is not connected in parallel. Further, in the light-emitting device, the n-electrode 2 of the first row, the fifth row, the fifth row, the third column, the fifth row, and the fourth row and the fifth row directly connected to the relay wiring portion 8 are not connected in parallel. . Further, in the light-emitting device 101, the fifth electrode of the fifth row, the fifth row, the fifth row, the seventh column, the fifth row, the eighth column, the fifth row, and the fifth electrode, which are directly connected to the relay wiring portion 8, are not connected in parallel. connection. Thereby, in the light-emitting device 1〇1, the load applied by the metal wire W can be alleviated. <Positive Electrode and Negative Electrode> The positive electrode 3 and the negative electrode 4 are for electrically connecting an electronic component such as a plurality of light-emitting elements 2 on a substrate to an external power source of a non-pattern, and applying an external power source to the electronic components. The voltage is the electrode that is energized from the outside, or three. I. That is, the positive electrode 3 and the negative electrode 4 are used or assumed to function as a part thereof.

大致矩形狀之焊墊部（供電部）3a、 π μ如下方式構成：具有 、4a及線狀之配線部3b、 155454.doc 201203632 仆，並將施加至焊墊部3a、4a之電壓經由配線部讣、仆而 施加至包含複數個發光元件2之發光部2〇。再者，如圖^所 示，於負極4之配線部4b上形成有表示其係陰極之陰極標 記 CM。 $ 焊墊部3a、乜係用以被施加來自外部電源之電壓者。如 . 圖2所示，於基板1上之角部之對角線之位置上，形成有一 對焊墊部3a、4a。而且，焊墊部3a、4a係藉由導電性之金 屬線而與未圖示之外部電源電性連接。 配線部3b、4b係用以將自外部電源施加至焊墊部3 && 之電壓朝安裝區域la上之發光元件2傳遞者。如圖2所示， 配線部3b、4b係以自焊墊部3a、4a延伸之方式形成，並且 於安裝區域la之周圍以大致L字狀而形成。 構成正極3及負極4之金屬膜之素材較佳為使用。其原 因在於：如下所述，於使用導熱性優異之Au作為金屬線w 之材料的情形時，可將同素材之金屬線W牢固地接合。 作為構成正極3及負極4之金屬膜之形成方法，較佳為與 上述安裝區域la上之金屬膜之形成方法同樣地，藉由電解 電鍍或無電解電鍍而形成。再者，構成正極3及負極4之金 屬膜之厚度並無特別限定，可根據金屬線W之數量等目的 及用途而適當選擇》 此處，如圖1及圖2所示，配線部3 b、4b之一部分由下述 之反光樹脂6覆盍。因此’即便於如上述般利用易於吸收 光之Au形成配線部3b、4b之情形時，自發光元件2出射之 光亦不會到達配線部3b、4b而由反光樹脂6反射》因此， I55454.doc •15· 201203632 可減輕出射光之損耗，可使發光裝置1〇1之光之提取效率 提兩。 進而’由於利用反光樹脂6覆蓋配線部3b、4b之一部 分，因此可保護該金屬線W免於受塵垢、水分、外力等之 影響。再者，如圖2所示，此處之配線部儿、扑之一部分 係指配線部3b、4b之中，位於安裝區域1 a之周圍且沿著安 裝區域la之邊而形成之部分。 <中繼配線部> 中繼配線部8係用以中繼正極3與負極4之間之配線者。 即’中繼配線部8將複數個發光元件2之至少一個與該發光 元件2之p電極加以連接，並將複數個發光元件2之至少一 個與5亥發光元件2之η電極加以連接，藉此中繼正極3與負 極4之間之配線。如圖2所示，中繼配線部8係由基板丨上之 金屬構件而構成。如圖2所示，中繼配線部8係於安裴區域 1 a之周圍，沿著s亥安裝區域丨a之一邊、即右側之邊而形成 為直線狀。 如圖2所示，中繼配線部8係由反光樹脂6覆蓋。因此， 如下所述，即便於使用易於吸收光之Au作為構成中繼配線 部8之金屬膜之情形時，自發光元件2出射之光亦不會到達 中繼配線部8而由反光樹脂6反射。因此，可減輕出射光之 損耗，可使發光裝置101之光之提取效率提高。進而，藉 由利用反光樹月旨6覆蓋中繼配線部8 ’可保護該中繼配線部 8免於受塵垢、水分、外力等之影響。 與正極3及負極4同樣地，構成中繼配線部8之金屬膜之 155454.doc •16- 201203632 素材較佳為使用Au。其原因在於：如下所述，於使用導熱 性優異之Au作為金屬線w之材料的情形時，可將同素材之 金屬線W牢固地接合。 作為構成中繼配線部8之金屬膜之形成方法，較佳為與 正極3及負極4同樣地，藉由電解電錄或無電解電鑛而形 成。再者，構成中繼配線部8之金屬膜之厚度並無特別限 疋，可根據金屬線W之數量等目的及用途而適當選擇。 實施形態之發光裝置中，如圖2所示，發光元件2係以如 下方式排列：於正極3之配線部3b與中繼配線部8之間，複 數個發光元件2之p電極2A朝向作為安裝區域la之一方向的 左側、或者複數個發光元件2之‘n電極2B朝向作為安裝區域 1 a之另一方向的右側。 又，如圖2所示，發光元件2係以如下方式排列：於負極 4之配線部4b與中繼配線部8之間，複數個發光元件2之口電 極2A朝向作為安裝區域la之另一方向的右彻)，且複數個發 光元件2之η電極2B朝向作為安裝區域u之一方向的左側。 即’發光元件2係以如下方式配置：於對圖2進行俯視之情 形時，在上方之群組（區域）及下方之群組（區域）中，其方 向以中繼配線部8之中央為邊界而反轉。 於實施形態之發光裝置1〇1中’如上述般沿著安裝區域 la之周圍形成中繼配線部8 ’且將發光元件2配置成方向以 該中繼配線部8為邊界而反轉，藉此於安裝區域“之有限 之面積内，連接發光元件彼此之配線不會變得複雜，可使 申聯連接之發光元件之數量增加。進而，於安裝區域la之 155454.doc -17· 201203632 有限之面積内，可緊密地配置複數個發光元件，從而可獲 得消耗電力相對於固定之亮度提高之發光裝置、或者發光 效率相對於固定之消耗電力提高之發光裝置。再者，於實 施形態之發光裝置101中，如圖2所示，將10個發光元件2 加以申聯連接，並且形成4行該串聯連接。 如圖2所示，配線部3b之一端部與配線部4b之一端部係 於安裝區域la之周圍以彼此鄰接之方式形成。如此，沿著 安裝區域la之周圍形成正極3及負極4之配線部3b、4b，且 使其一端部鄰接而形成，藉此即便於如發光裝置1 〇丨般將 複數個發光元件2配置在基板1上之情形時，亦可將下述之 保護元件5配置於適當之位置。因此，可防止正負兩電極 間之電壓成為齊納電壓以上，可適當地防止因施加過大之 電壓而產生發光元件2之元件損壞或性能劣化。 更具體而言，配線部3b、4b較佳為以其一端部於圖2所 示之大致矩形狀之安裝區域la之一邊的範圍内彼此鄰接之 方式形成。如此，以於安裝區域13之一邊之範圍内鄰接之 方式形成配線部3b、4b，藉此可確保用以將配線部3b、4b 與發光元件2電性連接之金屬線W之設置面積。因此，可 增加與配線部3b、4b連接之發光元件2之數量，即成為串 聯連接之起點及終點之發光元件2之數量，從而可使安装 區域la上之發光元件2之串聯連接之行數增加，而不會導 致連接發光元件彼此之配線變得複雜。而且，藉由如上述 般使串聯連接之行數增加，於安裝區域之有限之面積内， 可緊密地配置複數個發光元件，從而可獲得消耗電力相對 155454.doc •18- 201203632 於固定之亮度提高之發光裝置、或者發光效率相對於固定 之消耗電力提高之發光裝置。 又，作為如配線部3b之一端部與配線部4b之—端部於安 裝區域la之周圍彼此鄰接之形態，亦可設定成圖5所示2 發光裝置102。如圖5所示，配線部扑、仆之一端部係以於 大致矩形狀之安裝區域1&之角部彼此鄰接之方式形成。、 即，配線部3b係以自焊墊部3&延伸至安裝區域1&之角部之 方式形成為大致L字狀。又，配線部4b係以自焊墊部钻延 伸至:ίτ裝區域la之角部之方式形成為直線狀。再者於圖 5所示之發光裝置1〇2中，對於與發光裝置1〇1重複之構 成’標註相同之符號並省略說明。 如此，發光裝置101中，沿著安裝區域1&之周圍設置正 極3、負極4及中繼配線部8,且於基板丨上將正極3、負極4 及中繼配線部8與安裝區域la分開設置。藉由如此構成， 發光裝置101中，能夠將可與金屬線W牢固地接合之素材 (例如Au)用於正極3、負極4、中繼配線部8，且能夠將光 反射率較高之素材（例如Ag)用於安裝區域la，因此可獲得 光提取效率提高且可靠性較高之發光裝置。 <反光樹脂> 反光樹脂6係用以使自發光元件2出射之光反射者。如圖 2所示，反光樹脂6係以覆蓋配線部3b、4b之一部分、中繼 配線部8、下述之保護元件5及連接於該等之金屬線w之方 式形成。因此，即便於如上述或下述般利用易於吸收光之 Au形成配線部3b、4b、中繼配線部8及金屬線W之情形 155454.doc •19- 201203632 時，自發光元件2出射之光亦不會到達配線部3b、4b、中 繼配線部8及金屬線w，而由反光樹脂6反射。因此，可減 輕出射光之損耗，可使發光裝置101之光之提取效率提 高。進而’藉由利用反光樹脂6覆蓋配線部3b、4b之一部 分、中繼配線部8、保護元件5及連接於該等之金屬線w， 可保護該等構件免於受塵垢、水分、外力等之影響。 如圖1及圖2所示，反光樹脂6較佳為於基板1上以包圍形 成有發光部20之安裝區域13之方式形成為四角框狀。藉由 如上述般以包圍安裝區域la之周圍之方式形成反光樹脂 6，例如’如自圖4之左右兩側所配置之發光元件2出射之 光般’朝向基板1之安裝區域la之周圍的光亦可由反光樹 脂6反射。因此’可減輕出射光之損耗，可使發光裝置ι〇1 之光之提取效率提高。 又’如圖2所示，反光樹脂6較佳為以覆蓋成為安裝區域 la之周緣之區域之一部分的方式形成。如此，藉由以覆蓋 安裝區域la之周緣之一部分之方式形成反光樹脂6，不會 在配線部3b、4b與安裝區域la上之金屬膜之間形成基板1 露出之區域。因此，可使自發光元件2出射之光於形成有 反光樹脂6之内部之區域中全部反射，故而可最大限度地 減輕出射光之損耗’可使發光裝置1〇1之光之提取效率進 一步提高。The substantially rectangular pad portions (power supply portions) 3a and πμ are configured to have the wiring portions 3b and 4b and 155454.doc 201203632, and apply voltages to the pad portions 3a and 4a via wiring. The portion and the servant are applied to the light-emitting portion 2A including the plurality of light-emitting elements 2. Further, as shown in Fig. 2, a cathode mark CM indicating a cathode is formed on the wiring portion 4b of the negative electrode 4. The pad portion 3a and the wire are used to apply a voltage from an external power source. As shown in Fig. 2, a pair of pad portions 3a, 4a are formed at the diagonal positions of the corner portions on the substrate 1. Further, the pad portions 3a and 4a are electrically connected to an external power source (not shown) by a conductive metal wire. The wiring portions 3b and 4b are for transmitting the voltage applied from the external power source to the pad portion 3 &&&; toward the light-emitting element 2 on the mounting region 1a. As shown in Fig. 2, the wiring portions 3b and 4b are formed to extend from the pad portions 3a and 4a, and are formed in a substantially L shape around the mounting region la. The material constituting the metal film of the positive electrode 3 and the negative electrode 4 is preferably used. The reason for this is that, in the case where Au which is excellent in thermal conductivity is used as the material of the metal wire w as described below, the metal wire W of the same material can be firmly bonded. The method of forming the metal film constituting the positive electrode 3 and the negative electrode 4 is preferably formed by electrolytic plating or electroless plating in the same manner as the method of forming the metal film on the mounting region la. Further, the thickness of the metal film constituting the positive electrode 3 and the negative electrode 4 is not particularly limited, and may be appropriately selected depending on the purpose and application of the number of the metal wires W. Here, as shown in FIGS. 1 and 2, the wiring portion 3b One of the portions 4b is covered with the following reflective resin 6. Therefore, even when the wiring portions 3b and 4b are formed by Au which is easy to absorb light as described above, the light emitted from the light-emitting element 2 does not reach the wiring portions 3b and 4b and is reflected by the reflective resin 6. Therefore, I55454. Doc •15· 201203632 It can reduce the loss of the emitted light, and can improve the extraction efficiency of the light of the light-emitting device 1〇1. Further, since one portion of the wiring portions 3b and 4b is covered by the reflective resin 6, the metal wire W can be protected from dust, moisture, external force, and the like. Further, as shown in Fig. 2, the wiring portion and the portion of the wiring portion are the portions of the wiring portions 3b and 4b which are formed around the mounting region 1a and along the side of the mounting region 1a. <Relay wiring unit> The relay wiring unit 8 is a relay for relaying between the positive electrode 3 and the negative electrode 4. That is, the 'relay wiring portion 8 connects at least one of the plurality of light-emitting elements 2 to the p-electrode of the light-emitting element 2, and connects at least one of the plurality of light-emitting elements 2 to the n-electrode of the fifth-light-emitting element 2, This relays the wiring between the positive electrode 3 and the negative electrode 4. As shown in Fig. 2, the relay wiring portion 8 is composed of a metal member on the substrate. As shown in Fig. 2, the relay wiring portion 8 is formed around the ampoule region 1a, and is formed linearly along one side of the shai mounting region 丨a, that is, the right side. As shown in FIG. 2, the relay wiring portion 8 is covered with the reflective resin 6. Therefore, as described below, even when Au which is easy to absorb light is used as the metal film constituting the relay wiring portion 8, the light emitted from the light-emitting element 2 does not reach the relay wiring portion 8 but is reflected by the reflective resin 6. . Therefore, the loss of the outgoing light can be alleviated, and the light extraction efficiency of the light-emitting device 101 can be improved. Further, the relay wiring portion 8 can be protected from dust, moisture, external force, and the like by covering the relay wiring portion 8' with the reflective tree. Similarly to the positive electrode 3 and the negative electrode 4, the metal film constituting the relay wiring portion 8 is preferably 155454.doc • 16-201203632. The reason for this is that, in the case where Au which is excellent in thermal conductivity is used as the material of the metal wire w, as described below, the metal wire W of the same material can be firmly bonded. The method of forming the metal film constituting the relay wiring portion 8 is preferably formed by electrolytic recording or electroless electrolysis in the same manner as the positive electrode 3 and the negative electrode 4. Further, the thickness of the metal film constituting the relay wiring portion 8 is not particularly limited, and may be appropriately selected depending on the purpose and use of the number of the metal wires W. In the light-emitting device of the embodiment, as shown in FIG. 2, the light-emitting elements 2 are arranged such that the p-electrodes 2A of the plurality of light-emitting elements 2 are oriented between the wiring portion 3b of the positive electrode 3 and the relay wiring portion 8. The left side of one of the regions la, or the 'n electrode 2B of the plurality of light-emitting elements 2, is directed to the right side as the other direction of the mounting region 1a. Further, as shown in FIG. 2, the light-emitting elements 2 are arranged such that the port electrode 2A of the plurality of light-emitting elements 2 faces the other one as the mounting area la between the wiring portion 4b of the negative electrode 4 and the relay wiring portion 8. The right direction of the direction is the same, and the n-electrode 2B of the plurality of light-emitting elements 2 faces the left side which is one of the directions of the mounting region u. In other words, the light-emitting element 2 is disposed in such a manner that, in the case of looking down on FIG. 2, in the group (region) and the group (region) below, the direction is the center of the relay wiring portion 8 Reverse the boundary. In the light-emitting device 1A1 of the embodiment, the relay wiring portion 8' is formed along the periphery of the mounting region la as described above, and the light-emitting element 2 is disposed such that the direction is reversed with the relay wiring portion 8 as a boundary. Therefore, in the limited area of the installation area, the wiring connecting the light-emitting elements to each other does not become complicated, and the number of light-emitting elements connected by the joint connection can be increased. Further, in the installation area la 155454.doc -17· 201203632 In the area, a plurality of light-emitting elements can be closely arranged to obtain a light-emitting device in which the power consumption is increased with respect to the fixed brightness, or a light-emitting device in which the luminous efficiency is increased with respect to the fixed power consumption. In the apparatus 101, as shown in Fig. 2, ten light-emitting elements 2 are connected by a connection, and four rows of the series connection are formed. As shown in Fig. 2, one end of the wiring portion 3b and one end of the wiring portion 4b are tied to each other. The periphery of the mounting region la is formed adjacent to each other. Thus, the wiring portions 3b and 4b of the positive electrode 3 and the negative electrode 4 are formed along the periphery of the mounting region la, and one end portion thereof is adjacent to each other. Therefore, even when a plurality of light-emitting elements 2 are disposed on the substrate 1 as in the light-emitting device 1, the protective element 5 described below can be disposed at an appropriate position. Therefore, between the positive and negative electrodes can be prevented. The voltage is equal to or higher than the Zener voltage, and it is possible to appropriately prevent component damage or performance deterioration of the light-emitting element 2 due to application of an excessive voltage. More specifically, the wiring portions 3b and 4b are preferably one end portion thereof as shown in FIG. The one side of one of the substantially rectangular mounting regions 1a is formed adjacent to each other. Thus, the wiring portions 3b, 4b are formed adjacent to each other within a range of one side of the mounting region 13, thereby ensuring wiring The installation area of the metal wires W electrically connected to the light-emitting elements 2 by the portions 3b and 4b. Therefore, the number of the light-emitting elements 2 connected to the wiring portions 3b and 4b, that is, the light-emitting elements 2 which are the starting point and the end point of the series connection can be increased. The number of lines connecting the light-emitting elements 2 on the mounting area la can be increased without causing the wiring connecting the light-emitting elements to be complicated. Moreover, by the above The number of connected connections is increased, and a plurality of light-emitting elements can be closely arranged within a limited area of the mounting area, thereby obtaining power consumption relative to 155454.doc • 18-201203632, a fixed brightness-increasing illuminating device, or luminous efficiency The light-emitting device is improved in the power consumption of the fixed portion. The end portion of the wiring portion 3b and the end portion of the wiring portion 4b are adjacent to each other around the mounting region la, and may be set to be illuminated as shown in FIG. As shown in Fig. 5, the wiring portion is formed such that the corner portions of the substantially rectangular mounting regions 1 & are adjacent to each other. That is, the wiring portion 3b is formed by the self-welding portion 3& The method of extending to the corner portion of the mounting region 1 & is formed in a substantially L shape. Further, the wiring portion 4b is formed in a linear shape so as to be drilled from the pad portion to the corner portion of the λ region. In the light-emitting device 1A shown in Fig. 5, the same reference numerals are given to the same components as those of the light-emitting device 1A, and the description thereof will be omitted. As described above, in the light-emitting device 101, the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 are provided along the periphery of the mounting region 1&, and the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 are separated from the mounting region la on the substrate stack. Settings. According to this configuration, in the light-emitting device 101, a material (for example, Au) that can be firmly bonded to the metal wire W can be used for the positive electrode 3, the negative electrode 4, and the relay wiring portion 8, and the material having a high light reflectance can be used. (for example, Ag) is used for the mounting region la, so that a light-emitting device with improved light extraction efficiency and high reliability can be obtained. <Reflective Resin> The reflective resin 6 is used to reflect light emitted from the light-emitting element 2. As shown in Fig. 2, the reflective resin 6 is formed to cover a portion of the wiring portions 3b and 4b, the relay wiring portion 8, the protective element 5 described below, and a metal wire w connected thereto. Therefore, even when the wiring portions 3b and 4b, the relay wiring portion 8, and the metal wire W are formed by Au which is easy to absorb light, as described above or below, the light emitted from the light-emitting element 2 is emitted when the wiring portions 3b and 4b, the relay wiring portion 8, and the metal wire W are formed 155454.doc • 19-201203632 The wiring portions 3b and 4b, the relay wiring portion 8, and the metal wires w are not reached, but are reflected by the reflective resin 6. Therefore, the loss of the outgoing light can be reduced, and the light extraction efficiency of the light-emitting device 101 can be improved. Further, by covering the wiring portions 3b and 4b, the relay wiring portion 8, the protective element 5, and the metal wires w connected thereto by the reflective resin 6, it is possible to protect the members from dust, moisture, external force, and the like. The impact. As shown in Figs. 1 and 2, the reflective resin 6 is preferably formed in a square frame shape so as to surround the mounting region 13 in which the light-emitting portion 20 is formed on the substrate 1. The light-reflecting resin 6 is formed so as to surround the periphery of the mounting region 1a as described above, for example, 'the light emitted from the light-emitting elements 2 disposed on the left and right sides of FIG. 4' is toward the periphery of the mounting region la of the substrate 1. Light can also be reflected by the reflective resin 6. Therefore, the loss of the emitted light can be alleviated, and the extraction efficiency of the light of the light-emitting device ι〇1 can be improved. Further, as shown in Fig. 2, the reflective resin 6 is preferably formed to cover a portion of the region which is the peripheral edge of the mounting region la. Thus, by forming the light-reflecting resin 6 so as to cover one of the peripheral edges of the mounting region la, the region where the substrate 1 is exposed is not formed between the wiring portions 3b, 4b and the metal film on the mounting region 1a. Therefore, the light emitted from the light-emitting element 2 can be totally reflected in the region in which the light-reflecting resin 6 is formed, so that the loss of the emitted light can be minimized, and the light extraction efficiency of the light-emitting device 1〇1 can be further improved. .

作為反光樹脂6之材料，較佳為使用絕緣材料。又，為 了確保某種程度之強度可使用例如熱硬化性樹脂、熱塑 性樹脂等。更具體而t，可列舉：酚樹脂、j裒氧樹脂、BT 155454.doc •20- 201203632 樹脂、PPA或矽樹脂等。又’於成為該等之母體之樹脂 中’分散難以吸收來自發光元件2之光、且相對於成為母 體之樹脂之折射率差較大的反射構件（例如Ti〇2、八丨2〇3、 Zr〇2、Mg〇)等之粉末，藉此可高效地使光反射。再者， 反光樹脂6之尺寸並無特別限定，可根據目的及用途而適 虽選擇。又，於反光樹脂6之位置，亦可形成包含與樹脂 不同之材料之光反射構件。 <密封構件> 密封構件7係用以保護配置於基板1上之發光元件2、保 護元件5及金屬線W等免於受塵垢、水分、外力等影響之 構件。如圖1、圖2及圖4所示，密封構件7係藉由於基板j 上，向由反光樹脂6所包圍之安裝區域1&内填充樹脂而形 成。 作為密封構件7之材料，較佳為具有可使來自發光元件2 之光穿透之透光性者。作為具體之材料，可列舉：石夕樹 脂、環氧樹脂、尿素樹脂等。又，除上述材料外，視需要 亦可含有著色劑、光擴散劑、填料、螢光構件等。 再者，密封構件7可由單一之構件形成、或者亦可作為 兩層以上之複數層而形成。又，密封構件7之填充量只要 係包覆配置於由反光樹脂6所包圍之安裝區域_之發光 元件2、保護元件5、金屬線w等之量即可。又，於使密封 構件7具備透鏡功能之情形時，亦可使密封構件7之表面隆 起而形成為炮彈型形狀或凸透鏡形狀。 <螢光構件> 155454.doc -21- 201203632 於密封構件7中，亦可含有吸收來自發光元件2之光之至 少一部分並發出具有不同波長之光之螢光構件作為波長轉 換構件。作為螢光構件，較佳為使來自發光元件2之光轉 換成更長波長者。又，螢光構件可將一種螢光物質等以單 層而形成，亦可將混合有兩種以上之螢光物質等者作為單 層而形成。或者，亦可使含有一種螢光物質等之單層積層 兩層以上，亦可使分別混合有兩種以上之螢光物質等之單 層積層兩層以上。 作為螢光構件之具體之材料，例如可使用混合有釔、鋁 及石榴石之YAG(Yttrium Aluminum Garnet，釔鋁石榴石） 系螢光體、主要藉由Eu、Cef鑭系元素而活化之氮化物系 螢光體、氮氧化物系螢光體。 <金屬線> 金屬線w係用以將發光元件2或下述之保護元件5等電子 零件與正極3、負才虽4及中繼配線部8等加以電性連接之導 電性配線。作為金屬線w之材料，可列舉使用Au、As the material of the reflective resin 6, an insulating material is preferably used. Further, in order to secure a certain degree of strength, for example, a thermosetting resin, a thermoplastic resin or the like can be used. More specifically, t can be exemplified by phenol resin, j oxime resin, BT 155454.doc • 20-201203632 resin, PPA or oxime resin. Further, in the resin which is the matrix of the above, it is a reflection member which is difficult to absorb the light from the light-emitting element 2 and has a large difference in refractive index with respect to the resin which becomes the matrix (for example, Ti〇2, gossip 2〇3, A powder such as Zr 〇 2, Mg 〇), whereby light can be efficiently reflected. Further, the size of the reflective resin 6 is not particularly limited, and may be appropriately selected depending on the purpose and use. Further, at the position of the reflective resin 6, a light reflecting member containing a material different from the resin may be formed. <Sealing member> The sealing member 7 is a member for protecting the light-emitting element 2, the protective element 5, the metal wire W, and the like disposed on the substrate 1 from dust, moisture, external force, and the like. As shown in Fig. 1, Fig. 2, and Fig. 4, the sealing member 7 is formed by filling the resin in the mounting region 1 & surrounded by the reflective resin 6 on the substrate j. As the material of the sealing member 7, it is preferable to have a light transmissive property that allows light from the light-emitting element 2 to pass through. Specific examples of the material include Shishi resin, epoxy resin, and urea resin. Further, in addition to the above materials, a coloring agent, a light diffusing agent, a filler, a fluorescent member, or the like may be contained as needed. Further, the sealing member 7 may be formed of a single member or may be formed as a plurality of layers of two or more layers. Further, the filling amount of the sealing member 7 may be any amount that is disposed so as to be disposed on the light-emitting element 2, the protective element 5, the metal wire w, and the like in the mounting region surrounded by the light-reflecting resin 6. Further, when the sealing member 7 is provided with a lens function, the surface of the sealing member 7 may be raised to form a bullet-shaped shape or a convex lens shape. <Fluorescent member> 155454.doc -21-201203632 The sealing member 7 may further include a fluorescent member that absorbs at least a part of the light from the light-emitting element 2 and emits light having a different wavelength as a wavelength conversion member. As the fluorescent member, it is preferable to convert the light from the light-emitting element 2 into a longer wavelength. Further, the fluorescent member may be formed of a single layer of a fluorescent material or the like, or a single layer may be formed by mixing two or more kinds of fluorescent substances. Alternatively, two or more layers of a single layer of a fluorescent material or the like may be used, or two or more layers of a single layer of two or more types of phosphors may be mixed. As a specific material of the fluorescent member, for example, a YAG (Yttrium Aluminum Garnet)-based phosphor mixed with yttrium, aluminum, and garnet, and a nitrogen mainly activated by Eu, Cef lanthanide can be used. A compound-based phosphor or an oxynitride-based phosphor. <Metal Wire> The metal wire w is a conductive wire for electrically connecting the electronic component such as the light-emitting element 2 or the protective element 5 described below to the positive electrode 3, the negative electrode 4, and the relay wiring portion 8. As a material of the metal wire w, an Au,

Cu(銅）、Pt(始）、A1(紹）等金屬及該等之合金者特佳為使 料熱率等優異之Au。再者，金屬線W之直徑並無特別限 定，可根據目的及用途而適當選擇。 此處，如圖2所*，金屬線w與正極3、負極4及中繼配 線部8之連接部分係由反光樹脂6覆蓋。因此，如上所述， 即便於使用易於吸收光之Au作為構成金屬㈣之材料之情 形時，自發光元件2出射之光亦不會被金屬線W而由反光 樹脂6反射。因此，可減輕出射光之損耗，可使發光裝置 155454.doc -22· 201203632 101之光之提取效率提高。進而，藉由利用反光樹脂6覆蓋 金屬線W與正極3、負極4及中繼配線部8之連接部分，可 保護該金屬線W免於受塵垢、水分、外力等之影響。 <保護元件> 保濩元件5係作為用以保護包含複數個發光元件2之發光 • 冑2〇遠離由施加過大之電壓所引起之元件損壞或性能劣化 的元件而形成。如圖2所示，保護元件5係配置於正極3之 配線部3b之一端部，並藉由金屬線而與負極4之配線部仆 之4。卩連接但疋，保護元件5亦可配置於負極4之配線 P4b之知#，並藉由金屬線而與正極3之配線部3b之一 端部連接。 具體而言，保護元件5係由若施加規定電壓以上之電壓 則成為通電狀態之齊納二極體（Zener Di〇de)而構成。雖然 省略了圖不，但保護元件5係與上述發光元件2同樣地具有 P電極與η電極之半導體元件，其以相對於發光元件〜電 極2Α與η電極2Β成為反向並聯之方式，藉由金屬線w而與 負極4之配線部4b電性連接。再者，於埋設有保護元件5之 部位之附近無法配置發光元件2。因此，如圖2所示，最靠 近保護το件5之第4列第1行之發光元件2係於自埋設有保護 元件5之區域離開之部位藉由金屬線贾而連接。 由於具有該保護元件5，因此即便對正極3與負極4之間 施加過大的電壓且該電壓超過齊納二極體之齊納電壓，亦 可將發光元件2之正負兩電極間保持為齊納電壓，而不會 成為該齊納電壓以上。因此，藉由具備保護元件5，可防 155454.doc •23· 201203632 止正負兩電極間之電壓成為齊納電壓以上，可適當地防止 因施加過大的電壓而產生發光元件2之元件損壞或性能劣 化0 如圖2所示，保護元件5係由反光樹脂6覆蓋。因此，可 保護保護元件5及連接於保護元件5之金屬線w免於受塵 垢、水分、外力等之影響。再者，保護元件5之尺寸並無 特別限定，可根據目的及用途而適當選擇。 [發光裝置之動作] 根據以上所說明之發光裝置1〇1，於已驅動發光裝置1〇1 時’自發光元件2朝所有方向行進之光中，朝上方行進之 光被提取至發光裝置101之上方之外部。又，朝下方或橫 方向等行進之光於基板1之安裝區域13之底面及側面反 射，而被提取至發光裝置101之上方。此時，於基板丨之底 面、即安裝區域la上較佳為包覆有金屬膜，於安裝區域la 之周圍形成有反光樹脂6，因此抑制該部位之光之吸收， 並且藉由金屬膜或反光樹脂6而使光反射，藉此，可高效 地提取來自發光元件2之光。又，發光裝置1〇1可使藉由中 繼配線部8而串聯連接之發光元件2之數量增加，因此可使 肖耗電力相對於固疋之亮度而提高、或者使發光效率相對 於固定之消耗電力而提高。因此，發光裝置1〇1可設定為 適合各種電容及輸出電壓之電源之構成。 [發光裝置之製造方法] 其次，對本發明之第丨實施形態之發光裝置1〇1之製造方 法進行簡單說明。發光裝置1〇1之製造方法包括：基板製 155454.doc • 24- 201203632 作步驟、電鍍步驟、黏晶步驟、打線接合步驟、以及反光 樹脂形成步驟。又，於反光樹脂形成步驟之後，亦可包括 密封構件填充步驟。此處，進而包括保護元件接合步驟。 以下，對各步驟進行說明。再者，發光裝置101之構成如 上所述，故而此處適當省略說明。 <基板製作步驟> 基板製作步驟係製作形成有電鍍用配線之基板1之步 驟。於基板製作步驟中，藉由圖案化成特定之形狀而形成 基板1上之安裝區域la、或成為正極3及負極4之部位。 又’於基板製作步驟中，形成用以藉由電解電鍍而於基板 1上之安裝區域la上形成金屬膜之電鐘用配線。 <電鍍步驟> 電鍍步驟係於形成有上述電鍍配線之基板1上，至少形 成構成正極3、負極4及中繼配線部8之金屬構件之步驟， 較佳為藉由無電解電鍍而形成構成正極3及負極4之金屬構 件’並且於基板1上之安裝區域1&上藉由電解電鍍而形成 金屬膜之步驟。 作為電鍍之具體方法，可列舉：對正極3、負極4及中繼 配線部8與安裝區域la上之金屬膜均進行鍍Aui方法；僅 對正極3、負極4及十繼配線部8進行鍍Au，而不形成安裝 區域la上之金屬膜之方法；對正極3、負極4及中繼配線部 8上進行鍍Au，於安裝區域以上進行鍍八§之方法等。又， 較佳為w於安裝區域la上進行鑛Au或鑛Ag時，於Au或^ 之表面進而形成Ti〇2膜，又，當於安裝區域u上不進行電 155454.doc -25- 201203632 鍍時，直接於基板表面進而形成们〇2膜。 <黏晶步驟> 黏晶步驟係將發光元件2載置於上述金屬膜上之步驟。 黏曰曰步驟中執行如下之步驟：發光元件載置步驟，經由接 口構件而將發光元件2载置於基板^之金屬膜上；以及加 熱步驟，於載置發光元件2之後，對接合構件進行加熱， 使發光元件2接合於基板丨上之金屬膜上。 <保護元件接合步驟> 於"又置有保濩元件之情形時，保護元件接合步驟係將保 濩兀件5载置並接合於上述正極3之配線部扑上之步驟。載 置、接合保護元件5之方法與上述黏晶步驟相@，因此此 處省略說明。 <打線接合步驟> 打線接合步驟係於上述黏晶步驟之後，利用金屬線霸 金屬構件之正極3之配線部3b、與位於發光元件2上部之p 焊墊電極2Aa加以電性連接之步驟。同樣地，打線接合步 驟係利用金屬線W將位於發光元件2上部之⑽塾電極 2Ba、與金屬構件之負極4之配線料加以電性連接之步 驟。進而，於該步驟令，將複數個發光元件2分別經由吨 塾電極整電極2Ba而連接。又，保護元件$血負極 4之電性連接亦只要於該步驟中進行即可。即，利用金屬 線W將保護元件5之„電極與負極4之配線部朴加以連接。 再者’金屬線W之連接方法並無特別限定，只要以通常所 使用之方法進行即可。 155454.doc •26- 201203632 <反光樹脂形成步驟> 反光樹脂形成步驟係於上述打線接合步驟之後，沿著上 述安裝區域1a之周緣，以至少覆蓋配線部3b、4b之一部分 及中繼配線部8之方式形成反光樹脂6之步驟，反光樹脂^ 之形成例如可使用樹脂喷出裝置（圖示省略）進行，該樹脂 喷出裝置係於經固定之基板1之上側，可相對於基板〗在上 下方向或水平方向等上進行移動（可動）者（參照日本專利特 開 2009-182307 號公報）。 <密封構件填充步驟> 密封構件填充步驟係向上述反光樹脂6之内側填充包覆 上述發光元件2及上述金屬膜之透光性之密封構件7的步 驟。即，該步驟係將熔融樹脂注入至包含形成於基板丄上 之反光樹脂6之壁部之内部，其後藉由加熱或光照射等而 使包覆發光元件2、保護元件5、安裝II域la上之金屬膜及 金屬線W等之密封構件7硬化之步驟。 [第2實施形態] 一面參照圖6，一面對第2實施形態之發光裝置1〇3進行 詳細說明。如圖6所示，發光裝置1〇3除設置有兩個中繼配 線部8a、8b，且於安裝區域la内適當地配置有發光元件2 以外，具備與上述第丨實施形態之發光裝置1〇1相同之構 成。因此，對於與上述發光裝置1〇1重複之構成，標註相 同之符號並省略說明。又，發光裝置1〇3之整體構成（圖1} 及發光元件之構成（圖3)與上述發光裝置ιοί相同，因此亦 省略對該等之說明。 y' 155454.doc -27- 201203632 發光裝置103中，設置有兩個中繼配線部，且複數個發 光元件2之一部分被兩個中繼配線部8a、8b夾持而排列。 具體而言，在正極3之配線部3b與中繼配線部8a(以下，有 時稱為第1中繼配線部8a)之間（圖6中，11所示之區域），複 數個發光元件2之p電極2A以朝向作為安裝區域1&之一方向 之左側的方式排列。而且，發光裝置103中，在中繼配線 部（第1中繼配線部）8a與不同於中繼配線部8a之中繼配線部 8b(以下’有時稱為第2中繼配線部8b)之間（圖6中，12所示 之區域）’複數個發光元件2之p電極2 A以朝向作為安裝區 域la之另一方向之右侧的方式排列。進而，發光裝置 中，在中繼配線部（第2中繼配線部）8b與負極4之配線部4b 之間（圖6中’ 13所示之區域），複數個發光元件2之p電極 2 A以朝向作為安裝區域1 a之一方向之左側的方式排列。 即，發光元件2係以如下方式配置：於對圖6進行俯視之 情形時，其方向以第1中繼配線部8a為邊界、進而以第2中 繼配線部8 b為邊界而反轉。 即’於安裝區域1 a上’將配線部3b、4b與中繼配線部相 向之區域11、13各設置一個，且使中繼配線部彼此相向之 區域12之數量增加，藉此於安裝區域1 a内，可使串聯連接 之發光元件之數量增加，進而可使串聯連接之行數增加。 藉由如上述般沿著安裝區域la之周圍，設置複數個中繼 配線部8而非一個，於安裝區域1 a之有限之面積内，可使 串聯連接之發光元件2之數量增加。進而，於安裝區域la 之有限之面積内，可緊密地配置複數個杳光元件2 ,從而 I55454.doc -28 · 201203632 可獲得消耗電力相對於固定之亮度提高之發光裝置、或者 發光效率相對於固定之消耗電力提高之發光裝置。 例如，於在配線部3b與第1中繼配線部8a之間串聯連接 有6個發光元件2之安裝區域13的情形時，在第丨中繼配線 部8a與第2中繼配線部8b之間亦串聯連接有6個發光元件 2進而在第2中繼配線部8 b與配線部4 b之間亦串聯連接有 6個發光元件2，就整個發光裝置而言，串聯連接有18個發 光元件2。即，於如安裝區域1&之一邊方向上串聯連接有χ 個發光元件2之安裝區域1 a之情形時，將中繼配線部之數 量Y(至少具有一個中繼配線部，γ為正整數）與整個發光裝 置中之串聯連接之數量Ζ的關係係由Ζ = χ(γ+1)表示，越 增加中繼配線部之數量γ ’可使整個發光裝置中之串聯連 接之數量Ζ變得越大。藉此，於安裝區域固定之面積内， 可容易地增加串聯連接之發光元件之數量。 [第3實施形態] 一面參照圖7，一面對第3實施形態之發光裝置i 〇4進行 詳細說明。如圖7所示，發光裝置1〇4具備保護元件5及用 以連接保護元件之保護元件配線部9，除發光元件2之排列 狀態及連接於發光元件2之金屬線W之連接狀態以外，與 上述第2實施形態之發光裝置1〇3具備相同之構成。因此， 對於與上述發光裝置101及發光裝置1〇3重複之構成，標註 相同之符號並省略說明。又，發光裝置1Q4之整體構成（圖 1)及發光元件之構成（圖2(b))與上述發光裝置1〇1相同，因 此亦省略對該等之說明。 155454.doc -29· 201203632 發光裝置104係於第2實施形態之發光裝置103中設置保 護元件5而成者。於正極3之配線部3b上形成有包含齊納二 極體之保護元件5，於安裝區域la之周圍，進而於較中繼 配線部8a更外側具備用以將保護元件5與負極4電性連接之 保護元件配線部9 ’藉由金屬線w而將保護元件5與保護元 件配線部9加以連接，進而藉由金屬線w而將保護元件配 線=>卩9與負極4之配線部4b加以連接。藉由如上述般設置保 護元件配線部9，於正極3與負極4在基板上分開之發光裝 置中’可容易地設置保護元件5。 進而，較佳為保護元件5、保護元件配線部9及連接於該 等之金屬線W被光反射性樹脂6覆蓋。藉由該等亦由覆蓋 配線部3b、4b或中繼配線部8a、8b之光反射性樹脂6覆 蓋’可保護該等構件免於受塵垢、水分、外力等之影響。 與正極3、負極4及中繼配線部8a、讣相同，該保護元件 配線部9係由金屬材料形成，亦可由相同之金屬材料形 成，且於製造方法中亦可藉由相同之步驟而設置。 又，保護元件5亦可設置於負極4之配線部仆上，且藉由 金屬線W而將保護元件5與保護元件配線部9加以連接，進 而藉由金屬線w而將保護元件配線部9與正極3之配線部％ 加以連接。進而，亦可將保護元件5設置於保護元件配線 部9上，將正極3與負極4各自之配線部3b、4b之任—者斑 保護元件5加以連接，並將另-者與保護元件配線部9加以 連接。 又 保護元件配線部9亦可僅藉 由金屬線而與配線部 I55454.doc -30· 201203632 4a、4b，保護το件5之任一者連接之區域露出，其他則配 線於基板1之内部。於圖7之情形時，只要藉由金屬線而與 设置於正極3之配線部3b上之保護元件5連接之區域9a、及 藉由金屬線而與負極4之配線部朴連接之區域处的保護元 件配線部9露出即可。 複數個發光元件2如圖7所示，所有發光元件2係以如下 方式排列：p電極2A朝向作為安裝區域la之一方向之上 側、或者η電極2B朝向作為安裝區域1&之另一方向之下 側。相對於設置成發光元件之ρ電極2Α(參照圖2)以朝向安 裝區域la之右側之方式排列的區域丨丨與區域13、及發光元 件之ρ電極2A(參照圖2)以朝向安裝區域u之左側之方式排 列的區域12混合存在之形態之實施形態2之發光裝置1〇3中 的發光元件2之排列’實施形態3之發光裝置1〇4中，將各 發光元件2以於安裝區域la上旋轉90度之狀態排列。於將 複數個發光元件2不僅串聯連接，而且並聯連接之情形 時’較佳為如實施形態2之發光裝置103或實施形態1之發 光裝置101般排列發光元件2，但於不將發光元件2彼此並 聯連接之情形時，可如本實施形態3般排列發光元件2。其 中’在配線部3b、4b與中繼配線部8a、8b之間，將16個發 光元件2中之各8個發光元件2分成兩行進行串聯連接，並 將該兩行進行並聯連接。 [第4實施形態] 一面參照圖8，一面對第4實施形態之發光裝置105進行 詳細說明《如圖8所示，發光裝置105除安裝區域U之形 155454.doc •31- 201203632 狀，配線部3b、4b之形狀，中繼配線部8之形狀以外，具 備與上述第1實施形態之發光裝置101大致相同之構成。因 此’對於與上述發光裝置101重複之構成，標註相同之符 號並省略說明。又，發光裝置105之發光元件之構成（圖3) 與上述發光裝置101相同，因此亦省略對該等之說明。 如圖8所示’發光裝置1 05係將發光裝置1 〇 1中形成為大 致矩形狀之安裝區域la形成為圓形。於該圓形之安裝區域 la中’如圖8所示，在縱方向及橫方向上分別等間隔地排 列有複數個發光元件2。又，如圖8所示’此處，複數個發 光元件2於縱方向上最大配置1〇個，最小配置3個，並且於 橫方向上最大配置14個，最小配置6個，共計配置有11〇 個。又，如圖8所示’正極3及負極4之配線部3b、4b係沿 著該圓形之安裝區域之周圍而形成，立以各自之一端部彼 此鄰接之方式形成。又’如圖8所示，中繼配線部8亦沿著 圓形之安裝區域之周圍而形成。因此，發光元件2係以如 下之狀態排列：發光元件2之p電極與η電極之方向以中繼 配線部8之中央（此處為中央線CL1)為邊界而反轉。 反光樹脂6係於基材1上以包圍形成有發光部2〇之安裝區 域1 a之方式形成為圓狀。又’反光樹脂6係以覆蓋配線部 3b、4b之一部分、保護元件5及連接於該等之金屬線w之 方式形成。再者’符號AM係表示焊墊部3a為正極3之陽極 標記’符號3 0係形成於安裝區域上之金屬膜，符號7〇係用 以識別發光元件2之接合位置之識別標記，符號80係發光 裝置105之溫度測量點’該等亦藉由電鍍等而形成。 155454.doc -32· 201203632 具備此種構成之發光裝置105中，沿著圓形之安裝區域 la之周圍形成正極3及負極4之配線部3b、4b，且經由中繼 配線部8而將中央線CL 1之左右之發光元件2串聯連接，使 配線部3b、4b之一端部鄰接而形成，藉此即便於如發光裝 置105般將複數個發光元件2配置在基板丨上之圓形之安裝 區域1 a上之情形時’亦可將上述保護元件5配置於適當之 位置。因此’發光裝置105可防止正負兩電極間之電壓成 為齊納電壓以上’可適當地防止因施加過大之電壓而產生 發光元件2之元件損壞或性能劣化。 關於以上所說明之貫施形態1〜3之發光裝置，亦可將實 施形態3中之發光元件2之排列應用於實施形態1或2之發光 裝置’亦可將實施形態1或2中之發光元件2之排列應用於 實施形態3之發光裝置。又，亦可將實施形態3中之保護元 件配線部9應用於實施形態2之發光裝置。藉由用以實施發 明之形態對本發明之發光裝置進行了具體說明，但本發明 之主旨並不限定於該等記載，必需根據申請專利範圍之記 載而廣泛地解釋。又，根據該等記載進行各種變更、改變 等而成者當然亦包含於本發明之主旨内。 【圖式簡單說明】 圖1係表示本發明之實施形態之發光裝置之整體構成的 立體圖； 圖2係表示發明之第丨實施形態之發光裝置之構成的正視 圖； 圖3係表示第1實施形態之發光元件之構成的放大正視 155454.doc -33· 201203632 圖； 圖4係表示第1實施形態之發光裝置之構成的側視圖； 圖5係表示本發明之第1實施形態之另一發光裝置之構成 的正視圖； 圖6係表示本發明之第2實施形態之發光裝置之構成的正 視圖； 圖7係表示本發明之第3實施形態之發光裝置之構成的正 視圖；及 圖8係表示本發明之第4實施形態之發光裝置之構成的正 視圆。 【主要元件符號說明】 1 基板 la 安裝區域 2 發光元件 2A P電極 2 Aa P焊墊電極 2Ab、2Bb 延伸導電部 2B η電極 2Ba η焊墊電極 3 正極 3a、4a 焊墊部 3b、4b 配線部 4 負極 5 保護元件 155454.doc . 34 - 201203632 6 反光樹脂 7 密封構件 8、8a、8b 中繼配線部 9 保護元件配線部 9a、9b、11、12、13 區域 20 發光部 30 金屬膜 70 識別標記 80 溫度測量點 101 、 102 、 103 、 104 、 發光裝置 105 AM 陽極標記 CL1 中央線 CM 陰極標記 Vf 順向壓降 w .金屬線 155454.doc ·35-Metals such as Cu (copper), Pt (starting), and A1 (Sau), and the alloys thereof are particularly excellent in Au such as heat rate. Further, the diameter of the metal wire W is not particularly limited and may be appropriately selected depending on the purpose and use. Here, as shown in Fig. 2, the connection portion between the metal wire w and the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 is covered with the reflective resin 6. Therefore, as described above, even when it is easy to use Au which is easy to absorb light as the material constituting the metal (4), the light emitted from the light-emitting element 2 is not reflected by the light-reflecting resin 6 by the metal wire W. Therefore, the loss of the emitted light can be alleviated, and the extraction efficiency of the light of the light-emitting device can be improved by 155454.doc -22·201203632 101. Further, by covering the connection portion of the metal wire W with the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 by the reflective resin 6, the metal wire W can be protected from dust, moisture, external force, and the like. <Protection Element> The protection element 5 is formed as an element for protecting the light-emitting element including the plurality of light-emitting elements 2 from the element damage or performance deterioration caused by the application of an excessive voltage. As shown in Fig. 2, the protective element 5 is disposed at one end of the wiring portion 3b of the positive electrode 3, and is wired to the wiring portion of the negative electrode 4 by a metal wire. However, the protective element 5 may be disposed on the wiring P4b of the negative electrode 4, and connected to one end of the wiring portion 3b of the positive electrode 3 by a metal wire. Specifically, the protective element 5 is constituted by a Zener diode that is energized when a voltage equal to or higher than a predetermined voltage is applied. Although the illustration is omitted, the protective element 5 is a semiconductor element having a P electrode and an n-electrode in the same manner as the above-described light-emitting element 2, and is connected in anti-parallel with respect to the light-emitting element to electrode 2 and the n-electrode 2 The metal wire w is electrically connected to the wiring portion 4b of the negative electrode 4. Further, the light-emitting element 2 cannot be disposed in the vicinity of the portion where the protective element 5 is buried. Therefore, as shown in Fig. 2, the light-emitting elements 2 of the fourth row of the fourth row closest to the protective member 5 are connected by a metal wire at a portion away from the region where the protective element 5 is buried. Since the protective element 5 is provided, even if an excessive voltage is applied between the positive electrode 3 and the negative electrode 4 and the voltage exceeds the Zener voltage of the Zener diode, the positive and negative electrodes of the light-emitting element 2 can be maintained as Zener. The voltage does not become above the Zener voltage. Therefore, by providing the protective element 5, it is possible to prevent the voltage between the positive and negative electrodes from becoming equal to or higher than the Zener voltage, and it is possible to appropriately prevent the component damage or performance of the light-emitting element 2 from being generated by applying an excessive voltage. Deterioration 0 As shown in FIG. 2, the protective member 5 is covered by the reflective resin 6. Therefore, the protective element 5 and the metal wire w connected to the protective element 5 can be protected from dust, moisture, external force and the like. Further, the size of the protective member 5 is not particularly limited and may be appropriately selected depending on the purpose and use. [Operation of Light Emitting Device] According to the light emitting device 1〇1 described above, in the light traveling from the light emitting element 2 in all directions when the light emitting device 1〇1 is driven, light traveling upward is extracted to the light emitting device 101. The outside of it. Further, light traveling downward or in the lateral direction is reflected on the bottom surface and the side surface of the mounting region 13 of the substrate 1, and is extracted above the light-emitting device 101. In this case, the bottom surface of the substrate 、, that is, the mounting region 1a is preferably coated with a metal film, and the reflective resin 6 is formed around the mounting region 1a. Therefore, absorption of light at the portion is suppressed, and the metal film or The light reflecting resin 6 reflects the light, whereby the light from the light-emitting element 2 can be efficiently extracted. Further, in the light-emitting device 1A1, the number of the light-emitting elements 2 connected in series by the relay wiring portion 8 can be increased, so that the power consumption of the chirp can be increased with respect to the brightness of the solid or the luminous efficiency can be relatively fixed. Increase power consumption. Therefore, the light-emitting device 101 can be configured to be a power source suitable for various capacitors and output voltages. [Method of Manufacturing Light-Emitting Device] Next, a method of manufacturing the light-emitting device 1A according to the embodiment of the present invention will be briefly described. The manufacturing method of the light-emitting device 101 includes: a substrate 155454.doc • 24-201203632 as a step, a plating step, a die bonding step, a wire bonding step, and a reflective resin forming step. Further, after the step of forming the reflective resin, a sealing member filling step may be included. Here, a protective element joining step is further included. Hereinafter, each step will be described. Incidentally, since the configuration of the light-emitting device 101 is as described above, the description thereof will be omitted as appropriate. <Substrate Production Step> The substrate fabrication step is a step of fabricating the substrate 1 on which the plating wiring is formed. In the substrate fabrication step, the mounting region la on the substrate 1 or the portions of the positive electrode 3 and the negative electrode 4 are formed by patterning into a specific shape. Further, in the substrate forming step, wiring for electric clock for forming a metal film on the mounting region 1a on the substrate 1 by electrolytic plating is formed. <Electroplating Step> The electroplating step is a step of forming at least a metal member constituting the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 on the substrate 1 on which the plating wiring is formed, and is preferably formed by electroless plating. The metal member constituting the positive electrode 3 and the negative electrode 4 is formed on the mounting region 1& on the substrate 1 by electrolytic plating to form a metal film. As a specific method of electroplating, the Aui method is applied to the positive electrode 3, the negative electrode 4, the relay wiring portion 8, and the metal film on the mounting region 1a; only the positive electrode 3, the negative electrode 4, and the ten-step wiring portion 8 are plated. Au, a method of forming a metal film on the mounting region la; a method of plating Au on the positive electrode 3, the negative electrode 4, and the relay wiring portion 8, and performing plating on the mounting region or the like. Further, it is preferable that when the mineral Au or the mineral Ag is carried out on the mounting region la, the Ti〇2 film is further formed on the surface of the Au or the ^, and when the electricity is not applied to the mounting region u, 155454.doc -25 - 201203632 When plating, the film is formed directly on the surface of the substrate. <Macking Step> The die bonding step is a step of placing the light-emitting element 2 on the above metal film. In the bonding step, the following steps are performed: a light-emitting element mounting step of placing the light-emitting element 2 on the metal film of the substrate via the interface member; and a heating step of performing the bonding member after the light-emitting element 2 is placed Heating, the light-emitting element 2 is bonded to the metal film on the substrate. <Protection element bonding step> In the case where the protection element is further provided, the protection element bonding step is a step of placing and bonding the protective member 5 to the wiring portion of the positive electrode 3. The method of mounting and bonding the protective element 5 is in phase with the above-described die bonding step, and therefore the description is omitted here. <Wire bonding step> The wire bonding step is a step of electrically connecting the wiring portion 3b of the positive electrode 3 of the metal wire metal member to the p pad electrode 2Aa located at the upper portion of the light emitting element 2 after the above-described die bonding step . Similarly, the wire bonding step is a step of electrically connecting the (10) germanium electrode 2Ba located on the upper portion of the light-emitting element 2 and the wiring material of the negative electrode 4 of the metal member by the metal wire W. Further, in this step, a plurality of light-emitting elements 2 are connected via the tom-electrode whole electrode 2Ba. Further, the electrical connection of the protective element $ blood negative electrode 4 is also required to be carried out in this step. In other words, the wiring of the protective element 5 and the wiring portion of the negative electrode 4 are connected by a metal wire W. The method of connecting the metal wire W is not particularly limited, and may be carried out by a method generally used. Doc • 26-201203632 <Reflective resin forming step> The reflective resin forming step is followed by the above-described wire bonding step, covering at least one of the wiring portions 3b, 4b and the relay wiring portion 8 along the periphery of the mounting region 1a. The step of forming the reflective resin 6 is carried out, and the formation of the reflective resin can be carried out, for example, by using a resin discharge device (not shown) which is attached to the upper side of the fixed substrate 1 and can be positioned above and below the substrate. In the case of moving or moving in the direction or the horizontal direction (refer to Japanese Laid-Open Patent Publication No. 2009-182307). < Sealing member filling step> The sealing member filling step is to fill the inside of the above-mentioned reflective resin 6 to coat the above-mentioned illuminating a step of the light-transmitting sealing member 7 of the element 2 and the above metal film, that is, the step of injecting the molten resin into the substrate comprising the substrate The inside of the wall portion of the reflective resin 6, and thereafter the step of hardening the sealing member 7 such as the coated light-emitting element 2, the protective element 5, the metal film on the Mount II field la, and the metal wire W by heating or light irradiation or the like [Second Embodiment] A light-emitting device 1A3 according to a second embodiment will be described in detail with reference to Fig. 6. As shown in Fig. 6, the light-emitting device 1A3 is provided with two relay wiring portions 8a. In addition to the light-emitting device 2 disposed in the mounting region 1a, the configuration is the same as that of the light-emitting device 1A1 of the above-described first embodiment. Therefore, the configuration overlapping with the above-described light-emitting device 1〇1 is marked. The same reference numerals are given to omit the description. Further, the overall configuration of the light-emitting device 1〇3 (Fig. 1} and the configuration of the light-emitting elements (Fig. 3) are the same as those of the above-described light-emitting device ιοί, and therefore the description thereof is omitted. y' 155454. Doc -27-201203632 In the light-emitting device 103, two relay wiring portions are provided, and one of the plurality of light-emitting elements 2 is partially sandwiched by the two relay wiring portions 8a and 8b. Specifically, the positive electrode 3 is arranged. Wiring portion 3b and relay wiring portion 8a (in Between the first relay wiring portions 8a) (regions indicated by 11 in Fig. 6), the p-electrodes 2A of the plurality of light-emitting elements 2 are oriented toward the left side of one of the mounting regions 1 & In the light-emitting device 103, the relay wiring portion (first relay wiring portion) 8a and the relay wiring portion 8b different from the relay wiring portion 8a (hereinafter referred to as the second relay wiring portion) 8b) (the area shown by 12 in Fig. 6) 'The p electrodes 2 A of the plurality of light-emitting elements 2 are arranged so as to face the right side of the other direction as the mounting area la. Further, in the light-emitting device, Between the relay wiring portion (second relay wiring portion) 8b and the wiring portion 4b of the negative electrode 4 (the region indicated by '13 in FIG. 6), the p-electrode 2 A of the plurality of light-emitting elements 2 is oriented as the mounting region 1 a is arranged in the direction of the left side of one direction. In other words, when the light-emitting element 2 is placed in a plan view, the direction is reversed by the first relay wiring portion 8a and the second relay wiring portion 8b as a boundary. That is, 'on the mounting area 1a', each of the areas 11 and 13 facing the wiring portions 3b and 4b and the relay wiring portion is provided one by one, and the number of the regions 12 in which the relay wiring portions face each other is increased, whereby the mounting area is increased. Within 1 a, the number of light-emitting elements connected in series can be increased, and the number of rows connected in series can be increased. By providing a plurality of relay wiring portions 8 instead of one along the circumference of the mounting region la as described above, the number of the light-emitting elements 2 connected in series can be increased within a limited area of the mounting region 1a. Further, in a limited area of the mounting area la, a plurality of light-emitting elements 2 can be closely arranged, so that I55454.doc -28 · 201203632 can obtain a light-emitting device with increased power consumption with respect to a fixed brightness, or luminous efficiency relative to A fixed light-emitting device that consumes more power. For example, when the mounting regions 13 of the six light-emitting elements 2 are connected in series between the wiring portion 3b and the first relay wiring portion 8a, the second relay wiring portion 8a and the second relay wiring portion 8b are Six light-emitting elements 2 are connected in series, and six light-emitting elements 2 are connected in series between the second relay wiring portion 8b and the wiring portion 4b, and 18 light-emitting devices are connected in series for the entire light-emitting device. Element 2. In other words, when the mounting region 1a of the plurality of light-emitting elements 2 is connected in series in the direction of one side of the mounting region 1&, the number Y of the relay wiring portions (having at least one relay wiring portion, γ is a positive integer) The relationship with the number 串联 of the series connection in the entire illuminating device is represented by Ζ = χ (γ + 1), and the more the number of the relay wiring portions γ ' increases the number of series connections in the entire illuminating device becomes The bigger. Thereby, the number of light-emitting elements connected in series can be easily increased within the area where the mounting area is fixed. [Third Embodiment] A light-emitting device i 〇 4 according to a third embodiment will be described in detail with reference to Fig. 7 . As shown in FIG. 7, the light-emitting device 1A4 is provided with a protective element 5 and a protective element wiring portion 9 for connecting the protective element, except for the arrangement state of the light-emitting element 2 and the connection state of the metal wire W connected to the light-emitting element 2. The light-emitting device 1A3 of the second embodiment described above has the same configuration. Therefore, the same components as those of the above-described light-emitting device 101 and light-emitting device 1A3 are denoted by the same reference numerals, and their description will be omitted. Further, the overall configuration of the light-emitting device 1Q4 (Fig. 1) and the configuration of the light-emitting element (Fig. 2(b)) are the same as those of the above-described light-emitting device 1〇1, and therefore the description thereof will be omitted. 155454.doc -29·201203632 The light-emitting device 104 is a structure in which the protective element 5 is provided in the light-emitting device 103 of the second embodiment. A protective element 5 including a Zener diode is formed on the wiring portion 3b of the positive electrode 3, and is provided around the mounting region la and further outside the relay wiring portion 8a for electrically connecting the protective element 5 and the negative electrode 4. The connected protective element wiring portion 9' connects the protective element 5 and the protective element wiring portion 9 by the metal wire w, and further the protective element wiring => 卩9 and the wiring portion 4b of the negative electrode 4 by the metal wire w Connect. By providing the protective element wiring portion 9 as described above, the protective member 5 can be easily disposed in the light-emitting device in which the positive electrode 3 and the negative electrode 4 are separated from each other on the substrate. Further, it is preferable that the protective element 5, the protective element wiring portion 9, and the metal wires W connected thereto are covered with the light reflective resin 6. By covering the light-reflective resin 6 covering the wiring portions 3b and 4b or the relay wiring portions 8a and 8b, the members can be protected from dust, moisture, external force, and the like. Similarly to the positive electrode 3, the negative electrode 4, and the relay wiring portions 8a and 讣, the protective element wiring portion 9 is formed of a metal material or may be formed of the same metal material, and may be provided by the same steps in the manufacturing method. . Further, the protective element 5 may be provided on the wiring portion of the negative electrode 4, and the protective element 5 and the protective element wiring portion 9 are connected by the metal wire W, and the protective element wiring portion 9 is further provided by the metal wire w. It is connected to the wiring portion % of the positive electrode 3. Further, the protective element 5 may be provided on the protective element wiring portion 9, and the contact portion 5 of each of the wiring portions 3b and 4b of the positive electrode 3 and the negative electrode 4 may be connected, and the other and the protective element wiring may be connected. Part 9 is connected. Further, the protective element wiring portion 9 may be exposed only to the wiring portion I55454.doc -30·201203632 4a, 4b, and the region where the protection member 5 is connected by the metal wire, and the other may be wired inside the substrate 1. In the case of FIG. 7, the region 9a which is connected to the protective element 5 provided on the wiring portion 3b of the positive electrode 3 by a metal wire, and the region which is connected to the wiring portion of the negative electrode 4 by a metal wire are used. The protective element wiring portion 9 may be exposed. As shown in FIG. 7, a plurality of light-emitting elements 2 are arranged in such a manner that the p-electrode 2A faces the upper side as one of the mounting areas 1a, or the n-electrode 2B faces the other direction as the mounting area 1& Lower side. The region 丨丨 and the region 13 and the ρ electrode 2A (see FIG. 2) of the light-emitting element are arranged to face the mounting region u with respect to the ρ electrode 2A (see FIG. 2) provided as a light-emitting element, so as to face the right side of the mounting region 1a. The arrangement of the light-emitting elements 2 in the light-emitting device 1〇3 of the second embodiment in which the regions 12 arranged on the left side are mixed. In the light-emitting device 1〇4 of the third embodiment, the light-emitting elements 2 are placed in the mounting area. The state of la is rotated by 90 degrees. When a plurality of light-emitting elements 2 are connected not only in series but also in parallel, it is preferable to arrange the light-emitting elements 2 as in the light-emitting device 103 of the second embodiment or the light-emitting device 101 of the first embodiment, but the light-emitting elements 2 are not provided. When the electrodes are connected in parallel, the light-emitting elements 2 can be arranged as in the third embodiment. Here, between the wiring portions 3b and 4b and the relay wiring portions 8a and 8b, eight of the sixteen light-emitting elements 2 are connected in series in two rows, and the two rows are connected in parallel. [Fourth Embodiment] A light-emitting device 105 according to a fourth embodiment will be described in detail with reference to Fig. 8. "As shown in Fig. 8, the light-emitting device 105 has a shape of 155454.doc • 31 - 201203632 in addition to the mounting area U. The shape of the wiring portions 3b and 4b and the shape of the relay wiring portion 8 have substantially the same configuration as that of the light-emitting device 101 of the first embodiment. Therefore, the same components as those of the above-described light-emitting device 101 will be denoted by the same reference numerals and will not be described. Further, the configuration of the light-emitting elements of the light-emitting device 105 (FIG. 3) is the same as that of the above-described light-emitting device 101, and therefore the description thereof will be omitted. As shown in Fig. 8, the light-emitting device 015 is formed in a circular shape in a mounting region la formed in a substantially rectangular shape in the light-emitting device 1 〇 1. As shown in Fig. 8, in the circular mounting region la, a plurality of light-emitting elements 2 are arranged at equal intervals in the longitudinal direction and the lateral direction. Further, as shown in FIG. 8 , here, a plurality of light-emitting elements 2 are arranged at a maximum of one in the longitudinal direction, three are arranged at a minimum, and a maximum of four are arranged in the lateral direction, and a minimum of six are arranged, and a total of 11 are arranged. One. Further, as shown in Fig. 8, the wiring portions 3b and 4b of the positive electrode 3 and the negative electrode 4 are formed along the circumference of the circular mounting region, and are formed so that one end portion thereof is adjacent to each other. Further, as shown in Fig. 8, the relay wiring portion 8 is also formed along the circumference of the circular mounting region. Therefore, the light-emitting elements 2 are arranged in such a manner that the directions of the p-electrode and the n-electrode of the light-emitting element 2 are reversed at the center of the relay wiring portion 8 (here, the center line CL1). The reflective resin 6 is formed in a circular shape so as to surround the mounting region 1a in which the light-emitting portion 2 is formed on the substrate 1. Further, the reflective resin 6 is formed to cover one of the wiring portions 3b and 4b, the protective element 5, and the metal wire w connected thereto. Further, the symbol AM indicates that the pad portion 3a is the anode mark of the positive electrode 3, the symbol 30 is a metal film formed on the mounting region, and the symbol 7 is an identification mark for identifying the bonding position of the light-emitting element 2, symbol 80 The temperature measuring point of the light-emitting device 105 is also formed by plating or the like. 155454.doc -32·201203632 In the light-emitting device 105 having such a configuration, the wiring portions 3b and 4b of the positive electrode 3 and the negative electrode 4 are formed along the circumference of the circular mounting region la, and the center is formed via the relay wiring portion 8. The light-emitting elements 2 on the left and right of the line CL 1 are connected in series, and one end portions of the wiring portions 3b and 4b are formed adjacent to each other, whereby even a plurality of light-emitting elements 2 are arranged in a circular shape on the substrate 如 as in the light-emitting device 105. In the case of the area 1a, the protective element 5 may be disposed at an appropriate position. Therefore, the 'light-emitting device 105 can prevent the voltage between the positive and negative electrodes from becoming equal to or higher than the Zener voltage'. It is possible to appropriately prevent the element of the light-emitting element 2 from being damaged or degraded due to the application of an excessive voltage. In the light-emitting device of the above-described embodiments 1 to 3, the arrangement of the light-emitting elements 2 in the third embodiment can be applied to the light-emitting device of the first or second embodiment, or the light-emitting device of the first or second embodiment can be used. The arrangement of the elements 2 is applied to the light-emitting device of the third embodiment. Further, the protective element wiring portion 9 of the third embodiment can be applied to the light-emitting device of the second embodiment. The illuminating device of the present invention has been specifically described by the embodiment for carrying out the invention, but the gist of the present invention is not limited to the description, and it is necessary to explain it broadly in accordance with the scope of the patent application. It is a matter of course that various changes, modifications, and the like are included in the description of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an overall configuration of a light-emitting device according to an embodiment of the present invention; FIG. 2 is a front view showing a configuration of a light-emitting device according to a third embodiment of the present invention; and FIG. 3 is a first embodiment; FIG. 4 is a side view showing the configuration of the light-emitting device of the first embodiment; FIG. 5 is another light-emitting device according to the first embodiment of the present invention; FIG. 5 is a side view showing a configuration of a light-emitting device according to the first embodiment; 6 is a front elevational view showing a configuration of a light-emitting device according to a second embodiment of the present invention; and FIG. 7 is a front view showing a configuration of a light-emitting device according to a third embodiment of the present invention; and FIG. A front view circle showing a configuration of a light-emitting device according to a fourth embodiment of the present invention. [Description of main components] 1 Substrate la Mounting area 2 Light-emitting element 2A P-electrode 2 Aa P Pad electrode 2Ab, 2Bb Extended conductive portion 2B η electrode 2Ba η Pad electrode 3 Positive electrode 3a, 4a Solder pad portion 3b, 4b Wiring portion 4 Negative electrode 5 Protective element 155454.doc . 34 - 201203632 6 Reflective resin 7 Sealing member 8, 8a, 8b Relay wiring portion 9 Protective element wiring portion 9a, 9b, 11, 12, 13 Area 20 Light-emitting portion 30 Metal film 70 Identification Mark 80 Temperature measurement points 101, 102, 103, 104, illuminator 105 AM Anode mark CL1 Center line CM Cathode mark Vf Forward voltage drop w. Metal line 155454.doc · 35-

Claims (1)

201203632 七、申請專利範圍： l 一種發光裝置，其特徵在於：其包括 基板； 發光部，其包含配置於上述基板上之安裝區域中之複 . 數個發光元件； 正極及負極，該等分別具有焊墊部與配線部，並經由 該配線部而對上述發光部施加電壓；以及 反光樹脂，其以至少覆蓋上述配線部之方式形成於上 述基板上；且 沿著上述安裝區域之周圍形成有中繼配線部， 上述中繼配線部被上述反光樹脂覆蓋。 2_如請求項1之發光裝置，其中 上述複數個發光元件分別具備形成於一側之0電極' 及形成於另一側之η電極， 上述複數個發光元件包含相對於上述中繼配線部而與 上述ρ電極連接之發光元件、及與上述極連接之發光 元件。 3.如請求項1或2之發光裝置，其中 . 於上述正極之配線部與上述中繼配線部之間，上述ρ 電極以相對於上述安裝區域朝向一方向之方式排列， 於上述負極之配線部與上述中繼配線部之間，上述ρ 電極以相對於上述安裝區域朝向另一方向之方式排列。 4 ·如凊求項1或2之發光裝置，其具有複數個上述中繼配線 部，且上述複數個發光元件之一部分排列於兩個上述中 155454.doc 201203632 繼配線部之間而成。 5. 如清求項1至4中任一項之發光步署，甘士匕 $ f尤衷罝其中上述複數個發 光元件係藉由金屬線而彼此串聯及並聯地電性連接。 6. 如請求項1至5中任-項之發光裝置，其中上述反射性樹 脂係以包圍上述安裝區域之周圍之方式形成。 7·如請求項1至6中任一項之發光裝置，其中於上述安裝區 域上形成有金屬膜，並經由該金屬膜而配置有上述複數 個發光元件。 8.如請求項7之發光裝置，其中上述反光樹脂係以覆蓋上 述戈*裝區域之周緣之一部分之方式形成。 155454.doc201203632 VII. Patent application scope: l A light-emitting device, comprising: a substrate; a light-emitting portion comprising a plurality of light-emitting elements disposed in a mounting area on the substrate; a positive electrode and a negative electrode, respectively a pad portion and a wiring portion, wherein a voltage is applied to the light-emitting portion via the wiring portion; and a reflective resin formed on the substrate so as to cover at least the wiring portion; and a middle portion is formed along the periphery of the mounting region The relay wiring portion is covered by the reflective resin in accordance with the wiring portion. The light-emitting device of claim 1, wherein the plurality of light-emitting elements each include an ITO electrode formed on one side and an η electrode formed on the other side, and the plurality of light-emitting elements include the relay wiring portion a light-emitting element connected to the ρ electrode and a light-emitting element connected to the pole. 3. The light-emitting device according to claim 1 or 2, wherein the ρ electrode is arranged in a direction with respect to the mounting region between the wiring portion of the positive electrode and the relay wiring portion, and the wiring of the negative electrode Between the portion and the relay wiring portion, the ρ electrodes are arranged to face the other direction with respect to the mounting region. A light-emitting device according to claim 1 or 2, which has a plurality of said relay wiring portions, and one of said plurality of light-emitting elements is partially arranged between two of said wiring portions 155454.doc 201203632. 5. The illumination unit of any one of items 1 to 4, wherein the plurality of light-emitting elements are electrically connected in series and in parallel to each other by a metal wire. 6. The illuminating device of any one of clauses 1 to 5, wherein the reflective resin is formed to surround the periphery of the mounting area. The light-emitting device according to any one of claims 1 to 6, wherein a metal film is formed on the mounting region, and the plurality of light-emitting elements are disposed via the metal film. 8. The light-emitting device of claim 7, wherein the reflective resin is formed to cover a portion of a periphery of the above-mentioned region. 155454.doc
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