201200995 六、發明說明： 【發明所屬之技術領域】 一種筆記型電腦，特別有關於一種具有易更換散熱模組之筆 記型電腦。 【先前技術】 隨著科技的快速發展，電子元件的體積逐漸的縮小，使得電 子產品的體積也變的輕薄短小。由於電子元件的製程縮小化，電 子元件在運作的同時，也連帶著產生高溫。一般而言，電子元件 均有一定的工作溫度。當工作溫度過高時，輕者將造成電子裝置 的運行失敗，重者將損害電子元件的壽命。 為能降低電子元件工作時的溫度，所以廠商多會在電子元件 上設置散熱裝置。筆記型電腦的主機板為例。通常主機板具有中 央處理單元、南橋晶片、北橋晶片、顯示晶片與記憶體等電子元 件。由於筆記型電腦_部空間有限，所以為能達騎上述電子 元件進行降溫的目的。f知技術多採轉合式的散触置。換言 之，係將散熱裝置的導熱板分別連接於中央處理器、南橋晶片、 示晶片上’並透過導鮮將各電子树的廢熱傳導 但由於中她IH__祕均研， 蝴娜⑽物目_隸置^ 來，虽中央處理器的提供商又開發新的處 除此 觸的開發廠商只能重新對不_處理器郎新的散 201200995 之外’由於習知的散絲置的結構，使得散缝置盈 筆記型電腦的背板的狀況下進行更換。 仕不開啟 【發明内容】 具有易更 的筆記型 蓉於以上的問題，本發明的主要目的在於提供一種 換散熱模組之筆記型電腦，可細於不同種類處理晶片 電腦。 為達上述目的，本發明所揭露之具有易更換散熱模組之201200995 VI. Description of the Invention: [Technical Field of the Invention] A notebook computer, in particular, relates to a notebook computer having an easily replaceable heat dissipation module. [Prior Art] With the rapid development of technology, the volume of electronic components has gradually decreased, making the volume of electronic products lighter and shorter. Due to the downsizing of the electronic components, the electronic components are operated together with high temperatures. In general, electronic components have a certain operating temperature. When the operating temperature is too high, the lighter will cause the operation of the electronic device to fail, and the heavy one will damage the life of the electronic component. In order to reduce the temperature during operation of electronic components, manufacturers often place heat sinks on electronic components. Take the motherboard of the notebook as an example. Usually, the motherboard has electronic components such as a central processing unit, a south bridge chip, a north bridge chip, a display chip, and a memory. Due to the limited space of the notebook computer, it is possible to cool down the above-mentioned electronic components. F knows that the technology is more suitable for the transposition of the touch. In other words, the heat-conducting plates of the heat-dissipating device are respectively connected to the central processing unit, the south bridge wafer, and the display wafer, and the waste heat of each electronic tree is transmitted through the fresh-storage, but because of her IH__ secret research, the butterfly (10) objects _ Lieutenant ^, although the central processor's provider has developed a new one, except for the developer of this touch, can only re-do the _ processor lang new scatter 201200995 'because of the structure of the conventional loose wire Replace the slotted notebook computer's back panel. The invention is not limited to the above. In view of the above problems, the main object of the present invention is to provide a notebook computer with a heat-removing module that can handle wafer computers in different types. In order to achieve the above object, the present invention discloses an easy-to-replace heat dissipation module.
型電腦包括第一殼體、主機板、第一今妓 敗第散熱模組、第二散熱模組盘 第二殼體。主機板配置於第—殼體並具有第-晶片及第二晶/;、 第-散熱模組包含第-導熱板、第—熱管及散熱鰭片；第二料 板係接觸第-晶片’並將第—晶片之歸麟—熱管料至散熱 鰭片；第二散熱模組包含第二導熱板、第二熱管及散熱板；第二 導熱板係接觸第二晶片，並將第二晶片之熱量藉第二熱管傳導至 散熱板，散熱板係接觸散熱.鳍片；在第二殼體上具有—開口；第 二殼體覆蓋於主機板與第—殼體；開口係對應第二散熱模組，開 口面積大於第—散熱模組’使得第二散熱模組可以通過開口將 第二散熱模組設置於主機板上。 本發明的模組化散熱裝置可以應用在不同處理晶片的筆記型 電腦中1發廠商可崎财同的巾央處理單元與處理晶片分別 替換相應的散熱結構。如此—來，可以降低同時符合中央處理單 元與處理晶片的散熱裝置的製造成本。 有關本發明的特徵與實作，茲配合圖示作最佳實施例詳細說 5 201200995 明如下。 【實施方式】 請參考「第1圖」所示’其係為本發明之散熱裝置爆炸圖示 意圖。本發明的筆記型電腦具有顯示單元(未繪示)與本體2〇〇。筆 記型電腦可以是小型移動個人電腦、平 板電腦(Tablet)、電子書_n科，但本發明不僅限於此。 本體200包括第-殼體21〇、主機板22()、第一散熱模組 230、第二散熱模組240、第二殼體25〇與背板26〇。主機板22〇 配置於第-殼體210 ’主機板22〇具有第一晶片221及第二晶片 222。第一晶片221可以是中央處理單元與顯示晶片。第二晶片 222是北橋晶片。隨著電子元件的製程微小化，使得電子元件在運 作時會產生高溫。由於f子元件有工作溫度的關，若是持續處 於高溫狀態下將使得電子元件毀損，進而影響筆記型電腦的運作。 第散熱模組230包含第一導熱板231、第一熱管232及散熱 鰭片233。第一熱管232的二端設置第一導熱板231，另一端設置 散熱鰭片233。第一導熱板231係接觸第一晶片221，並將第一晶 片221之熱量藉第一熱管232傳導至散熱鰭片233。第一熱管232 與透過導熱膠固合散熱鰭片233。第一熱管232可藉由熱傳導、液 汽態變化及毛細管現象，而將熱量從第一導熱板231端傳導至另 一端(即散熱鰭片233)。由於散熱鰭片233具有較大面積，所以可 以進行快速的散熱。 第二散熱模組240包含第二導熱板24卜第二熱管242及一散 201200995 熱板243。第二熱管242的一端設置第二導熱板241，第二熱管242 的另一端設置散熱板243。第二導熱板241係接觸第二晶片222， 並將第二晶片222之熱量藉第二熱管242傳導至散熱板243。而散 熱板243係接觸散熱鰭片233，其中，散熱板243可以透過扣接、 黏合或疊合的方式與散熱鰭片233接觸。 在第二殼體250中設置一開口 251。開口 251的開口範圍至少 擴及第一晶片221的位置與第二晶片222的位置之間。換言之， 開口之面積大於該第二散熱模組之大小。開口 251係對應第二散 熱模組240以供第二散熱模組24〇藉開口 251置入第一殼體21〇。 主機板220被第二殼體25〇覆蓋與第一殼體21〇之間。 請配合「第1圖」並同時參考「第2圖」至「第6圖」所示， 其係分別為本發明之散熱裝置組合示意圖。首先，將第二散熱模 組240的第二熱管242係沿著開口 251邊緣設置，而散熱板243 破设置於第-殼體21〇的一側邊，請參考「第2圖」所示。 首先請參考「第2 ®」，將第二散熱獅24G ^置於第二晶片 222上接著，當第二殼體25〇覆蓋於主機板220與第一殼體21〇 時’「第二散熱模組24〇係被第4體Μ。所覆蓋(第二散熱模組⑽ 在「第3圖」中的虛線係為局部剖面表示）。由於開口 251的開口 積大於第散熱模組230，所以可以將第一散熱模組23〇置入於 開口 251巾，並與第二散熱模組24〇進行結合。 =參考「第4圖」所示’「第4圖」上方係為第—散熱模組23〇， 其、且裝方式請參考「第4圖」中的虛線8G、82、84。首先第-散 201200995 熱模組230從上方置入。當第一散熱模組23〇置入開口 251時， 需要將散熱鰭片233沿虛線82的方向與散熱板243接合。最後， 將第一散熱模組230沿著虛線84黏合於第一晶片221上，如「第 5圖」所示。 為能使上述的散熱裝置產生更佳的功效，可以在散熱板243 與散熱鰭片233的-側邊設置—風扇㈣，風扇27()的出風口則緊 鄰散熱板243與散熱鰭片说(請配合「第i圖」與「第6圖」所 示）’使得風扇270所吹出的風可以有效率的帶走散熱板243與散 曰片233的廢熱。而散熱板243的表面除了可以是平面外，亦 y以為波浪狀，散熱板243與風經過的面積大大的增加藉以提 焉散熱的效率。:t後，在第二殼體25〇上再覆蓋上—層背板26〇， 則可完成筆記型電腦的本體200的組裝。 “本發月的模組化散熱裝置可以應用在不同處理晶片的筆記变 =中。開發廢商可以替換不同的中央處理單元與處理晶片而不 改散細組結構。如此—來，可以降低啊符合中央處理單 疋與處理晶片的散熱裝置的製造成本。 ^然本伽以前叙較佳實_聽如上，然其並非用以限 :一：任何熟習相像技藝者，在不脫離本發明之精神和範園 本‘:更__ ’因此本發明之專利保護範圍須視 說月每所附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係為本發明之賴裝置爆炸示意圖。 201200995 第2圖係為本發明之散熱裝置之第二散熱模組置入第一殼體 與第二殼體之組合動作一示意圖。 第3圖係為本發明之散熱裝置之第二散熱模組置入第一殼體 與第二殼體之組合動作二示意圖。 第4圖係為本發明之散熱裝置之第一散熱模組與第一殼體之 組合示意圖。 第5圖係為本發明之散熱裝置之第一散熱模組、第一殼體與 第二殼體之組合示意圖。 第6圖係為本發明之散熱裝置之風扇置入第一殼體與第二殼 體之示意圖。 【主要元件符號說明】 散熱裝置100 導熱板110 導熱管120 散熱鰭片130 本體200 第一殼體210 主機板220 第一晶片221 第二晶片222 第一散熱模組230 第一導熱板231 201200995 第一熱管232 散熱鰭片233 第二散熱模組240 第二導熱板241 第二熱管242 散熱板243 第二殼體250 開口 251 背板260 風扇270 虛線 80、82、84The computer includes a first housing, a motherboard, a first heat dissipation module, and a second heat dissipation module disk second housing. The motherboard is disposed on the first housing and has a first wafer and a second wafer. The first heat dissipation module includes a first heat conduction plate, a first heat pipe and a heat dissipation fin, and the second material plate contacts the first wafer. The second heat dissipation plate includes a second heat conduction plate, a second heat pipe and a heat dissipation plate; the second heat conduction plate contacts the second wafer and heats the second wafer The second heat pipe is transmitted to the heat dissipation plate, and the heat dissipation plate is in contact with the heat dissipation fin. The second housing has an opening; the second housing covers the main board and the first housing; and the opening corresponds to the second heat dissipation module. The opening area is larger than the first heat dissipation module, so that the second heat dissipation module can set the second heat dissipation module on the motherboard through the opening. The modular heat dissipating device of the present invention can be applied to notebook computers of different processing wafers, and the corresponding heat dissipating structure is replaced by the processing unit and the processing wafer of the manufacturer. In this way, the manufacturing cost of the heat sink that meets both the central processing unit and the processing wafer can be reduced. The features and implementations of the present invention are described in detail with reference to the preferred embodiments. [Embodiment] Please refer to the "Fig. 1" for the purpose of the explosion diagram of the heat sink of the present invention. The notebook computer of the present invention has a display unit (not shown) and a body 2〇〇. The notebook type computer can be a small mobile personal computer, a tablet computer, or an e-book, but the present invention is not limited thereto. The body 200 includes a first housing 21, a motherboard 22 (), a first heat dissipation module 230, a second heat dissipation module 240, a second housing 25, and a back panel 26A. The motherboard 22 is disposed on the first housing 210'. The motherboard 22 has a first wafer 221 and a second wafer 222. The first wafer 221 can be a central processing unit and a display wafer. The second wafer 222 is a north bridge wafer. As the process of electronic components is miniaturized, high temperatures are generated during operation of the electronic components. Since the f sub-element has a working temperature, if it is continuously at a high temperature, the electronic component will be damaged, thereby affecting the operation of the notebook. The first heat dissipation module 230 includes a first heat conduction plate 231, a first heat pipe 232, and heat dissipation fins 233. The first heat pipe 232 is disposed at the two ends of the first heat pipe 232, and the heat dissipation fins 233 are disposed at the other end. The first heat conducting plate 231 contacts the first wafer 221 and conducts heat of the first wafer 221 to the heat radiating fins 233 through the first heat pipes 232. The first heat pipe 232 and the heat dissipation fin 233 are fixed by the heat conductive adhesive. The first heat pipe 232 conducts heat from the end of the first heat conducting plate 231 to the other end (i.e., the heat radiating fins 233) by heat conduction, liquid vapor state change, and capillary action. Since the heat radiating fins 233 have a large area, rapid heat dissipation can be performed. The second heat dissipation module 240 includes a second heat conduction plate 24, a second heat pipe 242, and a dispersion 201200995 hot plate 243. One end of the second heat pipe 242 is provided with a second heat conducting plate 241, and the other end of the second heat pipe 242 is provided with a heat radiating plate 243. The second heat conducting plate 241 contacts the second wafer 222 and conducts heat of the second wafer 222 to the heat sink 243 via the second heat pipe 242. The heat dissipation plate 243 is in contact with the heat dissipation fins 233, and the heat dissipation plate 243 can be in contact with the heat dissipation fins 233 by fastening, bonding or overlapping. An opening 251 is provided in the second housing 250. The opening range of the opening 251 extends at least between the position of the first wafer 221 and the position of the second wafer 222. In other words, the area of the opening is larger than the size of the second heat dissipation module. The opening 251 is corresponding to the second heat dissipation module 240 for the second heat dissipation module 24 to be inserted into the first casing 21 by the opening 251. The motherboard 220 is covered by the second housing 25 与 and the first housing 21 。. Please refer to "Figure 1" and refer to "Figure 2" to "Figure 6", which are respectively schematic diagrams of the heat sink assembly of the present invention. First, the second heat pipe 242 of the second heat radiation module 240 is disposed along the edge of the opening 251, and the heat dissipation plate 243 is disposed on one side of the first casing 21, as shown in Fig. 2. First, please refer to "2nd ®", place the second heat-dissipating lion 24G ^ on the second wafer 222, and then, when the second casing 25 is covered by the motherboard 220 and the first casing 21, "second heat dissipation" The module 24 is covered by the fourth body (the dotted line of the second heat dissipation module (10) in "Fig. 3" is a partial cross section). Since the opening of the opening 251 is larger than that of the first heat dissipation module 230, the first heat dissipation module 23 can be placed in the opening 251 and combined with the second heat dissipation module 24A. = Refer to the "4th figure" and the top of the "4th figure" is the first heat dissipation module 23〇. For the installation method, please refer to the dotted lines 8G, 82, and 84 in the "4th figure". First, the first-scatter 201200995 thermal module 230 is placed from above. When the first heat dissipation module 23 is placed in the opening 251, the heat dissipation fins 233 need to be joined to the heat dissipation plate 243 in the direction of the broken line 82. Finally, the first heat dissipation module 230 is bonded to the first wafer 221 along the broken line 84, as shown in FIG. In order to achieve better efficiency of the above heat dissipating device, a fan (four) may be disposed on the side of the heat dissipating plate 243 and the heat dissipating fin 233, and the air outlet of the fan 27 () is adjacent to the heat dissipating plate 243 and the heat dissipating fin ( Please match the "figure i" and "figure 6" to allow the wind blown by the fan 270 to efficiently remove the waste heat from the heat sink 243 and the heat sink 233. The surface of the heat dissipation plate 243 may be wavy in addition to the plane, and the area through which the heat dissipation plate 243 and the wind pass is greatly increased to improve the heat dissipation efficiency. After :t, the upper layer backing plate 26〇 is covered on the second casing 25〇, and the assembly of the body 200 of the notebook computer can be completed. "The modular heat sink of this month can be applied to the notes of different processing wafers. The development waste can replace different central processing units and process wafers without changing the fine structure. So - can be reduced It conforms to the manufacturing cost of the central processing unit and the heat dissipating device for processing the wafer. However, it is not preferable to use the following: And Fan Yuanben ': more __ ' Therefore, the scope of patent protection of the present invention shall be subject to the definition of each patent application scope attached to the month. [Simplified description of the drawings] Figure 1 is the explosion of the device of the present invention. 201200995 Fig. 2 is a schematic diagram showing the combined action of the second heat dissipation module of the heat dissipation device of the present invention into the first housing and the second housing. Fig. 3 is the second heat dissipation of the heat dissipation device of the present invention. The schematic diagram of the combination of the first housing and the second housing is shown in Figure 2. Figure 4 is a schematic diagram of the combination of the first heat dissipation module and the first housing of the heat dissipation device of the present invention. Invention A schematic diagram of a combination of a first heat dissipation module and a first housing and a second housing of the thermal device. Fig. 6 is a schematic view showing the fan of the heat dissipation device of the present invention being placed in the first housing and the second housing. Component Symbol Description Heat Dissipation Device 100 Heat Conduction Plate 110 Heat Pipe 120 Heat Sink 130 Body 200 First Housing 210 Motherboard 220 First Chip 221 Second Chip 222 First Thermal Module 230 First Thermal Conductor 231 201200995 First Heat Pipe 232 heat sink fin 233 second heat dissipation module 240 second heat conduction plate 241 second heat pipe 242 heat dissipation plate 243 second casing 250 opening 251 back plate 260 fan 270 dotted lines 80, 82, 84