[go: up one dir, main page]

TW201144939A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW201144939A
TW201144939A TW100107740A TW100107740A TW201144939A TW 201144939 A TW201144939 A TW 201144939A TW 100107740 A TW100107740 A TW 100107740A TW 100107740 A TW100107740 A TW 100107740A TW 201144939 A TW201144939 A TW 201144939A
Authority
TW
Taiwan
Prior art keywords
compound
photo
resin composition
mass parts
photosensitive resin
Prior art date
Application number
TW100107740A
Other languages
Chinese (zh)
Other versions
TWI477904B (en
Inventor
Kazuo Takebe
Katsuharu Inoue
Ryuichi Matsuura
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW201144939A publication Critical patent/TW201144939A/en
Application granted granted Critical
Publication of TWI477904B publication Critical patent/TWI477904B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

The photosensitive resin composition of the present invention includes: resin; photo-polymerized compound; photo-polymerization initiator; photo-polymerization initiation auxiliary agent containing thioxanthen compound; and solvent, wherein the photo-polymerization initiator includes <alpha>-amino-ketone compound, biimidazole compound and oxime compound, and the contained quality of hioxanthen compound is more than 80 mass parts and less than 160 mass parts in comparison with the contained quality of <alpha>-amino-ketone compound being 100 mass parts.
TW100107740A 2010-03-26 2011-03-08 Photosensitive resin composition TWI477904B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010071809 2010-03-26

Publications (2)

Publication Number Publication Date
TW201144939A true TW201144939A (en) 2011-12-16
TWI477904B TWI477904B (en) 2015-03-21

Family

ID=44696584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107740A TWI477904B (en) 2010-03-26 2011-03-08 Photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP5673243B2 (en)
KR (2) KR102066277B1 (en)
CN (1) CN102207680B (en)
TW (1) TWI477904B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5981167B2 (en) * 2011-03-24 2016-08-31 東京応化工業株式会社 Photosensitive resin composition
WO2013084283A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element
WO2013084282A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element
KR102025036B1 (en) * 2011-12-05 2019-09-24 히타치가세이가부시끼가이샤 Method for forming protective film on electrode for touch panel, photosensitive resin composition and photosensitive element, and method for manufacturing touch panel
JP2013160825A (en) * 2012-02-02 2013-08-19 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP2013171278A (en) * 2012-02-23 2013-09-02 Sumitomo Chemical Co Ltd Photosensitive resin composition
KR102149152B1 (en) * 2012-09-05 2020-08-28 가부시기가이샤 닛뽕쇼꾸바이 Photosensitive resin composition for photo spacer, and photo spacer
KR102145934B1 (en) * 2014-05-20 2020-08-19 동우 화인켐 주식회사 Method of forming photo-curable pattern
US10040967B2 (en) 2015-11-06 2018-08-07 Hitachi Chemical Company, Ltd. Photosensitive film, photosensitive element, cured product and touch panel
KR101697336B1 (en) 2016-03-03 2017-01-17 주식회사 엘지화학 Method for preparing liquid crystal aligning agent
KR101979980B1 (en) * 2016-03-23 2019-05-17 동우 화인켐 주식회사 Photosensitive Resin Composition
JP7569213B2 (en) * 2019-12-26 2024-10-17 住友化学株式会社 Photosensitive composition

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4470089B2 (en) * 2002-01-22 2010-06-02 東洋紡績株式会社 Actinic ray curable resist ink for conductive substrate
CN1573545A (en) * 2003-06-20 2005-02-02 富士胶片株式会社 Light-sensitive sheet, light-sensitive layers, image pattern forming method, and wiring pattern forming method
JP4419736B2 (en) * 2004-07-20 2010-02-24 Ｊｓｒ株式会社 Photosensitive resin composition, display panel spacer and display panel
KR100658714B1 (en) * 2004-11-30 2006-12-15 삼성에스디아이 주식회사 A photosensitive composition, a photosensitive paste composition for forming a partition including the same, and a method of manufacturing a partition for a plasma display panel using the same.
JP2006309157A (en) * 2005-04-01 2006-11-09 Jsr Corp Radiation-sensitive resin composition, protrusion and spacer formed of the same, and liquid crystal display element equipped with them
CN1841196A (en) * 2005-04-01 2006-10-04 Jsr株式会社 X-ray sensitive resin composition, protruded body and barrier body formed thereby, forming method thereof and liquid crystal display element
US8114574B2 (en) * 2005-06-30 2012-02-14 Dic Corporation Photosensitive resin composition
JP4655928B2 (en) * 2005-06-30 2011-03-23 Ｄｉｃ株式会社 Photosensitive resin composition
KR100961818B1 (en) * 2007-02-21 2010-06-08 주식회사 엘지화학 Photosensitive resin composition for black matrices, black matrix formed thereby and liquid crystal display device comprising the same
JP4844774B2 (en) * 2007-02-27 2011-12-28 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and method for forming them
US8361605B2 (en) * 2007-04-24 2013-01-29 Mitsui Chemicals, Inc. Photosensitive resin composition, dry film, and processed product made using the same
JP4952918B2 (en) * 2007-05-23 2012-06-13 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and method for forming them
WO2009034780A1 (en) * 2007-09-10 2009-03-19 Fujifilm Corporation Color filter, process for producing the color filter, and liquid crystal display device
JP5589270B2 (en) * 2007-10-23 2014-09-17 Ｊｓｒ株式会社 Radiation-sensitive composition for blue color filter, color filter and liquid crystal display element
JP2009134078A (en) 2007-11-30 2009-06-18 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP5527965B2 (en) * 2008-02-22 2014-06-25 Ｊｓｒ株式会社 Radiation-sensitive composition for green pixel formation, color filter, and color liquid crystal display element
KR101482552B1 (en) * 2008-04-30 2015-01-21 주식회사 동진쎄미켐 Negative photosensitive resin composition

Also Published As

Publication number Publication date
KR102066277B1 (en) 2020-01-14
KR20180021753A (en) 2018-03-05
KR20110108268A (en) 2011-10-05
CN102207680A (en) 2011-10-05
JP5673243B2 (en) 2015-02-18
CN102207680B (en) 2015-09-02
JP2011221508A (en) 2011-11-04
TWI477904B (en) 2015-03-21
KR102115077B1 (en) 2020-05-25

Similar Documents

Publication Publication Date Title
TW201144939A (en) Photosensitive resin composition
MY156182A (en) Resin composition
WO2013023732A3 (en) Ternesite used as an activator for latent-hydraulic and pozzolanic materials
SG152126A1 (en) Process for stabilizing olefinically unsaturated monomers
DOP2012000245A (en) SOLID COMPOSITIONS
WO2007089798A3 (en) Methods of preparing and characterizing mesenchymal stem cell aggregates and uses thereof
WO2009114601A3 (en) Preparation of lenalidomide
MX2010006736A (en) Hcv protease inhibitors and uses thereof.
WO2011083329A3 (en) Novel resin curing agents
TW200942566A (en) Novel positive photosensitive resin compositions
MY173526A (en) Novel anti-?5?1 antibodies and uses thereof
PH12017501623B1 (en) Resin composition, adhesive agent, and sealing agent
IN2012DN01336A (en)
WO2008011433A3 (en) Styrenated terpene resin as well as methods of making and using the same
EP2653492A4 (en) Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
MX2010000919A (en) Novel adducts useful as cure components for anaerobic curable compositions.
PH12012501815A1 (en) Curable composition
DE602007005282D1 (en) UNSATURATED POLYESTER RESIN OR VINYL RESIN CONTAINING COMPOSITIONS
MX2012004826A (en) Coating compositions and methods for using the same as a spot blender.
MX2012001999A (en) Use of nkg2d inhibitors for treating cardiovascular and metabolic diseases, such as type 2 diabetes.
IL209945A0 (en) Novel derivatives of pyrroloindole inhibitors of hsp90; compositions containing same, and use thereof
WO2009132119A3 (en) Substituted oxazolidinones
UY31900A (en) SOLID FORMS OF (1R, 2S, 3R) -1- (2- (USOXAZOL-3-IL) -1H-IMIDAZOL-4-IL) BUTANE-1, 2, 3, 4-TETRAOL AND METHODS OF USE.
MX343840B (en) Compositions, films and methods of preparing the same.
WO2013156356A3 (en) Ss-phosphorylated nitroxide radicals as inhibitors for reactive resins, reactive resins containing said ss-phosphorylated nitroxide radicals, and use of said ss-phosphorylated nitroxide radicals