201140946 六、發明說明： 【發明所屬之技術領咸】 [0001] 本發明係有關一種卡緣連接器，尤其涉及一種上下堆疊 的卡緣連接器組合。 [0002] 【先前技術】 中國大陸實用新塑專利第200720003525. 6號揭示了—種 卡緣連接器及其組合，其包括堆疊的上連接器與下連接 器，該上連接器與下連接器都分別設有狹長的插槽以收 容記憶體模組。上連接器與下連接器的結構基本相同並 且刀別安裝在電路板的上下兩面從而形成對稱關係。當 女裝記憶體模組時’第—記憶體模組以自上而下的方式 插入上連接器的插槽内’而第二記憶體模組以自下而上 的方式插入下連接器的插槽内，也就是說第―、第—己 憶體模組以不同的插入方式分別安裝至上連接器與;連 ，器内°由於上連接器與下連接器分別焊接在電路板的 _下兩側’在連接器安裝時需要錢路板的兩側同時進 行焊接。 [0003] 中國大陸實用新型專利第祕簡mi.9號揭示了另— 種卡緣連接H及其組合，其包括上下堆疊的並且前後伊 開的上連接H財連接器。社與下連接器焊^ 於電路板的同側’並且下連接器的結構為沉板型，如此 可乂郎省-定的高度空間。然而，在安裝記憶體模 組時必須先安裝下記憶體模組然後再安裝上記憶體模組 ^二且下A It體模M安裝時還會與上連接器發生干涉， 這明顯不便於消費者使用。 099115186 表單蝙號A0101 咕 4 共 21 頁 0992026887-0 201140946 [0004] 是故，確有必要設計一種加以改良之卡緣連接器組合以 克服先前技術中之缺陷。 【發明内容】 [0005] 有鑒於前述内容，本發明所欲解決之技術問題在於提供 一種便於組裝的卡緣連接器及其組合。 [0006] 為解決前述技術問題，本發明卡緣連接器係採用如下技 術方案：一種卡緣連接器，係可用以與第一卡緣連接器 堆疊設置，所述第一卡緣連接器設有第一絕緣本體及固 ^ 持於第一絕緣本體的上、下導電端子，且所述第一絕緣 ❹ 本體設有用以收容另一記憶體模組之第一插槽並定義有 一傾斜插入方向，上、下導電端子分別設有凸伸入第一 插槽内的接觸部；該卡緣連接器包括第二絕緣本體，係 設有用以收容一記憶體模組之第二插槽；及上、下端子 ，係安裝於第二絕緣本體内，該上、下端子分別設有凸 伸入第二插槽内的接觸部；當與第一卡緣連接器堆疊排 列時，所述上導電端子的接觸部與上端子的接觸部之間 Q 的距離大於下導電端子的接觸部與下端子的接觸部之間 的距離。 [0007] 相較於先前技術，本發明卡緣連接器具有如下功效：第 一插槽與第二插槽内的接觸部設置使記憶體模組沿不同 的方向插入第一插槽與第二插槽内，從而有利於記憶體 模組的安裝。 [0008] 為解決前述技術問題，本發明卡緣連接器組合係採用如 下技術方案：一種卡緣連接器組合，係用以收容第一記 099115186 憶體模組與第二記憶體模組，包括：第一卡緣連接器， 表單編號A0101 第5頁/共21頁 0992026887-0 201140946 設有第一絕緣本體及收容於第一絕緣本體内的第一端子 組，第一絕緣本體設有上壁、下壁及位於兩者之間的第 一插槽，俾以收容第一記憶體模組，所述第一端子組係 焊接於第一焊接面；第二卡緣連接器，位於第一卡緣連 接器的下方，所述第二卡緣連接器設有第二絕緣本體及 收容於第二絕緣本體内的第二端子組，第二絕緣本體設 有上壁、下壁及位於兩者之間的第二插槽，俾以收容第 二記憶體模組，所述第二端子組係焊接於第二焊接面， 該第二焊接面與所述第一焊接面係共面；所述第一插槽 與第二插槽分別設有沿不同方向延伸的插入空間以防止 所述第一記憶體模組與第二記憶體模組安裝時發生干涉 0 [0009] 相較於先前技術，本發明卡緣連接器組合具有如下功效 :第一插槽與第二插槽分別設有沿不同方向延伸的插入 空間以防止所述第一記憶體模組與第二記憶體模組安裝 時發生干涉，從而有利於記憶體模組的安裝。 【實施方式】 [0010] 參第一圖及第二圖所示，本創作卡緣連接器組合包括安 裝於電路板200的第一卡緣連接器10與第二卡緣連接器20 ，其中第二卡緣連接器20位於第一卡緣連接器10的下方 靠前位置，記憶體模組300分別以自上向下方式與自下向 上方式安裝至第一卡緣連接器10與第二卡緣連接器20内 〇 [0011] 參第三圖及第四圖所示，第一卡緣連接器10呈縱長狀， 其包括長方形狀的絕緣本體11以及自絕緣本體11相對的 099115186 表單編號A0101 第6頁/共21頁 0992026887-0 201140946 兩端彳二直向前延伸的支臂12。絕緣本體11包括相對設置 的上壁111與下壁112,上壁111與下壁112内分別設有端 子槽道收容導電端子13，並且上壁111與下壁112之間 设有插槽113以收容記憶體模組300。插槽113在靠近其 中一支臂12的豎直方向上形成一鍵扣114從而將插槽113 刀隔為長度不同的兩部分，記憶體模組300前端形成的缺 口（未圖示）必須與鍵扣114對應才能插入插槽113内，因 此鍵扣114可以起到防誤插的作用 。支臂12在鄰近下壁 112處形成—水平的支撐台122以在記憶體模組300安裝 時提供支擇作用，另，支臂12鄰近末端處還形成有倒L狀 的扣持部121以提供扣卡作甩:。其中，上壁111的前端面 位於下壁112的前端面的後方，故，位於上壁111與下壁 112之間的插槽113形成傾斜向上的插入空間。 [㈤ 12] ❹ 第一卡緣連接器2〇係沉板型連接器，其包括絕緣本體21 及位於絕緣本體21兩端的支臂22。絕緣本體21包括上壁 211、下壁212、插槽213及位於插槽213内的鍵扣214。 其中’上壁211的前端面位於下壁212的前端面的前方， 故’插槽213形成傾斜向下的插入空間。絕緣本體21在鄰 近下壁212處向後延伸一定距離從而形成收容部215，收 容在上壁211與下壁212内的端子23的焊接部固持在該收 容部215内並且向上壁211方向延伸，支臂22外側靠下位 置分別設有定位部222以在第二卡緣連接器2〇安裝至電路 板200時提供固持力’另，支臂22内侧鄰近末端處設有扣 持部221以提供扣卡作用。第二絕緣本體21的鍵扣214與 第一絕緣本體11的鍵扣114位於豎直方向上的同一位置。 099115186 表單编號A0101 第7頁/共21頁 0992026887h 201140946 [0013] 參第五圖及第六圖所示，第一卡緣連接器ίο内的導電端 子13包括分別收容於上壁U1與下壁丨12内的上導電端子 132與下導電端子131。上、下導電端子132、131分別設 有突伸入插槽113内的接觸部1321、1311以及向下延伸 的焊接部1322、1312。上導電端子132的接觸部1321位 於下導電端子131的接觸部1311的後方，即上導電端子 132的接觸部1321更靠近插槽113的内侧。記憶體模組 300傾斜插入插槽113内並與下導電端子13丨的接觸部 1311接觸’然後隨著記憶體模組3〇()向下移動從而與上導 電端子132的接觸部1321完全接觸，即記憶體模組3〇〇係 以自上而下的方式安裝至第—^緣連接器10内。焊接部 1322 ' 1312均為表面黏著式焊腳，並且焊接部1322、 1312焊接於位於電路板2〇〇的上表面的第一焊接面13〇。 [0014] 第二卡緣連接器20内的端子23包括分別收容於上壁211與 下壁212内的上端子232與下端子231。上、下端子232、 231分別設有突伸入插槽213内鈞接觸部2321、2311以及 向下延伸的焊接部2322、2312。上端子232的接觸部 2321位於下端子231的接觸部2311的前方，即下端子231 的接觸部2311更靠近插槽213的内侧。記憶體模組300傾 斜插入插槽213時先與上端子232的接觸部2321接觸，然 後隨著記憶體模組300向上移動而與下端子231的接觸部 2 311完全接觸，即記憶體模組3 0 0係以自下而上的方式安 裝至第二卡緣連接器20内，並且不會與第一卡緣連接器 10發生干涉，這便於消費者的操作。上、下端子232、 231之焊接部2322、2312均為針腳型焊腳並且自收容部 099115186 表單編號A0101 第8頁/共21頁 0992026887-0 201140946 Ο [0015] 215向上延伸，焊接部2322、2312連接於位於電路板200 的上表面的第二焊接面230。第一焊接面130與第二焊接 面230位於電路板的同一側並且處於同一平面，因此在第 一卡緣連接器10與第二卡緣連接器20向電路板200安裝時 ，只需在電路板200的一側進行焊接即可，這將簡化安裝 過程。由於第一卡緣連接器10與第二卡緣連接器20的端 子排佈不同，第一卡緣連接器10的上導電端子132的接觸 部1321與第二卡緣連接器20的上端子232的接觸部2321 之間的距離大於第一卡緣連接器10的下導電端子131的接 觸部1311與第二卡緣連接器的下端子231的接觸部2311 之間的距離。 Ο 在第一卡緣連接器10與第二卡緣連接器20安裝至電路板 200後，第二卡緣連接器20的收容部215與下壁212位於 電路板200的下方，而上壁211位於第一卡緣連接器10的 前方，另，支臂22兩側的定位部222固定於電路板200的 下表面。這樣的設置可以有效降低堆疊卡緣連接器的整 體高度，從而有利於電子產品的小型化發展。另，第一 卡緣連接器10與第二卡緣連接器20分別設有傾斜向上的 插入空間與傾斜向下的插入空間（即兩插入空間的延伸方 向不同），因而記憶體模組300係沿不同的方向插入對應 的插槽内，並且不會發生干涉現象。 [0016] 綜上所述，本發明確已符合發明專利之要件，爰依法提 出申請專利。惟，以上所述者僅係本發明之較佳實施方 式，本發明之範圍並不以上述實施方式爲限，舉凡熟習 本案技藝之人士援依本發明之精神所作之等效修飾或變 099115186 表單編號Α0101 第9頁/共21頁 0992026887-0 201140946 化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0017] 第一圖係本發明卡緣連接器組合安裝在電路板上之立體 圖並展示了記憶體模組安裝的初始狀態； [0018] 第二圖係第一圖所示本發明卡緣連接器組合在記憶體模 組安裝至最終狀態之立體組合圖； [0019] 第三圖係第一圖所示本發明卡緣連接器組合之立體圖； [0020] 第四圖係第三圖所示本發明卡緣連接器組合之分解圖； [0021] 第五圖係第三圖所示本發明卡緣連接器組合沿V-V線之剖 視圖； [0022] 第六圖係第三圖所示本發明卡緣連接器組合沿VI - VI線之 剖視圖。 【主要元件符號說明】 [0023] 第一卡緣連接器：10 [0024] 絕緣本體：11 [0025] 上壁：111 [0026] 下壁：112 [0027] 插槽：113 [0028] 鍵扣：114 [0029] 支臂：12 [0030] 扣持部：121 099115186 表單編號A0101 第10頁/共21頁 0992026887-0 201140946 [0031]支撐台：122 [0032] 導電端子：13 [0033] 第一焊接面：130 [0034] 下導電端子：131 [0035] 接觸部：1311 [0036] 焊接部：1312 [0037] 上導電端子：132 〇 [0038] 接觸部：1321 [0039] 焊接部：1322 [0040] 第二卡緣連接器：20 [0041] 絕緣本體：21 [0042] 上壁：211 [0043] 下壁：212 Ό [0044] 插槽：213 [0045] 鍵扣：214 [0046] 收容部：215 [0047] 支臂：22 [0048] 扣持部：221 [0049] 定位部：222 099115186 表單編號Α0101 第11頁/共21頁 0992026887-0 201140946 [0050] 端子：23 [0051] 第二焊接面：230 [0052] 下端子：231 [0053] 接觸部：2311 [0054] 焊接部：2312 [0055] 上端子：232 [0056] 接觸部：2321 [0057] 焊接部：2322 [0058] 電路板：200 [0059] 記憶體模組：300 0992026887-0 099115186 表單編號A0101 第12頁/共21頁201140946 VI. Description of the Invention: [Technology of the Invention] [0001] The present invention relates to a card edge connector, and more particularly to a card edge connector combination stacked on top of each other. [0002] [Prior Art] Chinese Utility Plastics Patent No. 200720003525. No. 6 discloses a card edge connector and a combination thereof, including a stacked upper connector and a lower connector, the upper connector and the lower connector Each has a narrow slot to accommodate the memory module. The structure of the upper connector and the lower connector are substantially the same and the cutters are mounted on the upper and lower sides of the circuit board to form a symmetrical relationship. When the female memory module is used, the 'first memory module is inserted into the socket of the upper connector in a top-down manner' and the second memory module is inserted into the lower connector from the bottom up. In the slot, that is, the first and the first memory modules are respectively mounted to the upper connector and the different connectors, and the inner device is soldered to the lower board of the circuit board. Both sides need to be welded at the same time on both sides of the money board when the connector is installed. [0003] The Chinese Utility Model Patent No. Mi. 9 discloses another card edge connection H and a combination thereof, which includes an upper connection H-connector stacked on top of each other. The lower connector is soldered to the same side of the board, and the structure of the lower connector is a sinker type, so that the height of the space can be reduced. However, when installing the memory module, the memory module must be installed first and then the memory module ^2 is installed. When the lower A It phantom M is installed, it will interfere with the upper connector, which is obviously inconvenient to consume. Use. 099115186 Form bat number A0101 咕 4 Total 21 pages 0992026887-0 201140946 [0004] Therefore, it is indeed necessary to design an improved card edge connector combination to overcome the deficiencies of the prior art. SUMMARY OF THE INVENTION [0005] In view of the foregoing, the technical problem to be solved by the present invention is to provide a card edge connector and a combination thereof that are easy to assemble. [0006] In order to solve the foregoing technical problem, the card edge connector of the present invention adopts the following technical solution: a card edge connector can be used to stack with a first card edge connector, and the first card edge connector is provided with The first insulative housing is fixed to the upper and lower conductive terminals of the first insulative housing, and the first insulative housing is provided with a first slot for receiving another memory module and defines an oblique insertion direction. The upper and lower conductive terminals respectively have a contact portion protruding into the first slot; the card edge connector includes a second insulative housing, and a second slot for receiving a memory module; The lower terminal is mounted in the second insulating body, and the upper and lower terminals are respectively provided with contact portions protruding into the second slot; when stacked with the first card edge connector, the upper conductive terminal The distance between the contact portion of the contact portion and the upper terminal is greater than the distance between the contact portion of the lower conductive terminal and the contact portion of the lower terminal. Compared with the prior art, the card edge connector of the present invention has the following effects: the contact portions in the first slot and the second slot are arranged to insert the memory module into the first slot and the second in different directions. Inside the slot, which facilitates the installation of the memory module. [0008] In order to solve the foregoing technical problem, the card edge connector assembly of the present invention adopts the following technical solution: a card edge connector combination for accommodating the first memory module and the second memory module, including : The first card edge connector, Form No. A0101, page 5 / 21 pages 0992026887-0 201140946 is provided with a first insulative housing and a first terminal set housed in the first insulative housing, the first insulative housing is provided with an upper wall a first slot between the lower wall and the two, to receive the first memory module, the first terminal set is soldered to the first soldering surface; and the second card edge connector is located at the first card The second card edge connector is provided with a second insulative housing and a second terminal set received in the second insulative housing. The second insulative housing is provided with an upper wall, a lower wall and both a second slot for receiving the second memory module, the second terminal set being soldered to the second soldering surface, the second soldering surface being coplanar with the first soldering surface; One slot and the second slot are respectively extended in different directions Inserting space to prevent interference between the first memory module and the second memory module when mounting 0 [0009] Compared with the prior art, the card edge connector combination of the present invention has the following effects: the first slot and the first The two slots are respectively provided with insertion spaces extending in different directions to prevent interference between the first memory module and the second memory module, thereby facilitating the installation of the memory module. [Embodiment] As shown in the first and second figures, the present card edge connector assembly includes a first card edge connector 10 and a second card edge connector 20 mounted on the circuit board 200, wherein The second card edge connector 20 is located at a lower position of the first card edge connector 10, and the memory module 300 is respectively mounted to the first card edge connector 10 and the second card in a top-down manner and a bottom-up manner. The edge connector 20 is shown in the third and fourth figures. The first card edge connector 10 has a longitudinal shape, and includes a rectangular insulating body 11 and a 099115186 form number opposite to the insulating body 11. A0101 Page 6 of 21 0992026887-0 201140946 Both ends of the arm 12 extend straight forward. The insulative housing 11 includes an upper wall 111 and a lower wall 112. The upper wall 111 and the lower wall 112 are respectively provided with terminal slots for receiving the conductive terminals 13, and the upper wall 111 and the lower wall 112 are provided with slots 113. The memory module 300 is housed. The slot 113 forms a key 114 in a vertical direction adjacent to one of the arms 12 to partition the slot 113 into two portions having different lengths. A notch (not shown) formed at the front end of the memory module 300 must be The key button 114 is correspondingly inserted into the slot 113, so the key button 114 can function to prevent mis-insertion. The arm 12 is formed adjacent to the lower wall 112 - a horizontal support table 122 to provide a locking function when the memory module 300 is installed. Further, the arm 12 is further formed with an inverted L-shaped latch portion 121 adjacent to the end portion. Provide a deduction card as: Here, since the front end surface of the upper wall 111 is located rearward of the front end surface of the lower wall 112, the slot 113 located between the upper wall 111 and the lower wall 112 forms an insertion space obliquely upward. [(5) 12] ❹ The first card edge connector 2 is a sinker type connector including an insulative housing 21 and an arm 22 at both ends of the insulative housing 21. The insulative housing 21 includes an upper wall 211, a lower wall 212, a slot 213, and a key 214 located in the slot 213. Here, the front end surface of the upper wall 211 is located in front of the front end surface of the lower wall 212, so that the 'slot 213 forms an insertion space obliquely downward. The insulative housing 21 extends rearwardly adjacent to the lower wall 212 to form a receiving portion 215. The soldering portion of the terminal 23 received in the upper wall 211 and the lower wall 212 is retained in the receiving portion 215 and extends in the direction of the upper wall 211. A positioning portion 222 is respectively disposed at an outer lower position of the arm 22 to provide a holding force when the second card edge connector 2 is mounted to the circuit board 200. In addition, a buckle portion 221 is disposed at an inner end of the arm 22 to provide a buckle. Card function. The key 214 of the second insulative housing 21 and the key 114 of the first insulative housing 11 are in the same position in the vertical direction. 099115186 Form No. A0101 Page 7 / Total 21 Page 0992026887h 201140946 [0013] As shown in the fifth and sixth figures, the conductive terminals 13 in the first card edge connector ίο are respectively accommodated in the upper wall U1 and the lower wall The upper conductive terminal 132 and the lower conductive terminal 131 in the crucible 12. The upper and lower conductive terminals 132, 131 are respectively provided with contact portions 1321, 1311 protruding into the slot 113 and solder portions 1322, 1312 extending downward. The contact portion 1321 of the upper conductive terminal 132 is located behind the contact portion 1311 of the lower conductive terminal 131, that is, the contact portion 1321 of the upper conductive terminal 132 is closer to the inner side of the slot 113. The memory module 300 is obliquely inserted into the slot 113 and is in contact with the contact portion 1311 of the lower conductive terminal 13A. Then, the memory module 3 is moved downward to completely contact the contact portion 1321 of the upper conductive terminal 132. That is, the memory module 3 is mounted to the first edge connector 10 in a top-down manner. The welded portions 1322' to 1312 are surface-adhesive solder fillets, and the solder portions 1322, 1312 are soldered to the first soldering surface 13A located on the upper surface of the circuit board 2''. [0014] The terminal 23 in the second card edge connector 20 includes an upper terminal 232 and a lower terminal 231 which are respectively received in the upper wall 211 and the lower wall 212. The upper and lower terminals 232, 231 are respectively provided with the inner contact portions 2321, 2311 protruding into the slot 213 and the downwardly extending solder portions 2322, 2312. The contact portion 2321 of the upper terminal 232 is located in front of the contact portion 2311 of the lower terminal 231, that is, the contact portion 2311 of the lower terminal 231 is closer to the inner side of the slot 213. When the memory module 300 is obliquely inserted into the slot 213, it first contacts the contact portion 2321 of the upper terminal 232, and then completely contacts the contact portion 2 311 of the lower terminal 231 as the memory module 300 moves upward, that is, the memory module The 300 is mounted into the second card edge connector 20 in a bottom-up manner and does not interfere with the first card edge connector 10, which facilitates consumer operation. The soldering portions 2322 and 2312 of the upper and lower terminals 232 and 231 are pin-type solder fillets and are self-contained 099115186. Form No. A0101 Page 8 / 21 pages 0992026887-0 201140946 Ο [0015] 215 extends upward, and the soldering portion 2322 The 2312 is connected to the second soldering surface 230 located on the upper surface of the circuit board 200. The first soldering surface 130 and the second soldering surface 230 are located on the same side of the circuit board and are in the same plane, so when the first card edge connector 10 and the second card edge connector 20 are mounted to the circuit board 200, only in the circuit One side of the board 200 can be welded, which simplifies the installation process. Since the terminal arrangement of the first card edge connector 10 and the second card edge connector 20 is different, the contact portion 1321 of the upper conductive terminal 132 of the first card edge connector 10 and the upper terminal 232 of the second card edge connector 20 The distance between the contact portions 2321 is greater than the distance between the contact portion 1311 of the lower conductive terminal 131 of the first card edge connector 10 and the contact portion 2311 of the lower terminal 231 of the second card edge connector. Ο After the first card edge connector 10 and the second card edge connector 20 are mounted to the circuit board 200, the receiving portion 215 and the lower wall 212 of the second card edge connector 20 are located below the circuit board 200, and the upper wall 211 Located at the front of the first card edge connector 10, the positioning portions 222 on both sides of the arm 22 are fixed to the lower surface of the circuit board 200. Such an arrangement can effectively reduce the overall height of the stacked card edge connector, thereby facilitating the miniaturization of electronic products. In addition, the first card edge connector 10 and the second card edge connector 20 are respectively provided with an obliquely upward insertion space and an obliquely downward insertion space (ie, different extension directions of the two insertion spaces), and thus the memory module 300 is Insert into the corresponding slot in different directions without interference. [0016] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes to the form of 099115186 in accordance with the spirit of the present invention. No. Α0101 Page 9 of 21 0992026887-0 201140946, all should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0017] The first figure is a perspective view of a card edge connector assembly of the present invention mounted on a circuit board and shows an initial state of installation of the memory module; [0018] The second figure is the first figure 3 is a perspective view showing the card edge connector assembly of the present invention shown in the first figure; [0020] FIG. 4 is a perspective view showing the card edge connector assembly of the present invention in a final state; 3 is an exploded view of the card edge connector assembly of the present invention shown in the third figure; [0021] FIG. 5 is a cross-sectional view of the card edge connector assembly of the present invention taken along the line VV shown in the third figure; [0022] The three figures show a cross-sectional view of the card edge connector assembly of the present invention taken along line VI-VI. [Main component symbol description] [0023] First card edge connector: 10 [0024] Insulating body: 11 [0025] Upper wall: 111 [0026] Lower wall: 112 [0027] Slot: 113 [0028] Keychain :114 [0029] Arm: 12 [0030] Buckle: 121 099115186 Form No. A0101 Page 10 / Total 21 Page 0992026887-0 201140946 [0031] Support table: 122 [0032] Conductive terminal: 13 [0033] One welding surface: 130 [0034] Lower conductive terminal: 131 [0035] Contact: 1311 [0036] Weld: 1312 [0037] Upper conductive terminal: 132 〇 [0038] Contact: 1321 [0039] Weld: 1322 [0040] Second card edge connector: 20 [0041] Insulating body: 21 [0042] Upper wall: 211 [0043] Lower wall: 212 Ό [0044] Slot: 213 [0045] Key: 214 [0046] Containment department: 215 [0047] Arm: 22 [0048] Buckle: 221 [0049] Positioning part: 222 099115186 Form number Α 0101 Page 11 / Total 21 page 0992026887-0 201140946 [0050] Terminal: 23 [0051] Second welding surface: 230 [0052] Lower terminal: 231 [0053] Contact: 2311 [0054] Weld: 2312 [0055] Upper terminal: 232 [0056] Contact: 2321 [ 0057] Welded part: 2322 [0058] Circuit board: 200 [0059] Memory module: 300 0992026887-0 099115186 Form number A0101 Page 12 of 21