TW201139100A - Transfer mold tooling having 3D runners - Google Patents

Abstract

Disclosed is a transfer mold tooling having 3D runners, comprising an internal mold and an external mold. The internal mold has a mold cavity, a plurality of gates disposed around the mold cavity and a plurality of inner channels. The inner channels are formed on an outer top surface of the internal mold and extend downward to a plurality of outer sides of the internal mold till connecting to the gates. The external mold has an internal mold rabbet for embedding the internal mold, a filling hole penetrating to the rabbet and a plurality of outer channels. The outer channels are formed in the internal mold rabbet and extend from the filling hole toward outside where the paths of the outer channels match with the paths of inner channels. When the external mold hoods the internal mold, a plurality of 3D runners consisting of the inner channels and the outer channels are formed. Accordingly, there can be provided multi-sides filling directions to the mold cavity, so that filling paths in the mold cavity are shortened to achieve the rapidly efficient filling of the mold cavity.

Description

201139100 VI. Description of the Invention: [Technical Field] The present invention relates to a packaging technique for a semiconductor device, and more particularly to a transfer mold having a three-dimensional flow path. [Prior Art]

In the current semiconductor packaging industry, for mass production, it is usually the best cost-performance ratio by means of Transfer Molding. In the mold-sealing process of transfer molding, a substrate such as a lead frame or a printed circuit board is fed into a cavity of a transfer mold by manual or automatic feeding, and then a molding compound having thermosetting properties but not yet cured is used. After preheating (softening), it is filled into the cavity by a syringe, and the entire cavity is filled, and then the semiconductor wafer is sealed after being cured by baking. As shown in Figure 1, a conventional transfer mold 1 has a cavity m and a rinse port 112. When the transfer mold is applied to the molding process, the transfer mold 100 is placed on the upper surface of the substrate 20. A flow path (not shown, field) connected to the rinsing port 112 is formed on the flat surface of the substrate 20 to be unilaterally filled. A plurality of wafers 30 are disposed on the earth electrode 20 of the substrate 2, and are electrically entangled by a plurality of bonding wires 31. η * ^ affixing the wafers 30 and the substrate 20, wherein the wafers 3 and the respective traces of the fresh lines 3 1 are located in the cavity iii" in the molding process, refer to the first system and the figure The temperature and the pressure are controlled under predetermined conditions, and the sealing body 1 is poured into the cavity through the main gate 112 by a sealing electrode 15 to seal the wafers 30 and m 201139100 The second welding line 31. As shown in Fig. 2, after the transfer mold was removed, the encapsulant 1Q was cured to obtain a package structure. During the molding process, the precursor before the uncured ε will flow inside the mold & iu, as the sealant 1 流 flows through the wafers 30 and the bonding wires 3 1 The problem that the mold flow velocity cannot be balanced...is affected by the mold flow imbalance, which causes the sealant to be coated with gas at the time of filling to leave an airtrap on the wafers 30. In addition, since the molding flow path of the sealing body filled by the main gates 112 to the wafers 3 is too long, the sealing body 10 may have a viscous effect when flowing, so that the h second bonding wires 31 are offset. The phenomenon (wiressweep), even causing the wire bonds 31 to touch each other and short circuit. In addition, when the number of stacked wafers is increased or when it is desired to package more wafers at a time, the conventional transfer mold 1 can only provide a single-sided injection molding direction, making it easier to generate gas holes during the molding process. The problem of gold line offset will seriously affect the quality of the package, resulting in reduced reliability. SUMMARY OF THE INVENTION In view of this, the main object of the present invention is to provide a transfer mold having a three-dimensional flow path, which can shorten the filling path in the cavity of the sealant, so as to achieve the effect of quickly filling the cavity, even if the number of wafer stacks is increased. It can also easily improve the problem of gas holes and reduce the deviation of gold lines. A second object of the present invention is to provide a transfer mold having a three-dimensional flow path capable of adjusting a mold flow velocity through each gate to achieve a mold flow level; A further object of the present invention is to provide a 201139100 transfer mold having a three-dimensional flow path, which can extend the service life of the cutting tool when the sheet is cut, and further increase the recognition degree of the subsequent stations. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The present invention discloses a transfer mold having a three-dimensional flow path, which is suitable for introducing a glue to package a plurality of wafers on a substrate, the transfer mold mainly comprising an inner mold and an outer mold. The inner mold has a cavity, a plurality of first gates disposed at a periphery of the cavity, and a plurality of first flow channel inner walls, wherein the first flow channel inner walls are formed on an outer top surface of the inner mold And extending down to a plurality of outer sides of the inner mold until communicating to the first gates. The outer mold has an inner mold inserting groove for fitting the inner mold, an extruding hole penetrating into the inner mold caulking groove, and a plurality of the inner mold embedding grooves and the outer side of the inner mold embedding groove An outer wall of the first flow passage, the paths of the outer walls of the first flow passages correspond to the inner walls of the first flow passages. When the outer mold covers the inner mold, the inner wall of the first flow passages and the outer wall of the first flow passages A plurality of first three-dimensional flow paths. The object of the present invention and solving the technical problems thereof can be further realized by the following technical measures. In the above transfer mold, the groove depth of the inner walls of the first flow passages may be smaller than the groove depth of the outer walls of the first flow passages. In the aforementioned transfer molds, the first flow channel inner wall portions may be flat soil regions. In the above transfer mold, the inner mold system may have four outer sides, and each outer side is formed with at least one of the first flow path inner walls. In the above transfer mold, the first gates of the inner walls of the first 201139100 flow passages connected to different outer sides may be of different calibers. In the aforementioned transfer mold, the opening shapes of the first injection openings may be selected from one of a square shape and a circular arc shape. In the aforementioned transfer mold, the press-fit periphery of the inner mold may be formed with a plurality of exhaust slots. In the aforementioned transfer mold, the inner mold system may have a second nozzle opening penetrating through the inner top surface of the mold cavity to communicate with the extrusion hole. In the aforementioned transfer mold, the cavity of the inner mold can be applied to a single mold, and the second gate is aligned with the center of the inner top surface of the mold. In the above transfer mold, the inner mold system may further have a plurality of second pouring gates penetrating to the inner top surface of the cavity and a plurality of second flow passage inner walls, wherein the second flow passage inner walls are formed The outer top surface of the inner mold extends to the second injection gates, and the outer mold system further has a plurality of second flows disposed in the inner mold recesses and extending outwardly from the extrusion holes. The path of the outer wall of the second flow passage corresponds to the second flow path=wall, and when the outer mold covers the inner mold, the inner wall of the second flow passage and the outer wall of the second flow passage A plurality of second three-dimensional flow channels are formed, wherein the second three-dimensional flow path system (four) is further away from the substrate in the first body flow path. • In the transfer mold described above, the cavity of the inner mold can be applied to the 歹J mold seal, and a plurality of second gate gate arrays are distributed on the top surface of the mold cavity. In the above transfer mold, the inner mold may be provided with a plurality of spacers in the cavity, corresponding to a plurality of dicing streets of the substrate between the units. 201139100 It can be seen from the above technical solution that the transfer mold with the three-dimensional flow path of the invention has the following advantages and effects: _ _ , by means of the inner mold and the outer mold as one of the technical means, due to the flow path of the inner mold The outer wall of the flow path of the inner wall and the outer mold constitutes a plurality of three-dimensional flow paths in different directions to provide five injection molding directions of up, front, back, left, and right. Therefore, it is possible to provide a multi-side pouring direction in the cavity, thereby shortening the filling path in the cavity to achieve a quick filling effect. Even the number of wafer stacks

The increase in volume can also easily improve the gas hole problem and reduce the gold line deviation. Second, borrowing * internal and external mold materials - technical means, because the injection flooding can have different caliber, that is, using the same pressure injection molding, can also change the flow rate of each injection molding direction, so it can be adjusted through each injection Mold flow velocity to achieve mold flow balance. Second, the spacer between the cavity and the inner mold of the inner mold is one of the technical means, because the spacer strip is formed in the cavity of the inner mold and corresponds to the cutting path between the units. Therefore, after the sealant is formed, a plurality of cutting guide grooves are formed on the sealant to shorten the cutting amount of the cutting tool, thereby prolonging the service life of the cutting tool, and further increasing the recognition degree of the subsequent station. The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, in which Therefore, only the components and combinations related to the case are displayed. The components shown in the figure are not drawn in proportion to the number, shape and size of the actual implementation of 201131100. Some ratios of scales are exaggerated or simplified. Processed to provide a clearer description. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated. According to a first embodiment of the present invention, a transfer mold having a three-dimensional flow path is illustrated in a partial perspective view of Fig. 3, and a perspective view of the inside of Fig. 4 is continued. The transfer mold 2 is mainly composed of an inner mold 210 and an outer mold 220. The inner mold 210 can be referred to Fig. 5, and the outer mold 22 can be referred to Fig. 6. The transfer mold 2 is adapted to introduce a gel to encapsulate a plurality of wafers on a substrate. In detail, the definition of the "stereoscopic flow path" means that in the present invention, the flow path and the meandering including the flow path are not formed on the plane where the substrate is sandwiched by the transfer mold, and the direction is from top to bottom. The flow path of the substrate. The inner mold 210 has a cavity 211 (as shown in Figures 4 and 7). Referring to FIG. 5, the inner mold 210 further has a plurality of first slag openings 212 and a plurality of first flow passage walls 213. The first gates 212 are disposed in the cavity 211. The peripheral edge (the first flow channel inner wall 213 is formed on one of the outer top surfaces 214 of the inner mold 210 and extends downward to a plurality of outer sides of the inner mold 2 10 as shown in Figs. 4 and 7; Until the first gates 212 are connected. The outer top surface 2 1 4 refers to the upper surface outside the cavity 211, and the outer top surface 214 is also embedded in the inner mold 21 In addition, the inner mold 210 can have four outer sides 215, and each outer side 215 is formed with at least one of the first flow passage inner walls 213 to achieve front, rear, left, and right four. Injection molding effect in one direction. 201139100 In the preferred embodiment, two outer flow passage inner walls 213 are formed on each outer side edge 215, and are communicated downward to the corresponding first port openings 212. As shown in FIG. 6, the outer mold 22 has an inner mold groove 221 for fitting the inner mold 210, an extrusion hole 222 penetrating the inner mold groove, and a plurality of a first channel outer wall (2) extending in the inner mold slot 221 and extending outwardly from the extrusion hole 222. The road (4) of the first flow channel outer wall 223 corresponds to the W-channel inner wall 213, and the extrusion hole 222 is pushed. The squeezing outlet of the rod is pressed to cause the uncured sealant plastic to be squeezed into the three-dimensional flow passage of the present invention. Specifically, the first flow passage inner wall 213 and the first flow passage outer wall 223 are cross-sectioned. In the present embodiment, the first flow channel inner wall 213 and the first flow channel outer wall 223 have a rectangular shape. The outer mold 220 and the inner mold 210 are made of a rectangular structure. It may be selected from one of stainless steel, aluminum and copper, and the inner mold slot 221 of the outer mold 22 is just sized to accommodate the inner mold 210 so that the outer top of the inner mold 210 The surface 214 and the outer side edges 215 can form a close fitting relationship with the inner mold slot 221 of the outer mold 220. Further, before the inner mold 210 and the outer mold 220 are fitted, the coating can be performed at a discretion a lubricating fluid is disposed in the inner mold recess 22 1 to improve the friction between the inner mold 210 and the outer mold 220 The condition 'favors the progress of the fitting and disengaging action, and prolongs the service life of the transfer mold 200. Please refer to Figures 3, 4 and 7 when the outer mold 220 covers the inner mold 210' by the The first-class inner wall 213 and the first flow path outer walls 201139100 223 constitute a plurality of first three-dimensional flow channels 230. In other words, in the present invention, the outer mold 220 is combined with the inner mold 2 1 〇 The first three-dimensional flow path 230. Further, the first three-dimensional flow path 23 is not formed on a plane in which the substrate 10 is sandwiched by the transfer mold 200, but is connected from the inside to the inside of the transfer mold 200 to The cavity 211

Three-dimensional flow channel. In this embodiment, the groove depths of the first flow channel inner walls 2 i 3 may be smaller than the groove depths of the first flow channel outer walls 223. Therefore, after the outer mold 220 is completed and removed, the sealant attached to the inner walls 213 of the first flow passages can be easily peeled off. Preferably, the first gates 212 of the first flow channel inner walls 213 connected to the different outer sides 215 can be different calibers. For example, in the seventh figure, the first gate gate 212 is smaller than The first first gate 202' in the right side of FIG. 7 can be adjusted to change the diameter of the first flow channel inner wall .213 and the first gates 2 1 2 to adjust the first gate gates. 2] 2 mold flow speed. Its application, the formula is: broken area; d = pipe diameter) The pipe square is inversely proportional to the same pressure injection molding, and is also adjustable enough to pass the body to the cavity 2 11 position is closer to the sealant from the right side filling side to the The method of adjusting the mold cavity fluidity is vi/V2=A2/AI = d2A2/d1A2 using the freewheeling principle (V=flow rate; A = 'so (1) in the steady flow (fixed flow) state, the flow rate and '(2) The flow rate is inversely proportional to the fracture area. Therefore, the phase can be used to change the flow rate of the parent injection direction. Therefore, the mold flow velocity of the first/main gate can be 2 2 to achieve the mold flow in the sealant. Balance, for example, when the first gates 2 12 on the right side of the setting of the next day are set, the mold flow speed to the cavity 211 is made higher than the mold flow speed from the left 2 U. At this time, By changing the caliber of the 笫-gate gate 212 of the right side 10 201139100 to be larger than the caliber of the first main gates 2 1 2 on the left side, the mold flow velocity on both sides can be balanced to uniformly fill Up to the cavity 2, as shown in Fig. 8, the inner mold 210 can have a second note that penetrates into the inner top surface. The opening 217 is connected to the extrusion hole 222. In the embodiment, the diameter of the extrusion hole 222 is larger than the diameter of the second injection gate 217, and the sealing body 10 can pass through the first portion during filling. The two gates 217 are filled into the cavity 211 from top to bottom, which ensures that the sealant 1 does not generate air holes above the wafers 30. In addition, the sealant 〇 is simultaneously pressed and pressed. The plurality of first-dimensional flow passages 23 are filled into the cavity 211 by the first nozzles 212. In the present invention, the inner mold 21 and the outer mold 22 can be used as the middle. The first flow path inner wall 213 of the inner mold 21 and the first flow path outer wall (2) of the outer mold 220 constitute the second 200-peripheral flow channel 230, and communicated to the Transfer mold

The first-injection gates 212 in different directions. As shown in Fig. 9, it is a schematic view of the injection molding direction when the transfer mold 200 is applied for molding. As can be seen from the figure, the present invention can simultaneously fill the sealant into the cavity 211 via the first gates, and at the same side of the mold hole 2, and form the front side of the transfer mold 200. At least two first injection nozzles, left and right four lateral injection molding directions. And the top portion is further provided with the second extrusion and the rinsing 217, which provides the at least five injection molding sides 222 from the upper and lower injection molding sides, so that the filling operation is performed once. Medium. Therefore, it is possible to provide a cavity

I 201139100 Multi-side injection direction, which shortens the filling path of the cavity 21 to achieve rapid filling. Even if the number of wafer stacks is increased, the air trap problem can be easily improved, and the wire sweep can be reduced. In a variant embodiment, as shown in Fig. 10, the first flow channel inner walls 213 may be flat regions. That is to say, the inner wall 213 of the first flow channel is not formed into a groove shape. Therefore, after the inner mold 210 is fitted into the outer mold 220, the depth of the first three-dimensional flow channel 230 can be phased. It is equal to the groove depth of the first flow path outer wall 223. Therefore, it is advantageous for the sealant to flow to the first flow channel inner wall 213' and after the molding process is completed and the outer mold 220 is removed, the sealant flow path residue in the first flow channel inner wall 213 can be easily removed. Things. In addition, the present invention is not limited to the opening shapes of the first gates 2丨2. The opening shapes of the first gates 212 may be selected from one of a square shape and a circular arc shape. In a preferred embodiment, as shown in Figures 3 to 5, the opening shape of the first gates 2 1 2 is designed to be circular. Further, as shown in Fig. 7, the caliber of the first gates 212 is gradually reduced from the outside to the inside to achieve an effect of increasing the filling pressure. Preferably, the opening shapes of the first gates 2 1 2 can be arbitrarily changed according to various processes to achieve the mold flow speed and flow rate required for the process. However, the shape of the openings of the second gates 2 17 must be designed according to customer requirements to meet customer flatness requirements. In a preferred embodiment, as shown in Figures 3 through 5, the nip of the inner mold 21A can be formed with a plurality of venting holes 216. Detailed while m 12 201139100

The outer circumference of the inner mold 210 is formed with a plurality of extensions protruding from the outer mold 220, and the exhaust slots 216 are extendable along the extensions to the inner mold 21G. The air in the cavity 211 is discharged to the outside when the sealing is performed. Specifically, and "T", the vent holes 2 16 can be formed into a groove shape, and in a preferred form, the vent holes 216 can have a circular arc-shaped cross section. By repositioning the extensions, it is convenient to easily separate the outer mold 22 from the inner mold after the molding is completed. In addition, the outer mold 220 can be formed with a plurality of grooves having shapes and positions corresponding to the extending portions, so that the inner mold 2 can be tightly fitted into the inner mold cavities 221. In the present embodiment, as shown in FIGS. 7 and 8, the cavity 211 of the inner mold 21 is applicable to a single mold, and the second gate 217 is aligned with the cavity 211. The center of the inner top surface. In detail, when the transfer mold 200 is disposed on the substrate 2, the cavity 211 can cover the plurality of bonding wires 3 of the wafers 30 and the plurality of wafers 3. The first gates 212 are closely attached to the upper surface of the substrate 2 and located outside the wafers 30, and the first gates 212 are away from the substrate 20 and located on the wafers 30. Above. Therefore, the molding flow path of the sealant 1 填充 filled by the first gates 2 1 2 to the wafers 3 can be shortened by about half of the conventional one (please refer to the figure), and the sealant is added. 1〇 can be filled above the wafers 30, which greatly shortens the molding time to improve the process efficiency. According to the second embodiment of the present invention, another transfer mold having a three-dimensional flow path is illustrated in Figure u shows a three-dimensional representation of the interior of the 201139100 diagram. The transfer mold 300 mainly includes the inner mold 210 and the outer mold 220. The same elements as those in the first embodiment will be denoted by the same reference numerals and will not be described in detail. As shown in FIG. 12, the upper mold 210 may have a plurality of second gates .217 and a plurality of second runner inner walls 318 extending through the inner top surface of the cavity 211. The second runner inner wall 318 is formed on the outer top surface 214 of the inner mold 210 and extends to communicate with the second gates 217. Moreover, as shown in FIG. 13, the outer mold 220 is further provided with a plurality of second flow path outer walls 328 disposed in the inner mold cavities 221 and extending outwardly from the extrusion holes 222. The path of the outer wall 328 of the flow channel corresponds to the inner wall 3 18 of the second flow path. As shown in FIG. 14®, when the outer mold 220 covers the inner mold 210, the first three-dimensional flow passage 230' is formed by the second flow passage inner wall 318 and the second flow passage outer walls 328. And a second three-dimensional flow channel 340, wherein the second three-dimensional flow channel 340 is further away from the substrate 20 relative to the first three-dimensional flow channel _230. Specifically, the first three-dimensional flow channel 230 is connected to the periphery of the upper surface of the substrate 2 沿着 along the outer side edges 2 15 , and the second three-dimensional flow channels 340 are only along the outer surface. The top surface 214 is connected to the cavity 211. More specifically, the distance between the second three-dimensional flow path 340 and the upper surface of the substrate 20 can be approximately equal to the height of the cavity 211. 340 J^ is directly connected to the substrate 20. Further, referring to FIGS. 13 and 14, the first three-dimensional flow channel 230 extends on one of the parallel faces above the upper surface of the substrate 20 and is connected downward to the four periphery of the upper surface of the substrate 20, and the The second three-dimensional 14 201139100 flow path 340 extends over one of the parallel faces above the upper surface of the substrate 2 . In the present embodiment, as shown in Figs. 14 and 15, the cavity 211 of the inner mold 21 is suitable for array molding, and

One (four) column is distributed on the top surface of the cavity 211. Specifically, the position of each of the second gates 217 may correspond to a plurality of substrate units 2 on the substrate 2 and the second nozzles 217 have the same size. When the sealant 1 is filled into the sealant 1 , the sealant 10 flows through the second three-dimensional flow passage 340 and passes through the second gates 217 , and flows through the first The three-dimensional flow path 23 passes through the first gates 212 to simultaneously fill the cavity 2 ι. Therefore, as shown in Fig. 16, when the transfer mold 3 of the present invention is applied to the molding process, the injection molding direction from the periphery can be provided for any one of the substrate units 21, and each of the second gates is provided. The 217 series may correspond to the upper side of each of the substrate units 21. Therefore, in one filling operation, the sealing body 1 灌 can be simultaneously supplied from the top, the front, the back, the left, and the right, so that the filling path of the sealing body 10 in the cavity 211 can be shortened. The effect of quickly filling the cavity 2U is achieved, and the process efficiency is further improved. Moreover, the effect of balancing the mold flow can be achieved by varying the size of the first gates 212 to provide different mold flow velocities. In addition, the inner mold 210 can be provided with a plurality of spacer strips 319 in the cavity 211 corresponding to the plurality of cutting lanes 22 of the substrate 20 between the units. In detail, the spacer strips 3丨9 can be used to balance the mold flow particularly above the plurality of dicing streets 22 parallel to the short sides of the substrate 20. When the sealant ίο is formed, since the spacers 319 are connected to the transfer package on one side of the die, the die can be used as a circular shape. The opening process point 211 is divided into a plurality of sealing chambers, and the packaging units are disposed on the substrate units 21. ^, as shown in FIG. 17, after the mold 300 is removed, the sealant 10 can be formed into a plurality of elements, and the package sheets are covered on the substrate 20 at a 7° angle of the deer. The wafers 30 are also misaligned with a line 31 β, and a plurality of cutting channels 11 are formed in the encapsulant 1 . J has a price of 11, and the cutting guides i i are on the cutting lanes 22, and each of the packaging units is separated from the hidden area. Due to the shortening of the cutting amount of the cutting tool, the life of the cutting tool is further increased, and the recognition of the subsequent stations is further increased. In particular, as shown in Figs. 18A and 18B, the opening shape of the first 212 may be selected from the square and the arc shape, such as the first notch 212 in the 18th drawing. The opening shape is shaped as '4' and the openings of the first gates 212 are square in the figure. However, in the present invention, the shapes of the first gates 212 can be arbitrarily changed according to various processes, and can even be arranged in a combination of mouth shapes or other opening shapes to meet the required mold flow speed and flow. As shown in FIG. 19, in a variant, the positions of the first gates 212 of the transfer mold are changed such that the first gates 212 correspond to the substrate units 21, and the rows are arranged. The air slot 216 is aligned with the scribe lines 22 between the substrate units 21. When the molding is performed, the sealing body can be directly poured into the cavity 211 via the first gates 212, and is particularly suitable for the process of packaging a large number of wafers at a time. This is because when a large number of wafers are packaged at a time, the substrate units 16 201139100 21 on the substrate 2 are more complicatedly distributed, and the number of wafers on the substrate 2 is greatly increased. Therefore, more sufficient pressure is required to provide the wafers. These first gates 212 have appropriate mold flow rates and flow rates. Therefore, by changing the positions of the first note ports 2 1 2, the sealant can be directly filled into the cavity 2 11 by the first rinse ports 2 1 2 after being filled, so as to seal The colloid can be smoothly and uniformly filled to the substrate sheets το 21 that are farther away from the first gates 212. In addition, the present invention does not limit that the position of the first gates 212 can be changed to an appropriate position according to the process requirements, and the multi-side pouring direction in the cavity can still be provided, thereby shortening the filling of the cavity 2 Path 'to achieve the effect of fast filling. The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, Any simple modifications, equivalent changes, and modifications made by the skilled artisan within the technical scope of the present invention are still within the technical scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a member before molding on a substrate using a conventional transfer mold. Fig. 2 is a schematic cross-sectional view showing the sealant on the substrate after molding using a conventional transfer mold. Fig. 3 is a partially cutaway perspective view of a transfer mold having a three-dimensional flow path in accordance with a first embodiment of the present invention. Fig. 4 is a perspective view showing the portion of m 17 201139100 in the transfer mold according to the first embodiment of the present invention. Fig. 5 is a perspective view showing the inner mold of the transfer mold according to the first embodiment of the present invention. Fig. 6 is a perspective view showing the outer mold of the transfer mold according to the first embodiment of the present invention. Fig. 7 is a cross-sectional view showing the element cut along the first three-dimensional flow path before the transfer mold is molded on the substrate in accordance with the first embodiment of the present invention. • Fig. 8 is a cross-sectional view of the element cut along the center line after the transfer mold is molded on the substrate in accordance with the first embodiment of the present invention. Fig. 9 is a top plan view showing the substrate of the injection molding direction according to the first embodiment of the present invention. Fig. 10 is a cross-sectional view showing the element according to the first three-dimensional flow path before the transfer mold is molded on the substrate in accordance with a variation of the first embodiment of the present invention. w ' Fig. 11 is a perspective view showing the inside of a transfer mold according to a second embodiment of the present invention. Fig. 12 is a perspective view showing the internal mold of the transfer mold according to the second embodiment of the present invention. Fig. 13 is a perspective view showing the outer mold of the transfer mold according to the second embodiment of the present invention. Fig. 14 is a cross-sectional view showing the element cut according to the three-dimensional flow path before the transfer mold of the second embodiment of the present invention is molded on the substrate m 18 201139100. Fig. 15 is a cross-sectional view of the element cut along the three-dimensional flow path after the transfer mold of the second embodiment of the present invention is molded on the substrate. Fig. 16: A transfer mold according to a second embodiment of the present invention shows a schematic view of a substrate in the direction of injection molding. Fig. 17 is a schematic cross-sectional view showing the encapsulant on the substrate after molding using the transfer mold of the second embodiment of the present invention. • Figs. 18A and 18B: A transfer mold according to a second embodiment of the present invention is a side view showing a change in the shape of the opening of the first gate. Fig. 19 is a top plan view showing a substrate in accordance with a variation of the second embodiment of the present invention. [Main component symbol description] 10 Sealing body 11 Cutting guide groove 20 Substrate 21 Substrate unit 22 Cutting path 30 Wafer 3 1 Bonding wire 100 Transfer mold 111 Die cavity 112 Injection gate 200 Transfer mold having a three-dimensional flow path 210 Internal mold 211 Mould Hole 212 first injection gate 213 first flow channel inner wall 214 outer top surface 215 outer side 216 exhaust slot 19 201139100 . 2 1 7 second injection gate. 220 outer mold 221 inner mold slot 222 extrusion hole 223 First flow channel outer wall 230 first three-dimensional flow channel 3 00 has a three-dimensional flow path transfer mold 3 1 8 second flow channel inner wall 3 19 spacer 328 second flow path outer wall # 3 40 second three-dimensional flow path

20

Claims (1)

2〇ll39l〇〇7 application patent scope: 1. 'There is a three-dimensional flow path transfer. The mold is suitable for importing a piece of glue to obliquely-package a plurality of wafers on the substrate. The pole W' has a cavity, a plurality of first gates disposed at a periphery of the cavity, and a plurality of first runner inner walls, wherein the - the inner wall of the first flow passage is formed on one of the outer top surfaces of the inner mold and extends to a plurality of outer sides of the inner mold until it is connected to the 4b flute and one pouring gate; and the outer wedge, α « _« _ having an inner mold slot for fitting the inner mold, / an extrusion hole to the inner mold recess, and a plurality of flow passages disposed in the inner mold recess and extending outward from the extrusion hole And the paths of the outer walls of the first flow passages correspond to the inner walls of the first passages. When the outer mold covers the inner mold, the first flow passage walls and the outer walls of the first flow passages form a plurality of first negative The upper edge of the ridge and the root edge are assembled, and the transfer mold having the three-dimensional flow path is loaded with the groove depth of the inner wall of the first flow path is smaller than the groove depth of the outer wall of the first flow path. 3. The transfer mold having a three-dimensional flow path according to claim 1, wherein the first-flow passage inner wall is a flat region. 4. The transfer machine having a three-dimensional flow path according to the patent application (4), wherein the inner mold has four outer sides, and each outer side is formed with at least one of the first flow path inner walls. 21 201139100 5. The transfer wedge having a three-dimensional flow path according to claim 4, wherein the first gates of the first flow passages connected to different outer sides are different calibers. 6. The transfer device having a three-dimensional flow path according to the scope of the patent application, wherein the opening shape of the first gates is selected from one of a square shape and a circular arc shape. 7. The transfer mold having a three-dimensional flow path according to the item i of the patent application, wherein the press-forming periphery of the inner mold is formed with a plurality of exhaust slot holes. , Field 8, according to the patent application scope 1, 2, 3, 4, 5, 6 or 7 of the three-dimensional flow path transfer mold, wherein the internal mold system has - through the top surface of the mold cavity The second injection port is connected to the extrusion hole. 9. The transfer mold having a three-dimensional flow path according to claim 8 of the patent application, wherein the cavity of the inner mold is suitable for a single mold seal, and the second injection gate is aligned with the inner top of the mold cavity. The center of the face. 10. A torsion magnet a-y-j having a three-dimensional flow path according to the scope of claim 1, 2, 3, 4, 5, 6 or 7 of the patent application, wherein the inner mold system has a plurality of Passing through the top of the cavity, the flute _ volts 八 py τ 面 之 — 注 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及The outer top surface extends to the second injection gates, and the outer mold system further has a plurality of second flow passages disposed in the inner mold rear grooves and extending outwardly from the extrusion holes [the outer wall of the flow passage The road (4) corresponds to the second flow passage inner wall 22 201139100. The mold covers the inner mold, and the second flow passage inner wall and the second flow passage outer wall system constitute a plurality of second three-dimensional flow passages, wherein the The two-dimensional flow path is further away from the substrate relative to the first three-dimensional flow path. 11. The transfer mold having a three-dimensional flow path according to the first aspect of the patent application, wherein the cavity of the inner mold is suitable for array molding, and a plurality of second gate gate arrays are distributed in the mold cavity. Inner top surface. 1 . The mold having a three-dimensional flow path according to claim 11 of the patent application, wherein the inner mold is provided with a plurality of spacers in the cavity, corresponding to a plurality of cutting paths of the substrate between the units. S S J 23