201138603 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱風扇系統，尤係關於一種結合 至主機板以逸散主機板上之電子元件及電子裝置所產生熱 量之散熱風扇系統。 【先前技術】 如主機板(Main Board或Mother Board)之電路板上設 有多數之如中央處理單元或繪圖卡之電子元件（Electronic Φ Components)及用以電性連接該電子元件之電性電路 (Conductive Circuits)，該些電子元件在作用日守會產生熱 量，若未將所產生之熱量自裝設有電路板之電子產品内排 除，則電子元件會因過熱而失效；此種問題在功能需求曰 增及處理速度越快之電子產品更形重要’因功能與處理速 度之提升意味電路板上整合之電子元件或電子裝置須更多 或更高階，更多或更高階之電子元件或電子裝置即會產生 鲁越多之熱量。故將電路板所產生之熱量有效散除係一必要 之設計。 一般業界所採用之逸散熱量方式之一’係在主機板或 母板上加設散熱風扇以逸散電子元件及/或電子裝置所產 生之熱量，此種散熱風扇已見於如第6,799,282、 7,215,548、7,286,357 及 7,568,517 號等美國專利中。 舉例而言，如第4圖所示之習知散熱風扇，係裝設於 電路板之預設位置上’主要由殼體41、扇輪42及印刷電 路板43所構成。該殼體41具有底座410、軸套管411及纟 3 111590 201138603 環設於該軸套管411上之定子組412;該扇輪42則具有輪 轂421、環設於該輪轂421外側之複數葉片422，軸接至該 輪轂421以軸設於該軸套管411中之轉軸423，以及設於 該輪轂421内側上之磁鐵424;而該印刷電路板43上則設 有至少一控制晶片430、感應晶片431及複數被動元件 432,該印刷電路板43係設置於該殼體41之底座410上， 以藉由該控制晶片430及感應晶片431控制扇輪42之轉 動，以由該扇輪42之轉動驅動氣流。 第4圖所示之習知散熱風扇所使用之控制晶片430係 —發熱源，產生之熱量若無法逸散’亦會導致其本身之過 熱而失效’一旦該控制晶片430失效’則無法作動扇輪42 ; 如此，會使電子產品之主機板上之電子元件所產生熱量無 從有效逸散，從而導致電子產品當機，甚而損壞。而該控 制晶片430恰係位於殼體41之底座410及扇輪42之輪轂 421間之間隙’該間隙之狭小往往使控制晶片430所產生 之熱量無法有效逸除，致而會因過熱而導致控制晶片430 之損壞。散熱風扇為電子產品之零組件中相對價廉之一 者’唯其無法運作時，即會損及電子產品價昂之核心組件 之主機板，故其重要性非從其價格所能衡量。 同時’由於控制晶片430及其它電子元件係位於散熱 風扇中’受損或損壞時，往往因拆卸不易，多未採用修復 或更換方式’而係將整個散熱風扇或印刷電路板丟棄，造 成資源之浪費。 此外’控制晶片430之設置會影響到輪扇42之輪轂 4 111590 201138603 421與殼體41之基座410間之間隙大小，往往會因控制晶 片430之厚度而須增加該間隙之高度，而不利是種散熱風 扇之整體高度之降低。且控制晶片430之設置會使該印刷 電路板43需使用之面積增加，印刷電路板43面積之增加 在不增大是種習知散熱風扇之截面積的情況下，則需縮減 葉片422之面積，但葉片422之面積的縮減會影響到風量 的產出，而風量的產出若不足則會影響到所欲之散熱功效。 為解決上述問題，第7,345,884號美國專利即提出一 • 種改良之散熱風扇。如第5圖所示，該第7,345,884號美 國專利之散熱風扇之結構大致同於前揭習知技術，不同處 於在於其印刷電路板5 3形成有一向外延伸之延伸部5 3 3， 供控制晶片530設置其上，以使該控制晶片530位於殼體 51之底座510及扇輪52之輪轂521間之間隙外或部分外 露出該間隙，俾令扇輪52所驅動之氣流得以將控制晶片 530所產生之熱量逸除。 惟，上述印刷電路板53向外延伸之延伸部533之形成 I 會使扇輪52在轉動時所驅動之氣流受到干擾，氣流受擾即 會產生噪音，進而影響至裝設有是種散熱風扇之電子產品 的使用品質。同時，因該延伸部533係向外延伸，使葉片 522與控制晶片530間需保持一預定之間隔，此亦不利於 是種習知散熱風扇之整體高度的降低，而無法滿足電子產 品薄化的需求。再者，該控制晶片530及其他電子元件仍 係位於散熱風扇中，受損或損壞時’往往也因拆卸不易’ 而無法修復，通常亦係將整個風扇丟棄而造成資源之浪費。t s 5 111590 201138603 再而’前揭之習知散熱風扇仍需將印刷電路板設置於 扇輪之輪轂及殼體之底座間，致印刷電路板之厚度仍會影 . 響至散熱風扇之整體高度’而無法進一步地薄化散熱風扇。 【發明内容】 有鑑於此’本發明即在提供一種具可修復電子元件之 散熱風扇系統可便利地修復或更換電子元件，而毋須在t 子元件受損或損壞時更換整個散熱風扇系統中之風扇單 元，進而使電子元件所產生之熱量得以有效逸散而無二$ 受損之虞’並能有效降低風扇單元之整體厚度，使風扇^ 元之葉片面積不致受限，且不會使氣流受擾而產生噪音。 β 本發明所提供之具可修復電子元件之散熱風扇系二| 係由用以結合至主機板並與該主機板電性連接之風扇單 元，以及複數整合於該結合有風扇單元之主機板上並二= 風扇單元與主機板電性連接之電子元件所構成，其中 1 複數電子元件至少包括有控制晶片與被動元件，用以控^ 5玄風扇單元之運轉。 本發明之散熱風扇系統之風扇單元得以任何習知之方 鲁 式與主機板結合，例如，嵌設、螺設'銲設或卡嗖等，且 風扇單元與主機板之結合得為可組卸的結合方式或非可組 卸的結合方式，在為可組卸地結合之方式時，若風扇單= 故障或損壞下，均得以更換之。 該風扇單元係包括具有輪轂、設於該輪轂内面之磁 鐵、以及設於該輪轂外面之多數葉片之扇輪，具有底座並 供該扇輪軸設之殼體，以及設於該殼體之底座上且未設有 111590 6 201138603 電子元件之印刷電路板，該印刷電路板上並設置有如線圈 之定子組。該風扇單元亦得為其它型式之風扇模組，而不 p艮於上述…構’差異處在採用之印刷電路板上未設置有電 子元件’而雜之好元件整合於結合有賴扇單元 之主機板上。同時，該印刷電路板復具有向外延伸之導電 連接元件’以與魅及設於魅機板上之電子元件電 性連接，俾㈣電子元件中之控制晶片經該導電連接元件 傳遞控制信號至該定子組，以控制該風扇單元之運轉。 由於該複數之包括控制晶片與被動元件之電子元件係 設於主機板上，若有受損或指掠* 人* 時’毋須如習知散熱風扇 往往曰更換’而能便利地在域板上修復或更換， 故能具較佳之修復性，而降低維修成本；且在風扇單元正 常運轉下，如控制3之電子元件所產生之熱量能有效逸 散而不致發生因過熱而受損之問題。且該如控制晶 子元件設於主機板上，：^干涉至絲之葉片面積，故使 扇輪之葉片面積在一定之空間範圍内有更大之伸展裕产， 進而能增加風量的輸出。同時，如控制晶片及被動元：之 電子元件毋須設於殼體之底座與扇輪之輪轂間，即有助於 減少底座與輪穀間之_的高度，而能降低風扇單元的整 體厚度’故較能符合電子產品薄化上的需求。#而 晶片設於主機板上之預定位置，*會干擾到風扇單元二 動狀態下所產生之氣流，故亦無產生噪音或震動之問題。 根據^發明之另一較佳具體實施例，該散熱風扇系統 中之風扇單兀亦得免除印刷電路板之❹，而將定子組直 111590 7 201138603 接安置於殼體之底座上，並將該定子組連結如排線之導電 連接元件，以使該定子組經由該導電連接元件與整合於主 機板上之電子元件電性連接，俾供電子元件中之控制晶片 所發出之控制訊號傳送至該定子組，而驅動該風扇單元之 轉動。如此，則能使風扇單元之結構簡化，而能進而降低 風扇單元之整體高度，符合電子產品薄化上之需求，並復 能提升本發明散熱風扇系統之修復性，避免資源之浪費。 【實施方式】 以下係藉由特定之具體實施例詳細說明本發明之技術 内容及實施方式，熟悉此技藝之人士可由本說明書所揭示 之内容輕易地瞭解本發明的優點及功效。本發明亦可藉由 其它不同的具體實施例加以施行或應用，本說明書中的各 項細節亦可基於不同觀點與應用，在不悖離本發明之精神 下進行各種修飾與變更。 須知，本說明書所附圖式所繪示之結構、比例、大小 等，均僅用以配合說明書所揭示之内容，以供熟悉此技藝 之人士之瞭解與閱讀，並非用以限定本發明可實施之限定 條件，故不具技術上之實質意義，任何結構之修飾、比例 關係之改變或大小之調整，在不影響本發明所能產生之功 效及所能達成之目的下，均應仍落在本發明所揭示之技術 内容得能涵蓋之範圍内。同時，本說明書中所引用之如 “上、下”、“内、外”、“前、後” “一”等之用語， 亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範 圍，其相對關係之改變或調整，在無實質變更技術内容下， 8 111590 201138603 當亦視為本發明可實施之範疇。 第一具體實施例 如弟 — 至 is 久2圖所不’係本發明之第一具體實施例結合 主機板的斜視圖。該具可修復電子元件之散熱風扇系 統’係包括戟人s ^ 疋合至一主機板10上並與該主機板10電性連 接之複數電；_ 元件丨丨5 疋件11 ’及與該主機板10結合並與該電子 有 電隨連接的風扇單元12。該主機板1 〇上復至少具 中央處埋單元1〇〇,且該主機板ίο可為任何習知之電 如印刷電路板(Printed Circuit Board)或母板(Mother ^〇ard)亦適用’其上除中央處理單元100外，復可設有其 =電子元件或電子裝置，如繪圖晶片、南橋晶片、北橋晶 電阻或電容等被動元件等，由於其為習知者即能適用， 在此不另為文贅述。 +〜該複數電子元件u則可包括控制晶片110及如電阻及 被動元件111 ’該控制晶片110係財央處理單元 電性連接，用以傳送控制信號至該風扇單元12，以控 1違風扇單元12之運轉。而該風扇單元12包括有殼體 120、印刷電路板121及扇輪122。該殼體12〇具有底座 l2〇a，形成於該底座12〇a上之軸套管12〇b，以及環設於 ，轴套管120b外側之定子組120C。該印刷電路板則 ίτ'攻於該底座120a上，以供定子組i2〇c安置於其上。核 印刷電路板121並連接有一如排線之導電連接元件12“ 向外延伸，以與該主機板1〇電性連接，俾進而電性連接至 5亥控制晶片110及被動元件111等之電子元件u，供該控 111590 9BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling fan system, and more particularly to a cooling fan system that is coupled to a motherboard to dissipate heat generated by electronic components and electronic devices on the motherboard. [Prior Art] If a motherboard such as a motherboard (Main Board or Mother Board) is provided with a plurality of electronic components such as a central processing unit or a graphics card (Electronic Φ Components) and an electrical circuit for electrically connecting the electronic components (Conductive Circuits), these electronic components generate heat during the action of the day. If the generated heat is not removed from the electronic products equipped with the circuit board, the electronic components will fail due to overheating; The ever-increasing demand and faster processing of electronic products is more important. 'As the increase in functionality and processing speed means that electronic components or electronic devices integrated on the board must have more or higher order, more or higher order electronic components or electronics. The device will generate more heat from the Lu Yue. Therefore, it is necessary to effectively dissipate the heat generated by the board. One of the general methods of heat dissipation used in the industry is to add a heat dissipating fan on the motherboard or the motherboard to dissipate heat generated by electronic components and/or electronic devices. Such a cooling fan has been found in, for example, 6,799,282, 7,215,548. U.S. Patent Nos. 7,286,357 and 7,568,517. For example, the conventional heat dissipating fan shown in Fig. 4 is mounted on a predetermined position of the circuit board and is mainly composed of a casing 41, a fan wheel 42, and a printed circuit board 43. The housing 41 has a base 410, a shaft sleeve 411, and a stator assembly 412 that is disposed on the shaft sleeve 411. The fan wheel 42 has a hub 421 and a plurality of blades disposed outside the hub 421. 422, the shaft 423 is coupled to the hub 421, the shaft 423 is disposed in the shaft sleeve 411, and the magnet 424 is disposed on the inner side of the hub 421. The printed circuit board 43 is provided with at least one control wafer 430. The sensing chip 431 and the plurality of passive components 432 are disposed on the base 410 of the housing 41 to control the rotation of the fan wheel 42 by the control chip 430 and the sensing chip 431 to be used by the fan wheel 42. The rotation drives the air flow. The control wafer 430 used in the conventional heat-dissipating fan shown in FIG. 4 is a heat source, and if the generated heat is not dissipated, it may cause its own overheating to fail. Once the control wafer 430 fails, the fan cannot be activated. The wheel 42; in this way, the heat generated by the electronic components on the motherboard of the electronic product is not effectively dissipated, thereby causing the electronic product to crash and even be damaged. The control wafer 430 is located in the gap between the base 410 of the housing 41 and the hub 421 of the fan wheel 42. The narrowness of the gap often prevents the heat generated by the control wafer 430 from being effectively removed, resulting in overheating. The damage of the wafer 430 is controlled. A cooling fan is one of the relatively inexpensive components of an electronic product. 'When it is not operational, it will damage the motherboard of the core component of the electronic product, so its importance is not measurable from its price. At the same time, because the control chip 430 and other electronic components are damaged or damaged in the cooling fan, it is often difficult to disassemble, and the repair or replacement method is not used. The entire cooling fan or printed circuit board is discarded, resulting in resources. waste. In addition, the setting of the control wafer 430 affects the gap between the hub 4 111590 201138603 421 of the wheel 42 and the base 410 of the housing 41, and the height of the gap must be increased due to the thickness of the control wafer 430. It is a reduction in the overall height of the cooling fan. Moreover, the setting of the control chip 430 increases the area required for the printed circuit board 43. The increase of the area of the printed circuit board 43 does not increase the cross-sectional area of the conventional cooling fan, and the area of the blade 422 needs to be reduced. However, the reduction of the area of the blade 422 will affect the output of the air volume, and if the output of the air volume is insufficient, it will affect the desired heat dissipation effect. In order to solve the above problem, U.S. Patent No. 7,345,884 proposes an improved cooling fan. As shown in FIG. 5, the structure of the heat dissipating fan of U.S. Patent No. 7,345,884 is substantially the same as that of the prior art, except that the printed circuit board 53 is formed with an outwardly extending extension portion 533 for control. The wafer 530 is disposed thereon such that the control wafer 530 is located outside or partially outside the gap between the base 510 of the housing 51 and the hub 521 of the fan wheel 52 to expose the gap, so that the airflow driven by the fan wheel 52 can control the wafer. The heat generated by 530 is removed. However, the formation of the outwardly extending extension portion 533 of the printed circuit board 53 causes the airflow driven by the fan wheel 52 to be disturbed, and the airflow is disturbed to generate noise, thereby affecting the installation of a cooling fan. The quality of use of electronic products. At the same time, since the extending portion 533 extends outwardly, a predetermined interval between the blade 522 and the control wafer 530 is required, which is not conducive to the reduction of the overall height of the conventional cooling fan, and cannot satisfy the thinning of the electronic product. demand. Moreover, the control chip 530 and other electronic components are still located in the cooling fan. When damaged or damaged, it is often difficult to repair due to the difficulty of disassembly. Usually, the entire fan is discarded, resulting in waste of resources. Ts 5 111590 201138603 In addition, the conventionally disclosed cooling fan still needs to place the printed circuit board between the hub of the fan wheel and the base of the housing, so that the thickness of the printed circuit board still affects. The overall height of the cooling fan is reached. 'It is impossible to further thin the cooling fan. SUMMARY OF THE INVENTION In view of the above, the present invention provides a heat dissipating fan system with repairable electronic components that can conveniently repair or replace electronic components without replacing the entire cooling fan system when the t subcomponents are damaged or damaged. The fan unit, in turn, allows the heat generated by the electronic components to be effectively dissipated without any damage, and can effectively reduce the overall thickness of the fan unit, so that the blade area of the fan unit is not limited, and the airflow is not caused. Disturbed to produce noise. The heat-dissipating fan system of the present invention is provided with a fan unit for being coupled to the motherboard and electrically connected to the motherboard, and a plurality of motherboards integrated with the fan unit. And two = the fan unit and the motherboard are electrically connected electronic components, wherein the plurality of electronic components include at least a control chip and a passive component for controlling the operation of the fan unit. The fan unit of the cooling fan system of the present invention can be combined with the motherboard by any conventional method, for example, embedded, screwed or welded, and the combination of the fan unit and the motherboard is disassemblable. The combination mode or non-removable combination mode can be replaced if the fan unit = fault or damage when it is combined. The fan unit includes a wheel having a hub, a magnet disposed on an inner surface of the hub, and a plurality of blades disposed outside the hub, a housing having a base for the fan shaft, and a base disposed on the base of the housing There is no printed circuit board for electronic components of 111590 6 201138603, and a stator set such as a coil is disposed on the printed circuit board. The fan unit may also be a fan module of other types, and the difference is that the printed circuit board is not provided with electronic components, and the components are integrated into the host unit combined with the fan unit. On the board. At the same time, the printed circuit board has an outwardly extending conductive connecting component to electrically connect with the electronic component disposed on the charm board, and the control wafer in the electronic component transmits a control signal to the control component through the conductive connecting component. The stator set controls the operation of the fan unit. Since the plurality of electronic components including the control chip and the passive component are mounted on the motherboard, if there is damage or fingering, the user does not need to be replaced as in the conventional heat-dissipating fan. Repair or replacement, it can have better repairability, and reduce maintenance costs; and under the normal operation of the fan unit, the heat generated by the electronic components of Control 3 can be effectively dissipated without causing damage due to overheating. Moreover, if the control crystal element is disposed on the main board, : ^ interferes with the blade area of the wire, so that the blade area of the fan wheel has a larger extension margin in a certain space range, thereby increasing the output of the air volume. At the same time, such as control chip and passive element: the electronic component does not need to be placed between the base of the housing and the hub of the fan wheel, which helps to reduce the height between the base and the valley, and can reduce the overall thickness of the fan unit. Therefore, it can meet the needs of thinning electronic products. # The chip is placed at a predetermined position on the motherboard, * will interfere with the airflow generated by the fan unit in the two-state state, so there is no problem of noise or vibration. According to another preferred embodiment of the invention, the fan unit in the cooling fan system is also free from the printed circuit board, and the stator assembly straight 111590 7 201138603 is placed on the base of the housing, and the The stator assembly is connected to the conductive connecting component of the wire, so that the stator group is electrically connected to the electronic component integrated on the motherboard via the conductive connecting component, and the control signal sent by the control chip in the electronic component is transmitted to the stator The stator set drives the rotation of the fan unit. In this way, the structure of the fan unit can be simplified, and the overall height of the fan unit can be further reduced, which meets the requirements for thinning of electronic products, and can improve the repairability of the cooling fan system of the present invention and avoid waste of resources. The embodiments of the present invention will be described in detail with reference to the specific embodiments thereof, and those skilled in the art can readily understand the advantages and functions of the present invention. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper, lower", "inside, outside", "before, after" and "one" are used in this specification for convenience of description only, and are not intended to limit the invention. The scope of the invention, the change or adjustment of its relative relationship, is not considered to be within the scope of the invention. The first embodiment is a perspective view of a first embodiment of the present invention in combination with a motherboard as shown in the drawings. The heat dissipating fan system with repairable electronic components includes a plurality of electric wires that are coupled to a main board 10 and electrically connected to the main board 10; _ component 丨丨 5 11 11 ' and The motherboard 10 is coupled to the fan unit 12 that is electrically connected to the electronic unit. The motherboard 1 has at least a central buried unit 1 〇〇, and the motherboard ίο can be any conventional electric such as a printed circuit board or a mother board (Mother ^〇ard) In addition to the central processing unit 100, it can be equipped with its electronic components or electronic devices, such as a drawing chip, a south bridge wafer, a north bridge crystal resistor or a passive component such as a capacitor, etc., since it can be applied to a conventional person, Another article is written. +~ The plurality of electronic components u may include a control chip 110 and a resistor and a passive component 111. The control chip 110 is electrically connected to the central processing unit for transmitting a control signal to the fan unit 12 to control the fan. The operation of unit 12. The fan unit 12 includes a housing 120, a printed circuit board 121, and a fan wheel 122. The housing 12 has a base 12a, a shaft sleeve 12b formed on the base 12a, and a stator assembly 120C annularly disposed outside the shaft sleeve 120b. The printed circuit board then ίτ' attacks the base 120a for the stator set i2〇c to be placed thereon. The core printed circuit board 121 is connected to a conductive connecting component 12 such as a wire to extend outwardly to electrically connect to the motherboard 1 , and is electrically connected to the electronic control chip 110 and the passive component 111 . Component u for the control 111590 9
I 201138603 制晶片110藉該導電連接元件ma傳遞控制訊號至該印刷 電路板121之疋子組120c上，以控制該風扇單元12之運 轉。而該扇輪122係包括輪穀心，設於該輪轂i22a之 内側上之磁鐵122b，多數設於該輪穀122a外側上之葉片 122c’以及㈣至該輪咖上之軸柱㈣；該轴柱㈣ 係麵接至該抽套管12〇b中，俾供該扇輪i22得以轴柱咖 為轴而相對於該殼體120自如轉動。該磁鐵咖係與定子 ιΙϋΓ產生之磁場發生磁性排斥作用’以驅動該扇輪 在此m ’由於扇輪122與習知者之驅動原理相同，故 在此不另為文贅述。 執風=可Γ本發明所揭示之具可修復電子元件之散 元至 而將控制風扇單元運轉之電子 ^主機板上而非設於風扇單元之結構中 “習^扇模組在運轉及設計上所存在的問題。> 將用以控制風扇單元12之如控片=熱風扇系統係 f合於主機板!。上，該如控制:::以 】利地在，板1G上料修復或更換，使本讀11此 統具有良好的修復性，而能有 :月之散熱風 如控制晶片m之電子元件u並非位=隹修成本。且該 120a間之間隙中，其所產生之教量即」輪皸122a與底座 有前述習知技藝因控制晶片位逸散，而不會 熱里無法有效逸除而會過熱受損的問題發生。 111590 201138603 . 再而，該如控制晶片110之電子元件11整合於主機板 10上，會使輪轂122a與底座120a間之間隙不受如护^ 片n〇之電子元件u之影響，而能進而縮;=二 扇單元12之整體高度的降低，而能符合電子產品薄小化之 需求。 再者，該如控制晶片丨10之電子元件u位於主機板 10上，會使葉片122c之面積不致受電子元件丨丨之影響而 能有效增加’葉片122e之面積能予增加，則有助於風^及 φ 散熱效率之提升。 此外，該如控制晶片110之電子元件U位於該風扇單 元12之運轉區域外，則不致干擾到風扇單元12所驅動之 氣流’故不會造成噪音之產生或影響風扇衫12之轉動穩 第二具體實施例 =3圖所示’本發明之第二具體實施例大致同於 -具肢貫_ ’故僅將差異處之風扇單以以繪示。如 所=發明第二具體實施例之風扇單元22係由殼 220、扇輪222及定子矣Hq所播士上 、，， 所構成。该定子組223係環 之軸套管22〇b外側並係安置於 220a上，該定子袓 万、，又肢之底 胁令該導電連接;有—如排線之導電連接元 (未圖示），以使敕八：：之―端係電性連接至主機 1之正合於主機板上之如抑 (未圖示）經由該導 &制日日片之電子元 電連接元件223a= 223,以驅動該扇輪 寻遞汛唬至該定子 222之轉動。亦即，該第二具體實施 111590 11 201138603 之風扇單元22未使用印刷電路板，故能使風扇單元22之 整體高度降低，以符合電子產品薄化上之需求；同時，未 使用印刷電路板能簡化風扇單元22之結構，而有降低成 本、節省組裝工時與流程之功效，復能提升本發明之散熱 風扇系統之修復性。 上述實施例僅例示性說明本發明之原理及其功效，而 非用於限制本發明。任何熟習此項技藝之人士均可在不違 背本發明之精神及範疇下，對上述實施例進行修飾與改 變。因此，本發明之權利保護範圍，應如後述之申請專利 範圍所列。 【圖式簡單說明】 第1圖係顯示本發明散熱風扇系統結合至主機板的斜 視圖； 第2圖係顯示本發明之風扇單元的剖視圖； 第3圖係顯示本發明第二具體實施例之風扇單元的剖 視圖， 第4圖係顯示習知散熱風扇之剖視圖；以及 第5圖係顯示第7,345,884號美國專利之散熱風扇剖 視圖。 11 電子元件 41、51殼體 43 印刷電路板 53 印刷電路板 【主要元件符號說明 10 主機板 12、22風扇單元 42 扇輪 52 扇輪 12 111590 201138603 100 中央處理單元 110控制晶片 111 被動元件 120 ' 220 殼體 120a 、220a底座 120b 、220b軸套管 120c 、223定子組 121a 、223a導電連接元件 122a 輪轂 122b 磁鐵 122c 葉片 122d 軸柱 121 印刷電路板 122 > 222扇輪 410 底座 411 軸套管 412 定子組 421 輪毅 422、 522葉片 423 轉軸 424 磁鐵 430 控制晶片 431 感應晶片 432 被動元件 510 底座 521 輪轂 530 控制晶片 533 延伸部 13 111590I 201138603 The wafer 110 transmits a control signal to the die set 120c of the printed circuit board 121 via the conductive connecting element ma to control the operation of the fan unit 12. The fan wheel 122 includes a wheel core, a magnet 122b disposed on the inner side of the hub i22a, a plurality of blades 122c' disposed on the outer side of the wheel valley 122a, and (d) a shaft column (four) on the wheel coffee; the shaft The column (4) is connected to the casing 12〇b, and the fan wheel i22 is freely rotatable relative to the casing 120 by the shaft. The magnets are magnetically repulsive with the magnetic field generated by the stator ΙϋΓ to drive the fan wheel. Since the fan wheel 122 has the same driving principle as the conventional one, it will not be further described herein. The wind can be used in the operation and design of the electronic module on the motherboard that controls the operation of the fan unit, rather than in the structure of the fan unit. The problem exists in the above. > The control unit for controlling the fan unit 12 = the hot fan system is attached to the motherboard! On the control unit::: Or replacement, so that the system has good repairability, and can have: the monthly heat dissipation such as the electronic component u of the control chip m is not the bit = repair cost, and the gap between the 120a, which is generated The teaching amount is that the rim 122a and the base have the aforementioned conventional techniques for controlling the wafer bit to escape, and there is no problem that the heat can not be effectively removed and the heat is damaged. 111590 201138603. Moreover, the electronic component 11 such as the control chip 110 is integrated on the motherboard 10, so that the gap between the hub 122a and the base 120a is not affected by the electronic component u such as the protective chip, and can be further Shrinking; = the overall height of the two units 12 is reduced, and can meet the needs of the thinning of electronic products. Moreover, if the electronic component u such as the control chip 10 is located on the motherboard 10, the area of the blade 122c is not affected by the electronic component 而, and the area of the blade 122e can be effectively increased, which contributes to Wind and φ increase the heat dissipation efficiency. In addition, if the electronic component U of the control chip 110 is located outside the operating area of the fan unit 12, it does not interfere with the airflow driven by the fan unit 12, so that no noise is generated or the rotation of the fan shirt 12 is stabilized. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 3 The second embodiment of the present invention is substantially the same as the one with the same. The fan unit 22 of the second embodiment of the invention is constituted by the casing 220, the fan wheel 222, and the stator 矣Hq. The stator set 223 is externally disposed on the outer side of the shaft sleeve 22〇b of the ring, and is disposed on the outer side of the shaft 220a. The stator is connected to the bottom of the limb to make the conductive connection; and the conductive connecting element such as the connecting line (not shown) So that the end of the 敕8:: is electrically connected to the host 1 and is connected to the motherboard (eg not shown) via the electronic and electrical connection element 223a= 223, to drive the fan wheel to search for the rotation of the stator 222. That is, the fan unit 22 of the second embodiment 111590 11 201138603 does not use a printed circuit board, so that the overall height of the fan unit 22 can be reduced to meet the demand for thinning of electronic products; meanwhile, the printed circuit board can be used without The structure of the fan unit 22 is simplified, and the cost is reduced, the assembly man-hour and the process are saved, and the regenerative function improves the repairability of the cooling fan system of the present invention. The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications and alterations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the patent application to be described later. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a heat dissipating fan system of the present invention coupled to a main board; Fig. 2 is a cross-sectional view showing the fan unit of the present invention; and Fig. 3 is a view showing a second embodiment of the present invention. A cross-sectional view of a fan unit, Fig. 4 is a cross-sectional view showing a conventional heat dissipating fan; and Fig. 5 is a cross-sectional view showing a heat dissipating fan of U.S. Patent No. 7,345,884. 11 electronic component 41, 51 housing 43 printed circuit board 53 printed circuit board [main component symbol description 10 motherboard 12, 22 fan unit 42 fan wheel 52 fan wheel 12 111590 201138603 100 central processing unit 110 control wafer 111 passive component 120 ' 220 housing 120a, 220a base 120b, 220b shaft sleeve 120c, 223 stator set 121a, 223a conductive connection element 122a hub 122b magnet 122c blade 122d shaft post 121 printed circuit board 122 > 222 fan wheel 410 base 411 shaft sleeve 412 Stator Set 421 Wheel 422, 522 Blade 423 Shaft 424 Magnet 430 Control Wafer 431 Sensing Wafer 432 Passive Element 510 Base 521 Hub 530 Control Wafer 533 Extension 13 111590