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TW201129807A - MEMS probe and its manufacturing method - Google Patents

MEMS probe and its manufacturing method

Info

Publication number
TW201129807A
TW201129807A TW99145817A TW99145817A TW201129807A TW 201129807 A TW201129807 A TW 201129807A TW 99145817 A TW99145817 A TW 99145817A TW 99145817 A TW99145817 A TW 99145817A TW 201129807 A TW201129807 A TW 201129807A
Authority
TW
Taiwan
Prior art keywords
needle
circuit substrate
present
manufacturing
concave slot
Prior art date
Application number
TW99145817A
Other languages
Chinese (zh)
Other versions
TWI413775B (en
Inventor
hong-guang Fan
Hong-Ren Chen
Wu-Zhen Ye
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Priority to TW99145817A priority Critical patent/TW201129807A/en
Publication of TW201129807A publication Critical patent/TW201129807A/en
Application granted granted Critical
Publication of TWI413775B publication Critical patent/TWI413775B/zh

Links

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention provides an MEMS (Micro Electro Mechanical Systems) probe and its manufacturing method. First, a circuit substrate made of ceramic material is processed to define a concave slot. Then, a needle body is formed on one surface of the circuit substrate, wherein one base of the needle body is formed on the surface of the circuit substrate and separated from the concave slot of the circuit substrate by a specific distance. The needle body has one needle arm extended from the base toward the concave slot for providing one free end. The needle body has one needle head structure including a needle tip and a needle base formed on the free end of the needle arm. As a result, the manufacturing method of the present invention does not require complicated structure computation and strict processing precision in processing the concave slot. Thus, the overall manufacturing process can be effectively simplified and the MEMS probe of the present invention has a low manufacturing cost so as to achieve the purpose of the present invention.
TW99145817A 2009-12-25 2010-12-24 MEMS probe and its manufacturing method TW201129807A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99145817A TW201129807A (en) 2009-12-25 2010-12-24 MEMS probe and its manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW98145129 2009-12-25
TW99145817A TW201129807A (en) 2009-12-25 2010-12-24 MEMS probe and its manufacturing method

Publications (2)

Publication Number Publication Date
TW201129807A true TW201129807A (en) 2011-09-01
TWI413775B TWI413775B (en) 2013-11-01

Family

ID=49990882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99145817A TW201129807A (en) 2009-12-25 2010-12-24 MEMS probe and its manufacturing method

Country Status (1)

Country Link
TW (1) TW201129807A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454706B (en) * 2012-09-07 2014-10-01 Mpi Corp Probe structure of power test and its manufacturing method
TWI565649B (en) * 2012-09-07 2017-01-11 Mpi Corp Needle body structure for power test and its preparation
US10436818B2 (en) 2016-07-25 2019-10-08 Mpi Corporation Probe module having cantilever MEMS probe and method of making the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6414501B2 (en) * 1998-10-01 2002-07-02 Amst Co., Ltd. Micro cantilever style contact pin structure for wafer probing
CN1276259C (en) * 1998-12-02 2006-09-20 佛姆法克特股份有限公司 Photoetching contact elements
TWI285741B (en) * 2005-02-02 2007-08-21 Mjc Probe Inc Testing probe
CN100516886C (en) * 2005-11-22 2009-07-22 旺矽科技股份有限公司 Probe of probe card and its manufacturing method
JP2008122330A (en) * 2006-11-15 2008-05-29 Japan Advanced Institute Of Science & Technology Hokuriku Semiconductor / ceramic composite cantilever for scanning probe microscope
KR100806736B1 (en) * 2007-05-11 2008-02-27 주식회사 에이엠에스티 Probe card and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454706B (en) * 2012-09-07 2014-10-01 Mpi Corp Probe structure of power test and its manufacturing method
TWI565649B (en) * 2012-09-07 2017-01-11 Mpi Corp Needle body structure for power test and its preparation
US10436818B2 (en) 2016-07-25 2019-10-08 Mpi Corporation Probe module having cantilever MEMS probe and method of making the same

Also Published As

Publication number Publication date
TWI413775B (en) 2013-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees