201129276 0911002 33312twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種線路板及其製作方法，且特別是 有關於一種軟硬板結構及其製作方法。 【先前技術】 、軟硬板結構是由軟性線路板以及硬性線路板所組合而 • 成的印刷線路板，其兼具有軟性線路板的可撓性以及硬性 線路板的強度。因此，軟硬板有助於提升零件連結與組裝 的设計彈性，並可提升零件連結的良率及節省空間。軟硬 板結構的製作方法可參照日本專利第2〇〇6〇2〇2891號與台 灣專利1268749所揭露的製作方法。 圖1A繪示習知之軟硬板結構的剖面圖，圖iB繪示圖 1A之軟硬板結構於軟性線路板彎折時的示意圖。 請同時參照圖1A，習知軟硬板結構1〇〇的製作方法是 _ 以一軟性線路板11〇為核心層，並在軟性線路板11()上形 成硬性線路板120。硬性線路板120具有一開口 122，開口 暴露出軟性線路板110的一可撓曲部112,以利於軟性 線路板110彎折。請參照圖1B，於實際使用時，可依使用 需求而彎折軟性線路板110的可撓曲部112。 值得注意的是，由於硬性線路板120需具有開口 122 以暴露出可撓曲部112，因此，硬性線路板120的可佈線 面積相對縮小。 201129276 0911002 33312twf.doc/n 【發明内容】 本發明提供一種軟硬板結構，其硬性線路板具有較大 的可佈線面積。 本發明提供一種軟硬板的製作方法，可增加軟硬板中 的硬性線路板的可佈線面積。 本發明提出一種軟硬板結構包括一軟性線路板、一第 連接層以及一第—硬性線路板。第一連接層配置於軟性 線路板上’且第-連接層具有至少—L以暴露出軟 性線路板的-可撓曲部。第—硬性線路板配置於第一連接 層上，且第一硬性線路板包括至少一第一絕緣層與至少一 第二線路層’[絕緣層具有—第―延伸部，第一延伸部 自第-開口的内壁朝向可撓曲部之中心延伸，第—線路芦 =置於第-絕緣層上’且部分第—線路層位於第—延伸^ =本电：之—貫施例中，第一延伸部與可撓曲部不 連且为別配置於第一連接層的兩側。 才 矣H發1之—/施例中’軟性線路板具有相對的-第 -表面與n面’且第—硬性線路板位於第弟 上’軟硬板結構更包括—第二連接層 L 、面 板。第二連接層配置於軟性線路板 線路 連接層具有至少一第二開口以暴露出軟杻線沾且第二 部。第二硬性線路板配置於第二連接層上、:可撓曲 路板包括至少一第二絕緣層與至少— 弟—硬性線 緣層具有-第二延伸部，第二 ^線路層’第二絕 "自弟二開口的内壁朝 201129276 0911002 33312twf.doc/n 向可撓曲。P之中心延伸，第二線路層配置於第二絕緣層 上且。卩分第二線路層位於第二延伸部上。 在本發明之一實施例中，第二延伸部的延伸長度小於 第一延伸部的延伸長度。 本發明提出一種軟硬板的製作方法如下所述。提供一 j性線路板、—第—連接層與—第—硬性線路板，其中第 連接層位於軟性線路板與第一硬性線路板之間，第一連 φ 接層具有至少一第一開口。壓合軟性線路板、第-連接層 與第一硬性線路板，其中第一開口暴露出軟性線路板的一 可撓曲部’第一硬性線路板配置於第一連接層上，且第一 硬性線路板包括至少一第一絕緣層與至少一第一線路層， 第一絕緣層具有一第一延伸部，第一延伸部自第一開口的 内壁朝向可撓曲部之中心延伸，第一線路層配置於第一絕 緣層上，且部分第一線路層位於第一延伸部上。 在本發明之一實施例中，第一絕緣層具有一連接部， 連接部連接第一延伸部並位於可撓曲部上方，且在壓合軟 鲁 性線路板、第一連接層與第一硬性線路板之後，軟硬板的 製作方法更包括移除連接部。 在本發明之一實施例中，軟硬板的製作方法更包括在 移除連接部之前，於連接部與第一延伸部相連之處形成至 少一溝槽’且移除連接部的步驟包括彎折第一絕緣層，以 使第一絕緣層自溝槽處斷裂。 在本發明之一實施例中，軟硬板的製作方法更包括提 供一第二連接層與一第二硬性線路板，其中第二連接層位 5 201129276。·歸 於軟性線路板與第二硬性線路板之間，第二連接層具有至 少一第二開口，以及壓合軟性線路板、第一連接層與第一 硬性線路板的步驟包括將第二連接層與第二硬性線路板壓 合至軟性線路板，其中第二開口暴露出軟性線路板的可撓 曲部，第二硬性線路板配置於第二連接層上，且第二硬性 線路板包括至少一第二絕緣層與至少—第二線路層，第二 絕緣層具有一第二延伸部，第二延伸部自第二開口的内壁 朝向可撓曲部之中心延伸，第二線路層配置於第二絕緣層 上，且部分第二線路層位於第二延伸部上。 本發明提出一種軟硬板的製作方法如下所述。提供一 軟性線路板。於軟性線路板上形成一第一連接層，第一連 接層具有至少-第-開口 ’第一開口暴露出軟性線路板的 —可撓曲部。於第一連接層上形成一第一絕緣層，且第一 '、'邑''彖層具有一第一㈣申部’第一延伸部自第一開口的内壁 朝向可撓曲部之中心延伸。於第一絕緣層上形成一第一線 路層，部分第一線路層位於第一延伸部上。 、在本發明之一實施例中，第一絕緣層具有一連接部， 連接部連接第一延伸部並位於可撓曲部上方，且在形成第 一絕緣層之後，軟硬板的製作方法更包括移除連接部。 在本發明之一實施例中，軟硬板的製作方法更包括在 ,除連接部之則，於連接部與第一延伸部相連之處形成至 溝槽，且移除連接部的步驟包括彎折第一絕緣層，以 使第一絕緣層自溝槽處斷裂。 在本發明之一實施例中，軟硬板的製作方法更包括下 201129276 賺 33312twf.doc/n 述步驟。於軟性線路板上形成一第二連接層，其中軟性線 路板位於第一連接層與第二連接層之間，第二連接層具有 至乂 第一開口’弟—開口暴露出軟性線路板的可挽曲 部^於第二連接層上形成一第二絕緣層，第二絕緣層具有 一第一延伸部’第二延伸部自第二開口的内壁朝向可撓曲 部之中心延伸。於第二絕緣層上形成一第二線路層，部分 第二線路層位於第二延伸部上。 基於上述’由於本發明的硬性線路板的絕緣層具有延 伸到可撓曲部上方且與可撓曲部分離的延伸部，且部分線 路層可配置於延伸部上，故硬性線路板的絕緣層的可佈線 面積增加。 —為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖2A繪不本發明一實施例之軟硬板結構的剖面圖， 擊 2B繪示圖2A之軟硬板結構於軟性線路板彎折時的示意 圖。圖3A繪不圖2A之軟硬板結構的一種變化，圖犯繪 示圖3A之軟硬板結構於軟性線路板彎折時的示意圖。 請參照圖2A，本實施例之軟硬板結構2〇〇包括一軟 性，路板21G、-第-連接層22()、—第—硬性線路板23〇、 一第一連接層240以及一第二硬性線路板25〇。 在本實施例中，軟性線路板21〇具有相對的一第—表 面212與-第二表面214，且第一連接層22〇與第二連接 201129276_ 層240分別配置於軟性線路板210的第一表面212與第二 表面214上。第一連接層220具有一第一開口 222，第二 連接層240具有一第二開口 242,第一開口 222與第二開 口 242皆暴露出軟性線路板210的一可撓曲部216。在本 實施例中，二線路層LI、L2可選擇性地配置於第一連接 層220與第二連接層240上。 第一硬性線路板230配置於第一連接層220上，且第 一硬性線路板230包括一第一絕緣層232與一第一線路層 234。第一絕緣層232具有一第一延伸部232a。第一延伸 部232a自第一開口 222的内壁222a朝向可撓曲部216之 中心延伸。在本實施例中，第一延伸部232a與可撓曲部 216不相連且分別配置於第一連接層220的兩側。 第一線路層234配置於第一絕緣層232上，且部分第 一線路層234位於第一延伸部232a上。換言之，第一線路 層234可順著第一延伸部232a而延伸到可撓曲部216上方 並與可撓曲部216重疊。因此，第一絕緣層232可具有較 大的可佈線面積。 第二硬性線路板250配置於第二連接層240上，且第 二硬性線路板250包括一第二絕緣層252與一第二線路層 254。第二線路層254配置於第二絕緣層252上。第二絕緣 層252具有一開口 OP，開口 〇p位於第二開口 242上方並 暴露出可撓曲部216。 請參照圖2B ’當彎折軟性線路板210的可撓曲部216 時，第一硬性線路板230可保持平板狀，且第一延伸部232& 201129276 υ^ιιυυ2 333i2twf.d〇c/n 可位於聲折的可撓曲部216側邊，因此，第一延伸部232a 可增加料的可撓曲部216周邊的空間利用率。 在其他實施例中，請同時參照圖3A與圖3B，軟硬板 結構3GG的第—硬性線路板23()可具有多層第一絕緣層 232與多層第—線路層234，且各第一絕緣層232可位於任 兩相鄰的第—線路層234之間，或是位於第-線路層234 與線路層L1之間。此外，軟硬板結構3〇〇的第二硬性線 φ 路板250可具有多層第二絕緣層252與多層第二線路層 254，且各第二絕緣層252可位於任兩相鄰的第二線路層 254之間，或是位於第二線路層254與線路層L2之間。 圖4A繪示本發明一實施例之軟硬板結構的剖面圖， 圖4B繪示圖4A之軟硬板結構於軟性線路板彎折時的示意 圖。請參照圖4A，本實施例之軟硬板結構400相似於圖 3A與圖3B的軟硬板結構3〇〇，兩者的差異之處在於軟硬 板結構400的各第二絕緣層252具有一第二延伸部252a， 第二延伸部252a自第二開口 242的内壁242a朝向可撓曲 # 部216之中心延伸，第二線路層254配置於第二絕緣層252 上’且部分第二線路層254位於第二延伸部252a上。 在本實施例中，第二延伸部252a的延伸長度A2小於 第一延伸部232a的延伸長度A1。因此，當彎折軟性線路 板210的可撓曲部216時（如圖4B所示），第一硬性線 路板230適於位在彎折的軟性線路板210外側，而第二硬 性線路板250適於位在彎折的軟性線路板210内側。 以下將介紹以壓合法(laminate)或增層法（build up ) 201129276 J3312twf.doc/n 製作圖2A的軟硬板結構200的詳細製程。 圖5A〜圖5B繪示本發明一實施例之軟硬板的製程剖 面圖。圖6繪示圖5B之軟硬板結構的一種變化。 首先，請參照圖5A，提供一軟性線路板210、一第一 連接層220、一第一硬性線路板230、一第二連接層240 與一第二硬性線路板250。軟性線路板210具有相對的一 第一表面212與一第二表面214，第一連接層220與第二 連接層240分別位於第一表面212與第二表面214上。 第一連接層220位於軟性線路板210與第一硬性線路 板230之間，第二連接層240位於軟性線路板210與第二 硬性線路板250之間。第一連接層220具有一第一開口 222，第二連接層240具有一第二開口 242。 接著，請參照圖5B，壓合軟性線路板210、第一連接 層220、第一硬性線路板230、第二連接層240與第二硬性 線路板250 ’其中第一開口 222與第二開口 242皆暴露出 軟性線路板210的一可撓曲部216。 第一硬性線路板230配置於第一連接層220上，且第 一硬性線路板230包括一第一絕緣層232、二第一線路層 234與多個貫穿第一絕緣層232的鍍通孔236。第一絕緣層 232具有一第一延伸部232a，第一延伸部232a自第一開口 222的内壁222a朝向可撓曲部216之中心延伸。第一線路 層234配置於第一絕緣層232的相對二表面232c、232d 上，且部分第一線路層234位於第一延伸部232a上，其中 鍍通孔236電性連接二第一線路層234。 201129276 0911002 33312twf.d〇c/n 第二硬性線路板250配置於第二連接層240上，且第 二硬性線路板250包括一第二絕緣層252、二第二線路層 254與多個貫穿第二絕緣層252的鍍通孔256。第二線路層 254配置於第二絕緣層252的相對二表面252b、252c上， 且鍍通孔256電性連接二第二線路層254。值得注意的是， 本實施例之第二絕緣層252亦可如同圖4A的第二絕緣層 252 —般具有一第二延伸部252a，且部分第二線路層254 可形成於第二延伸部252a上。 在本實施例中，可選擇性地形成多個貫穿第一硬性線 路板230、軟性線路板210與第二硬性線路板250的導電 貫孔T ’以使第一硬性線路板230、軟性線路板210與第 二硬性線路板250彼此之間電性連接。 在其他實施例中，請參照圖6，可在壓合軟性線路板 210、第一連接層220、第一硬性線路板230、第二連接層 240與第二硬性線路板250之後，將一配置有第一線路層 234a的第一絕緣層232b疊合至第一絕緣層232上，並且 將一配置有第二線路層254a的第二絕緣層252b疊合至第 二絕緣層252上。之後，可形成一導電貫孔T1，導電貫孔 T1貫穿第一絕緣層232、232b、軟性線路板210、第二絕 緣層252、252b，並電性連接第一線路層234、234a、軟性 線路板210、第二線路層254、254a。 圖7A〜圖7D續示本發明一實施例之軟硬板的製程剖 面圖。圖8繪示圖7D之軟硬板結構的一種變化。 首先’請參照圖7A，提供一軟性線路板210，軟性線 11 201129276 ιυυώ J3312twf.doc/n 路，210具有相對的—第一表面212與一第二表面。 著在第表面212形成一第一連接層220，且形成第 -連接層220的方法為在軟性線路板21()上塗佈一滕層。 ^ 詳細而言’第—連接層220具有一第一開口 222，且 第一開口 222暴露出軟性線路板210的-可撓曲部216。 然後，請參照圖7B，於第一連接層220上形成一線 路層L1。之後，將一第一絕緣層232形成於第一連接層 220上。詳細而言，在本實施例中，第一絕緣層232具有 一第一延伸部232a與一連接部232e，第一延伸部232a自 第一開口 222的内壁222a朝向可撓曲部216之中心延伸。 連接部232e連接第一延伸部232a並位於第一開口 222上 方。 之後，請參照圖7C，於第一絕緣層232上形成—第 一線路層234，其中部分第一線路層234位於第一延伸部 232a上。然後’在本實施例中，可選擇性地形成多個鍍通 孔236。鍍通孔236貫穿第一絕緣層232並電性連接第— 線路層234與線路層L1。在本實施例中，可在第一絕緣層 232上形成多個第一溝槽，其中第一溝槽位於連接 部232e與第一延伸部232a相連之處。 然後，可在軟性線路板210的第二表面214上依序形 成一第二連接層240、一線路層L2、一第二絕緣層252與 一第二線路層254，其中第二連接層24〇具有一第二開口 242 ’且第二開口 242亦暴露出可撓曲部216。第二絕緣層 252覆蓋第二開口 242。 12 201129276 0911002 33312twf.doc/n 、接著，可形成多個貫穿第二絕緣層252的鏡通孔256， 鍵通孔256電性連接第二線路層254與線路層。之後， I形成多個導電貫孔τ’導電貫孔τ貫穿第__絕緣層232、 第-連接層220、軟性線路板21〇、第二連接層24〇與第二 絕緣層252，並電性連接第-線路I 234、線路層U、軟 性線路板210、線路層L2與第二線路層254。 、在本實施例中，可在第二絕緣層252上形成多個第二 溝槽R2 ’第二溝槽R2位於第二開口 242上方。第二絕緣 層252藉由第二溝槽R2定義出一保留部252d與一連接部 252e。詳細而言，第二溝槽R2位於第二絕緣層252之保 留部252d與連接部252e相連之處。 之後，請參照圖7D，移除連接部232e、252e。詳細 而5，移除連接部232e、252e的方法為彎折第一絕緣層 232與第二絕緣層252,以使第一絕緣層232與第二絕緣層 252分別自第一溝槽R1與第二溝槽R2處斷裂。 此外，移除連接部232e、252e的方法也可以是以雷 馨 射切割的方式切斷第一絕緣層232之連接部232e與第一延 伸部232a相連的部分以及第二絕緣層252之保留部252d 與連接部252e相連的部分。 在其他實施例中’請參照圖8，可在形成鍍通孔236、 256之後，將一第一絕緣層232b與一第二絕緣層252b分 別形成於第一絕緣層232與第二絕緣層252上。之後，在 第一絕緣層232b與第二絕緣層252b上分別形成一第一線 路層234a與一第二線路層254a，並且，形成多個鍍通孔 13 201129276 j3312twf.doc/n 236a、256a以及—導電貫孔丁丨。鍍通孔236a貫穿第一絕 緣層23处並電性連接第一線路層234、234a。鍍通孔256a 貫穿第二絕緣層252b並電性連接第二線路層254、254a。 導電貫孔11貫穿第一絕緣層232、232b、第一連接層220、 軟性線路板210、第二連接層240與第二絕緣層252、252b， 亚電性連接第一線路層234、234a、線路層L1、軟性線路 板210、線路層L2與第二線路層254、254a。 练上所述，本發明的硬性線路板的絕緣層具有延伸到 可撓曲。卩上方且與可撓曲部分離的延伸部，且線路層可配 置於1伸σ卩上，，因此，硬性線路板的絕緣層的可佈線面積 增加。此外，當軟性線路板的可撓曲部彎折時，硬性線路 =依然保持平板狀’且延伸部可位於彎折的可撓曲部側 ^ 口此，延伸部可增加彎折的可撓曲部周邊的空間利用 率。 表雖然本發明已以實施例揭露如上，然其並非用以限定 本毛明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與㈣，故本 發明之保護範圍當視後社_請專職賴界定者為準。 【圖式簡單說明】 圖1A繪示習知之軟硬板結構的剖面圖。 —立圖1B_® 1A之軟硬板結構於軟性線路板彎折時的 不意圖。 圖2A繪示本發明—實施例之軟硬板結構的剖面圖。 14 201129276 0911002 33312twf.doc/n 圖2B繪示圖2A之軟硬板結構於軟性線路板彎折時的 示意圖。 圖3A繪示圖2A之軟硬板結構的一種變化。 圖3B繪示® 3A之軟硬板結構於軟性線路板彎折時的 示意圖。 圖4A緣示本發明-實施例之軟硬板結構的剖面圖。 圖犯緣示圖4A之軟硬板結構於軟性線路板彎折時的 示意圖。201129276 0911002 33312twf.doc/n VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a circuit board and a method of fabricating the same, and more particularly to a soft and hard board structure and a method of fabricating the same. [Prior Art] A soft and hard board structure is a printed wiring board which is composed of a flexible circuit board and a rigid wiring board, and has both the flexibility of a flexible wiring board and the strength of a rigid wiring board. Therefore, the soft and hard boards help to improve the design flexibility of part joining and assembly, and improve the connection yield and space saving of parts. The manufacturing method of the soft and hard board structure can be referred to the manufacturing method disclosed in Japanese Patent No. 2, No. 2, 289, and Taiwan Patent No. 1,268,749. 1A is a cross-sectional view showing a conventional soft and hard board structure, and FIG. 1B is a schematic view showing the soft and hard board structure of FIG. 1A when the flexible circuit board is bent. Referring to FIG. 1A at the same time, the conventional method for manufacturing the flexible board structure is to use a flexible circuit board 11 as a core layer and a rigid circuit board 120 on the flexible circuit board 11 (). The rigid circuit board 120 has an opening 122 that exposes a flexible portion 112 of the flexible circuit board 110 to facilitate bending of the flexible circuit board 110. Referring to FIG. 1B, in actual use, the flexible portion 112 of the flexible circuit board 110 can be bent according to the needs of use. It is to be noted that since the rigid wiring board 120 needs to have the opening 122 to expose the flexible portion 112, the wiring area of the rigid wiring board 120 is relatively reduced. 201129276 0911002 33312twf.doc/n SUMMARY OF THE INVENTION The present invention provides a soft and hard board structure in which a rigid wiring board has a large wiring area. The invention provides a method for manufacturing a soft and hard board, which can increase the routable area of the rigid circuit board in the soft and hard board. The invention provides a soft and hard board structure comprising a flexible circuit board, a first connecting layer and a first rigid circuit board. The first tie layer is disposed on the flexible circuit board' and the first connection layer has at least -L to expose the flexible portion of the flexible circuit board. The first rigid circuit board is disposed on the first connection layer, and the first rigid circuit board includes at least one first insulation layer and at least one second circuit layer '[the insulation layer has a first extension portion, and the first extension portion is from the first extension portion - the inner wall of the opening extends toward the center of the flexible portion, the first line is placed on the first insulating layer and the portion of the first line is located at the first - extension ^ = local power: - the first embodiment, the first The extension portion is not connected to the flexible portion and is disposed on both sides of the first connection layer. In the case of the invention, the 'soft circuit board has the opposite-first surface and the n-side' and the first hard circuit board is located on the first brother'. The soft and hard board structure further includes the second connection layer L, panel. The second connection layer is disposed on the flexible circuit board. The connection layer has at least one second opening to expose the soft line and the second portion. The second rigid circuit board is disposed on the second connection layer, the flexible circuit board includes at least one second insulation layer and at least one of the hard-core layer has a second extension, and the second circuit layer is second. The inner wall of the opening of the second brother is flexible toward 201129276 0911002 33312twf.doc/n. The center of the P extends, and the second circuit layer is disposed on the second insulating layer. The second circuit layer is located on the second extension. In an embodiment of the invention, the second extension has an extension length that is less than an extension of the first extension. The invention provides a method for manufacturing a soft and hard board as follows. A j-type circuit board, a first connection layer and a first hard circuit board are provided, wherein the first connection layer is located between the flexible circuit board and the first rigid circuit board, and the first connection layer has at least one first opening. Pressing the flexible circuit board, the first connection layer and the first rigid circuit board, wherein the first opening exposes a flexible portion of the flexible circuit board. The first rigid circuit board is disposed on the first connection layer, and the first rigid The circuit board includes at least one first insulating layer and at least one first circuit layer, the first insulating layer has a first extending portion, and the first extending portion extends from an inner wall of the first opening toward a center of the flexible portion, the first line The layer is disposed on the first insulating layer, and a portion of the first circuit layer is located on the first extension. In an embodiment of the invention, the first insulating layer has a connecting portion connecting the first extending portion and located above the flexible portion, and pressing the soft circuit board, the first connecting layer and the first After the rigid circuit board, the method of manufacturing the soft and hard board further includes removing the connection portion. In an embodiment of the present invention, the method for manufacturing the soft and hard board further includes forming at least one trench at a portion where the connecting portion is connected to the first extending portion before removing the connecting portion, and the step of removing the connecting portion includes bending The first insulating layer is folded to break the first insulating layer from the trench. In an embodiment of the invention, the method for fabricating the soft and hard board further comprises providing a second connection layer and a second rigid circuit board, wherein the second connection layer is 5201129276. Between the flexible circuit board and the second rigid circuit board, the second connection layer has at least one second opening, and the step of pressing the flexible circuit board, the first connection layer and the first rigid circuit board includes the second connection layer Pressing with the second rigid circuit board to the flexible circuit board, wherein the second opening exposes the flexible portion of the flexible circuit board, the second rigid circuit board is disposed on the second connecting layer, and the second rigid circuit board includes at least one a second insulating layer and at least a second circuit layer, the second insulating layer has a second extending portion, the second extending portion extends from the inner wall of the second opening toward the center of the flexible portion, and the second circuit layer is disposed in the second On the insulating layer, and a portion of the second circuit layer is located on the second extension. The invention provides a method for manufacturing a soft and hard board as follows. A flexible circuit board is provided. A first connection layer is formed on the flexible circuit board, and the first connection layer has at least a first opening - the first opening exposes a flexible portion of the flexible circuit board. Forming a first insulating layer on the first connecting layer, and the first ', '邑'' layer has a first (four) portion "the first extending portion extends from the inner wall of the first opening toward the center of the flexible portion . A first wiring layer is formed on the first insulating layer, and a portion of the first wiring layer is located on the first extending portion. In an embodiment of the invention, the first insulating layer has a connecting portion, the connecting portion is connected to the first extending portion and located above the flexible portion, and after the first insulating layer is formed, the method for manufacturing the soft and hard plate is further This includes removing the connection. In an embodiment of the present invention, the method for manufacturing the soft and hard board further comprises: forming, in addition to the connecting portion, a groove to the connecting portion where the connecting portion is connected to the first extending portion, and the step of removing the connecting portion comprises bending The first insulating layer is folded to break the first insulating layer from the trench. In an embodiment of the present invention, the method for manufacturing the soft and hard board further includes the steps of 2011312276 earning 33312twf.doc/n. Forming a second connection layer on the flexible circuit board, wherein the flexible circuit board is located between the first connection layer and the second connection layer, and the second connection layer has a first open circuit opening to the first opening The second bending layer forms a second insulating layer on the second connecting layer, and the second insulating layer has a first extending portion. The second extending portion extends from the inner wall of the second opening toward the center of the flexible portion. A second circuit layer is formed on the second insulating layer, and a portion of the second circuit layer is located on the second extension. The insulating layer of the rigid wiring board is based on the above-mentioned "the insulating layer of the rigid wiring board of the present invention has an extension portion extending above the flexible portion and separated from the flexible portion, and a part of the wiring layer can be disposed on the extending portion The cabling area is increased. The above-described features and advantages of the present invention will become more apparent from the following description. [Embodiment] FIG. 2A is a cross-sectional view showing a structure of a soft and hard board according to an embodiment of the present invention, and FIG. 2B is a view showing a soft and hard board structure of FIG. 2A when the flexible circuit board is bent. Fig. 3A shows a variation of the soft and hard board structure of Fig. 2A, and shows a schematic view of the soft and hard board structure of Fig. 3A when the flexible circuit board is bent. Referring to FIG. 2A, the soft and hard board structure 2 of the present embodiment includes a soft board, a road board 21G, a first connection layer 22 (), a first hard circuit board 23, a first connection layer 240, and a The second rigid wiring board 25 is. In this embodiment, the flexible circuit board 21 has an opposite first surface 212 and a second surface 214, and the first connection layer 22 and the second connection 201129276_ layer 240 are respectively disposed on the first of the flexible circuit board 210. Surface 212 and second surface 214. The first connecting layer 220 has a first opening 222, and the second connecting layer 240 has a second opening 242. The first opening 222 and the second opening 242 both expose a flexible portion 216 of the flexible circuit board 210. In this embodiment, the two circuit layers LI, L2 are selectively disposed on the first connection layer 220 and the second connection layer 240. The first rigid circuit board 230 is disposed on the first connection layer 220, and the first rigid circuit board 230 includes a first insulation layer 232 and a first circuit layer 234. The first insulating layer 232 has a first extension 232a. The first extension portion 232a extends from the inner wall 222a of the first opening 222 toward the center of the flexible portion 216. In this embodiment, the first extending portion 232a is not connected to the flexible portion 216 and is disposed on both sides of the first connecting layer 220. The first circuit layer 234 is disposed on the first insulating layer 232, and a portion of the first circuit layer 234 is located on the first extending portion 232a. In other words, the first wiring layer 234 can extend over the flexible portion 216 along the first extension 232a and overlap the flexible portion 216. Therefore, the first insulating layer 232 can have a large wiring area. The second rigid wiring board 250 is disposed on the second connecting layer 240, and the second rigid wiring board 250 includes a second insulating layer 252 and a second wiring layer 254. The second wiring layer 254 is disposed on the second insulating layer 252. The second insulating layer 252 has an opening OP, and the opening 〇p is located above the second opening 242 and exposes the flexible portion 216. Referring to FIG. 2B, when the flexible portion 216 of the flexible circuit board 210 is bent, the first rigid wiring board 230 can maintain a flat shape, and the first extension portion 232 & 201129276 υ^ιιυυ2 333i2twf.d〇c/n can be Located on the side of the flexibly deflectable portion 216, the first extension 232a can increase the space utilization around the flexible portion 216 of the material. In other embodiments, referring to FIG. 3A and FIG. 3B simultaneously, the first rigid circuit board 23 of the soft and hard board structure 3GG may have a plurality of first insulating layers 232 and a plurality of first wiring layers 234, and each first insulating layer Layer 232 can be between any two adjacent first line layers 234 or between first line layer 234 and line layer L1. In addition, the second rigid line φ board 250 of the soft and hard board structure may have a plurality of second insulating layers 252 and a plurality of second wiring layers 254, and each of the second insulating layers 252 may be located at any two adjacent second Between the circuit layers 254, or between the second circuit layer 254 and the circuit layer L2. 4A is a cross-sectional view showing the structure of a soft and hard board according to an embodiment of the present invention, and FIG. 4B is a schematic view showing the structure of the soft and hard board of FIG. 4A when the flexible circuit board is bent. Referring to FIG. 4A, the soft and hard board structure 400 of the present embodiment is similar to the soft and hard board structure 3 of FIG. 3A and FIG. 3B, and the difference is that each second insulating layer 252 of the soft and hard board structure 400 has a second extension portion 252a extending from the inner wall 242a of the second opening 242 toward the center of the flexible portion 216, the second circuit layer 254 being disposed on the second insulation layer 252' and a portion of the second line Layer 254 is located on second extension 252a. In the present embodiment, the extension length A2 of the second extension portion 252a is smaller than the extension length A1 of the first extension portion 232a. Therefore, when the flexible portion 216 of the flexible circuit board 210 is bent (as shown in FIG. 4B), the first rigid wiring board 230 is adapted to be positioned outside the bent flexible circuit board 210, and the second rigid wiring board 250 is Suitable for positioning inside the bent flexible circuit board 210. The detailed process of fabricating the soft and hard board structure 200 of Fig. 2A by laminating or build up 201129276 J3312twf.doc/n will be described below. 5A to 5B are cross-sectional views showing the process of a soft and hard board according to an embodiment of the present invention. Figure 6 illustrates a variation of the soft and hard board structure of Figure 5B. First, referring to FIG. 5A, a flexible circuit board 210, a first connecting layer 220, a first rigid wiring board 230, a second connecting layer 240 and a second rigid wiring board 250 are provided. The flexible circuit board 210 has a first surface 212 and a second surface 214. The first connecting layer 220 and the second connecting layer 240 are located on the first surface 212 and the second surface 214, respectively. The first connection layer 220 is located between the flexible circuit board 210 and the first rigid wiring board 230, and the second connection layer 240 is located between the flexible circuit board 210 and the second rigid wiring board 250. The first connection layer 220 has a first opening 222, and the second connection layer 240 has a second opening 242. Next, referring to FIG. 5B, the flexible circuit board 210, the first connection layer 220, the first rigid wiring board 230, the second connection layer 240, and the second rigid wiring board 250' are laminated to the first opening 222 and the second opening 242. A flexible portion 216 of the flexible circuit board 210 is exposed. The first rigid circuit board 230 is disposed on the first connection layer 220, and the first rigid circuit board 230 includes a first insulation layer 232, two first circuit layers 234, and a plurality of plated through holes 236 extending through the first insulation layer 232. . The first insulating layer 232 has a first extension 232a that extends from the inner wall 222a of the first opening 222 toward the center of the flexible portion 216. The first circuit layer 234 is disposed on the opposite surface 232c, 232d of the first insulating layer 232, and a portion of the first circuit layer 234 is located on the first extending portion 232a. The plated through hole 236 is electrically connected to the first circuit layer 234. . 201129276 0911002 33312twf.d〇c/n The second rigid circuit board 250 is disposed on the second connection layer 240, and the second rigid circuit board 250 includes a second insulation layer 252, two second circuit layers 254 and a plurality of through A through hole 256 is formed in the second insulating layer 252. The second circuit layer 254 is disposed on the opposite surfaces 252b and 252c of the second insulating layer 252, and the plated through holes 256 are electrically connected to the second circuit layers 254. It should be noted that the second insulating layer 252 of the embodiment may also have a second extending portion 252a as the second insulating layer 252 of FIG. 4A, and a portion of the second wiring layer 254 may be formed on the second extending portion 252a. on. In this embodiment, a plurality of conductive through holes T′ penetrating through the first rigid circuit board 230, the flexible circuit board 210, and the second rigid circuit board 250 are selectively formed to make the first rigid circuit board 230 and the flexible circuit board. 210 and the second rigid wiring board 250 are electrically connected to each other. In other embodiments, referring to FIG. 6, after the flexible circuit board 210, the first connection layer 220, the first rigid circuit board 230, the second connection layer 240, and the second rigid circuit board 250 are pressed, a configuration is performed. The first insulating layer 232b having the first wiring layer 234a is laminated on the first insulating layer 232, and a second insulating layer 252b configured with the second wiring layer 254a is laminated on the second insulating layer 252. Then, a conductive through hole T1 is formed. The conductive through hole T1 penetrates through the first insulating layer 232, 232b, the flexible circuit board 210, the second insulating layer 252, 252b, and is electrically connected to the first circuit layer 234, 234a, and the flexible circuit. Plate 210, second circuit layer 254, 254a. 7A to 7D are cross-sectional views showing the process of a soft and hard plate according to an embodiment of the present invention. Figure 8 illustrates a variation of the soft and hard board structure of Figure 7D. First, please refer to FIG. 7A, a flexible circuit board 210 is provided, and the flexible line 11 201129276 ιυυώ J3312 twf.doc/n path 210 has an opposite first surface 212 and a second surface. A first connecting layer 220 is formed on the first surface 212, and the first connecting layer 220 is formed by coating a thin layer on the flexible wiring board 21 (). ^ In detail, the first connection layer 220 has a first opening 222, and the first opening 222 exposes the flexible portion 216 of the flexible wiring board 210. Then, referring to FIG. 7B, a wiring layer L1 is formed on the first connection layer 220. Thereafter, a first insulating layer 232 is formed on the first connection layer 220. In detail, in the embodiment, the first insulating layer 232 has a first extending portion 232a and a connecting portion 232e extending from the inner wall 222a of the first opening 222 toward the center of the flexible portion 216. . The connecting portion 232e is connected to the first extending portion 232a and located above the first opening 222. Thereafter, referring to FIG. 7C, a first wiring layer 234 is formed on the first insulating layer 232, and a portion of the first wiring layer 234 is located on the first extension portion 232a. Then, in the present embodiment, a plurality of plated through holes 236 are selectively formed. The plated through hole 236 penetrates the first insulating layer 232 and is electrically connected to the first wiring layer 234 and the wiring layer L1. In the present embodiment, a plurality of first trenches may be formed on the first insulating layer 232, wherein the first trenches are located where the connecting portion 232e is connected to the first extending portion 232a. Then, a second connection layer 240, a circuit layer L2, a second insulation layer 252 and a second circuit layer 254 may be sequentially formed on the second surface 214 of the flexible circuit board 210, wherein the second connection layer 24〇 There is a second opening 242' and the second opening 242 also exposes the flexible portion 216. The second insulating layer 252 covers the second opening 242. 12 201129276 0911002 33312twf.doc/n Next, a plurality of mirror vias 256 extending through the second insulating layer 252 may be formed, and the key vias 256 are electrically connected to the second wiring layer 254 and the wiring layer. Thereafter, I forms a plurality of conductive through holes τ' conductive through holes τ through the __ insulating layer 232, the first connecting layer 220, the flexible wiring board 21 〇, the second connecting layer 24 〇 and the second insulating layer 252, and The first connection line-line I 234, the circuit layer U, the flexible circuit board 210, the circuit layer L2 and the second circuit layer 254 are connected. In this embodiment, a plurality of second trenches R2' may be formed on the second insulating layer 252. The second trenches R2 are located above the second openings 242. The second insulating layer 252 defines a remaining portion 252d and a connecting portion 252e by the second trench R2. In detail, the second trench R2 is located where the retention portion 252d of the second insulating layer 252 is connected to the connection portion 252e. Thereafter, referring to FIG. 7D, the connecting portions 232e, 252e are removed. 5, the method of removing the connecting portions 232e, 252e is to bend the first insulating layer 232 and the second insulating layer 252 so that the first insulating layer 232 and the second insulating layer 252 are respectively from the first trench R1 and the first trench The two grooves R2 are broken. In addition, the method of removing the connecting portions 232e, 252e may also cut the portion of the connecting portion 232e of the first insulating layer 232 that is connected to the first extending portion 232a and the remaining portion of the second insulating layer 252 in a manner of cutting. 252d is a portion connected to the connecting portion 252e. In other embodiments, please refer to FIG. 8 , after forming the plated through holes 236 , 256 , a first insulating layer 232 b and a second insulating layer 252 b are respectively formed on the first insulating layer 232 and the second insulating layer 252 . on. Thereafter, a first wiring layer 234a and a second wiring layer 254a are formed on the first insulating layer 232b and the second insulating layer 252b, respectively, and a plurality of plated through holes 13 are formed, 201129276 j3312twf.doc/n 236a, 256a, and - Conductive through-holes. The plated through holes 236a penetrate through the first insulating layer 23 and are electrically connected to the first wiring layers 234, 234a. The plated through holes 256a penetrate the second insulating layer 252b and are electrically connected to the second circuit layers 254, 254a. The conductive via 11 penetrates through the first insulating layer 232, 232b, the first connecting layer 220, the flexible wiring board 210, the second connecting layer 240 and the second insulating layer 252, 252b, and electrically connects the first circuit layers 234, 234a, The circuit layer L1, the flexible wiring board 210, the wiring layer L2, and the second wiring layers 254, 254a. As described above, the insulating layer of the rigid wiring board of the present invention has an extension to be flexible. An extension portion above the crucible and separated from the flexible portion, and the wiring layer can be disposed on the extension σ, whereby the wiring area of the insulating layer of the rigid wiring board is increased. In addition, when the flexible portion of the flexible circuit board is bent, the rigid line = still maintains a flat shape and the extension portion can be located on the side of the bent flexible portion, and the extension portion can increase the flexibility of the bending. Space utilization around the department. The present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. Any one of ordinary skill in the art can make some changes and (4) without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is subject to the definition of the post-service. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a cross-sectional view showing a conventional soft and hard plate structure. —The intention of the soft and hard board structure of the vertical 1B_® 1A when the flexible circuit board is bent. 2A is a cross-sectional view showing the structure of a soft and hard plate of the present invention. 14 201129276 0911002 33312twf.doc/n FIG. 2B is a schematic view showing the soft and hard board structure of FIG. 2A when the flexible circuit board is bent. FIG. 3A illustrates a variation of the soft and hard board structure of FIG. 2A. Fig. 3B is a schematic view showing the soft and hard plate structure of the ® 3A when the flexible circuit board is bent. Fig. 4A is a cross-sectional view showing the structure of the soft and hard plate of the present invention. Fig. 4A is a schematic view showing the soft and hard board structure of Fig. 4A when the flexible circuit board is bent.
圖5A〜圖5B繪示本發明―實施例之軟硬板的製程剖 圖6繪示圖5B之軟硬板結構的一種變化。 面圖 圖7A〜圖7D繪示本發明-實施例之軟硬板的製程剖 〇 圖8繪示圖7D之軟硬板結構的—種纟諮化。 【主要元件符號說明】 # 100、200、300、400 :軟硬板結構 110、210 :軟性線路板 112、216 :可撓曲部 120 :硬性線路板 122 :開口 212 :第一表面 214 :第二表面 220 :第一連接層 15 ι^312twf.doc/n 201129276 222 :第一開口 222a、242a :内壁 230 :第一硬性線路板 232、232b、910 :第一絕緣層 232a、912 :第一延伸部 232c、232d、252b、252c :表面 232e、252e :連接部 234、234a :第一線路層 236、236a、256、256a :鍍通孔 240 :第二連接層 242 :第二開口 250 :第二硬性線路板 252、252b :第二絕緣層 252a :第二延伸部 252d :保留部 254、254a :第二線路層5A to 5B illustrate a process section of the soft and hard board of the embodiment of the present invention. FIG. 6 illustrates a variation of the soft and hard board structure of FIG. 5B. 7A to 7D are cross-sectional views showing the process of the soft and hard board of the present invention. Fig. 8 is a view showing the structure of the soft and hard board of Fig. 7D. [Main component symbol description] #100, 200, 300, 400: soft and hard board structure 110, 210: flexible circuit board 112, 216: flexible portion 120: rigid wiring board 122: opening 212: first surface 214: Two surfaces 220: first connection layer 15 ι^312twf.doc/n 201129276 222: first opening 222a, 242a: inner wall 230: first rigid wiring board 232, 232b, 910: first insulating layer 232a, 912: first Extensions 232c, 232d, 252b, 252c: surfaces 232e, 252e: connection portions 234, 234a: first circuit layers 236, 236a, 256, 256a: plated through holes 240: second connection layer 242: second opening 250: Two rigid circuit boards 252, 252b: second insulating layer 252a: second extension 252d: retention portions 254, 254a: second circuit layer
Al、A2 :延伸長度 LI、L2 :線路層 OP :開口 R1 :第一溝槽 R2 :第二溝槽 T、T1 :導電貫孔 16Al, A2: extension length LI, L2: circuit layer OP: opening R1: first trench R2: second trench T, T1: conductive via 16