201128130 EL98033 31639twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種光源模組以及散熱元件 是有關於-種_發光二極體晶片作為發光元 = 組以及散熱塊。 【先前技術】 隨著半導體科技的進步，現今的發光二極 emmmg diode，LED)可發出高亮度的光線，並且 電、體積小、低電壓驅動等優點，因此發光二極體^ ^ 地應用於各種照明設備中。 K之201128130 EL98033 31639twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a light source module and a heat dissipating component which are related to a light-emitting diode chip as a light-emitting element=group and heat dissipation Piece. [Prior Art] With the advancement of semiconductor technology, today's LED dimmem diodes (LEDs) can emit high-intensity light, and have the advantages of electricity, small volume, low voltage driving, etc., so the light-emitting diodes are applied to Among various lighting equipment. K
-般而言，當發光二極體發出高亮度的光線時，會產 生大量的熱能。倘若熱能無法逸散而不斷地堆積在發^二 極體内，發光二極體的溫度會持續地上升。如此—來，發 光二極體可能會因為過熱而導致亮度衰減及使用壽命縮 短，嚴重者甚至造成永久性的損壞。因此，現今採用發光 一極體的知、明设備都會配置散熱塊（heat sink)以對發光 二極體進行散熱。 X 然而，在習知的發光二極體光源模組中，發光二極體 是配置於電路板上，而載有發光二極體的電路板再配置於 散熱塊上。藉由風扇所產生的氣流對散熱塊進行散熱，便 月b夠將發光二極體的熱能帶走。然而，由於一般電路板上 會有絕緣層以使不同的線路層達到絕緣的效果，但絕緣層 是熱的不良導體，這會對發光二極體的熱量經由電路板傳 201128130 EL98033 31639twf.doc/n 導至散熱塊的速率造成不良的影響，進而導致發光二極體 光源模組的散熱效率難以有效提升。 【發明内容】 本發明提供一種光源模組，其具有較佳的散熱效率。 本舍明^供一種散熱塊，其適於承載一發光二極體晶 片且具有多個排氣孔，用以作為迴悍時散熱塊與發光二極 體曰曰片之間焊料中之氣體的消散管道，可增加整體的散熱 能力，同時亦可提高焊接時的可靠度。 … •本發明還提出一種光源模組，其包括一散熱塊、一發 光二極體晶片以及一風扇模組。散熱塊具有一表面。發& 二極體晶片配置於散熱塊的表面上。風扇模組與發光二極 體晶'分別位於散熱塊的相對兩側。風扇模組具有一開 口 葉片與一環繞開口的擋板，其中葉片配置於開口中， 且^於產生-氣流，開口中的氣流沿著—流動方向流動， 進行散熱’擒板阻擋氣流朝向與流動方向相反 牧在本發明之—實施例巾，上狀光戦岐包括-雷 ，包性連接至發光二極體晶片，其 分別位於風扇模_相對兩側。^魏板與散熱塊 接哭在^發明之—實施例中，上述之光源模組更包括-連 接益，電性連接至電路板。 文匕栝連 在本發明之一實施例中，上 一導電元件，電性連接料二極體晶片與電括至少 201128130 EL98033 3]639twf.doc/n 在本發明之一實施例中’上述之散熱塊具有一凹陷， 用以容置發光二極體晶片。導電元件貫穿散熱塊且發光二 極體晶片與導電元件的一端電性連接。 在本發明之一實施例中，上述之散熱塊更具有多個排 氣孔，配置於凹陷内，且位於發光二極體晶片的下方。 在本％明之一具施例中’上述之每一排氣孔的孔徑介 於0.5公釐至2.0公釐。 在本發明之一實施例中，上述之光源模組更包括至少 -絕緣環’環繞導電S件，並使導電元件與散熱塊電性^ ^本發明之-實施财，上述之導電元件為 柱。導電柱之遠離發光二極體晶片的_端等电 並具有-凸緣，且凸緣的外徑大於絕緣=絕緣環， 在本發明之一實施例中，上述之光 -導線。導線的-端纏繞於絕緣環與凸緣之至少 另一端連接至電路板。 且V線的 點Λ t 實關巾，上叙散熱塊I有 則光二極體由焊接至焊魅秘焊接 在本發明之-實施例中，上述之光源、政熱塊上。 杯’其巾風純組與散熱塊 i、、&更包括—燈 風扇模組上。 且散熱塊位於 在本發明之一實施例中 電鍛一焊錫材料。 在本發明之—實施例中 上述之散熱塊為1屬材料 上述之金屬材Μ括叙、銅 201128130 EL98033 31639twf.doc/n 或銀 在本發明之一實施例中 ，上述之光源模組更包括一且 有多個跡_透鏡’散熱塊的表面具❹錢 透 鏡經由這些定錄分別與這較位孔卡接而岐於散熱=In general, when the light-emitting diode emits high-intensity light, a large amount of heat is generated. If the heat energy cannot escape and accumulates in the body of the hair, the temperature of the light-emitting diode will continuously rise. In this way, the light-emitting diode may cause brightness degradation and shortened service life due to overheating, and even cause permanent damage. Therefore, today's known devices that use a light-emitting diode are equipped with a heat sink to dissipate heat from the light-emitting diode. X However, in the conventional light-emitting diode light source module, the light-emitting diode is disposed on the circuit board, and the circuit board carrying the light-emitting diode is disposed on the heat-dissipating block. The heat sink is dissipated by the airflow generated by the fan, and the heat energy of the light-emitting diode is taken away. However, since there is an insulating layer on the general circuit board to make the different circuit layers have the effect of insulation, the insulating layer is a poor conductor of heat, which will transfer the heat of the light emitting diode through the circuit board. 201128130 EL98033 31639twf.doc/n The rate of conduction to the heat sink block adversely affects, and thus the heat dissipation efficiency of the light emitting diode light source module is difficult to effectively improve. SUMMARY OF THE INVENTION The present invention provides a light source module that has better heat dissipation efficiency. The present invention provides a heat dissipating block which is adapted to carry a light emitting diode chip and has a plurality of vent holes for use as a gas in the solder between the heat dissipating block and the light emitting diode chip. Dissipating the pipe can increase the overall heat dissipation capacity and also improve the reliability during welding. The present invention also provides a light source module including a heat sink block, a light emitting diode chip, and a fan module. The heat sink block has a surface. The hair & diode chip is disposed on the surface of the heat sink block. The fan module and the light-emitting diode are respectively located on opposite sides of the heat-dissipating block. The fan module has an open blade and a baffle surrounding the opening, wherein the blade is disposed in the opening, and the airflow is generated, and the airflow in the opening flows along the flow direction to dissipate heat. The seesaw blocks the airflow toward and flows. In the opposite direction, in the embodiment of the present invention, the upper diaphragm comprises a lightning-emitting element, and is connected to the light-emitting diode wafers, respectively, on opposite sides of the fan mold. The Wei-Board and the heat-dissipating block are connected to the invention. In the embodiment, the above-mentioned light source module further includes a connection and is electrically connected to the circuit board. In one embodiment of the present invention, the upper conductive element, the electrical connecting material diode wafer and the electrical wiring at least 201128130 EL98033 3] 639 twf.doc / n in an embodiment of the invention 'the above The heat sink block has a recess for accommodating the LED chip. The conductive element penetrates the heat sink block and the light emitting diode chip is electrically connected to one end of the conductive element. In an embodiment of the invention, the heat dissipating block further has a plurality of exhaust holes disposed in the recess and located below the LED chip. In one embodiment of the present invention, the diameter of each of the vent holes described above is from 0.5 mm to 2.0 mm. In an embodiment of the invention, the light source module further includes at least an insulating ring surrounding the conductive S piece, and electrically conducting the conductive element and the heat dissipating block. The conductive element is a column. . The conductive post is electrically connected to the illuminating diode chip and has a flange, and the outer diameter of the flange is larger than the insulating = insulating ring. In one embodiment of the invention, the above-mentioned light-conducting wire. The end of the wire is wound around the insulating ring and at least the other end of the flange is connected to the circuit board. And the V-line point 实 实 实 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The cup 'the towel wind pure group and the heat sink block i,, & more include - the lamp fan module. And the heat dissipating block is located in an embodiment of the invention for forging a solder material. In the embodiment of the present invention, the heat-dissipating block is a genus material, the metal material is described above, copper 201128130 EL98033 31639 twf.doc/n or silver. In an embodiment of the invention, the light source module further includes One and a plurality of traces _ lens 'the surface of the heat sink block with the money lens is respectively connected to the bit hole through these recordings and is cooled by heat =
本發明提出一種散熱塊’適於承载一發光 極體 晶 片。散熱麟應於發光二極體^的―表面具有—凹陷以 及多麵氣孔。這些排氣孔配置於_内 極體晶片的下方。 、m 在本發明之一實施例中 於0.5公釐至2.0公釐。 在本發明之一實施例中 電鍍一焊錫材料。 在本發明之 貫施例中 或銀。 上述之每—排氣孔的孔徑介 上述之散熱塊為一金屬材料 上述之金屬材料包括鋁、銅The present invention provides a heat slug block </ RTI> adapted to carry a luminescent body wafer. The heat dissipation lining should have a concave surface and a multi-faceted air hole on the surface of the light-emitting diode. These vent holes are disposed below the _ inner body wafer. And m is from 0.5 mm to 2.0 mm in one embodiment of the invention. In one embodiment of the invention, a solder material is electroplated. In the examples of the invention or silver. The above-mentioned aperture of the vent hole is a metal material, and the metal material includes aluminum and copper.
=本务明之-貫施例中，上述之焊錫材料包括錄。 執Γ上34，由於本發明之發光二姆晶丨是配置於散 導上，因此發光二極體晶片所產生的熱可直接傳 祖呈古r ’而不會被電路板阻擋，因此本發明之光源模 放熱效率。此外，由於散熱塊可具有多個排 迴焊過料，焊財的氣體可經由這些 可接古恭h除了可增加光源模組的散熱能力外，同時亦 二门Λ 極體晶片與散熱塊焊接時的可靠度。另外， 、風扇板組具有擋板以阻魏流麵朗口中的氣流之 201128130 EL98033 31639twf.doc/n 流動方向減的方向m進而增進鱗流，因此光源模 組具有較佳的散熱效率。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 ，1為本發明之一實施例之一種光源模組的示意圖。 圖2是圖1之光源模組的爆炸圖。請同時參考圖1與圖2， 本實施例之光源模組100包括—散熱塊11〇與一發光二極 體晶片120。散熱塊11〇具有—表面112，且發光二極體晶 片120配置於此表面112上。在本實施例中，光源模組1〇〇 更匕括電性連接至發光二極體晶片12〇的電路板以 及-風扇模組14G。發光二極體晶片12G與電路板13〇分= In this case, the above-mentioned solder materials include records. In the above, since the luminescent dimorph of the present invention is disposed on the scatter, the heat generated by the illuminating diode wafer can directly pass through the ancestors without being blocked by the circuit board, and thus the present invention The light source mold emits heat efficiency. In addition, since the heat dissipating block can have a plurality of reflowing and over-welding materials, the gas of the welding can be added to the heat-dissipating capacity of the light source module, and the two-gated body wafer is welded to the heat dissipating block. Reliability. In addition, the fan plate group has a baffle plate to prevent the flow in the flow direction of the surface of the flow, and the direction of the flow direction is reduced, thereby increasing the flow of the scale, so that the light source module has better heat dissipation efficiency. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. Embodiments 1 is a schematic diagram of a light source module according to an embodiment of the present invention. 2 is an exploded view of the light source module of FIG. 1. Referring to FIG. 1 and FIG. 2 simultaneously, the light source module 100 of the embodiment includes a heat dissipating block 11A and a light emitting diode chip 120. The heat sink block 11 has a surface 112, and the light emitting diode chip 120 is disposed on the surface 112. In this embodiment, the light source module 1 〇〇 further includes a circuit board electrically connected to the LED chip 12 以 and the fan module 14G. The LED chip 12G and the circuit board 13 are divided
別位於散熱塊110的相對_，且風扇模組14〇位於散熱 塊110與電路板130之間D 洋細而5，風扇模組14〇具有一開口 142盥配置於此 =口⑷中的-葉片M4。葉片144適於產生：_氣流。'此 ，口 M2 t的氣流可沿著-流動方向A1流動，以對散孰 塊no進行散熱。如此一來，配置於散熱塊ιι〇之表面ιΐ2 光二極體晶片120所產生的熱能可被氣流帶走，以 只二極體晶片12G過熱’進而可提高發光二極體晶 片120的發光效率及使用壽命。 為I達到更佳的散熱效果，本實施例之風扇模組14〇 具有L扣142的胁146，射_氣流朝向與流 201128130 EL98033 31639twf.doc/n 動方向A1相反的方向流動，以防止與散熱塊no接觸過 的熱空氣回流’亚進而增進熱對流。因此，本實施例之光 源模組1GG具有較佳的散熱效率。值得注意的是，本發明 並不限定開π 142中的氣流之流動方向M是朝向圖2中 所锋示的方向’在其他未繪示的實_巾，開时的氣流 之流動方向亦可與圖2 _示的流動方向以相反。 除此之外，在本實施例中’散熱塊110可具有一焊接 功116，其中政熱塊no的材質例如是鋁，而焊接點116 的材料例如是焊錫材料。具體而言，焊接點116的材料例 如是錄。發光二極體晶片12〇可藉由焊接至焊接點116而 配置於散熱塊110上，而鎳適於與焊料接合，其中焊料例 t是錫膏。舉_言’發光二極體晶Μ 12()可_表面黏 =製程（Surface Mount Technology, SMT)以與散熱塊 110 結合，以提高光源模組1〇〇的製造效率。 —土圖3是圖1之導電元件配置於發光二極體晶片的放大 P意圖。請參考圖卜圖2與圖3，在本實施例中，光源模 級1〇〇更包括二導電元件15〇、二絕緣環16〇以及二導線 19〇 ’其中導電元件15〇例如是導電柱，並且電性連接發光 〜極體晶片120與電路板130。散熱塊110具有一用以容 ，發光二極體晶片丨2〇的凹陷114，且導電元件丨5〇貫穿 畋熱塊110且發光二極體晶片12〇與導電元件15 電性連接。 ^ 此外，絕緣環160分別環繞對應的導電元件15〇，以 使導電元件150與散熱塊11〇電性絕緣。再者，導電元件 201128130 EL98033 31639twf.doc/n 150的另—端’也就是遠離發光二極體晶片120的一端凸 出於絕緣環160，並且具有一凸緣152。在本實施例中，凸 緣152的外控可以是大於絕緣環wo的内徑，以使導線wo 的一端可穩固地纏繞於絕緣環160與凸緣152之間，而較 不容易脫落。 在本實施例中，擋板146可具有一由擋板146的外緣 向内凹陷的通孔146a。導線190的一端纏繞於絕緣環 與凸緣152之間，且導線190的另一端穿過通孔146a而連 接至電路板13〇，以使發光二極體晶片120與電路板no 電性連接。 圖4是圖1之光源模組中的燈杯於組裝前的示意圖。 固5疋圖1之光源模組中的燈杯於組裝後的側視圖。請參 考圖1、圖4與圖5 ’在本實施例中，光源模組1〇〇更包括 :燈杯170與一固定於燈杯170上的連接器18〇，且連接 電性連接至燈杯170内的電路板13〇。風扇模組14〇 與散熱塊110皆配置於燈杯170上，且散熱塊11〇位於風 扇模組140上。 鱼五叫參考圖2、圖4與圖5，詳細而言，風扇模組14〇 y散熱塊Π〇例如是鎖附於燈杯17〇上。燈杯17〇可具有 多個紐裝孔172。多個鎖固件174可依序穿過這些組裝孔 =2，’而將燈杯170與風扇模組140鎖固至散熱塊11〇。此 八燈杯170可具有一卡槽176，組裴時，連接器18〇可 δ於卡槽176中，以使連接器180穩固地配置於燈杯17〇 中。 、i 10 201128130 31639twf.doc/n 圖6為本發明之另一實施例之一種光源模組的爆炸 圖’圖7為圖6之光源模組之散熱塊的示意圖。在此必須 說明的是，本實施例沿用前述實施例的元件標號與部分内 谷’其中採用相同的標號來表示相同或近似的元件，並且 省略了相同技術内容的說明。關於省略部分的說明可參照 前述實施例，本實施例不再重複贅述。 请同時參考圖6與圖7，本實施例的光源模組i〇〇a與 前述實施例之光源模組1〇〇相似，其主要的差異是在於： 散熱塊110a具有多個排氣孔118 (圖6與圖7中皆僅示意 地繪不四個），其中這些排氣孔118配置於凹陷1H内， 且位於發光二極體晶片12〇的下方。具體而言，每一排氣 孔118的孔徑介於〇.5公釐（mm)至2 〇公釐（mm)， 較佳地，則介於1.0公釐（；mm)至15公釐（mm)。 在本實施例中’由於散熱塊ll〇a具有排氣孔118，因 此當光二極體晶片12〇採用表面黏著製程與散熱塊u〇a 、、’。口日守，在進行迴焊的過程中，焊料中的氣體可經由排氣 孔118排出，意即存在於烊料中的氣體可利用排氣孔118 作為氣體消散管道。故，當焊料凝固時，發光二極體晶片 120與散熱塊ii〇a之間無氣泡存在，可使得發光二極體晶 片120與散熱塊11Ga緊密貼合，以有效提高發光二極體晶 片12〇與散熱塊ll〇a焊接時的可靠度，同時亦可增加光源 模組100a整體的散熱能力。 圖8為圖6之光源模組的組合示意圖。請同時參考圖 6、圖7與® 8，本實施例之光源模組100a可更包括一透 201128130 EL98033 31639twf.doc/n 鏡210 ’此透鏡210配置於散熱塊ll〇a的表面112上，其 中此透鏡210具有多個定位柱212 (圖6中僅示意地繪示 四個），而散熱塊110a的表面112具有多個與定位柱212 相對應的定位孔119。具體而言，透鏡21〇經由這些定位 柱212分別與這些定位孔119卡接而固定於散熱塊u〇a 上。由於本實施例之光源模組l〇〇a具有透鏡210，因此在 照明上可獲得較佳的光型表現，且光源模組丨〇〇a亦具有較 佳的出光效率。 綜上所述，由於本發明之發光二極體晶片配置於散熱 塊的表面，因此發光二極體晶片所產生的熱可以直接傳導 至政熱塊，而不會被電路板所阻擋，因此本發明之光源模 組具有較佳的散熱效率。再者，由於風扇模組具有擋板以 阻擋氣流朝向與開口中的氣流之流動方向相反的方向流 動，進而增進熱對流，因此光源模組具有較佳的散熱效率。 此外，由於散熱塊可具有多個排氣孔，因此在進行迴焊過 程時，焊料中的氣體可經由這些排氣孔排出，可增加光源 模組的散熱能力，同時亦可提高發光二極體晶片與散熱塊 焊接時的可靠度。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通 树明之精神和範圍内，當可作些許之更動與潤飾，故: 么明之保魏圍當視後附之巾請專利範圍所界定者為準。 【圖式簡單說明】 12 201128130 bL98033 31639t\vf.doc/n 圖1為本發明之-實施例之一種光源模組的示意圖。 圖2是圖1之光源模組的爆炸圖。 圖3是圖1之導電το件配置於發光二極體晶片的放大 示意圖。 圖4是圖1之光源模組中的燈杯於組裝前的示意圖。 圖5是圖1之光源模組中的燈杯於組裝後的側視圖。 圖6為本發明之另一實施例之一種光源模組的爆炸 圖。 圖7為圖6之光源模組之散熱塊的示意圖。 圖8為圖6之光源模組的組合示意圖。 【主要元件符號說明】 100、100a :光源模組 110、110a :散熱塊 112 :表面 114 :凹陷 • 116:焊接點 118 :排氣孔 119:定位孔 120 :發光二極體晶片 13〇 :電路板 140 :風扇模組 142 :開口 144 =葉片 13 201128130 bbysuji 31639twf.doc/n 146 :擋板 146a :通孔 150 :導電元件 152 :凸緣 160 ’·絕緣環 170 :燈杯 172 :組裝孔 174 :鎖固件 176 :卡槽 180 :連接器 190 :導線 210 :透鏡 212 :定位柱 A1 :流動方向The fan module 14 is located between the heat sink block 110 and the circuit board 130, and the fan module 14 has an opening 142, which is disposed in the mouth (4). Blade M4. The blade 144 is adapted to produce: a gas flow. 'This, the air flow of the port M2 t can flow along the flow direction A1 to dissipate heat from the bulk block no. In this way, the thermal energy generated by the surface of the heat dissipating block ι 2 photodiode wafer 120 can be carried away by the airflow to superheat the diode chip 12G, thereby improving the luminous efficiency of the LED chip 120 and Service life. In order to achieve a better heat dissipation effect, the fan module 14 of the present embodiment has a flank 146 of the L-cuff 142, and the jet stream flows toward the opposite direction to the flow direction 20112130 EL98033 31639 twf.doc/n, to prevent The hot air returning contacted by the heat slug block no further enhances heat convection. Therefore, the optical source module 1GG of the embodiment has better heat dissipation efficiency. It should be noted that the present invention is not limited to the flow direction M of the air flow in the opening π 142 is toward the direction shown in FIG. 2 'in other unillustrated real towel, the flow direction of the air flow when opening The flow direction is opposite to that shown in Figure 2_. In addition, in the present embodiment, the heat dissipating block 110 may have a soldering work 116 in which the material of the thermal block no is, for example, aluminum, and the material of the solder joint 116 is, for example, a solder material. Specifically, the material of the solder joint 116 is, for example, recorded. The light emitting diode chip 12 can be disposed on the heat slug 110 by soldering to the solder joint 116, and the nickel is adapted to be bonded to the solder, wherein the solder case t is a solder paste. The light-emitting diode wafer 12() can be surface-mounted (SMT) to be combined with the heat-dissipating block 110 to improve the manufacturing efficiency of the light source module. - Figure 3 is an enlarged P intent of the conductive element of Figure 1 disposed on a light emitting diode wafer. Referring to FIG. 2 and FIG. 3 , in the embodiment, the light source module 1 〇〇 further includes two conductive elements 15 〇 , two insulating rings 16 〇 , and two wires 19 〇 ' wherein the conductive elements 15 〇 are, for example, conductive pillars And electrically connecting the luminescent body wafer 120 and the circuit board 130. The heat dissipating block 110 has a recess 114 for receiving the LED chip, and the conductive member 〇5 〇 extends through the thermal block 110 and the LED wafer 12 is electrically connected to the conductive member 15. Further, the insulating ring 160 surrounds the corresponding conductive member 15A, respectively, to electrically insulate the conductive member 150 from the heat slug 11 . Further, the other end of the conductive member 201128130 EL98033 31639twf.doc/n 150, that is, the end away from the LED wafer 120, protrudes from the insulating ring 160 and has a flange 152. In this embodiment, the external control of the flange 152 may be larger than the inner diameter of the insulating ring wo such that one end of the wire wo can be firmly wound between the insulating ring 160 and the flange 152, and is less likely to fall off. In the present embodiment, the baffle 146 may have a through hole 146a recessed inwardly by the outer edge of the baffle 146. One end of the wire 190 is wound between the insulating ring and the flange 152, and the other end of the wire 190 is connected to the circuit board 13A through the through hole 146a to electrically connect the light emitting diode chip 120 to the circuit board no. 4 is a schematic view of the lamp cup in the light source module of FIG. 1 before assembly. Solid side view of the light cup in the light source module of Figure 1 after assembly. Please refer to FIG. 1 , FIG. 4 and FIG. 5 . In the embodiment, the light source module 1 further includes: a lamp cup 170 and a connector 18 固定 fixed to the lamp cup 170 , and the connection is electrically connected to the lamp The circuit board 13 in the cup 170 is 〇. The fan module 14A and the heat dissipation block 110 are disposed on the lamp cup 170, and the heat dissipation block 11 is located on the fan module 140. Referring to Figures 2, 4 and 5, in detail, the fan module 14 y y heat sink block Π〇 is, for example, attached to the lamp cup 17 。. The lamp cup 17 can have a plurality of button holes 172. A plurality of fasteners 174 can sequentially pass through the assembly holes =2, and lock the lamp cup 170 and the fan module 140 to the heat sink block 11A. The eight-cup cup 170 can have a card slot 176. When assembled, the connector 18 can be δ in the card slot 176 to allow the connector 180 to be securely disposed in the lamp cup 17A. FIG. 6 is an exploded view of a light source module according to another embodiment of the present invention. FIG. 7 is a schematic diagram of a heat sink block of the light source module of FIG. It is to be noted that the same reference numerals are used to denote the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the description of the embodiments will not be repeated. Referring to FIG. 6 and FIG. 7 simultaneously, the light source module i〇〇a of the present embodiment is similar to the light source module 1〇〇 of the foregoing embodiment, and the main difference is that the heat dissipation block 110a has a plurality of exhaust holes 118. (There are only four schematically shown in FIG. 6 and FIG. 7), wherein the vent holes 118 are disposed in the recess 1H and are located below the illuminating diode chip 12A. Specifically, each of the vent holes 118 has a pore diameter of from 〇5 mm (mm) to 2 〇 mm (mm), preferably, from 1.0 mm (mm) to 15 mm ( Mm). In the present embodiment, since the heat dissipating block 110a has the vent hole 118, the surface of the photodiode wafer 12 is bonded to the heat dissipating block u 〇 a , , . During the reflow process, the gas in the solder can be discharged through the venting opening 118, meaning that the gas present in the sputum can utilize the venting opening 118 as a gas dissipating conduit. Therefore, when the solder solidifies, no bubbles exist between the LED chip 120 and the heat dissipating block ii 〇 a, so that the LED chip 120 and the heat dissipating block 11Ga are closely adhered to effectively improve the LED 12 . The reliability of the solder joint with the heat sink block 11〇a can also increase the heat dissipation capability of the entire light source module 100a. FIG. 8 is a schematic diagram of the combination of the light source module of FIG. 6. FIG. Referring to FIG. 6 , FIG. 7 and FIG. 8 , the light source module 100 a of the embodiment may further include a lens of the 201128130 EL98033 31639 twf.doc/n mirror 210. The lens 210 is disposed on the surface 112 of the heat dissipation block 11A. The lens 210 has a plurality of positioning posts 212 (only four are schematically shown in FIG. 6 ), and the surface 112 of the heat dissipation block 110 a has a plurality of positioning holes 119 corresponding to the positioning posts 212 . Specifically, the lens 21 is respectively engaged with the positioning holes 119 via the positioning posts 212 and fixed to the heat dissipation block u〇a. Since the light source module 10a of the embodiment has the lens 210, a better light pattern performance can be obtained in illumination, and the light source module 丨〇〇a also has better light extraction efficiency. In summary, since the light emitting diode chip of the present invention is disposed on the surface of the heat sink block, the heat generated by the light emitting diode chip can be directly transmitted to the political heat block without being blocked by the circuit board, so The light source module of the invention has better heat dissipation efficiency. Moreover, since the fan module has a baffle to block the airflow from flowing in a direction opposite to the flow direction of the airflow in the opening, thereby enhancing heat convection, the light source module has better heat dissipation efficiency. In addition, since the heat dissipation block can have a plurality of vent holes, gas in the solder can be discharged through the vent holes during the reflow process, which can increase the heat dissipation capability of the light source module, and can also improve the light emitting diode. Reliability when soldering the wafer to the heat sink. The present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. Any one of the technical fields and the scope of the present invention can be modified and retouched, so: Depending on the scope of the patent, the attached towel shall prevail. [Simple Description of the Drawings] 12 201128130 bL98033 31639t\vf.doc/n FIG. 1 is a schematic diagram of a light source module according to an embodiment of the present invention. 2 is an exploded view of the light source module of FIG. 1. Fig. 3 is an enlarged schematic view showing the conductive material of Fig. 1 disposed on a light emitting diode wafer. 4 is a schematic view of the lamp cup in the light source module of FIG. 1 before assembly. Figure 5 is a side elevational view of the lamp cup of the light source module of Figure 1 after assembly. Figure 6 is an exploded view of a light source module in accordance with another embodiment of the present invention. 7 is a schematic view of a heat sink block of the light source module of FIG. 6. FIG. 8 is a schematic diagram of the combination of the light source module of FIG. 6. FIG. [Main component symbol description] 100, 100a: light source module 110, 110a: heat dissipation block 112: surface 114: recessed 116: solder joint 118: exhaust hole 119: positioning hole 120: light emitting diode chip 13: circuit Plate 140: Fan Module 142: Opening 144 = Blade 13 201128130 bbysuji 31639twf.doc/n 146 : Baffle 146a : Through Hole 150 : Conductive Element 152 : Flange 160 '·Insulation Ring 170 : Lamp Cup 172 : Assembly Hole 174 : Locking 176: Card slot 180: Connector 190: Wire 210: Lens 212: Positioning post A1: Flow direction