201109778 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種感聽構，特別是—種應用於液晶顯示器 之感測結構。 【先前技術】 …由於光電技術的不斷進步及影像顯示技術的數位化，各種顯 示器在日常生活中隨處可見。液晶顯示器因為具有高晝質、輕薄、 低消，功率、無㈣等優點，因此已廣泛地應用於各種通訊或電 子產扣上’並逐漸取代傳統陰極射線管顯示器，成為顯示器市場 “液晶顯示ϋ與感測單元結合應用，可提供觸控功能。如此一 來電子產。口可省部按鍵或其它類似功能之設備與組農，在同樣 的產品尺寸規格下’便可容較大尺寸之顯示面板。 第1圖所不係為習知液晶顯示器所採用的感測結構。習知感 測、U冓1G包含觸控面板(tGueh panel)u，設置於液晶顯示面板η201109778 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a sensing structure, particularly a sensing structure applied to a liquid crystal display. [Prior Art] ... Due to the continuous advancement of photoelectric technology and the digitalization of image display technology, various displays are ubiquitous in daily life. Because of its high quality, light weight, low power consumption, low power, no (four) and other advantages, liquid crystal displays have been widely used in various communication or electronic production buttons, and gradually replaced the traditional cathode ray tube display, becoming the display market "liquid crystal display" In combination with the sensing unit, it can provide touch function. As a result, the electronic product can be used for provincial buttons or other similar functions, and can display a larger size under the same product size specifications. The first embodiment is not a sensing structure used in a conventional liquid crystal display. The conventional sensing, U冓1G includes a touch panel (tGueh panel) u, and is disposed on the liquid crystal display panel η.
上面板U上之第―軟性電路板13來傳送觸控 面板U於觸控時所產生的感測訊號。液晶顯示面板12包含彩色 濾光層基板m及薄膜電晶體陣列基板122,且利用設置於薄膜電 曰曰，陣列基板122上之第二軟性電路板14及驅動晶片η，以提供 液晶顯不面板12工作所需之驅動電壓。此外，液晶顯示面板12 =身即為-獨立顯示晝面裂置。使用黏膠15可將觸控面板η黏 著於液晶顯示面板12上。 第一軟性電路板13與第 二軟性電路板14須經熱壓接合， 以 201109778 使兩者的線路最終整合於—連料(e_ect〇r)( 圖未示），再透過此 連接淳與§fl遽處理系統(未圖示）電性連接。 翫知液晶顯示器之觸控面板雖可提供觸控的效果，然而其需 要。又置至乂兩片軟性電路板，以分別傳輸觸控訊號及驅動訊號， 此曰B加所使用的材料與需要多次熱壓接合線路，使得製造成 本增加。 有t於此提供一種液晶顯示器之感測結構，可降低成本支出 並簡化製程，為此一業界簡解決之問題。 【發明内容】 本土月之目的在於提供—m顯示器之感測結構藉由整 合式軟性電路板’達到減少材料之❹、簡化軟性電路板之對位 及,合製程，進而降低製造成本。若配合使用與顯示器整合的觸 控單元’液晶顯示器之整體厚度更可進—步降低。 产為達上述目的，本發明揭露一種液晶顯示器之感測結構，包 含第-基板、第二基板、感測單元及軟性電路板。第二基板配置 於第:基板之下方。感測單元配置於第—基板之上方，且適可於 受觸碰時產生-觸碰訊號。軟性f路板具有第—端部和第二端 部，於第-端部具有第一接合部及第二接合部，其中第一接合部 係位於第一基板之上方且電性車 _ 电r生逑接至感測早凡，第二接合部連 至苐二基板上。 在參閱圖式及隨後描述之實施方式後，具有本發明所屬技術 領域之通常知識者便可瞭解本發明之目的、技術手段及實施態樣。 【實施方式】 201109778 以下將透過數個實施例來_本發明内容；㈣，本發明的 T施例並非心限制本發明需在如實施例所述之任何特定的環 境'應用或特殊方式方能實施。因此’關於實施例之說明僅為聞 釋本發明内容，而非用以限制本發明之範圍。 一 d/月併參閱第2圖及第3圖，所示為本發明所揭露之液晶顯 不Μ感測結構的第一較佳實施例之立體圖及側視圖。感測結構2 匕3第基板21、第二基板22、感測單元23及軟性電路板24。 ,第基板21與第二基板22考皮此疊置，第二基板22係配置於 第基板21之下方。第一基板21可為彩色渡光層基板，第二基 板22可為薄膜電晶體陣列基板。此外，感測單元^係配置於第 基板21之上方’且涵蓋液晶顯示器之一有效顯示區域3〇(八咖。The first flexible circuit board 13 on the upper panel U transmits the sensing signal generated by the touch panel U when touched. The liquid crystal display panel 12 includes a color filter layer substrate m and a thin film transistor array substrate 122, and uses a second flexible circuit board 14 and a driving wafer η disposed on the thin film capacitor, the array substrate 122 to provide a liquid crystal display panel. 12 drive voltage required for work. In addition, the liquid crystal display panel 12 = body is - independent display of the face crack. The touch panel n can be adhered to the liquid crystal display panel 12 by using the adhesive 15. The first flexible circuit board 13 and the second flexible circuit board 14 are subjected to thermocompression bonding, and 201109778 is used to finally integrate the two lines into the e_ect〇r (not shown), and then through the connection and the § The fl遽 processing system (not shown) is electrically connected. Although the touch panel of the liquid crystal display can provide a touch effect, it is required. It is also placed on two flexible circuit boards to transmit the touch signal and the drive signal respectively. This 加B plus the materials used and multiple hot-press bonding lines are required to increase the manufacturing cost. There is provided a sensing structure of a liquid crystal display, which can reduce the cost and simplify the process, which is a problem solved by the industry. SUMMARY OF THE INVENTION The purpose of the local month is to provide a sensing structure for the -m display to reduce material defects, simplify the alignment of the flexible circuit board, and reduce the manufacturing cost by integrating the flexible circuit board. If the touch panel unit integrated with the display is used, the overall thickness of the liquid crystal display can be further reduced. For the above purpose, the present invention discloses a sensing structure of a liquid crystal display, comprising a first substrate, a second substrate, a sensing unit and a flexible circuit board. The second substrate is disposed under the first: substrate. The sensing unit is disposed above the first substrate, and is adapted to generate a touch signal when touched. The flexible f-way plate has a first end portion and a second end portion, and has a first joint portion and a second joint portion at the first end portion, wherein the first joint portion is located above the first substrate and the electric vehicle is electrically The sputum is connected to the sensing, and the second joint is connected to the second substrate. The objects, technical means and implementations of the present invention will become apparent to those skilled in the <RTIgt; [Embodiment] 201109778 The following is a summary of the present invention through a number of embodiments; (d), the T embodiment of the present invention is not intended to limit the invention to any particular environment 'application or special mode as described in the embodiments. Implementation. Therefore, the description of the embodiments is merely illustrative of the invention and is not intended to limit the scope of the invention. Referring to Figures 2 and 3, a perspective view and a side view of a first preferred embodiment of the liquid crystal display sensing structure disclosed in the present invention are shown. The sensing structure 2 匕 3 the second substrate 21 , the second substrate 22 , the sensing unit 23 , and the flexible circuit board 24 . The first substrate 21 and the second substrate 22 are superposed on each other, and the second substrate 22 is disposed below the first substrate 21. The first substrate 21 may be a color light-emitting layer substrate, and the second substrate 22 may be a thin film transistor array substrate. Further, the sensing unit is disposed above the first substrate 21 and covers an effective display area 3 of the liquid crystal display.
Area)之至少-部份，且感測單元23適可於受觸碰時，產生一觸 碰訊號。 本貫施例係可將感測晶片28及驅動晶片29配置於第二基板 22上，兩者並分別與軟㈣路板24電性連接。心之，軟性電路 板24於第—端部具有第—接合部25及第二接合部26，第-接合 部25係位於第—基板21之上方且電性連接至感測單元23，第二 接合部26則可電性連接至感測晶片28與驅動晶片μ。 第接。。P 25與感測單元23電性連接的方式，例如第一接 合部25的線路先連接至卜基板21的線路上，而後再透過第一 基板21上之線路與感測單a 23之線路料；或者第—接合部μ 的線路直接與感測單元23的線路直接相連；此處僅是舉例，本發 明不限於此m關技藝者當能依實際需求職電性連接的方 201109778 式0 第二接合部26可連接至第二基板22上，再藉由線路分別與 感測晶片28及驅動晶片29電性連接。感測晶片28與驅動晶片29 的尺寸、數目與分佈位置僅是舉例，熟習相關技#者當能依實際 需求進行調整。此外，軟性電路板24於第二端部可具有第三接^ 部27，電性連接至一訊號處理系統5〇。 第二基板22上的感測晶片28係經由第二接合部％及第—接 合部25而與感測單元23電性連接，故當感測單元23受觸碰而產 生觸碰訊號時，觸碰訊號便可經由軟性電路板24之第一接合部Μ 及第二接合部26傳送至感測晶片28進行處理；隨後，可再經由 第二接合部26與第三接合部27傳送至訊號處理系統％。訊號處 理糸統50可接收並處理訊號，進而賴❹者所下達之 ^ ;在某些實施例中，訊號處理系統5()可回應使用者所輸入㈣ 號。訊號處理系統50可經由第三接合部27及第二接合部％，將 驅動訊號輸人至驅動晶片29，以驅動液晶顯示器之畫面顯示。另 外，為了辅助第-接合部25與第二接合部％的接合流暢與線路 定位穩定’可於第一接合部25與第二接合部％之間有一縫隙， 以方便接合作業和;t位精準。.縫隙的位置、長度、寬度或數目不 限於此，熟習相關技藝者當能依實際需求進行調整。此 2板24的線路可預先配置好，第三接合部27無㈣經過熱壓 接Q，可降低成本支出與減少製程複雜度。 =明感測結構之第二實施例如^圖所示，在此實 可切則述實施例中的感測晶片，僅保留驅動晶片Η，利用軟性 201109778 電路板24的第一接合部25與第三接合部27,將感測單元23之感 測訊號直接傳至訊號處理系統（未圖示）處理，換言之，感測單元 23於受觸碰時產生的觸碰訊號可經由第一接合部25與第三接合 4 27傳送至況號處理系統；或者亦可將前述實施例中之感測晶片 與驅動曰曰片整合，使其成為具有感測功能之驅動晶片3卜換言之， 感測單元23於受觸碰時產生的觸碰訊號可經由第一接合部25及 第一接〇部26，傳送至驅動晶片3丨進行處理隨後，可再經由第 接口邛26與第二接合部27傳送至訊號處理系統。於此實施例 中’可利用具有驅動及感測雙功能之晶片’來接收與處理來自感 測早το 23之感測訊號，並可提供—驅動電壓來驅動液晶顯示器。 °動曰曰片31的尺寸、分佈位置與數目僅是舉例，熟習相關技藝者 可依實際需求予以調整。 第5圖所示為本發明感測結構之第三實施例。在此實施例中， 感測單元23、感測晶片心驅動晶片心分別電性連接軟性電路 ，、中第接合部25可位於兩個彼此分離的第二接合部％At least part of the area, and the sensing unit 23 is adapted to generate a touch signal when touched. In the present embodiment, the sensing wafer 28 and the driving wafer 29 can be disposed on the second substrate 22, and the two are electrically connected to the soft (four) circuit board 24, respectively. The flexible circuit board 24 has a first engaging portion 25 and a second engaging portion 26 at the first end. The first engaging portion 25 is located above the first substrate 21 and is electrically connected to the sensing unit 23, and second. The bonding portion 26 is electrically connected to the sensing wafer 28 and the driving wafer μ. First. . The way in which the P 25 and the sensing unit 23 are electrically connected, for example, the line of the first bonding portion 25 is first connected to the line of the substrate 21, and then the line on the first substrate 21 and the line of the sensing sheet a 23 are transmitted. Or the line of the first-joining portion μ is directly connected to the line of the sensing unit 23; here is merely an example, and the present invention is not limited to the one that the skilled person can connect with the electric power according to the actual demand 201109778 The two bonding portions 26 are connectable to the second substrate 22, and are electrically connected to the sensing wafer 28 and the driving wafer 29 by wires, respectively. The size, number, and distribution of the sense wafers 28 and the drive wafers 29 are merely examples, and those skilled in the art can adjust them according to actual needs. In addition, the flexible circuit board 24 can have a third connection portion 27 at the second end portion, and is electrically connected to a signal processing system 5A. The sensing chip 28 on the second substrate 22 is electrically connected to the sensing unit 23 via the second bonding portion % and the first bonding portion 25, so when the sensing unit 23 is touched to generate a touch signal, the touch The touch signal can be transmitted to the sensing wafer 28 via the first bonding portion Μ and the second bonding portion 26 of the flexible circuit board 24 for processing; subsequently, it can be transmitted to the signal processing via the second bonding portion 26 and the third bonding portion 27 system%. The signal processing system 50 can receive and process the signal, which is then issued by the relying party; in some embodiments, the signal processing system 5() can respond to the user input (4). The signal processing system 50 can input a driving signal to the driving chip 29 via the third bonding portion 27 and the second bonding portion % to drive the screen display of the liquid crystal display. In addition, in order to assist the smooth integration of the first joint portion 25 and the second joint portion % with the line positioning, a gap may be formed between the first joint portion 25 and the second joint portion % to facilitate the joint work and the t-position precision. . The position, length, width or number of slits is not limited to this, and those skilled in the art can adjust according to actual needs. The line of the 2 board 24 can be pre-configured, and the third joint part 27 is not (4) hot-pressed Q, which can reduce the cost and reduce the complexity of the process. The second embodiment of the sensing structure is shown in the figure. Here, the sensing wafer in the embodiment can be cut, and only the driving wafer 保留 is retained, and the first bonding portion 25 of the circuit board 24 of the soft 201109778 is utilized. The three-joining portion 27 directly transmits the sensing signal of the sensing unit 23 to a signal processing system (not shown). In other words, the touch signal generated by the sensing unit 23 when being touched may be via the first bonding portion 25 . And transmitting to the condition processing system with the third bonding 4 27; or integrating the sensing wafer and the driving chip in the foregoing embodiment into the driving chip 3 having the sensing function, in other words, the sensing unit 23 The touch signal generated during the touch can be transmitted to the driving wafer 3 via the first bonding portion 25 and the first interface portion 26 for processing, and then transmitted to the second bonding portion 27 via the interface port 26 and the second bonding portion 27 Signal processing system. In this embodiment, a wafer having a driving and sensing dual function can be used to receive and process a sensing signal from the sensing τ 23 and a driving voltage can be supplied to drive the liquid crystal display. The size, distribution position and number of the movable jaws 31 are only examples, and those skilled in the art can adjust them according to actual needs. Fig. 5 shows a third embodiment of the sensing structure of the present invention. In this embodiment, the sensing unit 23 and the sensing wafer core drive wafer core are respectively electrically connected to the flexible circuit, and the middle first bonding portion 25 may be located at two second joint portions separated from each other.
之間。詳言之’軟性電路板24於第_端部以第—接合部Μ 測單元23電性連接，计女丨田上y '、 ^ 連接並利用兩個彼此分離的第二接合部％連接 至弟二基板22上。如第5圖所示，兩個彼此分離的第；接 係分別對應感測晶片28及驅動 甘』 艇動晶片29設置，並分別連接至第- 基板22上之兩側，且第一接入 牧王罘一 入 σ。卩25位於兩個彼此分離的第二接 口 4 20之中間。同樣地，為 要 助第一接合部25與第二接合邻 26的接合流暢與線路定位穩 4 ^ 1於第一接合部25盥第-桩八 %之間開設縫隙，以方便接入 >、弟一接合部 万便接口作業和定位精準。根據本發明，縫 201109778 隙的位i I度、寬度或數目沒有特別的限制，熟習相關技藝者 可依實際需求進行調整。軟性電路板24之第二端部可透過第三接 合部27電性連接至訊號處理系統（圖未示）。第5圖所㈣的各式 晶片的尺寸、分佈位置與數目僅是舉例，熟習相關技藝者可依實 際需求予以調整。另外，第—接合部25與第二接合部％之尺寸 差異、於基板上位置分佈、數目多寡等，於此也僅是舉例，熟習 相關技藝者亦可依實際需求進行調整。·. 第6圖所示係本發明感測結構之第四實施例。在此實施例中， ^晶m«晶片29可分別設置於第二基板22之兩側，而 單掘跡Γ)㈣晶片29透過另—軟性電路板32電性連接，以 =輸來自訊號處理系統的驅動訊號。第一接合部25的位置亦 I雜’例如··感測晶片28與驅動晶片29位置相鄰，而使第一 接“P 25位於第一基板 藝者可依實際需求予以調整。’熟f相關技 a 曰曰片的尺寸、分佈位置與數目亦僅 疋二、’,、習相關技藝者可依實際需求進行調整。 别述霄施例中，咸測罝+ 1_ 式單 " 可為電容感應式單元或電阻感應 Ρ_υ发 不限於此。感測單元23可為觸控面板（^ =、匕感應式觸控模組或與顯示器整合的觸控單元，但本發 不又此限’熟習相關技爇 ； 元。與顯示器整合的觸 …際需求選擇適當的感測單 產製程，，不必再加一;觸:面 的薄度。在此了，.隹持接近原顯不面板 级冽早το 23可使用與顯示器整合的觸 201109778 、重量減輕亦減少元件的使 控單元，如此能使基板整體厚度減少、重量 用，使製程成本降低。between. In detail, the flexible circuit board 24 is electrically connected to the first joint portion detecting unit 23 at the _ end portion, and the female 丨 上 y ', ^ is connected and connected to the second by using two second joint portions separated from each other. On the second substrate 22. As shown in FIG. 5, two separate segments are connected to the sensing wafer 28 and the driving boat, respectively, and are respectively connected to the two sides of the first substrate 22, and the first access is performed. The king of the animal husbandry enters σ. The crucible 25 is located between the two second interfaces 4 20 which are separated from each other. Similarly, in order to facilitate the smooth engagement of the first joint portion 25 and the second joint portion 26 and the line positioning stability, a gap is formed between the first joint portion 25 and the first pile portion to facilitate access. The younger brother has a joint interface and precise positioning. According to the present invention, the position i I degree, width or number of the slit 201109778 is not particularly limited, and those skilled in the art can adjust according to actual needs. The second end of the flexible circuit board 24 is electrically connected to the signal processing system (not shown) through the third connecting portion 27. The size, distribution position and number of various wafers in Fig. 5(4) are only examples, and those skilled in the art can adjust them according to actual needs. Further, the difference in the size of the first joint portion 25 and the second joint portion %, the position distribution on the substrate, the number of the joints, and the like are merely exemplified herein, and those skilled in the art may adjust them according to actual needs. Fig. 6 shows a fourth embodiment of the sensing structure of the present invention. In this embodiment, the ^ crystals m «the wafers 29 can be respectively disposed on both sides of the second substrate 22, and the single traces Γ) (4) the wafers 29 are electrically connected through the other flexible circuit board 32, and the signals are processed by the signal processing. The drive signal of the system. The position of the first bonding portion 25 is also similar. For example, the sensing chip 28 is adjacent to the driving chip 29, and the first connection "P 25 is located in the first substrate, and can be adjusted according to actual needs." Related technology a The size, distribution position and number of cymbals are also only two, ', and related art can be adjusted according to actual needs. In other examples, salt test 罝 + 1_ 式单" can be The capacitive sensing unit or the resistance sensing is not limited to this. The sensing unit 23 can be a touch panel (^ =, an inductive touch module or a touch unit integrated with the display, but the present invention does not limit this) Familiar with related technologies; Yuan. Integrate with the display to select the appropriate sensing yield process, no need to add one more; touch: the thinness of the face. Here, the holding is close to the original display panel level 冽Early το 23 can be used with the display integrated with the display 201109778, weight reduction and reduce the component of the control unit, so that the overall thickness of the substrate can be reduced, the weight is used, the process cost is reduced.
層37可為透明的導電氧化物， • ITO)、氧化銦（indium oxide)、砂銦氧化物（silic〇n indium 〇χ_、 在呂鋅氧化物（aluminum zinc oxide，AZO)、銦辞氧化物（indium zinc oxide, IZO)、在弟錫氧化物（antimony tin oxide, ΑΤΟ)或氧化錫等材 料；此處僅是舉例，本發明不受此限，熟習相關技藝者可依實際 需求選用適當的材料。在較佳實施例中，導電層37係由氧化銦錫 所製成。 舉例來說，於第一基板21之上表 36 ’接著再形成導電層37。導電 ’例如氧化銦錫（indium tin oxide, 保護層38可覆蓋著導電層37之表面。保護層38的材料可為 氮化矽化合物（SiNx)，但本發明不以此為限，熟習相關技藝者可 φ 依實際需求選用適當的材料。保護層38上方可貼附偏光片39。 在某些實施例中，可以偏光片39直接取代保護層38。此處與顯 示器整合的觸控單元僅是舉例，本發明不限於此，熟習相關技藝 者可依實際需求調整。 由於此種將感測單元23係直接整合於第一基板21之上表面 34的特性，液晶顯示器之感測結構於製程安排上得更具彈性且更 為簡易，且相較於習知技術，此種感測單元23之厚度較薄，更有 利於降低感測結構之整體厚度。 201109778 綜上所述，本發明利用同一軟性電路板電性連接感測單元、 晶片和tfl號處理系、统’可減少材料的使用與熱屡接合的次數若 配合使用與顯示器整合的觸控單元，液晶顯示器之整體厚度更可 進步降低’使得最終產品符合平面顯示裝置輕薄型化之發展趨 勢。 雖然本發明已以實施例揭露如上，然其並非用以限定本發 明，任何具有本發明所屬技術領域之通常知識者，在我離本發 月=精神和㈣内，當可作各種更動與潤飾，並可思揣其他不同 的實她例EJ此本發明之保護範圍當視後㈣請專利範圍所界 者為準。 【圖式簡單說明】 第1圆係習知感測結構之側視圖； 第圖係本發明感測結構之第一實施例之立體圖； 第3圖係第2圖所示之感測結構之側視圖； 第圖係本發明感測結構之第二實施例之立體圖； 第圖係本發明感測結構之第三實施例之立體圖； 第圖係本發明感測結構之第四實施例之立體圖；以及 第7圖係本發明感測單元之示意圖。 【主要元件符號說明】 10 感测結構 11 12 液'晶顯示面板 121 122 薄犋電晶體陣列基板 13 觸控面板 彩色渡光層基板 第一軟性電路板 201109778 14 第二軟性電路板 15 黏膠 17 驅動晶片 2 感測結構 21 第一基板 22 第二基板 23 感測單元 24 軟性電路板 25 第一接合部 26 第二接合部 27 第三接合部 28 感測晶片 29 驅動晶片 30 有效顯示區域 31 驅動晶片 32 軟性電路板 34 上表面 36 電極層 37 導電層 38 保護層 39 偏光片 41 液晶層 50 訊號處理系統Layer 37 can be a transparent conductive oxide, • ITO), indium oxide, sand indium oxide (silic〇n indium 〇χ _, in aluminum zinc oxide (AZO), indium oxide (indium zinc oxide, IZO), materials such as antimony tin oxide (antimony tin oxide) or tin oxide; here is only an example, the invention is not limited thereto, and those skilled in the art can select appropriate according to actual needs. In a preferred embodiment, the conductive layer 37 is made of indium tin oxide. For example, on the first substrate 21, the surface 36' is then formed into a conductive layer 37. Conductive 'such as indium tin oxide (indium) The oxide layer 38 may cover the surface of the conductive layer 37. The material of the protective layer 38 may be a tantalum nitride compound (SiNx), but the invention is not limited thereto, and those skilled in the art may select appropriate according to actual needs. The polarizer 39 may be attached to the protective layer 38. In some embodiments, the polarizer 39 may directly replace the protective layer 38. The touch unit integrated with the display is merely an example, and the present invention is not limited thereto. Familiar with relevant artists The adjustment of the sensing unit 23 directly on the upper surface 34 of the first substrate 21 makes the sensing structure of the liquid crystal display more flexible and simpler in the process arrangement, and the phase is adjusted. Compared with the prior art, the thickness of the sensing unit 23 is thinner, which is more favorable for reducing the overall thickness of the sensing structure. 201109778 In summary, the present invention electrically connects the sensing unit, the wafer and the same flexible circuit board. The tfl processing system and system can reduce the use of materials and the number of times of thermal bonding. If the touch unit integrated with the display is used, the overall thickness of the liquid crystal display can be improved and lowered, so that the final product conforms to the thin and thin display device. The present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. Anyone having ordinary knowledge in the technical field to which the present invention pertains may be various in the present invention. Change and retouch, and think about other different examples. The scope of protection of this invention is subject to the scope of the patent (4). 1 is a side view of a first embodiment of a sensing structure of the present invention; FIG. 3 is a perspective view of a first embodiment of the sensing structure of the present invention; A perspective view of a second embodiment of the sensing structure of the present invention; a perspective view of a third embodiment of the sensing structure of the present invention; a perspective view of a fourth embodiment of the sensing structure of the present invention; and a seventh drawing A schematic diagram of the sensing unit of the present invention. [Main component symbol description] 10 sensing structure 11 12 liquid crystal display panel 121 122 thin germanium transistor array substrate 13 touch panel color light-emitting layer substrate first flexible circuit board 201109778 14 Second flexible circuit board 15 adhesive 17 driving wafer 2 sensing structure 21 first substrate 22 second substrate 23 sensing unit 24 flexible circuit board 25 first bonding portion 26 second bonding portion 27 third bonding portion 28 sensing wafer 29 drive wafer 30 effective display area 31 drive wafer 32 flexible circuit board 34 upper surface 36 electrode layer 37 conductive layer 38 protective layer 39 polarizer 41 liquid crystal layer 50 signal processing system