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TW201109123A - Supporting pad - Google Patents

Supporting pad Download PDF

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Publication number
TW201109123A
TW201109123A TW98132166A TW98132166A TW201109123A TW 201109123 A TW201109123 A TW 201109123A TW 98132166 A TW98132166 A TW 98132166A TW 98132166 A TW98132166 A TW 98132166A TW 201109123 A TW201109123 A TW 201109123A
Authority
TW
Taiwan
Prior art keywords
foaming
holding
thickness direction
center
sheet
Prior art date
Application number
TW98132166A
Other languages
Chinese (zh)
Other versions
TWI432287B (en
Inventor
Yoshihide Kawamura
Takahiro Kume
Ayako Sato
Original Assignee
Fujibo Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujibo Holdings Inc filed Critical Fujibo Holdings Inc
Publication of TW201109123A publication Critical patent/TW201109123A/en
Application granted granted Critical
Publication of TWI432287B publication Critical patent/TWI432287B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/22Lapping pads for working plane surfaces characterised by a multi-layered structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished. The supporting pad (10) includes a urethane sheet (2) formed by the wet solidification method and having a supporting face (Sh). The urethane sheet (2) has a skin layer (2a) formed therein and has many cells (4) formed on the inner side of the skin layer (2a). The cells (4) have such a size that the cells (4) extend over almost the whole thickness of the urethane sheet (2). The cells (4) each has been formed so that the diameter thereof in a lower layer (Pr) of the urethane sheet (2) is larger than the diameter thereof in an upper layer (Ph) of the sheet (2). The cells (4) have been formed so that the direction of cell formation in the upper layer (Ph) is evenly inclined in a certain direction relative to the thickness direction and that the direction of cell formation in the lower layer (Pr) is the same as the thickness direction. When the pad (10) is compressed in polishing, a stress is evenly imposed on the object being polished.

Description

201109123 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種保持墊,特別是有關於一種 具備有樹脂薄片的保持塾,此樹脂薄片所具有之保持 面可用以保持被研磨物用’其保持面係藉由濕式凝固 法所形成大小橫跨厚度全體的大量直立型發泡。 【先前技術】 目前,半導體用石夕晶圓(WF)、平行平面板(fpd) 用玻璃基板或者是硬碟用基板等各種材料(被研磨物) 的表面(加工面)’為提升其平坦性,因而使用具備對 向配置的二個平台之研磨機進行研磨加工。於此等被 研磨物中’尤以半導體用矽晶圓(WF)或平行平面板用 玻璃基版’須達到高集積化無缺陷的基層配線或顯示 高畫質影像等需求,因而對於用以作為此些材料的基 礎的基板而言,對此基板之平坦性的需求度日益增 南0 例如,對被研磨物其中一面進行研磨加工時,係 於研磨機其中一方的平台上裝設有研磨墊,並在另一 方的平台上’則是將被研磨物保持呈與研磨墊對向的 方式。於進行研磨加工時,於被研磨物與研磨墊間, 供給含有研磨粒子(磨粒)的研磨漿,向被研磨物施 予研磨壓力(按壓力)。為避免被研磨物與平台間因 接觸而受到損傷,通常是在保持被研磨物用的平台 上’裝設保持墊。亦即,藉由保持墊,能在研磨處理 中’暫時保持被研磨物。又,在保持墊中,係可使甩 201109123 用以抑制被研磨物產生橫偏移用的模板。是否需使用 模板乃依被研磨物的種類而異,例如,在平行平面板 用玻璃基板的研磨加工中’乃是採用無模板的保持 塾。 一般係如,日本專利特開2〇〇6-62〇59號公報中 所揭露的採用具有藉由濕式凝固法所形成的發泡構 造之軟質的胺基曱酸酯發泡體(urethanef〇am,樹脂 薄片的一種)的保持墊,作為保持墊來使用。對藉由 濕式凝固法所形成之聚胺酯泡沫塑料而言,由於形成 有橫跨厚度全體大小的發泡,因而當以提高緩衝性為 目的,進而將發泡尺寸增大時,隨著保持被研磨物用 的保持面鄰近的發泡尺寸變大,其剛性將會隨之降 低。因此若緩衝性過低時,因研磨壓力而使被研磨物 所承受的應力,會產生受力不均的現象,繼而因應力 集中位於朝被研磨物的保持墊侧,陷入的大形凸部 上,此應力集中處會因研磨過度,而產生研磨不均的 現象。反之,當緩衝性提高時,則被研磨物所承受的 應力,變知較不易產生受力不均的現象,因而可提升 被研磨物的表面平滑性,但卻有陷入變大,而使得保 持墊本身亦有遭研削的可能性。於抑制被研磨物之陷 入所需的剛性以及用以均等化對被研磨物之應力所 需的緩衝性等兩者間可並行的技術上,先前技術中係 有如曰本專利特開2005-11972號公報所揭示的一種 藉有濕式凝固法所形成之發泡構造相異的二種薄片 加以貼合的保持墊。於上述技術_,係藉由其中一薄 片以確保緩衝性,並藉由另一薄片以發揮其剛性。 4 201109123 然而,於日本專利特開2006-62059號公報的技 術中,乃是因為藉由濕式凝固法所形成的表面層 (Skin Layer,表層)的表面(保持面)具有平滑性, 雖可較為平坦地保持被研磨物,但仍有尚未滿足上述 所需求的高精度的平坦性的問題存在。而曰本專利特 開2005-11972號公報的技術中,則會有因貼合二種 薄片所使用的黏著劑等之影響,而造成硬度不均一的 情況發生。此外,亦有於進行研磨加工時,二種薄片 剝離的問題。於進行研磨加工時,通常被研磨物是陷 入保持墊狀態下,邊進行保持,邊進行平坦化,因而 當壓縮具有緩衝性的保持墊時,則會對被研磨物產生 應力。此時,當保持墊的密度不均時,則施加於各個 不均部分上的應力大小相異,因而按壓力亦區域性地 隨之變換,故變得難以橫跨加工面全區域,進行均一 地研磨加工,因而破壞面内均一性。例如,在被研磨 物的外緣部和中央部的研磨裕度相異,會生成所謂的 外緣壓陷。若能降低施予於被研磨物上之應力不均, 並提高保持面的平坦性精度,則可獲得對被研磨物而 言,滿足高精度的平坦性的要求水準的保持墊。 【發明内容】 有鑒於上述習知問題,本發明之其中一目的就是 在提供一種保持墊,特別是可提高保持面的平坦性精 度,且提升被研磨物的面内均一性的一種保持墊。 為解決上述課題,本發明的保持墊係具備有一樹 脂薄片,此樹脂薄片所具有之保持面可用以保持被研 201109123 磨物用,其保持面係藉由^ 厚度全體的大量直立型發泡:法:形成大小橫跨 的厚度方向的中央部到上、十、仅^ ’自上述樹脂薄片 =形成方向’相對於上述厚方 向上傾斜的方式,以形成上述發泡 央部到1樹脂薄片的厚度方向的中 央。保持面侧的發泡端部為止的 對厚度方向,於固定方向上維 ^ B,相 形成的上述發泡,因而就算傾斜的方式所 二上產生讀不均的現象,於進行研磨加 縮%,仍可橫跨全面積,均等 應力,故能提高保持面 所產生之 物的面内均-性。 t生精度,且提升被研磨 於此情況下,樹脂薄片的厚度方向的中 圍,可以是相對於全體的厚度,介於以方的: ::+ΐθ%的範圍。發泡的長度較佳為,自ί度;二 :::發泡端部還大。又,發泡亦可以自厚Ϊ = ::相保持面的背面側的發泡端部為止的發泡形 向’是沿著厚度方向的方式來形成。上述這種發 ,’於保持面鄰近處,通過與保持面平行的剖面上形 的中心的垂直線,與於保持面的背面鄰近處, 此者面平行的剖面相交的位置可將其位置設定成 的二於與背面平行的剖面上相同的發泡所形成的孔 心评上。當以發泡於厚度方向的中央處上與保持面 十仃的剖面上所形成的孔的中心Μ1,此孔的中心M i 201109123 與保持面側的頂點M2間的連接線段作為斜邊所形成 ,直角三角形中,自中心Ml觀察頂點M2時的仰角 定義為Θ時,發泡亦可以形成為仰角θ的範圍介於 3〇度〜60度時。樹脂薄片係藉由濕式凝固法所形成 長條狀者’發泡亦可以自厚度方向的中央部到保持面 側的發泡端部為止的發泡形成方向,相對於厚度方 向,於樹脂薄片的長度方向上維持傾斜的方式來形 成L又,發泡亦可在與長度方向相交的寬度方向上, 沿f厚度方向上的方式來形成L自與長度方向 相乂的寬度方向的剖面觀察時,發泡係可形成於垂直 方向上。樹脂薄片可以由聚胺酯樹脂所製,發泡間亦 可形成微多孔狀。 根據本發明,由於發泡為自樹脂薄片的厚度方向 的中央部到保持面側的發泡端部為止的發泡形成方 向’相對於厚度方向,於固定方向上呈—致性傾斜的 :式所形成,因而在濕式凝固時就算樹脂薄片上發生 密度不均的現象,於進行研磨加卫,而遭屢縮時仍 全面積,均等化對被研磨物所產生之應力,故 能提高保持面之平坦性精度,且提升被研磨物的面内 均一性。 【實施方式】 對適用本發明實施形態之保 以下,請參閱圖式 持墊進行說明。 _以下,將就保持墊之結構進行說明,如第i圖所 谢匕本:鉍n'的保持墊10 ’係為具備有以聚胺酯 秘月曰所裝作的樹脂薄片的胺基甲酸醋薄片2。胺基甲 201109123 酸酉旨薄片2係藉由濕式凝固法所形成 磨物用的保持面Sh。 有^呆持被研 胺基甲酸酯薄片2係具有在橫跨保持面Sh將近 Ί度:度形成有緻密的微多孔的表面層 2a。亦即’表面層2a上具有微多孔構 甲酸酯薄片2的表面層2a為内側(内部)上,BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a retaining mat, and more particularly to a retaining crucible provided with a resin sheet having a retaining surface for retaining the object to be polished. 'The retaining surface is a large amount of upright foam which is formed by the wet coagulation method and spans the entire thickness. [Prior Art] At present, the surface (machined surface) of various materials (objects to be polished) such as a glass substrate or a hard disk substrate for a semiconductor wafer (WF) for semiconductor use is raised to be flat. Therefore, the grinding process is performed using a grinder having two platforms arranged in opposite directions. In such an object to be polished, in particular, a semiconductor wafer (WF) or a glass substrate for a parallel plane plate needs to have a high-concentration defect-free base layer wiring or display a high-quality image, and thus As a substrate on which these materials are based, the demand for the flatness of the substrate is increasing. For example, when one side of the object to be polished is polished, a polishing is performed on one of the platforms of the polishing machine. The pad, and on the other platform, is the way to keep the object in the object facing the pad. At the time of polishing, a polishing slurry containing abrasive particles (abrasive grains) is supplied between the workpiece and the polishing pad, and a polishing pressure (pressure) is applied to the workpiece. In order to avoid damage due to contact between the object and the platform, it is common to mount a holding mat on the platform for holding the object to be polished. That is, by holding the mat, it is possible to temporarily hold the object to be polished in the rubbing process. Further, in the holding mat, 甩201109123 can be used to suppress the template for lateral displacement of the object to be polished. Whether or not the template is to be used varies depending on the type of the object to be polished. For example, in the polishing process of the glass substrate for the parallel flat plate, the holding of the template is employed. A soft amine phthalate foam (urethanef 具有) having a foaming structure formed by a wet coagulation method as disclosed in Japanese Laid-Open Patent Publication No. H06-62-59 Am, a type of resin sheet, is used as a holding mat. In the polyurethane foam formed by the wet coagulation method, since foaming is formed across the entire thickness, when the foaming size is increased for the purpose of improving the cushioning property, The foaming size adjacent to the holding surface for the abrasive becomes large, and the rigidity thereof will be lowered. Therefore, when the cushioning property is too low, the stress applied to the object to be polished due to the polishing pressure causes a phenomenon of uneven force, and the stress is concentrated on the holding pad side of the object to be polished, and the large convex portion is trapped. On the top, this stress concentration is caused by excessive grinding and uneven grinding. On the other hand, when the cushioning property is improved, the stress applied to the object to be polished becomes less likely to cause uneven force, and thus the surface smoothness of the object to be polished can be improved, but it becomes trapped and enlarged, so that the stress is maintained. The mat itself is also subject to the possibility of being ground. The technique for suppressing the rigidity required for the sinking of the object to be ground and the cushioning property required for equalizing the stress on the object to be polished is parallel, and the prior art is as described in Japanese Patent Laid-Open No. 2005-11972. A holding mat which is bonded by two kinds of sheets having different foaming structures formed by a wet solidification method as disclosed in the publication. In the above technique, one of the sheets is used to ensure cushioning property, and the other sheet is used to exert its rigidity. 4 201109123 However, in the technique of Japanese Laid-Open Patent Publication No. 2006-62059, the surface (holding surface) of the surface layer formed by the wet coagulation method has smoothness, although Although the object to be polished is held relatively flat, there is still a problem that the high-precision flatness required for the above-described requirements is not satisfied. In the technique of Japanese Laid-Open Patent Publication No. 2005-11972, there is a case where unevenness in hardness occurs due to the influence of an adhesive or the like used for bonding the two kinds of sheets. In addition, there is also a problem that the two sheets are peeled off during the polishing process. When the polishing is carried out, the object to be polished is usually held while being held in a holding mat, and flattening is performed. Therefore, when the cushioning pad is compressed, stress is applied to the object to be polished. At this time, when the density of the holding mats is uneven, the magnitude of the stress applied to each of the uneven portions is different, and thus the pressing force is also changed in a regional manner, so that it becomes difficult to perform uniformity across the entire processing surface. Ground grinding process, thus destroying in-plane uniformity. For example, the grinding margin of the outer edge portion and the central portion of the object to be polished differs, so that a so-called outer edge indentation is generated. When the stress unevenness applied to the object to be polished can be reduced and the flatness accuracy of the holding surface can be improved, a required level of the flatness which satisfies the high-precision flatness can be obtained for the object to be polished. SUMMARY OF THE INVENTION In view of the above conventional problems, it is an object of the present invention to provide a retaining pad which, in particular, can improve the flatness of the holding surface and enhance the in-plane uniformity of the object to be polished. In order to solve the above problems, the holding mat of the present invention is provided with a resin sheet having a holding surface which can be used for holding the ground material of the 201109123, which maintains the surface by a large number of upright type foaming of the thickness: In the method of forming the center portion of the thickness direction across the thickness direction, the tenth, and the 'from the resin sheet=forming direction' are inclined with respect to the thickness direction to form the foaming central portion to the resin sheet. The center of the thickness direction. In the thickness direction of the foamed end portion on the surface side, the above-mentioned foaming is formed in the direction of the thickness in the direction of the reinforcing direction, so that the unevenness occurs in the manner of tilting, and the polishing shrinkage is performed. It can still cross the entire area and equal stress, so it can improve the in-plane uniformity of the objects produced by the holding surface. In the case of the thickness of the resin sheet, the thickness of the resin sheet may be in the range of ::: ΐ θ% with respect to the entire thickness. The length of the foaming is preferably from the degree of doubling; the second:: the foaming end is still large. Further, the foaming may be formed so as to be in the thickness direction from the foamed end portion of the back side of the thick phase :: = :: phase holding surface. In the above-mentioned hair, the position perpendicular to the center of the cross section parallel to the holding surface is adjacent to the back surface of the holding surface, and the position where the parallel plane intersects can set the position. The hole formed by the same foaming on the cross section parallel to the back surface is evaluated. When the center Μ1 of the hole formed on the cross section of the holding surface at the center of the thickness direction is formed, the connecting line between the center M i 201109123 of the hole and the apex M2 of the holding surface side is formed as a beveled edge. In the right triangle, when the elevation angle when the vertex M2 is observed from the center M1 is defined as Θ, the foaming may be formed such that the elevation angle θ ranges from 3 〜 to 60 degrees. The resin sheet is formed into a long strip shape by a wet coagulation method. The foaming direction can be foamed from the central portion in the thickness direction to the foamed end portion on the holding surface side, and the resin sheet is formed in the thickness direction. In the longitudinal direction, the inclination is maintained to form L, and the foaming may be formed in the width direction intersecting the longitudinal direction in the thickness direction of the f to form a cross section in the width direction opposite to the longitudinal direction. The foaming system can be formed in the vertical direction. The resin sheet can be made of a polyurethane resin, and the foaming space can also be formed into a microporous shape. According to the present invention, the foaming direction is 'in the direction of the thickness from the central portion in the thickness direction of the resin sheet to the foamed end portion on the holding surface side, and is inclined in the fixed direction. Since it is formed, even if density unevenness occurs on the resin sheet during wet solidification, it is polished and reinforced, and when it is repeatedly shrunk, the entire area is doubled, and the stress generated on the object to be polished is equalized, so that the retention can be improved. The flatness accuracy of the surface and the in-plane uniformity of the object to be polished. [Embodiment] For the application of the embodiment of the present invention, the following description will be given with reference to the drawings. _ Hereinafter, the structure of the holding mat will be described. For example, the holding mat 10' of the 铋n' is a urethane sheet 2 having a resin sheet which is filled with polyurethane. Amino group 201109123 The acid sheet 2 is a holding surface Sh for forming a workpiece by a wet coagulation method. The urethane sheet 2 has a surface layer 2a formed with a dense microporous shape at a degree close to the holding surface Sh. That is, the surface layer 2a having the microporous urethane sheet 2 on the surface layer 2a is on the inner side (inside),

多量的發泡4是形成略為均等地分散狀態。發泡* 2 有橫跨胺基曱酸醋薄片2的大致整體的厚度的: 小,在厚度方向上,形成縱長狀且帶圓頭的圓錐狀。 因胺基甲酸酯薄片2具有表面層2a,所以在保持面 sh上,未形成有㈣4的開口。在發泡4彼此間之 聚胺醋樹脂中’形成有較發泡4還小的微孔多(未圖 示)。在胺基甲酸酿薄片2上,則具有表面層2a的微 多孔構造、發泡4及微多孔呈網目狀連通構造以及發 泡形成連續發泡狀的連續發泡構造等。 X 發泡4,在自胺基甲酸酯薄片2的厚度方向的中 央部到保持面Sh侧之上部層Ph與自厚度方向的中央 部到保持面sh的背面,也就是保持面Sh與其相對面 (以下,稱為背面Sr。)側的下部層Pr上的發泡形 成狀態各不相同。亦即,發泡4係形成為在下部層 Pr上的孔徑較在上部層Ph上的孔徑為大。又,發泡 4係為’於上部層Ph中之到保持面Sh側的發泡端部 為止的發泡形成方向’係相對於厚度方向,係沿固定 方向一致性地傾斜著所形成’而於下部層中之到 背面Sr側的發泡端部為止的發泡形成方向則沿著厚 度方向所形成。換言之’發泡4的發泡形成方向,在 8 201109123 層,Ph + ’是沿著對厚度方向傾斜的方向(第工 圖的箭頭A方向)’而在下部層Pr中,則是沿著厚声 方向(箭頭Β方向)。 又 、因於上部層Ph中,發泡4是形成傾斜狀態,所 以在鄰近保持面Sh與保持面Sh平行的剖面上,藉由 發泡4所形成的孔,而通過此孔中心的垂直線,是與 鄰近背面Sr與背面81>平行的剖面相交的位置與此背 面Sr平行的剖面上,依相同的發泡4所形成的孔之 外側上。亦即,如第2(A)圖所示,自鄰近保持面讥 的保持面Sh相距50〜1〇〇" m程度的内側位置(箭 頭a的位置)、胺基甲酸酯薄片2的厚度方向的中央 的位置(箭頭b的位置)、以及鄰近背面^的自背面 Sr相距50〜100//m程度的内侧位置(箭頭c的位 置)。在此情況下,如第2(B)圖所示,在鄰近保持面 Sh的a-a剖面上,藉由發泡4所形成具有中心的 孔Ha。相同地,在胺基曱酸酯薄片2的厚度方向的 中央部的b-b剖面上,藉由相同的發泡4形成具有中 心Mb的孔Hb ;在鄰近背面Sr的c-c剖面上,藉由 相同的發泡4形成具有中心Mc的孔Hc。孔Ha ^中 心Ma、孔Hb的中心Mb以及孔He的中心Me並未 對齊於厚度方向上,而是位在偏移的位置。亦即,通 過孔H a的中心M a的垂直線L係與c-c剖面於交點 Q上相交。因此’交點Q位於孔He的外側。又,假 設孔He的半徑為Rc,孔He的中心Me與交點q間 的距離為Lc時,則距離Lc之大小約為半徑rc的2 〜5倍左右。 201109123 於此,茲就胺基甲酸酯薄片2所形成之發泡4的 匕,知度進行说明。如第3圖所示,在沿著胺基甲酸 酉曰薄片2的厚度方向的剖面上,於厚度方向的中央上 與保持面sh平行的剖面(請參閱第2⑻圖的b_b剖 面。)上,藉由發泡4所形成具有中心M1的孔。將 ,過此中心M1與厚度方向(第3圖的上下方向)正 交之方向(第3 ®的左右方向)的直線’與通過發泡 4的保持面Sh側的頂點M2,而假設與胺基甲酸酯薄 片2的厚度方向的直線間的交點為p時,則形成以連 釔中心Ml與頂點M2的線段作為斜邊的直角三角 形。在此直角三角形上,自中心M1觀察頂點M2形 成一仰角0。在胺基甲酸酯薄片2的上部層ph上, 發泡4係形成於此仰角θ介於3〇〜6〇度的範圍時。 於此情況下,假設連結中心M1與交點p的線段的長 度為X,連結頂點M2與交點P的線段的長度為y時, 則tan<9”/ X’其比值係介於〇 58〜173的範圍。於 此,仰角0係使用三次元量側χ射線電腦斷層攝影 以非破壞方式,將胺基甲酸酯薄片2的内部剖面進行 攝影取得照片,再於影像解析裝置中,將中心Μι和 頂點M2間進行定位後所獲得之值。簡單說,亦可利 用掃描型電子顯微鏡沿著濕式成膜時的長度方向的 厚度方向的剖面進行攝影,再藉由決定中心M1和頂 點M2後進而算出仰角0。 此外,保持墊1 〇為於胺基甲酸酯薄片2的背面 Sr侧上,貼合有用以將保持墊1〇裝設於研磨機的雙 面膠帶7。雙面膠帶7則具有未圖示的基材,並於= 201109123 材的兩面上分別形成有丙烯酸系黏著劑等感壓型黏 著劑層(未圖示)。基材是使用例如,聚對苯二甲酸 乙一酯(以下,簡稱為PET。)製的薄膜等的可撓性 薄膜。雙面膠帶7係藉基材的一面側的黏著劑層,與 胺基曱酸酯薄片2相互貼合,另一側(與胺基甲酸酉^ 薄片2相反之侧)的黏著劑層的表面上,則以剝離紙 8覆蓋。此外’此雙面膠帶7的基材,亦可兼作保持 墊10的基材。 以下’將就保持墊之製造方式進行說明,保持塾 1 〇是將藉由濕式凝固法形成的胺基甲酸醋薄片2與 雙面膠帶7相互貼合所製造而成。亦即,係包含,調 製聚胺酯樹脂溶液的準備步驟、於成膜基材上塗布聚 胺酯樹脂溶液,並於凝固液中,使聚胺酯樹脂溶液凝 固再生成聚胺酯樹脂的凝固再生步驟、將薄片狀的聚 胺酯樹脂加以洗淨,並使其乾燥的洗淨/乾燥步驟以 及貼合所取得之胺基甲酸酯薄片2和雙面膠帶7的層 壓步驟等製作保持塾10。以下,茲依照各步驟順序 進行說明之。 準備步驟係為混合聚胺酯樹脂、可溶解聚胺醋樹 脂的水混和性有機溶媒及添加劑,將聚胺酯樹脂溶 解。可列舉N,N-二甲基甲醯胺(以下,簡稱為dmf。) 或N ’ N-二甲基乙醯胺(DMAc )等作為有機溶媒, 本實施形態中係使用DMF作為有機溶媒。聚胺酯樹 脂可自聚酯系、聚醚系、聚碳酸酯系等樹脂中選擇其 中一種來使用。當考慮要形成上述的發泡構造時,則 可於D M F中溶解有2 0重量%的聚胺酯樹脂的樹脂岑 201109123 液中’使用B型旋轉黏度計於25°C下所測定的黏度 可介於3〜l〇pa.s的範圍’較佳為選定介於3〜6pa s 的範圍間的樹脂來使用。此聚胺酯樹脂可介於1〇〜 3〇重量%的範圍,較佳為於DMF中溶解成為介於15 25重里%的範圍。聚胺酯樹腊溶液的黏性為,除與 所使用的聚胺酯樹脂的濃度、分子量依存外,由於亦 與分子構造相依存,故將此等因素進行綜合考量,以 進行聚胺酯樹脂的選定或濃度設定等是為重要。次 外,作為保持墊用的聚胺酯樹脂而言,以使用自1〇〇 /模置為20MPa以下者較佳,使用丨〇MPa以下者更 佳。藉由使用低模量的聚胺酯樹脂,而可提高被研磨 物的密接性,進而提升保持力。 此外,為控制發泡4的尺寸或量(個數)及上部 層Ph中傾斜狀的發泡形成,可使用碳黑等顏料、親 水性活性劑及疏水性活性劑等來作為添加劑。此些添 加劑中,亦可使用常用的各種材料。將所得之溶液在 減壓下進行脱泡,而取得聚胺酯樹脂溶液。 於凝固再生步驟中,將準備步驟中所得之聚胺酯 樹脂溶液,於常溫下利用刀式塗布機等塗布裝置,於 帶狀的成膜基材上略均一地塗布成薄片狀。此時,可 透過調整刀式塗布機等與成膜基材間的間隙 胃(clearance),來調整樹脂溶液之塗布厚度(塗布 量)。於本實施形態中,係調整間隙,使塗布厚度介 於〇.8〜丨.2111111的範圍。成膜基材可使用樹脂製薄 膜、布帛、不織布等,於本實施形態中則是使用ρΕτ 製薄膜。 12 201109123 將塗布於成膜基材上的聚胺酯樹脂溶液,連續地 引導至對聚胺酯樹脂而言為不良溶媒的以水為主要 成分的凝固液(水系凝固液)中。為了調整聚胺酯樹 脂的再生速度,亦可於凝固液中添加DMF或DMF 以外的極性溶媒等有機溶媒,但於本實施形態中,則 是使用水。此外凝固液的溫度於本例中可設定介於 15〜20 C的範圍。於凝固液中,首先,在聚胺酯樹脂 溶液與凝固液間的界面形成皮膜,在接近皮膜的聚胺 酯樹脂中,形成可構成表面層2a用的微多孔。接著, 藉由聚胺酯樹脂溶液中的DMF的朝凝固液中的擴散 以及對聚胺醋樹脂中水的浸入的調和現象,而進行再 生具有連續發泡構造的聚胺酯樹脂。此時,由於成膜 基材的PET製薄膜’凝固液無法浸透,故在表面層 2a側發生DMF與水的置換,成膜基材側係形成較表 面層2a侧還大的發泡4。 於此,茲就隨聚胺酯樹脂的再生而伴隨而來的發 泡形成進行說明。在聚胺酯樹脂上,因為凝集力變 大,因而在接近皮膜的聚胺酯樹脂中,急速地進行再 生,而形成表面層2a。於本實施形態中,凝固液僅 使用水,且凝固液的溫度設定成較為低溫的丨5〜2〇 °C。藉此,在與水接觸的部分上,聚胺酯樹脂溶液急 速地凝固的表面上,形成緻密的表面層2a,所以水 與DMF間的相互擴散將受到抑制。另一方面,由於 聚胺醋樹脂的漢度調整至介於10〜30重量%的範 圍’因此凝固速度變緩。由上可知,對聚胺酯樹脂溶 液中水的浸透量變少,聚胺酯樹脂的再生因而緩慢地 13 201109123 進行。此外,聚胺酯樹脂溶液的黏度調整至介於3〜 lOPa.s的範圍。藉此,於凝固液中,先再生而成的表 面層2a侧與不完全再生狀態的成膜基材側,黏性的 差異變大,因而在上部層Ph之發泡4係呈傾斜地形 成。再者,自DMF的聚胺酯樹脂溶液而來的脱溶媒, 亦即,藉由DMF與水閒的置換,而形成表面層2a、 發泡4及微多孔,表面層2&的微多孔、發泡4及微 多孔係呈網目狀地相互連通。 此外,塗布於成膜基材上的聚胺酯樹脂溶液,係 連續地在凝固液中被引導。此時,凝固液中的聚胺酉旨 樹脂溶液的傳送速度設定介於5〜1〇m/min的範 圍。此傳送速度較習知的傳送速度(1〜2m/min左 右的範圍)還快速,如第4(A)圖所示,在上部層ph 側上,發泡4相對於成膜基材的行進方向(第 圖的箭頭方向),於前方側上傾斜地形成。換言之, f部層Ph中的發泡4係形成為,到表面層2a侧的發 ,端部為止的發_成方向’相對於厚度方向,係為 亦即’於成膜基材上再生的聚 S i 傾斜地形成。此外,如第4⑻A large amount of foaming 4 is formed in a state of being slightly uniformly dispersed. The foaming * 2 has a thickness which is substantially the entire thickness of the amino acid vinegar sheet 2: it is small, and is formed in a longitudinal direction and has a rounded conical shape in the thickness direction. Since the urethane sheet 2 has the surface layer 2a, an opening of (4) 4 is not formed on the holding surface sh. In the polyamine vinegar resin which is foamed 4, it is formed with a larger number of micropores than the foamed 4 (not shown). The urethane crucible sheet 2 has a microporous structure of the surface layer 2a, a foamed 4 and a microporous mesh-like communication structure, and a continuous foaming structure in which a foam is formed into a continuous foaming state. The X-foaming 4 is from the central portion in the thickness direction of the urethane sheet 2 to the upper portion Ph of the holding surface Sh side and the back portion from the central portion in the thickness direction to the back surface of the holding surface sh, that is, the holding surface Sh is opposed thereto. The state of foam formation on the lower layer Pr on the side of the surface (hereinafter referred to as the back surface Sr) is different. That is, the foamed 4 is formed such that the pore diameter on the lower layer Pr is larger than the pore diameter on the upper layer Ph. In addition, the foaming 4 is a 'foaming forming direction' in the upper layer Ph to the foamed end portion on the holding surface Sh side, and is formed by being inclined uniformly in the fixing direction with respect to the thickness direction. The foam formation direction in the lower layer to the foamed end portion on the back surface Sr side is formed along the thickness direction. In other words, the foaming direction of the foaming 4 is, in the layer of 8 201109123, Ph + ' is in the direction inclined to the thickness direction (the direction of the arrow A of the drawing) and in the lower layer Pr, the thickness is along the thick Sound direction (arrow Β direction). Further, since the foam 4 is formed in an inclined state in the upper layer Ph, the vertical line passing through the center of the hole is formed by the hole formed by the foaming 4 in the cross section parallel to the holding surface Sh and the holding surface Sh. The cross section parallel to the cross section parallel to the back surface Sr and the back surface 81> is parallel to the back surface Sr, and is formed on the outer side of the hole formed by the same foaming 4. That is, as shown in Fig. 2(A), the inner surface of the holding surface Sh of the adjacent holding surface is 50 to 1 〇〇 " m (the position of the arrow a), the urethane sheet 2 The position in the center in the thickness direction (the position of the arrow b) and the inner position (the position of the arrow c) from the back surface Sr from the back surface Sr of about 50 to 100/m. In this case, as shown in Fig. 2(B), a hole Ha having a center is formed by the foaming 4 on the a-a cross section adjacent to the holding surface Sh. Similarly, a hole Hb having a center Mb is formed by the same foaming 4 on the bb section at the central portion in the thickness direction of the amino phthalate sheet 2; on the cc section adjacent to the back surface Sr, by the same The foam 4 forms a hole Hc having a center Mc. The hole Ha ^ center Ma, the center Mb of the hole Hb, and the center Me of the hole He are not aligned in the thickness direction, but are located at offset positions. That is, the vertical line L passing through the center Ma of the hole H a intersects the c-c cross section at the intersection Q. Therefore, the intersection Q is located outside the hole He. Further, if the radius of the hole He is Rc, and the distance between the center Me of the hole He and the intersection q is Lc, the distance Lc is about 2 to 5 times the radius rc. 201109123 Here, the visibility of the foam 4 formed by the urethane sheet 2 will be described. As shown in Fig. 3, in the cross section along the thickness direction of the lanthanum carbamate sheet 2, the cross section parallel to the holding surface sh in the center in the thickness direction (see the b_b cross section of Fig. 2 (8)). A hole having a center M1 is formed by foaming 4. The straight line ' in the direction in which the center M1 is orthogonal to the thickness direction (the vertical direction of FIG. 3) (the left and right direction of the third direction) and the vertex M2 on the holding surface Sh side of the foaming 4 are assumed to be combined with the amine. When the intersection point between the straight lines in the thickness direction of the urethane sheet 2 is p, a right-angled triangle having a line segment connecting the center M1 and the vertex M2 as a hypotenuse is formed. On this right-angled triangle, the vertex M2 is observed from the center M1 to form an elevation angle of zero. On the upper layer ph of the urethane sheet 2, the foamed 4 is formed when the elevation angle θ is in the range of 3 〇 to 6 〇. In this case, assuming that the length of the line segment connecting the center M1 and the intersection point p is X, and the length of the line segment connecting the vertex M2 and the intersection point P is y, the ratio of tan <9"/X' is between 〇58 and 173. In this case, the elevation angle 0 is obtained by photographing the internal cross section of the urethane sheet 2 in a non-destructive manner using a three-dimensional side X-ray computed tomography, and then in the image analysis apparatus, the center is Μι The value obtained after positioning with the vertex M2. In short, it is also possible to use a scanning electron microscope to photograph a section along the thickness direction in the longitudinal direction of the wet film formation, and then determine the center M1 and the vertex M2. Further, the elevation angle 0 is calculated. Further, the holding mat 1 is placed on the back surface Sr side of the urethane sheet 2, and a double-sided tape 7 for attaching the holding mat 1 to the grinder is bonded. The double-sided tape 7 Further, a substrate (not shown) is provided, and a pressure-sensitive adhesive layer (not shown) such as an acrylic adhesive is formed on both surfaces of the material of 2011009123. The substrate is, for example, polyethylene terephthalate. (hereinafter, referred to as PET. A flexible film such as a film. The double-sided tape 7 is adhered to the amine phthalate sheet 2 by an adhesive layer on one side of the substrate, and the other side (with urethane hydride sheet 2) On the surface of the adhesive layer on the opposite side, the surface of the adhesive layer 8 is covered. Further, the base material of the double-sided tape 7 may also serve as a base material for the holding mat 10. Hereinafter, the manufacturing method of the holding mat will be carried out. It is to be noted that the 塾1 〇 is produced by laminating the urethane sheet 2 formed by the wet coagulation method and the double-sided tape 7. That is, the preparation step of preparing the polyurethane resin solution is A step of coating a polyurethane resin solution on a film-forming substrate, and solidifying the polyurethane resin solution in a coagulating liquid to form a polyurethane resin resin, a step of regenerating the polyurethane resin, washing the flaky polyurethane resin, and drying the drying/drying step And the lamination step of laminating the obtained urethane sheet 2 and the double-sided tape 7 is carried out, etc. The following steps are described in the order of the steps. The preparation step is a mixing of a polyurethane resin and a dissolvable polymerization. The water-miscible organic solvent and the additive of the amine vinegar resin dissolve the polyurethane resin, and examples thereof include N,N-dimethylformamide (hereinafter abbreviated as dmf.) or N'N-dimethylacetamide (DMAc). In the present embodiment, DMF is used as the organic solvent. The polyurethane resin may be selected from a resin such as a polyester resin, a polyether resin or a polycarbonate resin, and it is considered to form the above foam. In the structure, the resin 溶解201109123 dissolved in 20% by weight of polyurethane resin in DMF 'The viscosity measured at 25 ° C using B-type rotary viscometer can be between 3~l〇pa.s The range 'preferably is used for selecting a resin in the range of 3 to 6 Pa s. The polyurethane resin may be in the range of 1 〇 to 3 〇% by weight, preferably dissolved in DMF to be 15 25 mil % The scope. The viscosity of the polyurethane wax solution is not only dependent on the concentration and molecular weight of the polyurethane resin used, but also depends on the molecular structure. Therefore, these factors are comprehensively considered to select the polyurethane resin or to set the concentration. It is important. In addition, as the polyurethane resin for the holding mat, it is preferable to use it from 20 MPa or less, and it is more preferable to use 丨〇 MPa or less. By using a low modulus polyurethane resin, the adhesion of the object to be polished can be improved, and the holding power can be improved. Further, in order to control the size or amount (number) of the foam 4 and the foam formation in an inclined shape in the upper layer Ph, a pigment such as carbon black, a hydrophilic active agent, a hydrophobic active agent or the like may be used as the additive. Among these additives, various materials which are commonly used can also be used. The resulting solution was defoamed under reduced pressure to obtain a polyurethane resin solution. In the coagulation and regeneration step, the polyurethane resin solution obtained in the preparation step is applied to the strip-shaped film-forming substrate in a sheet form at a normal temperature by a coating device such as a knife coater. In this case, the coating thickness (coating amount) of the resin solution can be adjusted by adjusting the clearance between the knife coater and the like and the film formation substrate. In the present embodiment, the gap is adjusted so that the coating thickness is in the range of 〇.8 to 丨.2111111. As the film-forming substrate, a resin film, a cloth, a nonwoven fabric or the like can be used. In the present embodiment, a film made of ρΕτ is used. 12 201109123 The polyurethane resin solution applied to the film-forming substrate is continuously guided to a coagulating liquid (aqueous coagulating liquid) containing water as a main component of the polyurethane resin. In order to adjust the rate of regeneration of the polyurethane resin, an organic solvent such as a polar solvent other than DMF or DMF may be added to the coagulating liquid. However, in the present embodiment, water is used. Further, the temperature of the coagulating liquid can be set in the range of 15 to 20 C in this example. In the coagulating liquid, first, a film is formed at the interface between the polyurethane resin solution and the coagulating liquid, and microporous which can constitute the surface layer 2a is formed in the polyurethane resin close to the film. Next, the polyurethane resin having a continuous foaming structure is regenerated by the diffusion of DMF in the polyurethane resin solution into the coagulating liquid and the incorporation of water into the polyurethane resin. At this time, since the PET film-forming solidified liquid of the film-forming substrate is not allowed to permeate, the DMF and the water are replaced on the surface layer 2a side, and the film-forming substrate side is formed with the foam 4 which is larger than the surface layer 2a side. Here, the formation of foam accompanying the regeneration of the polyurethane resin will be described. In the polyurethane resin, since the cohesive force is increased, the polyurethane resin which is close to the film is rapidly regenerated to form the surface layer 2a. In the present embodiment, only the water is used as the coagulating liquid, and the temperature of the coagulating liquid is set to a relatively low temperature of 〜5 to 2 〇 °C. Thereby, a dense surface layer 2a is formed on the surface where the polyurethane resin solution is rapidly solidified on the portion in contact with water, so that the interdiffusion between water and DMF is suppressed. On the other hand, since the degree of the polyurethane resin is adjusted to a range of 10 to 30% by weight, the solidification rate becomes slow. As is apparent from the above, the amount of water permeation into the polyurethane resin solution is small, and the regeneration of the polyurethane resin is thus slowly carried out 13 201109123. Further, the viscosity of the polyurethane resin solution was adjusted to be in the range of 3 to lOPa.s. As a result, in the coagulating liquid, the difference in viscosity between the side of the surface layer 2a which is first regenerated and the side of the film-formed substrate which is not completely regenerated is increased, so that the foaming 4 of the upper layer Ph is formed obliquely. Further, the desolvent from the DMF urethane resin solution, that is, the surface layer 2a, the foamed 4 and the microporous, and the surface layer 2 & microporous, foamed by DMF and water replacement. 4 and the microporous system are connected to each other in a mesh shape. Further, the polyurethane resin solution applied to the film-forming substrate is continuously guided in the coagulating liquid. At this time, the transport speed of the polyamine resin solution in the coagulating liquid is set to be in the range of 5 to 1 〇 m/min. This transfer speed is also faster than the conventional transfer speed (a range of about 1 to 2 m/min), as shown in Fig. 4(A), on the upper layer ph side, the travel of the foam 4 with respect to the film-forming substrate The direction (the direction of the arrow in the figure) is formed obliquely on the front side. In other words, the foaming 4 in the f-layer layer Ph is formed such that the hair-forming direction 'to the end of the surface layer 2a side and the end portion is the same as the thickness direction, that is, 'regenerated on the film-forming substrate. The poly S i is formed obliquely. In addition, as in 4th (8)

圖所不’發泡4為,自聚胺酯榭 、J =方向的剖面觀察時’係沿著垂直方= 丄奐言之’發泡4在上部層 ; 於厚度方向,於固定方向了 心下…r則是沿著厚度呈;=斜:外形成’ 於聚胺酯樹脂係於成膜基材上 由 表面接觸所形成㈣面Μ,絲形成發泡 201109123 Π 〇 在洗淨/乾燥步驟中,將於再生步驟中所再生的 聚胺酯樹脂,以水等之洗淨液中洗淨,以除去殘留在 聚胺酯樹脂中的DMF《,使其乾燥。於聚胺醋樹脂 ,乾,中’本實施形態是使用具用内含熱源圓筒的圓 筒乾燥機。透過使聚胺g旨樹脂沿著圓筒的圓周面通過 而乾燥。將所獲得之胺基甲酸g旨薄片2捲取成捲轴 狀。 於層壓步驟中,係用以貼合藉濕式凝固法所製成 胺基曱義薄片2與雙面膠帶7。此時,讓胺基甲酸 醋薄片2的背面Sr與雙面膠帶7貼合。接下來,再 裁切成圓形或多角形等所預期的形狀、尺寸後,再進 行確認是否有損傷或附著有髒污或異物等的檢查,即 完成保持墊10。 其次,茲對本實施形態的保持墊1〇所達到之效 果作用等進行說明。 ^為使說明便於理解,茲就藉由習知濕式凝固法所 形成的胺基甲酸酯薄片的發泡構造進行說明。於習知 的濕式凝固法中,於PET製薄膜等的成膜基材上所 塗布的聚胺酯樹脂溶液係於水等凝固液中進行凝 固。因此,如第5圖所示,在構成習知的保持墊2〇 的胺基甲酸酯薄片12中,較於濕式凝固時初期所形 成的表面層12a還為内側上,形成有橫跨胺基曱酸酯 薄片12全體厚度的多量發泡14。此發泡14在保持 面Sh侧較背面Sr侧的孔徑還小,沿著厚度方向於垂 直方向上所形成。 ' 201109123 此外’在胺基甲酸酯薄片12中’鄰近保持面sh, 與保持面Sh平行的剖面上,藉由發泡14所形成的 孔,而通過此孔的中心的垂直線,與鄰近背面Sr,與 背面Sr平行的剖面相交的位置,係位於與背面心平 行的剖面上的相同的發泡14所形成的孔的内部上。 亦即’如第6(A)圖所示,自鄰近屬保持面sh的保持 面Sh相距50〜100# m程度内侧的位置(箭頭1的位 置)、胺基曱酸酯薄片12的厚度方向的中央位置(箭 頭m的位置)以及與鄰近屬背面Sr的背面心相距 5〇〜100" m程度内側的位置(箭頭η的位置)。在此 情況下,如第6(Β)圖所示’在鄰近保持面Sh的1-1 剖面上,藉由發泡14形成中心Ma的孔Ha。相同地, 在胺基甲酸醋薄片12的厚度方向的中央部的_剖 面上,藉由相同的發泡14,形成中心Mb的孔Hb, 而在鄰近背面Sr的η·η剖面上,収藉由相同發泡 14 ’形成中心Mc的孔Hc。孔Ha的中心心、孔册 的中心Mb及孔Hc的中心Mc係位於在厚度方向的 大致對齊的位置上。亦即’通過孔Ha的中心W的 垂直線L係與n-n到面於交點Q上相交。因此,交點 Q係位於孔He的内部。 就使用此種胺基甲酸醋薄片12習知的保持墊2〇 而吕,當進行研磨加工時’而施加研磨麼力時,由於 陷入保持塾2〇側’因具有緩衝性的胺基 甲酸酉曰薄片12壓縮’而對研磨物 =,不均的情況下,亦即,在發泡“的: 成上有不均之情況下’在各密度不均部分上,施加於 16 201109123 被研磨物的應力大小亦隨之不同。因此,施予被研磨 物的按壓力,區域性地變換,因而難以將被研磨物的 加工面,&跨全區域進行均一地研磨加工。其結果 為,進行研磨加工後的被研磨物中,例如,在外緣部 與中央部間的研磨裕度不同,而產生所謂外緣壓陷的 現象。換言之,會因以保持墊2()保持被研磨物,進 行研磨加工,而損及加工面的平坦性。由上可知,習 知的保持塾20 ’無法充分滿足達到高集積化無缺陷 的基層配線或顯示高畫質影像等需求為目的的半導 體用WF或fpd用玻璃基板所要求之高精度的平坦 性。 ,、相對地,於本實施形態中,胺基甲酸酯薄片2所 =成的發泡4,在上部層Ph係相對於厚度方向在固 定=向上呈一致性地傾斜所形成,而在下部層pr是 沿著厚度方向所形成。因此,在濕式凝固時,就算胺 基甲酸㈣片2發生密度不均現象,在進行研磨加工 時,而遭壓縮,仍可均等化對被研磨 力。、此可認為由於2對發泡4的形狀在下部層㈣ 形成位置,保持面Sh側的位置具有偏移的緣故。亦 即,對於保持面Sh上所承受的壓縮力而言,認為藉 由在接近下部層ΡΓ側所形成的複數個發泡4全面地 伸縮因而可在未顯著化密度不均的情況下,減低施 予被研磨物的應力不均。藉此’提高保持面的平坦性 精度’均等化對被研磨物的應力,故可提升被研磨物 的面内均一性,進而可高度地平滑化。 此外,在發泡4是自上部層Ph橫跨下部層pr全。 17 201109123 體傾斜地形成的情況下,因研磨加工時的壓縮力,保 持墊本身係呈剖面斜方狀地變形,而難以均等化施予 被研磨物的應力。在發泡4未於固定方向呈一致性地 傾斜所形成’而是隨機傾斜形成的情況下,就算具有 較為肥大化的下部層Pr’反而容易增大應力不均之 虞。相對於此’於本實施形態中,發泡4因為是在固 定方向呈一致性地傾斜所形成,故可減低應力不均, 進而能提升被研磨物的平坦性。 此外’於本實施形態中,於發泡4中,連結中心 Ml與頂點M2的線段作為斜邊的直角三角形中,自 中心Ml觀察頂點M2時之仰角θ,介於30〜60度的 範圍,亦即,以tan0介於0.58〜1.73的範圍的方式 形成發泡4。藉此,對保持面sh的區域性的壓縮力, 是藉由在接近下部層pr侧所形成的複數個發泡4而 緩和,故可確實地減低對被研磨物的應力不均。當考 慮提升被研磨物的面内均一性時,則以仰角Θ介於 40〜55度的範圍,亦即,以tan0可介於〇 84〜1 μ 的範圍的方式形成發泡4者為宜。 再者,於本實施形態中,發泡4係以在下部層 Pr的孔徑較在上部層Ph的孔徑還大的方式所形成。 藉此,在進行研磨加工,而遭施加研磨壓力時,可確 保緩衝性。此外,由於發泡4在上部層ph係傾斜形 成,故可均等化施加予被研磨物的研磨壓力,而可 制朝被研磨物的保持墊10側的陷入狀況。藉此, 對於陷入變大時’保持塾本身會遭研削的情況,保』 墊20本身被研削的情況可被抑制。據此,可一邊確 201109123 保保持面Sh的平坦性,一邊謀得提升被研磨物的平 坦性。更甚者’通常在研磨加工中,為提升保持面的 平坦性,需要一段運轉適應時間。相對地,在使用保 持墊20的研磨加工中,由於可確保保持面sh的平坦 隹故可達到縮短運轉適應時間,提高生產效率。 此外,於本實施形態中,構成保持墊2〇的胺基 甲酸酯薄片2雖僅例示由聚胺酯樹脂製。但 未受此所限。可具備有樹脂製薄片,亦可採^ 以保持被研磨物所需之緩衝性或適當的硬度等構 $,來作為保持墊20。可使用聚酯或聚乙烯等取代 聚胺酯樹脂為來作為樹脂製薄片。當考慮緩衝性或硬 度等時,則亦可以藉由濕式凝固法所形成的具有發泡 構造的薄片,來作為樹脂製薄片。 此外,於本實施形態中,藉由改變濕式凝固法中 的條件,例如聚胺酯樹脂溶液的濃度或溫度、在凝固 液中的傳送速度等,以改變上部層與下部層h的 厚度比例。亦即,有關胺基甲酸酯薄片2的厚度方向 的中央部,相對於胺基曱酸酯薄片2的全體厚度,可 在以距厚度方向的中心±1〇%的範圍進行改變。當考 慮確保研磨加工時的緩衝性或減低對被研磨物的應 力不均等時,則較佳為將上部層Ph與下部層ρΓ之交 界,位在胺基曱酸酯薄片2的厚度方向的大致中央 處。 此外,於本實施形態中,雖例示了具有作為基材 的PET製薄膜,於基材的兩面上形成有黏著劑層的 雙面膠帶7 ’但本發明未受限於基材或黏著劑的材。 201109123 質。於保持墊方面,僅須具備胺基甲酸酯薄片2即 可’例如’亦可以僅將各種黏著劑塗抹於胺基甲酸醋 薄片2 (的背面Sr;)來取代雙面膠帶7。此外,於本 實施形態中,雖例示了雙面膠帶7的基材可兼作為保 持塾10的基材’但本發明並未受限於此,亦可作成 於胺基甲酸酯薄片2與雙面膠帶7間貼合其他支撐 材。此種支撐材並無特別限制,可列舉PET製的薄 膜或不織布等。再者,雖例示了聚胺酯樹脂溶液的溶 媒、成膜基材、凝固液等之具體例,但本發明未受此 所限,亦可使用其他常用的材料。 再者,本實施形態中雖未特別提及,但在藉由濕 式凝固法所形成的胺基曱酸酯薄片2的厚度不均變 大時’為使保持面Sh與背面Sr可呈平行,宜將背面 Sr侧事先利用擦光或切割等方法進行平滑化。如此一 來’可進一步提升保持面Sh的平坦性。 其次,茲就依據本實施形態所製作而成保持塾 1 〇的實施例進行說明。並一併記载為進行比較用所 製作的比較例。 實施例1 於實施例1中,在胺基曱酸酯薄片2的製作中, 疋知用 5^酉日 MDI(methylene dipheny 1 diisocyanate,二 苯基曱烧二異氰酸醋)之聚胺醋樹脂,對於dmf中 以20重量%的比例溶解的溶液取10〇份,混合添加 45份的DMF ’及含有以碳黑作為顏料2〇重量。/〇的 DMF分散液40份’來調製聚胺酯樹脂溶液。所取得 的聚胺醋樹脂溶液的黏度為3.4Pa.s。此黏度係以旋 201109123 轉黏度計(東機產業株式會社製,TVB_1〇型)並使 用N.M3的旋轉器,於25。(:的溫度環境下,所測定之 值。在塗布聚胺知樹脂溶液時,將塗布裝置的間隙設 定成1.0mm。在PET製薄膜的成膜基材上,塗布聚 胺酯樹脂溶液後,連續地引導溫度2(rc的水(凝固 液)。此時,將聚胺酯樹脂溶液的傳送速度(線速度) 設定為7in/min,使聚胺酯樹脂得以完全再生。在洗 淨/乾燥後,於所取得的胺基甲酸酯薄片2的背面The figure does not 'foam 4', when viewed from the polyurethane 榭, J = direction section, 'line along the vertical side = rumors 'foam 4 in the upper layer; in the thickness direction, in the fixed direction of the heart... r is along the thickness; = oblique: externally formed 'on the polyurethane resin on the film-forming substrate formed by surface contact (four) surface Μ, silk forming foam 201109123 Π 〇 in the washing / drying step, will The polyurethane resin regenerated in the regeneration step is washed with a washing liquid such as water to remove DMF remaining in the polyurethane resin and dried. In the case of polyamine resin, dry, medium, this embodiment uses a cylindrical dryer having a heat source cylinder. The resin is dried by passing the polyamine g resin along the circumferential surface of the cylinder. The obtained carbamic acid g-form 2 was taken up in a roll shape. In the laminating step, it is used to bond the amine-based smear sheet 2 and the double-sided tape 7 which are formed by a wet coagulation method. At this time, the back surface Sr of the urethane sheet 2 was bonded to the double-sided tape 7. Next, after cutting into a desired shape and size such as a circle or a polygon, it is checked whether there is damage or adhesion of dirt or foreign matter, that is, the holding pad 10 is completed. Next, the effect and the like achieved by the holding mat 1 of the present embodiment will be described. In order to facilitate the understanding of the description, the foaming structure of the urethane sheet formed by the conventional wet coagulation method will be described. In the conventional wet coagulation method, the polyurethane resin solution applied to a film-forming substrate such as a PET film is solidified in a coagulating liquid such as water. Therefore, as shown in Fig. 5, in the urethane sheet 12 constituting the conventional holding mat 2, the surface layer 12a formed at the initial stage during wet coagulation is also on the inner side, and is formed across The amine phthalate sheet 12 is foamed 14 in a large amount throughout the thickness. This foaming 14 is smaller on the side of the holding surface Sh than the side of the back surface Sr, and is formed in the vertical direction along the thickness direction. ' 201109123 In addition, in the urethane sheet 12, adjacent to the holding surface sh, a section parallel to the holding surface Sh, a hole formed by the foaming 14 and a vertical line passing through the center of the hole, and adjacent The position of the back surface Sr where the cross section parallel to the back surface Sr intersects is located inside the hole formed by the same foam 14 on the cross section parallel to the back core. That is, as shown in Fig. 6(A), the holding surface Sh of the adjacent holding surface sh is spaced apart from the inside of the range of 50 to 100 #m (the position of the arrow 1), and the thickness direction of the amine phthalate sheet 12 The central position (the position of the arrow m) and the position of the inside of the back side of the adjacent back side Sr are 5 〇 to 100 " m degree (the position of the arrow η). In this case, as shown in Fig. 6(Β), on the 1-1 cross section adjacent to the holding surface Sh, the hole Ha of the center Ma is formed by the foaming 14. Similarly, in the cross section of the central portion in the thickness direction of the urethane sheet 12, the hole Hb of the center Mb is formed by the same foaming 14, and the η·η section adjacent to the back surface Sr is taken. The hole Hc of the center Mc is formed by the same foaming 14'. The center center of the hole Ha, the center Mb of the hole booklet, and the center Mc of the hole Hc are located at substantially aligned positions in the thickness direction. That is, the vertical line L passing through the center W of the hole Ha intersects with the n-n to the intersection point Q. Therefore, the intersection point Q is located inside the hole He. In the case of using such a urethane sheet 12, the holding mat 2 is used, and when the grinding process is performed, the grinding force is applied, and the 塾2〇 side is trapped due to the buffering of the guanidinium carbamate. When the sheet 12 is compressed, and the workpiece is uneven, that is, when the foaming is "uneven in the formation", it is applied to the unevenness portion of each density, and is applied to 16 201109123. The magnitude of the stress is also different. Therefore, the pressing force applied to the object to be polished is changed regionally, so that it is difficult to uniformly polish the processed surface of the object to be polished and the entire region. In the object to be polished after the polishing, for example, the polishing margin between the outer edge portion and the central portion is different, and a phenomenon of so-called outer edge depression occurs. In other words, the object to be polished is held by the holding pad 2 (). The polishing process is performed to damage the flatness of the machined surface. As is apparent from the above, the conventional 塾20' cannot sufficiently satisfy the requirements of high-integration and defect-free base layer wiring or display of high-quality images, etc. Fpd The high-precision flatness required for the glass substrate. In contrast, in the present embodiment, the foam 4 of the urethane sheet 2 is fixed in the upper layer Ph with respect to the thickness direction. It is formed by uniform inclination, and is formed along the thickness direction in the lower layer pr. Therefore, in the case of wet solidification, even if the density of the aminocarboxylic acid (4) sheet 2 is uneven, it is subjected to grinding processing. The compression can still equalize the grinding force. It is considered that the shape of the two pairs of foaming 4 is at the position where the lower layer (4) is formed, and the position on the holding surface Sh side is shifted. That is, for the holding surface Sh In terms of the compressive force, it is considered that the plurality of foams 4 formed on the side of the lower layer are fully expanded and contracted, so that the stress applied to the object to be polished can be reduced without significantly increasing the density unevenness. By increasing the flatness accuracy of the holding surface to equalize the stress on the object to be polished, the in-plane uniformity of the object to be polished can be improved, and the smoothness can be improved. Further, the foaming 4 is from the upper portion. Layer Ph across the lower layer p 17 201109123 When the body is formed obliquely, the holding pad itself is deformed in a rhombic shape due to the compressive force during the polishing process, and it is difficult to equalize the stress applied to the object to be polished. In the case where the fixed direction is formed by uniformly tilting, but is formed by random tilting, even if the lower layer Pr' having a larger enlargement tends to increase the stress unevenness, it is relatively the same as in the present embodiment. Since the bubble 4 is formed to be uniformly inclined in a fixed direction, stress unevenness can be reduced, and the flatness of the object to be polished can be improved. Further, in the present embodiment, in the foam 4, the connection center M1 and The line segment of the vertex M2 is a right-angled triangle of the hypotenuse, and the elevation angle θ when the vertex M2 is observed from the center M1 is in the range of 30 to 60 degrees, that is, the foaming is formed in such a manner that tan0 is in the range of 0.58 to 1.73. . Thereby, the regional compressive force against the holding surface sh is alleviated by the plurality of foams 4 formed close to the lower layer pr side, so that the stress unevenness to the workpiece can be surely reduced. When considering the in-plane uniformity of the object to be polished, the elevation angle Θ is in the range of 40 to 55 degrees, that is, it is preferable to form the foam 4 in such a manner that tan0 can be in the range of 〇84 to 1 μ. . Further, in the present embodiment, the foaming 4 is formed such that the pore diameter of the lower layer Pr is larger than the pore diameter of the upper layer Ph. Thereby, when the polishing process is performed and the polishing pressure is applied, the cushioning property can be ensured. Further, since the foaming 4 is formed obliquely in the upper layer ph system, the polishing pressure applied to the object to be polished can be equalized, and the immersed state on the holding mat 10 side of the workpiece can be obtained. Thereby, the situation in which the pad 20 itself is ground can be suppressed in the case where the shackle itself is subjected to grinding when the sag becomes large. According to this, it is possible to improve the flatness of the object to be polished while ensuring the flatness of the surface Sh while ensuring the 201109123. What's more, 'usually in the grinding process, in order to improve the flatness of the holding surface, it takes a period of operation to adapt to the time. On the other hand, in the polishing process using the holding mat 20, since the flatness of the holding surface sh can be ensured, the operation adaptation time can be shortened and the production efficiency can be improved. Further, in the present embodiment, the urethane sheet 2 constituting the holding mat 2 is merely exemplified by a polyurethane resin. However, it is not subject to this limitation. A resin sheet may be provided, and the cushioning property required for the object to be polished or an appropriate hardness may be used as the holding mat 20. A polyurethane resin or a substituted polyurethane resin can be used as the resin sheet. When a cushioning property, a hardness, or the like is considered, a sheet having a foaming structure formed by a wet coagulation method may be used as a resin sheet. Further, in the present embodiment, the thickness ratio of the upper layer to the lower layer h is changed by changing the conditions in the wet coagulation method, for example, the concentration or temperature of the polyurethane resin solution, the transport speed in the coagulating liquid, and the like. In other words, the central portion of the urethane sheet 2 in the thickness direction can be changed in the range of ±1% by weight from the center of the thickness direction with respect to the entire thickness of the urethane phthalate sheet 2. When it is considered to ensure the cushioning property at the time of polishing processing or to reduce the stress unevenness to the workpiece, it is preferable to set the boundary between the upper layer Ph and the lower layer ρΓ in the thickness direction of the amino phthalate sheet 2 Central office. Further, in the present embodiment, a double-sided tape 7' having a PET film as a substrate and having an adhesive layer formed on both surfaces of the substrate is exemplified, but the present invention is not limited to a substrate or an adhesive. material. 201109123 Quality. In the case of the holding mat, it is only necessary to have the urethane sheet 2, i.e., it is possible to apply only various adhesives to the back side Sr of the urethane sheet 2 instead of the double-sided tape 7. Further, in the present embodiment, the base material of the double-sided tape 7 is also exemplified as the base material for holding the crucible 10, but the present invention is not limited thereto, and may be formed on the urethane sheet 2 and The double-sided tape 7 is fitted with other support materials. The support material is not particularly limited, and examples thereof include a film made of PET or a non-woven fabric. Further, specific examples of the solvent, the film-forming substrate, and the coagulating liquid of the polyurethane resin solution are exemplified, but the present invention is not limited thereto, and other commonly used materials may be used. Further, although not particularly mentioned in the present embodiment, when the thickness unevenness of the amino phthalate sheet 2 formed by the wet coagulation method becomes large, the holding surface Sh and the back surface Sr may be parallel. It is preferable to smooth the back Sr side by polishing or cutting in advance. In this way, the flatness of the holding surface Sh can be further improved. Next, an embodiment in which the 塾 1 塾 is produced according to the present embodiment will be described. Also, it is described as a comparative example produced for comparison. Example 1 In Example 1, in the preparation of the amino phthalate sheet 2, a polyamine vinegar of MDI (methylene dipheny 1 diisocyanate, diphenyl sulfonium diisocyanate) was used. The resin was prepared by dissolving 10 parts of a solution dissolved in a ratio of 20% by weight in dmf, mixing 45 parts of DMF' and adding carbon black as a pigment. / 〇 DMF dispersion 40 parts ' to prepare a polyurethane resin solution. The viscosity of the obtained polyamine vinegar resin solution was 3.4 Pa.s. This viscosity was measured by a rotary spinner of 201109123 (manufactured by Toki Sangyo Co., Ltd., TVB_1〇) and a rotator of N.M3. (Measured value in the temperature environment of :: When the polyamine-based resin solution is applied, the gap of the coating device is set to 1.0 mm. After coating the polyurethane resin solution on the film-forming substrate of the PET film, continuously The temperature 2 (rc water (coagulating liquid) is guided. At this time, the transport speed (linear velocity) of the polyurethane resin solution is set to 7 in/min, and the polyurethane resin is completely regenerated. After washing/drying, it is obtained. The back of the urethane sheet 2

Sr侧進行檫光’使擦光面上貼合雙面膠帶7而完成保 持墊10的製造。 實施例2 於實施例2中,除將聚胺酯樹脂溶液的線速度設 疋成5m/min外,其他皆與實施例丨相同條件地製 作胺基甲酸酯薄片2,而完成保持墊1〇的製造。所 使用的聚胺酯樹脂溶液的黏度為3 2Pas。 比較例1 於胃比较例1中,除將聚酯MDI之聚胺酯樹脂以 30重量%的比例溶解於DMF,於凝固液中的線速度 设定為1.5m/min外,其他皆與實施例丨相同條件地 象作胺基甲酸酯薄片12,而完成保持塾2〇的製造。 聚胺酯樹脂溶液的黏度為8.2 Pas。亦即,比較例1 的保持墊20係為習知的保持墊(亦可參閱第5圖)。 將所取得的實施例1及比較例1的胺基甲酸酯薄 片,利用三次元量側x射線電腦斷層攝影裝置,以 ,破壞方式可視化内部構造,藉以比較發泡的形成狀 態。亦即,使用三次元量側x射線電腦斷層攝影裝^ 21 201109123 大'?學株式會社製,TDM1000_IS/SP)進行 旦^ :知自保持面Sh相距10"m間隔的連續斷層 :「二:得(:層影像’以SEM用影像解“ 制、冷说 」(〇lymPus §〇ft-Imaging S〇luti〇ns 社 )項取,針對顯著的!個發泡4(於比較例i中,係 指發泡14。以下,允η 、 ,, ^ ’、 Υ亦问。),未取各剖面影像的發泡 心)。其次,自發泡4的頂點Μ2觀察的剖面 影像與保持面Sh間的距離、自厚度方向的中央所形 成具有中心Ml的孔的剖面影像與保持面处間的距 離取得一個剖面間的距離y。此外,於通過中心 Ml與厚度方向正交的方向之直線,與通過頂點M2 之厚度方向的直線的交點為p時,取其中心Μι與交 點P間的距離為x (亦可參閱第3圖)。由所取得之 距離X與距離y的數值,求得tan0的值,於實施例 1及實施例2中分別為0.93及L28,於比較例J中則 為9.51。自所取得之tang的值,換算為屬發泡的傾 斜角之仰角0後,於實施例1及實施例2分別為 度及52度,比較例1則為84度,因而可得知實施例 1及實施例2的發泡較比較例丨的發泡更為傾斜。藉 由連續斷層影像解析之tan Θ的測定結果可明瞭,於 比較例1的胺基曱酸酯薄片12令,係以橫跨厚度全 體地沿著厚度方向形成發泡(亦可參閱第6圖)。亦 即’自厚度方向的才央部到表面層側,雖可觀察到稱 微傾斜的狀態,但發泡形成方向大致是沿著厚度方向 形成。相對地,於實施例1的胺基甲酸酯薄片2中, 可明瞭在上部層Ph的發泡形成方向較比較例1更為 22 201109123 傾斜(亦可參閱第2圖)。 關於研磨性能評估,使用各實施例及比較例中的 保持墊,於下述的研磨條件下,進行液晶顯示器用玻 璃基板(470mmx370mmx0.7mm)的研磨加工,利用 依曰本工業規格(JIS B 0601:’ 82)為基準的方 法,自濾波紋中心起伏求得平坦度a。在平坦度a的 測定中,係使用表面粗度形狀測定機(株式會社東京 精密製,surfcom480A ),依下述的測定條件進行測 定。自起因於基板表面的凹凸所獲得之測定曲線,算 出相鄰的凸部(山部)與凸部間的寬度W及凸部和 凹部(谷部)間的高度S,並作成以寬度W為橫轴, 高度S為縱軸的散布圖。自散布圖求出一次方程式 S=aW的近似直線,將斜度a設為研磨加工後之最終 的平坦度a。因平坦性越高,則寬度W變大,高度S 變小,故當斜度a越小時則平坦性則越顯優異。 研磨條件 使用研磨機:OSCAR研磨機(SPEEDFAM社製, SP-1200) 研磨速度(旋轉數):61 rpm 加工壓力:100g/cm2 研磨漿:鈽漿 研磨時間:30min 波紋中心起伏測定條件 評估長度:90mm 測定速度:3.0mm/s 中斷值:0.8〜8.0mm r 23 201109123 薄膜種類別:2RC 測定範圍:±40.0以m 傾斜補償:平滑曲線 經比較分別使用實施例丨及實施例2的保持墊 10與比較例1的保持墊20進行研磨加工後的平坦度 a,可知在研磨30分鐘後,實施例i及實施例2之$ 坦度a分別以0.0004及〇.〇〇〇6表示,而比較例 平坦度a則以0.0012表示。亦即,以實施例丨及實 施例2而言,與比㈣丨比較,可提升最終的平坦度 a。因此,可清楚得知,使用具備有藉由濕式凝固法 於上部層Ph上相對於厚度方向是在固定方向上呈一 致性地傾斜所形成,而在下部層pr上則沿著厚度方 向所形成的發泡4的胺基甲酸酯薄片2的保持墊1〇, 而可提高保持面之平坦性精度,且同時可提升被研磨 物的面内均一性。 本發明乃提供一種能提高保持面之平坦性精 度,且提升被研磨物的面内均一性之保持墊,故在保 持墊的製造、販售上具有貢獻,係為極具產業利用性 之發明。 【圖式簡單說明】 第1圖係表示適用於本發明之實施例的保持墊之剖面 示意圖; 第2圖係表示構成實施例的保持墊的胺基甲酸酯薄片 中的發泡之形成狀態之示意圖,其中,第2(A) 24 201109123 圖係為胺基甲酸酯薄片的厚度方向之剖面 圖,而第2(B)圖係分別表示於第2(A)圖中°a_a 剖面、b-b剖面及c_c剖面上所形成的孔的中 心的位置關係之示意說明圖; 第3圖係表示構成實施例的保持墊的胺基甲酸酯薄片 中上所形成發泡中的傾斜程度之示意說明圖; 第4圖係表示實施例的保持墊之剖面掃描型電子顯微 鏡照片,其中,第4(A)圖係表示沿濕式成膜時 的長度方向的厚度方向上之剖面,第4(B)圖係 表示沿與長度方向相交的寬度方向的厚度方 向上之剖面; 第5圖係'表示習知的保持塾之剖面示意圖;以及The Sr side is subjected to calendering to adhere the double-sided tape 7 to the polishing surface to complete the manufacture of the holding mat 10. [Example 2] In Example 2, a urethane sheet 2 was produced under the same conditions as in Example 除 except that the linear velocity of the polyurethane resin solution was set to 5 m/min, and the pad 1 was completed. Manufacturing. The viscosity of the polyurethane resin solution used was 32 Pas. Comparative Example 1 In Comparative Example 1 of the stomach, except that the polyester MDI urethane resin was dissolved in DMF at a ratio of 30% by weight, and the linear velocity in the coagulating liquid was set to 1.5 m/min, the other examples and examples 丨The same condition is used as the urethane sheet 12, and the production of the crucible is completed. The viscosity of the polyurethane resin solution was 8.2 Pas. That is, the holding mat 20 of Comparative Example 1 is a conventional holding mat (see also Fig. 5). The urethane sheets of the obtained Example 1 and Comparative Example 1 were visualized by a ternary amount side X-ray computed tomography apparatus to visualize the internal structure, thereby comparing the formation state of foaming. That is, using a three-dimensional side-side x-ray computed tomography apparatus ^ 21 201109123, manufactured by Takusho Co., Ltd., TDM1000_IS/SP), a continuous fault of 10 intervals from the holding surface Sh: "two: (In the comparative example i, the layer image 'is solved by the SEM image, and the cold is said" (〇lymPus §〇ft-Imaging S〇luti〇ns) Refers to foaming 14. Below, let η, ,, ^ ', Υ also ask.), not taking the foaming heart of each cross-sectional image). Next, the distance between the cross-sectional image observed from the apex Μ2 of the foaming 4 and the holding surface Sh, and the distance between the cross-sectional image of the hole having the center M1 and the holding surface from the center in the thickness direction, obtain a distance y between the cross-sections. Further, when the intersection of the straight line passing through the center M1 and the direction orthogonal to the thickness direction and the straight line passing through the thickness direction of the vertex M2 is p, the distance between the center Μι and the intersection point P is x (see also Fig. 3) ). The value of tan0 was obtained from the values of the distance X and the distance y obtained, and was 0.93 and L28 in Example 1 and Example 2, respectively, and 9.51 in Comparative Example J. Since the value of tang obtained is converted to the elevation angle 0 of the tilt angle of the foaming, the degree and the degree are 52 degrees in the first embodiment and the second embodiment, respectively, and the comparative example 1 is 84 degrees. The foaming of 1 and Example 2 was more inclined than the foaming of Comparative Example. As a result of measuring the tan Θ of the continuous tomographic image analysis, it was confirmed that the amino phthalate sheet 12 of Comparative Example 1 was foamed in the thickness direction as a whole across the thickness (see also Fig. 6). ). That is, from the center of the thickness direction to the surface layer side, although a state of being slightly inclined is observed, the direction in which the foam is formed is formed substantially along the thickness direction. On the other hand, in the urethane sheet 2 of Example 1, it was confirmed that the foam formation direction of the upper layer Ph was more inclined than that of Comparative Example 1 by 2011-09-123 (see also Fig. 2). For the evaluation of the polishing performance, the glass substrate for liquid crystal display (470 mm x 370 mm x 0.7 mm) was polished under the following polishing conditions using the holding mats of the respective Examples and Comparative Examples, and the industrial specifications (JIS B 0601) were used. : ' 82 ) is the reference method, and the flatness a is obtained from the fluctuation of the corrugated center. In the measurement of the flatness a, the surface roughness measuring machine (manufactured by Tokyo Seimi Co., Ltd., surfcom 480A) was used and measured according to the following measurement conditions. The width W between the adjacent convex portion (mountain portion) and the convex portion and the height S between the convex portion and the concave portion (valley portion) are calculated from the measurement curve obtained by the unevenness on the surface of the substrate, and the width W is calculated. On the horizontal axis, the height S is a scatter diagram of the vertical axis. The approximate straight line of the equation S = aW is obtained from the scatter plot, and the slope a is set to the final flatness a after the grinding process. The higher the flatness, the larger the width W and the smaller the height S. Therefore, the flatness is more excellent when the slope a is smaller. Grinding conditions using a grinder: OSCAR grinder (SP-DFAM, SP-1200) Grinding speed (number of revolutions): 61 rpm Processing pressure: 100 g/cm2 Grinding slurry: grouting time: 30 min Corrugation center undulation measurement condition Evaluation length: 90 mm Measurement speed: 3.0 mm/s Interruption value: 0.8 to 8.0 mm r 23 201109123 Film type: 2RC Measurement range: ±40.0 in m Tilt compensation: smooth curve was compared using the holding mats of Example 丨 and Example 2, respectively. The flatness a after polishing with the holding mat 20 of Comparative Example 1 shows that the tangent a of Example i and Example 2 is represented by 0.0004 and 〇.6, respectively, after polishing for 30 minutes, and is compared. The example flatness a is represented by 0.0012. That is, in the case of the embodiment and the embodiment 2, the final flatness a can be improved as compared with (4). Therefore, it is clear that the use is formed by the wet solidification method in which the upper layer Ph is uniformly inclined in the fixed direction with respect to the thickness direction, and the lower layer pr is formed along the thickness direction. The formed pad 4 of the foamed urethane sheet 2 can improve the flatness accuracy of the holding surface and at the same time improve the in-plane uniformity of the object to be polished. The present invention provides a holding mat which can improve the flatness accuracy of the holding surface and improve the in-plane uniformity of the object to be polished, and thus contributes to the manufacture and sale of the holding mat, and is an industrially useful invention. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a holding mat suitable for use in an embodiment of the present invention; and Fig. 2 is a view showing a state of foam formation in a urethane sheet constituting the holding mat of the embodiment. 2(A) 24 201109123 is a cross-sectional view in the thickness direction of the urethane sheet, and the second (B) diagram is shown in the °a_a section in the second (A) diagram, A schematic explanatory view of the positional relationship of the center of the hole formed in the bb section and the c_c section; Fig. 3 is a view showing the degree of inclination in the foam formed on the urethane sheet constituting the holding mat of the embodiment; Fig. 4 is a cross-sectional scanning electron micrograph showing a holding mat of the embodiment, wherein the fourth (A) diagram shows a section in the thickness direction along the longitudinal direction at the time of wet film formation, and the fourth (4) B) the figure shows a section in the thickness direction along the width direction intersecting the length direction; FIG. 5 is a schematic view showing a conventional section of the holding ;;

第6圖係表示構成習知的保持墊的胺基甲酸醋薄片中 的發泡之形成狀態之示意圖,其中,第6(a) 圖係為胺基曱酸酯薄片的厚度方向之剖面 圖,而第6(B)圖係分別表示於第6(A)圖中M 剖面、m-m剖面及η·η剖面上所形成的孔的中 心的位置關係之示意說明圖。 【主要元件符號說明】 2、12.胺基甲酸醋薄片; 2a、12a :表面層; 4、14 :發泡; 7 :雙面膠帶; 8 :剝離紙; 25 201109123 10、20 :保持墊;Fig. 6 is a view showing a state in which foaming is formed in a urethane sheet which constitutes a conventional holding mat, wherein Fig. 6(a) is a cross-sectional view in the thickness direction of the aminophthalic acid sheet. Further, Fig. 6(B) is a schematic explanatory view showing the positional relationship of the centers of the holes formed in the M section, the mm section, and the η·η section in Fig. 6(A). [Description of main component symbols] 2. 12. Amino acid vinegar flakes; 2a, 12a: surface layer; 4, 14: foaming; 7: double-sided tape; 8: release paper; 25 201109123 10, 20: holding pad;

Ha、Hb、He :孑L ;Ha, Hb, He: 孑L;

Lc :距離;Lc: distance;

Ml、Ma、Mb、Me :中心; M2 :頂點;Ml, Ma, Mb, Me: center; M2: vertex;

Pr :下部層;Pr : lower layer;

Ph :上部層; Q :交點;Ph: upper layer; Q: intersection point;

Sh :保持面;Sh : keep the face;

Sr :背面;以及 0 :仰角。 26Sr: back; and 0: elevation angle. 26

Claims (1)

201109123 七、申請專利範圍: 1·一種保持墊,係包含·· 拉f脂薄片’該樹脂薄片具有保持被研磨物之-伴 =:薄7厚7=凝固法所形成大: 發泡; 厚a王體的大置直立型之複數個 片之-;塾令之至少一該發泡,自該樹脂薄 一固f方=發泡形成方向,係相對於該厚度方向沿 U疋方向一致性地傾斜所形成。 2·如脂申1項所述之轉塾,其中,該樹 方向之該中央部,係介於相對於 二全體厚度,自該厚度方向的中心 ±10%的範圍。 3·如申請專利範圍第2項所述之保持墊,其中,該發 ,包自該厚度方向之該中央部到該保持面之一背^ 發泡端部為止之一孔徑’較到該保持面之發 泡端部為止之該孔徑為大。 4.如申請專利範圍第3項所述之保持墊,其中,該發 f自該厚度方向之該中央部到該保持面之該背面 則之發泡端部為止之-發泡形成 度方向所形成。 “該厚 5·如申請專利範圍第4項所述之保持墊,其中,該發 泡鄰近該保持面上,通過與該保持面平行的^面 上所形成孔的中心的垂直線,與鄰近該保持^之 -背面上’與該背面平行的剖面相交的位置,係 r ^ , 27 201109123 設定成為位於與該背面平行的剖面上相同的至少 一該發泡所形成的孔的外侧上。 6. 如申請專利範圍第4項所述之保持塾,其中,該發 泡於該厚度方向之中央上與該保持面平行的剖^ 上所形成孔之-中心M1與該保持面側之一頂點 M2所形成之連接線段為斜邊之直角三角形中,自 該中心Μ1觀察該頂點M 2之仰角為0時,該仰角 0係設定介於30度〜60度的範圍。 7. 如申請專利範圍第丨項所述之保持墊,其中, 該樹脂薄片係藉濕式凝固法所形成之長條狀 片;以及 ' 該發泡自該厚度方向之該中央部到該保持面側之 發泡端部為止之發泡形成方向,係相對於該厚度 方向沿該樹脂薄片之一長度方向傾斜所形成。 8. 如申請專利範圍第7項所述之保持墊,其中,該發 泡係沿與該長度方向相交之寬度方向上之該^ 方向所形成。 又 9. 如申請專利範圍第8項所述之保持墊,其中,該 發泡係自該長度方向相交之寬度方向之剖面觀^ 時,係形成於垂直方向上。 、 1〇·如申請專利範圍第7項所述之保持墊’其中, 該樹脂薄片,係為聚胺酯樹脂製;以及 該發泡間隙形成微多孔狀。 28201109123 VII. Patent application scope: 1. A holding mat, which contains ····························································· a plurality of pieces of the large upright type of the king body; at least one of the foaming of the enamel, from the resin, a solid f-square = foam forming direction, consistent with the thickness direction along the U 疋 direction The ground is formed by tilting. 2. The switch according to the item 1, wherein the central portion of the tree direction is in a range of ±10% from the center of the thickness direction with respect to the total thickness of the two. 3. The holding mat of claim 2, wherein the hair is wrapped from the central portion of the thickness direction to one of the back ends of the holding surface The pore diameter of the foamed end portion of the surface is large. 4. The holding mat according to claim 3, wherein the hair f is from the central portion in the thickness direction to the foamed end portion of the back surface of the holding surface form. The thickness of the holding pad according to the fourth aspect of the invention, wherein the foaming is adjacent to the holding surface, a vertical line passing through a center of the hole formed on the surface parallel to the holding surface, and adjacent The position at which the cross section parallel to the back surface intersects on the back surface, r ^ , 27 201109123 is set to be on the outer side of at least one of the holes formed by the foaming on the cross section parallel to the back surface. The retaining crucible according to claim 4, wherein the foam is formed in a center of the thickness direction in a direction parallel to the retaining surface, and a center M1 of the hole and a vertex of the retaining surface side The connecting line segment formed by M2 is a right-angled triangle of the oblique side. When the elevation angle of the vertex M 2 is 0 from the center Μ1, the elevation angle 0 is set in the range of 30 degrees to 60 degrees. The holding mat according to the item, wherein the resin sheet is a long sheet formed by a wet coagulation method; and the foaming end of the foam from the central portion to the holding surface side in the thickness direction Foam formation direction A retaining pad according to the length direction of the resin sheet, wherein the foaming system is in the width direction intersecting the length direction. The retaining pad according to the eighth aspect of the invention, wherein the foaming is formed in a vertical direction from a cross-sectional view in the width direction intersecting the longitudinal direction. The holding mat of the seventh aspect of the invention, wherein the resin sheet is made of a polyurethane resin; and the foaming gap is formed into a microporous shape.
TW98132166A 2009-09-03 2009-09-23 Keep the pad TWI432287B (en)

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CN102481679B (en) 2014-06-18
KR101588925B1 (en) 2016-01-26
CN102481679A (en) 2012-05-30
KR20120060812A (en) 2012-06-12
WO2011027411A1 (en) 2011-03-10
JP5355310B2 (en) 2013-11-27
JP2011051074A (en) 2011-03-17

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