[go: up one dir, main page]

TW201103697A - Equipment and method for cleaning polishing cloth - Google Patents

Equipment and method for cleaning polishing cloth Download PDF

Info

Publication number
TW201103697A
TW201103697A TW099107177A TW99107177A TW201103697A TW 201103697 A TW201103697 A TW 201103697A TW 099107177 A TW099107177 A TW 099107177A TW 99107177 A TW99107177 A TW 99107177A TW 201103697 A TW201103697 A TW 201103697A
Authority
TW
Taiwan
Prior art keywords
nozzle
cloth
polishing cloth
polishing
grinding
Prior art date
Application number
TW099107177A
Other languages
Chinese (zh)
Inventor
Kentaro Sakata
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of TW201103697A publication Critical patent/TW201103697A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The equipment for cleaning polishing cloth is capable of increasing pressure of washing water received by the polishing cloth, securely removing deposits from the polishing cloth and improving polishing efficiency. The equipment is used in a polishing apparatus, in which a work piece is pressed onto the polishing cloth adhered on a polishing plate and the work piece is relatively moved with respect to the polishing plate with supplying slurry to the polishing cloth so as to polish the work piece. The equipment comprises a nozzle unit having a nozzle capable of spraying high-pressure washing water toward the polishing cloth so as to clean the polishing cloth. The nozzle is a straight nozzle capable of linearly spraying the washing water and perpendicularly spraying the washing water with respect to the polishing cloth.

Description

201103697 六、發明說明: 【發明所屬之技術領域】 本申請案是依據並且主張於2009年3月27曰提 出申請的先前曰本專利申請案第P2〇〇9-79630號之 優先權’且該申請案的全部内容以參考文獻被併入本 說明書中。 本發明是有關於用於洗淨研磨布的一種裝置以 及一種方法。 【先前技術】 工作部件,例如半導體晶‘片,在一研磨設備中藉 由下列步驟被研磨:將工作部件壓至接附於一研磨盤 上的研磨布;令該研磨盤相對於工作部件移動;以及 當研磨工作部件之時將漿體供給至研磨布。 順便提,假使長時間使用研磨布,不同種類的 &quot;匕積物,例如磨屑(abrasi〇n dust)、漿體、反應產物, 逐漸地沉積在研磨布中。沉積物將造成某些問題,例 如降低研磨效率’損壞工作部件。因此,高壓洗液 (washing water)被定期地喷往研磨布以洗淨研磨 布。 傳’.·先洗淨裝置的—種是揭露於日本公開專利公 開第 P7-9340A號去。,办你从壯^ 现者该傳統裝置將高壓(約50 kg/Cm2)洗液從—嘴嘴傾斜地喷往研磨布,以使得研 磨布中的沉積物浮起’並且被移除。要注意的是,噴 201103697 嘴可被刷具圍起,以避免高壓洗液嘴錢。 然而’在上述的傳統裝置中,研磨布中的沉積 物’例如磨屑’無法充分地被移除,且無法獲得所欲 的研磨效率。 由於傾斜喷灑的高壓洗液是以一種似風扇的形 式散開,沉積物無法充分地被移除。發明人認為研磨 布所承受的每單位面積的洗液壓力小,所以這個問題 無法充分地被解決。 而今,研磨布主要是由發泡聚胺甲酸酯所構成。 與由不織布所構成的研磨布相較之下,難以透過噴灑 洗液從由發泡聚胺甲酸s旨所構成的不織布來移除沉 【發明内容】 因此,在本發明的—個目的是提供用於洗淨研/ 布的一種裝置以及一種方 t ’ 的洗液壓力,從研磨=增磨布所心 磨效率。 穩地移除沉積物並且增進; 為了達到該目的,用於洗淨研磨 於一研磨設借由,—j·— 1置疋使月 所“備中,在該研磨設備中 而接附於一研磨盤卜沾m Λ + 作。卩件被壓 漿體供給至研磨布、布’且該工作部件隨著網 =該工作部件。該用於洗淨研磨布地二動, 士能夠將高壓洗”往研磨布,以‘淨;= 201103697 喷嘴的喷嘴單元,且該噴嘴是一能夠線性地喷灑洗液 並且相對於研磨布垂直地喷灑洗液的直筒型喷嘴 (straight nozzle)。 在ό亥裝置中’ 5亥喷嘴單元可包括複數個喷嘴。 該裝置可進一步包含有一用於將該喷嘴單元移 至該研磨盤上的單元。 接著,用於洗淨研磨布的方法是使用於一研磨設 備中,在該研磨設備中一工作部件被壓至接附於一研 磨盤上的研磨布,且該工作部件隨著將漿體供給至研 磨布而相對於研磨盤相對地移動以研磨該工作部 件,該用於洗淨研磨布的方法包含有將高壓洗液從一 喷嘴單元的一噴嘴喷往該研磨布,以洗淨研磨布的步 驟,該喷嘴是一個直筒型喷嘴,且該直筒型喷嘴線性 地喷灑洗液,並且相對於研磨布垂直地喷灑洗液。 在該方法中,研磨布所承受的洗液壓力可近乎等 於或大於當研磨工作部件之時,被施加至工 研磨負載。 的 舉例來說,研磨布所承受的洗液壓力是 gf/cm2 〇 在該方法中,研磨布 Ί因王要材料可以是發泡 聚胺甲酸酉旨 以法中’當洗淨研磨布之時’該嘴嘴單元可 上二者攸直筒型喷嘴將洗液噴出而移動至該研磨盤 201103697 在本發明中’藉由採用直筒型喷嘴,可以增加該 研磨布所承受的洗液壓力,以使得研磨布中的沉積 物,例如磨屑,能夠充分地被移除。因此,可以高度 也預防工作部件的表面損傷’並且可以增進研磨準確 度另外,可以增進研磨效率,縮短研磨時間,並且 延長研磨布的壽命。 本發明之目的以及優點將透過申請專利範圍中 所特別指出的元件以及組合而被實施並達成。 g要了解的是,上述一般說明以及下列的詳細說明 疋例示性的且未意欲限制所請求的本發明。 【實施方式】 現在將參照隨附圖式詳細地說明本發明的 具體例。 第1圖是一顯示一研磨設備1〇的 意圖。 土 π 不 鏟斗Α 一水平面孩 二:,14是由-個已知的媒動機構(未顯示), J如馬達,所轉動。研磨布16,1主 泡聚胺甲酸酯所Μ占去枝 ' I # # 7C由發 面。甲夂曰所構成者,接附於該研磨盤12的一頂 個研麻1卞守媸晶片,被維持名 磨頭18的一底面上。各個研磨頭18是藉由_ °的驅動機構(未顯示),例如馬it,而與一轉軸 201103697 一起被轉動。各個研磨 β μ 構,例如汽缸單元=二…一個垂直驅動機 平疋,而被垂直地移動。 一聚體供給嘴嘴24,錢體供給至該研磨布16 的一頂面。 :工作部件2〇是藉由適當的方法,例如水的表 、吸力而維持在各個研磨頭18的底面上。各 個研磨頭18向下孩私 Π下移動而以一預定壓力,例如150 gf/cm ’將該工作部杜%蔽s 1 9 nt ^ 牛〇壓至以水平面旋轉之研磨 ^ 、 1布16上。透過將研磨頭18與轉軸22 — 起方疋轉ji作部件2〇的底面可以受到研磨。聚體在 研磨工作部件20之時,連續地供給至該研磨布16的 頂面。 各種類型的研磨M A P 4 m W碩為已知的,因此研磨頭18的 1 員型並未受到限定。例如,如第2圖中所示,該等研 頭18可紅轉地被維持在—位在該研磨盤η的中央 =中間滾子26以及維持滾子28之間,該等維持滚 的各個可以在位於該研磨盤12以外的一外位 :姓以及一位於其一外緣上的内位置之間移動。各個 維持滾子28受到一可won 了以圍繞一軸30旋轉的擺臂32 所支承。 接著,第3圖是一示意圖,顯示一用於洗淨該 磨布16的裝置34的一具體例。 s亥洗淨裝置34是位在該研磨設備10的研磨盤 12旁邊。 201103697 一—升降台36是藉由一個已知機構,例如汽缸單 兀38,而被垂直地驅動。一可移動件 y 升』以移 彺與移離該研磨盤12者,設置在該升降台36上。嗜 可移動件4〇是藉由一個適當的已知機構(一移動單 兀)而被往復地移動。移動單元的結構未受到限定。 舉例來說,該可移動件40可以藉由一被馬達44=轉 動的滾珠螺桿42或一汽缸單元,其設置於該升降台 36者,而被往復地移動。 一官臂46,設置於該可移動件4〇。一噴嘴單元 设置於該臂46的一前端。藉由往復地移動該可移 件40,該喷嘴單元48可以在該研磨盤η上以徑 向方向被移動。 工 如第4圖中所示,一直筒型噴嘴5〇接附於該噴 卜48。該直筒型喷嘴5〇藉由一夾具52而垂直 :也二定於該嗔嘴單元48的一外殼54。該直筒型喷嘴 成夠將高壓洗液線性地嘴往研磨布16而沒有分散 並且相對於該研磨布16的頂面垂直地喷出洗液。 移動液是經由一撓性管%以及設置在該可 嘴Λ 4 6中的管5 8而提供至該直筒型喷 且6〇 η /m在該外殼54的—底面。該刷 該^的:出口’高虔洗液自其被喷往 氣此預防向壓洗液噴濺。 在上述實施例中,該 移動該喷嘴單元48,^移\早:°如上所述般線性地 《亥移動皁元也可以如第2圖 201103697 設置有譚喷嘴單元48的該臂46 中所示般往復地旋動 圍繞一軸47。 另外孩噴嘴單元48可具有複數個噴嘴5〇(未顯 示)。在本例中,例如,該等噴嘴5〇可以設置於並且 線性地排列於該臂46上。 該刷具60可以被忽略。另外,可以採用其他的 喷賤-預防工具。 洗淨研磨布16的步驟將連續地被說明。 ,當研磨該等工作部件2〇時,該可移動件40已向 後移動’且a亥嘴嘴單元48已体在―預備位置以不至 於打斷研磨該等工作部件2〇的過程。 在該等工作部件20被完全地研磨之後,開始洗 ’平該研磨布16的步驟^首先,該可移動件4〇移至該 研磨盤12上,且該喷嘴單元48隨著將高壓洗液從直 筒型喷嘴50喷往該研磨布16,而在該研磨布16上 徑向地往復移動了一為研磨盤12半徑的長度。該研 磨盤12被旋動。藉此作用,可以洗淨該研磨布16的 整個表面。 藉由所示具體例的洗淨裝置34來執行一實驗。 該直筒型噴嘴50相對於該研磨布16的表面垂直地喷 灑洗液。洗液的喷灑角度為〇度,亦即,洗液是近乎 線性地喷往該研磨布16而沒有散開。從直筒型噴嘴 50所喷出的洗液壓力為13 MPa,且其數量為i β/min。該噴嘴5〇的出口的一内徑為大約4 mm,而 201103697 研磨布16所承受的洗液壓力為270 gf/cm2。要注音 的是’當研磨”工作部件2G冑,—預定負載,二 如大約150gf/cm2,從該等工作部件2〇施加至該研 磨布16。 該直筒型噴嘴50與該研磨布16之間的距離為大 約100 =m。然而,該直筒型噴嘴5〇近乎線性地噴灌 洗液,這樣該研磨布16所承受的壓力就不會受到其 間的距離所影響。即便距離改變達±20mm,該研磨布 16所承受的壓力是近乎恆定的。因此,該直筒型噴 嘴50與該研磨布16之間的距離無需嚴格地被規定。 另外,亦執行一個比較實驗。一個普通的噴嘴相 對於研磨布的表面垂直地喷灑洗液。洗液的喷灑角度 為25度以洗淨研磨布。從喷嘴所喷出的洗液壓力為 13 MPa,且其數量與上述實驗一樣為1 β/χηίη。喷嘴 的出口的内徑為大約4 mm,且研磨布所承受的洗液 壓力為大約80 gf/cm2。當研磨該等工作部件時,一 預定負載’例如大約150 gf/Cm2 ’從工作部件施加至 該研磨布。 普通喷嘴與研磨布之間的距離與上述實驗一樣 為大約100 mm。 依據在具體例的洗淨裝置34中所執行的實驗, 該研磨布16所承受的壓力可以透過使用該直筒型喷 嘴50而增加。藉由增加該壓力,其主要材料為發泡 聚胺甲酸酯的研磨布16中的沉積物,例如削屑,可 201103697 二適當地被移除’纟比較例中,工作部件的表面受 =,另一方面,在藉由具體例的裝置34所執行的實 轭例中,沉積物可以適當地被移除,以使得在工作部 件20的研磨表面中的損傷可以高度地被減低。在具 體例的裝置34中,損傷的發生率為比較例的大約J 半(1/2)。因此,可以增加研磨精度。研磨效率(研磨 時間)可以增進約10%。處理研磨布16的頻率可以由 每3批1次減低至每10批2次。因此,可以延長研 磨布16的壽命。 藉由採用該直筒型噴嘴50,即使該喷嘴5〇與該 研磨布16之間的距離改變,該研磨布16所承受的壓 力近乎為恆定的。因此,可以忽略微調它們之間的距 離。 要注意的是,藉由採用該直筒型噴嘴5〇,噴麗 洗液的區域是小的,這樣需要長時間來清洗該研磨布 16的整個表面。然而,若該研磨布16的表面有2〇0/〇 或更少者未被洗淨,工作部件20的研磨表面具有足 夠的品質。 若該研磨布16所承受的壓力較大,清潔力會增 加。然而,若該壓力過大,該研磨布16將會損壞。 當研磨該等工作部件20時,由該工作部件2〇施加至 該研磨布16的壓力為150-300 gf/cm2。該研磨布16 所承受的壓力可能略大於該壓力。舉例來說,該研磨 布16所承受的適當壓力為150—350 gf/cm2。 201103697 在上述具體例中,該研磨設備是—種單側研磨設 備,但是本發明的洗淨襄置能夠洗淨一個雙側研磨設 備的研磨布。 此處所述的全部實施例以及條件語言意欲用於 教學而協助讀者理解發明人所提供的發明以及概念 並且推廣該技藝,而被理解為既未對特別引述之實施 例以及條件,亦未對在說明書中與本發明的優勢以及 劣勢的呈現有關之實施例的條理有所限定。雖然本發 明的具體例已被詳細地說明,要被理解的是,各種不 同的變化、置換以及改變可以被做出而不背離本發明 的精神與範疇。 201103697 【圖式簡單說明】 第1圖是一研磨設備的一示意圖; 第2圖是一研磨頭的另一實施例的一示意圖; 第3圖是一清潔裝置的一示意圖;以及 第4圖是一喷嘴單元的一示意圖。 【主要元件符號說明】 10 : 磨光設備 12 :研磨盤 14 : 轉軸 16 :研磨布 18 : 研磨頭 20 :工作部件 22 : 轉軸 24’:喷嘴 26 : 中間滾子 28 :維持滾子 30 : 軸 32 :擺臂 34 : 洗淨裝置 36 :升降台 38 : 汽缸單元 40 :可移動件 42 : 滾珠螺桿 44 :馬達 46 : 管臂 47 :轴 48 : 噴嘴單元 50 :直筒型喷嘴 52 : 夾具 54 :外殼 56 : 撓性管 58 :管 60 :刷具</ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The entire contents of the application are incorporated herein by reference. The present invention relates to a device for cleaning a polishing cloth and a method. [Prior Art] A working component, such as a semiconductor wafer, is ground in a grinding apparatus by pressing a working component to a polishing cloth attached to a grinding disk; moving the grinding disk relative to the working part And feeding the slurry to the abrasive cloth while grinding the working part. Incidentally, if the abrasive cloth is used for a long time, different kinds of &quot;hoardings, such as abrasi〇n dust, a slurry, and a reaction product, are gradually deposited in the abrasive cloth. Deposits will cause certain problems, such as reduced grinding efficiency, and damage to working parts. Therefore, high-pressure washing water is periodically sprayed onto the polishing cloth to wash the polishing cloth. The type of ".. first cleaning device" is disclosed in Japanese Laid-Open Patent Publication No. P7-9340A. The conventional device will spray a high pressure (about 50 kg/cm2) of washing liquid from the nozzle to the polishing cloth so that the deposit in the polishing cloth floats and is removed. It should be noted that the spray 201103697 mouth can be enclosed by the brush to avoid high pressure washing liquid money. However, in the conventional apparatus described above, deposits such as abrasive chips in the abrasive cloth cannot be sufficiently removed, and the desired grinding efficiency cannot be obtained. Since the obliquely sprayed high pressure wash is spread out in a fan-like manner, the deposit cannot be sufficiently removed. The inventors believe that the washing liquid per unit area of the abrasive cloth is small, so this problem cannot be sufficiently solved. Today, the abrasive cloth is mainly composed of foamed polyurethane. Compared with a polishing cloth composed of a non-woven fabric, it is difficult to remove the sinking from the non-woven fabric composed of the foamed polyurethane by the spray washing liquid. SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide A device for washing the mortar/cloth and a washing liquid pressure of the square t', from the grinding = grinding cloth to the heart grinding efficiency. Steady removal of deposits and enhancement; for this purpose, for cleaning and grinding in a grinding device, -j·-1 is placed in the middle of the preparation, in the grinding device and attached to a grinding The disc is smeared by m Λ +. The 卩 piece is supplied to the polishing cloth and cloth by the pulverizing body, and the working part follows the net = the working part. The two parts for cleaning the polishing cloth can wash the high pressure Grinding cloth, with a 'net; = 201103697 nozzle nozzle unit, and the nozzle is a straight nozzle that can spray the liquid linearly and spray the liquid vertically with respect to the polishing cloth. In the όHai device, the '5 hai nozzle unit may include a plurality of nozzles. The apparatus can further include a unit for moving the nozzle unit to the grinding disc. Next, the method for washing the abrasive cloth is used in a grinding apparatus in which a working part is pressed to a polishing cloth attached to a grinding disc, and the working part is supplied with the slurry Moving to the polishing pad relative to the polishing disk to grind the working member, the method for cleaning the polishing cloth comprises spraying a high pressure washing liquid from a nozzle of a nozzle unit to the polishing cloth to wash the polishing cloth In the step, the nozzle is a straight type nozzle, and the straight type nozzle sprays the washing liquid linearly, and sprays the washing liquid vertically with respect to the polishing cloth. In this method, the abrasive cloth is subjected to a wash liquid pressure that is approximately equal to or greater than that applied to the abrasive load when the working component is being ground. For example, the pressure of the washing liquid to which the abrasive cloth is subjected is gf/cm2. In this method, the material of the abrasive cloth may be a foamed polyurethane, and the time is when the abrasive cloth is washed. 'The mouthpiece unit can be sprayed on the straight nozzle to move the washing liquid to the grinding disc 201103697. In the present invention, by using a straight nozzle, the pressure of the washing liquid to which the abrasive cloth is subjected can be increased, so that Deposits in the abrasive cloth, such as wear debris, can be sufficiently removed. Therefore, the surface damage of the working member can be highly prevented and the grinding accuracy can be improved. In addition, the polishing efficiency can be improved, the polishing time can be shortened, and the life of the polishing cloth can be prolonged. The object and advantages of the invention will be realized and attained by the <RTIgt; It is to be understood that the above general description and the following detailed description are illustrative and not intended to limit the claimed invention. [Embodiment] A specific example of the present invention will now be described in detail with reference to the accompanying drawings. Fig. 1 is an illustration showing the intention of a polishing apparatus. Soil π No shovel Α A horizontal plane child 2:, 14 is rotated by a known medium mechanism (not shown), J such as a motor. The polishing cloth 16, 1 main bubble polyurethane, occupies the branch 'I # # 7C from the surface. The armor of the nail is attached to a top of the grinding disc 12 and is held on a bottom surface of the name grinding head 18. Each of the polishing heads 18 is rotated by a drive mechanism (not shown), such as a horse, with a shaft 201103697. Each of the grinding β μ structures, such as the cylinder unit = two... a vertical drive machine, is moved vertically. A polymer is supplied to the nozzle 24, and the body is supplied to a top surface of the polishing cloth 16. The working member 2 is held on the bottom surface of each of the polishing heads 18 by a suitable method such as a table of water and suction. Each of the polishing heads 18 moves downwardly and downwardly to a predetermined pressure, for example, 150 gf/cm ', and the working portion is covered with s 1 9 nt ^ burdock to the grinding surface 1 and 1 cloth 16 which are rotated in a horizontal plane. . By grinding the polishing head 18 and the rotating shaft 22 as the bottom surface of the member 2, it can be ground. The polymer is continuously supplied to the top surface of the polishing cloth 16 while the working member 20 is being polished. Various types of grinding M A P 4 m W are known, and thus the type of the grinding head 18 is not limited. For example, as shown in Fig. 2, the grinding heads 18 can be maintained red-shifted between the center of the grinding disc η = the intermediate roller 26 and the maintenance roller 28, each of which maintains the roller It is possible to move between an outer position located outside the grinding disc 12: a last name and an inner position on an outer edge thereof. Each of the sustain rollers 28 is supported by a swing arm 32 that can be rotated about a shaft 30. Next, Fig. 3 is a schematic view showing a specific example of a means 34 for washing the rubbing cloth 16. The s-washing device 34 is located beside the grinding disc 12 of the grinding apparatus 10. 201103697 I—The lift table 36 is driven vertically by a known mechanism, such as a cylinder unit 38. A movable member y is lifted and moved away from the grinding disc 12, and is disposed on the lifting table 36. The movable member 4 is reciprocally moved by a suitable known mechanism (a moving single cymbal). The structure of the mobile unit is not limited. For example, the movable member 40 can be reciprocally moved by a ball screw 42 or a cylinder unit that is rotated by the motor 44, which is disposed on the lift table 36. An official arm 46 is disposed on the movable member 4''. A nozzle unit is disposed at a front end of the arm 46. By reciprocally moving the movable member 40, the nozzle unit 48 can be moved in the radial direction on the grinding disc n. As shown in Fig. 4, the continuous nozzle 5 is attached to the nozzle 48. The straight nozzle 5 is perpendicular to a clamp 52: it is also defined by a casing 54 of the nozzle unit 48. The straight nozzle is such that the high pressure washing liquid is linearly fed to the polishing cloth 16 without being dispersed, and the washing liquid is sprayed perpendicularly to the top surface of the polishing cloth 16. The moving liquid is supplied to the straight type spray and 6 〇 η /m on the bottom surface of the outer casing 54 via a flexible tube % and a tube 58 provided in the nozzle 246. The brush: the outlet 'sorghum lotion is sprayed to the gas to prevent splashing of the pressure washing liquid. In the above embodiment, the movement of the nozzle unit 48, the shifting is early: the linear movement of the soap element as described above may also be as shown in the arm 46 of the Tan nozzle unit 48 as shown in Fig. 2, 201103697. Rotating around a shaft 47 in a reciprocating manner. In addition, the child nozzle unit 48 can have a plurality of nozzles 5 (not shown). In this example, for example, the nozzles 5A may be disposed and linearly arranged on the arm 46. The brush 60 can be ignored. In addition, other sneeze-preventive tools can be used. The step of washing the abrasive cloth 16 will be continuously described. When the working members 2 are ground, the movable member 40 has moved rearwardly and the a-mouth nozzle unit 48 has been in the "preparation position" so as not to interrupt the process of grinding the working members 2''. After the working members 20 are completely ground, the step of washing the flat cloth 16 is started. First, the movable member 4 is moved onto the grinding disk 12, and the nozzle unit 48 is accompanied by a high pressure washing liquid. The straight nozzle 50 is sprayed onto the polishing cloth 16, and a length of the radius of the grinding disk 12 is radially reciprocated on the polishing cloth 16. The grinding disc 12 is rotated. By this action, the entire surface of the abrasive cloth 16 can be washed. An experiment was performed by the cleaning device 34 of the specific example shown. The straight nozzle 50 sprays the washing liquid perpendicularly to the surface of the polishing cloth 16. The spray angle of the wash liquid is the twist, that is, the wash liquid is sprayed almost linearly to the abrasive cloth 16 without being spread. The washing liquid pressure ejected from the straight nozzle 50 is 13 MPa, and the number thereof is i β / min. The inner diameter of the outlet of the nozzle 5 is about 4 mm, and the 201103697 abrasive cloth 16 is subjected to a washing pressure of 270 gf/cm2. To be phonetic is the 'when grinding' working part 2G, a predetermined load, such as about 150 gf/cm2, applied from the working parts 2 to the polishing cloth 16. Between the straight nozzle 50 and the polishing cloth 16 The distance is about 100 = m. However, the straight nozzle 5 喷 sprays the washing liquid almost linearly, so that the pressure of the abrasive cloth 16 is not affected by the distance therebetween. Even if the distance changes by ± 20 mm, The pressure applied to the abrasive cloth 16 is nearly constant. Therefore, the distance between the straight nozzle 50 and the polishing cloth 16 need not be strictly defined. In addition, a comparative experiment is also performed. A common nozzle is opposed to the grinding. The surface of the cloth was sprayed vertically. The washing liquid was sprayed at an angle of 25 degrees to wash the abrasive cloth. The pressure of the washing liquid sprayed from the nozzle was 13 MPa, and the amount was 1 β/χηίη as in the above experiment. The inner diameter of the outlet of the nozzle is about 4 mm, and the pressure of the washing cloth is about 80 gf/cm 2 . When grinding the working parts, a predetermined load 'for example, about 150 gf / Cm 2 ' from the working part Applied to The distance between the ordinary nozzle and the polishing cloth is about 100 mm as in the above experiment. According to the experiment performed in the cleaning device 34 of the specific example, the pressure of the polishing cloth 16 can be transmitted through the straight type. The nozzle 50 is increased. By increasing the pressure, the main material is a deposit in the abrasive cloth 16 of the foamed polyurethane, such as shavings, which can be appropriately removed in 201103697. The surface of the component is subjected to =, and on the other hand, in the example of the yoke performed by the device 34 of the specific example, the deposit can be appropriately removed so that the damage in the abrasive surface of the working member 20 can be highly In the apparatus 34 of the specific example, the incidence of damage is about J half (1/2) of the comparative example. Therefore, the polishing accuracy can be increased. The polishing efficiency (polishing time) can be increased by about 10%. The frequency of 16 can be reduced from once every 3 batches to 2 times every 10 batches. Therefore, the life of the polishing cloth 16 can be extended. By using the straight type nozzle 50, even between the nozzle 5〇 and the polishing cloth 16 distance The pressure applied to the abrasive cloth 16 is almost constant. Therefore, the distance between them can be neglected. It is noted that by using the straight nozzle 5, the area of the spray liquid is small. This requires a long time to clean the entire surface of the abrasive cloth 16. However, if the surface of the abrasive cloth 16 has 2 〇 0 / 〇 or less and is not washed, the abrasive surface of the working member 20 has sufficient quality. If the pressure applied to the abrasive cloth 16 is large, the cleaning force will increase. However, if the pressure is too large, the polishing cloth 16 will be damaged. When the working members 20 are ground, the working member 2 is applied to the polishing member 16 The pressure of the abrasive cloth 16 is 150-300 gf/cm2. The pressure on the abrasive cloth 16 may be slightly greater than the pressure. For example, the abrasive cloth 16 is subjected to a suitable pressure of 150-350 gf/cm2. 201103697 In the above specific example, the polishing apparatus is a one-side polishing apparatus, but the cleaning apparatus of the present invention is capable of washing a polishing cloth of a double-side polishing apparatus. All of the embodiments and conditional language described herein are intended to be used in teaching to assist the reader in understanding the inventions and concepts provided by the inventors and to promote the art, and are not to be construed as an The organization of the embodiments relating to the advantages and disadvantages of the present invention in the specification is limited. While the specific embodiments of the invention have been described in detail, it is understood that various changes, modifications and changes can be made without departing from the spirit and scope of the invention. 201103697 [Simplified illustration of the drawings] Fig. 1 is a schematic view of a polishing apparatus; Fig. 2 is a schematic view showing another embodiment of a polishing head; Fig. 3 is a schematic view of a cleaning device; and Fig. 4 is a view A schematic view of a nozzle unit. [Explanation of main component symbols] 10 : Polishing equipment 12 : Grinding disc 14 : Rotating shaft 16 : Grinding cloth 18 : Grinding head 20 : Working part 22 : Rotating shaft 24 ': Nozzle 26 : Intermediate roller 28 : Maintaining roller 30 : Shaft 32: swing arm 34: cleaning device 36: lifting platform 38: cylinder unit 40: movable member 42: ball screw 44: motor 46: pipe arm 47: shaft 48: nozzle unit 50: straight nozzle 52: clamp 54: Housing 56: flexible tube 58: tube 60: brush

Claims (1)

201103697 七、申請專利範圍: 1. 一種研磨布之洗淨裝置,其被使用在一研磨設備 中,於該研磨設備中,一工作部件被壓至而接附 於一研磨盤的研磨布上,且該工作部件隨著將漿 體供給至研磨布而對著該研磨盤作相對地移動以 研磨該工作部件: 其包含有: 一具有一能夠將高壓洗液喷往該研磨布,以 洗淨s亥研磨布之喷嘴的噴嘴單元; 其中該喷嘴是一能夠線性地噴灑該洗液並且 相對於該研磨布垂直地喷灑該洗液的直筒型噴 嘴。 、 2. 如申請專利範圍帛i項的裝置,纟中該噴嘴單元 包括複數個喷嘴。 3. 如申請專利範圍第2項的裝置,其進一步包含有 一用於將該噴嘴單元移至該研磨盤上的單元。 4. 如申請專利範圍第2項的裝置,其進一步包含有 一用於將該喷嘴單元移至該研磨盤上的單元。 5. —種用於洗淨研磨布的方法,該研磨布被使用在 一研磨設備中,於該研磨設備中一工作部件被壓 f而接附於一研磨盤的研磨布上且該工作部件隨 者將漿體供給至研磨布而對著該研磨盤作相對地 移動以研磨該工作部件。 15 201103697 其包含有下列步驟: 將高壓洗液從一噴嘴單元的一嗔嘴嗔往該奸 磨布’以洗淨該研磨布; 其中該噴嘴是一直筒型噴嘴;以及 該直筒型喷嘴線性地噴灑該洗液,且相對於 該研磨布垂直地噴灑該洗液。 6. 如申晴專利範圍第5項的方法,其中該研磨布所 承受的洗液壓力是近乎相同或大於當研磨該工作 部件時施加至該工作部件的研磨負載。 7. 如申5月專利範圍帛5項的.方法,纟中該研磨布所 承受的洗液壓力為15〇_35()gf/cm2。 8·如申請專利範圍第6項的方法,其中該研磨布所 承受的洗液壓力為15〇_35〇gf/cm2。 9.如申s月專利範圍第5項的方法,其中該研磨帑的 一主要材料是發泡聚胺甲酸酯。 10.如申請專利範圍第5項的方法,其中當洗淨該斫 布 夺。亥噴嘴單元隨著從該直筒型喷嘴將洗 液噴出而移動至該研磨盤上。201103697 VII. Patent application scope: 1. A cleaning device for a polishing cloth, which is used in a grinding device, in which a working member is pressed to be attached to a polishing cloth of a grinding disc, And the working part moves relative to the grinding disc to grind the working part as the slurry is supplied to the polishing cloth: it comprises: a spray capable of spraying a high-pressure washing liquid onto the polishing cloth for washing a nozzle unit of a nozzle of a shovel cloth; wherein the nozzle is a straight type nozzle capable of linearly spraying the washing liquid and spraying the washing liquid perpendicularly to the polishing cloth. 2. If the device of claim 帛i is applied, the nozzle unit includes a plurality of nozzles. 3. The device of claim 2, further comprising a unit for moving the nozzle unit to the grinding disc. 4. The device of claim 2, further comprising a unit for moving the nozzle unit to the grinding disc. 5. A method for washing a polishing cloth, which is used in a grinding apparatus in which a working part is pressed and attached to a polishing cloth of a grinding disc and the working part The slurry is then supplied to the polishing cloth and moved relative to the polishing disk to grind the working member. 15 201103697 It comprises the steps of: blasting a high pressure washing liquid from a nozzle of a nozzle unit to the smear cloth to wash the polishing cloth; wherein the nozzle is a continuous barrel nozzle; and the straight nozzle is linearly The lotion is sprayed and the lotion is sprayed vertically relative to the cloth. 6. The method of claim 5, wherein the abrasive cloth is subjected to a washing fluid pressure that is substantially the same or greater than a grinding load applied to the working component when the working component is ground. 7. For the method of applying the May patent scope 帛5, the washing liquid pressure of the abrasive cloth is 15〇_35()gf/cm2. 8. The method of claim 6, wherein the abrasive cloth is subjected to a washing liquid pressure of 15 〇 35 〇 gf/cm 2 . 9. The method of claim 5, wherein a primary material of the abrasive crucible is a foamed polyurethane. 10. The method of claim 5, wherein the cleaning is performed. The Hai nozzle unit moves onto the grinding disc as it ejects the washing liquid from the straight nozzle.
TW099107177A 2009-03-27 2010-03-12 Equipment and method for cleaning polishing cloth TW201103697A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009079630A JP2010228058A (en) 2009-03-27 2009-03-27 Polishing cloth cleaning apparatus and cleaning method

Publications (1)

Publication Number Publication Date
TW201103697A true TW201103697A (en) 2011-02-01

Family

ID=42245563

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099107177A TW201103697A (en) 2009-03-27 2010-03-12 Equipment and method for cleaning polishing cloth

Country Status (6)

Country Link
US (1) US20100248597A1 (en)
EP (1) EP2236245A3 (en)
JP (1) JP2010228058A (en)
KR (1) KR20100108254A (en)
CN (1) CN101844328A (en)
TW (1) TW201103697A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615589B (en) * 2012-04-12 2014-09-24 浙江金瑞泓科技股份有限公司 Polishing system and polishing method using polishing disk guide disc
AU2013262754A1 (en) * 2012-05-18 2014-12-11 Venmill Industries Device, methods and systems for restoring optical discs
US9754622B2 (en) 2014-03-07 2017-09-05 Venmill Industries Incorporated Methods for optimizing friction between a pad and a disc in an optical disc restoration device
US9620166B2 (en) 2012-05-18 2017-04-11 Venmill Industries Methods for restoring optical discs
JP6146375B2 (en) * 2014-06-12 2017-06-14 信越半導体株式会社 Polishing pad cleaning method and wafer polishing method
JP2017121672A (en) 2016-01-05 2017-07-13 不二越機械工業株式会社 Method for polishing workpiece and method for dressing polishing pad
US10096460B2 (en) 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
JP6304349B1 (en) * 2016-11-15 2018-04-04 株式会社Sumco Wafer edge polishing apparatus and method
JP7218731B2 (en) * 2020-01-09 2023-02-07 信越半導体株式会社 Cleaning equipment for lapping equipment
CN111482901B (en) * 2020-04-30 2022-08-26 青岛华芯晶电科技有限公司 Cleaning device of chemical mechanical polishing equipment
CN114183472B (en) * 2021-12-13 2024-11-05 中冶焦耐(大连)工程技术有限公司 A bearing sealing structure with a built-in hanging oil retaining device

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622069B2 (en) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 Dressing equipment for polishing cloth
US5674115A (en) * 1994-07-06 1997-10-07 Sony Corporation Apparatus for grinding a master disc
JPH09309063A (en) * 1996-05-24 1997-12-02 Nippon Steel Corp Polishing plate cleaning method and apparatus
US5868608A (en) * 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
JP3722591B2 (en) * 1997-05-30 2005-11-30 株式会社日立製作所 Polishing equipment
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5945346A (en) * 1997-11-03 1999-08-31 Motorola, Inc. Chemical mechanical planarization system and method therefor
EP1095734B1 (en) * 1997-12-26 2009-10-07 Ebara Corporation Polishing machine
JP3615931B2 (en) * 1998-03-26 2005-02-02 株式会社荏原製作所 Polishing apparatus and conditioning method in the polishing apparatus
JP3031345B2 (en) * 1998-08-18 2000-04-10 日本電気株式会社 Polishing apparatus and polishing method
US6319098B1 (en) * 1998-11-13 2001-11-20 Applied Materials, Inc. Method of post CMP defect stability improvement
US6220936B1 (en) * 1998-12-07 2001-04-24 Chartered Semiconductor Manufacturing Ltd. In-site roller dresser
US6135863A (en) * 1999-04-20 2000-10-24 Memc Electronic Materials, Inc. Method of conditioning wafer polishing pads
JP2001212750A (en) * 1999-11-25 2001-08-07 Fujikoshi Mach Corp Polishing machine cleaning equipment and polishing machine
JP2001237204A (en) * 2000-02-22 2001-08-31 Hitachi Ltd Method for manufacturing semiconductor device
JP2001237208A (en) * 2000-02-24 2001-08-31 Ebara Corp Cleaning method of cleaning surface of polishing device and cleaning device
US6669538B2 (en) * 2000-02-24 2003-12-30 Applied Materials Inc Pad cleaning for a CMP system
JP2002144218A (en) * 2000-11-09 2002-05-21 Ebara Corp Polishing device
US6554688B2 (en) * 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US20020187731A1 (en) * 2001-06-07 2002-12-12 Taiwan Semiconductor Manufacturing Co., Ltd. In-situ pad and wafer cleaning during chemical mechanical polishing
JP2004536717A (en) * 2001-08-02 2004-12-09 アプライド マテリアルズ インコーポレイテッド Multiport polishing fluid delivery system
JP2003127063A (en) * 2001-10-22 2003-05-08 Sony Corp Cmp device and polishing method by cmp device
DE10261465B4 (en) * 2002-12-31 2013-03-21 Advanced Micro Devices, Inc. Arrangement for chemical mechanical polishing with an improved conditioning tool
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US20050260936A1 (en) * 2004-05-21 2005-11-24 Rodriguez Jose O Dynamic atomizer on conditioner assemblies using high velocity water
CN101386149B (en) * 2007-09-12 2011-01-26 K.C.科技股份有限公司 Cleaning device for chemical mechanical polishing device
US7674156B2 (en) * 2007-10-08 2010-03-09 K.C. Tech Co., Ltd Cleaning device for chemical mechanical polishing equipment

Also Published As

Publication number Publication date
CN101844328A (en) 2010-09-29
KR20100108254A (en) 2010-10-06
EP2236245A3 (en) 2013-09-11
US20100248597A1 (en) 2010-09-30
EP2236245A2 (en) 2010-10-06
JP2010228058A (en) 2010-10-14

Similar Documents

Publication Publication Date Title
TW201103697A (en) Equipment and method for cleaning polishing cloth
JP2622069B2 (en) Dressing equipment for polishing cloth
JP5574597B2 (en) Method and apparatus for injection of CMP slurry
US11980997B2 (en) Dressing apparatus and polishing apparatus
CN111055172B (en) Cylindrical grinding machine
TW201200299A (en) Method and apparatus for dressing polishing pad
JP2015202545A (en) Grinding equipment
TW201713460A (en) Grinding device to maintain the grinding force of a grinding wheel when grinding a wafer by using a grinding device injecting cleaning water propagating ultrasonic wave to clean the grinding wheel
JP2008272902A (en) Apparatus and method for cleaning grinding head in cmp apparatus
JPH0310769A (en) Dressing device for polishing cloth
JPH0555267B2 (en)
JP2001237204A (en) Method for manufacturing semiconductor device
TW201238712A (en) Polishing method of glass plate
JPH10244458A (en) Dressing device for polishing pad
JP2005271101A (en) Dressing device of polishing pad and polishing apparatus having the dressing device of polishing pad
JP2005217037A (en) Conditioning method of polishing pad for semiconductor wafer
JP6189032B2 (en) Grinding method of ceramic substrate with silver penetrating electrode
JPH10256199A (en) Cleaning device for adsorption support surface
JP2008142851A (en) Polishing cloth conditioning equipment
JP2008311382A (en) Washing method for porous ceramic-made chuck
US20060121837A1 (en) Dressing method for polishing pad
JP2006218553A (en) Polishing pad dressing method
JP2002355759A (en) Wafer polishing equipment
JP4642183B2 (en) Wafer polishing equipment
JP2000246635A (en) Whetstone regeneration method and device