201103417 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤其涉及一種對電 子元件散熱的散熱裝置及其散熱方法。 【先前技術】 隨著電子資訊業不斷發展，電子元件（尤為中 央處理器）運行頻率和速度在不斷提升。由於高頻 高速將使電子元件產生的熱量隨之增多，使得其溫 度不斷升高，嚴重威脅著電子元件運行時的性能， 為確保電子元件能正常運作，必須及時排出電子元 件所產生的大量熱量，各種結構的散熱裝置亦因此 不斷地被設計出來。 ^知政熱裝置一般包括一吸熱板、一熱管及一 散熱器。言亥吸熱板貼設於電子元件的上纟面，該熱 管一端接合於吸熱板上，另一端結合於散熱器，從 而組裝成散熱裝置，該電子元件產生的熱量通過該 吸熱板吸收後傳導至熱管，再進—步通過散熱器散 發出去。 然而，上述散熱裝置中熱管與電子元件之間通 過吸熱板連接，熱阻較大，不能充分發揮熱管快速 導熱的性能，在熱負荷較大時往往達不到所需散熱 效果。 【發明内容】 201103417 、散熱性能 有鑒於此，有必要提供一種熱阻小 好的散熱裝置及其散熱方法。 戶 一種散熱裝置，包括一基板、至少一熱管及一 散熱鰭片組，該熱管包括一蒸發段及一冷凝段，該 基板的下表面上設有收容該熱管的蒸發段的溝槽， 該散熱鰭片組與熱管的冷凝段相結合，該熱管的蒸 發段具有一用於與一發熱電子元件接觸的平面，該 • 平面上設有一固態的錫膏層，該錫膏層的外表面與 該基板的下表面在同一平面上。 種散熱方法，包括如下步驟：提供一基板， 於該基板的下表面上設置溝槽；提供一散熱鰭片 組，將該散熱鰭片組設置在該基板的上表面上，·提 供至少一熱管，該熱管包括一蒸發段及一冷凝段， 该熱管的蒸發段具有一平面，將熱管的冷凝段結合 絲錢4組上，將歸的蒸發段設置㈣基板^ ’ 溝槽中，並使該熱管的蒸發段的平面外露；在該外 露的平面上設有-固態的錫膏層’使該錫膏層的外 表面與該基板的下表面在同—平面上；及在該锡膏 層與熱源之間塗佈一層導熱膏’並令該基板與 接觸。 與習知技術相比，上述散熱展置的熱管的蒸發 奴與熱源傳導接觸，能更加快速有效的吸收執量， 能充分發揮熱管快速導熱的性能，同時該熱㈣蒸 201103417 發段具有與熱源接觸的平面，該平面上設有一錫膏 層，能較精確的保證蒸發段的平面與基板的下表面 之間的平面度。 【實施方式】 下面參照附圖結合實施例對本發明作進一步說 明。 °201103417 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component and a heat dissipating method thereof. [Prior Art] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processor) are constantly increasing. Due to the high frequency and high speed, the heat generated by the electronic components will increase, which causes the temperature to rise continuously, which seriously threatens the performance of the electronic components during operation. To ensure the normal operation of the electronic components, it is necessary to discharge a large amount of heat generated by the electronic components in time. Therefore, various types of heat sinks have been continuously designed. The thermal device generally includes a heat absorbing plate, a heat pipe and a heat sink. The heat sink is attached to the upper surface of the electronic component. The heat pipe is coupled to the heat sink at one end and coupled to the heat sink at the other end to be assembled into a heat sink. The heat generated by the electronic component is absorbed by the heat sink and transmitted to the heat sink. Heat pipe, and then step forward through the radiator. However, in the above heat dissipating device, the heat pipe and the electronic component are connected through the heat absorbing plate, and the heat resistance is large, and the heat conduction performance of the heat pipe cannot be fully utilized, and the heat dissipation effect is often not obtained when the heat load is large. SUMMARY OF THE INVENTION 201103417, heat dissipation performance In view of this, it is necessary to provide a heat sink with a small heat resistance and a heat dissipation method thereof. A heat dissipating device includes a substrate, at least one heat pipe and a heat dissipating fin set, the heat pipe includes an evaporation section and a condensation section, and the lower surface of the substrate is provided with a groove for receiving an evaporation section of the heat pipe, the heat dissipation The fin group is combined with a condensation section of the heat pipe, the evaporation section of the heat pipe has a plane for contacting a heat-generating electronic component, and the surface is provided with a solid solder paste layer, and the outer surface of the solder paste layer The lower surfaces of the substrates are on the same plane. The heat dissipation method includes the following steps: providing a substrate, providing a groove on a lower surface of the substrate; providing a heat dissipation fin set, disposing the heat dissipation fin group on an upper surface of the substrate, and providing at least one heat pipe The heat pipe comprises an evaporation section and a condensation section, the evaporation section of the heat pipe has a plane, the condensation section of the heat pipe is combined with the wire money group 4, and the evaporation section to be returned is set in the (4) substrate ^' groove, and the a flat surface of the evaporation section of the heat pipe; a solid solder paste layer is disposed on the exposed surface such that an outer surface of the solder paste layer is on the same plane as a lower surface of the substrate; and in the solder paste layer A layer of thermal paste is applied between the heat sources and the substrate is brought into contact with. Compared with the conventional technology, the evaporation slave of the heat-dissipating heat pipe is in contact with the heat source, and can absorb the amount more quickly and effectively, and can fully exert the rapid heat conduction performance of the heat pipe, and the heat (4) steaming 201103417 has a heat source and a heat source. The plane of contact, which is provided with a solder paste layer, can more accurately ensure the flatness between the plane of the evaporation section and the lower surface of the substrate. [Embodiment] Hereinafter, the present invention will be further described with reference to the accompanying drawings. °
如圖1及圖2所示，該散熱裝置包括一基板10、 一散熱鰭片組20及四根熱管3〇。 4基板1G呈方形板狀，其具有—平整的上表面 12及一與該上表面12相對的下表面14。該下表面 14上並排設有四個相互平行的橫直溝槽16。所述四 個橫直溝槽〗6的橫截面均呈半圓弧形，其包括位於 基板财間的兩個第—溝槽⑽及分職於該兩第 一溝槽160兩側的兩第二溝槽162。所述第一及第 二溝槽160、162分別延伸貫穿該基板10的左右兩 側，該基板1()的右_應該兩第-溝槽⑽的末端 開設-矩形的第一缺口 17，該第一缺口 17的寬度 與該兩個第一溝槽160的整體寬度相同。該基板10 的左側分別對應該兩第二溝槽162的末端開設兩矩 形的第二缺口 18，每-第二缺口 18的寬度與每一 第二溝槽162的寬度相同。 該散熱鰭片組20貼設在該基板10的上表面12 上。該散熱鰭片、组20包括由複數較長散熱韓片210 201103417 排列而成的一方形的本體2卜及分別位於該本體2ι 左右兩側由複數較短散熱鰭片22〇排列.而成的第一 及第二凸台22、23。所述複數較長散熱鰭片21〇與 所述複數較短散熱鰭片220相互平行間隔設置。”As shown in FIG. 1 and FIG. 2, the heat sink includes a substrate 10, a heat sink fin set 20, and four heat pipes 3〇. The substrate 1G has a square plate shape having a flat upper surface 12 and a lower surface 14 opposite to the upper surface 12. The lower surface 14 is provided with four mutually parallel horizontal grooves 16 side by side. The four transverse grooves 6 have a semi-circular cross section, and include two first grooves (10) located in the substrate and two second grooves on both sides of the first grooves 160. Slot 162. The first and second trenches 160 and 162 extend through the left and right sides of the substrate 10, respectively, and the right end of the substrate 1() should open a rectangular first notch 17 at the end of the two first-grooves (10). The width of the first notch 17 is the same as the overall width of the two first grooves 160. The left side of the substrate 10 defines a second rectangular second notch 18 corresponding to the ends of the two second grooves 162, and the width of each of the second notches 18 is the same as the width of each of the second grooves 162. The heat dissipation fin group 20 is attached to the upper surface 12 of the substrate 10. The heat dissipating fins and the group 20 comprise a square body 2 and a plurality of heat dissipating fins 210 201103417 arranged on the left and right sides of the main body 2 ι. First and second bosses 22, 23. The plurality of longer heat dissipation fins 21 and the plurality of shorter heat dissipation fins 220 are disposed in parallel with each other. ”
i放”，、，，，，曰片组20的頂端於左右兩側的位置處設 有貫穿s亥散熱鰭片組20的兩圓形的第一通孔。 該第二凸台23上對應該兩第一通孔24的位置分別 開設有兩“u”形的第—凹槽25。該兩第—凹槽^ 的頂端分別與該兩第-通孔24抓連通，對應由兩第 -通孔24的位置處向下且呈相互靠近的趨勢 至貫穿該第二凸台23的底面，並於該第二凸台23 的底面上形成兩第一開σ 26。所述兩第一開口％ 相互平行且相互間隔，其於散熱鰭片組20的底面所 形成的整體形狀及大小與該基板1〇上的第二缺口 其Τ及大小對應，以在該散熱韓片組20組裝 上時該第-缺σ17與該第—凹槽㈣ 別設有兩圓形的第二通孔27 …刀 應該兩第二通孔27的位置分別=凸'22上對 货一 罝刀別開設有兩“U”形的 弟一凹槽28。該兩第二凹槽2 % - m , 的頂知为別與該兩 ==7相連通，對應由該兩第二通 置向下且呈相互靠近的方向延伸至貫穿該第一凸台 201103417 22的底面，並於該第一凸台22的底面上形成兩第 二開口 29。所述兩第二開口 29的形狀及大小分別 :該基板ίο上的兩第二缺口 18的形狀及大小對 -:在該散熱鰭片組2〇組裝在該基板ι〇上時該 缺口 18分別與該兩第二凹槽28對應連通。i, ",", the top end of the cymbal group 20 is provided with two circular first through holes penetrating through the swell fin group 20 at the positions on the left and right sides. The second boss 23 is opposite The two first through holes 24 are respectively provided with two "u" shaped first grooves 25. The top ends of the two first grooves are respectively connected with the two first through holes 24, corresponding to the two - The positions of the through holes 24 are downward and are close to each other to the bottom surface of the second boss 23, and two first openings σ 26 are formed on the bottom surface of the second boss 23. The two first openings % are parallel to each other and spaced apart from each other, and the overall shape and size of the bottom surface of the heat dissipation fin group 20 correspond to the size and size of the second gap on the substrate 1 to be assembled when the heat dissipation Korean package 20 is assembled. The first-negative σ17 and the first-groove (four) are provided with two circular second through holes 27...the positions of the two second through-holes 27 are respectively convex=22 on the opposite side of the tool a "U" shaped brother-shaped groove 28. The top of the two second grooves 2% - m, is not connected to the two ==7, corresponding to the two second throughs down and in phase The second opening 29 is formed on the bottom surface of the first boss 22, and the second opening 29 is formed in the bottom surface of the first boss 22. The shape and size of the two openings 29 are respectively: The shape and size of the two second notches 18 are: - the notches 18 are respectively in communication with the two second grooves 28 when the heat dissipation fin sets 2 are assembled on the substrate.
Α所述四根熱管30均呈U形，其管體採用導熱性 能較，的金屬如鋼製成。請同時參閲圖3,所述四 根熱管3〇包括位於中間的兩第-熱管32及分別設 於該兩第熱管32兩側的兩第二熱管34。每一第 二熱管32包括收容於該基板.10的第一溝槽160内 一第一蒸發段320、穿設於該散熱鰭片組2〇的第一 通孔24内的一第一冷凝段322、及連接於該第一蒸 ，段32〇與第一冷凝段322之間且收容於該第二凸 ♦台23的第一凹槽25内的一第一連接段324。每一 第一熱菅34包括收容於該基板1〇的第二溝槽162 内一第二蒸發段34〇、穿設於該散熱鰭片組2〇的第 二通孔27内的一第二冷凝段342、及連接於該第二 蒸發段340與第二冷凝段342之間且收容於該第一 凸台22的第二凹槽28内的一第二連接段344。所 述第一蒸發段320與第二蒸發段340的形狀相同， 均包括一與該基板1〇的第一及第二溝槽160、162 的内表面相匹配的弧狀面326及與該弧狀面326相 對的一平面328。各蒸發段320、340的橫截面呈半 圓形’其高度略小於該溝槽160、162的深度。 201103417 所述熱管30的蒸發段32()、謂收容在該溝槽 160 162内’其弧狀面326分別與溝槽16〇、162 的内表面相貼設，平面328與該基板1()的下表面 門形成向度大致為mm-0.3mm的間隔。然 後，分別於所述熱管3〇的孤狀面326與對應溝槽 160 162的内表面之間的間隙内及其平面與基 板1〇的下表面14之間的間隔填設-錫膏層40,以 將所述熱官30與基板1〇之間焊接連接，連接之後 該錫貧層40呈固態、。該平面328上的錫膏層4〇通 過銑削使其外表面與該基板1〇的下表面14在同一 平面上，所述錫膏層40於該基板10的下表面14的 中央形成與熱源接觸的熱傳導係數較高的吸熱 區。使用時，發熱電子元件貼設於該吸熱區並^ 發熱電子70件的表面與該錫膏層4〇之間再塗佈一 層導，膏、，該發熱電子元件產生的熱量一方面通過 導熱膏傳導至錫膏層40,再通過錫膏層4〇傳導至 熱管30的蒸發段32〇、34〇吸收，再將熱量傳導至 熱管30的冷凝段322、342,熱管3〇的冷凝段^厂 342進一步通過散熱鰭片組2〇將熱量散發到周圍環 境中，該發熱電子元件產生的熱量另一方面通過導 熱膏傳導至基板10,並由基板10傳導至散熱鰭片 組20，通過散熱鰭片組2〇散發至周圍環境中。該 锡膏層40的設置可以填補熱管3〇與基板1〇之間由 於加工公差的問題所形成的平整度的誤差。設士十 201103417 時，將熱管30的蒸發段32〇、340的橫截面的高度 設置成略小於該溝槽160、162的深度，通過錫膏層 40來填補二者間的高度差，再通過銑削使錫膏層40 與基板10的下表面14在同一平面上，能較精確的 保證蒸發段320、340的平面328與基板1〇的下表 面14之間的平面度。The four heat pipes 30 are U-shaped, and the pipe body is made of a metal such as steel having thermal conductivity. Referring to FIG. 3, the four heat pipes 3〇 include two first heat pipes 32 in the middle and two second heat pipes 34 respectively disposed on two sides of the two heat pipes 32. Each of the second heat pipes 32 includes a first evaporation section 320 received in the first trench 160 of the substrate 110, and a first condensation section disposed in the first through hole 24 of the heat dissipation fin group 2〇. 322, and a first connecting portion 324 connected to the first steaming portion, between the segment 32〇 and the first condensation portion 322, and received in the first groove 25 of the second convex portion 23. Each of the first heat sinks 34 includes a second evaporation section 34〇 received in the second trench 162 of the substrate 1 , and a second through the second through hole 27 of the heat dissipation fin set 2〇. a condensing section 342 and a second connecting section 344 connected between the second evaporating section 340 and the second condensing section 342 and received in the second recess 28 of the first boss 22. The first evaporation section 320 and the second evaporation section 340 have the same shape, and each includes an arc surface 326 matching the inner surfaces of the first and second grooves 160, 162 of the substrate 1 and the arc A plane 328 opposite the face 326. The cross-section of each of the evaporation sections 320, 340 is semi-circular 'having a height slightly smaller than the depth of the grooves 160, 162. 201103417 The evaporation section 32() of the heat pipe 30, that is, contained in the groove 160 162, has its arcuate surface 326 attached to the inner surfaces of the grooves 16〇, 162, respectively, and the plane 328 and the substrate 1() The lower surface door forms an interval of a dimension of approximately mm-0.3 mm. Then, the solder paste layer 40 is filled in the gap between the isolated surface 326 of the heat pipe 3 与 and the inner surface of the corresponding groove 160 162 and the space between the plane and the lower surface 14 of the substrate 1 分别. The solder joint 30 is soldered to the substrate 1 , and the tin lean layer 40 is solid after being connected. The solder paste layer 4 on the plane 328 is milled such that its outer surface is in the same plane as the lower surface 14 of the substrate 1 , and the solder paste layer 40 is in contact with the heat source at the center of the lower surface 14 of the substrate 10 . The endothermic zone with a higher thermal conductivity. In use, the heat-generating electronic component is attached to the heat absorbing zone and a layer of conductive paste is applied between the surface of the heat-generating electronic component 70 and the solder paste layer 4, and the heat generated by the heat-generating electronic component passes through the thermal conductive paste. Conducted to the solder paste layer 40, and then transferred to the evaporation sections 32〇, 34〇 of the heat pipe 30 through the solder paste layer 4, and then transferred to the condensation sections 322 and 342 of the heat pipe 30, and the condensation section of the heat pipe 3〇 The 342 further dissipates heat to the surrounding environment through the heat dissipating fin group 2, and the heat generated by the heat generating electronic component is conducted to the substrate 10 through the thermal conductive paste on the other hand, and is conducted by the substrate 10 to the heat dissipating fin group 20 through the heat dissipating fin The film group 2 is distributed to the surrounding environment. The solder paste layer 40 is disposed to fill the flatness error between the heat pipe 3's and the substrate 1's due to processing tolerances. At shishishi 201103417, the height of the cross section of the evaporation sections 32〇, 340 of the heat pipe 30 is set to be slightly smaller than the depth of the grooves 160, 162, and the height difference between the two is filled by the solder paste layer 40, and then passed. Milling allows the solder paste layer 40 to be on the same plane as the lower surface 14 of the substrate 10 to more accurately ensure the flatness between the plane 328 of the evaporation sections 320, 340 and the lower surface 14 of the substrate 1 turns.
該散熱裝置中的熱管30至少為一根，其數目可 隨熱負荷而增加或減少，相應的基板10的溝槽 160、162及散熱鰭片組2〇上通孔24、27的數量與 熱管30的數量一致即可。 綜上所述，本發明符合發明專利之要件，爰依 法提出專利申請。惟以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1為本發明一較佳實施例散熱裝置的立體分 解圖。 圖2為圖1倒置的立體分解圖。 圖3為圖2的立體組裝圖。 圖4為圖3所示散熱裝置的散熱方法的流程圖。 【主要元件符號說明】 上表面 12 基板 1〇 下表面 14 缺口 16、17、18 201103417 散熱結片組 20 本體 21 凸台 22 ' 23 通孔 24、27 凹槽 25 ' 28 開口 26、29 熱管 30、32、34錫膏層 40 溝槽 160、162 散熱韓片 210 ' 220 蒸發段 320、340 冷凝段 322、342 連接段 324、344 弧狀面 326 平面 328The heat pipe 30 has at least one heat pipe 30, the number of which can be increased or decreased with the heat load, and the number of the through holes 24, 27 of the corresponding grooves 10 and 162 of the substrate 10 and the heat dissipation fin group 2 and the heat pipe The number of 30 is the same. In summary, the present invention complies with the requirements of the invention patent and submits a patent application in accordance with the law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of a heat sink according to a preferred embodiment of the present invention. Figure 2 is an exploded perspective view of Figure 1 inverted. Figure 3 is an assembled, isometric view of Figure 2; 4 is a flow chart of a heat dissipation method of the heat dissipation device shown in FIG. [Main component symbol description] Upper surface 12 Substrate 1 〇 Lower surface 14 Notch 16, 17, 18 201103417 Thermal slab group 20 Body 21 Boss 22 ' 23 Through holes 24, 27 Groove 25 ' 28 Opening 26, 29 Heat pipe 30 32, 34 solder paste layer 40 trench 160, 162 heat sink Korean 210 '220 evaporation section 320, 340 condensation section 322, 342 connecting section 324, 344 arc surface 326 plane 328