201103199 六 發明說明： 【發明所屬之技術領域】 本發明係有關於一種模組連接 特別是指-種用以收容模塊且組連接器組合’ 組連接器及模組連接器組合兔一峨塊達成電性連接的模 【先前技術】 習知的模組連接器，如2〇〇5年3 口 利申請號聰_靡.3(中華二= 構造，使整個沉板式模組連接接”沉板式的 的厂子f，或疋在印刷電路板上的高度得以有效地降低。板 上時板式模組連器安裝在印刷電路板 路杯卜真七裳求中，我們並不希望安裝在印刷電 種大旦生：的連接器凸出印刷電路板的下表面，例如在一 同種r連續排列多 組件，如果^電路板的上表面及下表面上加工及安展零 表面的沉1==^ 板的下表_制， 時’會造成之後印刷電路 程的阻礙。礙’例如會造成利用網板印刷錫膏製 201103199 矣而ίΐί陰陽板製程之外，如果在印刷電路板的上、下 2都需要安料組件的製財，如果把會凸出印刷電路 =沉板式模紐連接器放在最後才組裝，是可以避 電：板的？的但是’另外—種情況是’如果想要在印刷 板的上、下表面都需要分別安裝—個會凸出印刷電路 面的"L·板式模組連接II時，也會產生以上所述的問 喊0 踗在上述的製程需求中，並不希望安裳在印刷電 ®的·連接器凸出印刷電路板的下表面，所以 1代的設計是使沉板式模組連接器不要凸出印刷電路板另 -：，例如第一圖至第三圖所示的另一種習知的沉板式模 、接器1 a，其女裝於印刷電路板4 〇 a上，用以收容 一模塊3 0 a ’該模組連接器i a包括—連接器本體丄〇 a及-蓋體2〇a，連接器本體1〇a包括一絕緣本體工 1 a、多數個導電端子12a、及—遮蔽殼體i3a，該 些導電端子1 2 a組裝於該絕緣本體i i a内，遮蔽殼體 1 3 a包覆於該絕緣本體丄1 a外側。蓋體2 q a覆設於 該模塊3 0 a與連接器本體丄〇 a的上方。 該模組連接器1 3的下表面1 1 1 a係延伸至印刷電 路板4 0 a的開孔4 2 a中，而具有沉板的絲，且其下 表面1 1 1 a不會超過印刷電路板4 〇 a的下表面4工 a ;雖然這種構造已經能夠使整個模組連接器i a的高度 可以至多減少了印刷電路板4 〇 a的厚度，但是在印刷電 路板4 0 a板上的高度ηi a卻無法有效地降低。 201103199 特別是，如果印刷電路板4〇a 別安裝一個模组連接η w，請參閱第nr需要分 就無法減低這種組合的整體厚度H5a了。這時 緣是，本發明人有感上述問題之 並配合學理之運用，1切h 又吾’乃潛心研究 問題之本發明 喊出—種設計合理且有效改善上述 【發明内容】 本發明之主要目的，在於提供一種 連接器組合，其在焊接製程中不會凸出印刷及模組 :敕:且可降低模組連接器的整體高度，而且在二 板完成後’可有效降低模組連接器在印刷電路板 為達上述之目的，本發明係提供一種模 括：一第一連接器，其包含一 一 、 ° 匕 μ , 緣本體及多數個第 ^知子，该第-絕緣本體具有_第—下表面、多數個 =繞成一第一組裝空間的第一側壁、及連通該第—喊命 間且上、下相對的一上開口與一下開口，該些電ς 子固定在該第一絕緣本體的第一側壁上，每—第电二 子具有-延伸出該第一絕緣本體外的焊接部、及 = 該第-組裝空間内的第一接觸部；以及一第二 ，豆 包含有-第二絕緣本體及多數個第二導電端子，該:: =體具有-第二下表面、多數個圍繞成—第二組裝空： 一勺弟二側壁、及-連通該第二組裝空間的上開口，該 了導電端子固定在該第二絕緣本體的第二側壁上，^二 二導電端子具有-延伸出該第二絕緣本體外的橋接部、及 201103199 、:凸：入該第二組裝空間内的第二接觸部，·其 連接β的第二絕緣本體由該第一絕緣本體的上"- 一：且裝空間内，且該第二絕緣本體的第二;表面且 该第一絕緣本體的下開口凸出該第 ^ = 子的第一接觸:橋接部分別接觸該些第-導電端 本=另提供一種模組連接器組合，包括··一第一連 ^匕含有—第—絕緣本體及多數個帛—ff端子， 對=及連通該第-咖… 上開口與一下開口’該些第一導電端 一絕緣本體的第一側壁上，每一第一 ^ 出該第—絕緣本體外的焊接部、及一凸伸：：第有二： =的第-接觸部;-第二連接器，其 =多f固第二導電端子，該第二絕緣本體具有:第ί m势夕數個圍繞成一第二組裝空間的第二側壁、及-連通该第二組裝空_上開σ，該些第二導 該第二絕緣本體的第二側壁上，每一 口疋在 第二絕緣本體外的橋接部、及= :接觸部;-模塊，其設有多數個與該些第 的電接觸塾;以及一印刷電路板，其 面及，下ί表面及一下表面’該印刷電路板在該上表 第之間設有一開孔;其中，該第-連接器以該 印刷雷if 開口對應該印刷電路板的開孔安裝在該 _電路板上，該第-連接器的各第一導電端子的焊接部 201103199 分別焊接在該印刷電路板上，該 路板的上表面且其第一矣^ 連接器凸出該印刷電 面，該第二連接器的第二絕緣該印刷電路板的下表 開口組裝人該第-㈣空 體由料—絕緣本體的上 下表面穿過該第-絕““二該f二絕緣本體的第二 孔而凸出該印刷電路板的下且表^口與該印刷電路板的開 接部分別接觸該些第—導電端=些第二導電端子的橋 該第二連接器的第二絕緣本體的上開口 === 的各個電接觸塾分別接觸該些“電端 在下有益效果：本發明的模組連接器除了 :明模組連接器的整體組裝後接二= 接器在印刷電路板板上的高度。m降低騎組連 為=更進—步瞭解本發明為達成既定 圖式，相信本發日狀㈣ίΓ關本發明之詳細說明、 入且且r之瞭解卩而4寺试與特點’當可由此得一深 用，；^瞭解’然而所附圖式與附件僅提供參考與說明 並非用來對本發明加以限制者。 /、 【實施方式】 :青t閱第五圖所示，本發明係提供一種模 广且f接器組合’該模組連接器組合包括該模組 1、一印刷電路板3 0、及一模塊5〇。 益 201103199 H 組連接器工在構造上為兩件式的設計，包 及一第二連接器2〇。請配合參閱 第/、圖至第九圖所示，第一連接器2 〇包含 本多數個第一導電端子12、及一遮蔽殼體13 i其中该第—絕緣本體11係以絕緣材料製成，具有一第 一下表面111及多數個第—側壁i i 2，該些第一側壁 1 1。2圍繞成-第一組裝空間i i 3，用以收容該第二連 妾器2 0第一絕緣本體1 1在第一組裝空間1 1 3的上 、下端相對的設有一上開口1 14與-下開口工丄5，上 開口 1 1 4與下開口1 1 5係分別連通於第—組裝空間1 1 3。每一第一側壁1 1 2設有收容該些第一導電端子工 2的多數個第-端子槽i i 6。此外，該些第—側壁工1 2中的二相對第一側壁1 1 2外表面凹設有多數卡扣槽工 17第一絕緣本體1 1在二相鄰的第一側壁1 1 2連接 處内側設有-定位槽工工8 ’定位槽工工8係延伸至該第 一絕緣本體11的上表面。 每一第一導電端子i 2係以導電性的金屬材料製成， 具有一第一固定部121 ,第一固定部i 2丄一端彎折延 伸一焊接部1 2 2，焊接部1 2 2延伸出該第一絕緣本體 1 1外。第一固定部1 21另一端彎折延伸一具有彈性的 第一接觸部1 2 3，第一接觸部1 2 3係側向地凸伸入該 第一組裝空間1 1 3内。第一導電端子1 2的第一固定部 1 2 1係干涉固定於對應的第一端子槽1 16中，使該些 第一導電端子1 2固定在該第一絕緣本體1 1的第一側壁 1 1 2上。 201103199 遮蔽殼體1 3係以金屬材料製成，為一中空的框架结 構，遮敝殼體1 3具有多數個側板丄3丄，該些側板 對：板131分別往内彎折形成有；數個卡扣 ” 2 ’該些側板1 3工中的另二相對侧板工3丄分別 设有夕數個卡孔1 3 3。遮蔽殼體i 3的卡扣片i 3 ，扣於該第-絕緣本體i丄的卡扣槽丄丄7，從而使遮蔽 殼體1 3包覆於該第一絕緣本體1 1外側。201103199 Sixth Invention: Technical Field of the Invention The present invention relates to a module connection, in particular, to a module for housing a module and a combination of a combination of a connector and a module connector. Electrically connected modules [Prior Art] Conventional module connectors, such as 2〇〇5年三口利application No. Cong_靡.3 (Chinese 2 = construction, the entire sinking module is connected) The height of the factory f, or the 疋 on the printed circuit board, can be effectively reduced. The on-board slab module connector is installed in the printed circuit board, and we do not want to install it in the printed circuit. Dadansheng: The connector protrudes from the lower surface of the printed circuit board, for example, a plurality of components are continuously arranged in the same kind of r, if the upper surface and the lower surface of the circuit board are processed and the surface of the zero surface is sunken 1==^ The following table _ system, when 'will cause obstacles after printing electric distance. Obstruction' will cause the use of screen printing solder paste system 201103199 矣 and ΐ 阴 yin and yang board process, if on the printed circuit board upper and lower 2 Need to install components If you put the protruding printed circuit = the sinking type of the die connector is assembled at the end, you can avoid the electricity: the board? But 'other - the situation is 'if you want to be on the upper and lower surfaces of the printed board When you need to separately install a "L·Plate Module Connection II that will protrude from the printed circuit surface, it will also produce the above-mentioned question 0. In the above process requirements, you don’t want Anshang in Printed® The connector protrudes from the lower surface of the printed circuit board, so the first generation design is such that the sinker module connector does not protrude from the printed circuit board - another, for example, the first figure to the third figure The sinking type die and connector 1 a is worn on the printed circuit board 4 〇a for accommodating a module 30 a 'the module connector ia includes a connector body 丄〇 a and a cover body 2〇a, the connector body 1A includes an insulative body 1a, a plurality of conductive terminals 12a, and a shielding case i3a. The conductive terminals 12a are assembled in the insulative housing iia, shielding the housing 1 3 a is wrapped around the outer side of the insulating body 丄 1 a. The cover 2 qa is applied to the module 3 0 a Above the connector body 丄〇a. The lower surface 1 1 1 a of the module connector 13 extends into the opening 4 2 a of the printed circuit board 40 a, and has a sinking wire and under it The surface 1 1 1 a does not exceed the lower surface 4 of the printed circuit board 4 〇a; although this configuration has enabled the height of the entire module connector ia to at most reduce the thickness of the printed circuit board 4 〇a, The height ηi a on the printed circuit board 40 a board cannot be effectively reduced. 201103199 In particular, if the printed circuit board 4〇a is not equipped with a module connection η w, please refer to the nr need to divide it can not reduce this The overall thickness of the combination is H5a. At this time, the inventor of the present invention is aware of the above problems and cooperates with the application of the theory, and the invention of the present invention is a reasonable design and effective improvement of the above [invention] The main purpose of the present invention The invention provides a connector assembly which does not protrude from the printing and the module during the soldering process: 敕: and can reduce the overall height of the module connector, and after the completion of the second board, the module connector can be effectively reduced. The printed circuit board provides the above-mentioned purpose. The present invention provides a first connector, comprising: a first, a 匕μ, a rim body and a plurality of tensors, the first-insulating body having _- a lower surface, a plurality of first sidewalls that are wound into a first assembly space, and an upper opening and a lower opening that communicate with the first and lower opposite sides, the electrical insulators are fixed to the first insulating body On the first side wall, each of the second electric sub-sections has a solder portion extending outside the first insulating body, and a first contact portion in the first assembly space; and a second, the bean includes a second insulation Ontology a plurality of second conductive terminals, the:: = body having a second lower surface, a plurality of surrounding - a second assembly space: a scoop two sidewalls, and - an upper opening communicating with the second assembly space, the conductive The terminal is fixed on the second sidewall of the second insulative housing, and the second and second conductive terminals have a bridge extending from the outside of the second insulative body, and a spring contact: 201103199: a second contact into the second assembly space a second insulating body whose connection β is from the upper portion of the first insulative body and in the space, and the second surface of the second insulative body and the lower opening of the first insulative body The first contact of the ^^ sub-section: the bridge portion contacts the first-conducting end respectively. The other provides a modular connector assembly, including a first connection, a first-insulating body, and a plurality of帛-ff terminal, pair = and connected to the first coffee - upper opening and lower opening 'the first conductive end of the first side wall of the insulating body, each of the first first insulating body of the first insulating body And a protrusion:: the second: = the first contact; - the second connection The second insulative second conductive body has: a second sidewall that surrounds a second assembly space, and - connects the second assembly air_upper opening σ, The second side wall of the second insulative housing has a bridge portion between the outer portion of the second insulating body and a contact portion; a module having a plurality of electrical contacts with the plurality And a printed circuit board having a surface and a lower surface and a lower surface. The printed circuit board is provided with an opening between the upper surface of the upper surface; wherein the first connector corresponds to the printed lightning if opening The opening of the circuit board is mounted on the _ circuit board, and the soldering portions 201103199 of the first conductive terminals of the first connector are respectively soldered on the printed circuit board, and the upper surface of the circuit board and the first 连接^ connection thereof Extending the printed electrical surface, the second connector is insulated from the lower surface of the printed circuit board, and the first (four) hollow body is passed through the first and second surfaces of the insulating body through the first - "two" The second hole of the f-insulating body protrudes from the lower surface of the printed circuit board The opening portions of the printed circuit board respectively contact the bridges of the first conductive terminals = some of the second conductive terminals, and the respective electrical contacts of the upper opening of the second insulating body of the second connector === respectively contact the " The utility model has the following advantages: the module connector of the present invention is connected to the height of the connector board on the printed circuit board board except for the integral assembly of the module connector. m lowering the riding group connection = more advanced - step to understand the present invention in order to achieve the established schema, I believe that the present day (four) Γ Γ 本 本 本 本 本 本 本 本 本 详细 详细 详细 详细 详细 详细 详细 详细 详细 详细 详细 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 It is to be understood that the invention is not limited by the scope of the invention. /, [Embodiment]: As shown in the fifth figure, the present invention provides a modular and f-connector assembly. The modular connector assembly includes the module 1, a printed circuit board 30, and a Module 5〇. Yi 201103199 Group H connector is constructed in a two-piece design with a second connector. Referring to FIGS. 2 and 9 , the first connector 2 includes the plurality of first conductive terminals 12 and a shielding case 13 i , wherein the first insulating body 11 is made of an insulating material. Having a first lower surface 111 and a plurality of first side walls ii 2, the first side walls 1 1 . 2 surround the first assembly space ii 3 for receiving the second splicer 20 first insulation The upper body 1 1 is opposite to the upper and lower ends of the first assembly space 1 1 3 and is provided with an upper opening 1 14 and a lower opening workpiece 5, and the upper opening 1 1 4 and the lower opening 1 1 5 are respectively connected to the first assembly space. 1 1 3. Each of the first side walls 112 is provided with a plurality of first terminal slots i i 6 for receiving the first conductive terminals 2 . In addition, two of the first side wall members 1 2 are recessed with respect to the outer surface of the first side wall 1 1 2 with a plurality of snap grooves 17 and the first insulating body 1 1 is at the junction of the two adjacent first side walls 1 1 2 The inner side is provided with a positioning groove worker 8 'the positioning groove worker 8 is extended to the upper surface of the first insulative housing 11. Each of the first conductive terminals i 2 is made of a conductive metal material, and has a first fixing portion 121 . The first fixing portion i 2 弯 is bent at one end and extends to a welded portion 1 2 2 , and the welded portion 12 2 extends. Out of the first insulating body 1 1 . The other end of the first fixing portion 1 21 is bent to extend a first contact portion 1 2 3 having elasticity, and the first contact portion 1 2 3 protrudes laterally into the first assembly space 1 1 3 . The first fixing portion 1 2 1 of the first conductive terminal 12 is interference-fixed in the corresponding first terminal slot 116, and the first conductive terminals 12 are fixed to the first sidewall of the first insulating body 11. 1 1 2 on. 201103199 The shielding housing 13 is made of a metal material and is a hollow frame structure. The concealing housing 13 has a plurality of side plates 3丄, and the side plate pairs: the plates 131 are respectively bent and formed inward; Each of the two side panels 1 3 of the side panels 1 3 is provided with a plurality of card holes 1 3 3 respectively. The latching piece i 3 of the shielding shell i 3 is fastened to the first The locking groove 7 of the insulating body i is covered so that the shielding case 13 is covered on the outside of the first insulating body 1 1 .
請配合參閱第十圖至第十一圖所示，第二連接器2 〇 包含有一第二絕緣本體2 1及多數個第二導電端子^ 2， 第二絕緣本體2 1係以絕緣材料製成，具有一第二下表面 2 1 1與多數個第一侧壁2 1 2，該些第二側壁2 1 2圍 繞成一第二組裝空間2 1 3 ’用以收容該模塊5 〇。第二 絕緣本體2 1在第二組裝空間2丄3的上端設有一上開口 214，上開口214係連通於該第二組裝空間2 1 3。 母一第一侧壁2 1 2設有多數個收容該些第二導電端子2 2的第二端子槽2 1 5。第二絕緣本體2 1在二相鄰的第 二侧壁2 1 2連接處外侧凸設有一定位塊2 1 6，定位塊 2 1 6係與該第一絕緣本體1 1的定位槽丄^ 8相對應， 而形成一種防呆的設計，以限制該第二連接器2 〇只能以 單一方向組裝入該第一連接器1 〇内。 每一第二導電端子2 2係以導電性的金屬材料製成， 具有一第二固定部2 2 1，第二固定部2 2 1—端彎折延 伸一橋接部2 2 2，橋接部2 2 2延伸出該第二絕緣本體 2 1外而且延伸在該第二絕緣本體2 1的外側壁面。第二 固定部2 2 1另一端彎折延伸一具有彈性的第二接觸部2 201103199 2 3，第一接觸部2 2 3側向地凸伸入該第二組裝空間2 1 3内。第二導電端子22的第二固定部22 1係干涉固 定於對應的第二端子槽2 1 5内，使該些第二導電端子2 2固定在該第二絕緣本體21上。 明參閱第五圖及第十五圖所示，模組連接器1可進一 步包括一罩設於該第一連接器1 〇與第二連接器2 〇上方 的蓋體40，蓋體4 0係以金屬材料製成，包含一頂板4 2、及多數個由該頂板4 2周緣往下彎折延伸的側板4工 ，頂板4 2中心位置設有一定位孔4 4，該些侧板4 1中 的二相對側板4 1内側分別往内凸設有二卡持塊4 3，各 卡持塊4 3係與該第一連接器1 〇的各卡孔丄3 3相對應 0 印刷電路板3 0具有一上表面31及一下表面32， s亥印刷電路板3 0在該上表面3 1及下表面3 2之間設有 一開孔3 3 (請配合參閱第六圖所示）。 模塊5 0在本貫施例中為一攝像模組，但不限定。模 塊5 0的底部具有一基板5 1，該基板5 的側緣設有多 數個電接觸墊5 2 (請配合參閱第五圖所示），該些電接 觸墊5 2係與該些第二導電端子2 2的第二接觸部2 2 3 (請配合參閱第十-圖所示）相對應；藉由上述之組成以 形成本發明之模組連接器組合。 組裝本發明之模組連接器組合時，請先參閱第五圖、 第六圖、及第九圖所示，第-連接器i Q以該第—絕緣本 體11的下開口115對應該印刷電路板3 q的開孔3 3 安裝在該印刷電路板3 Q上，第—連接器丄Q的各第一導 201103199 電端子1 2的焊接部1 2 2分別焊接在該印刷電路板3 〇 上，第一連接器1 0凸出該印刷電路板3 〇的上表面3工 且其第一下表面1 1 1不凸出該印刷電路板3 〇的下表面 3 2。 之後，在組裝該第一連接器i 〇與第二連接器2 〇以 組成該模組連接器1時，請配合參閱第十二圖至第十四圖 所不，第二連接器2 〇的第二絕緣本體2 i係由該第一絕 緣本體1 1的上開口1 1 4組裝入該第一組裝空間1 1 3 # (請配合參閱第七圖所示），且第二絕緣本體21的第二 下表面2 1 1穿過該第一絕緣本體1丄的下開口丄1 5與 印刷電路板3 0的開孔3 3而凸出該印刷電路板3 〇的下 表面3 2，意即苐二絕緣本體2 1的第二下表面2 1 1此 時係往下凸出該第一絕緣本體i i的第一下表面丄丄工。 3亥些第二導電端子2 2的橋接部2 2 2分別接觸該些第一 導電端子1 2的第一接觸部1 2 3。 組裝5亥模塊5 0時，請參閱第五圖、及第十五圖至第 • 十七圖所示，模塊5 0由該第二連接器2 0的第二絕緣本 體2 1的上開口 2 1 4組裝入該第二組裝空間2 1 3内， 模塊5 0的該些電接觸墊5 2分別侧向接觸於該些第二導 電端子2 2的第二接觸部2 2 3，以達成電性連接。最後 ，將該蓋體4 0罩設於該模塊5 0、第一連接器丄〇、及 第二連接器2 0的上方，並使該模塊5 〇顯露於該蓋體4 0的定位孔4 4中，該蓋體4 0的各卡持塊4 3對應卡扣 於§玄第一連接器1 〇的各卡孔1 3 3，以固定住該蓋體4 0 ’從而利用該蓋體4 〇的頂板4 2將電子模組丄3穩定 11 201103199 地壓制固持於該第一連接器1 〇與第二連接器2 〇内。 此外，必須進一步說明的是，在上述實施例的圖式中 ’係以板上型的第一連接器1 0為例說明，但不限定，第 一連接器1〇也可為沉板式的設計’意即第一連接器1〇 的第一下表面1 1 1係延伸至該印刷電路板3 〇的開孔3 3中’但第一下表面1 1 1同樣不會凸出該印刷電路板3 0的下表面3 2 (圖未示）。 另外’本發明並不限定該模塊5 〇的類型，上述實施 例中的模塊5 〇為一種側接觸式模塊5 〇，電接觸墊5 2 係設置在基板5 1侧緣，故該些第二導電端子2 2也設計 為側接觸式的類型。但還有一種下接觸式模塊5 〇，其電 接觸墊5 2係設置在基板5 1下表面（圖未示），當然， 本發明的該些第二導電端子2 2也可改為下接觸式的類型 ’而使第二導電端子2 2的第二接觸部2 2 3由該模塊5 0的下方往上接觸該些電接觸墊5 2，因此該模塊5 0與 第二導電端子22呈下接觸式的態樣，也同樣包含在本案 的範圍内。 是以’透過本發明之模組連接器及模組連接器組合， 具有如下述之特點及功能： 1、本發明的模組連接器1在組裝於印刷電路板3〇 的製程中，因只有先焊接第一連接器1 0，而第一連接器 1 0焊接於印刷電路板3 〇時不會凸出印刷電路板3 0下 表面3 2，所以不會造成之後印刷電路板3 〇的下表面3 2的製程阻礙。 12 201103199 2、本發明的模組連接器丨係在印刷電路板3 〇的焊 接製程結束後，才將該第二連接器2 〇組裝入該第一連接 器1 0内，以組成該模組連接，而且第二連接器2〇 的第二下表面211係凸出該印刷電路板3◦的下表面3 2 ’故第二連接器2 〇的第二下表面2工工至該印刷電路 板30的下表面32之間具有一高度H2 (請參閱第十四 圖所示），使得該模組連接器工形成一種沉板式設計，故 降低了該模組連接器工的整體高度H3 (因減少了印刷電 φ 路板3 0的厚度）。 ★ 3、本發明的模組連接器i為具有第—連接器丄〇與 第二連接器2◦的兩件式構造，且該第二連接器2 〇係另 行組裝入該第一連接器1 〇内，故可降低該模組連接器i 整體在印刷電路板30板上的高度HI(請配合參閱第十 、圖所示）即使在邊模塊5 0組裝入第二連接器2 〇内 $以5亥蓋體4 Q罩住後’所構成的模組連接器組合的板上 咼度Η 4也同樣得以降低。 _ 4、在该印刷電路板3 〇的上、下表面3丄、3 2都 需要分別安裝-個模組連接器工的應用情況下（請參閱第 十八圖所不），這種組合的整體厚度Η5也可以有效地減 低。 5本务明的第二連接器2 0係另行組裝入第一連接 器1 ◦内換5之’第二連接器2 〇是可替換的，故可料 由替換^不同的第二連接器2 〇，而達成改變該模組連接器 1相對該印刷電路板3 0之沉板深度的功能。 201103199 惟以上所述僅為本發明之較佳可行實施例，非因此即 侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式 内容所為之等效技術變化，均同理皆包含於本發明之範圍 内，合予陳明。 【圖式簡單說明】 第-圖係習知模組連接器、模塊與印刷電路㈣立體分解 圖0 第二圖係習知模組連接器的俯視圖。 第二圖係第二圖的3 — 3剖視圖。 個習知 第四圖係在印刷電路μ 松，」 板的下表面都分別安裝 模、，且連接器時的剖視圖。 :五=系本發明之模組連接器組合的立體分解圖。 第六圖係本發明之第-連接ϋ的立體分解圖。 圖 第七圖係本發明之第—連接料印刷f路板的立體組合 第八圖係本發明之第一 ^ FI ^ ^ X ^ 埂接态與印刷電路板的俯視圖 第九圖係第八圖的9-9剖視圖。 第十圖係本發明之笫_ 第十一圖係本發明=連立體分解圖。 第十 ^係本發連接器與印刷電純的立體組合 第一連接益的立體組合圖 第十三圖係本發明 第十四圖係第十三 第十五圖係本發明 模組連接器與印刷電路板的俯視圖。 圖的14-14剖視圖。 模、、且連接器組合的立體組合圖。 201103199 第十六圖係本發明之模組連接器組合的俯視圖。 第十七圖係第十六圖的1 7 — 1 7剖視圖。 第十八圖係在印刷電路板的上、下表面都分別安裝一個習 本發明之模組連接器時的剖視圖。 【主要元件符號說明】 〔習知〕 la 模組連接器 10a 連接器本體 • 11a 絕緣本體 111a 下表面 12a 導電端子 13a 遮蔽殼體 2 0a 蓋體 3 0a 模塊 4 0a 印刷電路板 41a 下表面 φ 4 2 a 開孔Referring to the tenth to eleventh drawings, the second connector 2 includes a second insulative housing 2 1 and a plurality of second conductive terminals 2, and the second insulative housing 2 1 is made of an insulating material. There is a second lower surface 2 1 1 and a plurality of first side walls 2 1 2 , and the second side walls 2 1 2 are surrounded by a second assembly space 2 1 3 ′ for receiving the module 5 〇. The second insulating body 2 1 is provided with an upper opening 214 at an upper end of the second assembly space 2丄3, and the upper opening 214 is connected to the second assembly space 2 13 . The first first sidewall 2 1 2 of the mother is provided with a plurality of second terminal slots 2 15 for accommodating the second conductive terminals 2 2 . The second insulative housing 2 1 has a positioning block 2 1 6 on the outer side of the second adjacent side wall 2 1 2 , and a positioning block 2 16 and a positioning slot of the first insulative housing 1 1 . Correspondingly, a foolproof design is formed to limit the second connector 2 to be assembled into the first connector 1 in a single direction. Each of the second conductive terminals 2 2 is made of a conductive metal material, and has a second fixing portion 2 2 1 , the second fixing portion 2 2 1 - the end is bent to extend a bridge portion 2 2 2 , and the bridge portion 2 2 2 extends outside the second insulative housing 2 1 and extends on an outer sidewall surface of the second insulative housing 21 . The other end of the second fixing portion 2 2 1 is bent and extended by a second contact portion 2 201103199 2 3 having elasticity. The first contact portion 2 2 3 protrudes laterally into the second assembly space 2 1 3 . The second fixing portion 22 1 of the second conductive terminal 22 is interference-fixed in the corresponding second terminal slot 2 15 , and the second conductive terminals 22 are fixed on the second insulating body 21 . As shown in FIG. 5 and FIG. 15 , the module connector 1 further includes a cover 40 that is disposed above the first connector 1 〇 and the second connector 2 , and the cover body 40 The utility model is made of a metal material, and comprises a top plate 4, and a plurality of side plates 4 extending downward from the periphery of the top plate 4, and a positioning hole 44 is disposed at a central position of the top plate 4 2, and the side plates 4 1 are Two latching blocks 43 are respectively protruded from the inner side of the opposite side plates 4 1 , and each of the latching blocks 43 is corresponding to each of the card holes 丄 3 3 of the first connector 1 0 0 printed circuit board 3 0 There is an upper surface 31 and a lower surface 32. The printed circuit board 30 has an opening 3 3 between the upper surface 3 1 and the lower surface 3 2 (please refer to the sixth figure). The module 50 is a camera module in the present embodiment, but is not limited. The bottom of the module 50 has a substrate 5 1. The side edge of the substrate 5 is provided with a plurality of electrical contact pads 52 (please refer to the fifth figure), and the electrical contact pads 52 are associated with the second The second contact portion 2 2 3 of the conductive terminal 22 (corresponding to the reference to the tenth-figure) corresponds to the composition of the module connector of the present invention. When assembling the modular connector assembly of the present invention, please refer to the fifth, sixth, and ninth drawings. The first connector i Q corresponds to the lower opening 115 of the first insulating body 11 to correspond to the printed circuit. The opening 3 3 of the board 3 q is mounted on the printed circuit board 3 Q, and the soldering portions 1 2 2 of the first terminals 201103199 of the first connector 丄Q are respectively soldered on the printed circuit board 3 The first connector 10 protrudes from the upper surface 3 of the printed circuit board 3 and its first lower surface 1 1 1 does not protrude from the lower surface 32 of the printed circuit board 3 . After that, when the first connector i 〇 and the second connector 2 组装 are assembled to form the module connector 1, please refer to the twelfth to fourteenth, and the second connector 2 〇 The second insulative housing 2 i is assembled from the upper opening 1 1 4 of the first insulative housing 1 1 into the first assembly space 1 1 3 # (please refer to the seventh figure), and the second insulative housing 21 The second lower surface 21 1 protrudes through the lower opening 丄 15 of the first insulative housing 1 and the opening 33 of the printed circuit board 30 to protrude the lower surface 3 2 of the printed circuit board 3 ,, that is, The second lower surface 2 1 1 of the second insulating body 2 1 is now protruded downward to project the first lower surface of the first insulating body ii. The bridging portions 2 2 2 of the second conductive terminals 2 2 respectively contact the first contact portions 1 2 3 of the first conductive terminals 12 . When assembling the 5H module 50, please refer to the fifth figure, and the fifteenth to the seventeenth, the module 50 is the upper opening 2 of the second insulative body 2 1 of the second connector 20 The plurality of electrical contact pads 52 of the module 50 are laterally contacted with the second contact portions 2 2 3 of the second conductive terminals 2 2 to achieve electrical power. Sexual connection. Finally, the cover body 40 is disposed over the module 50, the first connector 丄〇, and the second connector 20, and the module 5 〇 is exposed to the positioning hole 4 of the cover body 40. 4, each of the holding blocks 4 3 of the cover body 40 corresponds to each of the card holes 1 3 3 of the first connector 1 ,1 to fix the cover body 40 ′ to utilize the cover body 4 The top plate 4 2 of the crucible stabilizes the electronic module 丄3 11 201103199 and is pressed and held in the first connector 1 〇 and the second connector 2 。. In addition, it should be further explained that in the above-described embodiment, the first connector 10 of the upper type is described as an example, but not limited thereto, the first connector 1 can also be a sinker type design. 'meaning that the first lower surface 1 1 1 of the first connector 1 延伸 extends into the opening 3 3 of the printed circuit board 3 ' 'but the first lower surface 1 1 1 also does not protrude from the printed circuit board The lower surface of the 30 is 3 2 (not shown). In addition, the present invention does not limit the type of the module 5. The module 5 in the above embodiment is a side contact module 5 〇, and the electrical contact pads 5 2 are disposed on the side edge of the substrate 51, so the second The conductive terminal 22 is also designed in the form of a side contact type. However, there is also a lower contact module 5 〇, the electrical contact pads 52 are disposed on the lower surface of the substrate 51 (not shown), of course, the second conductive terminals 22 of the present invention may also be replaced by lower contacts. The second contact portion 2 2 3 of the second conductive terminal 2 2 contacts the electrical contact pads 52 from the lower side of the module 50, so that the module 50 and the second conductive terminal 22 are The following contact patterns are also included in the scope of this case. The combination of the module connector and the module connector of the present invention has the following features and functions: 1. The module connector 1 of the present invention is assembled in the process of the printed circuit board 3, because only The first connector 10 is soldered first, and the first connector 10 is soldered to the printed circuit board 3 〇 without protruding the lower surface 3 2 of the printed circuit board 30, so that the printed circuit board 3 is not subsequently lowered. The surface 3 2 process is hindered. 12 201103199 2. The module connector of the present invention is assembled into the first connector 10 to form the module after the soldering process of the printed circuit board 3 is completed. Connecting, and the second lower surface 211 of the second connector 2 凸 protrudes from the lower surface 3 2 of the printed circuit board 3 2 so that the second lower surface 2 of the second connector 2 is machined to the printed circuit board The lower surface 32 of the 30 has a height H2 (see FIG. 14), so that the module connector forms a sinker design, thereby reducing the overall height H3 of the module connector. The thickness of the printed electrical φ board 30 is reduced). ★ The module connector i of the present invention is a two-piece structure having a first connector 丄〇 and a second connector 2 ,, and the second connector 2 is separately assembled into the first connector 1 In the case, the height HI of the module connector i as a whole on the printed circuit board 30 can be reduced (please refer to the tenth and the figure) even if the side module 50 is loaded into the second connector 2 The on-board twist Η 4 of the modular connector assembly formed by the 5 hood cover 4 Q is also reduced. _ 4, in the application of the upper and lower surfaces 3丄, 3 2 of the printed circuit board 3 需要, respectively, to the application of a module connector (see Figure 18), this combination The overall thickness Η5 can also be effectively reduced. The second connector 20 of the present invention is separately assembled into the first connector 1 and the second connector 2 is replaced by a second connector 2, so that the second connector 2 can be replaced by a different one. That is, a function of changing the depth of the die attach of the module connector 1 relative to the printed circuit board 30 is achieved. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalent technical changes of the present specification and the contents of the drawings are all included in the present invention. Within the scope of the invention, it is given to Chen Ming. [Simple diagram of the diagram] The first diagram is a schematic diagram of the conventional module connector, module and printed circuit (4). Fig. 0 The second diagram is a top view of a conventional module connector. The second figure is a 3 - 3 cross-sectional view of the second figure. The fourth figure is a cross-sectional view in which the printed circuit is loose, and the lower surface of the board is mounted with a mold and a connector. : Five = is an exploded perspective view of the modular connector assembly of the present invention. Figure 6 is a perspective exploded view of the first port of the present invention. Figure 7 is a perspective view of the first embodiment of the present invention. The eighth embodiment of the printed circuit board of the present invention is the first figure of the FI ^ ^ X ^ 埂 state of the present invention and the top view of the printed circuit board. 9-9 section view. The tenth figure is the 本 of the present invention. The eleventh figure is the present invention = a three-dimensional exploded view. The thirteenth figure of the present invention is the three-dimensional combination of the first embodiment of the present invention. The thirteenth figure of the present invention is the thirteenth fifteenth figure of the present invention. Top view of the printed circuit board. Figure 14-14 is a cross-sectional view. A three-dimensional combination of the die, and the connector combination. 201103199 Figure 16 is a top plan view of the modular connector assembly of the present invention. Figure 17 is a cross-sectional view taken at 17 to 17 of the sixteenth figure. Figure 18 is a cross-sectional view showing a module connector of the conventional invention mounted on both the upper and lower surfaces of the printed circuit board. [Main component symbol description] [General] la module connector 10a connector body • 11a insulative housing 111a lower surface 12a conductive terminal 13a shielding housing 2 0a cover 3 0a module 4 0a printed circuit board 41a lower surface φ 4 2 a opening
His 核組連接裔在印刷電路板板上的1¾度 Η 5 a 在印刷電路板的上、下表面分別安裝一個模組連 接器時，由其中之一模組連接器的上表面至其中 之另一模組連接器的上表面之間的整體厚度 〔本發明〕 1 模組連接器 10 第一連接器 11 第一絕緣本體 15 201103199 111 第一下表面 112 第一側壁 113 第一組裝空間 114 上開口 115 下開口 116 第一端子槽 117 卡扣槽 118 定位槽 12 第一導電端子 121 第一固定部 122 焊接部 123 第一接觸部 13 遮蔽殼體 13 1 側板 132 卡扣片 13 3 卡孔 20 第二連接器 21 第二絕緣本體 211 第二下表面 212 第二側壁 213 第二組裝空間 214 上開口 215 第二端子槽 216 定位塊 22 第二導電端子 221 第二固定部 16 201103199 222 橋接部 223 第二接觸部 30 印刷電路板 3 1 上表面 3 2 下表面 3 3 開孔 4 0 蓋體His nuclear group connection on the printed circuit board board 13⁄4 degrees Η 5 a When installing a module connector on the upper and lower surfaces of the printed circuit board, one of the module connectors from the upper surface to the other The overall thickness between the upper surfaces of a modular connector [Invention] 1 modular connector 10 first connector 11 first insulative body 15 201103199 111 first lower surface 112 first side wall 113 first assembly space 114 Opening 115 lower opening 116 first terminal slot 117 snap groove 118 positioning slot 12 first conductive terminal 121 first fixing portion 122 soldering portion 123 first contact portion 13 shielding housing 13 1 side plate 132 snap tab 13 3 card hole 20 Second connector 21 second insulative housing 211 second lower surface 212 second side wall 213 second assembly space 214 upper opening 215 second terminal slot 216 positioning block 22 second conductive terminal 221 second fixing portion 16 201103199 222 bridging portion 223 Second contact portion 30 printed circuit board 3 1 upper surface 3 2 lower surface 3 3 opening 4 0 cover
4 1 侧板 4 2 頂板 4 3 卡持塊 4 4 定位孔 5 0 模塊 5 1 基板 5 2 電接觸墊 Η 1 模組連接器在印刷電路板板上的高度 Η 2 第二連接器的第二下表面至該印刷電路板的下表 面的高度 Η 3 模組連接器的整體高度 Η 4 模組連接器組合在印刷電路板板上的高度 Η 5 在印刷電路板的上、下表面分別安裝一個模組連接 器時，由其中之一模組連接器的上表面至其中之另 一模組連接器的上表面之間的整體厚度 174 1 side plate 4 2 top plate 4 3 holding block 4 4 positioning hole 5 0 module 5 1 substrate 5 2 electrical contact pad Η 1 height of the module connector on the printed circuit board Η 2 second of the second connector The height of the lower surface to the lower surface of the printed circuit board Η 3 The overall height of the module connector Η 4 The height of the module connector assembly on the printed circuit board Η 5 Install one on the upper and lower surfaces of the printed circuit board The overall thickness of the module connector from the upper surface of one of the module connectors to the upper surface of the other of the module connectors