201102605 六、發明說明： * 【發明所屬之技術領域】 • 本發明涉及一種均溫板，特別涉及一種用於為電子元 件進行散熱之均溫板及其製造方法。 【先前技術】 諸如電腦中央處理器、北橋晶片、發光二極體等高功 率電子元件朝向更輕薄短小以及多功能、更快速運行之趨 勢發展，其在運行時單位面積所產生熱量也隨之愈來愈 多，熱量如果不能被及時有效地散去，將直接導致溫度急 Φ 劇上升，而嚴重影響發熱電子元件正常運行。是故，需要 使用散熱裝置來對該等電子元件進行散熱。 最典型散熱裝置係一種鰭片式散熱器，藉由散熱器與 發熱電子元件接觸達成散熱目的。為適應較高之熱通量， 在發熱電子元件與散熱器之間通常加裝一具有良好熱傳導 性之均溫板。該均溫板之作用係將發熱電子元件產生熱量 先均勻分佈，然後再傳到散熱器上，以充分發揮散熱器之 效能。 習知之均溫板通常為一具有密封腔體結構之板體。該 密封腔體作為蒸汽運動之空腔，其内被抽成低壓並裝有可 鲁 進行相變化之工作介質如水、乙醇、石蝶等。該密封腔體 之内表面形成有毛細結構。使用時，均溫板之底板吸收發 熱電子元件發出之熱量而令其内之工作介質蒸發成汽態， 汽態之工作介質沿空腔流向均溫板之頂板且與頂板接觸釋 放出熱量而冷卻成液態，液態之工作介質在毛細結構作用 下回流至底板。正常工作狀態下之均溫板具有較好之散熱 效率。然，在製造、運輸、安裝或使用之過程中，均溫板 時常會受到碰撞，由於均溫板具有腔體結構，使得均溫板 容易受擠壓而導致密封腔體變形，進而影響工作介質蒸發 效率，甚至導致密封腔體破裂而損毁。 201102605 【發明内容】 種均溫板之製造方法，包括以下步驟：提供一 之型!^，按預定尺寸切割該型材得到複數内部具有 =層丄將複數支撑元件登直置於該殼體之容置：内毛 ΐίίίϊΐ相對端分別與該殼體固定相連；密封該殼 質，並抽=之注液孔向容置腔内注入液態工作介 果私句溫板’包括一形成有一密封容置腔之殼體及設 容埴該容置腔之内表面上之一毛細結構層，該 固定相連 與習知技術相比 一縱長之中空擠型材 殼體’節約生產成本 ，之複數支撐元件，蝴元件之兩相對 本發明之均溫板之製造方法，採用 並按預定尺寸切割該型材得到複數 明之方法所製造:均 :結以;i牛對殼體起到密集嫩作用，提高均“ 【實施方式】 用以ftH1工及目2，本發明一實施例之均溫板1〇 邻涵a萝!"”、、電子凡件20進行散熱。該均溫板ι〇之頂 設有-散熱器3〇 ’用以將該均溫板1〇吸： 之熱置散發至周圍環境中去。 次队 上述均溫板10整體上為一長方板體，其 一 U、形成於該殼體u内之一密封容置腔12、設 置於该殼體11圍繞該容置腔12之内表面上之一 ^ -及容置於該容置腔12内之複數支撐元件1二； 谷置腔12内被抽成低壓並裝有可進行相變化之 作介質如水、乙醇、石躐等。 201102605 請一併參閱圖3及圖4,該殼體u可由銅、鋁 導熱餘之㈣製成，其具有—矩形底板 Η，與該底板15平行設置之—矩形蓋板16。該底板15 與該電子元件20相接觸，且通常為該底板15之 中央與該電子元件2〇接觸，用以快速、均勻吸收該電 Τ元件20所產生之熱虽。该蓋板16密封罩置於底板η ^，從而該蓋板16與底板15共同圍置該容置腔12。該 可藉由將一金屬管打扁或衝壓一金屬板之方式 一體製成。在第一實施例中，該均溫板1〇之殼體u之 弧形，使得殼體11整體上呈扁圓形；在第二 ，該均溫板i〇a之殼體ua之兩側邊呈矩形， 使仔设體11整體上呈扁方形。 該毛細結構層13覆蓋於該殼體u圍繞容置腔12 内表面上。該毛細結構層13之毛細結構形式可 ^ 杈末燒結、金屬絲網、纖維素、碳納米管陣列其 中之一種或者多種之結合。 /、 ，再次參閱圖1至圖4，該等支撐元件14均勻間 =^ ^置於該殼體U之底板15與蓋板16之間，其較 熱性能良好之金屬如銅、銘或者合金製成。、在 中該支撐元件14為一金屬柱，在第二實施 14夕撐兀件-14為一圓柱狀金屬彈簧。該支撐元件 # K »二、支撐元件143之拉伸方向垂直於該殼體之底 =+ 板Μ’其相對兩端面分別抵靠底板15及蓋板201102605 VI. Description of the Invention: * [Technical Field of the Invention] The present invention relates to a temperature equalizing plate, and more particularly to a temperature equalizing plate for dissipating heat for an electronic component and a method of manufacturing the same. [Prior Art] High-power electronic components such as computer central processing units, north bridge chips, and light-emitting diodes are moving toward a trend toward lighter, thinner, shorter, more versatile, and faster operation, and the heat generated per unit area during operation is also increased. More and more, if the heat can not be effectively dispersed in time, it will directly lead to a sharp rise in temperature, which seriously affects the normal operation of the heating electronic components. Therefore, it is necessary to use a heat sink to dissipate the electronic components. The most typical heat sink is a fin-type heat sink that is cooled by contact with heat-generating electronic components. In order to accommodate higher heat flux, a uniform temperature plate with good thermal conductivity is usually installed between the heat-generating electronic component and the heat sink. The function of the temperature equalizing plate is to uniformly distribute the heat generated by the heat-generating electronic components and then transmit them to the heat sink to fully utilize the heat sink performance. The conventional temperature equalization plate is usually a plate body having a sealed cavity structure. The sealed chamber acts as a cavity for the movement of steam, which is evacuated to a low pressure and is provided with a working medium such as water, ethanol, stone butterfly or the like which can undergo phase change. The inner surface of the sealed cavity is formed with a capillary structure. In use, the bottom plate of the temperature equalizing plate absorbs the heat generated by the heat-generating electronic component to evaporate the working medium therein into a vapor state, and the working medium of the vapor state flows along the cavity to the top plate of the temperature equalizing plate and contacts the top plate to release heat and cool. The liquid, liquid working medium is returned to the bottom plate under the action of the capillary structure. The average temperature plate under normal working conditions has better heat dissipation efficiency. However, in the process of manufacturing, transportation, installation or use, the uniform temperature plate is often subjected to collision. Since the temperature equalizing plate has a cavity structure, the temperature equalizing plate is easily squeezed to cause deformation of the sealing cavity, thereby affecting the working medium. Evaporation efficiency, even leading to cracking of the sealed cavity and damage. 201102605 [Summary] A method for manufacturing a uniform temperature plate, comprising the steps of: providing a type! ^, cutting the profile according to a predetermined size to obtain a plurality of internal layers having a layer 登 placing the plurality of support members in the housing The inner end of the inner ΐ ί ί ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ And a capillary structure layer disposed on the inner surface of the accommodating cavity, the fixed connection is compared with the prior art; a longitudinally hollow extruded profile shell saves production cost, and the plurality of support components, the butterfly component The method for manufacturing the uniform temperature plate of the present invention is manufactured by the method of cutting and cutting the profile according to a predetermined size to obtain a plurality of methods: both: the cows play a dense and tender effect on the casing, and the improvement is "" For the ftH1 work and the object 2, the temperature equalizing plate of the embodiment of the present invention is adjacent to the singularity and the electronic component 20 for heat dissipation. The top of the temperature equalizing plate is provided with a heat sink 3 〇 ‘ to suck the temperature equalizing plate 1 : the heat is dissipated to the surrounding environment. The upper temperature plate 10 of the second team is a rectangular plate body, and a U is formed in the casing u to seal the accommodating cavity 12 and is disposed on the inner surface of the casing 11 surrounding the accommodating cavity 12 . The upper part and the plurality of supporting elements 1 are placed in the accommodating cavity 12; the valley chamber 12 is evacuated to a low pressure and is provided with a phase changeable medium such as water, ethanol, sarcophagus or the like. 201102605 Please refer to FIG. 3 and FIG. 4 together, the casing u can be made of copper and aluminum heat conduction (4), and has a rectangular bottom plate Η, and a rectangular cover plate 16 disposed in parallel with the bottom plate 15. The bottom plate 15 is in contact with the electronic component 20, and generally the center of the bottom plate 15 is in contact with the electronic component 2A for quickly and uniformly absorbing the heat generated by the electrical component 20. The cover 16 is placed on the bottom plate η ^ such that the cover 16 and the bottom plate 15 together surround the receiving cavity 12 . This can be made in one piece by flattening a metal tube or stamping a metal plate. In the first embodiment, the arc of the casing u of the temperature equalizing plate 1 is such that the casing 11 is flat in shape as a whole; and secondly, on both sides of the casing ua of the temperature equalizing plate i〇a The sides are rectangular, so that the body 11 is flat on the whole. The capillary structure layer 13 covers the inner surface of the housing cavity 12 around the housing cavity u. The capillary structure of the capillary structure layer 13 may be a combination of one or more of sinter sintering, wire mesh, cellulose, and carbon nanotube array. Referring again to FIG. 1 to FIG. 4, the supporting members 14 are evenly placed between the bottom plate 15 of the casing U and the cover plate 16, and the metal having good thermal properties such as copper, inscription or alloy is used. production. The support member 14 is a metal post, and in the second embodiment, the brace member-14 is a cylindrical metal spring. The support member # K » 2, the tensile direction of the support member 143 is perpendicular to the bottom of the housing = + plate Μ 'the opposite end faces abut against the bottom plate 15 and the cover
Sir产面上之毛細結構層13，從而起到支揮該殼體 &板15與蓋板16之間之容置腔12之作用。 道a 參閱圖5，製造本發明之均溫板1〇時，將一 切奴f長之中空金屬銘擠型材40按預定尺寸 殼體U，再通過專用模具將金屬粉末、金 六番他毛細材料高溫燒結，形成與殼體11對應該 奋置腔2之内表面緊密結合之毛細結構層13，將該支 201102605 撐元件14通過夾具豎直置於殼體n内之容置腔 與殼體Π之底板15及蓋板16通過燒結或者焊接因 定相連，並將殼體11兩端壓鉚並焊接密封該容 12,從預留之注液孔注入液態工作介質並經抽真空，^ 口，使谷置腔12内形成一個被抽成低壓之 *』 容置該工作介質，進而得到本發明之均溫板1〇。二間以 使用時，上述均溫板1〇之底板15之底面緊貼發埶 電子7G件20吸熱，容置腔12内之工作介質從底^ :及熱，支撐元件14之間隙上升至蓋板 r 乍二質f该盍板16處遇冷放出熱量而冷卻為液 社播ί 门Λ 透至毛細結構層13並沿該毛細 …構層13流回底板15，繼續進行相變化循環。 古、技術相比’該均溫板10之容置腔12内容置 10 體U起到多點畨集支撐之作用，進而提 支且’工作介質在相變化過程中轉化為蒸 生膨胳乂 = 4腔12為一密封腔室，該容置腔I2會產 =制=25之與r 之平面声。另拉伸私度，從而保證該均溫板10 低製造ί、-杯;Γ支壯撑70件i4a採用金屬彈簧，可以降 二ί;】；?〇 I ί〜配精度。且’該殼體10通過切割 Λ’易於規模化生產’降低製造成本。 法提出專利申％。2明2明專利之要件’遂依 或變化，皆應神所作之等效修飾 【圖式簡單說訂凊專利範圍内。 圖1係本發明第一實施例之均溫板與一散熱器及電子 201102605 元件之立體組合圖。 圖2係圖1沿II-II線之剖視圖。 圖3係本發明第二實施例之均溫板與一散熱器及電子 元件之立體組合圖。 圖4係圖3沿IV-IV線之剖視圖。 圖5係藉由切割一型材得到本發明第一實施例之均溫 板之殼體之工序示意圖。 【主要元件符號說明】 均溫板 10,10a 殼體 11,11a 容置腔 12 毛細結構層 13 支撲元件 14,14a 底板 15 蓋板 16 電子元件 20 散熱器 30The capillary structure layer 13 on the Sir surface functions to support the accommodating cavity 12 between the casing & plate 15 and the cover plate 16. Referring to Fig. 5, when manufacturing the temperature equalizing plate of the present invention, the hollow metal ingot profile 40 of all the slaves is made into a predetermined size of the casing U, and then the metal powder and the hexaploid capillary material are passed through a special mold. The high temperature sintering forms a capillary structure layer 13 which is tightly coupled with the inner surface of the housing 11 corresponding to the cavity 2, and the member 201102605 is supported by the clamp member 14 in the housing cavity and the housing 竖 vertically. The bottom plate 15 and the cover plate 16 are connected by sintering or welding, and the two ends of the casing 11 are riveted and welded to seal the volume 12, and the liquid working medium is injected from the reserved liquid injection hole and vacuumed, The working medium is placed in the valley chamber 12 to form a low pressure, and the temperature equalizing plate of the present invention is obtained. When the two are in use, the bottom surface of the bottom plate 15 of the above-mentioned uniform temperature plate is closely attached to the heat-generating electronic 7G member 20, and the working medium in the receiving chamber 12 rises from the bottom and the heat, the gap of the supporting member 14 to the cover. The plate r 乍 质 质 盍 盍 盍 盍 盍 盍 盍 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 。 。 Compared with the ancient technology, the content of the temperature-increasing plate 10 is set to 10, and the body U acts as a multi-point support, and the working medium is converted into a steaming swell during the phase change process. = 4 cavity 12 is a sealed chamber, and the receiving cavity I2 will produce a flat sound of =25 and r. Another degree of privateness is stretched to ensure that the temperature equalizing plate 10 is low in manufacturing ί, - cup; 70 pieces of i4a are made of metal springs, which can be lowered by two;;; 〇 I ί ~ with precision. And 'the casing 10 is easily mass-produced by cutting Λ' and the manufacturing cost is reduced. The law proposes a patent application. 2 Ming 2 Ming patents 'requirements' 遂 变化 变化 变化 皆 皆 遂 遂 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效1 is a perspective assembled view of a temperature equalizing plate, a heat sink and an electronic 201102605 component according to a first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line II-II of Figure 1. Fig. 3 is a perspective assembled view of a temperature equalizing plate, a heat sink and an electronic component according to a second embodiment of the present invention. Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3. Fig. 5 is a view showing the steps of obtaining a casing of the temperature equalizing plate of the first embodiment of the present invention by cutting a profile. [Main component symbol description] Temperature equalizing plate 10,10a Housing 11,11a accommodating cavity 12 Capillary structure layer 13 Flapping element 14,14a Base plate 15 Cover plate 16 Electronic component 20 Radiator 30