201102252 六、發明說明： 【發明所屬之技術領域】 本發明，係有關於射出成型用模具、射出成型方法、 以及射出成型品。 【先前技術】 於先前技術中，作爲成型樹脂製品之方法，係廣泛使 用射出成型。當經由此射出成型來成型具備有貫通孔之樹 脂製品的情況時，一般而言，係在作了 2分割之模具的其 中一方處，立起設置有當模具鎖合時而與另外一方之模具 的腔表面相抵接之銷，並藉由該銷來形成貫通孔。 此時，另外一方之模具與銷之前端，爲了不會由於接 觸而對於另外一方之模具造成損傷，並未嚴密地抵接，就 算是在模具鎖合時，亦成爲介存有20#m左右之些許的空 隙。在通常之成型品或是成型法中，在此些許的空隙中， 樹脂係幾乎不會進入，因此，在貫通孔部處係並不會產生 毛邊’或者是就算產生有毛邊，該毛邊亦成爲對於製品而 言不會造成問題的大小。 然而，在特別被要求有高精確度之光學鏡面、光學球 面 ' 光學非球面或者是光學自由曲面等的特殊平滑面，或 者是如同微晶片一般之具備有細微構造的樹脂製品中，就 算是微小的毛邊，亦會對於其之功能或是性能造成影響。 特別是，當使用將樹脂之流動性提高而實現高轉印性的成 法，例如使用將模具表面之溫度提高至被射出之樹脂 201102252 的熱變形溫度附近以上的熱循環成型法、或是使用使樹脂 成爲可塑化之碳酸氣體亦或是將腔內之壓力提高的氮氣之 氣體輔助成型法、或者是在模具處使用熱傳導率低之絕熱 模具以使樹脂成爲難以冷卻之絕熱成型法等的情況時，就 算是如同上述一般之些許的空隙，樹脂亦容易進入，而容 易在貫通孔部處產生毛邊。 因此，係提案有：在銷之基端處設置線圈彈簧，並將 該銷朝向另外一方之模具而適度作推壓，藉由此，而在模 具鎖合時，並不對於另外一方之模具造成損傷地而使銷之 前端與另外一方之模具相抵接，而不使空隙存在的方法（ 例如，參考專利文獻1 )。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2004- 1 1 43 3 4號公報 【發明內容】 [發明所欲解決之課題] 然而，在上述專利文獻1所記載之方法中，由於係必 須要在各銷之基端處分別配置線圈彈簧，因此，可作推壓 之銷的數量或是大小會被線圈彈簧之大小所限制，在形成 複數之貫通孔、特別是形成複數之微小貫通孔上，係爲困 難。又，在此種構成中，由於相對於模具，線圈彈簧係容 易相對性地傾斜，因此，要將複數之銷均一地作推壓一事 -6 - 201102252 ’係爲困難，而會有部分性地產生空隙並產生大的毛邊之 虞。 又，當在各個的銷處而分別設置線圈彈簧之構成的情 況時，會有由於各個的線圈彈簧之劣化等而使得在推壓力 中產生有偏差的可能性，而更進一步使上述一般之均一之 推壓的維持成爲困難。 相對於此，係亦可考慮有：並非在銷的基端處，而是 在銷所作抵接之另外一方的模具側來設置線圈彈簧之方法 0 但是，如同線圈彈簧二般之彈性構件，由於係並無法 耐住樹脂之射出壓力，且亦不具備有必要之耐熱性，因此 ’係無法配置在腔內。因此，係不得不在另外一方之模具 內’將與銷作抵接之抵接部作爲能夠在接近遠離方向上作 滑動之構造而設置之，並設爲使線圈彈簧將此抵接部從另 外一方之模具的內部來作推壓之構造，但是，在此構造中 ’樹脂會進入至滑動部分之空隙中，而會產生毛邊。 又，在專利文獻1之第3實施例中，係揭示有：將複數 之銷一體化，並將此藉由共通之推壓構件來朝向另外一方 之模具而作推壓的形態。然而，此方法，係存在有下述之 缺點：亦即是，係在一體化之銷本身的加工精確度乃至其 與模具之插通孔間的相對位置精確度上均成爲需要具備高 精確度。 本發明，係有鑑於上述之事態所硏發而成，並以提供 _ 一種能夠對於毛邊的產生有效地作抑制，並成型複數之貫 201102252 通孔的射出成型用模具、射出成型方法、以及根據前述兩 者所製造之射出成型品，作爲目的。 [用以解決課題之手段] 若依據本發明之第1態樣，則係爲一種射出成型用模 具，係爲具備有固定模具與可動模具，並在該固定模具與 該可動模具之間而形成有樹脂被注入之腔的射出成型用模 具，其特徵爲，具備有：模具，係爲前述固定模具以及前 述可動模具之任一方的模具，並具備有複數之插嵌孔；和 棒狀之複數之銷，係在模具鎖合時，被插入至前述插嵌孔 內，並在前述腔內而使前端部與另外一方之模具相抵接； 和推壓構件，係爲了在前述模具鎖合時，將前述複數之銷 整批地從前述複數之銷的基端部側起來朝向前述另外一方 之模具側作推壓，而被配置在前述腔外。 在此射出成型用模具中，較理想爲：前述推壓構件， 其材質係爲彈性體（彈性樹脂或是橡膠等）、或是平行彈 簧、又或是被塡充有氣體或液體的緩衝構件。於此，在本 發明中’所謂「彈性體」之用語，係作爲廣義之用語而使 用’亦即是’不僅是指彈性樹脂或是橡膠，就算並非爲一 般性地被分類爲彈性樹脂者，只要是能夠發揮本發明中所 需要的推壓力的樹脂，則亦包含於其中。 又’在此射出成型用模具中，較理想爲：使用熱循環 成型法、氣體輔助成型法以及絕熱成型法中之至少—者。 又’在此射出成型用模具中，較理想爲：前述推壓構 -8 - 201102252 件對於前述複數之銷所賦予的推壓力，係爲2〜55MPa，更 理想，係爲2〜15MPa。 又，在此射出成型用模具中，較理想爲：前述推壓構 件，係爲藉由以將被設置在前述其中一方之模具處的複數 之銷的基端部之端面朝向前述另外一方之模具來作推壓的 方式而被配置的薄片狀之彈性構件所構成者。 又，在此射出成型用模具中，較理想爲：前述另外一 方之模具，係爲藉由低硬度或是高脆性之材料所形成者。 若依據本發明之第2態樣，則係爲一種射出成型方法 ，其特徵爲：係使用有本發明之射出成型用模具，而在前 述腔內塡充成型材料，並將該腔之形狀作轉印。 若依據本發明之第3態樣，則係爲一種樹脂製之射出 成型品，並係使用本發明之射出成型用模具所成型者，其 特徵爲：係具備有光學鏡面、光學球面、光學非球面、光 學自由曲面以及細微構造中之至少一者。 在此射出成型品中，較理想爲：具備有寬幅以及深度 落在10〜200μπι之範圍內的細微流路之微晶片用樹脂成型 品。 [發明之效果] 若依據本發明，則由於將複數之銷整批地作推壓之推 壓構件，係被配置在腔之外，因此，能夠將在複數之銷的 各個處之推壓力的偏差減少，並且亦能夠將由於推壓構件 之劣化所導致的推壓力之偏差減輕，故而，能夠對於樹脂 -9 - 201102252 進入銷之前端部與另外—方之模具之間所產生的大的毛邊 之發生作抑制。 故而，就算是在對於具備被要求有高精確度之特殊平 滑面或是細微構造的成型品作成型的情況時，或者是使用 將樹脂之流動性提高而實現高轉印性之成型法的情況時， 亦能夠對於大的毛邊之發生有效作抑制地來成型複數之貫 通孔。 【實施方式】 以下，針對本發明之實施形態，參考圖面而作說明。 圖1係爲本發明之射出成型品的一種實施形態之微晶 片1的上視圖’圖2(3)係爲圖1之111-111剖面圖、圖2(匕 )係爲圖1之IV-IV剖面圖’圖3係爲具備有微晶片1之後述 的樹脂製基板10之上視圖。 微晶片1 ’係爲具備有後述之細微流路1 5、1 6等的細 微構造’並於其之內部而進行核酸、蛋白質、血液等之液 體試料的化學反應或是分離、分析等者。 如圖1〜3中所示一般，此微晶片1，係具備有：被作 層積並藉由內側之腹面10A、20A彼此而相互作了貼合之2 枚的矩形板狀之樹脂製基板10、20。 其中，在樹脂製基板10之腹面10 A處，係如圖2 ( a ) 、圖3中所示一般，被形成有直線狀之流路用溝12、13。 又，如圖3中所示一般，在此些之流路用溝I2、13的兩端 部處，係分別被形成有在樹脂製基板10之厚度方向上作貫 -10- 201102252 通之貫通孔14。另外’在本實施形態中之流路用溝12與流 路用溝1 3 ’雖係相互正交地被形成，但是，亦可並不作正 交地而形成之。進而，在樹脂製基板10處，係如圖2(b) 、圖3中所示一般，在從上面觀察時在位於對角之2個場所 的角部附近處’係分別被形成有在厚度方向上作貫通之貫 通孔1 8。 又，如圖2(a)、圖2(b)、圖3中所示一般，在樹 脂製基板1〇之背面10B處，於各貫通孔14之周圍，係被設 置有圓筒狀之突起部31，在各貫通孔18之周圍，係被設置 有圓筒狀之突起部32。此些之突起部31、32，係包圍貫通 孔14、18而突出於樹脂製基板10之厚度方向上。其中，突 起部31，係被嵌合於分析裝置（未圖示）之管或是噴嘴處 ，並成爲進行試料等之導入或是排出，突起部32，係在將 微晶片1設置在分析裝置處時之定位等之中而被使用。另 外，此種突起部3 1、3 2，係可具備有圓筒狀之形狀，亦可 具備有多角形狀等之其他的形狀。又，突起部31之尺寸， 係配合於管或是噴嘴之尺寸而被任意作設定。 另一方面，如圖2(a)中所示一般，樹脂製基板20, 係爲表面平滑之構件，並相對於樹脂製基板1 〇之腹面1 〇 A (流路用溝1 2、1 3之形成面）而被作接合。經由此接合’ 樹脂製基板20係作爲流路用溝12、13或是貫通孔14之蓋（ cover )而起作用，並在其與樹脂製基板10之流路用溝12 之間形成細微流路1 5、在其與流路用溝1 3之間形成細微流 路1 6、且藉由其與貫通孔1 4而形成開口部1 7。 201102252 又，如圖2(b)中所示一般，在樹脂製基板2 0處，係 於與樹脂製基板10之貫通孔18相對應的各位置處，被形成 有在厚度方向上作貫通之貫通孔21。此貫通孔21，係與貫 通孔18—同地’被使用在當將樹脂製基板1〇與樹脂製基板 2 0作接合時的各基板之定位中。又，貫通孔21，係藉由樹 脂製基板10與樹脂製基板20間之接合，而被與貫通孔1 8相 通連’並藉由其與該貫通孔18而形成定位孔19。此定位孔 1 9 ’係被使用在當將微晶片丨設置於未圖示之分析裝置處 時的定位中。 於此’細微流路15、16 (流路用溝12、13)之形狀， 若是能夠對於將分析試料、試藥之使用量減少，以及成型 模具之製作精確度、轉印性、離模性等的事態作考慮，則 係以設爲使寬幅、深度均落在l〇#m〜200/zm之範圍內的 形狀爲理想，但是，係並未被特別限定，只要依據微晶片 之用途來作決定即可。又，係可將細微流路1 5 ' 1 6 (流路 用溝12、13)之寬幅和深度設爲相同，亦可設爲相異。在 本實施形態中’細微流路1 5、1 6之剖面的形狀，係成爲矩 形狀，但是，此形狀係僅爲其中一例，而亦可成爲圓形狀 等之其他的形狀。 又’如同上述一般，由於樹脂製基板10之貫通孔14係 與流路用溝12、13相連接，因此，藉由此貫通孔14所被形 成之開口部17，係與細微流路15、16相連接。此開口部17 ，係爲用以進行凝膠、試料、緩衝液之導入、保存、排出 的孔’並被與被設置在分析裝置（未圖示）處之管或是噴 -12- 201102252 嘴相連接’經介於此管或是噴嘴’而將凝膠或是試料、緩 衝液等導入至細微流路15、16中，或者是從細微流路15、 16而排出。 另外’開口部1 7 (貫通孔1 4 )以及定位孔丨9 (貫通孔 18)之形狀，係並不被限定於圓形狀，而亦可設爲矩形狀 等之其他的各種形狀。又’開口部17 (貫通孔14)以及定 位孔1 9 (貫通孔1 8 )之內徑，係只要與分析手法或是分析 裝置相配合即可，而例如以1〜4 m m左右爲理想。 '以上之樹脂製基板1〇、20的形狀，只要是容易作處理 之形狀、易於進行分析的形狀，則不論是何種形狀均可， 但是’例如係以正方形、長方形、圓形等之形狀爲理想。 又，樹脂製基板10、2〇之大小，係以10mm平方〜200mm平 方左右爲理想，又以l〇mm平方〜l〇〇mm平方爲更理想。又 ，被形成有流路用溝12、13之樹脂製基板1〇的板厚，若對 於成型性作考慮，則係以0.2mm〜5mm左右爲理想，又以 0.5mm〜2mm爲更理想。 作爲蓋（cover )而起作用之樹脂製基板20的板厚， 若對於成型性作考慮，則係以0.2mm〜5mm左右爲理想， 又以0.5mm〜2mm爲更理想。但是，當如同本實施形態一 般·，在樹脂製基板20處並不形成流路用溝的情況時，作爲 樹脂製基板20,係亦可不使用板狀之構件，而使用薄膜（ 薄片狀之構件）。於此情況，薄膜之厚度，係以3 0 /z m〜 3 00仁m爲理想，又以50 // m〜1 50 # m爲更理想。 又’樹脂製基板1 0、20，係經由後述之射出成型方法 -13- 201102252 而被成型，在成型材料係使用樹脂。作爲此樹脂，係以成 型性（轉印性、離模性）佳、透明性高、相對於紫外線或 可視光之自我螢光性低者爲理想，例如，使用熱可塑性樹 脂。 作爲熱可塑性樹脂，例如，係以使用聚碳酸酯、聚甲 基丙烯酸甲酯、聚苯乙烯、聚丙烯腈、聚氯乙烯、聚對苯 二甲酸乙二酯、尼龍6、尼龍66、聚醋酸乙烯、聚偏二氯 乙烯、聚丙烯、聚異戊二烯、聚乙烯、聚二甲基矽氧烷、 環狀聚烯烴等爲理想。又以使用聚甲基丙烯酸甲酯、環狀 聚烯烴爲特別理想。另外，在樹脂製基板10與樹脂製基板 20處，係可使用相同之材料，亦可使用不同之材料。 又，在並未被形成有流路用溝之樹脂製基板20處，除 了熱可塑性樹脂以外，亦可使用熱硬化性樹脂或是紫外線 硬化性樹脂等。作爲熱硬化性樹脂，係以使用聚二甲基矽 氧烷爲理想。 具備有以上之構成的微晶片1，係藉由將2枚的樹脂製 基板10、20 —面作推壓一面作加熱接合而形成之》作爲此 時之加熱接合法或是接合裝置’係可使用傳統以來所熟知 者。 接著，針對在將微晶片1之樹脂製基板作射出成型時 所使用的射出成型用模具（以下，稱作成型用模具）作說 明。 另外，於此，係僅針對在樹脂製基板10之射出成型中 所使用的成型用模具2作說明’關於在樹脂製基板20之射 -14- 201102252 出成型中所使用的成型用模具，係省略 20，由於係僅爲在平板上被形成有貫通 ，係可藉由具備有與用以在樹脂製基板 、18之後述的成型用模具2之構成爲相 具，來進行成型。 圖4係爲成型用模具2之側剖面圖， 定模具40的下視圖，圖6係爲後述之可 〇 如圖4中所示一般，成型用模具2, 40、和可動模具50、和銷保持構件60。 固定模具40，係如圖4、圖5中所示 樹脂製基板更大上一圈的略平板狀， 具50相對向之下面40a處，被形成有用 、13與貫通孔14之一部份的凸部41。此 爲與流路用溝12、13和貫通孔14之一部 negative)形狀，更詳細而言，係被形 溝12、13以及貫通孔14之上面而作觀察 ，並且，被形成爲與流路用溝12、13之 〇 又，固定模具40，在本實施形態中 模（master mode)處適用電鑄加工而被 ，係在主模之表面上，藉由電鍍法而但 鎳-銘-磷合金、銅等之金屬析出後’將 ，而形成之。藉由此，固定模具40，係 說明。樹脂製基板 孔2 1之形狀，因此 10上形成貫通孔14 同構成的成型用模 圖5係爲後述之固 動模具50的上視圖 係具備有固定模具 一般，被形成爲較 並且，在與可動模 以形成流路用溝1 2 凸部4 1，係被形成 份相對應的相反（ 成爲：當從流路用 時成爲反轉的形狀 深度相同的高度者 ，係在未圖示之主 形成，更詳細而言 己錬、錬-銘合金、 此金屬從主模剝離 藉由以上述電鑄加 -15- 201102252 工所得之鎳或銅等的低硬度或者是高脆性之材料而被形成 。於此，所謂低硬度或是高脆性之材料，係指較SKH51硬 度爲更低的材料（SKH51之硬度= 5 8-60HRC)。 可動模具50，係如圖4、圖6中所示一般，與固定模具 40相同的，被形成爲較樹脂製基板10更大上一圈的略平板 狀，並且，在與固定模具40相對向之上面50a處，被形成 有與除了流路用溝12、13以及貫通孔14、18之外的樹脂製 基板1 〇之形狀相對應之相反形狀的腔5 1。此腔5 1，係在與 突起部31、32相對應之各位置處，具備有與該突起部31、 32相對應之相反形狀的凹部52、53。在凹部52、53之底面 處，用以將後述之銷63、Μ作插嵌的插嵌孔54、55，係與 貫通孔14' 18略同一直徑地而被形成，並在可動模具50之 厚度方向上作貫通。. 又，在可動模具5 0之側面處，係被形成有用以將成型 材料之樹脂注入至腔51內的樹脂注入口 56。又，可動模具 5 0，係與上述之固定模具4 0相同的，爲經由電鑄加工所形 成。 銷保持構件60，係如圖4中所示一般，具備有蓋構件 61、和基台構件62'和棒狀之複數之銷63、64、和彈性構 件65。 於此些之中，蓋構件61，係被形成爲當從上面作觀察 時與固定模具40或是可動模具50同形狀之略平板狀。在蓋 構件6 1之下面處，係於與可動模具5 0之凹部5 2、5 3相對應 之位置處，被形成有朝向下方而開口之凹部61a、61b，在 -16- 201102252 此凹部61a、61b之底面處，於與可動模具50之插嵌孔54、 55相對應之位置處’用以將銷63、64作插嵌之插嵌孔61c 、61d，係在厚度方向上作貫通。 基台構件62，係與蓋構件61同樣的而被形成爲略平板 狀，並在上面被形成有用以將彈性構件65 (推壓構件）作 收容之凹部62a。凹部62a，係涵蓋著蓋構件61之全部的凹 部61a、61b之下方區域地被形成。另外，凹部62 a，只要 是涵蓋著全部的凹部61a、61b之下方區域地而被形成，則 不論是何種形狀均可。又，基台構件6 2，係以使周緣部分 之上面與蓋構件61之下面作了抵接的狀態，而被與該蓋構 件6 1作固定。另外，蓋構件，係亦可爲與可動模具一體化 〇 銷63、64，係爲用以形成樹脂製基板10之貫通孔14、 18者，並被形成爲於一端處具備有鍔部63a、64a之附有階 段差的圓柱狀，且一面將鍔部63a、64a收容於蓋構件61之 凹部61a、61b中，一面被插嵌於蓋構件61之插嵌孔61c、 6 Id中。又，銷64，係被形成爲相較於銷63而更多出有固 定模具40之凸部41的高度的量之長度。此些之銷63、64， 係藉由蓋構件6 1與基台構件62，隔著彈性構件65而被鍔部 63a、64a作挾持，並以立設的狀態而被作保持。 彈性構件65，係爲本發明之推壓構件，並被形成爲薄 片狀’且以涵蓋著基台構件62處之凹部62a之表面全面的 方式而被作鋪設。如此這般，彈性構件65，係以將所有的 銷63、64作支持的方式，而被設置在腔51外之該些銷63、 -17- 201102252 64的基端部處，並被構成爲藉由其之彈性力而將所 63、64整批地朝向各前端部而作推壓。 又，彈性構件65，其材質只要是爲彈性體（樹 膠）之任一者、或是平行彈簧、或是被塡充有氣體 的緩衝構件即可，而亦可將此些作組合。藉由此， 各銷63、64作推壓所需之空間，係僅需要該銷63、 端面的面積之量便已足夠。又，作爲彈性構件（推 )是與將線圈彈簧設置在各銷之基端處的先前技術 可作推壓之銷的數量或是大小係並不會被線圈彈簧 所限制，就算是複數之微小的銷63、64，亦能夠確 推壓。進而，係藉由將彈性構件65設爲上述之構成 該彈性構件65以安定之狀態來作設置，因此，與先 之線圈彈簧不同，能夠防止其相對於模具而產生傾 且，能夠使彈性構件6 5密著於銷6 3、64之基端面全 將該銷63、64作推壓，故而，能夠對於複數之銷63 均一地作推壓。藉由此，能夠對於在銷63、64與固 40之間而部分性地產生空隙並發生毛邊的情況有效 抑制。 另外，作爲彈性體（樹脂、橡膠），例如，係 氟素橡膠、聚矽氧橡膠、氟矽氧橡膠、聚丙烯酸橡 烯丙烯橡膠、聚胺酯橡膠，或者是丙烯酸系、胺酯 乙烯系等之熱可塑性彈性體等爲理想，更理想，係 熱溫度爲高之氟素橡膠、聚矽氧橡膠、氟矽氧橡膠专 由此彈性構件65所致之對於銷63、64的推壓力 有的銷 脂、橡 或液體 爲了對 64之基 壓構件 不同， 之大小 實地作 ，而將 前技術 斜，並 面，並 、64而 定模具 果地作 以使用 膠、乙 系、苯 使用耐 亭。 ，係因 -18- 201102252 應於銷63、64 (貫通孔1 4、1 8 )之大小、或者是射出成型 時之成型材料以及模具之溫度等，而被適宜作調整，但是 ，槪略係爲2MPa以上之推壓力。推壓力之上限，只要是能 夠產生不會對於彈性體65本身、固定模具40以及銷63、64 造成損傷之程度的推壓力者即可，但是，更理想，係設爲 2〜55 MPa之範圍。進而，推壓力係以設爲2〜15 MPa爲理 想。推壓構件，係只要由能夠發揮出此種範圍之推壓力的 橡膠硬度或是壓縮率之材料來作選擇即可。 接著，針對使用有成型用模具2之樹脂製基板10之射 出成型方法作說明。 首先，將被立設於銷保持構件60處之銷63、64，分別 插嵌於所對應之可動模具50的插嵌孔54、55中，並在使可 動模具50之下面與蓋構件61之上面作了抵接的狀態下，將 可動模具50與銷保持構件60作固定。如此這般，銷63、64 ，係成爲貫通可動模具50並被立設於該可動模具50之腔51 內的狀態，此腔5 1內之部分，係成爲與樹脂製基板1 0之貫 通孔1 4、1 8相對應的祖反形狀》 接著，將固定模具40與可動模具50作締結（模具鎖合 )。於此，係將被固定有銷保持構件之可動模具50的上面 5 0a、和固定模具40之下面40a，使相互之周緣成爲一致地 作抵接，並將此些之固定模具40與可動模具50作固定。另 外，此時，係亦可在可動模具50之腔51內或是固定模具4〇 之下面40a處預先塗布離模劑。 此時，銷63、64之前端部，係經由從彈性構件65而來 -19- 201102252 之推壓力，而在腔51內與固定模具40相抵接。具體而言’ 銷63之前端部係與固定模具40之凸部41下面相抵接’銷64 之前端部係與固定模具40之下面40a相抵接。又’此時’ 係被構成爲使銷63、64之鍔部63a、64a的上面與蓋構件61 之凹部61a、61b的底面並不相抵接，並成爲藉由彈性構件 65之推壓力而使銷63、64與固定模具40確實地作抵接。 接著，將身爲成型材料之樹脂作塡充。具體而言’係 將被加熱至特定之溫度的樹脂，以特定之射出壓力而從樹 脂注入口 56來注入至腔51內而作塡充。而後，在特定之冷 卻時間後，藉由將凝固了的樹脂從成型用模具2而取出， 而得到腔5 1等之形狀被作了轉印並經由銷63、64而形成了 貫通孔1 4、1 8之樹脂製基板1 0。 另外，在進行上述之射出成型時，係亦可使用下述之 至少一者的方法：將固定模具40以及可動模具50之至少其 中一方的溫度反覆地作升降之熱循環成型法、接續於成型 材料而將二氧化碳氣體或是氮氣等之高壓氣體注入至腔51 內之氣體輔助成型法、以及在固定模具40以及可動模具50 之至少其中一方處而設置用以將腔51內作絕熱之絕熱層的 絕熱成型法。藉由使用此些方法，而能夠提升樹脂之流動 性，並實現高轉印性。另外，作爲此些之成型法，係可使 用從先前技術起即爲周知者。 若藉由以上之成型用模具2，則由於在可動模具50處 ’係貫通該可動模具50地設置有在模具鎖合時而在腔51內 使前端部與固定模具40相抵接之複數之銷63、64，並且， -20- 201102252 在銷63、64之基端部處，係被設置有將全部的該些銷63、 64朝向各前端部而作推壓之彈性構件65，因此，藉由此彈 性構件65 ’而將全部的銷63、64同時作推壓，而能夠使此 些之銷63、64的前端部與固定模具40相抵接。藉由此，能 夠對於樹脂進入至銷63、64之前端部與固定模具40之間所 產生的大的毛邊之發生作抑制。 又，彈性構件65，由於其材質係爲彈性體（樹脂、橡 膠）、或是平行彈簧、又或是被塡充有氣體或液體的緩衝 構件，因此，用以對於各銷63、64作推壓之空間，係成爲 僅需要該些之銷63、64的基端面之面積之量即已足夠。藉 由此，作爲彈性構件（推壓構件）是與將線圈彈簧設置在 各銷之基端處的先前技術不同，就算是複數之微小的銷63 、64，亦能夠確實地作推壓。 進而，係藉由將彈性構件65設爲上述之構成，而將該 彈性構件65以安定之狀態來作設置，因此，與先前技術之 線圈彈簧不同，能夠防止其相對於模具而產生傾斜，並且 ，能夠使彈性構件65密著於銷63、64之基端面全面，並將 該銷63、64作推壓，故而，能夠對於複數之銷63、64而均 一地作推壓。藉由此，能夠對於在銷63、64與固定模具40 之間而部分性地產生空隙並發生毛邊的情況有效果地作抑 制。 故而，就算是在對於具備被要求有高精確度之特殊平 滑面或是細微構造的成型品作成型的情況時、或者是使用 有將樹脂之流動性提高而實現高轉印性之成型法的情況時 -21 - 201102252 ，亦能夠對於大的毛邊之發生有效作抑制並成型複數之貫 通孔1 4、1 8。 又，由於銷63、6 4係藉由彈性構件65而被作適度的推 壓，因此，就算是藉由低硬度或是高脆性之材料所形成的 固定模具40，亦不會有由於與銷63、64間之抵接而產生損 傷的情形。進而，就算是在發生模具鎖合力或是模具溫度 之變動的情況時，伴隨於該變動所產生的推壓力之變化， 亦經由彈性構件65之彈性變形而被作吸收，而能夠確實地 使銷63、64抵接於固定模具40處。 又，由於係能夠藉由彈性構件65而使銷63、64確實地 抵接於固定模具40處，因此，係並不需要對於銷63、64之 長度尺寸以高精確度來作管理。故而，能夠將製作成本降 低，並且，係使短期間內之製作成爲可能。 另外’本發明’係並非被解釋爲受到上述之實施形態 所限定者’不用說，係亦可進行適宜之變更、改良》 例如，在上述實施形態中，作爲使用成型用模具2而 成型之射出成型品’係列舉出具備有細微構造之微晶片1 而作了說明，但是’作爲此種射出成型品，係亦可爲光學 透鏡等之具備有光學鏡面、光學球面、光學非球面、光學 自由曲面者，且亦可爲具備有此些與細微構造中之至少1 個者。 又’腔51 ’雖係作爲被形成於可動模具5〇處者而作了 說明’但是，只要是被形成在固定模具4〇與可動模具5〇之 間即可，例如’亦可被形成於固定模具4〇處。 -22- 201102252 又’銷63、64，雖係作爲藉由可動模具5〇與銷保持構 件6 0間之固定而被設置在可動模具5 〇側者而作了說明，但 是，係亦可爲被設置於固定模具40側。 又，彈性構件65，雖係作爲將全部的銷63、64作推壓 者而作了說明，但是，係只要爲對2個以上的銷6 3、6 4作 推壓者即可，例如，亦可如圖7中所示一般，設爲在每2個 的銷63、64處而藉由相異之複數的彈性構件65來對於該銷 63、64作推壓之構成。進而，彈性構件65，係亦可如圖8 中所示一般，以隔著板構件66來對於銷63、64作推壓的方 式而作設置，若是設爲此種構成，則能夠對於由於其與銷 63、64間之接觸所造成的彈性構件65之損傷作防止。 又，銷63、64，係並不被限定於圓柱狀者，例如，亦 可形成爲隨著朝向前端部而縮徑的錐狀。若是設爲此種構 成，則能夠將從銷63、64之射出成型品的離模更爲容易地 進行。又，銷63、64，係亦可爲角柱狀。 [實施例] 以下，藉由列舉出實施例’而對·於本發明作更具體之 說明》 作爲本發明之實施例1、2以及比較例’藉由以下之條 件，而使用設置有彈性構件6 5之成型用模具2和並未作設 置之成型用模具’來分別將微晶片1之樹脂製基板1〇作了 射出成型。 -23- 201102252 <樹脂製基板> 樹脂製基板1 〇，係設爲了以下之形狀。 大小 ：5 0mm平方 厚度 ：1.5mm 流路用溝12、13之深度、寬幅 ：50/zm 貫通孔14、1 8之內徑 ：2mm <彈性構件> 作爲實施例1之彈性構件6 5，使用材質爲氟素橡膠、 厚度爲2mm、壓縮率爲50%、對於銷63、64之推壓力爲 4 0MPa者。又，作爲實施例2之彈性構件65，使用材質爲氟 素橡膠 '厚度爲2mm、壓縮率爲10% '對於銷63、64之推 壓力爲4MP a者。在實施例1、2中所使用之氟素橡膠，具體 而言，係爲NOK股份有限公司製之製品名F201、橡膠硬度 A70之氟素橡膠。 <射出成型> 作爲成型材料，使用透明樹脂材料之丙烯酸樹脂（ DELPET :旭化成公司製，旭化成化學股份有限公司之登 記商標），並經由熱循環成型法而進行了射出成型。 <評價> 對於藉由設置有彈性構件65之成型用模具2所成型了 的樹脂製基板10 (實施例1、2)、和藉由未被設置有彈性 -24- 201102252 構件65之成型用模具所成型了的樹脂製基板（比較例）’ 分別藉由顯微鏡而對於貫通孔14、18之開口部作了觀察’ 並對於毛邊的發生作了確認。另外，比較例之銷’係使用 當作了模具鎖合時在銷前端與模具之間會存在有5/zm以上 之空隙一般的長度之銷。 其結果，在實施例1、2之樹脂製基板1 0中，在任何的 貫通孔14、18之開口部處，均並未發生有毛邊。另一方面 ，在比較例之樹脂製基板中，在任一之貫通孔的開口部處 ，均係發生有l〇〇Aim左右之毛邊。 由以上之結果，可以確認到，藉由使用設置有彈性構 件6 5之成型用模具2，係能夠對於毛邊之發生作抑制地而 形成複數之貫通孔I4、18。 【圖式簡單說明】 [圖1 ]本實施形態中之微晶片的上視圖。[Technical Field] The present invention relates to a mold for injection molding, an injection molding method, and an injection molded article. [Prior Art] In the prior art, as a method of molding a resin article, injection molding is widely used. When a resin product having a through-hole is molded by this injection molding, generally, one of the two-divided molds is provided with a mold that is attached to the other mold when the mold is locked. The cavity surface abuts the pin and the through hole is formed by the pin. At this time, the other end of the mold and the front end of the pin are not tightly contacted for the other mold due to contact, and even when the mold is locked, the storage is about 20#m. A little gap. In a conventional molded article or a molding method, in such a small gap, the resin system hardly enters, so that no burrs are formed at the through-hole portion, or even if burrs are generated, the burrs become It does not cause a problem for the product. However, in a resin material which is particularly required to have a high-precision optical mirror surface, an optical spherical surface, an optical aspheric surface, or an optical free-form surface, or a resin product having a fine structure like a microchip, even a small The raw edges will also affect its function or performance. In particular, when a method of improving the fluidity of the resin to achieve high transferability is used, for example, a thermal cycle molding method in which the temperature of the surface of the mold is raised to a temperature higher than or equal to the vicinity of the heat distortion temperature of the resin 201102252 to be ejected is used, or A gas-assisted molding method in which the resin is made into a plasticized carbon gas, or a gas-assisted molding method in which the pressure in the chamber is increased, or an adiabatic mold having a low thermal conductivity in the mold to make the resin into an adiabatic molding method which is difficult to cool. At this time, even if it is a small gap as described above, the resin easily enters, and burrs are easily generated at the through-hole portion. Therefore, it is proposed to provide a coil spring at the base end of the pin and push the pin toward the other mold to press it moderately, so that when the mold is locked, it is not caused by the other mold. A method of damaging the ground so that the front end of the pin abuts against the other mold, and the void is not present (for example, refer to Patent Document 1). [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004- 1 1 43 3 No. 4 of the Invention [Problems to be Solved by the Invention] However, in the method described in Patent Document 1, Since the coil springs must be disposed at the base ends of the pins, the number or size of the pins that can be pushed is limited by the size of the coil springs, and a plurality of through holes are formed, especially forming plural numbers. It is difficult to make a small through hole. Further, in such a configuration, since the coil spring is easily tilted relative to the mold, it is difficult to uniformly press the plurality of pins -6 - 201102252 ', and there is a partial Create voids and create large burrs. Further, when the coil springs are separately provided at the respective pin portions, there is a possibility that a deviation occurs in the pressing force due to deterioration of the respective coil springs, etc., and the above-described general uniformity is further achieved. The maintenance of the push becomes difficult. On the other hand, it is also possible to consider a method in which a coil spring is provided not at the base end of the pin but on the mold side of the other side where the pin abuts. However, like the coil spring, the elastic member is It is not able to withstand the injection pressure of the resin, and it does not have the necessary heat resistance, so it cannot be placed in the cavity. Therefore, it is necessary to provide the abutting portion that abuts the pin in the mold of the other one as a structure that can slide in the approaching direction, and the coil spring is made to have the abutting portion from the other side. The inside of the mold is used as a pressing structure, but in this configuration, the resin enters into the gap of the sliding portion, and burrs are generated. Further, in the third embodiment of Patent Document 1, it is disclosed that a plurality of pins are integrated, and this is pressed by a common pressing member toward the other mold. However, this method has the following disadvantages: that is, it requires high precision in the processing accuracy of the integrated pin itself and the relative positional accuracy between the pin and the through hole of the mold. . The present invention has been made in view of the above-described circumstances, and provides a mold for injection molding, an injection molding method, and a method for forming a plurality of through holes 102102252 through which a burr can be effectively suppressed. The injection molded article manufactured by the above two is intended for the purpose. [Means for Solving the Problem] According to the first aspect of the present invention, a mold for injection molding is provided with a fixed mold and a movable mold, and is formed between the fixed mold and the movable mold. A mold for injection molding having a cavity into which a resin is injected is characterized in that: a mold is provided as one of the fixed mold and the movable mold, and a plurality of insert holes are provided; and a plurality of rod-shaped inserts are provided The pin is inserted into the insertion hole when the mold is locked, and the front end portion is in contact with the other mold in the cavity; and the pressing member is for locking the mold. The plurality of pins are collectively pressed from the base end side of the plurality of pins toward the other mold side, and are disposed outside the cavity. In the injection molding die, it is preferable that the pressing member is made of an elastic body (elastic resin or rubber), a parallel spring, or a cushioning member that is filled with a gas or a liquid. . Here, in the present invention, the term "the so-called "elastomer" is used in a broad sense to mean that "is not only" an elastic resin or a rubber, but is not generally classified as an elastic resin. Any resin that can exert the pressing force required in the present invention is also included. Further, in the mold for injection molding, it is preferable to use at least one of a heat cycle molding method, a gas assist molding method, and an adiabatic molding method. Further, in the injection molding die, it is preferable that the pressing force of the pressing member -8 - 201102252 is 2 to 55 MPa, more preferably 2 to 15 MPa, for the plurality of pins. Further, in the injection molding die, it is preferable that the pressing member is directed to the other one of the end faces of the base end portions of the plurality of pins provided in the one of the molds. It is composed of a sheet-like elastic member that is arranged to be pressed. Further, in the injection molding die, it is preferable that the other one of the molds is formed of a material having low hardness or high brittleness. According to a second aspect of the present invention, there is provided an injection molding method characterized in that the injection molding die of the present invention is used, and a molding material is filled in the cavity, and the shape of the cavity is made. Transfer. According to a third aspect of the present invention, there is provided an injection molded article made of a resin, which is molded by using the injection molding die of the present invention, and is characterized in that it has an optical mirror surface, an optical spherical surface, and an optical non- At least one of a spherical surface, an optical freeform surface, and a fine structure. In the injection molded article, it is preferable to provide a resin molded article for a microchip having a fine flow path and a fine flow path having a depth of 10 to 200 μm. [Effects of the Invention] According to the present invention, since the pressing members that press the plurality of pins in a batch are disposed outside the cavity, the pressing force at each of the plurality of pins can be exerted. The deviation is reduced, and the deviation of the pressing force due to the deterioration of the pressing member can also be alleviated, so that large burrs generated between the end portion of the resin before entering the pin and the other mold can be obtained for the resin -9 - 201102252 The occurrence is suppressed. Therefore, even in the case of molding a molded article having a special smooth surface or a fine structure which is required to have high precision, or a molding method in which the fluidity of the resin is improved to achieve high transferability, At the same time, a plurality of through holes can be formed by effectively suppressing the occurrence of large burrs. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a top view of a microchip 1 of an embodiment of an injection molded article of the present invention. FIG. 2(3) is a cross-sectional view taken along line 111-111 of FIG. 1, and FIG. 2(匕) is an IV- of FIG. FIG. 3 is a top view of a resin substrate 10 including a microchip 1 described later. The microchip 1' is a chemical reaction, separation, analysis, or the like, which is provided with a fine structure such as a fine flow path 15 and 16 to be described later, and is subjected to a liquid sample of nucleic acid, protein, blood or the like. As shown in FIG. 1 to FIG. 3, the microchip 1 is provided with two rectangular plate-shaped resin substrates which are laminated and bonded to each other by the inner ventral surfaces 10A and 20A. 10, 20. In the ventral surface 10 A of the resin substrate 10, as shown in Fig. 2 (a) and Fig. 3, linear flow path grooves 12 and 13 are formed. Further, as shown in Fig. 3, generally, the end portions of the flow path grooves I2 and 13 are formed so as to penetrate through the thickness direction of the resin substrate 10 through -10-201102252. Hole 14. Further, the channel groove 12 and the channel groove 1 3 ' in the present embodiment are formed to be orthogonal to each other, but may be formed without orthogonality. Further, in the resin substrate 10, as shown in Fig. 2(b) and Fig. 3, when viewed from above, the portions near the corners of the two corners are formed with thicknesses. The through hole 18 is penetrated in the direction. Further, as shown in Fig. 2 (a), Fig. 2 (b), and Fig. 3, a cylindrical protrusion is provided around the through holes 14 at the back surface 10B of the resin substrate 1A. The portion 31 is provided with a cylindrical projection 32 around each of the through holes 18. The projections 31 and 32 project in the thickness direction of the resin substrate 10 so as to surround the through holes 14 and 18. The protrusion 31 is fitted into a tube or a nozzle of an analysis device (not shown), and is introduced or discharged into a sample or the like, and the protrusion 32 is provided to the microchip 1 in the analysis device. Used in the positioning of the time, etc. Further, such protrusions 3 1 and 3 2 may have a cylindrical shape or may have other shapes such as a polygonal shape. Further, the size of the projection 31 is arbitrarily set in accordance with the size of the tube or the nozzle. On the other hand, as shown in Fig. 2(a), the resin substrate 20 is a member having a smooth surface and is 相对A with respect to the ventral surface of the resin substrate 1 (flow path grooves 1 2, 1 3) The surface is formed and joined. By the joining, the resin substrate 20 functions as the flow path grooves 12 and 13 or the cover of the through hole 14, and forms a fine flow between the resin substrate 20 and the flow path groove 12 of the resin substrate 10. The path 15 forms a fine flow path 16 between the channel 15 and the flow path groove 13 and forms an opening 17 with the through hole 14 . In addition, as shown in FIG. 2(b), the resin substrate 20 is formed at a position corresponding to the through hole 18 of the resin substrate 10, and is formed to penetrate in the thickness direction. Through hole 21. This through hole 21 is used in the positioning of each substrate when the resin substrate 1 is bonded to the resin substrate 20 in the same manner as the through hole 18. Further, the through hole 21 is joined to the through hole 18 by the bonding between the resin substrate 10 and the resin substrate 20, and the positioning hole 19 is formed by the through hole 18. This positioning hole 1 9 ' is used in the positioning when the microchip cassette is placed at an analysis device not shown. In the shape of the fine flow paths 15 and 16 (flow path grooves 12 and 13), the amount of the analysis sample and the reagent to be used can be reduced, and the manufacturing precision, transferability, and mold release property of the molding die can be made. In view of the facts, it is preferable to make the shape in which the width and the depth fall within the range of l〇#m to 200/zm, but it is not particularly limited as long as it is used according to the microchip. Let's make a decision. Further, the width and depth of the fine flow path 1 5 ' 16 (flow path grooves 12, 13) may be the same or different. In the present embodiment, the shape of the cross section of the fine flow paths 15 and 16 is a rectangular shape. However, this shape is merely an example, and may be another shape such as a circular shape. In addition, as described above, the through hole 14 of the resin substrate 10 is connected to the flow path grooves 12 and 13, so that the opening portion 17 formed by the through hole 14 is connected to the fine flow path 15, 16-phase connection. The opening portion 17 is a hole for performing introduction, storage, and discharge of a gel, a sample, and a buffer, and is connected to a tube provided at an analysis device (not shown) or a nozzle -12-201102252 The gel, the sample, the buffer, and the like are introduced into the fine flow paths 15 and 16 via the tube or the nozzle, or are discharged from the fine flow paths 15 and 16. Further, the shape of the opening portion 17 (the through hole 14) and the positioning hole 9 (the through hole 18) is not limited to a circular shape, and may be other shapes such as a rectangular shape. Further, the inner diameter of the opening portion 17 (through hole 14) and the positioning hole 19 (through hole 18) may be any combination with an analysis method or an analysis device, and is preferably, for example, about 1 to 4 m. The shape of the above-mentioned resin substrates 1 and 20 can be any shape as long as it is a shape that is easy to handle and can be easily analyzed. However, for example, a shape such as a square, a rectangle, or a circle is used. Ideal. Further, the size of the resin substrate 10 and 2 is preferably about 10 mm square to 200 mm square, and more preferably 1 mm square to 1 mm square. Further, the thickness of the resin substrate 1A on which the flow path grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, and more preferably 0.5 mm to 2 mm, in view of moldability. The thickness of the resin substrate 20 which functions as a cover is preferably about 0.2 mm to 5 mm, and more preferably 0.5 mm to 2 mm, in view of moldability. However, when the flow path groove is not formed in the resin substrate 20 as in the case of the present embodiment, the resin substrate 20 may be formed without using a plate-like member. ). In this case, the thickness of the film is preferably from 3 0 /z m to 300 Å, and more preferably from 50 // m to 1 50 # m. Further, the resin substrates 10 and 20 are molded by an injection molding method -13 to 201102252 which will be described later, and a resin is used for the molding material. The resin is preferably molded (transferability, mold release property), high transparency, and low self-fluorescence with respect to ultraviolet light or visible light. For example, a thermoplastic resin is used. As the thermoplastic resin, for example, polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyacetic acid are used. Ethylene, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethyl siloxane, cyclic polyolefin, etc. are preferred. Further, it is particularly preferable to use polymethyl methacrylate or a cyclic polyolefin. Further, in the resin substrate 10 and the resin substrate 20, the same material may be used, or a different material may be used. Further, in addition to the thermoplastic resin, a thermosetting resin or an ultraviolet curable resin may be used in the resin substrate 20 in which the channel grooves are not formed. As the thermosetting resin, polydimethylsiloxane is preferably used. The microchip 1 having the above configuration is formed by heat-bonding two resin substrates 10 and 20 to each other as a heating bonding method or a bonding device. Use what is known from the tradition. Next, a mold for injection molding (hereinafter referred to as a mold for molding) used for injection molding of a resin substrate made of the microchip 1 will be described. In addition, the molding die 2 used for the injection molding of the resin substrate 10 is described as the mold for molding used in the molding of the resin substrate 20 - 201102252. The omission of 20 is formed by forming a molding die 2 to be described later on the resin substrate and 18, as it is formed only on the flat plate. 4 is a side cross-sectional view of the molding die 2, and a lower view of the fixing die 40, and FIG. 6 is a squeegee as described later in FIG. 4, a molding die 2, 40, a movable die 50, and a pin. The member 60 is held. The fixed mold 40 is a slightly flat plate having a larger circumference of the resin substrate as shown in FIG. 4 and FIG. 5, and is formed at a portion 40a opposite to the lower surface 40a, and is formed with a portion of the useful portion 13 and the through hole 14. Projection 41. This is the shape of one of the flow path grooves 12 and 13 and the through hole 14 , and more specifically, the grooved grooves 12 and 13 and the upper surface of the through hole 14 are observed, and are formed into a flow. Further, the road groove 12, 13 is fixed, and the mold 40 is fixed in the master mode in the present embodiment, and is applied to the surface of the main mold by electroplating but nickel-ming- A metal such as a phosphorus alloy or copper is precipitated and formed. Thereby, the mold 40 is fixed, and the description is given. In the shape of the resin-made substrate hole 21, the molding die 5 having the through-holes formed in the same manner as shown in FIG. 5 is a top view of a fixed mold 50 which will be described later, and is generally provided with a fixed mold. The movable mold forms the flow path groove 1 2 and the convex portion 4 1 is opposite to the formed portion (the height of the shape having the same depth when inverted from the flow path) is the main one not shown. Forming, in more detail, the bismuth, bismuth alloy, which is formed by peeling off from the main mold by a low hardness or high brittle material such as nickel or copper obtained by electroforming at -15-201102252 Here, the material of low hardness or high brittleness refers to a material having a lower hardness than SKH51 (the hardness of SKH51 = 5 8-60HRC). The movable mold 50 is as shown in FIG. 4 and FIG. In the same manner as the fixed mold 40, it is formed in a substantially flat shape which is larger than the resin substrate 10, and is formed with and in addition to the flow path groove 12 at the upper surface 50a opposite to the fixed mold 40. , 13 and the resin substrate 1 other than the through holes 14 and 18 The shape corresponds to the cavity 51 of the opposite shape. The cavity 51 is provided at each position corresponding to the protrusions 31, 32, and has a concave portion 52 having an opposite shape corresponding to the protrusions 31, 32, 53. At the bottom surface of the concave portions 52, 53, the insertion holes 54, 55 for inserting the pins 63 and 后 which will be described later are formed to have the same diameter as the through holes 14'18, and are formed in the movable mold. Further, in the thickness direction of 50, a through hole is formed in the side surface of the movable mold 50 to inject the resin of the molding material into the cavity 51. Further, the movable mold 50 is coupled to The above-described fixed molds 40 are similarly formed by electroforming. The pin holding member 60, as shown in Fig. 4, is provided with a cover member 61, and a base member 62' and a plurality of pins 63 of a rod shape. And the elastic member 65. Among these, the cover member 61 is formed in a substantially flat shape having the same shape as the fixed mold 40 or the movable mold 50 when viewed from above. In the lower portion, at a position corresponding to the concave portions 5 2, 5 3 of the movable mold 50, There are recesses 61a, 61b which are open toward the lower side, at the bottom surfaces of the recesses 61a, 61b of -16-201102252, at positions corresponding to the insertion holes 54, 55 of the movable mold 50, for 'pins 63, 64' The insertion holes 61c and 61d for insertion and insertion are penetrated in the thickness direction. The base member 62 is formed in a substantially flat shape similarly to the cover member 61, and is formed thereon to be used to elastic members 65. (Pushing member) is a recessed portion 62a for accommodating. The recessed portion 62a is formed to cover a lower portion of the recessed portions 61a and 61b of the cover member 61. Further, the recessed portion 62a may be formed in any shape as long as it covers the lower regions of all the recessed portions 61a and 61b. Further, the base member 6 2 is fixed to the cover member 61 by bringing the upper surface of the peripheral portion into contact with the lower surface of the cover member 61. Further, the cover member may be formed by integrating the split pins 63 and 64 with the movable mold, and forming the through holes 14 and 18 of the resin substrate 10, and is formed to have the flange portion 63a at one end thereof. 64a has a columnar shape with a stepped state, and the crotch portions 63a and 64a are housed in the recessed portions 61a and 61b of the cover member 61, and are inserted into the insertion holes 61c and 6 Id of the cover member 61. Further, the pin 64 is formed to have a length larger than the height of the convex portion 41 of the fixed mold 40 as compared with the pin 63. The pins 63 and 64 are held by the flange portions 63a and 64a via the elastic member 65 by the lid member 61 and the base member 62, and are held in an upright state. The elastic member 65 is a pressing member of the present invention and is formed into a sheet-like shape and laid in such a manner as to cover the entire surface of the concave portion 62a at the abutment member 62. In this manner, the elastic member 65 is disposed at the base end of the pins 63, -17-201102252 64 outside the cavity 51 in such a manner as to support all the pins 63, 64, and is configured as The 63, 64 are pushed in batches toward the respective front end portions by the elastic force thereof. Further, the elastic member 65 may be any material as long as it is an elastomer (spelt), a parallel spring, or a cushioning member which is filled with a gas, or may be combined. Thereby, the space required for pushing the pins 63, 64 is sufficient only for the amount of the area of the pin 63 and the end face. Further, as the elastic member (push) is the number or size of the pin which can be pushed by the prior art in which the coil spring is provided at the base end of each pin, it is not limited by the coil spring, even if it is a small number The pins 63 and 64 can also be pushed. Further, since the elastic member 65 is configured to have the elastic member 65 in a stable state, the elastic member 65 can be prevented from being tilted with respect to the mold, and the elastic member can be prevented. The base end faces of the pins 6 3 and 64 are all pressed against the pins 63 and 64, so that the plurality of pins 63 can be uniformly pressed. Thereby, it is possible to effectively suppress the occurrence of voids between the pins 63, 64 and the solid 40 and occurrence of burrs. Further, as the elastomer (resin or rubber), for example, a fluorocarbon rubber, a polyoxyethylene rubber, a fluorocarbon rubber, a polyacrylic rubber olefin rubber, a polyurethane rubber, or a heat such as an acrylic or an amine ester. A plastic elastomer or the like is desirable, and more preferably, the fluorocarbon rubber, the polyoxyxene rubber, and the fluorosilicone rubber having a high heat temperature are used for the urging force of the pins 63 and 64 by the elastic member 65. In order to make the base member of 64 different, the size of the base is made to be the same, and the front technology is inclined, and the mold is used to make the mold to use the glue, the B, and the benzene. , -18- 201102252 is suitable for adjustment of the size of the pins 63, 64 (through holes 14 and 18), or the molding material at the time of injection molding, and the temperature of the mold, etc. It is a pushing force of 2 MPa or more. The upper limit of the pressing force may be a pressing force that does not cause damage to the elastic body 65 itself, the fixed mold 40, and the pins 63 and 64. More preferably, the pressing force is set to a range of 2 to 55 MPa. . Further, the pressing force is preferably set to 2 to 15 MPa. The pressing member may be selected from a material having a rubber hardness or a compression ratio capable of exerting a pressing force in such a range. Next, an injection molding method using the resin substrate 10 having the molding die 2 will be described. First, the pins 63, 64 which are erected at the pin holding member 60 are respectively inserted into the insertion holes 54, 55 of the corresponding movable mold 50, and the lower surface of the movable mold 50 and the cover member 61 are In the state in which the above is abutted, the movable mold 50 and the pin holding member 60 are fixed. In this manner, the pins 63 and 64 are in a state of passing through the movable mold 50 and standing in the cavity 51 of the movable mold 50, and the portion in the cavity 51 is a through hole with the resin substrate 10. 1 4, 1 8 corresponding ancestor shape" Next, the fixed mold 40 and the movable mold 50 are joined (mold-locked). Here, the upper surface 50a of the movable mold 50 to which the pin holding member is fixed and the lower surface 40a of the fixed mold 40 are brought into contact with each other, and the fixed mold 40 and the movable mold are fixed. 50 for fixing. Further, at this time, the release agent may be applied in advance in the cavity 51 of the movable mold 50 or the lower surface 40a of the fixed mold 4?. At this time, the front ends of the pins 63 and 64 abut against the fixed mold 40 in the cavity 51 via the pressing force from the elastic member 65 to -19-201102252. Specifically, the front end portion of the pin 63 abuts against the lower surface of the convex portion 41 of the fixed mold 40. The front end portion of the pin 63 abuts against the lower surface 40a of the fixed mold 40. Further, 'this time' is configured such that the upper surfaces of the flange portions 63a and 64a of the pins 63 and 64 do not abut against the bottom surfaces of the concave portions 61a and 61b of the cover member 61, and are caused by the pressing force of the elastic member 65. The pins 63, 64 are surely abutted against the fixed mold 40. Next, the resin which is a molding material is charged. Specifically, the resin to be heated to a specific temperature is injected into the cavity 51 from the resin injection port 56 to be filled with a specific injection pressure. Then, after the specific cooling time, the solidified resin is taken out from the molding die 2, and the shape of the cavity 5 1 or the like is transferred, and the through holes 14 are formed via the pins 63 and 64. , 18 resin substrate 10. Further, in the above-described injection molding, at least one of the following methods may be employed: a thermal cycle molding method in which at least one of the fixed mold 40 and the movable mold 50 is repeatedly raised and lowered, and the molding is continued. A gas-assisted molding method in which a high-pressure gas such as carbon dioxide gas or nitrogen gas is injected into the chamber 51, and a heat insulating layer for insulating the chamber 51 at at least one of the fixed mold 40 and the movable mold 50 is provided. Adiabatic molding. By using such methods, the fluidity of the resin can be improved and high transferability can be achieved. Further, as such a molding method, it is known from the prior art. According to the above-described molding die 2, the movable mold 50 is inserted through the movable mold 50, and a plurality of pins are formed in the cavity 51 when the mold is locked, and the front end portion is brought into contact with the fixed mold 40. 63, 64, and -20- 201102252 At the base end portions of the pins 63, 64, an elastic member 65 for pressing all of the pins 63, 64 toward the respective front end portions is provided, and therefore, Thereby, all the pins 63 and 64 are simultaneously pressed by the elastic member 65', and the front end portions of the pins 63 and 64 can be brought into contact with the fixed mold 40. Thereby, it is possible to suppress the occurrence of large burrs generated between the end portions of the resin before the pins 63, 64 and the fixed mold 40. Moreover, since the elastic member 65 is made of an elastic body (resin, rubber), a parallel spring, or a cushioning member that is filled with a gas or a liquid, it is used to push the pins 63 and 64. It is sufficient that the space of the pressure is such that the area of the base end faces of the pins 63 and 64 is only required. Thus, the elastic member (urging member) is different from the prior art in which the coil spring is provided at the base end of each pin, and even a plurality of minute pins 63 and 64 can be reliably pressed. Further, by providing the elastic member 65 in the above-described configuration, the elastic member 65 is placed in a stable state, and therefore, unlike the coil spring of the prior art, it is possible to prevent the tilt from being generated with respect to the mold, and The elastic member 65 can be adhered to the base end faces of the pins 63 and 64 in a comprehensive manner, and the pins 63 and 64 can be pressed, so that the plurality of pins 63 and 64 can be uniformly pressed. Thereby, it is possible to effectively suppress the occurrence of a gap between the pins 63, 64 and the fixed mold 40 and burrs. Therefore, even in the case of molding a molded article having a special smooth surface or a fine structure which is required to have high precision, or a molding method in which the fluidity of the resin is improved to achieve high transferability, In the case of -211022, it is also possible to effectively suppress the formation of large burrs and to form a plurality of through holes 14 and 18. Further, since the pins 63 and 64 are appropriately pressed by the elastic member 65, even if the fixed mold 40 is formed of a material having low hardness or high brittleness, there is no cause and failure. 63, 64 between the contact and damage. Further, even when the mold blocking force or the mold temperature fluctuates, the change in the pressing force caused by the fluctuation is absorbed by the elastic deformation of the elastic member 65, and the pin can be surely made. 63, 64 abuts at the fixed mold 40. Further, since the pins 63, 64 can be reliably abutted against the fixed mold 40 by the elastic member 65, it is not necessary to manage the lengths of the pins 63, 64 with high precision. Therefore, the production cost can be reduced, and the production in a short period of time can be made possible. Further, the 'invention' is not to be construed as being limited to the above-described embodiment. In other words, it is also possible to carry out an appropriate change or improvement. For example, in the above embodiment, the injection molding is performed using the molding die 2 The molded article ' series has been described with a microchip 1 having a fine structure. However, as such an injection molded article, an optical lens, an optical spherical surface, an optical aspheric surface, or an optical freedom may be used as an optical lens. The curved surface may be provided with at least one of such a fine structure. Further, the 'cavity 51' is described as being formed in the movable mold 5, but it may be formed between the fixed mold 4 and the movable mold 5, for example, 'may be formed Fix the mold 4〇. -22- 201102252 The 'pins 63 and 64' are described as being provided on the side of the movable mold 5 by the fixing between the movable mold 5〇 and the pin holding member 60, but it may be It is provided on the side of the fixed mold 40. Further, although the elastic member 65 has been described as being pressed by all the pins 63 and 64, it is only necessary to press the two or more pins 6 3 and 6 4, for example, Alternatively, as shown in Fig. 7, the pin 63, 64 may be pressed by a plurality of different elastic members 65 at every two pins 63, 64. Further, the elastic member 65 may be provided so as to press the pins 63 and 64 with the plate member 66 as shown in Fig. 8, and if it is configured as described above, The damage of the elastic member 65 caused by the contact with the pins 63, 64 is prevented. Further, the pins 63 and 64 are not limited to the cylindrical shape. For example, the pins 63 and 64 may be formed in a tapered shape that is reduced in diameter toward the distal end portion. According to this configuration, the mold release from the injection molded articles of the pins 63 and 64 can be more easily performed. Further, the pins 63 and 64 may be in the shape of a column. [Examples] Hereinafter, the present invention will be more specifically described by exemplifying the examples ', and the examples 1 and 2 and the comparative examples of the present invention are provided with elastic members by the following conditions. The resin substrate 1 of the microchip 1 is injection-molded by the molding die 2 of 6 and the molding die which is not provided. -23- 201102252 <Resin substrate> The resin substrate 1 is formed into the following shape. Size: 5 0mm square Thickness: 1.5mm Depth and width of channel 12, 13: 50/zm Through hole 14, 1 8 inner diameter: 2mm <Elastic member> As the elastic member 657 of Example 1, a material having a material of fluororubber, a thickness of 2 mm, a compression ratio of 50%, and a pressing force for the pins 63 and 64 of 40 MPa was used. Further, as the elastic member 65 of the second embodiment, a material having a material of fluorocarbon rubber having a thickness of 2 mm and a compression ratio of 10% was used, and the pressing force of the pins 63 and 64 was 4 MP a. The fluorocarbon rubber used in Examples 1 and 2 is specifically a product name F201 manufactured by NOK Co., Ltd. and a fluorocarbon rubber having a rubber hardness of A70. <Injection molding> As a molding material, an acrylic resin (DELPET: Asahi Kasei Co., Ltd., registered trademark of Asahi Kasei Chemicals Co., Ltd.) of a transparent resin material was used, and injection molding was carried out by a thermal cycle molding method. <Evaluation> The resin substrate 10 (Examples 1 and 2) molded by the molding die 2 provided with the elastic member 65, and the molding of the member 65 without being provided with the elastic-24-201102252 The resin substrate (comparative example) which was molded by a mold was observed by the microscope with respect to the opening of the through holes 14 and 18, and the occurrence of burrs was confirmed. Further, the pin of the comparative example used a pin having a length of 5/zm or more between the tip end of the pin and the mold when the mold was locked. As a result, in the resin substrate 10 of Examples 1 and 2, no burrs were formed in the openings of any of the through holes 14 and 18. On the other hand, in the resin substrate of the comparative example, a burr of about 10 Aim occurred in the opening of any of the through holes. From the above results, it was confirmed that a plurality of through holes I4 and 18 can be formed by suppressing the occurrence of burrs by using the molding die 2 provided with the elastic member 65. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A top view of a microchip in the present embodiment.
[圖2]圖1之微晶片的（a) ΙΙΙ-ΙΙΙ剖面圖、（b) IV-IV 剖面圖。 [圖3]被形成有流路用溝之樹脂製基板的上視圖。 [圖4]本發明之射出成型用模具的側剖面圖。 [圖5]本發明之射出成型用模具中的固定模具之下視圖 〇 [圖6]本發明之射出成型用模具中的可動模具之上視圖 〇 [圖7]對於銷保持構件之其他例子作展示之剖面圖。 -25- 201102252 [圖8 ]對於銷保持構件之又一其他例子作展示之剖面圖 【主要元件符號說明】 1 :微晶片（射出成型品） 2:成型用模具（射出成型用模具） 1 0、20 :樹脂製基板（射出成型品） 4 0 :固定模具 50 :可動模具 51 :腔 5 4、5 5 :插嵌孔 63 、 64 ：銷 65 :彈性構件（推壓構件） -26-Fig. 2 is a (a) ΙΙΙ-ΙΙΙ cross-sectional view and (b) IV-IV cross-sectional view of the microchip of Fig. 1. Fig. 3 is a top view of a resin substrate on which a channel groove is formed. Fig. 4 is a side sectional view showing a mold for injection molding of the present invention. Fig. 5 is a bottom view of the fixed mold in the mold for injection molding of the present invention. Fig. 6 is a top view of the movable mold in the mold for injection molding of the present invention. Fig. 7 is a view showing another example of the pin holding member. A cross-sectional view of the display. -25- 201102252 [Fig. 8] A cross-sectional view showing still another example of the pin holding member [Description of main components] 1 : Microchip (injection molded article) 2: Mold for molding (mold for injection molding) 1 0 20: resin substrate (injection molding) 40: fixed mold 50: movable mold 51: cavity 5 4, 5 5: insertion hole 63, 64: pin 65: elastic member (urging member) -26-