TW201040874A - The built-in self-test circuit of a video multi media system chip - Google Patents

Abstract

A video multimedia chip is disclosed comprising a memory with specific words, a system chip comprising a built-in self-test block with a reference value, configured to receive the specific words of the memory and to get a computation result by computing the specific words and the reference value, a bus with a least one wire to connect the memory with the system chip, configured to transmit the specific words of the memory to the system chip, and an interface coupled to the system chip, configured to provide the computation result to a checker, wherein the checker can know whether the at least one wire of the bus is properly linked.

Description

201040874 VI. Description of the Invention: [Technical Field of the Invention] I check the circuit and its operation The present invention relates to a self-method of an audio-visual multimedia chip. [Prior Art] For audio and video multimedia chips, (Multiple-Chip M () dules, = often, using multi-chip module system wafers and - memory. There are at least - ^ r. m inside , ^ ^ 仃 仃 仃 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 ^ 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含Determining the quality of the system crystal = reading body 'still can not ensure the quality of audio and video multimedia chips. 4 How to ensure the final product quality with a fast and cost-effective test method has become an important issue in the industry. 15 Current wafer manufacturer Most of the audio and video multimedia chips produced use High Definition Multimedia Interface (〇HDMI). In order to protect digital content from unauthorized units, the industry generally uses high-bandwidth digital content protection (High-Bandwidth Digital Content PiOtection). 'HDCP' agreement. Usually, the wafer manufacturer will burn HDCP gold 20 key in a memory in the audio and video multimedia chip, this memory Often such as an EEPROM or Flash. This HDCP system by the American Digital Content

Developed by Protection, authorized wafer manufacturers have to implant a set of protected HDCP keys in the EEPROM within the chip, and each EEPROM will have a different HDCP key. Simply put, the HDCP system essentially forces two devices (the transmitter and the 25 201040874 receiver) to perform an authentication protocol before exchanging information, and each device has a private key and a public key. When two devices are connected, they can exchange their own public keys, then calculate their own private money, and get a key for decoding. The private gold painting of this device is provided by the official organization "Digital Content Protection LLC", so if it does not comply with the HDCP specification, the key will not be provided naturally. In Fig. 1, a schematic illustration shows a conventional audio and video multimedia chip 100 design. ' Ο As shown in the figure, this video multimedia chip design 1 includes a memory 102, a bus bar 104, and a system chip 106. The memory 102 is, for example, EEPR0M, and includes a burned HDCP key 112. If the system chip 106 is a receiving end, it has an HDMI receiver 1 〇 8 and includes a built-in self-test. The HDMI transmitter is 11 〇. If the system chip 106 is a transmission end, it has an HDMI transmitter 1 〇 8 and a 15 built-in self-test HDMI receiver 110. The memory 1 〇 2 used for the AV multimedia chip 100 must be legally authorized, so the keys 112 on each of the authorized memories 102 are different. To check that the wires on the busbars 1〇4 are all properly connected, use the system chip 106' to read the contents of the memory 1〇2 by the bus bar 104, and check if the content is correct. To achieve this inspection, the wafer manufacturer will traditionally design an additional HDMI Receiver/Transmitter on the System Chip 1〇6 as its built-in Burn-In Self Test (BIST) block. The built-in HDMI Receiver/Transmitter ι1 is the external data destination/source, which performs the same authentication function to check the correctness of the HDCP key. If the key is correct, the bus 106 is known. The wires on the top are all connected correctly, and vice versa, so this self-test function is achieved. 201040874 However, implementing the HDMI Receiver/Transmitter 110 on the system wafer 106 would require a significant increase in the number of gates on the system wafer 106. That is, the system chip originally only needs the function of the HDMI transmission/receiver 108, but if the authentication function of the HDCP key is simulated in the audio-visual multimedia chip, the system chip needs an additional 5 design HDMI receiver/transmitter 110, so the required increase is required. The number of gates also causes an increase in power consumption, and it takes a while for the HDMI Receiver/Transmitter 110 to perform this authentication function, which causes a delay in test time, and for the chip manufacturer who rents the test lab, It is also an increase in cost. 〇 It is therefore desirable to be able to provide an audio and video multimedia chip that can quickly perform the self-testing function* without the need to consume a large number of gates in the system. SUMMARY OF THE INVENTION The present invention provides an audio-visual multimedia wafer that solves the underlying problems of the prior art. Unlike the traditional design approach, the audio-visual multi-media chip described here does not emulate the HDCP key authentication function, thus avoiding the large number of gates consumed by the inspection function. Moreover, it is also possible to have a faster ® test rate, which may reduce the cost of renting a test lab. In one embodiment, an audio-visual multimedia chip is described herein, comprising 20-memory memory having a specific set of strings; a system wafer including an inspection function block having a reference a value configured to receive the particular string of the group in the memory and perform an operation on the reference value and the received string of characters to obtain an operation result; a bus having at least a wire connecting the memory and the system 25 pieces, configured to transfer the set of specific strings in the memory to the system wafer; and an interface coupled to the system wafer, configured to The result of the 201040874 calculation is provided to an inspector; wherein the inspector can know whether the at least one wire on the busbar is normally connected by the result of the operation. In another embodiment, an audio-visual multimedia chip is described herein, comprising: a memory having a specific set of strings; a system chip, 5 of which includes a register, the register configuration To receive and store the set of specific strings in the memory; a bus bar having at least one wire that connects the memory to the system chip and configured to transmit the set in the memory a specific string to the system chip; an external operator that can receive the particular string stored in the temporary buffer and can execute an operation program thereon, 10 to obtain an operation result; an interface, The system chip and the external computing device are connected to the external computing device, and configured to provide information stored in the temporary storage device to the external computing device; wherein the inspector of the device can learn the busbar by using the operation result Whether at least one of the wires is normally connected. In addition to burning a set of protected HDCP information into the memory of the AV multimedia film, the present invention additionally burns a specific string of characters into the memory, wherein the specific string of the group can be designated to be burned. Recorded in a specific location in this memory. For the memory purchased by the general industry, there is still a part of the idle space after the necessary information is burned, so the specific string of the group can be burned to the idle space without increasing the manufacturing cost. In an embodiment of the present invention, the specific string burned in the memory may be a graphic information, wherein the graphic information can display a solid graphic on the memory, so the design can be designed on the surface of the memory. Special symbol or trademark. This embodiment can achieve the function of checking the connection quality of the wires on the bus bar, and also has a simple anti-counterfeiting function. The present invention also includes a self-test method for inspecting the quality of wire connections between a system wafer and a memory, comprising: burning a specific set of 201040874 Ο Ο substrings in the memory; A reference value check function is performed on the system 3, and the check function block is used to check whether the received signal is positive 4; the system chip records the specific string in the memory, and the bus is on the bus At least one wire is taken from the memory; this check is performed on the data of this reference value; this check function box is a comparison result; the result of the comparison is transmitted to the outside of the video. Point, it is not the result of this comparison to (4), where the comparison of the two receivers is received from this contact and displayed to the inspection operator. The method also includes an audio-visual multimedia chip detection device. The operator-side audio multimedia chip detecting device has an interface, an external memory audio and video multimedia chip, which includes a chip having m and has a temporary storage. And connecting the memory to the system t. The system wafer is routed to the memory via the ® stream (4). The step package = request to specify the memory - a specific read requirement ': by:, (4) This information is here to the register: the person here" The external operator reads this information through this interface; to this temporary storage: the operation program to get an operation result: where: the operator execution body: if the row Has been normally connected to the system crystal, its large = good can be dispersed _ stored in this memory, and therefore, although the invention adds this surname on the memory plus manufacturing cost 'at the same time can be omitted: The time required for a 'string' but not for a particular string can be much smaller: pass: the time required to check the second time in this particular position is 201040874. And 'because this particular string can be Wafer manufacturers design their own, Therefore, it can be counted as a graphic or any kind of trademark, so a mark can be hidden to increase the difficulty of plagiarizing the circuit layout design. 5 [Embodiment] Figure 2 is a simplified block diagram 'Description An audio-visual multimedia chip 200 according to the present invention. As shown in the figure, the audio-visual multimedia chip 200 includes a memory 202, a bus bar 204, and a system chip 206. If the audio-visual multimedia chip 200 ίο is used for the transmission end, For example, the player chip 206 includes an HDMI transmitter 208; if the AV multimedia chip is for a receiving end, such as a television, the system chip 206 includes an HDMI receiver 2〇8. In this embodiment The HDMI specification is exemplified, but is not limited to the HDMI specification transmitter or receiver. The memory 202 includes a set of HDCP keys 112 and a set of 15 specific strings 214. The system chip 206 can be a system. Single chip (System_〇n Chip, SOC), which is designed for digital home audio and video applications, such as digital media players, digital photo players, and TV displays. Applications, DVD players, MP3 players, PDAs, camcorders, car navigators (carnavigat〇rs), 20 network & control cameras (iPCam/SecurityCam), wireless media compression transfer boxes (Wi-Fi Media Pump) And a video transcription system (Vide 〇 Transc〇der). In some embodiments of the invention, the set of specific strings 214 are located at a particular address within the memory 202. In some embodiments, The memory system is ^12B EEPROM, and the specific word 214 of the group can be located at the front end, the end of the memory 25, or dispersed in certain specific positions. This set of specific strings 214' may, in some preferred embodiments, be 8 to 32 Bits in size. In another embodiment of the present invention, the specific string 214 burned in the memory 2〇2 can be converted into a graphic information by using an appropriate code, so that a special symbol can be hidden in the memory 202 or trademark. In some embodiments, the memory system used in the present invention uses a non-volatile 5 non-volatile memory (NVM), which includes a mask read-only memory (Mask ROM), which can be programmed. Read-only memory (prom), erasable programmable read-only memory (EPR0M), electrically erasable programmable read-only memory (EEPROM), and flash memory. For the bus bar 204 connecting the memory 202 and the system chip 206, 10 may be an Inter 2 2 bus (Inter Integrated Circuit Bus), a Microwire bus, a Serial Peripheral Interface (SPI) bus, or any of them. The bus bar 204 of the system chip 206 and the memory 202 can be serially connected. In accordance with some embodiments of the present invention, memory 202 can be a 15 EEPROM and a particular string 214 therein can be designated for programming at a particular location within memory 202. For EEPROMs purchased by the general industry, there is still a part of the idle space after the necessary information is burned, so the specific string 214 of the group can be burned to the idle space without increasing the manufacturing cost. In one embodiment of the invention, the set of particular strings 214 is a message of size 288 Bits and is programmed on an EEPROM of size 512 Bits, and the particular string 214 is Burn in the remaining space of this EEPR〇M. The manufacturer designs 25 an inspection function block 210 on the system wafer 206 in accordance with an embodiment of the present invention. The check function block 210 is configured to read the specific group string 214 in the memory 202 through the bus bar 204', and then perform the 201040874 operation to obtain an operation result, wherein the operation result can indicate whether the wire is normal. connection. In a preferred embodiment of the invention, the check function block 210 can be a comparator or a shift signature. The check function block 2 can receive the set of specific strings 214 in the memory 202 through the bus bar 204 and perform an operation to check whether it has received the correct set of the specific string 214 to check the bus bar 204. Is the connection of the wires inside correct? The check function block 210 includes a reference value 216 which is determined by the size and position of the particular set of strings 214. The comparator or signature mechanism is designed to operate on the received information to obtain an operation result. Check if the result of this operation matches this reference value 216 to check if the received string 214 is correct. The size of the reference value 216 required in the embodiment in which the signator is used is smaller than the embodiment using the comparator. However, implementing this signature on system wafer 206 requires a more complex circuit and requires a greater number of gates than the number of gates required to implement the comparator. Referring to Fig. 3, in accordance with an embodiment of the present invention, a simplified block diagram is used to describe a device for detecting a multimedia chip. The device uses a register 310 instead of the check function block 210 shown in Fig. 2, and adds an external operator η# coupled to the register 31A. The device 330 includes an audio-visual multi-sister 栌 ^ ΛΛ . . . 曰 媒体 media day 300. An audio-visual multimedia chip and a system chip 306. The memory 2〇2 contains a set of HDCP keys 112, and a set of specific strings 214. In addition, if the audio-visual multimedia chip 3 is used for the transmission end, such as a player, the system chip 306 includes an HD1UT / Kui * / ν Sun leisure reduction (10) such as : transmission benefit 308; if the audio and video multimedia chip is used to receive the knowledge, such as a television, the system chip 3

Receiver 308. In this embodiment, the Sun·, 1 03 1U HDMI specification is taken as an example, but is not limited to the transmission of the 2010/2010 HDMI specification, or the interface is configured to receive and store the temporarily stored string. call. The set of J in the audio and video multimedia chip 3 〇〇 C has at least one wire connected to the ^ 3 a bus bar 204, 5

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And configured to transmit this note: 02 and the system die 306, the system die 306. The specific string m of the level in the hidden body 202 is up to this point, and the set 330 further includes an external operator part operator 314 to receive the temporary; the "face" 312. the outer 214, and the tfH... The stored specific string 2i4 is stored and executed by a program to obtain a face=connect the system chip 3〇6 and the external operator is different: the information stored in the register 31G 2M is provided to the external computing device - wherein: an inspector can learn from the result of the operation whether the at least one wire on the bus bar 2〇4 is normally connected. The invention also includes providing an inspection. The resulting method of operation, in accordance with an embodiment of the present invention, may indicate whether the busbars on an AV multimedia wafer are properly connected. Please refer to Figures 4 and 5, which are respectively described in accordance with the present invention. The operation flowchart of the audio-visual multimedia chip 200 described in FIG. 2 and the audio-visual multimedia wafer detecting device 33 described in FIG. 3. Please refer to FIG. 4 again, which uses a comparator or a Signature An embodiment of the functional block is now examined. This flow diagram begins at block 302. In block 400, system wafer 206 is activated, and by bus bar 204' it sends a read request to memory 202, which reads The request specifies a specific address in the memory 202. Assuming that the wires on the bus bar 204 are normal, the read request can be correctly sent to the memory 202. In block 402, the memory 202 is based on the read request. The designated bit 12 25 201040874 address, output a set of strings 214 on the address, which are sent back to the system wafer 206 by wires on the bus bar 204. If any of the wires on the bus bar 204 have an abnormal condition, then This reading request may not be correctly delivered and the wrong address may be specified. The information transmitted back to the system chip 2〇6 may be incorrectly transmitted during the transmission, or both of the above cases may occur simultaneously. If the reading request is not caused by the wire failure, the memory 202 may not send the information, so that the system chip 206 receives a set of information that is all, 〇, and value. If a wire on row 204 is broken, then the wire will continue to be sent, 〇, 〇. 10 In block 404, the information transmitted back to system wafer 206 is then sent to inspection function block 210 for a The check function block 210 loads a reference value 216 and compares the reference value 216 with the information received by the function block 210 from the system wafer 206 by checking the comparator or signature in the function block 210. The function block will produce an operation result, which may be, for example, a signal of "1" or ''0', indicating whether the reference value is the same as the received information. At block 406 'System Chip 206 receives the result of the calculation from the inspection function block 210, and transmits it to a contact outside the video multimedia chip to send the result of the nose to the wafer manufacturer, and the wafer manufacturer can use the operation node 20 It is known that the connection quality of the wires on the bus bar is normal, and the purpose of self-detection before the package is achieved quickly. Please refer to FIG. 5, which is a flow chart showing the operation of the audio-visual multimedia wafer detecting apparatus according to another embodiment of the present invention, which is as shown in FIG. The initial steps of the flowchart of Fig. 5 are similar to the flowchart of Fig. 4, and the same steps in Fig. 25 are indicated by squares of the same numerals. However, in FIG. 4, blocks 404 and 406 are replaced by blocks 504, 506, and 508; that is, flowcharts 13 201040874 are from block 400, block 402 to block 504, and finally block 508. In block 504, the string 214 of the set that is sent back to the system chip is then loaded and stored in a register. In block 〇6, an external operator 314 reads 5 the string 2M stored in the temporary register 310 by means of an interface 312. And in block 508, the external operator performs an operation by using a software to obtain an operation result to check whether the information stored in the temporary register is correct, so that the self-detection before packaging can be achieved.在 胄 ' ' Within the spirit and scope of the present invention, as described below, 'therefore, those skilled in the art should be able to readily apply the concepts and embodiments of the present invention for designing or modifying others. The architecture is used to achieve the same function as the purpose of the present invention. [Simple description of the diagram] 15 ❹ 20 ^ 1 The diagram is a generalized diagram depicting the traditional self-checking circuit design. The -k, 2 diagram is a generalized diagram of an audio-visual multimedia chip according to the present invention. Figure 3 is a generalized illustration of a seed wafer inspection apparatus in accordance with another embodiment of the present invention. Figure 4 is a flow chart showing the operation of the check function block in accordance with the present invention in the form of a taste 11 or a signature. According to the present invention, the block system is based on the knowledge flow chart of the temporary storage (four) inspection function. 14 25 201040874 [Description of main component symbols] 100: AV multimedia chip 102: Memory 5 104: Bus bar 106: System chip 108: HDMI transmission/receiver 110: HDMI receiver/transmitter Ο 112: HDCP key ίο 200: Video Multimedia Chip 202: Memory 204: Bus Bar 206: System Chip 208: HDMI Transmitter/Receiver 15 210: Check Function Block 214: Specific String 216: Reference Value ° 300: AV Multimedia Wafer 306: System Wafer 20 310: The register 314: the external computing unit 330: the audio-visual multimedia chip detecting device 400: sending the reading request 402: the information is sent back to the second 404: generating the operation result 406: indicating the connection quality 15 201040874 504: storing the register 506: information Send to external operator 508: perform an operation and indicate the result

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Claims (1)

201040874 VII. Patent application scope: 1. A video multimedia chip with self-test function, comprising: a memory having a specific set of strings; 5 a system wafer comprising an inspection function block, the inspection function The block has a reference value configured to receive the set of specific strings in the memory, and perform an operation on the reference value and the received set of strings to obtain an operation result; Having at least one wire connecting the memory and the 10 system wafer, configured to transfer the particular set of strings in the memory to the system wafer, wherein the system wafer is operated by the operation As a result, it can be known whether the at least one wire on the bus bar is normally connected. 15. The audio-visual multimedia chip of claim 1, wherein the check function block is a comparator. 3. The audio-visual multimedia chip of claim 1, wherein the check function block is a signature device. The audio and video multimedia chip of claim 1, wherein the specific string of the group may be 8Bit to 32Bit. 5. The audio-visual multimedia chip of claim 1, wherein the 25 memory can be an electrically erasable programmable read only memory (EEPROM). The invention relates to the audio-visual multimedia chip of claim 1, wherein the specific string of the group can be stored in the memory in a distributed manner. 7. The audio-visual multimedia chip of claim 1, wherein the operation result is provided to an inspector by an interface coupled to the system chip. 8. A video and audio multimedia wafer detecting device having a test function, wherein the video and audio multimedia wafer detecting device comprises: 10 an audio and video multimedia chip, comprising: a memory having a specific set of strings; a system wafer, The method includes a register configured to receive and store the specific set of strings in the memory; a bus bar having at least one wire connecting the memory and the system chip, and configuring To transmit the particular set of strings in the memory to the system chip; 15 - an external operator that receives the particular set of strings stored by the register and can perform an operation on the set a program to obtain an operation result; an interface connecting the system chip and the external operator, and configured to provide information stored in the register to the external operator. The audio-visual multimedia chip of claim 8, wherein an inspector can learn whether the at least one wire on the busbar is normally connected by the operation result. 10. The audio-visual multimedia chip of claim 8, wherein the set of specific strings can be from 8 Bit to 32 Bit. 18 201040874 201040874 Ο 15 〇 25 π·1 Please refer to the audio-visual multimedia chip described in claim 8, wherein the memory can be an electrically erasable memory (EEPROM). 12. The audio-visual multimedia wafer of claim 8, wherein the particular set of sub-strings can be stored discretely in the memory. 13. A method for providing an inspection result of an audio-visual multimedia chip, wherein the audio-visual multimedia chip has a system crystal connected by a bus bar. The hidden system of the system includes: a check function block, the check function block further includes a reference value, and the method includes: a method for sending a read to the memory via the bus bar Requiring that the read request specifies information in the memory-specific address; the memory returns the information to the check function block; and checks the function of the block_reference value and the information to an operation result; The result of this operation can indicate whether the bus bar has been normally connected between the system chip and the memory. The method for providing the test result described in the thirteenth item of the specification, M = ° κ may be the content of a specific string stored in the memory and its address. Bamboo < J Yujia 07 Second=Part 19 201040874 16. The method for providing an inspection result according to claim 13 of the patent application, wherein the inspection function block is a signature device. 17. The method of providing an inspection result according to claim 13 of the patent application, wherein the memory can be an electrically erasable programmable read only memory (EEPROM). 18. The method of providing a check result as described in claim 13 of the patent application, wherein the specific string of the group may be 8 Bit to 32 Bit. 10 19. The method of providing an inspection result according to claim 13, wherein the set of specific strings can be stored in the memory in a distributed manner. 20. The method of providing inspection results as described in claim 13 of the patent application, 15 which provides an operation to an inspector by being coupled to an interface of the system wafer. The operating method of the audio-visual multimedia wafer detecting device, wherein the audio-visual multimedia wafer detecting device has an interface, an external computing device and a 20-audio multimedia chip, which comprises a memory, a system wafer, a register, a memory bus and the system chip and having a bus bar of at least one wire; and the method includes: the system chip sends a read request to the memory via the bus bar, the read request Specifying information in a specific address in the memory; 25 the memory sends the information to the register via the bus; the interface is coupled to the register; 20 201040874 the external operator reads through the interface Taking the information; the external operator executes an operation program to obtain an operation result; wherein the operation result indicates whether the bus bar is normally connected between the system chip and the memory. 5. The method of operating an audio-visual multimedia wafer inspection device of claim 21, wherein the information is the content of a particular string stored in the memory and its address. The operating method of the audio-visual multimedia wafer detecting device of claim 21, wherein the memory can be an electrically erasable programmable read-only memory (EEPROM). 24. The method of operating a multimedia multimedia wafer inspection device of claim 21, wherein the set of specific strings can be from 8 Bit to 32 Bit. The method of operating an audio-visual multimedia wafer detecting device according to claim 21, wherein the set of specific strings can be stored in the memory in a distributed manner. twenty one