TW201040288A - A powder form chemical compound to purify molten solders with its application tools and utilization methods - Google Patents

Abstract

A powder form chemical compound to purify molten solders with its application tools and utilization methods, may melt and form an active chemical compound liquid layer on molten solder surfaces of a solder-pot running temperature within the production scale (230 DEG C to 275 DEG C ). The powder form chemical compound may form an active chemical compound liquid layer on a molten solder surface by real-time and In-line, it may continuously absorbing and wrapping Impurities on molten solder surfaces, virtually stops formation of the Dross along with minimizing formation of oxide solder, further more it may also reducing solder consume volume on welding points of the PCB, and makes total solder consume volume drop 65 to 80% based on same product model with same production quantity.

Description

201040288 . VI. Description of the invention: [Technical field of the invention] A synthetic chemical powder capable of purifying molten tin and its application and a method of using the method for purifying a tin-rolled tin of a wave soldering furnace, especially a kind After being added to the surface of the molten tin, it has an active compound to clean the surface of the molten metal on the surface of the molten tin, and continuously separates the dross (tin oxide or infusible). The tin and the impurities in tin, 〇xide solder or Dross) and immediately absorb the separated impurities to absorb the synthetic chemical powder of the purified tin bismuth. [Prior Art] Soldering tin crucible welding method and equipment are applied to production technology and industrial fields such as printed circuit board (PCB), electronic components, printed circuit board assembly (pcBA), etc. before the Second World War. It has been used, and after World War II, it has been widely used in the global military and people's livelihood electronics industry due to the vigorous development of related science and technology. Relevant technologies and equipment have been continuously evolved and improved to adapt to the layout of printed circuit boards. Minimization of components, and the need to improve reliability and circuit function complexity, while wave soldering and its soldering technology are more important for stable quality, mass production of printed circuit temple anti-assembly and electronic component soldering. The peak of the soldering equipment | history has been more than 30 years, manufacturing representatives such as: the United States ElectrQvert, Japan Chuntian τ reward na, Sakamoto Koki Japan Yoshida, Taiwan Super Electronics, Taiwan Nisshin Electric. Machine, German mronics Soltec, Canada c〇fin, Singapore 4 201040288 CEM, He « Harris and other companies; at the same time, in order to reduce and improve the peak tin Tin fishing (tin oxide, insoluble kicking, (four) (6) heart & Dross), the loss of solder consumption and the negative impact of poor solder quality in the operation of the furnace are also related to the introduction of "melting tin powder purification powder" or the same nature 'Mixed liquid' 'The slag of these chemicals and the self-fluxing tin slag is removed, and the impurities and tin in the dross are separated to facilitate the recovery of the molten tin; another way of implementation is These chemicals are directly poured into the molten tin surface to directly separate the impurities and molten tin in the tin slag. The representative manufacturers of this type of molten tin bismuth cleaning powder and solution are as follows: Alfa Metals, USA, Tamuna, Japan, Kester, USA Qua! Itech, Singapore pmi and other companies. However, the conventional formula of the powder and solution for melting tin and antimony is not high in the separation and recovery of impurities and molten tin in tin dross (tin oxide, non-melting tin), and its general tin saving. It is only about 22%~42%. Therefore, the economic benefits are low, so it is not widely used in the peak production line of Bofeng tin. Most users use the direct sales of tin fishing back to tin supply. "The price of tin slag is about 6〇% of the original tin price is recovered by the tin supplier." Very few users use the Solder recovery system (SRS) for tin slag (tin oxide, non-melting tin). Impurities and tins are recovered, and the tin recovery rate can be increased to about 45% 'but the price of SRS equipment and the cost of operating consumables are added to the cost calculation', then the recovery amount will be much lower than the direct sale of tin slag back to Tin supplier. Please refer to "Figure 1", which shows the operation of a conventional tin furnace. 5 201040288 Schematic diagram 'As shown in the figure 'When a tin furnace 10 is in normal operation, impurities 2〇 will gradually form' The impurity 20 includes a tin slag and a non-sinter solder layer (Oxide solder & Dross Layer). When the normal tin furnace 10 is in operation, the impurity 20 will only float on the 301 surface 301 of the molten tin , 30 because of the lower specific gravity and lower quality impurities. The 20' is suspended in the surface 301 of the dissolved tin gun by a radical molecule. Since these impurities contain a large amount of "tin oxide" and "tin powder", they have a mutual affinity with the molten tin. The new synthetic molecules formed by the conversion of the affinity or the conversion of the pseudo- or Temperary Catalist between the molten tin molecules are generally referred to as "tin slag and non-melting tin (〇xide s 〇lder &

Dross)"" is the impurity 20; as described above, the cause of the formation of the impurity 2〇 mainly includes: (1) "tin ash" generated after oxidation of the tin-bismuth 30; (2) within the original molten tin 30 Impurities contained, such as "sweet soil"; (3) oxidized metal due to temperature difference; (4) residue formed by flux; (5) impurities on the tinned side of printed circuit boards; (6) molten tin Toner or the like which is generated by friction when the calcination 30 flows. As above, if the tin furnace 10 is melted into a molten tin by a new tin material, the phenomenon of the impurity 20 is slight in the first hour. However, practical experiments have also confirmed that the speed and efficiency of the impurity 20 are It is proportional to the amount of impurities contained in the molten tin. Therefore, if the impurity content of the tin-melting crucible is too high, after the tin furnace 10 is operated for the second hour, the impurities are 2 〇 (tin slag and non-melting tin layer). The thickness of the solder is almost equal to the proportion, so the users of the wave soldering furnace must be 6 201040288. The maintenance personnel must remove the impurities 20 (slag and non-melting tin) once every two hours. In addition, in general, the tin content in the tin slag averages about 95% of the total weight 'but the tin supplier's recycling price is only 60% of the value, thus causing the user to lose about 35% of the additional tin consumption; The tin slag and the non-melting tin layer generated during the operation of the tin furnace are a hardened layer, which often causes a collision between the PCB trolley and the product, and because the content of the mixed tin in the molten tin is too high, This leads to problems such as a decrease in Lubricati〇n scale, an increase in roughness scale, and an increase in Viscosity scale, and the weldability of such a high-mass fused tin bismuth is very high. Poor; please refer to "Picture 2" for further matching. The figure shows the molecular crystal phase alignment photo after the surface of the solder joint of the soldering furnace of Xizhi soldering furnace is magnified 500 times, as shown in the figure, due to the tin melting If the impurity content of 3〇 is too high, the surface of the solder joint will be rough, and the solderability of the metal surface and the inner layer will be very poor, which will lead to false soldering, void soldering, incomplete soldering, bridge bridging, and tin tip after soldering. Poor welding, such as icicles, also makes the peaks The cost of this PCBA success or failure process has also increased; in order to improve this phenomenon, most engineers and technicians can only continuously increase the production temperature of tin, but the result of continuously increasing the temperature of tin production will result in the immediate production of parts and PCB materials. Sexual damage, in this way, reduces the overall price of the product, and may even result in defective product returns and derivative compensation costs. SUMMARY OF THE INVENTION In view of the above problems, the present inventors have been able to find out more suitable for the research and analysis of the correlation between the generation and the suppression of dross in the phase 7 201040288 • (4) experience. Solution; the main purpose of the present invention is to provide a kind of purifying molten tin which can save the amount of tin, reduce the temperature of the tandem joint and improve the reliability of the soldering product f, and the soldering yield of the (four) liter product. Chemical powder and its application fixture and method of use. In order to achieve the above object, the inventors have mixed a plurality of compounds to prepare a synthetic chemical powder for purifying molten tin, which is added to the molten tin and can be immediately applied to the molten calcined surface. Real-time (In-1 ine) forms an active compound to purify the radiant surface and continuously separate the tin and impurities in the tin slag (tin oxide or non-solder tin, 〇xide s〇lder or Dross) The impurities to be separated are absorbed and coated to achieve the effect of purifying tin smelting', thereby increasing the recovery rate of tin. In order for your review board to clearly understand the composition of the present invention and its efficacy after implementation, please refer to the following instructions for matching. D [Embodiment] When the normal tin furnace is in operation, only when the product is manufactured in the wave soldering furnace, the impurities will be generated and gradually increased, and the impurities include: tin oxide (tin ash), oxidation Various types of metals, flux residues, various impurities on the surface of the PCB, and carbon powder generated by the friction of the molten tin due to circulation, so that these impurities can be classified as "the main cause of deterioration of the quality of the molten tin". Moreover, these impurities will continue to increase in the operation of the wave soldering furnace. Even after the wave soldering furnace operates for one hour, it will increase by 8 201040288 _ geometric multiples. Therefore, the most fundamental solution is to make the impurities quickly and effectively. Wrap, and this process must be continuous. The synthetic chemical powder for purifying molten tin bismuth according to the present invention, the application jig thereof and the method for using the same, wherein the synthetic chemical powder (referred to as A0P-22S) for purifying molten tin bismuth has the inside of the slag The ability to separate impurities from molten tin, and at the same time have the ability to quickly coat the separated impurities, which are at least mixed by several chemical substances shown in the following list, and their names and weight ratios are, for example, "3rd. As shown in the figure, it is a list of the composition of the chemical substances of the present invention. Please refer to the figure. The composition of the synthetic chemical powder for purifying molten tin as described in the present invention mainly includes: Acid hydrogen bond Ammonium Bicarbonate, Ammonium Chloride, Boric Acid, Calcium (II) Chloride, Calcium Dichlorate, Cellulose Hydride, Diaminomethanal, Epsomite, adipic acid

Hexanedioic Acid, Oxidized Town Magnesium Oxide, Penic Acid ◎ Oxoborinic Acid, Brominated Potassium Bromide, 奸铭蓉

Potassium Aluminium Sulfate, Saccharin, Salicylic Acid, Silver(II) Silver(II) Fluoride, Sodium Acetate, Sodium Carbonate, Sodium Chloride, Sodium Hydrogen Carbonate, Acid Breaking Sodium Nitrate, Sodium Nitrobenzene Sulfonate, Zinc • Chloride, Zinc Sulfide, etc.; as described above, the chemical powder of 201040288 molten tin can be purified in airtight bags and chambers. Under the condition of temperature, it is in a state of soft powder. When the powder is poured on the surface of the molten tin which reaches the production temperature (23〇C~275°C), the powder will melt into a bismuth state and be melted in the surface. A layer of purified synthetic chemical material is formed thereon, and the physical properties of the purified synthetic chemical hydrazine (hereinafter referred to as "purified hydrazine") are as follows: (1) S·G specific gravity < 3 '(specific gravity of molten tin gun > 7 < 9, Therefore, the liquid can be floated on the surface of the molten tin and will not sink. (2) The pH is between 3. 5 and 5. 5; (3) Liquid form (Liquid form (10) spi; (4) Production temperature (23 0 °c~275 r ) no smoke on the molten tin surface; (5) no odor; (6) no evaporation and no volatilization; (7) complete separation of tin and non-melting tin impurities and molten tin And the coating can be continuously coated continuously; (8) completely soluble in water, so the purified liquid mud which is absorbed from the surface of the molten tin and absorbed by the impurity can be completely separated after soaking in water; 9) Completely free of controlled substances, in line with the latest regulations of international environmental protection (RoHS, PFOS, REACH) up to 2 西 BC; (1 〇) stable temperature difference obtained by purifying the thermal insulation coefficient of the enamel layer on the molten tin surface >15°C 'Therefore, there is an opportunity to block the loss of heat of the molten tin and the contact of the air to the night of the molten tin to cause oxidation of the metal. As described above, the chemical agent for purifying the molten tin as described in the present invention is j 201040288 - After dissolving the tin liquid surface, it will melt into a sputum state, and the chemical agent system which can purify the molten tin liquid will form a purification calcination (hereinafter referred to as purifying hydrazine), which has a polymer, a weak acid, a low specific gravity, and a low viscosity. And high-efficiency separation of impurities and coating of impurities, special synthesis of molecules, so can be quickly and completely divided Tin slag, and all impurities and tin in the non-melting tin, and can be continuously coated with impurities, and since the composition of the present invention is mostly a polymer material, there is a monthly b force to absorb several times the volume of impurities, Therefore, it has the characteristics of continuous long-term reaction. Ο Please refer to “Fig. 4”, which is a schematic diagram of the initial implementation of the process of the present invention. As shown in the figure, a spacer 4 is used around the tin port 401 of a wave soldering furnace 40. After the 〇2 is enclosed, it is immersed in the molten tin surface 501 of the molten tin 50 to a depth of about 5ππη~150mm. Further, the tin-plating opening 401 can be a single-spray tin or a double-spray tin. After the chemical powder 6 of the purifying tin-smelting agent of the present invention is put into the wave soldering furnace 40, the production temperature is 23 ITC 275. (: The molten tin 烺 50 is contacted, and the chemical powder 6 可 which can be purified after melting is formed to form a clean 烺 601, and the clean 烺 601 is blocked at the isolation frame 402 and the squirting port 401 at this time. In addition to the molten tin surface 501, the cleaned crucible 601 is prevented from being present on the molten calcined surface 501 in the isolation frame 402 of the tin-plating port 401, thereby preventing direct impact and contact cleaning of the tin-bismuth flowing out of the tin-plating port 401. , and part of the purifying bottle 601 is pulled into the tin stream and enters a pump 403, and then flows out of the tin-plating port 401. And the tin-plating port 401 of the wave soldering tin 40 oscillates downwardly, which will cause impurities 502. Take out the isolation frame 402, and then float up to the molten tin surface 5 01 and be covered by the purification 掖 6 01. At this time, the impurity 11 201040288 502 (the tin slag and the non-melting tin layer) will be quickly replaced by the purification 烺 601 Referring to the figure, the molten tin which is flowed down from the tin port 401 of the wave soldering furnace 40 is calcined 50, and then received by a rectangular tube 404, and then the molten tin 50 is guided from both sides to receive the tin.烺From the tin stew surface, the depth of 5 Li ~ 150 Li flows to the Crest Tin Furnace 40 to prevent the molten tin 烺 50 from directly impacting and contacting Purify 烺 601 ' and pull part of the purification 烺 601 into the tin flow, enter the pump 403, and then flow out through the tin port 401, and the tin flow that is impacted downward by the tin-plating port 401 of the wave solder pot 40 will The impurity 502 is taken out to the outside of the rectangular tube 404, and then floats up to the molten tin surface 5〇1, and is covered by the purified crucible 601. At this time, the purifying crucible 601 functions, and the impurity 5〇2 (slag and no The molten tin layer is quickly replaced by the cleaned 烺 601. Refer to the “figure 5”, which is a schematic diagram of the maturity of the implementation process of the present invention, as shown in the figure 'Burn the tin furnace of the wave soldering furnace 4〇1 is surrounded by the isolation frame 402, and is not inserted into the surface of the tin-bismuth surface 5〇1 about 5mm~15〇mm, so that the present invention and the production temperature reach 23 (TC~275. (: after the molten tin 烺 50 contact, Melting into purified crucible 6〇1, and being blocked outside the insulating frame 4〇2 and the molten tin surface 501 of the squirting tin port 401, preventing the purification 煨6〇1 from being melted in the isolation frame 402 of the tin-filling port 401 On the 5烺1 surface of the tin crucible, prevent the molten tin 烺5〇 flowing out of the tin-plating port 401 from directly impacting and contacting the cleaning crucible 6〇丨 and pulling part of the purifying crucible 601 into the tin stream to enter the gang Pu 4〇3, and then flow out from the tin-plated port 401' and the tin-spinning tin furnace 4〇 spray tin σ 4〇1 downward impact of the tin flow, the impurity 502 will be taken out of the isolation frame' and then floated to the tin The liquid surface 5〇1 is coated with the purified crucible 601. When the main function of the present invention reaches the maturity stage, the principle of the action process is as shown in the figure, 12 201040288 • After the purification liquid 601 functions to reach the maturity stage The molten tin calcined 50 reaches ultra-pure. Net, high weldability and low production temperature state, the total amount of tin can be saved by 65%~80%. In addition, as shown in the figure, the molten tin crucible flowing down the nozzle 401 of the wave soldering tin furnace 40 is taken up by the above empty rectangular tube 4〇4, and then the molten tin crucible 50 is discharged from both sides of the outlet. The depth of about 5 to 15 煨 at 5〇1 of the kneading surface flows into the wave soldering furnace 40 to prevent the molten tin solution 50 from directly impacting downward and contacting the purification crucible 601 (AOP_22S), and partially purifying the crucible 6煨1 〇 pull in the tin flow, so that the purification 煨 601 enters the pump 403, and then flows out of the tin port. When the tin port 401 strikes the tin flow downward, the impurity 502 is taken out of the rectangular tube 404. Then, it floats up to the surface of the molten tin, 5〇1, and is covered by the purified crucible 601. When the function of the purified crucible 6〇1 of the present invention reaches the maturity stage, the molten tin crucible can reach ultra-pure and high. Solderability and low production temperature conditions, the total amount of tin can be saved by 65~8〇%.凊 Refer to “Fig. 6”, which is a photomicrograph of a molecular crystal phase magnified 500 times the surface of the solder joint of the tin-bismuth solder product after application of the present invention, as shown in the figure, as claimed in the present invention. The chemical agent for purifying the molten tin is melted into a purifying state, and after it reaches the maturity stage, the molten tin can be made into a state of ultra-pure 'high weldability and low production temperature, and the molten tin is sprayed. The appearance of the tin mouth will be dazzling like a mirror, and the appearance of the solder joint, as shown in this figure, the crystal phase alignment (Crystal Phase Array) is a perfect straight line, representing the excellent solderability of the molten tin. (Perfect solder_AbiUty); please refer to "Fig. 7", which is a schematic diagram of the average thickness of the solder joint flat 13 201040288 during the operation of the conventional tin furnace. As shown in the figure, the conventional tin furnace is running, SAC3〇5 AU〇 y average solder joint thickness (265 ° C) 2839 u Inch ~ (230 ° C) 3405 u

Inch; please refer to "Figure 8" again. The figure shows the average thickness of the solder joint after applying the present invention. It is not intended to be as shown in the figure. When it comes to maturity, SAC3〇5

The average thickness of Alloy solder joints is approximately (265. 〇1228~(23(TC)1287 u

Inch, this is enough to prove that after applying the invention, the non-melting tin (Dr〇ss) can be completely produced, and the loss of tin oxide is at least 〇·〇5%, and the amount of solder used in various forms is effectively reduced by 25 ~55%, and the total amount of tin can be saved by 65~80% under the same production conditions of the same product. As described above, the purifying molten tin crucible referred to in the present invention can be completely separated into all impurities and tin in the tin dross and the non-melting tin after being melted into a clean state, and the impurities can be immediately sustained. When the coating is not saturated, when the purification and absorption of the coated impurities reaches a saturation level, the saturated purified sputum is removed, and the chemical agent for purifying the molten tin is re-added to re-melt the fresh purified sputum to maintain the purification. The effect of melting tin. In summary, after the implementation of the present invention, it is indeed possible to provide a chemical which can save the tin amount, reduce the soldering temperature and improve the reliability of the soldering quality, thereby improving the soldering yield of the product. The purpose of the agent. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any change and modification made by those skilled in the art without departing from the spirit and scope of the invention. All should be covered by the patent of the present invention. 201040288 In summary, the effect of the present invention is in line with the "practicality", "novelty" and "progressiveness" of the patent application requirements; the applicant filed an application for an invention patent to the shackle in accordance with the provisions of the Patent Law.

15 201040288 [Simple description of the diagram], Figure 1 is a schematic diagram of the operation of a conventional tin furnace. Fig. 2 is a photomicrograph of a molecular crystal phase after a 500-fold magnification of the solder joint surface of a conventional soldering furnace. Fig. 3 is a chart showing the composition of the chemical substance of the present invention. Figure 4 is a schematic view showing the initial stage of the implementation of the present invention. Figure 5 is a schematic diagram of the maturity of the implementation process of the present invention. Fig. 6 is a photomicrograph showing the alignment of the surface of the solder joint of the tin-bismuth solder product after the application of the present invention. Figure 7 shows the average thickness of the solder joints during the operation of the conventional tin furnace. Fig. 8 is a diagram showing the average thickness of solder joints after the application of the present invention. [Main component symbol description]

10 Tin furnace 20 Impurity 30 Dissolved tin solution 301 烺 surface 40 Crest tin furnace 401 Spray tin 402 isolation frame 403 Pump 404 Over the rectangular tube 50 Dissolved tin 煨 501 Fused 煨 surface 16 201040288 502 Impurity 60 Purification of molten tin Chemical powder 601 purification stew

17

Claims (1)

201040288 . VII. Patent application scope: 1. A synthetic chemical powder capable of purifying molten tin, which can be added to the surface of molten tin crucible in a tin furnace. After dissolution, it has the effect of purifying the molten tin crucible. The chemical recovery of the amount of tin is: Ammonium Bicarbonate, Ammonium Chloride, Boric Acid, Calcium (II) Chloride, Gas and Acid ( Calcium Dichlorate), hydrated cellulose Cel lulose Hydride, urea (Diaminomethanal), Epsomite, Hexanedioic Acid, Magnesium Oxide, Oxoborinic Acid, Desertification Potassium Bromide, Potassium Aluminium Sulfate, Saccharin, Salicylic Acid, Silver (II) Si lver (11) Fluoride, Sodium Acetate, Sodium Carbonate (Sodium Acetate) Sodium Carbonate, Sodium Chloride, Sodium Hydrogen Carbonate, Sodium Nitrate, Sodium Nitrobenzene Sulfon Ate), Zinc Chloride, Zinc Sulfide. 2. The synthetic chemical powder for purifying molten tin bismuth according to claim 1, wherein each component of the synthetic chemical powder capable of purifying the molten tin is in a powder form. 3. The synthetic chemical powder for purifying molten tin as described in claim 1, wherein the proportion of the weight of the constituent material of the synthetic chemical powder of the purified tin resin is after mixing 0. 01 ppb ~ 98%. 18 201040288 4. The synthesis chemistry of the purifying tin bismuth described in the claim _ _ _ _ 丨 丨 叙 纟 纟 纟 , , , , , , , , , , , , , , 纟 纟 纟 纟 纟 纟 纟 纟 纟 纟 纟 可 可It is present in a hermetic packaging bag and is in a powder state at room temperature. 5. The synthetic chemical powder for purifying molten tin crucible according to claim 1, wherein the tin furnace for reacting the synthetic chemical powder of the fusible tin crucible has a single nozzle or a Any of the two spray nozzles. 6. The synthetic chemical powder for purifying molten tin as described in claim 5, wherein an isolation frame is disposed around the tin port of the tin furnace. 7. The synthetic chemical powder of the refinable molten tin crucible according to claim 5, wherein the molten tin crucible flowing from the spouting port is guided by a top and a rectangular shape, and then guided. The tin enamel is formed by the outlets formed on both sides of the rectangular hole in the upper space, so that the molten tin flows into the tin furnace from a depth of 5 to 150 mm of the surface of the tin. 8. A method for purifying a synthetic chemical powder capable of purifying molten tin, which can be used for purifying molten tin in a tin furnace, thereby increasing the recovery rate of the amount of tin, which comprises: the synthetic chemistry of the purifying tin After the powder is put into the tin furnace, a refreshing liquid of the active compound can be formed on the surface of the molten tin (Real-time, In-1 ine), and the liquid surface can be read and absorbed. The impurities suspended in the surface of the molten tin are covered. 9. The method of using the synthetic chemical powder of the smelable tin-melon according to claim 8, wherein the cleaning liquid produced by the method of use has a liquid surface thickness of 1 to 15 mm. The method for using a synthetic chemical powder for purifying molten tin as described in claim 8 wherein the thickness of the surface of the purified crucible produced by applying the method of use is one molecule. 11. The method of using the synthetic chemical powder of the thief-smelling tin bismuth according to claim 8, wherein the method of using the synthetic chemical powder of the thixotropy can be purified after the reaction is carried out The condition of calcining and absorbing impurities will gradually become saturated. When the saturated state is reached, the saturated purifying agent should be removed, and then the new chemical agent for purifying the molten tin can be poured to be melted. Form a fresh purifying plaque. 12. The method of using the synthetic chemical powder of the refinable molten tin as described in claim 8, wherein the synthetic chemical powder of the purifying molten tin is contacted with the molten tin and reaches a production temperature Under the condition, the chemical powder of the purifying molten tin stew can be melted into a molten state. 13. The method for using a synthetic chemical powder for purifying molten tin as described in claim 8, wherein the production temperature is a production temperature of the tin-melting in the tin furnace, which is maintained at 23 ° C. 275 ° C. 20