201039737 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子裝置，且特別是有關於一種 具電磁屏蔽及散熱之電子裝置及其組裝方法。 【先前技術】 近年來由於工商發達、社會進步，相對提供之產品亦 主要針對便利、確實、經濟實惠為主旨，因此，當前開發 ❹ 之產品亦比以往更加進步，而得以貢獻社會；在關於電子 產品方面，近年來業者不斷地開發出更經濟便利之電子裝 置供產品使用，使其作業與功效可達到事半功倍之運作。 為了防止電子裝置中的零件過熱，電子裝置中通常含 有散熱片來做散熱。然而，一般散熱片的面積太小，散熱 不佳；若將散熱片加大則會增加產品的面積。另一方面， 傳統的散熱片呈扇葉狀，容易輻射電磁波，難以防止零件 造成的電磁波干擾。 D 由此可見，上述現有的電子裝置，顯然仍存在有不便 與缺陷，而亟待加以進一步改進。爲了解決電磁干擾及過 熱的問題，相關領域莫不費盡心思來謀求解決之道，但長 久以來一直未見適用的方式被發展完成。因此，如何能在 電子裝置上達成電磁屏蔽及散熱之功效，實屬當前重要研 發課題之一，亦成爲當前相關領域極需改進的目標。 【發明内容】 201039737 因此，本發明之一態樣是在提供一種具電磁屏蔽及散 熱之電子裝置及其組裝方法。 依據本發明一實施例，一種具電磁屏蔽及散熱之電子 裝置包含底板、印刷電路板、電子元件、金屬遮蔽片與導 熱體。底板具有開口，電子元件設置於印刷電路板上，導 熱體配置於金屬遮蔽片上。印刷電路板配置於底板之上， 印刷電路板上的電子元件面對底板之開口。金屬遮蔽片固 定在底板下並覆蓋底板之開口，金屬遮蔽片上的導熱體面 〇 對底板之開口並接觸到電子元件。 依據本發明另一實施例，一種具電磁屏蔽及散熱之電 子裝置的組裝方法，包含下列步驟： (1) 將電子元件設置於印刷電路板之銲錫面上； (2) 根據電子元件的大小及電子元件在印刷電路板上 的位置，於底板形成開口； (3) 將印刷電路板配置於底板之上，並將印刷電路板 上的電子元件面對底板之開口；以及 〇 (4)於底板之下方，將金屬遮蔽片上的導熱體面對底 板之開口，使導熱體接觸電子元件，再將金屬遮蔽片固定 在底板下以覆蓋開口。 如此，導熱體將電子元件產生的熱量傳導至金屬遮蔽 片，由金屬遮蔽片把熱量散發到外界。另一方面，金屬遮 蔽片可屏蔽電子元件產生的電磁波。 由上述本發明實施例可知，應用本發明具有防治電磁 波干擾及散熱等優點。綜上所述，本發明之態樣所提供之 電子裝置及其組裝方法具有上述諸多優點及實用價值，其 201039737 =論在産品結構及功能上皆有較大的改進，在技術上有顯 著的進y並産生了好用及實用的效果，且相較於現有的 電子裝置具有增進的突出多項功效，從而更加適於實用， 並具有産業的廣泛利用價值。 以下將以各種實施例，對上述之說明以及接下來的實 施方式做詳細的描述，並對本發明進行更進一步的解釋。 【實施方式】 〇 為了使本發明之敘述更加詳1；與完備，可參照所附之 ®式及以下所述各種實施例，圖式中相同之號碼代表相同 或相似之元件。另一方面，眾所週知的元件並未描述於實 施例中，以避免對本發明造成不必要的限制。 本發明之技術態樣是一種具電磁屏蔽及散熱之電子裝 置’其可應用於各類電子產品，或是廣泛地運用在相關之 技術環節。值得一提的是，此電子裝置可兼具防治電磁波 干擾及散熱之功效。以下將搭配第1圖至第2圖來說明此 電子裝置之具體實施方式。 請參照第1圖，第1圖是依照本發明一實施例之一種 電子裝置100的剖面圖。如圖所示，電子裝置100包含底 板120、印刷電路板110、電子元件114、金屬遮蔽片130 輿導熱體132。底板120具有開口 124，電子元件114設置 於印刷電路板110上，導熱體132配置於金屬遮蔽片130 上。印刷電路板110配置於底板120之上，印刷電路板110 上的電子元件114面對底板120之開口 124。金屬遮蔽片 13〇固定在底板120下並覆蓋底板120之開口 124’金屬遮 6 201039737 蔽片130上的導熱體132面對底板120之開口 124並接觸 到電子元件114。 如此，導熱體132可將電子元件114產生的熱量傳導 至金屬遮蔽片130’由金屬遮蔽片130把熱量散發到外界。 另一方面，金屬遮蔽片130可屏蔽電子元件114產生的電 磁波。 實作上，電子元件114對應於底板120之開口 124中’ 使得印刷電路板110可更靠近底板12〇，藉以縮小印刷電 ❹路板110與底板120之間的距離，進而縮減電子裝置100 所占的體積。 上述印刷電路板110具有銲錫面111與元件面112,其 中元件面112相對於銲錫面hi相對。舉例來說，印刷電 路板110可為雙面板’其包括頂層（T〇p Layer)和底層 (Bottom Layer)兩層’兩層中間為絕緣層。雙面板兩面都可 以佈線，頂層一般為元件面112，底層一般為焊錫面ill。 印刷電路板110上的電子元件114設置於銲錫面111。 〇 另外’電子元件114可為晶片或一晶片組。實務上’銲錫 面111可用來設置有電磁波干擾問題及散熱差的電子元 件’以便於藉由導熱體132搭配金屬遮蔽片130來為此電 子元件散熱，以及利用金屬遮蔽片130來屏蔽電磁波；至 於元件面112可用來設置其他電子元件。 '上述底板120具有内表面121與外表面122，其中内 表面121相對於外表面122。内表面121面向印刷電路板 110，外表面122面向金屬遮蔽片130。另外，底板120的 材質可包含金屬，以便於增加散熱效率。實務上，底板120 201039737 可為機殼底盤、機殼底座或類似機構件。 上述金屬遮蔽片130可焊接於底板120,更具體而言， 金屬遮蔽片130可焊接在底板12〇之外表面122。實作上， 金屬遮蔽片130為鋼片或類似元件，其中鋼片的厚度可小 於底板120的厚度，藉以減少電子裝置ι〇〇所占的空間。 另外’上述導熱體132可為導熱片（Thermal Pad)或類似材 料，以便於為電子元件114導熱。 應瞭解到’雖然第1圖僅繪示一電子元件114與一開 ❹ 口 124，然此並非用以限制本發明，熟習此項技藝者應視 實際需要’彈性選擇電子元件114的數量，並可根據電子 元件Π4的大小、數量以及電子元件n4在印刷電路板n〇 上的位置，相應地於底板12〇形成一個或多個開口 124。 請參照第2圖’第2圖是第1圖之底板12〇與金屬遮 蔽片130的立體圖。如圖所示，利用點焊技術將金屬遮蔽 片130焊接在底板120下。因此，於金屬遮蔽片13〇上形 成數個焊點134。 ❹ 本發明之另一技術態樣是一種具電磁屏蔽及散熱之電 子裝置的組裝方法，其可應用於錢電子產品，或是廣泛 地運用在相關之技術環節。以下將搭配第3圖來說明此組 裝方法之具體實施方式。 請參照第3圖，第3圖是第1圖之電子裝置100的組 裝方法的示意圖。於此組裝方法中，首先，可將電子元件 114設置於印刷電路板110之銲錫面ηι上。接著，根據電 子元件114 #大小及電子元件114在印刷電路板11〇上的 位置，於底板120形成開口 124。然後，將印刷電路板11〇 201039737 配置於底板120之上，並將印刷電路板no上的電子元件 114面對底板120之開口 124。加之’於底板120之下方， 將金屬遮蔽片130上的導熱體132面對底板120之開口 124’使導熱體132接觸電子元件114’再將金屬遮蔽片13〇 固定在底板120下以覆蓋開口 124。有關將金屬遮蔽片130 固定在底板120下之方式’可利用點焊技術將金屬遮蔽片 130焊接在底板120下。 在第3圖中，可將印刷電路板11〇及其銲錫面上 0 的電子元件114沿著方向310朝著底板120之内表面121 移動；然後固定印刷電路板110,把銲錫面111靠近内表面 121並將電子元件114正對開口 124。另一方面，金屬遮蔽 片130與其上的導熱體132沿著方向320朝向底板12〇之 外表面122,然後利用點焊技術將金屬遮蔽片13〇焊接在 底板120之外表面122。 由上述本發明實施例可知，應用本發明具有下列優點. (1) 導熱體132搭配金屬遮蔽片13〇可有效地為電子 ❹ 元件114散熱。 (2) 金屬遮蔽片130可有效地屏蔽電子元件114所產 生的電磁波。 (3) 不需要為電子元件Π4用到額外的散熱片，無 磁波輻射的問題。 雖然本發明已以實施方式揭露如上，然其並非用以阳 定本發明，任何熟習此技藝者，在不脫離本發明之精神^ 範圍内，當可作各種之更動與潤飾，因此本發明之保^ 圍當視後附之申請專利範圍所界定者為準。 ’、S範 9 201039737 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1圖是依照本發明一實施例之一種電子裝置的剖面 圖。 第2圖是第1圖之底板與金屬遮蔽片的立體圖。 第3圖是第1圖之電子裝置的組裝方法的示意圖。 【主要元件符號說明】 100 :電子裝置 110 :印刷電路板 111 :銲錫面 112 :元件面 114 :電子元件 120 :底板 121 :内表面 122 :外表面 124 :開口 130 :金屬遮蔽片 132 :導熱體 134 :焊點 310 :方向 320 :方向201039737 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device having electromagnetic shielding and heat dissipation and an assembly method thereof. [Prior Art] In recent years, due to the development of industry and commerce and social progress, the products provided are mainly aimed at convenience, reliability, and economic benefits. Therefore, the products currently developed are more advanced than before, and can contribute to society; In terms of products, in recent years, operators have continuously developed more economical and convenient electronic devices for use, so that their operations and functions can be achieved with half the effort. In order to prevent overheating of parts in an electronic device, the electronic device usually includes a heat sink for heat dissipation. However, the area of the heat sink is generally too small, and the heat dissipation is not good; if the heat sink is increased, the area of the product is increased. On the other hand, the conventional heat sink has a fan-like shape and is easy to radiate electromagnetic waves, and it is difficult to prevent electromagnetic wave interference caused by parts. It can be seen from the above that the above-mentioned existing electronic devices obviously have inconveniences and defects, and further improvements are urgently needed. In order to solve the problem of electromagnetic interference and overheating, the related fields have not tried their best to find a solution, but the method that has not been applied for a long time has been developed. Therefore, how to achieve electromagnetic shielding and heat dissipation on electronic devices is one of the most important research and development topics at present, and it has become an urgent need for improvement in related fields. SUMMARY OF THE INVENTION 201039737 Accordingly, an aspect of the present invention provides an electronic device having electromagnetic shielding and heat dissipation and an assembly method thereof. In accordance with an embodiment of the invention, an electronic device having electromagnetic shielding and heat dissipation includes a backplane, a printed circuit board, electronic components, a metal shield, and a heat conductor. The bottom plate has an opening, the electronic component is disposed on the printed circuit board, and the heat conductor is disposed on the metal shielding sheet. The printed circuit board is disposed on the bottom plate, and the electronic components on the printed circuit board face the opening of the bottom plate. The metal shield is fixed under the bottom plate and covers the opening of the bottom plate, and the heat conductive surface of the metal shield is open to the bottom plate and contacts the electronic component. According to another embodiment of the present invention, an assembly method of an electronic device with electromagnetic shielding and heat dissipation includes the following steps: (1) disposing an electronic component on a solder surface of a printed circuit board; (2) according to the size of the electronic component and Positioning the electronic component on the printed circuit board to form an opening in the bottom plate; (3) arranging the printed circuit board on the bottom plate and facing the electronic component on the printed circuit board facing the opening of the bottom plate; and 〇 (4) on the bottom plate Below, the heat conductor on the metal shielding sheet faces the opening of the bottom plate, the thermal conductor contacts the electronic component, and the metal shielding sheet is fixed under the bottom plate to cover the opening. In this way, the heat conductor conducts heat generated by the electronic component to the metal shield, and the metal shield transmits heat to the outside. On the other hand, the metal mask can shield electromagnetic waves generated by electronic components. It can be seen from the above embodiments of the present invention that the application of the present invention has the advantages of preventing electromagnetic interference and heat dissipation. In summary, the electronic device and the assembly method thereof provided by the aspect of the present invention have many advantages and practical values as described above, and 201039737=there are great improvements in product structure and function, and are technically significant. Into y and produced a useful and practical effect, and compared with the existing electronic devices have enhanced outstanding multiple functions, which is more suitable for practical use, and has a wide range of industrial value. The above description and the following embodiments will be described in detail with reference to various embodiments, [Embodiment] In order to make the description of the present invention more detailed, reference is made to the accompanying drawings and the various embodiments described below, wherein like numerals represent the same or similar elements. On the other hand, well-known elements are not described in the embodiments to avoid unnecessarily limiting the invention. The technical aspect of the present invention is an electronic device with electromagnetic shielding and heat dissipation, which can be applied to various electronic products or widely used in related technical aspects. It is worth mentioning that this electronic device can combine the effects of preventing electromagnetic interference and heat dissipation. A specific embodiment of the electronic device will be described below with reference to Figs. 1 to 2 . Referring to Figure 1, Figure 1 is a cross-sectional view of an electronic device 100 in accordance with one embodiment of the present invention. As shown, the electronic device 100 includes a bottom plate 120, a printed circuit board 110, electronic components 114, a metal shield 130, and a heat conductor 132. The bottom plate 120 has an opening 124, the electronic component 114 is disposed on the printed circuit board 110, and the thermal conductor 132 is disposed on the metal shielding sheet 130. The printed circuit board 110 is disposed on the bottom plate 120, and the electronic component 114 on the printed circuit board 110 faces the opening 124 of the bottom plate 120. The metal shield 13 is fixed under the bottom plate 120 and covers the opening of the bottom plate 120. 124' Metal cover 6 201039737 The heat conductor 132 on the cover 130 faces the opening 124 of the bottom plate 120 and contacts the electronic component 114. Thus, the heat conductor 132 can conduct heat generated by the electronic component 114 to the metal shield 130' to dissipate heat from the metal shield 130 to the outside. On the other hand, the metal mask 130 shields the electromagnetic waves generated by the electronic component 114. In practice, the electronic component 114 corresponds to the opening 124 of the bottom plate 120 such that the printed circuit board 110 can be closer to the bottom plate 12 〇, thereby reducing the distance between the printed circuit board 110 and the bottom plate 120, thereby reducing the electronic device 100. The volume occupied. The printed circuit board 110 has a solder surface 111 and an element surface 112, wherein the element surface 112 is opposed to the solder surface hi. For example, the printed circuit board 110 can be a double panel, which includes a top layer (T〇p Layer) and a bottom layer (Bottom Layer). Both sides of the double panel can be wired, the top layer is generally the component surface 112, and the bottom layer is generally the solder surface ill. The electronic component 114 on the printed circuit board 110 is disposed on the solder surface 111. Further, the electronic component 114 can be a wafer or a wafer set. In practice, the solder surface 111 can be used to provide an electronic component with electromagnetic interference problems and poor heat dissipation, so as to dissipate heat for the electronic component by the heat shield 132 with the metal shielding sheet 130, and shield the electromagnetic wave with the metal shielding sheet 130; Component face 112 can be used to set up other electronic components. The bottom plate 120 has an inner surface 121 and an outer surface 122, wherein the inner surface 121 is opposite the outer surface 122. The inner surface 121 faces the printed circuit board 110 and the outer surface 122 faces the metal shield 130. In addition, the material of the bottom plate 120 may include metal to increase heat dissipation efficiency. In practice, the base plate 120 201039737 can be a chassis chassis, a chassis base or the like. The metal shield sheet 130 can be welded to the bottom plate 120. More specifically, the metal shield sheet 130 can be welded to the outer surface 122 of the bottom plate 12. In practice, the metal shielding sheet 130 is a steel sheet or the like, wherein the thickness of the steel sheet can be less than the thickness of the bottom plate 120, thereby reducing the space occupied by the electronic device. Further, the above-mentioned heat conductor 132 may be a thermal pad or the like to facilitate heat conduction for the electronic component 114. It should be understood that although FIG. 1 only shows an electronic component 114 and an opening 124, it is not intended to limit the present invention, and those skilled in the art should select the number of elastic selection electronic components 114 as needed. One or more openings 124 may be formed in the bottom plate 12 according to the size and number of the electronic components Π4 and the position of the electronic component n4 on the printed circuit board. Referring to Fig. 2, Fig. 2 is a perspective view of the bottom plate 12A and the metal shielding sheet 130 of Fig. 1. As shown, the metal mask 130 is soldered under the bottom plate 120 using spot welding techniques. Therefore, a plurality of solder joints 134 are formed on the metal mask 13A. Another aspect of the present invention is an assembly method of an electronic device having electromagnetic shielding and heat dissipation, which can be applied to money electronic products or widely used in related technical aspects. The specific implementation of this assembly method will be described below with reference to Figure 3. Referring to Fig. 3, Fig. 3 is a schematic view showing a method of assembling the electronic device 100 of Fig. 1. In this assembly method, first, the electronic component 114 can be placed on the solder surface η of the printed circuit board 110. Next, an opening 124 is formed in the bottom plate 120 in accordance with the position of the electronic component 114 # and the electronic component 114 on the printed circuit board 11 . Then, the printed circuit board 11 〇 201039737 is disposed on the bottom plate 120, and the electronic component 114 on the printed circuit board no faces the opening 124 of the bottom plate 120. In addition, under the bottom plate 120, the heat conductor 132 on the metal shielding sheet 130 faces the opening 124' of the bottom plate 120, so that the heat conductor 132 contacts the electronic component 114' and then the metal shielding sheet 13 is fixed under the bottom plate 120 to cover the opening. 124. Regarding the manner in which the metal shield sheet 130 is fixed under the bottom plate 120, the metal shield sheet 130 can be welded under the bottom plate 120 by spot welding. In FIG. 3, the printed circuit board 11 and its electronic component 114 on the solder surface 0 can be moved along the direction 310 toward the inner surface 121 of the bottom plate 120; then the printed circuit board 110 is fixed to bring the solder surface 111 close to the inside. Surface 121 and electronic component 114 are facing opening 124. On the other hand, the metal mask 130 and the heat conductor 132 thereon face the outer surface 122 of the bottom plate 12 in the direction 320, and then the metal shield 13 is welded to the outer surface 122 of the bottom plate 120 by spot welding. It can be seen from the above embodiments of the present invention that the application of the present invention has the following advantages. (1) The heat conductor 132 is matched with the metal shielding sheet 13 to effectively dissipate heat from the electronic cymbal element 114. (2) The metal mask 130 can effectively shield electromagnetic waves generated by the electronic component 114. (3) There is no need to use an additional heat sink for the electronic component Π4, and there is no problem of magnetic radiation. Although the present invention has been disclosed in the above embodiments, it is not intended to be used for the present invention. Any one skilled in the art can make various modifications and retouchings without departing from the spirit of the invention. ^ The scope defined in the patent application scope is subject to the definition of patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A cross-sectional view of an electronic device of an embodiment. Fig. 2 is a perspective view of the bottom plate and the metal shielding sheet of Fig. 1. Fig. 3 is a schematic view showing a method of assembling the electronic device of Fig. 1. [Description of main component symbols] 100: electronic device 110: printed circuit board 111: solder surface 112: component surface 114: electronic component 120: bottom plate 121: inner surface 122: outer surface 124: opening 130: metal shielding sheet 132: thermal conductor 134: Solder Joint 310: Direction 320: Direction