201038911 六、發明說明： 【發明所屬之技術領域】 體之散熱模組及其製造方法。 I、體及第一散熱 【先前技術】 〇201038911 VI. Description of the invention: [Technical field to which the invention pertains] The heat dissipation module of the body and the method of manufacturing the same. I, body and first heat dissipation [Prior Art] 〇
啊====展’使的積體電路(崎福_ 、处里器㈣他1 Processmg unit)、記憶體(memory)及各 =制^因製程提升，可在單位體積内容置數量較以前為多之 二二片封f面積也較以前為小，且運作時脈較以前高，而可 =、速之運算效能。然而，由於晶片在運作時會產生熱能，隨 者曰曰片面，之縮小及運算喊之提高，在單麵積所產生之熱量 $以，高出甚多。而熱能將導致晶片溫度上升，當超出晶片所 谷;斗之操作溫麟，便可能導致祕運作不敎，甚至燒毀。 %為解決上述問題’目前㈣於發熱量較高之電子元件上均特 別3又置散難組’獅散細組料電？元件所產生之 將其散逸至外界’崎低電子元件之溫度。餘模組可一具有 =熱鰭片之基板’設置於散熱鰭片上導熱管(heatpipe)及散熱風扇 所組成。其巾基板與導熱管之連接部份，_由以魏金屬鎖之 f式’將僅需賴部份浸泡於電解軸，崎金屬魏鑛至連接 社。接著於連接部份設置—層料，再將導熱管透過錫膏結合 於基板上。最後，將結合完成之散熱模組，置人—高_中^ 錫焊燒結(solder)，使錫膏熔融後’脫離爐具置於室溫或低财境， 3 201038911 使錫膏冷卻凝固，以接合基板與導熱管。 然而，習知鎳電鍍製程，具有以下缺點： 第一，電鍍鎳須於酸電解液中進行’此製程係為濕式製程， 會於製造過程中產生對環境有害之化合物，不符合日益嚴格之環 保規範。 第二，電鑛製程大多為全面電鍍而非區域部分電鍍，因區域 部分電鍍容易導致製造成本進一步提升。 第三，金屬鎳之導熱係數約為73.3W/(m.k)，遠小於金屬鋁及 金屬鋼，因此將造成散熱模組於熱傳導路徑上之熱傳導值的下 降’導致散熱模組之散熱能力下降。 第四，由於基板與熱導管之間設置一電鍍鎳層，因鎳盥銅、 鋁間之結合能力較差，導致導熱之效果較低。 /、 【發明内容】 有鑑於上述習知技藝之問題，本發明之目·是在提供一種 =熱模組及其製造籍’以解決習知技藝之散熱模組導熱性因需 、又鎳接合第-散熱體及第二散熱體，導致製造成本較高、接合力 不足及導熱值下降之問題。 根據本發明之目的’提出一種散熱模組，包含一第一散敎體、 =二散熱體及-金屬層。金屬層係設置於第 體之間，且金屬層之厚度係訥轉至麵_。 散… 其中，第—散熱體係、為-散熱鰭片。 其中，第二散熱體係為—散熱基板或一熱管。 201038911 其中，第一散熱體與金屬層之門审s _ 第二散熱趙與金屬層’且接著層係為 :錫膏7著層’其係結合 錄合金屬層係為輪屬、鋼合金、齡屬、錄合金或銅 此外，本發明更提出一種散献 首先，提供獅。接/=2釘列步驟。 屬層至第-散熱體。而後，設置9么屬喷射方式设置一金 ❹ 設置一第二散熱體至接著層之層之一侧。最後， 一散熱體及$二散熱體。㈨細金麟及接㈣結合第 火焰、ί::=ί=:真空電_、-電_、-熔射 射、一高速火焰熔射或一大氣電漿 其中，金屬層之厚度為1以„1至1〇〇〇"111。 其中，第一散熱體係為一散熱基板。 其中，散熱鰭片係為鋁金屬所製成。 其中，第二散熱體係為一散熱基板或一熱管。 /、中金屬層可為銅金屬、銅合金、鎳金屬、鎳合金或銅鎳 合金所製成。 承上所述，依本發明之散熱模組及其製造方法，可藉由利用 金屬層以騎方式設置於第—散鱗上，可降低生產成本，增加 熱傳導效較提升帛-散鐘及帛二散題接合能力。 5 201038911 【實施方式】 一杳LI μ及第2圖’其分麟為本發明之散熱模組之第 一實例體圖及局部剖視圖。圖中，散熱模組1包含-第一 散熱體1卜一第二散熱體12、-金屬層13及-接著層14。 第政熱體11可為一散熱基板，其可以紹金屬所製成，且第 一散熱體11端具有_接觸部ηι，而可供-電子元件(圖未 示）如處理n %圖顯π晶片、南橋晶片、北橋晶片或任何控制 晶片設置於其上。此外，第—散熱體11亦可視需求開設-對應第 -政熱體I2之溝槽1丨2。為提升散熱效能’可視需求於第一散熱 體11上另設置-散朗片113。金屬層13之材f可油金屬、^ 合金、鎳金屬、鎳金屬或銅錄合金所製成，其係以金屬喷射(_ spray)之方式設置於第—散熱體u之—側。其中，金屬喷射方式 可以-真空電㈣射方式、―電弧熔射方式、—火焰線材溶射方 式、-火粉德射方式、―高速火麟射方式或—大氣電裝炫 射之方式’將金屬I 13塗佈於第—散熱體之—侧，而形成一厚度 約1 /zm至1000#ηι之塗佈層。 接著層14可為一低溫錫膏，其作業溫度可為攝氏12〇度至22〇 度之間’但不以此為限。當金屬層13噴塗完成後，可將低溫錫膏 塗佈之金屬層上而形成接著層14。 第二散熱體12可為一導熱管(heatpipe)，其可將一金屬銅材質 所1成之圓質熱管(直徑通常可為6mm至8mm，但不以此為限) 藉由模具或治具將其彎折打扁後，埋設於溝槽112内，並位於接 著層14上。導熱管之内部呈一真空狀態，且含有少許水蒸氣或冷 凝水。其一端設置於接觸部H1(即受熱端），一端設置於散熱鰭片 201038911 1B之一侧(即冷卻端）’可藉由水蒸氣之蒸發冷凝效應將電子元件 所產生之熱能迅速傳導至散熱鰭片113上。 备散熱模組1組裝完成後，可透過一治具(fixture)或夾持裝置 夾持結合尚未進行錫焊處理之第一散熱體n及第二散熱體12，並 將其送入一高溫爐内烘烤，將錫膏加熱至一熔融狀態以包覆結合 第一散熱體11及第二散熱體12。當將散熱模組丨脫離於高溫爐 後，靜置於室溫一段時間。待錫膏凝固後，藉由金屬層13及錫膏 間接結合第一散熱體U及第二散熱體12，即完成第一散熱體n 〇 及第二散熱體12之結合程序。 為更有效提升散熱效率，可於第一散熱體n之一側設置一散 熱風扇15，而可利用主動散熱之方式將蓄積於散熱鰭片113上之 熱能吹散至外部。 其中，因金屬層係以熔射方式塗佈於第一散熱體u上，其係 屬於-種乾製程方式，而較不會於製造過程中產生對環境有害之 巧染物。此外，由於金屬層13之材f可為銅金屬或義合金，其 熱傳導係數(銅金屬約為386 W/(m.k)，鋁約220W/(m.k))均較習知 之電鍍錄材質之導熱係數(約為73 3w/(mk))為高，而可提升散熱 模組1整體熱傳導性。此外，金屬噴塗製程麵配合一簡易遮蔽 治具便可遮罩不須喷塗的部份，其較習知技藝之區域部分電鑛製 程之成本為低。此外，由於銅金屬或銅銻金屬之金屬接合力較習 知電鑛鎳為高，因而可提升導熱及抗拉拔之能力，而可提升散熱 模組1於使用時之可靠度。 請參閱第3圖及第4 ® ’其分獅為本發明之散熱模組之第 二實施例之立體圖及剖視圖。圖中，散熱模組2包含-第-散熱 7 201038911 、：第二散熱體22、—金屬層23及—接著層24。在此實施 =中丄第-散熱體2卜金屬層22及接著層24均與第相 :第= 與第一實施例之差異在於本實施例 之第-政熱體22為二政熱基板，其可相互間隔並且藉 3 及接著層24而與第一散熱體21相結合。 圖 請參照第5圖’其係林發明散顏_造方法之步驟流程 其製造方法包含下列步驟： 511 :提供一第一散熱體。 512 :藉由-金屬喷射方式設置一金屬層至第一散熱體之一 侧。 513 :設置一接著層至金屬層之一侧。 514 :設置一第二散熱體至接著層之一側，並藉由金屬層及接 著層結合第一散熱體及第二散熱體。 其中，上述第一散熱體可為一散熱基板，其可以鋁金屬所製 成。金屬層之材質可為銅金屬、銅合金、鎳金屬、鎳合金或銅鎳 合金所製成，其係以金屬噴射之方式設置於第一散熱體之一側。 其中金屬喷射方式可以一真空電聚熔射(vacuum plasma spray, VPS)、一電弧熔射(肌melting spray)、一火焰線材熔射㈣re flame spray)方式、火焰粉末熔射(powder frame spray)方式、一高速火 焰’熔射(high velocity 0矽_如1，H〇w)方式或一大氣電漿熔射 (atmosphefe plasma spray，APS)之方式，將金屬層塗佈於第一散熱 體之一侧’而形成一厚度約為至lOOOym之塗佈層。 接著層可為一低溫錫膏，其作業溫度可為設置12〇度至220 度之間，但不以此為限。 201038911 第一散熱體可為一導熱管(heat pipe)，其可將一金屬銅材質所 製成之圓質熱官(直徑通常可為6mm至8mm，但不以此為限)藉由 二具，治具將其彎折狀後設置於第-絲體之-賴溝槽内。 導熱管之_呈—真空狀態，且含有少許水蒸汽或冷凝水。可藉 由水蒸氣之碰冷凝效麟電子元件所產生之熱能迅速傳導 熱鰭片上。 综上所述，本發明散熱模組及其製造方法之功效在於藉由熔 射方式塗佈金制至第—散熱體上，制於-乾製程方式，而較 不會於製造過程中產生對環境有害之汙染物。 此外’本發明散熱模組及其製造方法之另一功效在於金屬層 ^材質Z為銅金>1或雜合金’其熱傳導係數均較習知之電鑛鎳 材質為咼，而可提升散熱模組熱傳導性。 ^外’本發熱模組及其製造方法之再_功效在於金屬喷 ’、製程較電11鎳製程為低，而可有效降彳喊本。 、 r、·二L本^散熱模組及其製造方法之又—功效在於銅金屬 之力較習知電鍍錦為高，而可提升導熱及抗 拉拔之靶力，而可提升散熱模組於使用時之可靠度。 以上所述僅為舉例性，而非為限制性 之精神與麟，而對其進行之等效修改切# 2脫離本發明 之申請專利範圍中。 等私改或變更，均應包含於後附 【圖式簡單說明】 第1圖係為本發明之散熱模組之第一實施例之立體圖 201038911 第2圖係為本發明之散熱模紅之第一實施例之剖視圖； 第3圖係為本發明之散熱模組之第二實施例之立體圖； 第4圖係林個之散_組之第二實關之剖視圖。 【主要元件符號說明】 I :散熱模組； II :第一散熱體； III :接觸部； 112 :溝槽； 113 :散熱鰭片； 12 :第二散熱體； 13 :金屬層； 14 :接著層； 15 :散熱風扇； 2:散熱模組； 21 :第一散熱體； 22 :第二散熱體； 23 :金屬層； 24 :接著層；及 S11〜S14 :步驟流程。啊====展's integrated circuit (Sakifu _, 处 器 (4) he 1 Processmg unit), memory (memory) and each = system process increase, can be placed in the unit volume content before the number For the more than two pieces, the area of the f is smaller than before, and the operating clock is higher than before, and the performance of the speed can be reduced. However, since the wafer generates heat during operation, the reduction in the sheet surface, the reduction in the calculation, and the increase in the amount of heat generated in a single area are much higher. The heat will cause the temperature of the wafer to rise, when it exceeds the valley of the wafer; the operation of the bucket will lead to the operation of the secret, even burning. % is to solve the above problems. At present, (4) on the electronic components with higher heat generation, special 3 is also difficult to dispose of the group. The component produces the heat that dissipates it to the outside world. The remaining module can be composed of a heat sink and a heat dissipating fan disposed on the heat sink fin. The connection part of the towel substrate and the heat pipe is immersed in the electrolysis shaft by the f-type of the Wei metal lock, and the metal is transferred to the connection company. Then, a layer is placed on the connecting portion, and the heat pipe is then bonded to the substrate through the solder paste. Finally, the heat-dissipating module will be combined with the high-medium solder paste to make the solder paste melt and then leave the stove at room temperature or low. 3 201038911 The solder paste is cooled and solidified. To bond the substrate to the heat pipe. However, the conventional nickel electroplating process has the following disadvantages: First, electroplating nickel must be carried out in an acid electrolyte. This process is a wet process, which may cause environmentally harmful compounds in the manufacturing process, which is not in conformity with increasingly strict Environmental regulations. Second, most of the electro-mineral processes are full-scale electroplating rather than partial electroplating, which is likely to result in further improvements in manufacturing costs due to partial plating. Third, the thermal conductivity of metallic nickel is about 73.3 W/(m.k), which is much smaller than that of metallic aluminum and metallic steel, so that the thermal conduction value of the heat-dissipating module on the heat conduction path is lowered, resulting in a decrease in the heat dissipation capability of the heat-dissipating module. Fourth, since an electroplated nickel layer is disposed between the substrate and the heat pipe, the bonding ability between the nickel beryllium copper and the aluminum is poor, resulting in a low heat conduction effect. SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, the object of the present invention is to provide a heat module and a manufacturing method thereof to solve the thermal conductivity of the heat dissipation module of the prior art, and to form a nickel joint. The first heat sink and the second heat sink cause a problem of high manufacturing cost, insufficient bonding force, and a decrease in heat conduction value. According to the purpose of the present invention, a heat dissipation module is provided, comprising a first bulk body, a second heat sink body and a metal layer. The metal layer is disposed between the first bodies, and the thickness of the metal layer is transferred to the surface _. Disperse... Among them, the first - heat dissipation system, is - heat sink fins. The second heat dissipation system is a heat dissipation substrate or a heat pipe. 201038911 wherein, the first heat sink and the metal layer are s _ _ second heat and the metal layer 'and the layer is: the solder paste 7 layer 'the combination of the recorded metal layer is a wheel, steel alloy, In addition to the age, recording alloy or copper, the present invention further proposes a dispersion first, providing a lion. Connect the /=2 pinning step. The genus layer to the first heat sink. Then, the setting of 9 is a spray mode setting a gold ❹ a second heat sink is disposed to one side of the layer of the subsequent layer. Finally, a heat sink and two heat sinks. (9) Fine Jinlin and (4) combined with the first flame, ί::=ί=: vacuum _, - electricity _, - spray shot, a high-speed flame spray or an atmospheric plasma, the thickness of the metal layer is 1 „1至1〇〇〇"111. The first heat dissipation system is a heat dissipation substrate. The heat dissipation fins are made of aluminum metal, wherein the second heat dissipation system is a heat dissipation substrate or a heat pipe. The medium metal layer may be made of copper metal, copper alloy, nickel metal, nickel alloy or copper nickel alloy. According to the above, the heat dissipation module and the manufacturing method thereof can be used by using a metal layer The method is set on the first-scatter scale, which can reduce the production cost and increase the heat transfer efficiency, and improve the joint ability of the 帛-散钟 and 帛二散题. 5 201038911 [Embodiment] One LI μ and the second figure A first example of a heat dissipation module and a partial cross-sectional view of the heat dissipation module of the present invention. In the figure, the heat dissipation module 1 includes a first heat dissipation body 1 , a second heat dissipation body 12 , a metal layer 13 and a subsequent layer 14 . The heat body 11 can be a heat dissipation substrate, which can be made of metal, and the first heat sink 11 has _ The contact portion ηι, and the usable electronic component (not shown), such as the processing n π π wafer, the south bridge wafer, the north bridge wafer or any control wafer is disposed thereon. In addition, the first heat sink 11 can also be opened as required - Corresponding to the groove 1丨2 of the first heat body I2. In order to improve the heat dissipation performance, the first heat sink 11 is additionally provided with a dispersible sheet 113. The metal layer 13 is made of oil metal, alloy, nickel. Made of metal, nickel metal or copper alloy, which is placed on the side of the first heat sink u in the form of metal spray (_spray). Among them, the metal spray method can be vacuum electric (four) radiation mode, arc melting Shooting method, - flame wire spraying method, - fire powder shooting method, "high-speed fire lining method or - atmospheric electric smashing method", metal I 13 is applied to the side of the first heat sink to form a The coating layer has a thickness of about 1 /zm to 1000#ηι. The layer 14 can be a low temperature solder paste, and the operating temperature can be between 12 degrees Celsius and 22 degrees Celsius 'but not limited thereto. When the metal layer After the spraying is completed, the low temperature solder paste may be applied to the metal layer to form the adhesive layer 14. The heat sink 12 can be a heat pipe, which can be made of a metal copper material (the diameter can be generally 6mm to 8mm, but not limited thereto) by a mold or a jig. After being bent and flattened, it is buried in the groove 112 and located on the adhesive layer 14. The inside of the heat pipe is in a vacuum state and contains a little water vapor or condensed water. One end of the heat pipe is disposed at the contact portion H1 (ie, the heat receiving end). One end is disposed on one side of the heat dissipation fin 201038911 1B (ie, the cooling end)', and the heat energy generated by the electronic component can be quickly transmitted to the heat dissipation fin 113 by the evaporation condensation effect of the water vapor. After that, the first heat sink n and the second heat sink 12 which have not been soldered can be clamped by a fixture or a clamping device, and sent to a high temperature furnace for baking, and the solder paste is applied. Heating to a molten state to cover the first heat sink 11 and the second heat sink 12 . When the heat dissipation module is removed from the high temperature furnace, it is left at room temperature for a while. After the solder paste is solidified, the first heat sink U and the second heat sink 12 are indirectly coupled by the metal layer 13 and the solder paste, that is, the bonding process of the first heat sink n 〇 and the second heat sink 12 is completed. In order to more effectively improve the heat dissipation efficiency, a heat dissipating fan 15 may be disposed on one side of the first heat radiating body n, and the heat energy accumulated on the heat radiating fins 113 may be blown to the outside by active heat dissipation. Wherein, since the metal layer is applied to the first heat dissipating body u by spraying, it belongs to a dry process, and does not produce an environmentally harmful dye in the manufacturing process. In addition, since the material f of the metal layer 13 can be a copper metal or a nylon alloy, the thermal conductivity (about 386 W/(mk) of copper metal and about 220 W/(mk) of aluminum) is higher than the thermal conductivity of the conventional electroplated material. (About 73 3w/(mk)) is high, and the overall thermal conductivity of the heat dissipation module 1 can be improved. In addition, the metal spraying process surface can be used with a simple shielding fixture to cover the portion that is not required to be sprayed, which is lower in cost than the electric mining process in some areas of the prior art. In addition, since the metal bonding force of the copper metal or the copper-bismuth metal is higher than that of the conventional nickel ore, the heat conduction and the pull-out resistance can be improved, and the reliability of the heat-dissipating module 1 in use can be improved. Please refer to Fig. 3 and Fig. 4'' for a perspective view and a cross-sectional view of a second embodiment of the heat dissipation module of the present invention. In the figure, the heat dissipation module 2 includes a -first heat sink 7 201038911 , a second heat sink 22 , a metal layer 23 and a second layer 24 . In this embodiment, the first heat dissipating body 2 and the second layer 24 and the second layer 24 are the same as the first embodiment. The difference between the first embodiment and the first embodiment is that the first embodiment of the present embodiment is a two-dimensional thermal substrate. They can be spaced apart from one another and combined with the first heat sink 21 by means of 3 and subsequent layers 24. Please refer to Figure 5 for the step flow of the method for manufacturing the invention. The manufacturing method comprises the following steps: 511: providing a first heat sink. 512: A metal layer is disposed on one side of the first heat sink by a metal spray method. 513: Set an adhesive layer to one side of the metal layer. 514: A second heat sink is disposed to one side of the adhesive layer, and the first heat sink and the second heat sink are combined by the metal layer and the connecting layer. The first heat sink may be a heat sink substrate, which may be made of aluminum metal. The material of the metal layer may be made of copper metal, copper alloy, nickel metal, nickel alloy or copper-nickel alloy, and is disposed on one side of the first heat sink by metal spraying. The metal spraying method can be a vacuum plasma spray (VPS), an arc melting spray, a flame reflow method, or a powder frame spray method. a high-velocity flame spraying method (high velocity 0矽_如1, H〇w) or an atmospheric plasma atomizing (APS) method, applying a metal layer to one of the first heat sinks The side is formed to form a coating layer having a thickness of about 1000 ym. The layer can be a low temperature solder paste, and the operating temperature can be set between 12 degrees and 220 degrees, but not limited thereto. 201038911 The first heat sink can be a heat pipe, which can be made of a metal copper material (the diameter can usually be 6mm to 8mm, but not limited thereto) by two The jig is bent and placed in the groove of the first-filament body. The heat pipe is in a vacuum state and contains a little water vapor or condensed water. The heat generated by the condensation of the water element can be quickly transferred to the hot fin by the action of the vapor. In summary, the heat-dissipating module of the present invention and the manufacturing method thereof have the advantages of coating the gold to the first heat dissipating body by means of a spray method, and manufacturing the method to the dry process, which is less likely to be produced during the manufacturing process. Environmentally harmful pollutants. In addition, another function of the heat dissipating module and the manufacturing method thereof is that the metal layer ^ material Z is copper gold > 1 or a miscellaneous alloy, and the heat transfer coefficient thereof is higher than that of the conventional electro-mineral nickel material, and the heat-dissipating mold can be improved. Group thermal conductivity. ^External heating module and its manufacturing method _ efficiency is metal spray ‘, the process is lower than the electric 11 nickel process, and can effectively reduce the shouting. , r, · two L this ^ cooling module and its manufacturing method - the effect is that the force of copper metal is higher than the conventional electroplating brocade, and can enhance the heat and pull target, and can improve the thermal module Reliability when using. The above description is only illustrative, and not limiting, and the equivalent modifications thereof are omitted from the scope of the invention. The privacy changes or changes should be included in the attached [Simplified description of the drawings]. Figure 1 is a perspective view of the first embodiment of the heat dissipation module of the present invention 201038911. The second figure is the first part of the heat dissipation model of the present invention. 3 is a perspective view of a second embodiment of the heat dissipation module of the present invention; and FIG. 4 is a cross-sectional view of the second embodiment of the group. [Main component symbol description] I: heat dissipation module; II: first heat sink; III: contact portion; 112: trench; 113: heat sink fin; 12: second heat sink; 13: metal layer; Layer; 15: cooling fan; 2: heat dissipation module; 21: first heat sink; 22: second heat sink; 23: metal layer; 24: adhesive layer; and S11~S14: step flow.