201038114 六、發明說明： 【發明所屬之技術領域】 範例具體實施例大致是關於用於照明裝置的電路配 置，且更明確地是關於在單層PCB板上的LED光源的串聯 和並聯配置。 【先前技術】 在各種發光應用中，複數個考量已經促使發光工業開 始使用發光二極體（LED )以及提供照明源的其它新發光技 術。LED和這些其他的照明裝置往往會是串聯連接。然而， 當單個光源相毀時’電流將無法再經過光源，且它們的照 明將會停止。又，必須使用典型地多層PCB板。 【發明内容】 範例具體實施例可以串聯和並聯連接led。這種連接 允許電流流到已經損毀的LED的周圍，使得在組件中的剩 餘光源可以繼續提供照明。具體實施例不僅僅可以使用 ㈣，亦可使用有機發光二極體（〇LED)、場發射顯示器 (fed)、發光聚合物（LEP)以及有機電激發光（〇el)。 範例具體實施例也可以架置LED在印刷電路板（pCB) 上’其在含有㈣的表面和相對表面之間具有低熱電阻 率。相對表面可以是金屬製的，I空氣可以被迫使位於此 表面上方，以冷卻組件。可以使用金屬製的芯之pcB板。 在範例具體實施例中，可以使用單層PCB板。 201038114 【實施方式】 參考圖式以求更佳的理解1 1顯示了複數個光源 ⑽，其以串聯和並聯而電性連接至電源n〇。㈣1〇〇的 許多群組被顯示。群組可以描述成關於所顯示的χι、χ2、 以及Υ2維度。首先，在Χ1_γ^維度中，三個光源顯 示成並聯群組且每一個並聯群組是與彼此串聯。在圖上的 「點」意指在每一個並聯群組中可以有大於三個的光源。 因此，在每一個並聯群組的Y1方向中，可以有大於三個的 光源。又，「點」再次用來代表可以有大於三個的並聯群 組。因此，在χι方向中’可以有大於三個的彼此串聯的並 聯群組。 其次，在X2-Y2的維度中，三個光源顯示成並聯群組 且每一個並聯群組是與彼此串聯。在圖上的「點」再次意 指在每一個並聯群組中可以有大於三個的光源。因此，在 每一個並聯群組的Y2方向中，可以有大於三個的光源，且 在X2方向中，可以有大於三個的彼此串聯的並聯群組。應 /主意的疋.雖然顯示了四個點，但不限於僅有四個額外光 源的具體實施例，而可以使用任何數量的額外光源。 圖2顯示了範例具體實施例，其中每一個並聯群組包 含六個光源，且三個並聯群組是與彼此串聯。這個結構是 雙重的，且這兩個結構接著與彼此並聯。這個具體實施例 可以供範例電流’該電流分配至光源中。再者，可以使 用單層板，對於製造的目的來說，單層板較便宜且較簡易。 5 201038114 光源的精確數量和方位可以取決於每一個光源的特性（舉 例來說，電流牵引（current draw ))以及所希的照明量。 假設任何一個光源損毁，電流會穿過在並聯群組中的 任何其它光源，且隨後穿過以串聯連接的剩餘群組。該群 組分配電流，由於電流分配的一致性，使得已經熄滅的光 源變得更難以發現。 回頭參考圖1 ’應該注意的是：也可以加入另外的並聯 群組’舉例來說，X3-Y3、X4-Y4等。再者，電路系統可以 包含額外的元件’舉例來說，放大器、限制器、微處理器、 電阻器、電容器以及測量裝置，以進一步地改善電路的效 能。 光源和電路可以是印刷電路板（PCB )的一部份。pCB 可以包含標準FR4電路板。範例具體實施例可以使用在光 源和PCB的背面間之低位準的熱電阻值。這允許熱從光源 散佈至PCB的背面’其中熱可以藉由傳送或傳導或兩者而 從光源組件移除。為此目的，範例具體實施例可以使用金 屬芯PCB 1於範例具體實施例的ρ(：Β可以包含金屬製的 背PCB表面’其中較冷的空氣會經過該表面且從光源組件 移除熱。包含光源的PCB表面可以塗覆高反射性塗層且也 可以是特定顏色，該顏色取決於光源應用的特定需求。 圖3顯示用於範例PCB板的層。基板iq較佳地具有低 熱電阻值。在較佳的具體實施例中，基板1〇會是金屬製的， 且在範例具體實施例中，基板1〇會是銘。介電材料"是 放置在傳導層12和基板10之間。傳導層12可以是卜2盘 201038114 斯（〇Z)的銅。介電材料11可以是70·90微米厚。由於許 多原因，PCB的範例具體實施例是有優勢的。單一傳導層 可以用來連接所有的光源；這樣替整個組件提供了降低的 成本、重量、尺寸以及熱電阻率。金屬製的基板也提供了 低熱電阻率，並允許熱更容易地在pCB的前側和後側之間 傳送。藉由移動空氣（或其他氣體物質）遍及基板1〇的背 表面而可以將熱從PCB移除。散熱器或風扇可以附接至背 表面，以更進一步地促進熱從基板1〇移除。空氣（或其他 氣體物質）可以藉由一個或多個風扇而移動遍及基板1〇的 背表面。 圖4顯示使用單層傳導線來連接光源於pCB板上的— 個方法。明顯地，傳導線20可以導向任何數量的設計和形 狀，以用於包含光源的電路22。傳導線2〇的精確路線可以 取决於被使用的光源陣列的數量和尺寸以及架置在板 上的其他構件。 具體實施例可以用於任何各種的照明應用，包含但不 限於：電子顯示的背光源、建築光源、廣告光源、特效光 源或靜態顯示的背光源。具體實施例可以使用任何形式的 LED來作為光源。 本發明已經顯示並描述較佳的具體實施例，擅長此技 術者將會了解：許多改變和修改可以被實施來影響所述的 發明，而仍在所主張發明的範疇中。此外，標示在上文中 的絝多το件可以被改變或被將提供相同結果的不同的元件 替換，而仍落在所主張發明的精神中。因此，這個目的是 7 201038114 讓本發明僅限制於所標示的申請專利範圍的範疇。 【圖式簡單說明】 當參考隨附圖式時，將會對範例具體實施例有較佳理 解，其中完全相同的部分是完全相同於完全相同的元件符 號，且其中： 圖1是各種具體實施例的概略電路圖。 圖2是範例具體實施例的概略電路圖。 圖3是側視圖，其顯示了 PCB層。 圖4是概略圖，其顯示了含有串聯和並聯光源電路的 具體實施例之單層PCB之一個可能的佈局。 【主要元件符號說明】 10 基板 11介電材料 12 傳導層 2〇 傳導線 22 光源 光源 11 〇電源 8201038114 VI. Description of the Invention: [Technical Field of the Invention] Exemplary embodiments are generally related to circuit configurations for lighting devices, and more particularly to series and parallel configurations of LED light sources on a single layer PCB board. [Prior Art] In various lighting applications, a number of considerations have prompted the lighting industry to begin using light emitting diodes (LEDs) as well as other new lighting technologies that provide illumination sources. LEDs and these other lighting devices tend to be connected in series. However, when a single source is destroyed, the current will no longer pass through the source and their illumination will stop. Also, a typical multilayer PCB board must be used. SUMMARY OF THE INVENTION Example embodiments may connect LEDs in series and in parallel. This connection allows current to flow around the LED that has been destroyed so that the remaining light source in the assembly can continue to provide illumination. The specific embodiment can use not only (4) but also an organic light emitting diode (〇LED), a field emission display (fed), a light emitting polymer (LEP), and an organic electroluminescence (〇el). Exemplary embodiments may also mount an LED on a printed circuit board (pCB) that has a low thermal resistivity between the surface containing the (four) and the opposing surface. The opposing surface can be made of metal and I air can be forced over the surface to cool the assembly. A metal core PCB board can be used. In an exemplary embodiment, a single layer PCB board can be used. 201038114 [Embodiment] Referring to the drawings for a better understanding, 1 1 shows a plurality of light sources (10) electrically connected to a power source n〇 in series and in parallel. (4) Many groups of 1〇〇 are displayed. Groups can be described as being about the dimensions of χι, χ2, and Υ2 displayed. First, in the Χ1_γ^ dimension, three light sources are shown in parallel groups and each parallel group is in series with each other. "Point" on the figure means that there may be more than three light sources in each parallel group. Therefore, there may be more than three light sources in the Y1 direction of each parallel group. Again, the "point" is again used to represent a parallel group that can have more than three. Therefore, there may be more than three parallel groups in series in the χι direction. Second, in the dimension of X2-Y2, three light sources are shown in parallel groups and each parallel group is in series with each other. The "point" on the graph again means that there can be more than three light sources in each parallel group. Thus, in the Y2 direction of each parallel group, there may be more than three light sources, and in the X2 direction, there may be more than three parallel groups in series with each other. It should be / idea. Although four points are shown, it is not limited to a specific embodiment with only four additional light sources, and any number of additional light sources can be used. Figure 2 shows an exemplary embodiment in which each parallel group contains six light sources and three parallel groups are in series with each other. This structure is dual and the two structures are then connected in parallel with each other. This particular embodiment can be used for the example current 'which is distributed into the source. Furthermore, a single layer board can be used, which is cheaper and easier for manufacturing purposes. 5 201038114 The exact number and orientation of the light source can depend on the characteristics of each source (for example, current draw) and the amount of illumination. Assuming any one of the sources is destroyed, the current will pass through any other source in the parallel group and then pass through the remaining groups connected in series. This group distributes the current, making the extinguished light source more difficult to find due to the uniformity of current distribution. Referring back to Figure 1 'it should be noted that additional parallel groups can also be added' for example, X3-Y3, X4-Y4, and the like. Furthermore, the circuitry may include additional components 'for example, amplifiers, limiters, microprocessors, resistors, capacitors, and measuring devices to further improve the performance of the circuit. The light source and circuitry can be part of a printed circuit board (PCB). The pCB can contain standard FR4 boards. Example embodiments may use low level thermal resistance values between the light source and the back side of the PCB. This allows heat to be spread from the light source to the back side of the PCB where heat can be removed from the light source assembly by transfer or conduction or both. To this end, example embodiments may use metal core PCB 1 in the exemplary embodiment of ρ (: Β may include a metal back PCB surface 'where colder air will pass through the surface and remove heat from the light source assembly. The surface of the PCB containing the light source may be coated with a highly reflective coating and may also be of a particular color depending on the particular needs of the light source application. Figure 3 shows a layer for an exemplary PCB board. The substrate iq preferably has a low thermal resistance. In a preferred embodiment, the substrate 1 will be made of metal, and in the exemplary embodiment, the substrate will be the same. The dielectric material is placed on the conductive layer 12 and the substrate 10. The conductive layer 12 may be copper of 201038114(〇Z). The dielectric material 11 may be 70.90 micrometers thick. Example embodiments of the PCB are advantageous for a number of reasons. A single conductive layer may Used to connect all of the light sources; this provides reduced cost, weight, size, and thermal resistivity for the entire assembly. Metal substrates also provide low thermal resistivity and allow heat to be more easily on the front and back of the pCB Transfer between sides. Heat can be removed from the PCB by moving air (or other gaseous species) throughout the back surface of the substrate 1. A heat sink or fan can be attached to the back surface to further promote heat from the substrate 1〇 Removal. Air (or other gaseous species) can be moved across the back surface of the substrate 1 by one or more fans. Figure 4 shows a method of connecting a light source to a pCB board using a single layer of conductive wire. Notably, the conductive lines 20 can be directed to any number of designs and shapes for the circuit 22 containing the light source. The precise alignment of the conductive lines 2 can depend on the number and size of the array of light sources used and the mounting on the board. Other components. The specific embodiments can be used in any of a variety of lighting applications including, but not limited to, backlights for electronic displays, architectural light sources, advertising light sources, special effects light sources, or statically displayed backlights. Specific embodiments can use any form of LED The present invention has been shown and described with respect to preferred embodiments, and those skilled in the art will appreciate that many changes and modifications can be Implemented to influence the described invention while still in the scope of the claimed invention. Furthermore, the multiple elements indicated above may be altered or replaced by different elements that provide the same result, while still claiming In the spirit of the invention, therefore, the object is 7 201038114 to limit the invention to the scope of the claimed patent application. [Simplified description of the drawings] When referring to the accompanying drawings, reference will be made to the example embodiments. BRIEF DESCRIPTION OF THE DRAWINGS It is to be understood that the same elements are the same as the same reference numerals, and wherein: Figure 1 is a schematic circuit diagram of various embodiments. Figure 2 is a schematic circuit diagram of an exemplary embodiment. Figure 3 is a side view. A PCB layer is shown.Figure 4 is a diagrammatic view showing one possible layout of a single layer PCB of a particular embodiment including series and parallel source circuits. [Main component symbol description] 10 Substrate 11 Dielectric material 12 Conductive layer 2〇 Conduction line 22 Light source Light source 11 〇 Power supply 8