201036525 六、發明說明： 【發明所屬之技術領域】 尤指可防水的電子裝讀熱結構。 本發明係關於一種散熱結構， 【先前技術】 Ο 隨者輕薄短小的發展趨勢，電子裝置如 的體積亦隨之縮小，但是電子㈣如錢源供應器 得散熱問題愈形嚴重。以電_二卜=觸面積也隨之變小’使 部印刷電路板上之電子接器於運作時其内 外咬诵當*舰㈣ ‘的熱f。傳_電源轉接器的 不ΐ 構成’因塑膠材質傳熱效果較差，而導致敎量 ===姊獅剛_ °磁#_散熱問題， ==Γ之電子元件易於損壞’不只會降低電源轉接器之 使用可命，更會降低電源轉接器之電_換效率。 目則市面上亦有為驗散制題而設計之具散·翻電源轉接 η °為了使發熱的電子元件所產生的熱量能有效地散逸 成上設置數個散熱片，且電子元件與散熱片以螺喊者是2的t =互連接來幫助電子元件散去缝。然而，現今的絲無器已朝小 型化與高功率發展，使傳統的被動式散熱方式謂散熱要求。 右利用強制散熱方式則需在電源轉接器之殼體上增設通孔，使電 4 201036525 源轉接器與外界空氣相通，並利用風扇加快散熱效率。只是，因為殼 體上存在有通孔，導致在潮濕環境下或戶外運作的電源轉接器時，其 内部之電子元件將可能因長期與水或濕氣接觸而造成電源轉接器短路 或損毁。若意外或無預期大量水或液體侵入時，電源轉接器内部之電 子元件更會立即造成短路與損壞。 為了避免強制式散熱方式所帶來的水氣入侵問題，可將電子元件 〇與空氣流道之間設有分隔板，避免水氣入侵至電子元件。在這樣的設 十下利用二氣流道所驅動的氣流快速帶離已傳導至分隔板的熱量， 以達到間接賴目的。然而，在間接散熱方式巾，由於外界的冷空氣 並未直接接_電子元件，故其離_的錢仍然有限。 【發明内容】 〇 本發明之主要目的在提供—種可防水的電子裝置散熱結構，其利 間結構將殼聽構⑽分隔成彼此連通之空間或腔室，並利用風 2触=__，w卜界__子_又迅速 轉接器之朗壽命與降低電源轉接器之電_ 構主要包含殼體 名一通風孔、第 部’以將殼體結 基於上述目的’本發啊时的f子裝置散熱結 結構、隔間結構、風扇。殼體結構具有第一通風孔、 排水孔、第一排水孔。隔間結構設置於殼體結構内 5 201036525 構内部分隔成彼此連通之人風腔室、風扇室、容置空間、出風腔室。 風扇設置於風扇室内，以使氣流由第一通風孔與第二通風孔流動進 出，且氣流依序流經人風腔室、風扇室、容置空間、峰腔室，以帶 離设置於容置空間内電路板總成所產生的熱。 本發明之次要目的在提供-種可防水的電子錢絲結構，盆利 用在入、出«分別言史置權水板、以及略高或傾斜於排水孔的底板與 〇側板’以導引流體或水氣所凝結成的水滴經由排水孔排出，而達到防 水的目的，以避免電子元件遭受短路與損壞。 基於上述目的，在本㈣可防水的電子裝置賴結構卜入風腔 室包含-人風腔室底板與人風通風頸，人風腔室底板的位置被設置成 ^對於第-排水孔。人風通風_人風口與第—通風孔被設置成彼此 卩细沒有孔_部份外殼作為檔水板）。域腔室包含出風腔 出風通風軸防水擔板。人風腔室底板的位置概置成相對 ;排JC孔jr方水擒板被設置在出風通風頸的出風口與第二通風孔 t間且彼此被相隔設置。 神可以藉由以下的發明詳述及所附圖式得 關於本發明之優點與精 到進一步的瞭解。 【實施方式】 6 201036525 請參閱第u〜出圖，第1Α〜1β -熱結構之外觀示意圖。請參閱第2A〜2；B圖1 明可防水的電子裝置散 -防水的電子裝置散熱結構之内部示音圖。Μ弟M〜2B圖為本發明可 3A〜3C圖為本發明可防水的電子裝置細 =第3A〜3C圖，第 从〜3B圖為沿著第1A圖所示之处線段=之=示意圖。第 沿著第U圖所示之CD線段作剖切的剖^切的剖面圖。第冗圖為 千夕赵麯从碰… 、；王要包合如第1A〜1B圖所 不之喊體結構⑴、12)、如第3 圆所 部的隔” 團所不之叹置在殼體結構(1卜12)内 )、料如第2B _吨置在«結構⑴， 内损風扇(16)。這其中，殼體結構由 殼體⑽所構成。 Μ卞口的上咸體(11)與下201036525 VI. Description of the invention: [Technical field to which the invention pertains] In particular, a waterproof, electronically mounted thermal structure. The present invention relates to a heat dissipating structure. [Prior Art] 发展 With the trend of lightness and thinness, the volume of an electronic device is also reduced, but the problem of heat dissipation of an electron (4) such as a money source is more serious. In the case of electricity, the area of the contact area is also reduced. The electronic connector on the printed circuit board is used to bite the inside and outside of the ship as a heat (f). _ _ power adapter does not constitute the composition of the plastic material due to poor heat transfer, resulting in 敎 quantity === 姊 刚 just _ ° magnetic # _ heat problem, = = Γ electronic components are prone to damage 'not only reduce the power supply The use of the adapter can be reduced, and the power conversion efficiency of the power adapter can be reduced. In the market, there are also scattered and turned-on power adapters designed for the purpose of verification. In order to make the heat generated by the hot electronic components effectively dissipate into several heat sinks, and the electronic components and heat dissipation The snails are 2 t = interconnects to help the electronic components scatter the seams. However, today's wireless devices have been miniaturized and developed with high power, making the traditional passive heat dissipation method a heat dissipation requirement. To use the forced heat dissipation method on the right, a through hole is added to the housing of the power adapter to make the power source communicate with the outside air, and the fan is used to accelerate the heat dissipation efficiency. However, because there are through holes in the housing, the internal electronic components may be short-circuited or damaged due to long-term contact with water or moisture when the power adapter is operated in a humid environment or outdoors. . If an accidental or unexpected large amount of water or liquid intrudes, the electronic components inside the power adapter may cause short-circuit and damage immediately. In order to avoid the problem of moisture intrusion caused by the forced heat dissipation method, a partition plate may be arranged between the electronic component 〇 and the air flow path to prevent moisture from invading the electronic component. Under such a setting, the airflow driven by the two airflow paths is used to quickly carry away the heat that has been conducted to the partition plate, so as to achieve an indirect effect. However, in the indirect heat-dissipating method, since the outside cold air is not directly connected to the electronic component, the money from the _ is still limited. SUMMARY OF THE INVENTION The main object of the present invention is to provide a waterproof structure for a waterproof electronic device, the intervening structure separating the shell hearing structure (10) into a space or a chamber that communicates with each other, and using the wind 2 touch = __, w卜界__子_The speed of the adapter and the power of the power adapter are reduced. The structure mainly includes the housing name, a ventilation hole, and the first part is used to make the housing knot based on the above purpose. f sub-device heat sink structure, compartment structure, fan. The housing structure has a first ventilation hole, a drainage hole, and a first drainage hole. The compartment structure is disposed in the casing structure. 5 201036525 The interior of the structure is divided into a human air chamber, a fan chamber, an accommodation space, and an air outlet chamber. The fan is disposed in the fan chamber, so that the airflow flows in and out from the first ventilation hole and the second ventilation hole, and the airflow sequentially flows through the human air chamber, the fan chamber, the accommodation space, and the peak chamber to be disposed away from the air chamber. Set the heat generated by the board assembly in the space. The secondary object of the present invention is to provide a water-repellent electronic money structure, which is used for guiding in and out of the bottom plate and the side plate which are slightly higher or inclined to the drainage hole. Water droplets condensed by fluid or moisture are discharged through the drain hole to achieve waterproofing to avoid short circuit and damage of the electronic components. Based on the above object, in the (4) water-repellent electronic device, the structure into the wind chamber comprises a manhole chamber bottom plate and a human air vent neck, and the position of the manhole chamber floor is set to be the first drain hole. Ventilation ventilation _ The ventilator and the ventilating holes are arranged to be thinner and have no holes _ part of the casing as a water deflector). The domain chamber contains an air outlet venting shaft waterproofing plate. The position of the floor of the plenum chamber is set to be opposite; the JC hole jr square water slab is disposed between the air outlet of the venting vent neck and the second venting hole t and is spaced apart from each other. The advantages and details of the present invention will become apparent from the following detailed description of the invention and the accompanying drawings. [Embodiment] 6 201036525 Please refer to the u-output, the first Α~1β-heat structure appearance diagram. Please refer to 2A~2; B. Figure 1 shows the internal sound map of the heat-dissipating structure of the waterproof electronic device. The drawing of the younger brother M~2B is 3A~3C of the present invention, and the electronic device which can be waterproofed according to the present invention is finer = 3A~3C, and the figure from 〜3B is the line along the line shown in Fig. 1A == . A cross-sectional view taken along the line of the CD shown in Fig. U. The second redundant picture is for the singer of Qianxi Zhaoqu... I want to include the screaming structure (1), 12) as in the 1st to 1st, and the sigh of the 3rd round. The housing structure (1b 12), the material such as the 2B_ton is placed in the «structure (1), the internal loss fan (16). Among them, the housing structure is composed of the housing (10). (11) and below
輔m〜Β騎较外觀示賴，為了讓冷空氣流進、流出殼體 、屬1、12) ’可僅在上殼酬上開設有第—通風孔⑴4)、第二通風 孔(113)。在風扇⑽所提供的空氣吸引力之下，外界冷空氣可由第一 通風=(1Μ)被引入，並流經殼體結構⑴、⑵内部的各個組件(特別是 產生高熱源的電子元件)之後，最終由第二通風孔⑴$被排出。為了排 出流體或錢·結成的水滴，可僅在流出上殼_)上開設第一排 水孔(112)、第二排水孔(111)，且第—排水孔(112)、第二排水孔⑴^ 可被分別設置在相鄰於第—通風孔(114)、第二通風孔(113)且在上殼體 (11)的側面上。 7 201036525 考慮到風扇(16)強大的空氣吸引力會意外吸入水氣，帛來引入空 的第，風孔_在數量上可少於第二通風孔(ιΐ3)，以減少吸入 里如第3A圖所不，在第—通風孔(m)的設置上，入風通風頸(141) 的入風口（1412)與第-通風孔⑴4)被設置成彼此錯位，以避免水氣直 接經由入風通風頸(141)接觸到内部的電子元件。 在上又體(11)兩知上的第一通風孔(114)、第二通風孔(⑴)的數量 〇雖不均專但疋在考慮到美觀與對稱性，防止水氣直接被吸入至容 置工間(121) ’可在上殼體(u)上設置如m圖所示之複數個盲孔(出）。 第-通風孔(1M)再加上複數個盲孔⑴5)，其數量、排列方式相當於第 二通風孔(113)。換言之，複數個盲孔_被設置成相對於人風通風頸 (141)的入風Π(1412) ’而第—通風孔(114)被設置在複數個盲孔⑴5)的 兩側，如第1Β圖所示。 〇 如第2Α〜2Β圖所示’設置在殼體結構(11、12)内部的隔間結構 (116、117) ’可將殼體結構内部分隔成彼此連通之入風腔室(μ)、風扇 室(15)、容置空間(121)、出風腔室(13)。風扇⑽設置於風扇室⑽内， 以使氣流由第一通風孔(114)、第一排水孔(112)與第二通風孔(113)、第 二排水孔(111)流動進出。如第3C圖所示之箭頭方向13c，氣流依序流 經入風腔室(14)、風扇室(15)、容置空間(121)、出風腔室(13)，以帶離 设置於谷置空間(m)内電路板總成所i生的熱，以避免降低電源轉接 器之使用壽命與降低電源轉接器之電源轉換效率。 8 201036525 入風腔室(14)、風扇室(15)、出風腔室(13)可被設置在上殼體(u)， -而容置空間(121)可被設置在下殼體(12)。設置風扇(16)的風扇室(15)被 設置在入風腔室(14)與出風腔室(13)之間，而入風腔室(η)、風扇室 (15)、出風腔室(13)大體上平行於容置空間(⑵）。入風腔室(14)與出風 腔室(13)經由風扇室(15)、容置空間(丨21)而達到間接連通。具體來說， 如第2B圖所示，風扇室(15)具有入口（152)與出口(151)。入口(152)分 別與風扇(16)的如第3B圖所示之頂面入風口（162)、入風通風頸(141) 〇的出風口(Mil)連通，而出口⑽)分別與風扇⑽的側面出風口 (161)、容置空間(121)連通。這其中，入風腔室(14)相對於在上殼體(11) 的第一通風孔(114) ’而出風腔室(13)相對於第二通風孔(113)。 如此一來，設置在風扇室(15)的風扇（16)所提供的吸引力，能夠如 第3B圖所示之箭頭方向114邊由第一通風孔(114)、入風腔室㈣吸 入外界冷空氣，並將之導入容置空間⑽），最終第3B圖所示之箭頭 〇方向13a經由出風腔室(13)、第二通風孔⑴3)排出空氣。在這個過程 令，藉著風扇室(15)所吸入的冷空氣被導入容置空間(121)之後，冷空 氣將直接接觸到容置空間⑽)中的電路板總成，然後如第3c圖戶= • ^箭頭㈣13b已吸收部份熱能的空氣將由容置空間(121)流向出風腔 至(13) ’最終排出本發明可防水的電子襄置散熱結構⑴。 *另外’風扇⑽所驅動的氣流亦可第3B圖所示之箭頭方向⑽ 由第-排水孔(U2)被吸入至入風腔室(14)，而風扇⑽所驅動的氣流亦 可從由出風腔室(13)經由該第二排水孔⑴⑽排出。 9 201036525 為了避免冷空氣所含有的水氣從第一通風孔(丨14)被引入，甚至流 體直接從第-通風孔(114)或第二通風孔(113)被倒入，入風腔室(14)與 出風腔室(13)需要有特殊結構設計。簡單來說，在人風腔室(14)與出風 腔至(13)々別δ又置檔水板、以及略高或傾斜於第一排水孔(I〗])、第二 排水孔(111)的底板與側板，以導引流體或水氣所凝結成的水滴經由第 -排水孔(112)、第二排水孔(111)排出，而同時達到防水的目的，以避 ◎免電子元件遭受短路與損壞。 請參閱第4Α〜4C ®，第4Α〜4C圖為本發明防水腔室之示意圖。 如第4A圖所tf ’人風腔室(14)包含入風腔室底板(142)與入風通風頸 (141)。如第3A〜3B圖所示，人風腔室底板〇42)被設置成相對於第一 排水孔(m)，而錢通風頸(141)的入風口（1412)與第一通風孔⑴句被 設置成彼此錯位。如第4B〜4C圖所示，出風腔室(13)包含出風腔室底 〇板(133)、出風通風頸(132)與防水擔板(131)。如第3A〜3B圖所示，防 水擋板(131)被設置在出風通風頸(132)的出風口 (⑽)與第二通風孔 (113)之間且彼此被相隔設置。 如第3A〜3B圖所示，入風通風頸_的入風口(1412)與第一通風 孔(114)被設置成彼此錯位’因此在風扇室⑽的風扇⑽所提供的吸引 力’外界冷空氣能夠如第3B SI所示之箭頭方向馳經由第—通風孔 (114)、入風腔室⑽中入風通風頸(141)的入風口(1412)經過，並被導 入風扇室(15)。在這個過程巾’由第—通觀(114)流向人風通風頸⑽) 10 201036525 時，空氣將如箭頭方向l14a略有轉f，同時還考慮到人風通風頸⑽) .的長度與風扇室⑽的空氣吸人力之間_連性，使得空氣中的水氣 1將被暫時滞留在入風腔室(14)的壁面(特別是入風通風頸(W)的壁 面）、、从腔室底板_或相對於入風腔室㈣之上殼體⑼的壁面之 上’並藉著入風腔室底板(142)、隔間結構⑴7)被設置成相對於第一排 水孔(112)的_，導引流體或水氣所凝結成的水滴如第3A圖所示之 箭頭方向Mb經由於第-排水孔⑴幻排出，而達到防水的目的，以避 〇免電子元件遭受短路與損壞。換言之，入風腔室底板㈣與該第一排 水孔(112)相銜接，使得該入風腔室14藉由第一排水孔㈣與外界空 間相連通。相對地，水滴或水氣被暫時滯留在出風腔室⑽的壁面(特 別是出風通風頸㈣的壁面）、出風腔室底板(133)或相對於出風腔室 (13)之殼體⑼的壁面之上時’可藉著出風腔室底板(133)、隔間結構 ⑽)被設置成相對於第二排水孔(111)的關係，導引流體或水氣所凝結 成的水滴如第3A圖所示之箭頭方向13b經由於第二排水孔(lii)排出。The auxiliary m ~ Β ride is more attractive, in order to let the cold air flow in and out of the shell, the genus 1, 12) ' can only open the first venting hole (1) 4), the second venting hole (113) . Under the air attraction provided by the fan (10), outside cold air can be introduced by the first ventilation = (1 Μ) and flow through the various components inside the housing structure (1), (2) (especially the electronic components that generate high heat sources) Finally, it is discharged by the second ventilation hole (1)$. In order to discharge the fluid or the water droplets formed, the first drain hole (112), the second drain hole (111), and the first drain hole (112) and the second drain hole (1) may be opened only on the outflow upper shell _). ^ may be disposed adjacent to the first venting hole (114), the second venting hole (113), and on the side of the upper casing (11). 7 201036525 Considering the strong air attractiveness of the fan (16), it will accidentally inhale the water vapor, and the air inlet _ will be less than the second venting hole (ιΐ3) in order to reduce the inhalation as in the 3A In the arrangement of the first ventilation hole (m), the air inlet (1412) and the first ventilation hole (1) 4) of the air inlet vent (141) are arranged to be misaligned with each other to prevent the water vapor from directly entering the air. The venting neck (141) contacts the internal electronic components. The number of the first venting holes (114) and the second venting holes ((1)) on the upper body (11) is not uniform, but the beauty and symmetry are taken into consideration to prevent the water vapor from being directly sucked into the body. The holding station (121) ' can set a plurality of blind holes (out) as shown in the m-picture on the upper casing (u). The first venting hole (1M) is further provided with a plurality of blind holes (1) 5), and the number and arrangement thereof are equivalent to the second venting holes (113). In other words, the plurality of blind holes _ are arranged to be opposite to the air inlet raft (1412) of the human ventilating neck (141) and the first venting holes (114) are disposed on both sides of the plurality of blind holes (1) 5), such as 1 is shown in the figure. For example, the compartment structure (116, 117) disposed inside the casing structure (11, 12) as shown in Fig. 2~2Β can divide the interior of the casing structure into an air inlet chamber (μ) that communicates with each other, Fan chamber (15), accommodation space (121), and air outlet chamber (13). The fan (10) is disposed in the fan chamber (10) to allow airflow to flow in and out of the first ventilation hole (114), the first drainage hole (112) and the second ventilation hole (113), and the second drainage hole (111). As shown in the arrow direction 13c shown in FIG. 3C, the airflow sequentially flows through the air inlet chamber (14), the fan chamber (15), the accommodating space (121), and the air outlet chamber (13) to be disposed away from each other. The heat generated by the board assembly in the space (m) avoids reducing the service life of the power adapter and reducing the power conversion efficiency of the power adapter. 8 201036525 The air inlet chamber (14), the fan chamber (15), the air outlet chamber (13) may be disposed in the upper casing (u), and the accommodation space (121) may be disposed in the lower casing (12) ). A fan chamber (15) for setting a fan (16) is disposed between the air inlet chamber (14) and the air outlet chamber (13), and the air inlet chamber (n), the fan chamber (15), and the air outlet chamber The chamber (13) is substantially parallel to the accommodating space ((2)). The air inlet chamber (14) and the air outlet chamber (13) are in indirect communication via the fan chamber (15) and the accommodation space (丨21). Specifically, as shown in Fig. 2B, the fan chamber (15) has an inlet (152) and an outlet (151). The inlets (152) are respectively connected to the top air inlet (162) of the fan (16) as shown in FIG. 3B, the air outlet (Mil) of the air inlet vent (141), and the outlet (10) and the fan (10), respectively. The side air outlet (161) and the accommodation space (121) are connected. Here, the air inlet chamber (14) is opposite to the second air vent (113) with respect to the first air vent (114)' in the upper casing (11). In this way, the attractive force provided by the fan (16) disposed in the fan chamber (15) can be sucked into the outside by the first ventilation hole (114) and the air inlet chamber (4) as indicated by the arrow direction 114 in FIG. 3B. The cold air is introduced into the accommodating space (10)), and finally the arrow 〇 direction 13a shown in Fig. 3B is discharged through the air outlet chamber (13) and the second vent hole (1) 3). In this process, after the cold air sucked in by the fan chamber (15) is introduced into the accommodating space (121), the cold air will directly contact the circuit board assembly in the accommodating space (10), and then as shown in Fig. 3c. Household = • ^ arrow (four) 13b The air that has absorbed part of the heat will flow from the accommodating space (121) to the venting chamber to (13) 'final discharge of the waterproof heat-dissipating structure (1) of the present invention. * In addition, the airflow driven by the fan (10) can also be sucked into the air inlet chamber (14) by the first drain hole (U2) in the direction of the arrow (10) shown in Fig. 3B, and the air flow driven by the fan (10) can also be controlled. The outlet chamber (13) is discharged through the second drain hole (1) (10). 9 201036525 In order to prevent the moisture contained in the cold air from being introduced from the first vent (丨14), even the fluid is directly poured from the first vent (114) or the second vent (113) into the air chamber. (14) A special structural design is required with the outlet chamber (13). Briefly, in the plenum chamber (14) and the outlet chamber to (13), the δ is placed on the water plate, and slightly higher or inclined to the first drainage hole (I]], and the second drainage hole ( 111) The bottom plate and the side plate, the water droplets condensed by the guiding fluid or the water gas are discharged through the first drain hole (112) and the second drain hole (111), and at the same time achieve the purpose of waterproofing to avoid the electronic component Suffer from short circuit and damage. Please refer to Section 4~4C®, and Figures 4 to 4C are schematic views of the waterproof chamber of the present invention. As shown in Fig. 4A, the tf 'human chamber (14) includes an inlet chamber floor (142) and an inlet vent neck (141). As shown in Figures 3A to 3B, the plenum chamber floor 42) is disposed opposite to the first drain hole (m), and the air inlet (1412) of the money vent neck (141) and the first vent hole (1) They are set to be misaligned with each other. As shown in Figs. 4B to 4C, the air outlet chamber (13) includes an air outlet chamber bottom plate (133), an air outlet vent neck (132), and a waterproof support plate (131). As shown in Figs. 3A to 3B, the water baffle (131) is disposed between the air outlet ((10)) of the air outlet vent (132) and the second vent hole (113) and is spaced apart from each other. As shown in Figures 3A to 3B, the air inlet vent (1412) and the first venting opening (114) are arranged to be misaligned with each other 'therefore the attraction provided by the fan (10) in the fan chamber (10) is cold outside. The air can pass through the first vent hole (114), the air inlet (1412) of the air inlet vent (141) in the air inlet chamber (10), and is introduced into the fan chamber (15). . In this process towel 'from the first-view (114) to the human ventilating neck (10) 10 201036525, the air will slightly turn f as the direction of the arrow l14a, while also taking into account the length of the ventilating neck (10)) and the fan room (10) The air suction between the humans is such that the water vapor 1 in the air will be temporarily retained in the wall surface of the air inlet chamber (14) (especially the wall surface of the air inlet vent (W)), and from the chamber The bottom plate _ is disposed above the wall surface of the casing (9) above the inlet air chamber (4) and is disposed relative to the first drainage hole (112) by the air inlet chamber floor (142) and the compartment structure (1) 7) _, the water droplets condensed by the guiding fluid or the moisture gas, as shown in the arrow direction Mb shown in FIG. 3A, are discharged through the first-drainage hole (1) to achieve the purpose of waterproofing to avoid short-circuiting and damage of the electronic component. In other words, the inlet chamber (4) of the inlet chamber is engaged with the first drain hole (112) such that the inlet chamber 14 communicates with the outside space by the first drain hole (4). In contrast, water droplets or moisture are temporarily retained in the wall surface of the air outlet chamber (10) (especially the wall surface of the air outlet vent neck (4)), the air outlet chamber floor (133) or the shell relative to the air outlet chamber (13). When the wall of the body (9) is above, the air outlet chamber floor (133) and the compartment structure (10) can be arranged to be condensed with respect to the second drain hole (111). The water droplets are discharged in the arrow direction 13b as shown in Fig. 3A via the second drain hole (lii).
D 當本發明可防水的電子裝置散熱結構⑴被直立放置時(即第—通 風孔(114)朝上，而第二通風孔〇13)朝下)時，如第4A圖所示之入風通 風’員(Ml)的長度⑻设计’則必須考慮風扇(π)吸入空氣時，在入風妒 室(14)處產生負壓力之情形，否則水滴被吸含於入風腔室(1句内將不: 排出。在入風腔室(14)處產生負壓力時，主要藉著水滴本身的重力， 來克服風扇（16)的吸入之負壓，其公式如下：D When the heat-dissipating structure (1) of the waterproof device of the present invention is placed upright (ie, the first vent (114) faces upward and the second vent 13 faces downward), the wind enters as shown in FIG. 4A. The length of the ventilation member (Ml) (8) design must consider the situation where the fan (π) inhales air and generates negative pressure at the inlet chamber (14), otherwise the water droplets are sucked into the air inlet chamber (1 sentence) The inside will not: discharge. When the negative pressure is generated at the inlet chamber (14), the negative pressure of the suction of the fan (16) is mainly overcome by the gravity of the water droplet itself. The formula is as follows:
Pl=水位壓力 Ρ2=風扇吸入靜壓 201036525 P1>P2時有利於將水排出Pl=water level pressure Ρ2=fan suction static pressure 201036525 P1>P2 is good for draining water
Pl=/〇gh (Pressure=Density*Acceleration of Gravity*Height) p =1000Kg/m3 (Density of Water) g=9.81m/S2 (Acceleration of Gravity) 假言史：風扇吸入之靜壓(P2)為9.66mm-Aq(實測值)時，則 h>9.66*9.81/(1000*9.8 l)=0.00966m=9.66mm f) 換§之，入風通風頸(141)的長度⑻正比於風扇室(ι5)的空氣吸入 力。風扇室(15)的空氣吸入力會受到其内部結構與風扇（16)的吸入之 負壓影響。 —在散熱結構⑴被直立放置時，為了能夠進—步排水，在入風通風 頸(141)的出風口(1411)附近’從入風通風頸(⑷)延伸出傾斜板 (Ml3)如第4A圖所不。然後，流體或水滴將如箭頭_沿著傾斜板 (1祀）、隔間結構(m)或人風腔室底板⑽)從第—排水孔(m)排出。 相對地’料水滴存在於出風腔_時，為了能夠順利排水，同樣 在出風通風頸㈣的人風口(咖)附近，從出風通風頸_延伸出一 ，如第4B〜4C圖所示。然後，流體或水滴將如箭頭13b :、斜板(1323)、關結_6)或_啦_賴二排水孔 另外 為了克服水滴之表面張力及點 滯性，傾斜板(1413、1323) 12 201036525 ::角度例如5度，以加速排水。換言之，出風通風頸(132)延伸出 、*斜板〇323) ’由遠離出風通風頸(m)的端點帶有向出風腔 斜的斜面’而斜面的斜角為3〜3G度。同樣地，人風觀頸(141) 的傾斜板(⑷3)，由遠離人風通風哪⑽端點帶有向入風腔 以確保水滴不 =)内部傾斜的斜面’而斜面的斜角為3〜3〇度。為了阻擔水氣的進 入’防水擋姉31)之面尺寸必須大於通_口端尺寸 會滴入出風通風頸(132)。 θ 藉由以上較佳具體實施例之詳述，係希望能更加 ^特f與精神，而鱗以上述露的較佳具體實施例來:㈣之 =加以限制。相反地，其目的是希望能涵蓋各觀變及具相等性的 文排於本發賴对請之專·目的範細。 、 【圖式簡單說明】Pl=/〇gh (Pressure=Density*Acceleration of Gravity*Height) p =1000Kg/m3 (Density of Water) g=9.81m/S2 (Acceleration of Gravity) History of hypothesis: static pressure (P2) of fan suction is 9.66mm-Aq (measured value), then h>9.66*9.81/(1000*9.8 l)=0.00966m=9.66mm f) In other words, the length of the inlet vent neck (141) (8) is proportional to the fan chamber ( Ι5) Air suction force. The air suction force of the fan chamber (15) is affected by the internal pressure of the internal structure and the suction of the fan (16). - When the heat dissipation structure (1) is placed upright, in order to enable further drainage, the sloping plate (Ml3) extends from the inlet vent neck ((4)) near the air outlet (1411) of the inlet vent neck (141). 4A is not. Then, the fluid or water droplets will be discharged from the first drain hole (m) as arrow _ along the sloping plate (1 祀), the compartment structure (m) or the plenum chamber floor (10). Relatively, when the material droplets are present in the air outlet _, in order to be able to drain smoothly, the air outlet vents are also extended in the vicinity of the air outlet (coffee) of the air outlet vent (4), as shown in Figures 4B to 4C. Show. Then, the fluid or water droplets will be as shown by the arrow 13b:, the swash plate (1323), the closing _6) or the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 201036525: Angles such as 5 degrees to accelerate drainage. In other words, the outlet venting neck (132) extends out, * sloping plate 〇 323) 'the end point away from the outlet venting neck (m) with a slope inclined to the outlet chamber' and the bevel angle of the slope is 3 to 3G degree. Similarly, the sloping plate ((4)3) of the human wind neck (141) is ventilated away from the wind (10) end point with a slope facing the air inlet chamber to ensure that the water droplets are not slanted internally. The bevel angle of the slope is 3 ~3 degrees. In order to prevent the entry of moisture, the size of the surface of the waterproof damper 31 must be larger than the size of the through-end end, and the ventilating neck (132) will be dripped. θ is intended to be more specific and advantageous by the detailed description of the preferred embodiments above, and the scales are limited by the preferred embodiment of the above disclosure: (d). On the contrary, the purpose is to cover the scope of the changes and the equivalents of the texts. , [Simple description of the map]
第U]B圖為本發明可防水的電子打散熱結構之外觀示意圖 第2A〜2B圖為本發明可防水的電子妓散熱結構之内部示意圖。 第3A〜3C圖為本㈣可防水㈣子裝置賴結構之剖面示意圖。 第4A〜4C圖為本發明防水腔室之示意圖。 ° 【主要元件符號說明】 1可防水的電子裝置散熱結構 11、12殼體結構 13 201036525 111第二排水孔 112第一排水孔 113第二通風孔 114第一通風孔 115盲孔 116、117隔間結構 13出風腔室 14入風腔室 15風扇室 16風扇 121容置空間 131防水擋板 132出風通風頸 133出風腔室底板 141入風通風頸 142入風腔室底板 14FIG. 7A to FIG. 2B are schematic diagrams showing the appearance of the water-repellent electronic heat-dissipating structure of the present invention. FIG. 2A to FIG. Figures 3A to 3C are schematic cross-sectional views of the (4) water-repellent (four) sub-device structure. 4A to 4C are schematic views of the waterproof chamber of the present invention. ° [Main component symbol description] 1 Waterproof electronic device heat dissipation structure 11, 12 housing structure 13 201036525 111 second drainage hole 112 first drainage hole 113 second ventilation hole 114 first ventilation hole 115 blind hole 116, 117 compartment Inter-structure 13 air outlet chamber 14 air inlet chamber 15 fan chamber 16 fan 121 accommodation space 131 waterproof baffle 132 air outlet vent 133 air chamber bottom plate 141 air inlet vent 142 air chamber bottom plate 14