201032348 六、發明說明： 【發明所屬之技術領域】 封裳結構、發光單元及 本發明係關於一種發光二極 背光模組。 【先前技術】 ❹ 發光二極體（Light-Emitting Diode，LED)為通電時可 發光的半導體元件，其是利用摻雜有πι_ν族化學元素， 如磷化鎵（GaP)、石申化鎵（GaAs)等之半導體材料所製成 的發光元件。發光原理是將電能轉換為光，也就是對化合 物半導體施加電流，透過電子與電洞的結合，將能量以: 的形式釋出，達成發光的效果。LED最大㈣點在於益需 暖燈時間（idling time)、反應速度快（約在1〇·9 =、、:、電（壽命長達十萬小時以上)、污染低、適合量 可罪度咼，容易配合應用上的需要製 =，適用範圍廣泛，如汽車、通訊產業、 唬及顯示器等。 ，四又通 請參照圖1所示，其為習知發 -示意圖，發光二極體封二：:， 二極體晶粒12、一導電：：具有一殼體11、-發光 具有一凹陷部⑴，發光二^日；'封裝材料14。殼體11 上並位於凹陷部⑴内 ^ 12设置於導電元件13 並覆蓋發光二極體晶粒12縣㈣14設置於㈣部⑴ 當發光二㈣晶粒12所發㈣光線射至封裝材料14 4 201032348 後，由於封裝材料14與空氣之折射率差異較大，導致部 分光線不會直接射至空氣，反而會全反射回封裝材料14。 然而，由於殼體11之材料會吸收部分的光線，以殼體11 的材質為聚鄰苯二甲醯胺（Polyphthalamide，PPA)為例， 其具有10%〜15%的吸收率。因此，當光線射至凹陷部111 之侧壁111a上時，會有部分的光線被側壁Ilia吸收，進 而造成發光二極體封裝結構1整體的出光亮度減弱。 因此，如何提供一種發光二極體封裝結構、發光單元 ® 及背光模組，能夠提高發光二極體封裝結構之出光亮度， 正是當前的重要課題之一。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種能夠提高 發光二極體封裝結構之出光亮度之發光二極體封裝結 構、發光單元及背光模組。 _ 為達上述目的，本發明提供一種發光二極體封裝結 構，包含一導電元件、一發光二極體晶粒、一殼體、一螢 光沉澱層及一封裝膠。發光二極體晶粒與導電元件電性連 接。殼體包覆至少部分導電元件，並具有一容置部，發光 二極體晶粒位於容置部。螢光沉澱層沉澱於至少部分之容 置部。封裝膠充填於容置部，並覆蓋發光二極體晶粒。 為達上述目的，本發明提供一種發光單元，包含一電 路板及至少一發光二極體封裝結構。發光二極體封裝結構 係設置於電路板，發光二極體封裝結構包含一導電元件、 5 201032348 一發光二極體晶粒、一殼體、一螢光沉澱層及一封裝膠。 ' 發光二極體晶粒與導電元件電性連接。殼體包覆至少部分 導電元件，並具有一容置部，發光二極體晶粒位於容置 部。螢光沉澱層沉澱於至少部分之容置部。封裝膠充填於 容置部，並覆蓋發光二極體晶粒。 為達上述目的，本發明提供一種背光模組，包含一背 板及至少一發光單元。發光單元設置於背板，發光單元包 含一電路板及至少一發光二極體封裝結構。發光二極體封 春 裝結構係設置於電路板，發光二極體封裝結構包含一導電 元件、一發光二極體晶粒、一殼體、一螢光沉澱層及一封 裝膠。發光二極體晶粒與導電元件電性連接。殼體包覆至 少部分導電元件，並具有一容置部，發光二極體晶粒位於 容置部。螢光沉澱層沉澱於至少部分之容置部。封裝膠充 填於容置部，並覆蓋發光二極體晶粒。 承上所述，因依本發明之發光二極體封裝結構、發光 ©單元及背光模組係將封裝膠中的複數螢光體粒子，沉澱於 至少部分殼體之容置部上，而形成一螢光沉澱層。如此一 來，當發光二極體晶粒所發出之光線被全反射至殼體時， 較不易被殼體吸收，進而能提升發光二極體封裝結構之出 光亮度。 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之發 光二極體封裝結構、發光單元及背光模組，其中相同的元 201032348 件將以相同的參照符號加以說明。 請同時參照圖2及圖3所示’其 發光二極體封裝結構2之-示意圖，、2為本實施例之 Α-Α之一剖面示意圖。 為/口圖2之直線 ^發明實施例之發光二極體封裝結構2 7L件21、一發光二極體晶粒22、—加 3導電 層以及-封裝膝25。在此，發光二23二勞光沉殿 一了頁面屮氺r f .、 體封4結構2係以 φ 面出先（top Vlew)之封裝結構為例。 導電元件21於此係以一導緩牟 二個導電捲腳^ .导線木為例，導線架可具有 貫例中，部分導電元件2!固定於 成體23中，二個導電接腳211則 、 折至殼體23之底部。 路於双體23外，並f 定二Si體晶粒22可利用導電膠(圖中未顯示）固 '導電件21上，發光二極體晶粒 別與導電元件21的二個導電接腳211』=電=^刀 發光二極體晶粒22之一電極利用 $例如’ 豆巾夕一兩^ 〜用导電膠與導電接腳211 顯 連接，另—電極則可利用金屬接線（圖中未 ，·，、員不）與另一導電接腳211電性連接。 殼體23包覆至少部分導電元件2卜並具有—容置部 加’發光二極體晶粒22位於容置部231。本實施例中， 殼體23之材質係包含玻璃纖維、氧化鈦、氧化辦、石夕、 聚鄰苯二甲醯胺、陶莞或其組合。其中，容置部231的侧 壁23U具有一斜面、一曲面或其組合。請同時參照圖3 至圖5所不，容置部231之側壁231a、231b、231c可具有 7 201032348 二斜面（圖3)、一斜面（圖4)或一曲面（圖5)。 側壁上的斜面或曲面數量可依產品設計需求而定，如 圖3所示，當側壁231a具有複數斜面心、&時，該等斜 面s】、S2可具有不同斜率，於此係以接近導電元件之 斜面s〗之斜率小於遠離導電元件21之斜面心為例，該等 斜面S〗、S2係於殼體23以高溫射出成型時—併形成。"、201032348 VI. Description of the Invention: [Technical Field of the Invention] The cover body structure, the light-emitting unit and the invention relate to a light-emitting diode backlight module. [Prior Art] Light A Light-Emitting Diode (LED) is a semiconductor element that emits light when it is energized. It is doped with a chemical element such as gallium phosphide (GaP) or gallium arsenide. A light-emitting element made of a semiconductor material such as GaAs). The principle of luminescence is to convert electrical energy into light, that is, to apply a current to a compound semiconductor, and through the combination of electrons and holes, the energy is released in the form of: to achieve the effect of luminescence. The maximum (four) point of LED is idling time and fast response time (about 1〇·9 =, ,:, electricity (life is more than 100,000 hours), low pollution, suitable amount of guilty 咼It is easy to match the needs of the application =, a wide range of applications, such as automotive, communications industry, 唬 and display, etc., please refer to Figure 1 for the four-way, it is a well-known diagram - the light-emitting diode package two:: The diode die 12, a conductive: has a housing 11, the light emitting has a recess (1), and the light emitting is performed; the encapsulating material 14. The housing 11 is located in the recess (1) and is disposed at Conductive element 13 and covering the light-emitting diode die 12 county (four) 14 is set in the (four) part (1) when the light-emitting two (four) crystal grain 12 (four) light is emitted to the packaging material 14 4 201032348, due to the refractive index difference between the packaging material 14 and the air Large, causing some of the light to not directly hit the air, but will be totally reflected back to the encapsulating material 14. However, since the material of the casing 11 absorbs part of the light, the material of the casing 11 is polyphthalamide ( Polyphthalamide (PPA), for example, has 10% to 15% Therefore, when light is incident on the side wall 111a of the depressed portion 111, part of the light is absorbed by the side wall Ilia, thereby causing the light-emitting brightness of the entire light-emitting diode package 1 to be weakened. Therefore, how to provide a kind of light The light-emitting diode package structure, the light-emitting unit®, and the backlight module can improve the light-emitting brightness of the light-emitting diode package structure, which is one of the current important issues. [Invention] In view of the above problems, the object of the present invention is A light emitting diode package structure, a light emitting unit and a backlight module capable of improving the light output brightness of the light emitting diode package structure are provided. _ In order to achieve the above object, the present invention provides a light emitting diode package structure including a conductive component, a light-emitting diode die, a casing, a fluorescent precipitation layer and an encapsulant. The light-emitting diode die is electrically connected to the conductive component. The casing covers at least a part of the conductive component and has a receiving portion The light-emitting diode crystal grain is located in the accommodating portion, and the fluorescent precipitation layer is deposited on at least part of the accommodating portion, and the encapsulant is filled in the accommodating portion and covers the illuminating portion. In order to achieve the above object, the present invention provides a light emitting unit comprising a circuit board and at least one light emitting diode package structure. The light emitting diode package structure is disposed on the circuit board, and the light emitting diode package structure comprises a conductive element, 5 201032348 a light-emitting diode die, a casing, a fluorescent precipitation layer and an encapsulant. The light-emitting diode die is electrically connected to the conductive component. The casing covers at least a portion of the conductive component And having a receiving portion, the light emitting diode die is located in the receiving portion, and the fluorescent precipitation layer is deposited on at least a portion of the receiving portion, and the encapsulant is filled in the receiving portion and covers the light emitting diode die. To achieve the above objective, the present invention provides a backlight module including a back panel and at least one light emitting unit. The light emitting unit is disposed on the backplane, and the light emitting unit comprises a circuit board and at least one light emitting diode package structure. The light-emitting diode package spring structure is disposed on the circuit board, and the light-emitting diode package structure comprises a conductive component, a light-emitting diode die, a casing, a fluorescent precipitate layer and a glue. The light emitting diode die is electrically connected to the conductive element. The housing encloses at least a portion of the conductive element and has a receiving portion, and the light emitting diode die is located at the receiving portion. The fluorescent precipitate layer is precipitated in at least a portion of the receiving portion. The encapsulant is filled in the accommodating portion and covers the luminescent diode die. According to the present invention, the LED package structure, the illuminating unit, and the backlight module of the present invention deposit a plurality of phosphor particles in the encapsulant on at least a portion of the housing. A fluorescent precipitate layer. In this way, when the light emitted by the light-emitting diode die is totally reflected to the casing, it is less easily absorbed by the casing, thereby improving the brightness of the light-emitting diode package structure. [Embodiment] Hereinafter, a light-emitting diode package structure, a light-emitting unit, and a backlight module according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein like elements will be described with the same reference numerals. Please refer to the schematic diagram of the LED package structure 2 shown in FIG. 2 and FIG. 3, and FIG. 2 is a schematic cross-sectional view of the Α-Α of the present embodiment. The line of Fig. 2 is a light-emitting diode package structure of the invention embodiment 2 7L member 21, a light-emitting diode die 22, a 3-conductive layer, and a package knee 25. Here, the illuminating two 23 two-light sag hall has a page 屮氺r f . , and the body-sealed 4 structure 2 is exemplified by a top Vlew package structure. The conductive element 21 is exemplified by a conductive tape of two conductive windings. The lead frame may have a conventional example. A part of the conductive element 2 is fixed in the body 23, and two conductive pins 211 are fixed. Then, folded to the bottom of the casing 23. The two-body die 22 can be made of a conductive paste (not shown) on the conductive member 21, and the light-emitting diode die and the two conductive pins of the conductive member 21 are disposed. 211』=Electric=^The one electrode of the illuminating diode die 22 is made of $, for example, 'bean towel 夕 两 ^ ^ 〜 conductive paste and conductive pin 211 are connected, and the other electrode can use metal wiring (Figure The middle, the other, the member is not electrically connected to the other conductive pin 211. The housing 23 encloses at least a portion of the conductive member 2 and has a receiving portion plus a light-emitting diode die 22 located in the receiving portion 231. In this embodiment, the material of the casing 23 comprises glass fiber, titanium oxide, oxidized office, shixi, polyphthalamide, porphyrin or a combination thereof. The side wall 23U of the accommodating portion 231 has a slope, a curved surface or a combination thereof. Referring to FIG. 3 to FIG. 5 simultaneously, the side walls 231a, 231b, and 231c of the accommodating portion 231 may have 7 201032348 two inclined surfaces (FIG. 3), one inclined surface (FIG. 4), or a curved surface (FIG. 5). The number of bevels or curved surfaces on the side walls may be determined according to product design requirements. As shown in FIG. 3, when the side walls 231a have a plurality of beveled faces, &s, the slopes s, S2 may have different slopes, which are close to each other. The slope of the slope s of the conductive element is smaller than the slope of the core away from the conductive element 21, and the slopes S, S2 are formed when the casing 23 is injection molded at a high temperature. ",
再請參照圖3’螢光沉澱層24沉澱於至少部分之容置 部23卜其中，螢光沉澱層24具有複數螢光體粒^。:於 螢光沉澱層24覆蓋了殼體23的部分側壁23u，阻擋了光 線射至殼體23之側壁231a的路徑，故可減少發光:極體 晶粒22所發出的光線被殼體23吸收的情形，甚至藉由螢 光沉澱層24來反射或進一步激發光線，進而提升了發光 二極體封裝結構2的出光亮度。本實施例中，螢光沉殿層 24覆蓋側壁231a之高度印約為發光二極體晶粒22之高 度H2的一至二倍，以達到較佳的反射效果。 。 封裝膠25充填於容置部231内’並覆蓋封裝發光二 極體晶粒22。本實施例中’封㈣25之材f係包含環氧 樹脂、壓克力、二氧化石夕、卿或其組合。封裝膠^係 包含有複數螢光體粒子，固化製財賴烤封裝膠^以、 固化封裝膠25,其中於烘烤升溫的過程中，至攝氏丄十至 八十度左右時，封裝膠25的流祕會提高，保料溫卢 -段時間後’混合於封裝膠25内之複數螢光體粒子即$ 往下沉澱’而於容置部231内形成一螢光沉殺層以 再將溫度升高至固化溫度（例如為15〇τ)，完成封裝膠 201032348 25的固化。 ^ 本實施例中，發光二極體封裝結構2更可包含一反射 層26，設置於容置部231之側壁231a與螢光沉澱層24之 間。反射層26可藉由化學電鍍的方式來形成，用以阻擋 光線射至容置部231之侧壁231a，並可提高光線的反射 率。本實施例中，反射層26之材質係為金、銀、銅、翻、 鋁、鎳、錫、鎂或其組合。需注意的是，在反射層26和 導電元件21之間需預留0.01mm以上之間隙或填入絕緣材 ❿ 料，以避免短路的情形發生。 請參照圖6所示，其為本實施例之發光二極體封裝結 構5之一示意圖。本實施例之發光二極體封裝結構5係以 側面出光（side view )的封裝結構為例，其與發光二極體 封裝結構2不同之處在於：導電元件21a露出於殼體23 之外，作為日後與電路板銲接的部分與出光面的相對位置 關係不相同。請再參照圖2所示，發光二極體封裝結構2 ©之導電接腳211露出於殼體23之外的銲接部分係位於殼 體23的下表面，係與發光二極體封裝結構2之出光面（上 表面）為相對設置的關係。而圖6中，發光二極體封裝結 構5之導電接腳211a露出於殼體23之外的銲接部分係位 於殼體23的下表面，故與發光二極體封裝結構5之出光 面（侧表面）為相鄰表面。 請參照圖7所示，本發明亦提供一種發光單元72，其 係包含一電路板A及至少一發光二極體封裝結構5，於此 係以發光單元72具有複數發光二極體封裝結構5,且應用 9 201032348 於一液晶顯示裝置之背光模組為例。該等發光二極體封裝 結構5係設置於電路板A，並與電路板A電性連接，各發 光二極體封裝結構5包含一導電元件21a、一發光二極體 晶粒22、一殼體23、一螢光沉澱層24及一封裝膠25。發 光二極體晶粒22設置於導電元件21a。殼體23包覆至少 部分導電元件21a，並具有一容置部231，發光二極體晶 粒22位於容置部231。螢光沉澱層24沉澱於部分之容置 部231。封裝膠25充填於容置部231，並覆蓋發光二極體 _ 晶粒22。 其中，發光二極體封裝結構5係與前述圖6中之發光 二極體封裝結構5具有相同的功效及技術特徵，故於此不 再贅述。值得一提的是，本實施例之發光單元72除了可 以作為背光模組之光源之外，還可以應用於廣告看板、燈 箱、顯示裝置、照明裝置或其他電子裝置的光源。 另外，請再參照圖7所示，本發明亦提供一種背光模 ©組7，在此背光模組7係以應用於液晶顯示裝置之一側置 式背光模組7為例。背光模組7包含一背板71及至少一 發光單元72,於此以背光模組7包含一發光單元72為例。 發光單元72設置於背板71，發光單元71包含一電路板A 及至少一發光二極體封裝結構5。發光二極體封裝結構5 係設置於電路板A，發光二極體封裝結構5包含一導電元 件21a、一發光二極體晶粒22、一殼體23、一螢光沉澱層 24及一封裝膠25。發光二極體晶粒22設置於導電元件 21a。殼體23包覆至少部分導電元件21a，並具有一容置 10 201032348 部231，發光二極體晶粒22位於容置部231。螢光沉澱層 24沉澱於部分之容置部231。封裝膠25充填於容置部 231 ’並覆蓋發光二極體晶粒22。另外，背光模組7更可 包含一導光板73，導光板73設置於背板71上，其中發光 單元72之出光面與導光板73相對設置，俾使發光單元72 射出的光線直接入射導光板73。 其中，發光單元72與前述實施例之發光單元72具有 相同的技術特徵，故於此不再贅述。 另外’請參照圖8所示，背光模組8係以應用於液晶 顯示裝置之一直下式背光模組為例。與上述之背光模組7 不同之處在於··背光模組8包含至少一發光單元82，發光 單元82包含一電路板a及複數發光二極體封裝結構2， 其中電路板A及該等發光二極體封裝結構2與上述實施例 中之電路板A及發光二極體封裝結構2具有相同的技術特 徵，故於此不再贅述。 本實施例中，背光模組8之背板81更可具有一反射 面811，該等發光單元82排列設置於背板81之一反射面 811上。該等發光單元82之出光面與複數光學膜片83相 對設置。其中，該等光學膜片83可包含擴散板、上擴散 片（Upper Diffusion Sheet )、增光片（Brightness Enhancement Film )、稜鏡片（Prism Sheet )、下擴散片 (Lower Diffusion Sheet)或其組合，俾使背光模組8形成 一均勻之面光源。 綜上所述，因依本發明之發光二極體封裝結構、發光 201032348 單元及背光模組係將封裝膠中的複數螢光體粒子，沉澱於 至少部分殼體之容置部上，而形成一螢光沉澱層。如此一 來，當發光二極體晶粒所發出之光線被全反射至殼體時， 較不易被殼體吸收，進而能提升發光二極體封裝結構之出 光亮度。並且，本發明揭露之複數斜面、曲面之容置部側 壁設計，更有利於螢光沉澱層之形成而增進封裝結構之出 光。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為習知發光二極體封裝結構之一剖面圖； 圖2為本發明應用於頂面出光之發光二極體封裝結構 之一示意圖； 圖3為本發明應用於頂面出光之發光二極體封裝結構 之一剖面圖； 圖4為本發明應用於頂面出光之發光二極體封裝結構 之另'一剖面圖； 圖5為本發明應用於頂面出光之發光二極體封裝結構 之再一刹面圖； 圖6為本發明應用於側面出光之發光二極體封裝結構 之一示意圖； 圖7為本發明應用於側置式背光模組之一示意圖；以 12 201032348 及 圖8為本發明應用於直下式背光模組之一示意圖。 【主要元件符號說明】 1〜5 :發光二極體封裝結構 11、 23 :殼體 111 :凹陷部 111a、231a、231b、231c :側壁Referring again to Fig. 3', the fluorescent precipitation layer 24 is deposited in at least a portion of the accommodating portion 23, and the fluorescent precipitation layer 24 has a plurality of phosphor particles. The fluorescent precipitation layer 24 covers a portion of the side wall 23u of the casing 23, blocking the path of light to the side wall 231a of the casing 23, so that the light emission can be reduced: the light emitted by the polar body 22 is absorbed by the casing 23. In the case, even the fluorescent precipitation layer 24 reflects or further excites the light, thereby improving the light-emitting brightness of the LED package structure 2. In this embodiment, the height of the sidewalls 231a of the phosphor layer 24 is printed to be about one to two times the height H2 of the LED die 22 to achieve a better reflection effect. . The encapsulant 25 is filled in the accommodating portion 231 and covers the packaged light emitting diode die 22. In the present embodiment, the material f of the seal (four) 25 comprises epoxy resin, acrylic, sulphur dioxide, sulphur, or a combination thereof. The encapsulant comprises a plurality of phosphor particles, a curing encapsulating adhesive, and a curing encapsulant 25, wherein the encapsulating adhesive 25 is in the process of baking and heating up to about ten to eighty degrees Celsius. The flow secret will be improved, and the material will be heated after the period of time, and the plurality of phosphor particles mixed in the encapsulant 25 will be deposited downward to form a fluorescent killing layer in the accommodating portion 231. The temperature is raised to the curing temperature (for example, 15 〇τ) to complete the curing of the encapsulant 201032348 25. In this embodiment, the LED package structure 2 further includes a reflective layer 26 disposed between the sidewall 231a of the accommodating portion 231 and the phosphor deposition layer 24. The reflective layer 26 can be formed by electroless plating to block the light from hitting the side wall 231a of the accommodating portion 231 and to improve the reflectance of the light. In this embodiment, the material of the reflective layer 26 is gold, silver, copper, tumbling, aluminum, nickel, tin, magnesium or a combination thereof. It should be noted that a gap of 0.01 mm or more is required between the reflective layer 26 and the conductive member 21 or the insulating material is filled in to avoid a short circuit. Please refer to FIG. 6, which is a schematic diagram of the LED package structure 5 of the present embodiment. The light-emitting diode package structure 5 of the present embodiment is exemplified by a side view package structure, which is different from the light-emitting diode package structure 2 in that the conductive element 21a is exposed outside the casing 23, The relative positional relationship between the portion to be soldered to the board and the light-emitting surface is different. Referring to FIG. 2 again, the soldering portion of the light-emitting diode package structure 2, which is exposed outside the casing 23, is located on the lower surface of the casing 23, and is connected to the light-emitting diode package structure 2. The light-emitting surface (upper surface) has a relatively set relationship. In FIG. 6, the soldering portion of the conductive pin 211a of the LED package 5 exposed outside the housing 23 is located on the lower surface of the housing 23, so that the light emitting surface of the LED package 5 is on the side. The surface) is an adjacent surface. As shown in FIG. 7 , the present invention also provides a light emitting unit 72 including a circuit board A and at least one light emitting diode package structure 5 , wherein the light emitting unit 72 has a plurality of light emitting diode package structures 5 . And applying 9 201032348 to a backlight module of a liquid crystal display device as an example. The light emitting diode package structure 5 is disposed on the circuit board A and electrically connected to the circuit board A. Each of the light emitting diode package structures 5 includes a conductive component 21a, a light emitting diode die 22, and a shell. The body 23, a fluorescent precipitation layer 24 and an encapsulant 25. The light-emitting diode die 22 is disposed on the conductive member 21a. The housing 23 covers at least a portion of the conductive member 21a and has a receiving portion 231, and the light-emitting diode particles 22 are located in the accommodating portion 231. The fluorescent precipitate layer 24 is deposited on a portion of the accommodating portion 231. The encapsulant 25 is filled in the accommodating portion 231 and covers the illuminating diode dies 22 . The light-emitting diode package structure 5 has the same functions and technical features as the light-emitting diode package structure 5 of FIG. 6 described above, and thus will not be further described herein. It is worth mentioning that the light-emitting unit 72 of the present embodiment can be applied to a light source of an advertising billboard, a light box, a display device, a lighting device or other electronic devices in addition to being a light source of the backlight module. In addition, please refer to FIG. 7 again, the present invention also provides a backlight module © group 7, wherein the backlight module 7 is exemplified by a side-mounted backlight module 7 applied to a liquid crystal display device. The backlight module 7 includes a backplane 71 and at least one light emitting unit 72. The backlight module 7 includes a light emitting unit 72 as an example. The light emitting unit 72 is disposed on the back plate 71. The light emitting unit 71 includes a circuit board A and at least one light emitting diode package structure 5. The LED package structure 5 is disposed on the circuit board A. The LED package structure 5 includes a conductive component 21a, a light emitting diode die 22, a housing 23, a fluorescent precipitation layer 24, and a package. Glue 25. The light emitting diode die 22 is disposed on the conductive member 21a. The housing 23 covers at least a portion of the conductive element 21a and has a receiving portion 10 201032348 portion 231 , and the light emitting diode die 22 is located in the receiving portion 231 . The fluorescent precipitate layer 24 is deposited on a portion of the accommodating portion 231. The encapsulant 25 is filled in the accommodating portion 231' and covers the luminescent diode die 22. In addition, the backlight module 7 further includes a light guide plate 73. The light guide plate 73 is disposed on the back plate 71. The light emitting surface of the light emitting unit 72 is disposed opposite to the light guide plate 73, so that the light emitted from the light emitting unit 72 is directly incident on the light guide plate. 73. The light-emitting unit 72 has the same technical features as the light-emitting unit 72 of the foregoing embodiment, and thus will not be described again. In addition, as shown in FIG. 8, the backlight module 8 is exemplified by a direct-type backlight module applied to a liquid crystal display device. The backlight module 8 includes at least one light emitting unit 82. The light emitting unit 82 includes a circuit board a and a plurality of light emitting diode package structures 2, wherein the circuit board A and the light emitting units The diode package structure 2 has the same technical features as the circuit board A and the LED package structure 2 in the above embodiments, and thus will not be described again. In this embodiment, the backplane 81 of the backlight module 8 further has a reflective surface 811, and the light emitting units 82 are arranged on one of the reflective surfaces 811 of the backplane 81. The light-emitting surfaces of the light-emitting units 82 are disposed opposite to the plurality of optical films 83. The optical film 83 may include a diffusion plate, an upper diffusion sheet, a brightness enhancement film, a prism sheet, a lower diffusion sheet, or a combination thereof. The backlight module 8 is formed into a uniform surface light source. In summary, the LED package structure, the light-emitting diode 201032348 unit and the backlight module according to the present invention deposit a plurality of phosphor particles in the encapsulant on at least a portion of the housing. A fluorescent precipitate layer. In this way, when the light emitted by the light-emitting diode die is totally reflected to the casing, it is less easily absorbed by the casing, thereby improving the brightness of the light-emitting diode package structure. Moreover, the side wall design of the plurality of inclined surfaces and curved surfaces of the present invention is more advantageous for the formation of the fluorescent precipitation layer to enhance the light emission of the package structure. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a conventional light-emitting diode package structure; FIG. 2 is a schematic view showing a light-emitting diode package structure applied to a top surface of the present invention; FIG. 4 is a cross-sectional view of a light emitting diode package structure applied to a top surface of the present invention; FIG. 5 is a cross-sectional view of the light emitting diode package structure applied to the top surface of the present invention; FIG. 6 is a schematic diagram of a light-emitting diode package structure applied to a side light-emitting device according to the present invention; FIG. 7 is a schematic diagram of the present invention applied to a side-mounted backlight module; 12 201032348 and FIG. 8 are schematic diagrams of one embodiment of the present invention applied to a direct type backlight module. [Description of main component symbols] 1 to 5: LED package structure 11, 23: Housing 111: recessed portions 111a, 231a, 231b, 231c: side wall
12、 22 :發光二極體晶粒 13、 21、21a :導電元件 14 :封裝材料 211、211a :導電接腳 231 :容置部 24 :螢光沉澱層 25 :封裝膠 26 :反射層 7、8 :背光模組 71、 81 :背板 72、 82 :發光單元 73 :導光板 811 :反射面 83 :光學膜片 A :電路板 :螢光沉澱層覆蓋侧壁之高度 13 201032348 h2 :發光二極體晶粒之高度 Si、s2:斜面12, 22: light-emitting diode crystal grains 13, 21, 21a: conductive element 14: encapsulating material 211, 211a: conductive pin 231: housing portion 24: fluorescent precipitation layer 25: encapsulant 26: reflective layer 7, 8: backlight module 71, 81: back plate 72, 82: light-emitting unit 73: light guide plate 811: reflective surface 83: optical film A: circuit board: fluorescent precipitation layer covering the height of the side wall 13 201032348 h2: light two The height of the polar body grains Si, s2: bevel
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