201021995 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種塑膠嵌入多孔性結構且結合金屬基材的 方法，特別是有關於多孔性結構與金屬基材接合後將塑膠嵌入於 多孔性結構之領域。 ^ 【先前技術】 Ο 目前在熟知的塑膠與金屬黏結的方式有兩大系統，一者是以 快乾膝或光固化樹脂膠直接以失具固定後使膠乾燥而完成塑膠結 構與金屬基板黏合，以此複雜衫卫步獅加工程序不談之外， 膠水的化學敎性及結合蚊雖雜不佳；綠对稱為奈来 射出成i技術(NMT, Nano Molding Technology)金屬與塑膠結合之 技術中’其金屬基板經過酸紐出奈米孔洞後’浸泡特定化&藥 舰奈米础填滿該化學藥劑’復將特㈣料直接射域型於金 ❹屬表面，由於特定塑料與特定化學藥劑引發置換反應而黏著一 起，這_化學反叙變歸分子_結的方式，雜夠有效的 將塑膠與金屬直接結合H但由於僅能使用特定的塑膠導致 後續表面處理舰化問題，以及經過令人擔叫化學渔製程處 理，這兩種習用技術對於講究環保與可靠度的消費性電子產品， 其應用範圍相對變小。 有鑑於習知技藝之各項問題，為了能夠兼顧解決之，本發明 人基於多年從事研究·與衫實務經驗，提出—觀膠嵌 孔性結構且結合金屬基材的方法，以作為改善上祕點之實現方 201021995 式與依據。 【發明内容】 有鑑於此’根據本發明之一目的，提出一種利用粉末燒結原 理將多孔性結構以化學鏈結方式穩固的燒結或燒焊於基材上，隨 後並且進行塑膠結構嵌入於多孔性結構體，可以達到工程塑膠= 多孔性結構、基材的穩固結合。 ”、 緣疋，為達上述目的，依本發明之一種塑膠嵌入多孔^^生結構 且結合金屬基材的方法’此方法包含下列步驟：首先，提供一金 屬基材、一粉體漿料及一塑膠體。然後，先配置粉體漿料堆積於 金屬基材之表面，隨後將兩者進行共燒結處理，粉體漿料因鬆裝 堆積而燒結成多孔性結構並且與金屬基材緊密接合，最後，嵌入 一塑膠體於此多孔性結構，以達到塑膠體與多孔性結構、及金屬 基材三者結合之目的。 鲁 承上所述，因依本發明之一種塑膠嵌入多孔性結構且結合金 屬基材的方法，有以下一個或多個優點： (1) 此塑膠嵌入多孔性結構且結合金屬基材的方法，藉由粉末 冶金之燒結，使粉體漿料中的黏合劑將被汽化與燒除，且粉體漿 料之粉體自身，以及粉體與金屬基材穩固燒結在一起，兩者產生 ，穩固的化學鍵結(金屬鍵），因此可以適用於常用的金屬材料如銅、 鐵、鋁、鎂、辞以及其合金。 (2) 此塑膠嵌入多孔性結構且結合金屬基材的方法，可藉由熔 融的塑膠體進入、嵌入或射入多孔性結構而緊密的與其多孔性結 201021995 構結，、’並且達到與金屬基材接合在一起的目的，所使用的塑膠 材料就沒有限制與特別指定<5 •，依本發明所提供之-種塑膠嵌入多孔性結構且結合金屬基材 的方法，確實能夠有效地進行處理，同時達到單純簡化之功能。 兹為使貴審查委員對本發明之技術特徵及所達到之功效有 更進-步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明 如後。 ❹ 【實施方式】 以下將參照相關圖式，說明依本發明之一種塑膠嵌入多孔性 結構且結合金屬基材的方法，為使便於理解，下述實施例中之相 同元件係以相同之符號標示來說明。 请一併參閱第1圖至第10圖。如第1圖所示之步驟，依本發 明之一種塑膠嵌入多孔性結構且結合金屬基材的方法，包含下列 Φ 步驟： 步驟80 :提供一金屬基材1、一粉體漿料2及一塑膠體3。其 中此金屬基材1之型體係為平板、U型、L型體，其中金屬基材j 之型體係可由鈑金沖壓、金屬壓鑄、重力鑄造、半液固射出成型 製程所完成。於此實施例中係以平板加以表示(如第2圖所示），但 -並不以此為限。此金屬基材1或粉體漿料2之粉體係為一純金屬 或合金’其中，純金屬或合金之材質係包含銅、鐵、叙、鎮、鋅。 粉體衆料2之粉體，於此實施例中係與金屬基材1同一材質，但 粉體漿料2之粉體亦可為瓷金粉體’此瓷金粉體可為金屬間化合 201021995 物、金屬碳化物或金屬氮化物等，此莞金粉體的特徵係須能夠與 金屬基材產生合金化。粉體漿料2係利用黏結劑混拌粉體而成的 膏狀物’但並不以此為限，其巾金屬紐丨及粉體漿料2之粉體 亦可為能夠產生合金化的異種金屬材f。塑膠體3係包含工程塑 膠、熱可塑及熱可固的之單一或複合配方。 步驟81 :粗化後的金屬基材丨之表面(如第3圖所示），其中 粗化此金屬基材1之表面係利用物理方式(例如喷砂處理》利用化 ❹學方式(例如蝕刻處理)而使金屬基材表面粗化u，或者同時利用 物理方式及化學方式加以金屬基材表面粗化n處理。粗化的範圍 可以是局部性或全面性，也沒有關單面或是雙面，都可以 處理。 步驟.82 :配置粉體漿料2於金屬基材丨之表面，以及視需凑 所增加之二模板4卜42、-到刀5，其中配置粉體聚料2於金眉 基材1之表Φ，係可利關刀成型及倾的單—歧合的表面塗 ❹ 佈方式加以處理，於此實施例中，二模板41、42係為一硬質材制 開孔之兩侧剖面，開孔之位置依實際需求而定，二模板#、42信 位於金屬基材1之表面。利用粉體漿料2堆積於模板41、42之間 並且利用刮刀5加以刮除超出二模板4卜42高度的多餘之粉體類 料2 (如第4圖所示）。 ’ 、步驟83 :進行共燒結粉體漿料2及金屬基材丨，使粉體漿料之 成為一多孔性結構21，且使多孔性結構21緊密接合於金屬基材^ 上’其中粉體聚料2因鬆裝堆積(鬆裝堆積表示粉體聚料以鬆散方 式加以填裝、堆積)燒結而成多孔性結構21。另外，燒結所需之粉 體漿料2係_黏賴混拌而成粉體賴2的膏狀物，經過燒^ 201021995 時之高溫加以汽化脫脂及燒除黏合劑，留下近似圓形的粉體(如第 5圖所不）’並且經過燒結其初步加熱而使粉體漿料2之粉體自身 接合(如第6圖所示）。接續著，經過更長時間與更高溫至粉體，其 粉體漿料2之粉體至熔點以下(〇.8Tm,Tm為溶點溫度），使粉體^ 料2中之粉體自身互相炫接而緊密燒結成強固的鍵結而形成多孔 性結構21(如第7圖所示)，另外，多孔性結構21與金屬基材的粗 糙界面，也由於高溫的作用使原子互相擴散，而互相熔接在一起， 瘳因而產生多孔性結構2卜多孔性結構與金屬基材讎結合層6以 及原金屬基材1之三個不同層次之結構(如第8 .圖所示）。經過共燒 結處理後制的多孔性結構能觸_與金屬紐緊密接合(如第 9圖所示），以等待塑膠體嵌入射出處理。 _步驟84 :嵌入一熔融之塑膠體3於多孔性結構21中，而將熔 融之塑膠體3藉由射出機而高壓射入於模具7内之多孔性結構 =，使塑膠體3嵌入於多孔性結構21中，達到塑膠體3與多孔性 、〜構21、金屬基材1三者相互結合之目的。（如第1〇圖所示） & 以上所述僅為舉例性，而非為限制性者。任何未脫離本發明 之精神與範嘴’而對其進行之等效修改或變更，均應包含於後附 之申請專利範圍中。 【圖式簡單說明】 第1圖係為一種塑膠嵌入多孔性結構且·結合金屬基材的方法 之步驟流程圖。 第2圖係為本發明之一種塑膠嵌入多孔性結構且結合金屬基 材的方法之金屬基材之剖面示意圖。 201021995 第3圖係為本發明之一種塑勝嵌入多孔性結構且結合金屬基 材的方法之金屬基材表面粗化後之剖面示意圖。 第4圖係為本發明之一種塑勝嵌入多孔性結構且結合金屬基 材的方法之配置模板及刮刀之侧視示意圖。 第5圖係為本發明之一種塑膠嵌入多孔性結構且結合金屬基 材的方法之粉體漿料經脫脂後的鬆裝堆積之顯微結構 圖。 ❿ 第6圈係為本發明之一種讎嵌入多補:結構且給合金屬基 材的方法’其粉體漿料經脫脂後的鬆裴堆積燒結後之多 孔結構顯微結構圖。 第7圖係為本發曰月之嵌入塑膠於多孔性結才籌之方法之金屬粉 末初步燒結之顯微結構圖。 第8圖係為本發明之一種塑膠嵌入多孔性結構且結合金屬基 材的方法’其多孔性結構、多孔性結構與金屬基材擴散 參結合層以及原金屬基材之三個不同層次之結構圖。 第9圖係為本發明之一種塑膠嵌入多孔性結構且結合金屬基 材的方法之燒結金屬基材及多孔結構燒結後之剖面示 意圖。 第10圖係為本發明之一種塑膠嵌入多孔性結構且結合金屬基 ’ 材的方法之施工示意圖。 > 201021995 【主要元件符號說明】 1 :金屬基材； 11:金屬基材表面粗化； 2:粉體漿料； 21 :多孔性結構； 3:塑膠體； 41、42":模板； 5 :刮刀； 6:多孔性結構與基材擴散結合層； 7 :模具； S80〜S84 :步驟。201021995 VI. Description of the Invention: [Technical Field] The present invention relates to a method for embedding a plastic into a porous structure and bonding a metal substrate, in particular to embedding a plastic in a porous structure after bonding with a metal substrate. The field of sexual structure. ^ [Prior Art] Ο There are two major systems for the bonding of plastics and metals. One is to fasten the knee or the light-curing resin glue directly to fix the glue and dry the glue to complete the bonding of the plastic structure to the metal substrate. In addition to the complex processing of the lion's processing procedure, the chemical enthalpy of the glue and the combined mosquitoes are poor; the green pair is called NMT, Nano Molding Technology. In the technology, 'the metal substrate is immersed in the nano-hole after the acid-to-nano hole, and the medicinal ship Nami Foundation fills the chemical agent. The remedy (four) material directly forms the surface type on the surface of the genus, due to the specific plastic and The specific chemical agent initiates the displacement reaction and sticks together. This is a way of chemically reversing the molecular-junction, which is effective enough to directly bond the plastic to the metal. However, since only a specific plastic can be used, the subsequent surface treatment of the ship is caused. And through the treatment of chemical fishing processes, these two conventional technologies are relatively small in terms of environmentally-friendly and reliable consumer electronic products. In view of the problems of the prior art, in order to be able to solve the problem, the present inventors have proposed a method of making a hole-to-hole structure and combining a metal substrate based on years of experience in research and shirt practice, in order to improve the secret. The realization of the point of 201021995 and the basis. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to sinter or solder a porous structure to a substrate by chemical sintering using a powder sintering principle, followed by embedding a plastic structure in the porous structure. The structure can achieve the stable combination of engineering plastics = porous structure and substrate. In order to achieve the above object, a method for embedding a porous plastic structure and a metal substrate according to the present invention includes the following steps: First, providing a metal substrate, a powder slurry, and a plastic body. Then, the powder slurry is first deposited on the surface of the metal substrate, and then the two are co-sintered, and the powder slurry is sintered into a porous structure by loose packing and tightly bonded to the metal substrate. Finally, a plastic body is embedded in the porous structure to achieve the purpose of combining the plastic body with the porous structure and the metal substrate. According to the above, a plastic embedded in the porous structure according to the present invention The method of combining the metal substrate has one or more of the following advantages: (1) The method of embedding the plastic into the porous structure and combining the metal substrate, the sintering of the powder metallurgy, the adhesive in the powder slurry will be Vaporization and burning, and the powder of the powder slurry itself, as well as the powder and the metal substrate are firmly sintered together, the two produce a stable chemical bond (metal bond), so it can be applied to common Metal materials such as copper, iron, aluminum, magnesium, and their alloys. (2) The method of embedding the plastic into a porous structure and bonding the metal substrate can enter, embed or inject the porous structure by the molten plastic body. Tightly constructed with its porous junction 201021995, 'and achieve the purpose of bonding with the metal substrate, the plastic material used is not limited and specially specified <5 •, according to the invention provided by the plastic embedded The porous structure and the method of combining the metal substrate can be effectively processed and at the same time achieve a simple and simplified function. In order to enable the reviewing committee to have a more advanced understanding and understanding of the technical features and the effects achieved by the present invention. The preferred embodiment and the detailed description are as follows. ❹ [Embodiment] Hereinafter, a method for embedding a porous structure and bonding a metal substrate according to the present invention will be described with reference to the related drawings. It is to be understood that the same elements in the following embodiments are denoted by the same reference numerals. Please refer to FIG. 1 to FIG. 10 together. Steps as shown in FIG. According to the method of the present invention, a plastic embedded in a porous structure and bonded to a metal substrate comprises the following Φ steps: Step 80: providing a metal substrate 1, a powder slurry 2 and a plastic body 3. The metal The substrate 1 type system is a flat plate, a U-shaped, an L-shaped body, wherein the metal substrate j type system can be completed by a sheet metal stamping, a metal die casting, a gravity casting, a semi-liquid solid injection molding process. The flat plate is shown (as shown in Fig. 2), but - not limited to this. The powder system of the metal substrate 1 or the powder slurry 2 is a pure metal or alloy 'where the material of the pure metal or alloy It is composed of copper, iron, Syrian, town, and zinc. The powder of the powder material 2 is the same material as the metal substrate 1 in this embodiment, but the powder of the powder slurry 2 may also be porcelain gold powder. The body of this porcelain powder can be an intermetallic compound of 201021995, a metal carbide or a metal nitride, etc., which is characterized by being capable of alloying with a metal substrate. The powder slurry 2 is a paste obtained by mixing a powder with a binder, but is not limited thereto, and the powder of the metal foil and the powder slurry 2 can also be alloyed. Dissimilar metal material f. The plastic body 3 consists of a single or composite formulation of engineering plastics, thermoplastics and heat-settables. Step 81: The surface of the roughened metal substrate crucible (as shown in FIG. 3), wherein the surface of the metal substrate 1 is roughened by a physical means (for example, sand blasting) by means of chemical transformation (for example, etching) Processing) to roughen the surface of the metal substrate, or to simultaneously roughen the surface of the metal substrate by physical and chemical methods. The range of roughening may be local or comprehensive, and there is no single or double The surface can be processed. Step 82: Configure the powder slurry 2 on the surface of the metal substrate, and add the two templates 4, 42 to - knife 5, where the powder material 2 is disposed. The table Φ of the gold eyebrow substrate 1 is treated by a single-discriminating surface coating method which can be formed by cutting and tilting. In this embodiment, the two templates 41 and 42 are two holes made of a hard material. The side profile, the position of the opening is determined according to actual needs, and the two templates #42 and 42 are located on the surface of the metal substrate 1. The powder slurry 2 is deposited between the templates 41 and 42 and scraped off by the doctor blade 5 Template 4 Bu 42 extra excess powder material 2 (as shown in Figure 4). Step 83: performing the co-sintering powder slurry 2 and the metal substrate 丨, making the powder slurry into a porous structure 21, and bonding the porous structure 21 to the metal substrate ^ The aggregate 2 is sintered by loose packing (the loose packing means that the powder aggregate is filled and stacked in a loose manner) to form a porous structure 21. In addition, the powder slurry 2 required for sintering is _ _ mixing The paste of the powdered Lai 2 is vaporized and degreased and burned off after burning at a high temperature of 201021995, leaving an approximately circular powder (as shown in Fig. 5) and is initially heated by sintering. The powder of the powder slurry 2 is self-joined (as shown in Fig. 6). Subsequently, after a longer period of time and a higher temperature to the powder, the powder of the powder slurry 2 is below the melting point (〇. 8Tm, Tm is the melting point temperature), so that the powders in the powder material 2 are spliced to each other and tightly sintered to form a strong bond to form a porous structure 21 (as shown in Fig. 7), and in addition, porosity The rough interface between the structure 21 and the metal substrate also causes the atoms to mutually diffuse due to the action of high temperature, and is welded together, 瘳Thus, a porous structure 2 porous structure and a metal substrate tantalum bonding layer 6 and a structure of three different levels of the original metal substrate 1 (as shown in Fig. 8) are produced. Porosity after co-sintering treatment The structure can be in close contact with the metal button (as shown in Fig. 9) to wait for the plastic body to be embedded in the injection process. _Step 84: embedding a molten plastic body 3 in the porous structure 21, and melting the plastic body 3, the porous structure of the high-pressure injection into the mold 7 by the injection machine =, the plastic body 3 is embedded in the porous structure 21, and the plastic body 3 and the porous body, the structure 21, and the metal substrate 1 are mutually The purpose of the combination (as shown in Figure 1) & The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations of the present invention are intended to be included within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the steps of a method in which a plastic is embedded in a porous structure and bonded to a metal substrate. Fig. 2 is a schematic cross-sectional view showing a metal substrate in which a plastic is embedded in a porous structure and bonded to a metal substrate. 201021995 Fig. 3 is a schematic cross-sectional view showing the surface of a metal substrate which is a method of plastically embedding a porous structure and incorporating a metal substrate. Fig. 4 is a side elevational view showing a configuration template and a doctor blade of a method of plastically embedding a porous structure combined with a metal substrate. Fig. 5 is a view showing the microstructure of the loosening of the powder slurry after degreasing of a method in which a plastic is embedded in a porous structure and combined with a metal substrate. ❿ The sixth ring is a multi-hole structure microstructure diagram of the present invention in which the enthalpy is embedded and multi-complemented: the structure and the method of feeding the metal substrate, the powder slurry is subjected to degreasing and loosening. Figure 7 is a micrograph of the preliminary sintering of the metal powder in the method of embedding the plastic in the porous layer. Figure 8 is a structure of a plastic embedded in a porous structure and combined with a metal substrate of the present invention. The structure of the porous structure, the porous structure, the diffusion substrate of the metal substrate, and the structure of the original metal substrate are three different levels. Figure. Fig. 9 is a cross-sectional view showing a sintered metal substrate and a porous structure of a method in which a plastic is embedded in a porous structure and bonded to a metal substrate. Fig. 10 is a schematic view showing the construction of a method in which a plastic is embedded in a porous structure and bonded to a metal base material. > 201021995 [Description of main component symbols] 1: Metal substrate; 11: Surface roughening of metal substrate; 2: Powder slurry; 21: Porous structure; 3: Plastic body; 41, 42": template; : scraper; 6: porous structure and substrate diffusion bonding layer; 7: mold; S80~S84: step.