TW201021169A - Heat dissipation structure - Google Patents

Abstract

An object of the present invention is to provide a heat dissipation structure that can efficiently dissipate the heat generated by a heat generating device, and that does not generate dust such as carbon powder or have metal fiber projections that may adversely affect the electrical characteristics of the heat generating device. The heat dissipation structure 54 comprises a glass epoxy substrate 50 on the main surface 50a of which a heat generating device 60 is mounted, and a heat dissipation sheet 52 provided with a polypyrrole-impregnated sheet. A front surface circuit pattern layer 62 made of electrically conducting material is formed on the main surface of the substrate, and a reverse surface circuit pattern layer 66 made of electrically conducting material is formed on the reverse surface 50b of the substrate. Further, the front surface circuit pattern layer 62 and the reverse surface circuit pattern layer 66 are electrically connected via a through hole 64. The heat generating device is mounted on the front surface circuit pattern layer so as to be bonded thereto, with an electrically insulating layer 58 interposed therebetween. The heat dissipation sheet is bonded to the reverse surface of the substrate, and a heat sink 56 is bonded to the heat dissipation sheet.

Description

[Technical Field] The present invention relates to a heat dissipation structure that efficiently radiates heat generated from a power element or a light-emitting element to the outside. ..., [Prior Art] 7L pieces. ) It will overheat due to the heat generated by itself, and the degradation of its own or the deterioration of its optical properties. Therefore, the diffusion, the temperature rise of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Outside the component. Here, the heat dissipating structure constituted by the printed circuit board of the heat dissipating means and the dispersing plate and the heat sink are in close contact with each other. Ini heat transfer secret, first of all, for the printing of the heat-emitting components, the printing work is a unified heat (four) sub-parts (five) sometimes called the heat caused by the body as a heat-dissipating mechanism, so try to install the guide i pattern By: f The heat-generating component is provided with the back conductor _ connection of the component, the through-hole of the guide substrate and the function as a heat-dissipating mechanism (refer to, for example, the stalking substrate itself is taught to reduce the cost of the component to the circuit board and between The contact with the secret domain (9) New Zealand board ^ as a heat sink; increase; ===: gold = 201021169 = free to apply the weight required to move as light as possible recently proposed as a material for the heat sink, can be unfavorable jf. Therefore, A graphite plate having a high heat dissipation effect (see, for example, a mesh plate 8 formed by a graphite plate processed by a graphite plate), as a heat dissipation plate (refer to a patent) The document also discloses a heat dissipating plate which is obtained by using the graphite crucible in the surface of the graphite film to obtain a thin film of the organic film. Patent Document 9) is formed here to form the heat dissipating plate. Or forming a metal film, or will use t 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Japanese Patent Laid-Open Publication No. JP-A No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei. No. 2005-229100 (Patent Document 9) Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. The material layer is made of graphite material, and the heat-generating component of the main surface of the printed circuit board is:

The printed circuit board prints the iiti S to cause the electrical short circuit 201021169, and the heat dissipation structure including the heat dissipation plate disclosed in the above Patent Document 8 can obtain very excellent heat dissipation characteristics, but the metal fiber will protrude from the fracture surface of the heat dissipation plate. Disposal of this metal fiber is quite troublesome. This metal fiber is also the same as the above-described carbon powder, and may have disadvantages such as a printed circuit portion of a printed circuit board or a short circuit of a heat generating element. (Means for Solving the Problem) The person who went to the Ming Dynasty repeatedly performed the κ-free test, and found that the heat dissipation formed by the densely immersed plate of the fiber aggregate and the metal layer was formed. Moreover, the heat-dissipating plate formed by the adhesion of the bonding member to the metal plate can efficiently expand the heat. And it has been confirmed that dust such as toner will not be generated from the board. It has been found that the formation of a printed circuit board comprising a through-hole and a back-conductor, and the formation of the above-mentioned poly-wetting board can be based on the redness of the heat-dissipating plate. A heat-dissipating structure that allows heat generated by a heat-generating element to be efficiently diffused is effective in providing a heat-dissipating structure having a heat-producing property that allows the hair to be :μ: - ii" In the meantime, the first heat dissipating structure of the present invention having the following configuration includes the temple. The substrate is provided with a heat generating element on the main surface thereof; and the heat sink plate is closely adhered to the back surface of the substrate; and the heat of the heat generating element can be dissipated. The main surface and the back side of the polysilicon plate

SiHHSSSS face 6 201021169 Or any side of the metal plate through the Li joint member.路 基 基 基 : : : 基 基 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : The circuit pattern layer may also be separated in the thickness direction of the substrate (the effect of the invention). The polyi of the fused polymer includes the infiltrated polyfluorene. w~ straight __ layer, or 吟埶; the secret rate of the board is less than Jinchi or Jin Gu. #且,其其ΐΐΓ板 is in close contact with the metal plate or the metal layer, so the thermal expansion rate αρ parallel to i _t>1 is greater than the thermal diffusivity in the vertical direction. That is, when the heat sink is dense, the isothermal is The face is extended at a speed that is perpendicular to the direction of the surface of the sputum in the direction perpendicular to the surface of the sputum plate. 2. This is the physical quantity of the thermal energy propagation characteristic, relative to the heat transfer of the diffusion material. It is proportional to the age, and the value of the age is negative. The value of the temperature is ίίίίίΐΐϊ. The higher the cooling efficiency of the elastic component, the lower the thermal resistance between the heating element, ..., and the crucible element. It can be said that the thermal resistance means the temperature rise amount relative to the calorific value per unit time, and the temperature contact area is determined by the heat generating element (high temperature part) and the heat enthalpy (the low reciprocal number is approximated. The heat transfer coefficient can be obtained. By dividing the temperature difference between ',,, and the hot meal, between the heat-generating element and the heat, in a short time, 201021169, the temperature is difficult to transmit. The hair part is more difficult to dissipate and means the heat-generating element itself. The temperature is easy to rise (4) if = the second heat-dissipating structure, the miscellaneous on the bump, the heat generated by the thermal element is parallel to the heat-dissipating structure, the surface of the heat-dissipating plate is closely connected to the P-brush circuit board. The direction spreads rapidly, spanning a wide range of the surface of the crucible, forming a high temperature in a short period of time, and the total amount of the two heat is so large that the heat-dissipating element is made in accordance with the heat-dissipating structure of the present invention. The indirect contact with the enthalpy can efficiently dissipate the heat generated by the self-heating element. The heat dissipating plate constituting the heat dissipating structure of the present invention does not cause slavery or the like in the work process such as the rupture process. invention The heat dissipating structure does not cause the adhesion of powder or the like to the electronic module mounted on the heat dissipating structure or the like, resulting in short electrical defects, etc. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the embodiments of the present invention are not limited by the drawings. The drawings only schematically show the gradation, size, and arrangement of the constituent elements to the extent that the present invention can be understood, and the numerical values described below and Other conditions are merely preferred, and the present invention is not limited to the embodiment of the present invention. In order to explain the first and second heat dissipating structures of the embodiment of the present invention, firstly, heat dissipation of constituent elements of the heat dissipating structure is achieved. The result of the verification experiment is described in the composition of the plate, the method of its manufacture, and the thermal properties thereof. 201021169 <Heat Dissipation Plate> Referring to Figs. 1(A) and (Β), the heat dissipation plate configuration relating to the constituent elements of the heat dissipation structure will be described. And a manufacturing method thereof. Fig. 1 (Α) and a schematic cross-sectional view of a heat dissipating plate which is a constituent element of the first and second heat dissipating structures, respectively, broken in a direction perpendicular to the main surface and the back surface. In the following description, the heat dissipation plate that is the constituent element of the second heating structure is the first heat dissipation plate, and the second heat dissipation plate is the heat dissipation plate that is the component of the second heat generation structure. Φ Figure KA) The first heat dissipation plate The metal layer is adhered to at least one of the main surface 18a and the back surface 18b of the polyfluorene-infiltrated sheet 18 of the cellulose sheet-impregnated polyfluorene polymer. In FIG. 1(A), although the metal plate 16 and the metal layer 2 are formed by the main surface plate and the back surface 18b of each of the wetting plates ls of the spectroscopy, the metal layer 20 and the metal layer 20 are formed. Just fine. J forms the first heat sink shown in Fig. 1(A) by three manufacturing methods, and the methods are as follows. The first method comprises the following steps: in the tree) dip, the mixture of the polymer side plate of the polymer (hereinafter also as follows: (4 is composed of true time and space two = each; at least one of the wheels forms a metal layer) The second method comprises the following steps : Infiltrating the polymerized polymer into the cellulose plate to make the poly bowl, also known as the (2_2_1) step.); and the U-drawing (the following is a part of the surface of the infiltrated plate) Sometimes also referred to as the (2_2_2) step.), 4 is formed by particles to form gold. The third method comprises the following steps: Also known as di-invasion plate to make poly-impregnation (hereinafter sometimes by electroplating) The at least 彳 础 亦 亦 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 2-3 —34) J/Semitted in the production of cellulose 201021169 plate / / / 闰i ί 咯 聚合 聚 聚 ' ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The step includes the steps (3-1) and (3-2), for example, chlorine r, and the steps are as follows: copper (II) chloride is dissolved in water, and the filter paper in the middle of the night is used in the 2 m/liter concentration. Implement the fourth (step) knife Let the vaporized copper (8) penetrate into the filter paper _ zero (four).

C, the characteristics of the thickness of the ϋ 平 平 系 针对 针对 平 § § § § : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : ί之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之之It is not necessary to be the main table of the poly-infiltration board in the vaporization of the vaporization of the polymerization. The layer can be dispersed, and the surface of the plate can be appropriately set to the evaporation range. The (2_2-2) step is by using the printing technology to cover the range of the immersion broaching brush. The use of the delicious slate 1 heat sink is appropriately set to the printing plate (4), the singularity is 500ml (refers to the liter metal layer) The electroplating solution can be prepared by, for example, adding 5 〇g of sulfuric acid and 2 〇mi of sulfuric acid to the steamed water of 5〇_(Zhejiang) and then dropping it on 10 201021169 5 copper (II) sulfate is completely dissolved. Set the electric ore liquid as a pit, apply electric ore to the main surface and the back surface of the polysulfide infiltration board. When conducting electric ore, the Juluo infiltration board is connected to the cathode to form A copper layer having a thickness of 0.02 mm. When a first heat dissipation plate is formed by forming a metal layer on only one of the main surface and the back surface of the polyfluorene-impregnated plate, the metal film is not coated with an insulator film such as a polymer film. On the side of the side, the second (2-1_2) step, the (2_2_2) step, and the second (2) step are performed, that is, if the metal layer is not coated with an insulator film such as a polymer film. In the steps (2-1-2), (2-2-2), and (2-3-2), the area where the metal layer is formed on the main surface and the back surface of the plate is exposed. The second heat dissipation plate can be formed only in the desired area, that is, the second heat dissipation plate can be formed in accordance with the second (2) step, the (2_2-2) step, and the j. The range of the metal layer is formed. In the second heat dissipating plate which is not shown in Fig. 1(B), at least one of the main surface 26a and the back surface 26b of the 'fork plate 26' is formed on the cellulose plate infiltrated polyfluorene polymerization. The metal plate is bonded via the bonding member. In FIG. 1(B), the metal plate 22 is bonded to the main surface of the polyfluorene wetting plate 26 via the bonding member 24, and the bonding member 28 is bonded to the back surface 26b. The second heat dissipation plate is formed by the base plate 30, but any one of the metal plate 2 and the metal plate 30 may be formed. Among the adhesive members 24 and 28, the Miqibang Co., Ltd. 1 tape may be appropriately selected. No. NW-50) 'Or the same as Shimin Hard Co., Ltd.', the use of acrylic acid modified Wei resin, Shimin Hard (product number SX72〇w), etc.: <Verification of the thermal properties of the heat sink> (10)f according to the results of the verification experiment of the heat-dissipating heat-dissipating plate of the embodiment of the present invention according to the embodiment of the present invention, and the final supply t is used for the thermal properties of the heat-dissipating plate of the present invention. The figure is a cross-sectional structural view schematically showing the arrangement relationship between the heat generating element 40, the electric wiring board 42, the moon heat plate 44, and the heat sink 46. The curry is a heating element 4 〇 using a 1 W light-emitting diode. The universal printed circuit board of the electric wiring board 42 is known. This general-purpose printed circuit board is a general-purpose printed circuit board manufactured by Sunhayato Co., Ltd., which is formed of a glass epoxy material 201021169 (ICB-^3SHG). The enthalpy 46 uses the nameplate 塾 5mm thickness of the nameplate enthusiasm. The electric wiring board 42' heat sink 44 and the heat sink 46 are respectively broken into a positive shape of 60 mm, and overlap as shown in FIG. The center position of the heat generating element 4 is disposed on one side of one side of the square of 6 mm away, and is equidistant from the two sides perpendicular to the side. In the heat radiating plate 44, the heat-dissipating plates shown in Fig. KA) and the heat-dissipating plates formed of the comparative graphite materials were used to verify the thermal characteristics. In order to carry out the comparison, the hiding of the electric wiring board 42 is directly performed when the heat sink is not pasted. Further, the heat sink of the heat sink shown in Fig. _ is not the same as the heat sink, and the description thereof is omitted. ^The evaluation of the thermal characteristics of the heat sink is based on the temperature time change from the time when the CH1 to CH8 person 1 Hi shown in Fig. 2 starts to energize the heat generating element 4G.

(10) and CH7 indicate that the electric wiring board 42 is provided with a temperature measurement point of the side surface of the heat generating element 40. And CH2, CH4, CH= and one side surface opposite to the side on which the electric wiring board 42 is provided. As shown in Fig. 2, CH1 is set to the heating element 4〇 positive fixed point 'CH3; CH5 * CH7 are respectively set The temperature is measured at a position away from the heat-generating component and at a position of 45 mm. Further, (10) is set at a temperature measurement point 'CH4, CH6, which is directly below the hair element 2 40, and a temperature measurement point where g is separated from the position of 45 mm. 12 201021169 [Table 1] -~~~ I II — Ill A 37.3 32.7 75.5 B 23.9 21.2 17.3 ~~ C 24.5 22.4 15.3 _ D 22.4 20.6 16.0 ~ —E 21.8 19.5 F 22.2 19.8 16.1 — G 21.2 19.0 14.8 Η 21.8 19.6 15.5 ~ _ (unit. C/W) Table 1 shows the horizontal barriers of A to ,, which respectively show the thermal resistance between the two shown below. Α 铺 科 纽 纽 元件 无 无 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^

Ξ value = idle f shows the thermal resistance between CH3 and the space close to CH3, and the thermal resistance value between the contact and the butterfly, the Ε field shows CH5 j Λ Λ Λ Γ thermal resistance value 'F field display CH6 And the transmission: 2, 3, ,,, resistance, G field shows the resistance between CH7 and the space close to CH7, and the block shows the thermal resistance between CH8 and the space close to CH8. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,戸, system 1 ^ ^ scale 5 indicates (5), vertical axis. The C scale is used to indicate the temperature. The heat sink is bonded to the first heat dissipation structure. The board is densely connected to D 1 ρ. The thickness is G.llnm. Here, as the electric wiring board 4: and the 44-filament, in the hot ridge of the contact 46 (10), the temperature measurement point directly under the element 4 is φ and reaches 454. 〇 ί The temperature changes after 3 minutes. The person dares to reach 52.7°c and is in thermal equilibrium. 13 201021169 The temperature measurement points CH2 to CH8 are approximately lower than CHI I5t. As shown in Fig. 1, when the third structure of the embodiment of the present invention is used as the heat dissipation plate 44, the thermal resistance value is approximately 21·2 C/W to 37.3 C/W. The f 4 system is shown as being compared with the use of the heat dissipation plate which is a component of the second heat dissipation structure of the present invention as the heat dissipation plate 44, and is disclosed in Patent Document 3: a mesh body composed of metal wires is sandwiched between f When the same type of heat sink (manufactured by Nippon Co., Ltd., trade name "Jits ^nnal Conduction Sheet") is used as the heat sink 44, the temperature of the CH1 to CH8 is changed. Figure. The thickness of this heat sink is 〇15 coffee. The horizontal axis of Fig. 4 represents time in two scales, and the vertical axis represents temperature in t-degree system. $Fig. 4 '& 疋 发热 发热 发热 发热 发热 之 之 之 之 之 之 之 之 之 之 之 之 之 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热status. The temperature of the brewing point CH2 ~ CH8 is roughly lower than the CH1 15 it ~ 18 it. As shown in Table 1, when a metal plate is used to sandwich the ink plate to make the heat dissipation plate having the integrated structure as the heat dissipation plate 44, 敎19.(TC/W~32TC/W. The resistance value is approximately 5, which shows the time change of the temperature in CH1 to CH8 when the electric wiring board 42 is directly formed without using the heat dissipation plate 44. The horizontal axis represents the time in minutes 3, and the vertical axis As shown in Fig. 5, L is set at the temperature measurement point immediately below the heat generating element 40. The temperature change I reaches 93.6C after 3 minutes from the start of energization of the light-emitting diode of the heat generating element. We can see that the temperature tends to increase with time, and the temperature of CH2~CH8 is approximately lower than CH1 6〇.〇. The curve of temperature change between CH2 and (3)4~Na is extremely The curve of the temperature change in CH2 and CH4 to CH8 given in t has been integrated into the nucleus. Therefore, in Fig. 5, the curves given to the temperature changes in (4) and CH4 to CH8 have been omitted. ® 3 and Figure 4 show the temperature change of the heat-generating component 14 201021169 Paper to 6 〇. (: It will rise to above. Because of the heat sink shown in 5, the temperature of the temperature component in CH1 rises. It can be seen that 'hunting makes the green hot plate can effectively prevent the heat 14.5 °CAV~ board ^, the thermal resistance value is roughly =f4 component =====

Disperse, hairpin, spontaneous element, enchantment, efficacious expansion, or optical accompaniment, red reading, reduction cup, 'confirmed by _ containing poly ♦ each immersion plate composed of looseness = continuous correction metal _ composition of the saki The financial field has excellent domain diffusion characteristics, so that the heat dissipation plate composed of the body composition is drunk in one of the above. In addition, the heat dissipation plate composed of the poly-infusion board has no production meeting, and the + electronic module causes adverse effects. Excellent properties of dust such as toner. <heat-dissipating structure> 'mA·, the first heat-dissipating structure of the present invention and the second heat-dissipating structure are different from each other in the heat-dissipating plate structure of the element. Since the heat dissipation plate structure used in the first and second heat dissipation structures of the present invention has been described, three embodiments will be described below to explain the use of the first and second heat dissipation structures in the present invention. , equipped with heating = substrate structure of electronic parts. Further, in the following description, since it is common to the first and second heat dissipation structures of the present invention, the first and second heat dissipation structures are not distinguished from each other, and only the heat dissipation structure is referred to. As for the second and second heat sinks, they are sometimes referred to as heat sinks, except for special distinctions. The heat dissipation structure according to the first to third embodiments of the present invention will be described with reference to Figs. 6 to 8 . In the following description of the first to third embodiments, any one of the first and second heat dissipation plates may be used as the heat dissipation plate. Fig. 6 is a schematic cross-sectional structural view showing a heat dissipating structure of the first embodiment, and including a heat dissipating plate and a heat sink. The heat dissipation structure 54 of the first embodiment includes a glass epoxy substrate 50 on which the heat generating element 60 is mounted on the main surface 50a, and 15 201021169 ί. The back surface of the _5G is closely connected. Fever = Niu 6 〇 The equivalent of electrical insulation is used to make it 66. Further, the s-surface circuit pattern layer 66 which is touched through the through hole m is turned on. The circuit pattern layer 62 and the back surface circuit layer surface circuit pattern layer 62 and the main surface layer 66 of the back epoxy substrate 5 are considered to be formed, for example, on a wiring layer of glass. Main surface and back surface 50b, copper with circuit pattern is formed

The heat generating element 6 is mounted with an insulating sound 5R interposed therebetween. The heat sink 52 is connected to the heat sink 52 of the surface circuit pattern layer 62 of the top surface of the mountain. Enthusiastic, anti-J, back view, and hot brother close to this. And the heating element 66=: the nameplate of the loser, etc. Logic integrated body t road, power her tank, 偻 1 The heat of the layer diffusion will be transmitted to the heat sink 52. The heat of the 部 散 ^ 传 传 传 传 ( ( ( ( ( ( ( ( ( ( ( ( iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff iff The direction of the surface of the plate 52 is faster. Therefore, the heat generated by the self-contained element 60 will rapidly diffuse along the surface parallel to the surface of the heat sink 52 via the iii iiiif52', #===Touching the heat 壑56 plus 5(4) coffee, in a short time ^ unit time The total amount of heat absorbed by the heat sink 56 is large, so that the temperature of the hot surface 56 main surface 56a in contact with the heat sink 52 is high. And the heat dissipation structure 54 allows the ageing element 6G to be in contact with the _% 16 201021169. The heat of the self-developing element 6G can be efficiently spread. The structure of the heat-dissipating structure of the second embodiment is used to describe the heat-dissipating structure of the second embodiment. The heat-dissipating structure % of the internal circuit is used in the substrate 70, and the characteristics of the eclipse and the peak pattern layer 68 are the same as those of the first embodiment described above. The components other than ΐ are the same as those of the mydriatic structure 54 of the first embodiment, and the description thereof will not be repeated.傅...Fu Parallel case is a layered copper plate formed as a plane of ΓΐίίΪ/? β ] u 参 构造 构造 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 The efficiency of heat diffusion in the substrate 7〇 can be improved. The heat-generating element 6 can be used as the heat-dissipating structure of the third embodiment, and the heat-dissipating structure is included in the schematic structure of the heat-dissipating structure. In the heat dissipating structure 76 of the third embodiment, the thickness of the substrate is separated in the thickness direction, and the two internal electric bodies 54 and 曰 74 are characterized by the heat dissipation structure of the first and second embodiments. The constituent elements other than the constituents f and 74 are the same as those of the heat dissipating structures 54 and 74 of the first and second embodiments, and the description thereof will not be repeated. The layers 邡1 and '2 are also associated with the internal circuit pattern. The layer 68 is the same, and the inside of the substrate 72 made of tantalum is a layered copper plate which is formed by being separated from the main surface 72a and the back surface in the thickness direction of the right earth plate, and a wiring layer of copper having a circuit pattern may be formed. In the heat dissipation structure 76, the heat generated by the internal electric power unit 2' self-heating element (9) inside the substrate 72 can be temporarily spread along the substrate 72 due to the internal heat protection and the 68_2, so that the substrate can be improved. 72 yuan month Shishi efficiency two base! Reverse 72 contains 2 internal circuit pattern layers Therefore, the efficiency of the heat transfer from the heat generation is higher than that of the substrate 70 of the second embodiment. The more the number of internal circuit pattern layers included in the substrate, the more the substrate is along the horizontal 17 201021169 ' « The efficiency of the heat diffusion is higher. Compared with the heat dissipation structures of the first and second embodiments, the third embodiment of the dispersion body 76 can reduce the efficiency of the self-generating element 6G. 9(A) to 9(D) are views showing a front view of the (A)-based LED backlight module using the heat dissipating structure of the present invention, FIG. 9 (8) is a side view, and FIG. 9 (C) is a rear view, FIG. 9 ( D) is a cross-sectional structural view showing a side view in an enlarged manner. In the LED backlight module of the heat-dissipating structure of the invention, the structure of the coffee maker 80 is mounted, and the k-body 82 is fixed by a heat sink 84 which also serves as a mounting component. The heat dissipation structure according to the first embodiment of the present invention described above is used as the heat dissipation structure 82. As shown in Fig. 9(D), in the heat dissipation structure 82, the substrate 82_ with the LEDs 80 mounted thereon is closely attached to the distribution plate © 82-2. The heat sink 82_2 is mounted, and the free substrate 82_丨 and the heat sink 84 are separated across the portion sandwiched by the aluminum back support plate 86 and the heat sink 84. The LED light designed to be output from the LED 80 mounted on the heat dissipation structure 82 can be diffused and reflected by the reflector 88 supported by the aluminum back support plate 86, and simultaneously propagates in the acrylic light guide plate 90. The illumination surface plate 92 is the same. brightness. The size of the surface panel is A4 size (length 21〇mm, width 297mm). That is, the size of the front view of the optical module of Fig. 9(A) is equivalent to the size of A4. On the other hand, heat is also generated from the LED 80, and this heat is transmitted to the heat sink 84 and the aluminum back support plate 86 via the heat radiating structure 82, and is diffused to the outside. Next, the results of the verification experiment are illustrated by the qualitative nature of the LED backlight module using the heat dissipation structure of the present invention. ..... When the forward current of 60 mA flows into the LED 80 to cause it to emit light, the illuminance of the surface plate 92 is 6000 lux. It is estimated that the decrease in luminous efficiency due to the increase in temperature of the LED 8 在 is within 2%, and the luminous efficiency of the LED 80 can be ensured to be 卯% or more. Further, a forward current of 100 mA which is equivalent to 1.67 times the above condition flows into the LED 80 to illuminate it. The illuminance of the surface plate 92 is 10,000 lux. At this time, the temperature at the center of the back surface of the LED backlight module (the point shown as E in Fig. 9(A)) rises to 54 ° C, but the temperature of the LED 80 is 77 t. It is estimated that the decrease in luminous efficiency due to the temperature rise of LED80 is within 9%, which ensures that the luminous efficiency of LED80 is 91〇/〇 18 .201021169 .

OK: The LED month model is constructed without using the heat dissipation structure of the present invention, and the same experiment is performed. In this comparative experiment, when a forward current of 60 nlA was caused to flow into the LED 80 to cause light emission, it was confirmed that the luminous efficiency of the LED 8 was lowered to 70%. ^ C The flatness of the thermal characteristics of the LED backlight module using the heat dissipating structure of the present invention is a total of five points A to E indicated by the viewing surface 9 (AHD), and the temperature time changes from the start of energization. . A and B indicate measurement points near the LED 8 ,, and c and d indicate measurement points of the enthalpy 84. The frame temperature F of the LED backlight module is not shown in Figures 9(A) to (D), which is the room temperature around the LED backlight module. And G indicates the center position of the front side of the coffee backlight module v, and E indicates the center position of the back side of the LED backlight module. The evaluation of the thermal characteristics of the backlight module using the heat dissipation structure of the present invention will be described with reference to the drawings. Fig. 10 is a view for explaining the evaluation of the thermal characteristics of the LED backlight module using the heat dissipation structure of the present invention. In Fig. 1A, the g-axis is scaled in minutes to indicate the elapse of time since the LED 80 was energized. Further, the vertical axis on the left side indicates the temperature in A to F in units of C, and the vertical axis on the right side indicates the illuminance G of the surface plate 92 in units of Lux. The illuminance G of the surface plate 92 is reduced immediately after the start of energization, but is stable to the loooo lux. And the LED backlight module has a frame temperature ρ around the LED backlight module ❹ The room temperature is approximately 30 ° C and remains constant, and the A and B in the vicinity of the LED 80 are full of buzzer ® to vrc or more. And close to l 〇 〇 塾 = 84 = fixed ί c not = about 55 ° C to maintain stability. • Temperature 77 with A and B near LED8〇. In comparison with the enthalpy of the LED 80, the temperature in the measurement points C and D of the LED 为 84 is 55t: only 22 is different, so that the heat generated by the 'self' LED 80 has been efficiently transmitted to the enthalpy 84. The following conclusions can be drawn: by this, the temperature in A and B near the LED 80 does not rise to 77.良好 Good results above. Port 19 201021169 [Simplified Schematic] Fig. 1(A) to (B) are diagrams for explaining the configuration of the heat sink and the method of manufacturing the same, and (A) and (B) are perpendicular to the first and the (2) A schematic cross-sectional structural view of the main surface and the back surface of the heat dissipation plate of the constituent elements of the heat dissipation structure. Figure 2 is for use in the embodiment of the present invention! And the thermal properties of the heat dissipating plate of the second heat dissipating structure component are described in the verification experiment. Fig. 3 is a timing chart showing changes in temperature in CH1 to CH8 when a heat dissipation plate using the heat dissipation structure of the second embodiment of the embodiment of the present invention is used as the heat dissipation plate 44.

Fig. 4 is a graph showing changes in temperature between CH1 and CH8 when a heat dissipating plate in which a conventional graphite plate is sandwiched between metal wires and used as a heat dissipating plate. Fig. 5 is a graph showing the time change of temperature in CH1 to CH8 when the electric wiring board is directly brought into contact with the heat sink without using a heat dissipation plate. Fig. 6 is a schematic cross-sectional structural view showing a heat dissipating structure of the first embodiment of the present invention, and showing a heat dissipating plate and a heat enthalpy. Fig. 7 is a view showing a heat dissipating structure of a second embodiment of the present invention, and is a schematic cross-sectional structural view of each of the hot plates and the enthalpy. Fig. 8 is a perspective view showing a heat dissipating structure of a third embodiment of the present invention, and a schematic cross-sectional structural view of a hot plate and a enthalpy. ,

Γ Γ 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四Cross-sectional structural view of the side view. 剌 说明 剌 剌 剌 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 F: temperature measurement point (temperature) G: illuminance measurement point (illuminance) 16, 20: metal layers 18, 26: polypyrrole infiltration plate 18a, 26a, 50a, 56a, 70a, 72a: main surfaces 18b, 26b, 50b 70b, 72b: back surface 22, 30: metal plates 24, 28: bonding members 10 40, 60: heat generating elements 42: electrical wiring boards 44, 52, 82-2: heat sinks 46, 56, 84: hot 塾50, 70, 72, 82-1: Substrates 54, 74, 76, 82: heat dissipation structure 58: insulating layer 62: surface circuit pattern layer 64: through hole φ 66: back circuit pattern layer

68, 68-1, 68-2: Internal circuit pattern layer 80: LED 86: Aluminum back support plate 88: Reflector 90: Acrylic light guide plate 92: Surface plate 21

Claims (1)

201021169 VII. Patent application scope: 1. A heat dissipation structure for carrying heat dissipation of a hair-receiving lightning component, characterized in that it includes a 'sub-order' and the heat-generating electronic substrate is mounted on the main surface thereof. The electronic heat sink is closely attached to the back surface of the substrate; V ' and the heat dissipation plate is formed on the double-sided or the double-sided or the middle surface of the main surface and the back surface of the cellulose sheet infiltrated with the polyfluorene board. 2. If you apply for a bribe i ^ fine layer. ❹ The main surface of the substrate is formed with a conductive material layer '= base === there is / conductive material composed of a conductive material (10) circuit _ /, in the oil-removing portion clip surface Γ ίί road pattern layer through the through A heat dissipating structure of the second aspect of the table η of the main surface of the substrate, wherein the inner layer is provided with a plurality of layers so as to be separated in the thickness direction of the substrate. . The inner layer of the road is made of ah, the ribs are improved, and the heat dissipation of the static electronic components is characterized in that: ..., the king is electrically mounted on the substrate, and the heat-generating electronic component is mounted on the main surface thereof; The heat dissipating plate is in close contact with the back surface of the substrate; the second board is immersed in the polymer board, and the cellulose sheet is infiltrated into the polymer. The double-sided or any-surface of the moon surface, the heat-dissipating structure of the fifth item is adhered to the metal plate by the bonding member, wherein the main surface of the substrate is a surface circuit pattern layer composed of a conductive material, and The back surface of the substrate is opened, and a back circuit pattern layer made of a conductive material is formed, and y, the back surface circuit pattern layer and the surface circuit pattern layer have six heat dissipation structures through the through holes, wherein the substrate is provided inside the substrate. The conductive material is composed of (4) a wide circuit pattern, and the internal circuit pattern layer is electrically connected to the surface circuit layer formed on the main surface of the substrate via the through hole and the back circuit pattern layer formed on the back surface of the substrate. 8. The heat dissipation structure according to claim 6, wherein the internal circuit pattern layer is provided with a plurality of layers in a manner of being separated along the thickness direction of the substrate. Eight, the pattern: twenty three