201017786 六、發明說明 【發明所屬之技術領域】 本發明關於半導體裝置等使用之網版印刷裝置、特別 是將錫球印刷至基板面上的錫球印刷裝置中，對被印刷至 基板上的錫球進行檢測、對缺陷部分進行修補（repair ) 的裝置及方法。 φ 【先前技術】 近年來，半導體裝置之電連接採用使用錫球（solder ball )之凸塊（bump )形成技術。例如有使用高精確度網 版印刷裝置，印刷錫膏（cream solder)施予迴焊，而以 180〜150μιη間距形成直徑80〜ΙΟΟμιη之球凸塊的印刷法 〇 作爲習知網版印刷裝置，例如有具備以下者：基板搬 入輸送帶；基板搬出輸送帶；具備升降機構的平台部；具 φ 有作爲轉印圖案之開口部的遮罩（網版）；刮刀；具備刮 刀之升降機構及水平方向移動機構的刮刀頭；以及控制彼 等機構的控制裝置。 其之主要動作，首先，係將基板由搬入輸送帶部搬入 裝置內，將基板定位於印刷平台部暫時固定。之後，針對 具有和電路圖案對應之開口部的網版之標記、與基板之標 記，藉由攝影機進行辨識，對雙方之偏移量進行位置補正 ，將基板定位於之間，使兩者呈接觸而上升印刷平台。藉 由刮刀，使網版接觸基板之同時，使焊膏等之糊狀物塡充 201017786 於網版之開口部。之後，下降平台使基板與網版分離，如 此則，糊狀物由網版被轉印至基板上而完成印刷。最後， 將基板由裝置予以搬出。 另外，將錫球撥入使成爲特定間距排列於高精確度加 工微細孔而咸的治具，使直接移載至基板上之同時施予迴 焊而形成錫球凸塊的錫球撥入法爲周知者。 具體言之爲，如特開2000-49 1 83號公報之揭示，由 空氣噴嘴（air nozzle)將錫球供給網版上，使網版搖動、 _ 振動之同時將錫球塡充至特定之開口部，另外，藉由刷取 部或刮刀之並行運動塡充之後予以加熱的方法。 但是，並非全部錫球均被正確搭載於各凸塊形成位置 ，有可能產生搭載部不良。因此，於特開2003-3091 3 9號 公報之揭示，設置錫球之修補裝置，藉由管部構件吸引除 去不良錫球之後，使管部構件吸附新的良品錫球之後，搬 送、再度搭載於具有缺陷之部分，藉由雷射光照射部由管 部構件內側照射雷射光使錫球溶融而暫時固定之技術。 ❹ 錫膏之印刷法因爲設備成本便宜，可以整批形成大量 之凸塊，具有低成本、高效率之優點。 但是’錫膏印刷法，難以確保被轉印之焊錫量之均勻 性’迴焊後需要進行押壓錫球凸塊使高度平滑化的平坦化 處理’會增加工程數造成製造成本增加之問題。另外，伴 隨裝置之高密度化’例如150〜120μιη間距之細間距化進 展，會產生印刷良品率變差，生產性降低之問題。 另外’錫球擠壓法，可藉由確保錫球之分級精確度而 -6- 201017786 形成均勻高度的凸塊。但是，因爲使用高精確度之錫球吸 附治具，藉由自動機整批搭載錫球，細間距化時之間歇時 間（tact )之增大，及高價位治具、設備機器之使用所導 致形成成本之增大問題存在。 另外，特開2000-49 1 83號公報揭示之方法，係搖動 或振動網版使錫球塡充於開口部，另外，藉由刷取部或刮 刀之並行運動施予塡充之方法中，半隨錫球粒子之小型化 0 ，會產生粒子間之范德瓦爾斯力（Vander Waals Force ) 引起之密接現象或靜電氣引起之吸附現象，而導致無法將 全部錫球正確塡充於網版開口部之問題。 另外，特開2003-3091 3 9號公報揭示之方法中，修補 後殘存之助焊劑之量有可能變少，迴焊時焊錫之潤溼性惡 化時，錫球融化時對電極焊墊部之焊接不完全的潤溼不良 有可能會發生。 另外，鄰接之錫球間之距離接近時，吸附錫球的管部 φ 構件帶有靜電氣時，即使供給至基板上之錫球欲由管部構 件分離時，因爲錫球被管部構件之靜電氣吸附而有可能無 法由管部構件分離。由此而發生修補之良品率降低，生產 性裂化之問題。 特開2003-3 09 1 39號公報揭示之方法中，作爲上述之 對策，係藉由雷射光照射部由管部構件內側照射雷射光使 錫球溶融而暫時固定，但因爲雷射光照射裝置之設置’成 本上升極高，受限於此，管部構件之構成及材質等亦需要 使用不發熱之材質。 201017786 【發明內容】 (發明所欲解決之課題） 本發明有鑑於上述問題，目的在於提供將錫球供給至 基板面上之後藉由檢測發現缺陷時，可以低成本、有效地 確實進行缺陷之修復的錫球檢測修補裝置。 (用以解決課題的手段） Φ 爲解決上述問題，本發明之錫球檢測修補裝置，係具 備修復用分配器，用於檢測基板之電極焊墊上所搭載之錫 球之狀態，對被檢測出缺陷的電極焊墊供給錫球者；其特 徵爲：上述修復用分配器，係具備：吸附噴嘴，用於吸附 、保持上述錫球；貫穿孔，形成於上述吸附噴嘴內；心棒 ，可自由移動上述吸附噴嘴之上述貫穿孔之內部；及驅動 機構，在上述心棒之端部將上述錫球按押於上述電極焊墊 之狀態下，使上述吸附噴嘴朝由上述錫球分離之方向移動 @ 〇 另外，本發明之錫球檢測修補裝置，藉由上述驅動機 構使上述心棒沿著上述吸附噴嘴之軸方向移動，上述心棒 之端部可由上述吸附噴嘴之前端部突出。 另外，本發明之錫球檢測修補裝置，藉由上述驅動機 構使上述心棒通過上述吸附噴嘴內形成之上述貫穿孔而移 動，上述心棒堵住上述貫穿孔之開口端部而將上述貫穿孔 間隙設爲窄小狀態。 -8- 201017786 另外，本發明之錫球檢測修補裝置，吸附上述錫球的 上述吸附噴嘴之前端部，係被形成爲推拔（taper )溝狀。 另外，本發明之錫球檢測修補裝置，係具備：將電極 焊墊上搭載有錫球的基板予以搬入，檢測上述電極焊墊上 之錫球之狀態而檢測出缺陷時，爲修復缺陷而除去不良錫 球的除去用分配器；及將新的錫球供給至缺陷之電極焊墊 的修復用分配器；其特徵爲：上述修復用分配器，係具備 φ :進行真空吸附的吸附噴嘴，及使上述吸附噴嘴內部上下 移動的心棒；在藉由上述心棒將新的錫球朝下方按押狀態 下使上述吸附噴嘴上升而構成。 另外，本發明之錫球檢測修補方法，係將事先印刷有 助焊劑的複數電極焊墊上搭載有錫球的基板予以搬入，檢 測上述基板上之錫球之狀態而發現缺陷時，修復上述缺陷 者；其特徵爲：上述缺陷爲錫球之位置偏移或雙錫球時， 除去上述錫球，藉由上述修復用分配器之吸附噴嘴吸附新 參 的錫球，使助焊劑附著於上述被吸附之錫球，搬送至缺缺 陷部分，搭載於缺陷部分之後，藉由上述修復用分配器內 藏之心棒將搭載錫球按押於電極部之同時，使吸附噴嘴由 錫球分離。 另外，本發明之錫球檢測修補方法，係檢測基板之電 極焊墊上所搭載之錫球之狀態，修復缺陷者；其特徵爲具 備：藉由除去用分配器之噴嘴部對缺陷部分供給助焊劑的 工程；藉由修復用分配器之吸附噴嘴來吸附錫球予以保持 的工程；將上述錫球搬送至缺陷位置之電極焊墊上予以載 -9 - 201017786 置的工程；使移動上述吸附噴嘴內的心棒之端部’觸接於 上述錫球的工程；及在上述心棒之端部觸接於上述錫球， 將上述錫球按押於上述電極焊墊之狀態下，使上述吸附噴 嘴朝由上述錫球分離之方向移動的工程。 【實施方式】 以下參照圖面說明，在基板上搭載、印刷錫球，檢測 被印刷之錫球之缺陷而加以修復的本發明實施形態之裝置 @ 及方法之較佳實施形態。 圖1爲助焊劑印刷及錫球搭載/印刷工程之槪略圖。 如圖1(a)所示，首先，於基板21之電極焊墊22上 ，藉由網版印刷法轉印特定量之助焊劑23。本實施形態中 ，網版20，係以可確保高精確度圖案位置精確度的方式， 使用以加成法（additive)製作之金屬網版。以攝影機15f 攝取載置於平台上之基板21與事先設於網版20的定位用 標記之影像，使基板載置平台1 Of朝水平方向移動，進行 @ 位置偏移之補正。作爲刮刀3，可使用角型刮刀、劍型刮 刀、平板刮刀之任一。首先，依據助焊劑23之黏度、觸 變性，來設定網版間隙、印壓、及刮刀速度等條件。之後 ，以設定之條件進行助焊劑之印刷。 藉由攝影機1 5f觀測被印刷之助焊劑23之量，判斷 其量，助焊劑23之量少時，錫球塡充時錫球有可能無法 附著於電極焊墊22上。另外，成爲迴焊時之焊接潤溼不 良之主要原因，無法形成漂亮形狀之凸塊，亦成爲凸塊高 -10- 201017786 度不良或焊接強度不足之主要原因。 相反地，助焊劑之量過多時，錫球搭載/印刷時網版 之開口部附著多餘的助焊劑時，錫球會附著於網版之開口 部，錫球無法被轉印至基板上。如上述說明，助焊劑印刷 乃維持錫球搭載品質非常重要之因素。 之後，如圖1 ( b )所示，將錫球24搭載/印刷於， 被印刷有助焊劑23的基板21之電極焊墊22上。本實施 φ 形態中使用直徑約ΙΟμιη之錫球。錫球24之搭載使用的網 版20b，係以能確保高精確度之圖案位置精確度的方式， 而使用藉由加成法製成之金屬網版。 網版20b之材質，係使用例如鎳之磁性體材料。如此 則，網版20b被來自設於平台10之磁鐵10s之磁力吸引 ，而可將基板21與網版2 0b間之間隙設爲0。因此，可防 止錫球24潛入基板21與網版2 0b之間而產生多餘之錫球 〇 〇 在網版20b之背面開口部附近設有樹脂製或金靥製之 微小支柱20a。如此而構成助焊劑23溢出時之退縮部。因 此，印刷有助焊劑23的基板21密接於網版20b時，可防 止助焊劑23之溢出之附著於網版開口部內。 於基板21之角部4點設有定位標記（未圖示）。藉 由攝影機15f(參照圖2)以視覺辨識基板21上之定位標 記與網版20b側之定位標記（未圖示），高精確度地進行 定位。如此則，可以高精確度地將錫球24供給至特定之 電極焊墊22上。 -11 - 201017786 表示於網版20b上的縫隙狀體63，係構成錫球供給用 之塡充單兀（參照圖4)之一要素。搖動縫隙狀體63之同 時’使塡充單元朝箭頭60V方向移動，錫球24被擠壓轉 動而被逐一塡充於網版20b之開口部20d。 圖2爲助焊劑印刷至錫球檢測修補爲止之工程之一實 施形態之槪略圖。 圖2所示裝置，係將助焊劑印刷部1 〇 1、錫球搭載· 印刷部103、及檢測•修補部104構成爲一體者。各部係 由輸送帶25予以連結，藉由該輸送帶25來搬送基板。於 助焊劑印刷部1 0 1及錫球搭載·印刷部1 03，設有作業用 之平台10f、10b。使該平台l〇f、l〇b上下移動來進行基 板之取/送。平台10f、10b構成爲可於水平方向（ΧΥ0 方向）移動。另外，藉由攝影機15f、15b攝影網版20、 20b與基板之定位標記（未圖示），而可進行網版20、 2〇b與基板間之定位。另外，錫球印刷後之基板上之印刷 狀態（錫球之搭載狀態）之檢測用攝影機1 5a，被設於檢 測·修補部104。另外，雖未圖示，亦設有進行彼等之動 作控制或影像處理、檢測判斷的控制裝置。本圖中，於檢 測·修補部104未設置平台，而可於輸送帶25上進行檢 測•修補，具備基板定位用之機構（未圖示）。另外，亦 可構成爲設有平台。另外，於各網版下部設置版下清掃裝 置’用於清掃網版背面（未圖示）。 圖3爲本實施形態之凸塊形成工程之流程圖。 首先，將基板搬入助焊劑印刷部（STEP1 )。之後， 201017786 進行網版與基板之定位，使塗敷頭下降至網版上，在施加 特定印壓狀態下移動塗敷頭，由設於網版上之開口部將特 定量之助焊劑印刷至電極焊墊上（STEP 2)。之後，藉由 攝影機15f攝影助焊劑印刷後之網版開口狀況，對攝影結 果進行影像處理、進行檢測（STEP3 )。檢測之結果不良 (NG)時，藉由印刷裝置內具備之版下清掃裝置自動實 施網版清掃，必要時補充供給助焊劑。另外，對NG之基 ❹ 板，係以不實施錫球印刷以後之工程的方式，送出NG信 號之同時，於後工程之輸送帶上待機而排出生產線外。藉 由線上之NG基板自動倉儲等整箱整批予以排出而構成亦 可。NG基板於生產線外之工程實施洗淨後，可以再度使 用於助焊劑印刷（STEP4)。 對於良品基板實施錫球搭載•印刷（STEP5 )。錫球 搭載•印刷結束後，版分離之前由網版上方對網版開口內 之錫球塡充狀況進行檢測（STEP6 )。檢測結果存在塡充 e 不足之處時，再度使錫球塡充頭動作，執行錫球搭載•印 刷動作（STEP7 )。如此則，可以提升錫球塡充率。 於STEP6之檢測結果爲OK時執行版分離（STEP8 ) ，藉由檢測•修補裝置檢測錫球之搭載狀況（STEP9 )。 錫球搭載狀況之檢測爲NG時，將錫球吸附、保持於修復 用分配器，對該錫球供給助焊劑之後，對不良處之電極焊 墊部再度供給錫球（STEP10)。搭載狀況檢測爲OK時， 藉由迴焊裝置使錫球溶融（STEP 11)，而完成錫球凸塊。 圖4爲使錫球搭載/印刷部之錫球搭載於基板上的錫 -13- 201017786 球供給頭（塡充單元）之構成圖。 錫球供給頭60，係具備：錫球殻體，係在框體61、 蓋部64、濾網狀體62所形成之空間將錫球24予以收納； 及於濾網狀體62之下方隔開間隔被設置的縫隙狀體63。 濾網狀體62,係由適合於供給對象之錫球24之直徑，而 具有網目狀開口或連續之長方形狀縫隙部等之開口的極薄 金靥板形成。於濾網狀體62之下方，配置縫隙狀體63, 縫隙狀體63和網版20b呈面接觸而構成。 藉由設於蓋部64上方之印刷頭升降機構4，可調整縫 隙狀體63對網版20b之接觸狀況/間隙。縫隙狀體63， 係由磁性材料形成之極薄金屬板形成。藉由磁性材料之使 用，藉由設有磁鐵的平台10之磁力，使縫隙狀體63可以 吸附於由磁性材料形成之網版2 0b。縫隙狀體63，係適合 於對象之錫球24之直徑極網版20b之開口部20d之尺寸 ，具有例如網目狀開口或連續之長方形狀縫隙部。 另外，錫球供給頭60，係具備：對錫球殼體上設置之 濾網狀體62，朝水平方向施加振動之水平振動機構。水平 振動機構，係在錫球殻體側面之平行位置所形成構件上安 裝振動施加手段65，將安裝有該構件的支撐構件7〇設於 蓋部64之上面而構成。藉由該構成，由錫球殻體側面側 藉由振動施加手段65施加振動可使濾網狀體62產生振動 。藉由濾網狀體62之振動，可使設於濾網狀體62之縫隙 狀開口成爲較錫球24之直徑大爲開放。如此則，收納於 錫球殼體的錫球24’會由濾網狀體62之縫隙部掉落縫隙 -14- 201017786 狀體63上。掉落縫隙狀體63上的錫球24 錫球24之供給量，可以藉由振動施加手段 之控制予以調節。 振動施加手段65，係使用空氣旋轉式振 位控制進行壓縮空氣壓力之微調而可以控制 ，控制壓縮空氣流量而變化振動數亦可。藉 段65，使濾網狀體62及錫球殼體對收納於 @ 球24施予振動，使作用於錫球24間之范德 之吸附力互相抵消而予以分散。藉由上述分 止錫球供給量受錫球24之材料或生產環境 之影響而產生之變化。因此，可考慮生產效 〇 另外，於錫球供給頭60設有使錫球殼 搖動的水平搖動機構。水平搖動機構如下構 件70上部設置線性導軌67，以線性導軌67 Q 設置設有線性軌條的塡充頭支撐構件71。於 構件71設置驅動馬達68，於該驅動馬達68 凸輪60，藉由偏心凸輪66之旋轉使支撐構< 向移動（搖動）而構成。塡充頭支撐構件7] 馬達支撐構件2，以對馬達支撐構件2不會 動的方式而構成。 亦即’水平搖動機構，係藉由驅動馬達 輪66旋轉，而可以任意之行程量對縫隙狀骨 方向之搖動動作。縫隙狀體63係在藉由磁 之數量、亦即 6 5之振動能量 :動器，藉由數 振動數。或者 由振動施加手 •錫球殻體之錫 瓦爾斯力引起 散效果，可防 中溫度、溼度 率而進行調整 體朝水平方向 成。於支撐構 可移動的方式 該塡充頭支撐 之軸安裝偏心 牛70朝水平方 1，係被支撐於 朝左右方向移 68使偏心凸 I 63提供水平 力被吸附於網 -15- 201017786 版20b的狀態下施予搖動動作，因此’在縫隙狀體63與 網版20b間不會空出間隙，可以確實轉動錫球24。另外’ 藉由縫隙狀體63之開口尺寸，可使錫球24確實補充於縫 隙狀體63之開口之同時’可以進行效率良好的塡充動作 。網版2 0b與搖動動作之週期速度，可藉由驅動馬達68 之速度控制任意變更，可以考慮線上平衡而設定錫球24 之塡充間歇時間（tact )。另外，依據錫球24之材料種類 、網版20b之開口及環境條件來調整合適之週期速度’可 ❹ 以控制塡充效率。 在錫球供給頭60設置刮刀狀體（spatula shape ) 69。 藉由錫球供給頭60對基板21上供給錫球24之後，使網 版2 0b由基板21面分離時，亦即進行版分離而將錫球轉 印至基板21上時，在網版2 0b之版面狀存在錫球24之殘 留物時，錫球24會通過網版2 0b之開口部2Od掉落至基 板21上，成爲過多錫球被供給之不良原因。因此，本實 施形態中，於錫球供給頭60之進行方向，於錫球殼體隔 ❹ 開間隔，將刮刀狀體69設成和縫隙狀體63大略同一高度 。刮刀狀體69之前端係被施予硏磨成爲極薄且高平坦精 確度之狀態，和網版20b呈密接狀態下，使錫球24不會 溢出錫球供給頭60之外部而予以構成。 又，刮刀狀體69使用磁性材料時，和縫隙狀體63同 樣藉由磁力被吸附於網版2 0b，因此可防止錫球24之溢出 錫球供給頭60外部。另外，使刮刀狀體69設於錫球殼體 之外周部全部區域而構成亦可。藉由刮刀狀體69可盡量 -16- 201017786 減少網版2 0b之版面上之錫球殘餘。 但是’網版20b之版面之微小變位引起之錫球殘餘之 影響乃未被考量。因此，本實施形態中，爲更進一步減少 過剩錫球引起之不良，而於錫球供給頭60設置氣幕（air curtain)形成用之送風機構75。 亦即，在支撐印刷頭升降機構4的馬達支撐構件2設 置送風機構75，而於塡充單元之周圍形成氣幕。於該送風 φ 機構75，可由壓縮空氣供給源（未圖示）被供給壓縮空氣 ，如此而構成。藉由使用送風機構75，在錫球供給頭60 朝基板端面方向移動時，藉由壓縮空氣使溢出之錫球被押 壓滾動朝向錫球供給頭60之動作方向側，因此，可，因 此，可防止版面上之錫球殘留。 以下說明將錫球搭載/印刷於基板上之動作。 圖5爲錫球搭載/印刷動作之槪略圖。搭載/印刷動 作主要使用錫球供給頭60與清掃器130。 〇 首先，如（1)所示，錫球供給頭60移動至基板21 之長邊方向之同時，藉由水平振動機構振動錫球殼體，將 錫球塡充於網版2 0b之開口部。之後，如（2)所示，錫 球供給頭60並用水平振動機構引起之搖動動作，使錫球 轉動而確實塡充於開口部之同時，於水平方向（箭頭A方 向）往復移動。 對網版開口部之錫球塡充動作結束後’錫球供給頭60 如（3)之箭頭B方向上升。之後，如（4)之箭頭C所示 ，使基板21之上方移動至長邊方向’回至原來位置之後 -17- 201017786 ，如箭頭D所示，係降至接觸網版20b之位置而停止。 以下說明清掃器130之清掃動作。 清掃器130，係將上述塡充動作後不希望而殘留於網 版上之上述清掃集中者。於清掃器130之底部，如圖5所 示，被形成複數個刮刀131。刮刀131，係於清掃器130 之動作進行方向之相反方向以傾斜一定角度被安裝（細部 未圖示）。刮刀131移動於網版上撫平其表面使網版上之 錫球廢棄而可被清掃集中。 _ 錫球供給頭60之塡充動作結束後，如（5)所示，清 掃器130以接觸網版20b之狀態下移動至箭頭E所示水平 方向。亦即，安裝於清掃器130底部之複數個刮刀131， 係沿網版2 0b之上面朝水平方向進行。此時，殘留於網版 2 0b上的錫球被清掃集中，朝網版20b之空的開口部掉落 。如此則，可以消除後述圖6、7所示無錫球之不良。另 外，將網版2 0b上之錫球全部清掃排出，最後成爲網版 2〇b上無殘留多餘錫球之狀態。 清掃器130，移動至網版2 0b之開口部存在的端部附 近時，如箭頭F所示上時上升之後，如（6)之箭頭G所 示，使基板21之上方回至長邊方向，如箭頭Η所示再度 下降至接觸網版20b之位置。之後，再度進行同樣之清掃 動作。該清掃動作，係在網版2 0b上之錫球完全被清掃爲 止被執行數次。另外，必要時亦可如（7 )之箭頭I所示 ，使限定於網版20b之一部分的清掃動作移動至其他部分 而連續進行。 -18· 201017786 藉由上述清掃動作，可對空的全部開口部塡充錫 因此可消除無錫球之不良。另外，最後網版2 0b上之 錫球全被清掃排出而無殘留，因此使網版2 0b由基ί 分離時可防止剩餘錫球之進入網版2 0b之開口部。因 可以消除後述圖6、7所示雙錫球之不良。 圖6表示錫球搭載/印刷後攝影基板上之錫球塡 態之結果之例。 0 印刷後之基板以攝影機1 5 a攝影時，錫球對全部 部良好塡充時可以觀測到如（a )所示狀態。（b )表 球之一部分塡充不完全之狀態（無錫球之不良）。 表示錫球彼此吸附之雙錫球狀態及過剩錫球由電極部 之狀態 圖7爲錫球搭載/印刷後之代表性缺陷例之槪略 如圖7所示，錫球塡充不良之例有：例如未被塡充錫 「無錫球狀態」、近接之錫球彼等重疊的「雙錫球狀 φ 、及錫球偏移電極部之助焊劑塗敷位置的「錫球位置 之狀態」。 於彼等之狀態下使基板流至後續工程（迴銲工程 會生產出不合格品。因此，藉由檢測基板上之塡充狀 藉由上述塡充單元（錫球供給頭）再度嘗試塡充、印 作，則可以將不良品修正爲良品。該檢測可以藉由和 模型比較之圖案匹配來判斷。錫球塡充•印刷後藉由 裝於塡充單元的CCD或線性感側器攝影機15b依據 單位進行整批辨識。NG時再度實施錫球塡充.印刷 球， 過剩 ί 21 此， 充狀 電極 示錫 ：c) 溢出 圖。 球之 態」 偏移 )時 態， 刷動 良品 被安 區域 。合 -19- 201017786 格時實施版分離動作之後將基板排出至後續工程。 圖8爲錫球搭載/印刷後之檢測、修補部之修補作業 說明圖。 於檢測•修補部，首先，錫球搭載•印刷完了後，藉 由CCD ( Charge Couple Device)攝影機15a確認基板上 之塡充狀況。檢測出不良時，求出不良處之位置座標，雙 錫球、位置偏移錫球、過剩錫球等之不良時，如（1)所 示’除去用分配器、亦即吸引用真空吸附噴嘴86移動至 參 不良錫球24x之位置，對不良錫球24x施予真空吸附並移 動至不良錫球捨去平台（未圖示）。於不良錫球捨去平台 ’藉由真空遮斷使錫球掉落、廢棄至廢棄箱83 (參照圖9 )° 另外’未被供給錫球24的電極焊墊部時，或以真空 吸附噴嘴86除去不良錫球時，如（2)所示，使用修復用 分配器87藉由負壓吸附收納於錫球收納部84的正常錫球 24。之後，如（3)所示，使吸附有正常錫球24的修復用 @ 分配器87，由錫球收納部84移動至助焊劑供給部85。如 (4)所示’使吸附有錫球24的修復用分配器87移動至 儲存於助焊劑供給部85的助焊劑23，使錫球24浸漬於助 焊劑2 3而對錫球2 4添加助焊劑2 3。之後，如（5 )所示 ’使吸附錫球24的修復用分配器87移動至基板上之缺陷 部。最後’如（6 )所示，對缺陷部供給錫球24。藉由上 述（1)〜（6)之工程而完成修補作業。 於上述工程’可使除去用分配器兼作爲助焊劑供給用 -20- 201017786 分配器，而在除去不良錫球之後，實施對缺陷部分供給助 焊劑之方法。此情況下，供給新的錫球時，不進行附著助 焊劑之工程亦可。 又，於先前之檢測，除去位置偏移錫球等不良錫球時 ，可藉由上述修補作業將正常錫球補給至正確位置而修復 缺陷。 圖9爲檢測修補裝置之槪略構成，檢測•修補部以1 0 個獨立之裝置由上觀察之平面圖。如圖9所示，由搬入輸 送帶81搬入檢測對象之基板21，傳遞至檢測部輸送帶82 上，被搬送至箭頭J方向。於檢測部輸送帶82上部設有 門型框架80。於門型框架80之搬入輸送帶81側，在基板 搬送方向（箭頭J方向）之直角方向設置線性感側器79。 藉由線性感側器79可檢測出基板21上之電極焊墊22被 印刷之錫球24之狀態。於此，作爲錫球之狀態檢測器雖 設置線性感側器79，但亦可構成爲設置攝影用攝影機，使 移動至門型框架80之長邊方向，攝影錫球之狀態影像， 檢測出缺陷。 在支撐門型框架80的一方之腳側設置：收納正常錫 球的錫球收納部84及助焊劑供給部85，在另一方之腳側 設置廢棄箱83。於門型框架80，以藉由線性馬達可於水 平方向（箭頭Κ方向）以動的方式設置：吸引、除去不良 錫球用的除去用分配器、亦即真空吸附噴嘴86，及基板上 之缺陷修補用的修復用分配器87。 檢測部輸送帶82構成爲可於箭頭J方向及其反方向 201017786 往復移動，對應於基板21之缺陷位置，可使修復用分配 器87或真空吸附噴嘴86之位置定位於缺陷位置。檢測· 修補完成之基板係藉由搬出輸送帶88被搬出、送至迴銲 裝置。藉由上述構成，依據圖8說明之動作可進行檢測· 修補。 圖10爲修復用分配器之構成側面圖。圖11爲修復用 分配器之前端部之錫球之吸附分離動作之說明擴大圖。 如圖10所示，於修復用分配器87被形成例如保持、 @ 移動錫球用的塑膠製之吸附噴嘴90 (但是材質不限定於塑 膠製）。吸附噴嘴90係由前端部98朝上方被施予推拔狀 ，亦即，吸附噴嘴90，成爲由前端部98朝基端部99擴大 其幅度之形狀。於吸附噴嘴90內被形成貫穿孔92。如圖 1 1所示，貫穿孔92，（雖不如吸附噴嘴90之形狀）亦朝 上方被施予推拔狀。亦即’貫穿孔92，係成爲越上部越粗 ，越是下部越細之形狀。更詳細說明如下，貫穿孔92係 被形成爲，設於貫穿孔92之下端的開口端部92 a之內徑 ❹ ，成爲和後述說明之心棒91之外徑大略同一。於貫穿孔 92之內部空間，藉由負壓施加機構（未圖示）被施加負壓 〇 吸附噴嘴90係藉由保持器等被固定於噴嘴支撐框94 。噴嘴支撐框94被連結於驅動部96。因此’吸附噴嘴90 ，係和驅動部96同時自由移動於上下方向。 於吸附噴嘴90之貫穿孔92內，介由密封構件（未圖 示）被插入心棒91予以保持。心棒91，係例如直徑約 -22- 201017786 ΙΟμιη之圓柱形狀之金屬製之棒，由強度大、不容易帶電 的材質構成（但是心棒91之形狀及材質不限定於上述） 。除貫穿孔92之開口端部92a之部分以外，心棒91之外 徑較貫穿孔92之內徑爲小，心棒91可於吸附噴嘴90之 軸方向自由上下移動。心棒91之上端部91a被固定於支 撐構件93。支撐構件93，係被連結於馬達95，和心棒91 可同時自由移動於上下方向。 0 支撐構件93與驅動部96係介由線性軌條97被連接 ，因此支撐構件93與驅動部96成爲可以分別獨立上下移 動。亦即，安裝於支撐構件93的心棒91，與連結於驅動 部96的吸附噴嘴90可以分別獨立上下移動。 上述支撐構件93、噴嘴支撐框94、馬達95、驅動部 96及線性軌條97等構成驅動機構。 支撐構件93下降，或吸附噴嘴90上升時，如圖1〇( b)所示，支撐構件93之下端面與吸附噴嘴90之上端面 0 呈頂接。於該頂接狀態下，心棒91之下端部91b由吸附 噴嘴90之前端部98朝下方向突出。爲實現上述功能’心 棒91之全長A較吸附噴嘴90之全長B變爲更長而構成。 如圖1 1之擴大所示，吸附噴嘴90之前端部98 ’被加 工成爲推拔溝狀，而能容易保持錫球24。藉由吸附噴嘴 90之前端部98被加工成爲推拔溝狀’在真空吸附錫球24 時，錫球24可以良好地設定於推拔溝內’錫球24不容易 由前端部98分離。另外，藉由前端部98之溝部形狀設爲 和錫球24之形狀同樣的球狀，更能良好進行吸附。但是 -23- 201017786 ，前端部98之形狀並不限定於上述。 以下說明上述構成之修復用分配器對錫球之缺陷修補 動作。 最初，藉由修復用分配器87之吸附噴嘴90吸附修補 用之新的錫球24(直徑約30μπι)。此時，於吸附噴嘴90 內介由貫穿孔92被供給負壓，因此錫球24被真空吸附於 吸附噴嘴90之前端部98。雖未圖示，構造成爲負壓不會 由心棒91被插入之貫穿孔92之上部洩漏。另外，此時， @ 如圖10(a)所示，心棒91成爲由吸附噴嘴90之前端部 98被吸引至內側（上方）之狀態。 於該吸附狀態下，將錫球24搬送至缺陷處之電極焊 墊120上方，使修復用分配器87朝電極焊墊120方向下 降，如圖11 (a)所示，使錫球24載置於電極焊墊120上 之助焊劑1 2 1內。 之後，驅動馬達95，在心棒91之下端部91b頂接錫 球24之前，使心棒91通過吸附噴嘴90之貫穿孔92下降 @ 。如此則，如圖1 1 ( b )所示，心棒91將錫球2 4朝電極 焊墊120按壓。如上述說明，心棒91之外徑與貫穿孔92 之開口端部92a之內徑大略爲同一，在心棒91之移動過 程，心棒91成爲堵住貫穿孔92之開口端部92a之狀態。 因此，貫穿孔92內之間隙變爲狹小狀態’即使負壓作用 時，其引起之真空吸附（負壓）力亦變小’錫球24成爲 可由吸附噴嘴90自由分離。 依據上述構成，無須另外設置切斷負壓用之真空泵閥 -24- 201017786 ，可削減成本。 之後，如圖10(b)所示，在心棒91將錫球24按 於電極焊墊120狀態下，如圖11(b)所示上升吸附噴 90使由錫球24分離。 最後，使馬達95驅動，再度上升心棒91使由錫球 分離。此時，心棒91與錫球24之接觸面積極小，小至 使產生靜電亦可以忽視之程度，因此心棒9 1與錫球24 φ 分離可以圚滑地進行。 如上述說明，本實施形態之錫球檢測修補裝置，係 修復用分配器87內設置可上下移動之心棒91，將錫球 供給至缺陷部分時，藉由心棒91以物理方式將錫球24 壓至電極焊墊120側之同時，將吸附噴嘴91往上拉升 由錫球24分離，因此可使錫球有效確實搭載於電極焊 上。 另外，於錫球搭載時無須使用例如雷射光照射裝置 〇 高價位之裝置，可以簡單之構成實現上述功能，可抑低 置之製造成本。 以上係依據較佳實施形態說明本發明實施形態之錫 檢測修補裝置及錫球檢測修補方法，但本發明並不限定 上述實施形態。亦即，本發明在不脫離其要旨、主要特 情況下可做各種變更實施。 本發明之錫球檢測修補裝置，係在以心棒9 1將被 給至基板上的錫球朝電極焊墊側按壓之狀態下，將吸附 嘴往上拉升而由錫球分離。因此可使錫球有效、確實搭 壓 嘴 24 即 之 於 24 按 而 墊 等 裝 球 於 徵 供 噴 載 -25- 201017786 於電極焊墊上。另外’即使不使用雷射光照射裝置等之高 價位裝置，亦可以簡單之構成實現上述功能，因此可降低 裝置之製造成本。 【圖式簡單說明】 圖1爲本發明實施形態之助焊劑印刷及錫球搭載/印 刷工程之槪略圖。 圖2爲助焊劑印刷至錫球檢測修補爲止之工程說明之 槪略圖。 圖3爲凸塊形成工程之流程圖。 圖4爲錫球供給頭之全體構造之側面圖。 圖5爲錫球搭載/印刷動作說明之槪略圖。 圖6爲錫球搭載/印刷後之基板狀態例之平面圖。 圖7爲錫球搭載/印刷後之代表性缺陷例之槪略圖。 圖8爲錫球搭載/印刷後之修補作業說明之槪略圖。 圖9爲檢測修補裝置之槪略構成之說明平面圖。 圖10爲修復用分配器之構成側面圖。 圖11爲修復用分配器之前端部之錫球之吸附分離動 作之說明擴大圖。 【主要元件符號說明】 2 :馬達支撐構件 3 :刮刀 4 :印刷頭升降機構 -26- 201017786 10、10f、10b:平台 l〇s :磁鐵 15a、15f、15b :攝影機 20 :網版 2 0 a :支柱 20b :網版 2〇c :版框 φ 2 0d ··開口部 21 :基板 22 :電極焊墊 23 :助焊劑 24 :錫球 25 :輸送帶 60 :錫球供給頭 61 :框體 φ 62 :濾網狀體 63 :縫隙狀體 64 :蓋部 65 :振動施加手段 66 :偏心凸輪 67 :線性導軌 6 8 :驅動馬達 69 :刮刀狀體 7 1 :塡充頭支撐構件 -27 201017786 75 :送風機構 7 9 :線性感側器 8 0 :門型框架 8 1 :搬入輸送帶 82 :檢測部輸送帶 83 :廢棄箱 8 4 :錫球收納部 85:助焊劑供給部 @ 8 6 :真空吸附噴嘴 87 :修復用分配器 8 8 :搬出輸送帶 9 0 :吸附噴嘴 9 1 :心棒 92 :貫穿孔 1 0 1 :助焊劑印刷部 103 :錫球搭載·印刷部 @ 1 04 :檢測·修補部 120 :電極焊墊 130 :清掃器 1 3 1 :刮刀 -28-201017786 6. Technical Field [Technical Field] The present invention relates to a screen printing apparatus used in a semiconductor device or the like, particularly a tin ball printing apparatus that prints a solder ball onto a substrate surface, and prints tin onto the substrate. A device and method for detecting a ball and repairing a defective portion. φ [Prior Art] In recent years, the electrical connection of a semiconductor device has been carried out using a bump forming technique using a solder ball. For example, there is a printing method in which a high-precision screen printing device, a solder solder is applied for reflow, and a ball bump having a diameter of 80 to ΙΟΟμη is formed at a pitch of 180 to 150 μm as a conventional screen printing device. For example, there are the following: a substrate loading conveyor; a substrate carrying conveyor; a platform portion having a lifting mechanism; a mask having a φ having an opening portion of the transfer pattern; a doctor blade; a lifting mechanism having a blade and a level The scraper head of the direction moving mechanism; and the control device that controls their mechanism. The main operation is as follows: First, the substrate is carried into the apparatus by the loading and transporting belt portion, and the substrate is positioned and fixed to the printing platform. Then, the mark of the screen having the opening corresponding to the circuit pattern and the mark of the substrate are recognized by the camera, and the offset of both sides is corrected, and the substrate is positioned between the two to make contact therebetween. And rising the printing platform. By using a doctor blade, the screen is brought into contact with the substrate, and the paste of the solder paste or the like is filled in the opening of the screen of 201017786. Thereafter, the lowering platform separates the substrate from the screen, and thus, the paste is transferred onto the substrate by the screen to complete printing. Finally, the substrate is carried out by the device. In addition, the solder ball is inserted into a jig that is arranged at a specific pitch in a high-precision processing micro-hole and is salty, and is directly transferred to the substrate while being reflowed to form a solder ball bump. For the well-known. Specifically, as disclosed in Japanese Laid-Open Patent Publication No. 2000-49 1 83, the solder ball is supplied to the screen by an air nozzle, and the screen is shaken, and the solder ball is charged to the specific one while vibrating. The opening portion is additionally heated by the parallel movement of the brushing portion or the doctor blade. However, not all of the solder balls are correctly mounted on the respective bump forming positions, and there is a possibility that the mounting portion is defective. Therefore, in the Japanese Patent Publication No. 2003-3091 No. 3-9, a solder ball repairing device is provided, and after the defective solder ball is sucked and removed by the pipe member, the pipe member is adsorbed to a new good solder ball, and then transported and reloaded. In the defective portion, a technique in which the laser beam is irradiated by the inside of the tube member by irradiating the laser beam to the inside of the tube portion is melted and temporarily fixed.印刷 The printing method of solder paste can form a large number of bumps in batches because of the low cost of equipment, which has the advantages of low cost and high efficiency. However, in the solder paste printing method, it is difficult to ensure the uniformity of the amount of solder to be transferred. After the reflow, it is necessary to carry out the flattening process of pressing the solder ball bumps to smooth the height, which increases the manufacturing cost and increases the manufacturing cost. Further, with the increase in the density of the device, for example, the fine pitch of the pitch of 150 to 120 μm, the printing yield is deteriorated, and the productivity is lowered. In addition, the 'tin ball extrusion method can form a bump of uniform height by ensuring the classification accuracy of the solder ball -6- 201017786. However, because of the use of high-precision solder ball adsorption jigs, the use of auto balls in a batch of solder balls, the increase in the intermittent time (tact) during fine pitch, and the use of high-priced jigs and equipment The problem of increasing the cost of formation exists. In addition, the method disclosed in Japanese Laid-Open Patent Publication No. 2000-49 1 83 is a method in which a solder ball or a vibrating screen is used to fill a solder ball in an opening portion, and a method of applying a parallel motion by a brushing portion or a doctor blade, The miniaturization of the semi-sand solder ball particles will result in the adhesion caused by the Vander Waals Force between the particles or the adsorption caused by the electrostatic gas, which will make it impossible to properly fill all the solder balls on the screen. The problem of the opening. Further, in the method disclosed in Japanese Laid-Open Patent Publication No. 2003-3091 No. 3-9, the amount of the flux remaining after the repair may be small, and when the wettability of the solder is deteriorated during the reflow, the electrode pad portion is melted when the solder ball is melted. Incomplete wettability of the weld may occur. Further, when the distance between adjacent solder balls is close, when the tube portion φ member of the solder ball is electrostatically charged, even if the solder ball supplied to the substrate is to be separated by the tube member, the solder ball is used as the tube member. The electrostatic gas is adsorbed and may not be separated by the tube member. As a result, the yield of repairs is reduced and the problem of productive cracking occurs. In the method disclosed in Japanese Laid-Open Patent Publication No. 2003-3 09 1 39, the above-described countermeasure is to temporarily fix the solder ball by irradiating the inside of the tube member with the laser beam by the laser beam irradiation portion, but the laser beam irradiation device is temporarily fixed. The setting 'cost increase is extremely high, and it is limited to this. The structure and material of the pipe member also need to use a material that does not generate heat. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) The present invention has been made in view of the above problems, and an object thereof is to provide a defect that can be reliably and reliably performed at a low cost and efficiently when a solder ball is supplied onto a substrate surface and a defect is detected by detection. Tin ball inspection and repair device. (Means for Solving the Problem) Φ In order to solve the above problem, the solder ball detecting and repairing apparatus of the present invention includes a repairing dispenser for detecting the state of the solder ball mounted on the electrode pad of the substrate, and detecting the state The defective electrode pad is supplied to the solder ball; and the repairing dispenser includes: an adsorption nozzle for adsorbing and holding the solder ball; a through hole formed in the adsorption nozzle; and a heart rod movable freely The inside of the through hole of the adsorption nozzle; and a driving mechanism that moves the soldering nozzle toward the electrode pad in a state where the solder ball is pressed against the electrode pad at an end portion of the core bar @@ Further, in the solder ball detecting and repairing apparatus of the present invention, the mandrel is moved in the axial direction of the adsorption nozzle by the drive mechanism, and the end of the mandrel is protruded from the front end portion of the adsorption nozzle. Further, in the solder ball detecting and repairing apparatus of the present invention, the mandrel is moved by the through hole formed in the adsorption nozzle by the driving mechanism, and the core bar blocks the opening end of the through hole to set the through hole gap It is a narrow state. -8- 201017786 Further, in the solder ball detecting and repairing apparatus of the present invention, the front end portion of the adsorption nozzle for adsorbing the solder ball is formed into a taper groove shape. In addition, the solder ball detecting and repairing apparatus of the present invention includes a substrate in which a solder ball is mounted on an electrode pad, and detects a state of the solder ball on the electrode pad to detect a defect, thereby removing the defective tin for repairing the defect. a dispenser for removing a ball; and a repairing dispenser for supplying a new solder ball to a defective electrode pad; wherein the repairing dispenser includes φ: an adsorption nozzle for performing vacuum adsorption, and The mandrel that moves up and down inside the adsorption nozzle is configured to raise the adsorption nozzle by pressing the new tin ball downward by the mandrel. Further, in the solder ball detecting and repairing method of the present invention, a substrate on which a solder ball is mounted on a plurality of electrode pads in which a flux is previously printed is carried in, and when a state of a solder ball on the substrate is detected and a defect is found, the defect is repaired. The feature is that when the defect is the positional shift of the solder ball or the double solder ball, the solder ball is removed, and the solder ball of the new ginseng is adsorbed by the adsorption nozzle of the repairing dispenser to adhere the flux to the adsorbed The solder ball is transported to the defect-deficient portion, and after being mounted on the defective portion, the solder ball is placed on the electrode portion by the mandrel attached to the repair dispenser, and the adsorption nozzle is separated by the solder ball. Further, the solder ball detecting and repairing method of the present invention detects the state of the solder ball mounted on the electrode pad of the substrate and repairs the defect; and is characterized in that the flux is supplied to the defective portion by removing the nozzle portion of the dispenser. The work of maintaining the solder ball by the adsorption nozzle of the dispenser; the above-mentioned solder ball is transported to the electrode pad of the defect position to carry the work of -9 - 201017786; The end of the heart stick is in contact with the solder ball; and the solder ball is contacted at the end of the heart stick, and the solder ball is pressed against the electrode pad to make the adsorption nozzle face the above The movement of the solder ball in the direction of separation. [Embodiment] Hereinafter, a preferred embodiment of the apparatus and method of the embodiment of the present invention in which a solder ball is mounted on a substrate and printed on a substrate to detect defects of the printed solder ball is described. Figure 1 is a schematic diagram of flux printing and solder ball mounting/printing engineering. As shown in Fig. 1(a), first, a specific amount of the flux 23 is transferred onto the electrode pad 22 of the substrate 21 by screen printing. In the present embodiment, the screen 20 is a metal screen manufactured by an additive method in such a manner as to ensure high-accuracy pattern position accuracy. The camera 15f picks up the image of the substrate 21 placed on the stage and the positioning mark previously provided on the screen 20, moves the substrate mounting platform 1 Of in the horizontal direction, and corrects the @ position shift. As the scraper 3, any of an angle scraper, a sword scraper, and a flat scraper can be used. First, the conditions such as the screen gap, the printing pressure, and the blade speed are set in accordance with the viscosity and the thixotropy of the flux 23. Thereafter, the flux is printed under the set conditions. When the amount of the flux 23 to be printed is observed by the camera 15f, the amount of the flux 23 is judged. When the amount of the flux 23 is small, the solder ball may not adhere to the electrode pad 22 when the solder ball is filled. In addition, it is a cause of poor solder wetting during reflow, and it is impossible to form a bump of a beautiful shape, and it is also a cause of poor bumps of -10-201017786 degrees or insufficient weld strength. On the other hand, when the amount of the flux is too large, when the flux is attached to the opening of the screen at the time of solder ball mounting/printing, the solder ball adheres to the opening of the screen, and the solder ball cannot be transferred onto the substrate. As described above, flux printing is a very important factor in maintaining the quality of solder balls. Thereafter, as shown in FIG. 1(b), the solder ball 24 is mounted/printed on the electrode pad 22 of the substrate 21 on which the flux 23 is printed. In this embodiment, a tin ball having a diameter of about ΙΟμηη is used in the φ form. The screen 20b used for the solder ball 24 is a metal screen made by an additive method in such a manner as to ensure high-precision pattern position accuracy. The material of the screen 20b is made of a magnetic material such as nickel. Thus, the screen 20b is attracted by the magnetic force from the magnet 10s provided on the stage 10, and the gap between the substrate 21 and the screen 20b can be set to zero. Therefore, it is possible to prevent the solder ball 24 from intruding between the substrate 21 and the screen 20b to generate excess solder balls. 〇 A micro pillar 20a made of resin or metal is provided in the vicinity of the opening portion of the back surface of the screen 20b. In this way, the retraction portion when the flux 23 overflows is formed. Therefore, when the substrate 21 on which the flux 23 is printed is in close contact with the screen 20b, it is possible to prevent the overflow of the flux 23 from adhering to the screen opening. Positioning marks (not shown) are provided at four points on the corner of the substrate 21. The camera 15f (see Fig. 2) visually recognizes the positioning mark on the substrate 21 and the positioning mark (not shown) on the side of the screen 20b, and performs positioning with high precision. In this way, the solder balls 24 can be supplied to the specific electrode pads 22 with high precision. -11 - 201017786 The slit-shaped body 63 shown on the screen 20b constitutes one of the elements of the charging unit (see Fig. 4) for supplying the solder ball. While the slit-shaped body 63 is being shaken, the charging unit is moved in the direction of the arrow 60V, and the solder balls 24 are pressed and rotated to be filled one by one in the opening portion 20d of the screen 20b. Fig. 2 is a schematic diagram showing one embodiment of a process in which flux is printed until the solder ball is repaired and repaired. In the apparatus shown in Fig. 2, the flux printing unit 1 〇 1, the solder ball mounting/printing unit 103, and the detecting/repairing unit 104 are integrally formed. Each part is connected by a conveyor belt 25, and the substrate is conveyed by the conveyor belt 25. The flux printing unit 1 0 1 and the solder ball mounting/printing unit 103 are provided with work platforms 10f and 10b. The platform l〇f, l〇b is moved up and down to take the substrate. The stages 10f and 10b are configured to be movable in the horizontal direction (ΧΥ0 direction). Further, by the cameras 15f and 15b, the screens 20, 20b and the positioning marks (not shown) of the substrate are used to position the screens 20, 2〇b and the substrate. In addition, the camera 15a for detecting the printing state (the state in which the solder ball is mounted) on the substrate after the solder ball printing is provided in the detecting/repairing unit 104. Further, although not shown, a control device for performing motion control, video processing, and detection determination is also provided. In the figure, the detection/repairing unit 104 is provided with a platform, and can be inspected and repaired on the conveyor belt 25, and includes a mechanism for positioning the substrate (not shown). Alternatively, it may be configured to have a platform. In addition, an under-cleaning device ’ is provided in the lower portion of each screen for cleaning the back of the screen (not shown). Fig. 3 is a flow chart showing the bump forming process of the embodiment. First, the substrate is carried into the flux printing portion (STEP1). After that, 201017786 performs positioning of the screen and the substrate, lowers the coating head onto the screen, moves the coating head under application of a specific printing state, and prints a certain amount of flux to the opening provided on the screen to On the electrode pad (STEP 2). Thereafter, the camera 15f photographs the opening condition of the screen after the flux printing, and performs image processing and detection on the photographing result (STEP 3). When the result of the detection is poor (NG), the screen cleaning is automatically performed by the under-cleaning device provided in the printing apparatus, and the flux is replenished if necessary. In addition, the NG base plate is sent out of the production line by waiting for the NG signal to be sent out on the conveyor belt of the post-engineering. It can also be constructed by discharging the whole batch of NG substrate automatic storage on the line. After the NG substrate is cleaned in the project outside the production line, it can be used again for flux printing (STEP 4). Solder ball mounting and printing (STEP5) is performed on the good substrate. Solder balls • After printing, the solder balls in the screen opening are detected by the top of the screen before the separation (STEP6). When the test result is insufficient, the solder ball is refilled and the solder ball mounting/printing operation (STEP7) is executed. In this way, the solder ball charge rate can be increased. When the detection result of STEP6 is OK, the separation of the plate is performed (STEP8), and the state of mounting the solder ball is detected by the inspection/repair device (STEP9). When the detection condition of the solder ball is NG, the solder ball is adsorbed and held in the repair dispenser, and after the flux is supplied to the solder ball, the solder ball is again supplied to the electrode pad portion of the defective portion (STEP 10). When the mounting condition is detected as OK, the solder ball is melted by the reflow device (STEP 11), and the solder ball bump is completed. 4 is a configuration diagram of a tin-13-201017786 ball supply head (charge unit) in which a solder ball of a solder ball mounting/printing unit is mounted on a substrate. The solder ball supply head 60 includes a solder ball housing that houses the solder balls 24 in a space formed by the housing 61, the cover portion 64, and the mesh body 62, and is disposed below the filter mesh 62. The slit-like body 63 is provided with an interval. The mesh body 62 is formed of an extremely thin metal plate having an opening of a mesh-like opening or a continuous rectangular slit portion, which is suitable for the diameter of the solder ball 24 to be supplied. Below the mesh body 62, a slit-like body 63 is disposed, and the slit-shaped body 63 and the screen 20b are formed in surface contact. The contact state/gap of the slit-like body 63 to the screen 20b can be adjusted by the print head elevating mechanism 4 provided above the lid portion 64. The slit-like body 63 is formed of an extremely thin metal plate formed of a magnetic material. By the use of the magnetic material, the slit-like body 63 can be adsorbed to the screen 20b formed of a magnetic material by the magnetic force of the stage 10 provided with the magnet. The slit-like body 63 is suitable for the size of the opening portion 20d of the diameter pole screen 20b of the target solder ball 24, and has, for example, a mesh-like opening or a continuous rectangular slit portion. Further, the solder ball supply head 60 is provided with a horizontal vibration mechanism that applies vibration to the horizontal direction to the filter-like body 62 provided on the solder ball housing. In the horizontal vibration mechanism, a vibration applying means 65 is attached to a member formed at a parallel position on the side surface of the solder ball housing, and the supporting member 7 to which the member is attached is placed on the upper surface of the lid portion 64. With this configuration, the filter body 62 is vibrated by applying vibration by the vibration applying means 65 on the side surface side of the ball housing. By the vibration of the mesh body 62, the slit-like opening provided in the mesh body 62 can be made larger than the diameter of the solder ball 24. In this manner, the solder ball 24' accommodated in the solder ball housing is dropped from the slit portion of the mesh body 62 to the slit 63-2010-17786. The supply amount of the solder ball 24 solder ball 24 dropped on the slit 63 can be adjusted by the control of the vibration applying means. The vibration applying means 65 can control the fine pressure of the compressed air by using the air rotary type vibration control, and can control the flow rate of the compressed air to change the number of vibrations. In the section 65, the mesh body 62 and the solder ball housing are vibrated in the @ ball 24, and the adsorption force of the van der Waals acting on the solder balls 24 is offset and dispersed. By the above, the amount of solder ball supply is affected by the material of the solder ball 24 or the production environment. Therefore, production efficiency can be considered. Further, the solder ball supply head 60 is provided with a horizontal rocking mechanism for rocking the solder ball shell. The horizontal rocking mechanism is provided with a linear guide 67 at the upper portion of the member 70, and a squeezing head supporting member 71 provided with a linear rail with a linear guide 67Q. A drive motor 68 is disposed on the member 71, and the drive motor 68 cam 60 is supported by the rotation of the eccentric cam 66. < is configured to move (shake). The head supporting member 7] The motor supporting member 2 is configured to prevent the motor supporting member 2 from moving. That is, the 'horizontal rocking mechanism' is capable of oscillating the direction of the slit-like bone by an arbitrary stroke amount by rotating the driving motor wheel 66. The slit-like body 63 is composed of a number of magnets, i.e., a vibration energy of 65, by a number of vibrations. Or, the hand is applied by vibration. • The tin of the solder ball shell causes the dispersion effect to prevent the medium temperature and humidity from being adjusted. In the support structure movable manner, the shaft of the squeezing head support is mounted to the horizontal side 1 and is supported to move in the left-right direction 68 so that the eccentric convexity I 63 provides horizontal force to be adsorbed to the net -15- 201017786 version 20b Since the shaking operation is applied in the state, "the gap is not formed between the slit-shaped body 63 and the screen 20b, and the solder ball 24 can be surely rotated. Further, by the opening size of the slit-like body 63, the solder ball 24 can be surely replenished to the opening of the slit-like body 63, and an efficient charging operation can be performed. The cycle speed of the screen 20b and the shaking operation can be arbitrarily changed by the speed control of the drive motor 68, and the charging time (tact) of the solder ball 24 can be set in consideration of the line balance. In addition, the appropriate cycle speed can be adjusted according to the material type of the solder ball 24, the opening of the screen 20b, and the environmental conditions to control the charging efficiency. A spatula shape 69 is provided in the solder ball supply head 60. When the solder ball 24 is supplied to the substrate 21 by the solder ball supply head 60, and the screen 20b is separated from the surface of the substrate 21, that is, when the solder ball is transferred to the substrate 21, the screen is removed. When the residue of the solder ball 24 exists in the surface of 0b, the solder ball 24 is dropped onto the substrate 21 through the opening portion 2Od of the screen 20b, which causes a defective solder ball to be supplied. Therefore, in the present embodiment, the blade-shaped body 69 is disposed at substantially the same height as the slit-like body 63 in the direction in which the solder ball supply head 60 is moved, at intervals in the solder ball case. The front end of the blade-shaped body 69 is honed to a state of extremely thin and high flatness precision, and the solder ball 24 is placed in close contact with the screen 20b so that the solder ball 24 does not overflow the outside of the solder ball supply head 60. Further, when the blade-shaped body 69 is made of a magnetic material, it is adsorbed to the screen 20b by the magnetic force as the slit-like body 63. Therefore, the solder ball 24 can be prevented from overflowing the outside of the solder ball supply head 60. Further, the blade body 69 may be formed in the entire outer peripheral portion of the solder ball housing. By scraper-like body 69, as much as possible -16- 201017786 can reduce the residual of solder balls on the screen of screen 20b. However, the influence of the tin ball residual caused by the slight displacement of the screen of the screen 20b was not considered. Therefore, in the present embodiment, in order to further reduce the defects caused by the excess solder balls, the air ball supply head 60 is provided with an air blowing mechanism 75 for forming an air curtain. That is, the air supply mechanism 75 is provided in the motor support member 2 supporting the print head elevating mechanism 4, and an air curtain is formed around the refill unit. The blower φ mechanism 75 is configured such that compressed air can be supplied from a compressed air supply source (not shown). By using the blower mechanism 75, when the solder ball supply head 60 moves toward the substrate end surface, the overflow solder ball is pressed and pressed toward the operation direction side of the solder ball supply head 60 by the compressed air. Therefore, It can prevent the solder balls from remaining on the plate. The operation of mounting/printing the solder ball on the substrate will be described below. Fig. 5 is a schematic diagram of a solder ball mounting/printing operation. The solder ball supply head 60 and the cleaner 130 are mainly used for the mounting/printing operation. First, as shown in (1), the solder ball supply head 60 is moved to the longitudinal direction of the substrate 21, and the solder ball is vibrated by the horizontal vibration mechanism to fill the opening of the screen 20b. . Then, as shown in (2), the solder ball supply head 60 is oscillated by the horizontal vibration mechanism, and the solder ball is rotated to reliably refill the opening and reciprocate in the horizontal direction (arrow A direction). After the solder ball filling operation of the screen opening portion is completed, the solder ball supply head 60 rises in the direction of the arrow B of (3). Thereafter, as indicated by an arrow C of (4), moving the upper side of the substrate 21 to the long-side direction 'back to the original position -17-201017786, as indicated by the arrow D, is stopped to contact the screen 20b and stops. . The cleaning operation of the cleaner 130 will be described below. The cleaner 130 is the cleaning concentrator that is left undesired on the screen after the above-described charging operation. At the bottom of the cleaner 130, as shown in Fig. 5, a plurality of scrapers 131 are formed. The scraper 131 is attached at an oblique angle to the opposite direction of the direction in which the cleaner 130 is operated (details are not shown). The blade 131 is moved on the screen to smooth the surface thereof so that the solder balls on the screen are discarded and can be cleaned and concentrated. After the completion of the charging operation of the solder ball supply head 60, as shown in (5), the cleaner 130 moves to the horizontal direction indicated by the arrow E in a state of contacting the screen 20b. That is, a plurality of scrapers 131 attached to the bottom of the cleaner 130 are horizontally oriented along the top of the screen 20b. At this time, the solder balls remaining on the screen 20b are swept and concentrated, and are dropped toward the empty opening of the screen 20b. In this way, the defect of the Wuxi ball shown in Figs. 6 and 7 to be described later can be eliminated. In addition, all the solder balls on the screen 20b are cleaned and discharged, and finally, there is no residual solder ball on the screen 2〇b. When the cleaner 130 moves to the vicinity of the end portion where the opening portion of the screen 20b exists, as shown by the arrow F, the upper side of the substrate 21 is returned to the long side direction as indicated by an arrow G in (6). , again as shown by the arrow Η to the position of the contact screen 20b. After that, the same cleaning operation is performed again. In the cleaning operation, the solder balls on the screen 20b are completely cleaned and executed several times. Further, if necessary, as shown by the arrow I of (7), the cleaning operation limited to one portion of the screen 20b may be continuously performed by moving the cleaning operation to the other portion. -18· 201017786 By the cleaning operation described above, it is possible to fill all the openings of the empty space, thereby eliminating the defects of the Wuxi ball. In addition, the tin balls on the last screen 20b are all cleaned and discharged without residue, so that when the screen 20b is separated from the base, the remaining solder balls can be prevented from entering the opening of the screen 20b. This can eliminate the defects of the double tin balls shown in Figs. 6 and 7 which will be described later. Fig. 6 shows an example of the result of the solder ball state on the solder ball mounted/printed photographic substrate. 0 When the printed substrate is photographed by the camera at 15 a, the state shown in (a) can be observed when the solder ball is fully charged. (b) One part of the ball is incompletely filled (the defect of Wuxi ball). The state of the double-tin ball in which the solder balls are attracted to each other and the state of the excess solder ball by the electrode portion are shown in FIG. 7 as a representative example of the solder ball after the solder ball is mounted/printed, and the solder ball is poorly charged. For example, "the state of the tin ball position" in which the solder ball is not filled with the "Wuxi ball state" and the solder balls that are adjacent to each other, "the double tin ball shape φ, and the solder ball application position of the solder ball offset electrode portion". In the state of the other, the substrate is flowed to the subsequent process (the reflow process will produce a defective product. Therefore, by detecting the charge on the substrate, the above-mentioned charging unit (the solder ball supply head) is again attempted to recharge. If it is printed, the defective product can be corrected as a good product. The detection can be judged by pattern matching compared with the model. The solder ball is charged and printed by the CCD or the line side camera 15b installed in the charging unit. According to the unit, the whole batch identification is carried out. In the case of NG, the solder ball is refilled. The printing ball is over, ί 21 is this, the filling electrode shows tin: c) overflow diagram. The state of the ball "offset" is the state, and the good area is swiped. After -19-201017786, the substrate is discharged to the subsequent project after the separation operation. Fig. 8 is a diagram showing the repair operation of the solder ball after mounting/printing and the repairing operation of the repairing unit. In the inspection and repair section, first, after the solder ball is mounted, the CCD (Charge Couple Device) camera 15a confirms the charge on the substrate. When a defect is detected, the position coordinates of the defective portion, the double tin ball, the positional offset solder ball, and the excess solder ball are determined, as shown in (1), the removal dispenser, that is, the vacuum suction nozzle for suction. 86 Move to the position where the poor solder ball is 24x, apply vacuum suction to the bad solder ball 24x and move to the bad solder ball to go to the platform (not shown). In the case of a poor solder ball, the soldering ball is dropped by the vacuum to the waste box 83 (see Fig. 9). When the electrode pad portion of the solder ball 24 is not supplied, or the vacuum suction nozzle is used. When the defective solder ball is removed, as shown in (2), the normal solder ball 24 accommodated in the solder ball housing portion 84 is adsorbed by the repairing dispenser 87 by the negative pressure. Thereafter, as shown in (3), the repairing @ distributor 87 to which the normal solder ball 24 is adsorbed is moved from the solder ball housing portion 84 to the flux supply portion 85. As shown in (4), the repairing dispenser 87 to which the solder ball 24 is adsorbed is moved to the flux 23 stored in the flux supply unit 85, and the solder ball 24 is immersed in the flux 2 3 to be added to the solder ball 24 Flux 2 3 . Thereafter, as shown in (5), the repairing dispenser 87 for adsorbing the solder balls 24 is moved to the defective portion on the substrate. Finally, as shown in (6), the solder ball 24 is supplied to the defective portion. The repair work is completed by the above (1) to (6) projects. In the above-mentioned work, the removal dispenser can be used as a flux supply -20-201017786 dispenser, and after the defective solder balls are removed, a method of supplying a flux to the defective portion is performed. In this case, when a new solder ball is supplied, the process of attaching the flux may not be performed. Further, in the previous detection, when the defective solder ball such as the positional offset solder ball is removed, the normal solder ball can be replenished to the correct position by the above-mentioned repairing operation to repair the defect. Fig. 9 is a plan view showing the schematic configuration of the detecting and repairing device, and the detecting and repairing portion is viewed from above by 10 independent devices. As shown in Fig. 9, the substrate 21 to be inspected is carried by the loading/unloading belt 81, transmitted to the detecting portion conveyor belt 82, and conveyed to the direction of the arrow J. A door frame 80 is provided on the upper portion of the detecting portion conveyor belt 82. On the loading conveyor 81 side of the door frame 80, a line side slider 79 is provided in a direction perpendicular to the substrate conveying direction (arrow J direction). The state of the solder ball 24 on which the electrode pad 22 on the substrate 21 is printed can be detected by the line side slider 79. Here, although the line side sensor 79 is provided as the state detector of the solder ball, it may be configured to provide a camera for shooting, moving to the longitudinal direction of the door frame 80, and photographing the state of the solder ball to detect a defect. . On the one leg side of the support door frame 80, a solder ball accommodating portion 84 and a flux supply portion 85 for accommodating a normal solder ball are provided, and a waste box 83 is provided on the other leg side. The door frame 80 is provided in a horizontal direction (arrow Κ direction) by a linear motor: a removal dispenser for sucking and removing defective solder balls, that is, a vacuum adsorption nozzle 86, and a substrate A repair dispenser 87 for defect repair. The detecting portion conveyor belt 82 is configured to reciprocate in the direction of the arrow J and its opposite direction 201017786, and the position of the repairing dispenser 87 or the vacuum suction nozzle 86 can be positioned at the defect position in accordance with the defect position of the substrate 21. The substrate that has been inspected and repaired is carried out by the carry-out conveyor 88 and sent to the reflow device. According to the above configuration, the operation described with reference to Fig. 8 can be detected and repaired. Fig. 10 is a side view showing the configuration of the repair dispenser. Fig. 11 is an enlarged view showing the action of the adsorption separation of the solder balls at the front end of the repair dispenser. As shown in Fig. 10, the repairing dispenser 87 is formed with, for example, a plastic adsorption nozzle 90 for holding and moving the solder ball (however, the material is not limited to plastic). The adsorption nozzle 90 is pushed upward by the distal end portion 98, that is, the adsorption nozzle 90 has a shape in which the distal end portion 98 is enlarged toward the proximal end portion 99. A through hole 92 is formed in the adsorption nozzle 90. As shown in Fig. 11, the through hole 92 (not in the shape of the adsorption nozzle 90) is also pushed upward. In other words, the through hole 92 has a shape in which the upper portion is thicker and the lower portion is thinner. More specifically, the through hole 92 is formed such that the inner diameter ❹ of the opening end portion 92a provided at the lower end of the through hole 92 is substantially the same as the outer diameter of the mandrel 91 described later. A negative pressure is applied to the internal space of the through hole 92 by a negative pressure applying mechanism (not shown). The adsorption nozzle 90 is fixed to the nozzle support frame 94 by a retainer or the like. The nozzle support frame 94 is coupled to the drive unit 96. Therefore, the adsorption nozzle 90 and the driving portion 96 are simultaneously freely movable in the vertical direction. Inside the through hole 92 of the adsorption nozzle 90, it is held by a sealing member (not shown) inserted into the mandrel 91. The mandrel 91 is, for example, a metal rod having a cylindrical shape of a diameter of about -22 to 201017786 ΙΟμιη, and is made of a material having high strength and being difficult to be charged (however, the shape and material of the heart rod 91 are not limited to the above). The outer diameter of the mandrel 91 is smaller than the inner diameter of the through hole 92 except for the portion of the opening end portion 92a of the through hole 92, and the mandrel 91 is freely movable up and down in the axial direction of the adsorption nozzle 90. The upper end portion 91a of the mandrel 91 is fixed to the support member 93. The support member 93 is coupled to the motor 95, and the mandrel 91 can be freely moved in the vertical direction at the same time. Since the support member 93 and the drive unit 96 are connected via the linear rail 97, the support member 93 and the drive unit 96 can be independently moved up and down. That is, the mandrel 91 attached to the support member 93 and the adsorption nozzle 90 coupled to the drive portion 96 can be independently moved up and down. The support member 93, the nozzle support frame 94, the motor 95, the drive unit 96, the linear rail 97, and the like constitute a drive mechanism. When the support member 93 is lowered or the adsorption nozzle 90 is raised, as shown in FIG. 1(b), the lower end surface of the support member 93 is in contact with the upper end surface 0 of the adsorption nozzle 90. In this urging state, the lower end portion 91b of the mandrel 91 protrudes downward from the front end portion 98 of the suction nozzle 90. In order to achieve the above-described function, the full length A of the stem 91 is longer than the total length B of the adsorption nozzle 90. As shown in the enlarged view of Fig. 11, the front end portion 98' of the adsorption nozzle 90 is processed into a push-and-groove shape, and the solder ball 24 can be easily held. The front end portion 98 is processed into a push-pull groove shape by the suction nozzle 90. When the vacuum ball 24 is vacuum-adsorbed, the solder ball 24 can be favorably set in the push-pull groove. The solder ball 24 is not easily separated by the tip end portion 98. Further, since the shape of the groove portion of the distal end portion 98 is a spherical shape similar to the shape of the solder ball 24, the adsorption can be performed more satisfactorily. However, -23-201017786, the shape of the front end portion 98 is not limited to the above. The defect repairing operation of the solder ball of the above-described repairing dispenser to the solder ball will be described below. Initially, a new solder ball 24 (about 30 μm in diameter) for repair is adsorbed by the adsorption nozzle 90 of the repair dispenser 87. At this time, a negative pressure is supplied to the adsorption nozzle 90 through the through hole 92, so that the solder ball 24 is vacuum-adsorbed to the front end portion 98 of the adsorption nozzle 90. Although not shown, the negative pressure is not leaked from the upper portion of the through hole 92 into which the mandrel 91 is inserted. Further, at this time, as shown in Fig. 10 (a), the mandrel 91 is in a state of being attracted to the inner side (upper side) by the end portion 98 of the adsorption nozzle 90. In the adsorption state, the solder ball 24 is transferred to the upper electrode pad 120 of the defect, and the repair dispenser 87 is lowered toward the electrode pad 120. As shown in FIG. 11(a), the solder ball 24 is placed. In the flux 1 2 1 on the electrode pad 120. Thereafter, the motor 95 is driven to lower the mandrel 91 through the through hole 92 of the adsorption nozzle 90 before the lower end portion 91b of the mandrel 91 is brought into contact with the solder ball 24. Thus, as shown in Fig. 11 (b), the mandrel 91 presses the solder ball 24 toward the electrode pad 120. As described above, the outer diameter of the mandrel 91 is substantially the same as the inner diameter of the opening end portion 92a of the through hole 92. When the mandrel 91 is moved, the mandrel 91 is in a state of blocking the opening end portion 92a of the through hole 92. Therefore, the gap in the through hole 92 becomes a narrow state. The vacuum suction (negative pressure) force caused by the negative pressure is small. The solder ball 24 can be freely separated by the adsorption nozzle 90. According to the above configuration, it is not necessary to separately provide a vacuum pump valve -24-201017786 for cutting off the negative pressure, thereby reducing the cost. Thereafter, as shown in Fig. 10 (b), in the state in which the tin bar 24 presses the solder ball 24 against the electrode pad 120, the adsorption spray 90 is lifted as shown in Fig. 11 (b) to separate the solder ball 24. Finally, the motor 95 is driven to raise the mandrel 91 again to separate the solder balls. At this time, the contact surface between the mandrel 91 and the solder ball 24 is actively small, so that the generation of static electricity can be neglected, so that the separation of the mandrel 9 1 from the solder ball 24 φ can be smoothly performed. As described above, in the solder ball detecting and repairing apparatus of the present embodiment, the mandrel 91 that can be moved up and down is provided in the repairing dispenser 87, and when the solder ball is supplied to the defective portion, the solder ball 24 is physically pressed by the mandrel 91. At the same time as the electrode pad 120 side, the adsorption nozzle 91 is pulled up and separated by the solder ball 24, so that the solder ball can be effectively mounted on the electrode pad. In addition, it is not necessary to use a device such as a laser light irradiation device at a high price when the solder ball is mounted, and the above functions can be easily realized, and the manufacturing cost can be reduced. Although the tin detecting and repairing apparatus and the solder ball detecting and repairing method according to the embodiment of the present invention have been described above based on the preferred embodiments, the present invention is not limited to the above embodiment. That is, the present invention can be implemented in various modifications without departing from the gist of the invention. In the solder ball detecting and repairing apparatus of the present invention, the solder ball is pulled up toward the electrode pad side by the mandrel 91, and the nozzle is pulled up to be separated by the solder ball. Therefore, the solder ball can be effectively and surely pressed over the nozzle 24, that is, 24, and the pad is loaded on the electrode to be sprayed on the electrode pad -25-201017786. Further, even if a high-priced device such as a laser beam irradiation device is not used, the above-described functions can be easily realized, so that the manufacturing cost of the device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a flux printing and a solder ball mounting/printing process according to an embodiment of the present invention. Figure 2 is a schematic diagram of the engineering description of the flux printing to the solder ball inspection and repair. Figure 3 is a flow chart of the bump forming process. Fig. 4 is a side view showing the entire structure of the solder ball supply head. Fig. 5 is a schematic view showing the description of the solder ball mounting/printing operation. Fig. 6 is a plan view showing an example of a state of a substrate after solder ball mounting/printing. Fig. 7 is a schematic view showing a representative defect of the solder ball after mounting/printing. Fig. 8 is a schematic view showing the description of the repair operation after the solder ball is mounted/printed. Fig. 9 is an explanatory plan view showing the schematic configuration of the repairing device. Fig. 10 is a side view showing the configuration of the repair dispenser. Fig. 11 is an enlarged view showing the adsorption separation operation of the solder balls at the front end portions of the repair dispenser. [Description of main component symbols] 2: Motor support member 3: Scraper 4: Print head lifting mechanism -26- 201017786 10, 10f, 10b: Platform l〇s: Magnets 15a, 15f, 15b: Camera 20: Screen 2 0 a : pillar 20b : screen 2 〇 c : frame φ 2 0d · opening 21 : substrate 22 : electrode pad 23 : flux 24 : solder ball 25 : conveyor belt 60 : solder ball supply head 61 : frame φ 62: mesh body 63: slit-like body 64: cover portion 65: vibration applying means 66: eccentric cam 67: linear guide 6 8: drive motor 69: blade-shaped body 7 1 : boring head support member -27 201017786 75 : Air blowing mechanism 7 9 : Line side device 8 0 : Door frame 8 1 : Carrying in conveyor belt 82 : Detection unit conveyor belt 83 : Disposal box 8 4 : Tin ball housing portion 85 : Flux supply unit @ 8 6 : Vacuum Adsorption nozzle 87: Reparation distributor 8 8 : Carry-out conveyor 9 0 : Adsorption nozzle 9 1 : Mandrel 92 : Through hole 1 0 1 : Flux printing unit 103 : Solder ball mounting and printing unit @ 1 04 : Detection and repair Part 120: Electrode pad 130: Cleaner 1 3 1 : Scraper-28-