201014771 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種晶片測試機之分類裝置，尤其是指一 種不僅可將晶片準確的依電性參數級距所職出的在設定參 數#&圍等級巾财在設定參數麵等級巾進行分開且更可簡 易快速的將不在設定參數翻等財的晶4依不同參數範圍 #絲度―纽，料同f求剌，而在其紐施行使用上 • 更增實用功效特性的晶片測試機之分類裝置創新設計者。 【先前技術】 按’隨著半導體產業的蓬勃發展’各種半導體晶片之應用 雜為廣泛，並由於生產技術之不斷改良，晶片之生產速率也 不斷提升’而晶片測試係為晶片之生產製程中所必要之程序， 可峰保每一晶片在出廠時之品質均能合乎客戶之要求，而目前 晶片測试之動作以採用自動化作業之晶片測試機來進行，並藉 • 由晶片測試機之電子探針與晶片接觸後測量其反應，而依其實 際測試值判別後加以分級且分別收集。 上述之B曰片測S式機係具有一測盤，測盤之圓周分割有數多 缺槽’並於每-缺槽之位置分職設有—吸嘴或吸盤，以達到 吸取或釋放晶片零件之魏，使制盤每猶—缺槽之距離， 測盤上之各吸嘴或健即可吸取或釋放所對應之⑼零件，以 進行必要之循環測試或自動包裝之作業，且於測盤之周緣裝設 有-測試組，測試組設有電子探針，可與晶片零件之接點相接 201014771 觸，以電性參數級距測出晶片零件之各項數值並判斷其表數範 圍等級，再依照晶片零件之不同參數範園等級，利用一棋 之分類結構而將各晶片—一進行分類。 然而，上述晶片測試機’其雖可達到對晶片測試、包裝及 針對電性參數級距所顺㈣獨參數範_級進行分級收 置之預期功效’但於其實際操作施行使用上卻發現該結構於 利用分類結構進行分類時，由於其分類結構係呈—棋盤式机 計，使得需分別蚊有X軸與γ軸的坐標，令分齡構以ς 向移動及直向移動機至魏置晶㈣位置後進行分類不僅 在其整體結構設計上顯得較姆雜不便，且由於其需分別進行 f及直向之移動’相對於其飾分類過財需花費較長的時 間’致令其整體在施行使用上仍存有改進之空間。 緣是’發明人有鑑於此，秉持多年該相關行業之豐富設計 開發及實際製作經驗，針對現有之轉及缺失再予以研究改 良’因而發明出一種晶片測試機之分類裝置 用價值性之目的者。 胃 【發明内容】 本發明晶片測試機之分類襄置，其主要係於晶片測試機連 ^設有分纖置，齡_置_動力源帶_臂圓孤狀轉 動’且於分類裝置對應該擺臂呈弧形排列有數不同分類槽，使 传於晶片錢以之檢難置檢_料麵奴之電性灸 數級距的參數範圍等級時’該晶片祕入分類裝置之導管/， 201014771 且β擺#圓弧狀轉動至呈弧形制之相對應該晶片參數範圍 等級之刀類槽處’讓導管另端與該分類槽連接，使晶片能於相 對應參數範g等級之分類槽内集中收置；藉此，不僅可將晶片 準碟的依電丨！參數級距所測試㈣在設定參數範圍等級中與 不在設定參數範圍等級巾進行分開，且更可簡易快速的將不在 汉疋參數範圍等級中的晶片依不同參數範圍等級程度一一分 級’供不同需求應用，而在其整體施行使用上更增實用功效特 性者。 【實施方式] 為令本發明所運用之技^^内容、發明目的及其達成之功效 有更π整且清楚的揭露，茲於下詳細說明之，並請一併參閱所 揭之圖式及圖號： 首先，請參閱第一圖本發明之立體分解結構圖、第二圖本 發明之俯視結構圖及第三圖本發明之局部放大俯視結構圖所 不，本發明主要係於機台（1)上設有一轉盤（11)，對應該轉盤 (11)之一侧設有進料軌道(丨2)，該進料軌道(12)供對轉盤（η) 輸送晶片（2) ’於轉盤（11)外緣環設排列有數容槽（111)，且於 機台（1)上對應該轉盤（Π)設有檢測裝置（13)，該檢測裝置〇3) 供依電性參數級距檢測通過之晶片（2)的參數範圍等級，並於 該機台（1)上對應轉盤(11)設有導出裝置（14)，該導出裝置（14) 對應轉盤（11)之容槽（ill)底端設有兩相對應之氣槽（141)，於 兩氣槽（141)間則形成有氣孔（142)’並於導出裝置（14)對應氣 6 201014771 槽（141)及氣孔（142)設有壓力供給單元（143)，以能供給氣槽 (141)及氣孔（142)正壓、負壓或完全不供給氣壓，於機台（1) 下端對應該氣孔（142)開設有導出孔（15)，並於對應機台（1) 導出孔（15)設有分類裝置（3)，另於機台（1)上對應轉盤（η) 亦設有包裝帶裝填區（16)，該包裝帶裝填區（〗6)穿設有包裝帶 (161)以能供對良品之晶片（2)進行包裝；其中： 該分類裝置（3)，請一併參閱第四圖本發明之剖視結構圖 及第五圖本發明之局部放大剖視結構圖所示，其設有動力源 (31)，該動力源(31)可為步進馬達，於該動力源(31)之出力端 連接設有一擺臂（32)，該擺臂（32)上設有導管(33)，該導管(33) 之一端連接至機台（1)之導出孔（15)，於該導管（33)之另一端 則能隨著擺臂（32)之擺動連接至呈弧形排列之數不同分類槽 (34) ’另對應該導管（33)設有感應器（35)，該感應器（35)可供 檢測是否有晶片（2)通過該導管（33)。 如此一來’以令晶片（2)由進料軌道（12)輸送至轉盤（11) 時’該晶片（2)會排列掉落於轉盤（11)上之各容槽（111)中，讓 晶片（2)受到轉盤（11)之容槽（111)帶動往檢測裝置（13)移動 進行檢測’且將依電性參數級距檢測後之晶片（2)的參數範圍 等級傳輸至導出裝置(14)，於當在所設定之參數細等級中的 日曰片（2)通過導出裝置（14)時’該導出裝置（14)會利用壓力供 給單70(143)提供負壓’讓晶片⑵吸附於氣槽（141)而通過該 现孔（142)〔請—併參閱第六圖本發明之良品通過狀態示意圖 7 201014771 所示〕，以使晶片（2)藉由轉盤（u)之各容槽gii)帶動至包裝 帶裝填區（16)處，讓晶片（2)掉落於包裝帶（丨61)進行包裝。 另，請一併參閱第七圖本發明之劣品通過狀態示意圖所 不，當不在所設定之參數範圍等級中的晶片〇通過導出裝置 (⑷時’該導出冑置(14)會利用壓力供給單元(143)不對氣槽 (141)提供氣壓，及對該氣孔（142)提供正壓或不提供氣壓，讓 劣品之晶片（2)因正壓之吹送或自然重力，於經過導出孔（15) 會往下掉落人分類裝置⑶之導管⑽内，且糊該感應器㈣ 感應晶片⑵是否有通過導管(33)，於此同時，該分類裝置⑶ 之動力源(31)亦會帶動其擺臂（32)祕狀轉動至呈弧形排列 之相對應該晶片⑵參數範圍等級之分類槽⑽處〔請一併參 閱第八〜十圖本發明之分類狀態示意圖㈠〜（三)所示〕，讓 導管(33)之另端與該分類槽⑽連接，以令該晶片⑵於分類 槽（34)集中收置。 然而前述之實施例或圖式並非限定本發明之產品結構、孔 洞數目或使財式，任何所屬技術領财具有通f知識者之適 當變化或修飾’⑽視為稀離本發明之糊龄。 藉由以上所述，本發明之元件組成與使用實施說明可知， 本發明與财結構她之下，本發明由㈣在其分類裝置利用 動力源帶動擺侧弧狀轉動，且於分類裝置對應麵臂呈弧形 排列有數不同分類槽，使躲晶片受機台上之檢測裝置檢測出 為不在所叹疋之電性參數級距的參數範圍等級時，該晶片能落 8 201014771 入分類裝置之導管中’且該擺臂圓弧狀轉動至呈弧形排列之相 對應該晶片參數範圍等級之分類槽處，讓導管另端與該分類槽 連接，使曰日片月b於相對應參數範圍等級之分類槽内集中收置， 不僅可將晶片準確的依電性參數級距所測試出的在設定參數 範圍等級中與不在設定參數範圍等級中進行分開，且更因其擺 臂係利用動力源帶動呈圓弧狀轉動，及其相對應之各分類槽亦 為呈弧形排列設置，以可簡易快速的將不在設定參數範圍等級 — 巾的晶#依不崎絲度—分級’供不同需求應用，而在其 整體施行使用上更增實用功效特性者。 綜上所述，本發明實施例確能達到所預期之使用功效，又 其所揭露之具體構造，不僅未曾見諸於同類產品中，亦未曾公 開於申請前，誠已完全符合專利法之規定與要求，爰依法提出 發明專利之申請，懇請惠予審查，並賜准專利，則實感德便。 9 201014771 【圖式簡單說明】 第一圖：本發明之立體分解結構圖 第二圖：本發明之俯視結構圖 第三圖：本發明之局部放大俯視結構圖 第四圖··本發明之剖視結構圖 第五圖：本發明之局部放大剖視結構圖 第六圖：本發明之良品通過狀態示意圖 • 第七圖：本發明之劣品通過狀態示意圖 第八圖：本發明之分類狀態示意圖（一) 第九圖：本發明之分類狀態示意圖（二) 第十圖：本發明之分類狀態示意圖（三) 【主要元件符號說明】 (1) 機台 (11) 轉盤 (111) 容槽 (12) 進料軌道 (13) 檢測裝置 (14) 導出裝置 (141) 氣槽 (142) 氣孔 (143) 壓力供給單元 (15) 導出孔 (16) 包裝帶裝填區 (161) 包裝帶 (2) 晶片 (3) 分類裝置 (31) 動力源 (32) 擺臂 (33) 導管 (34) 分類槽 (35) 感應器201014771 VI. Description of the Invention: [Technical Field] The present invention relates to a sorting device for a wafer testing machine, and more particularly to a setting parameter that can not only accurately position a wafer according to an electrical parameter step interval. & circumference level of the money in the setting parameter surface level towel to separate and more easily and quickly will not be in the setting parameters to turn the crystal 4 according to different parameter range #丝度-纽,料为f求剌, and in its Innovative designers of classification devices for wafer testers that use the more practical and useful features. [Prior Art] According to the 'prosperous development of the semiconductor industry', the application of various semiconductor wafers is extensive, and the production rate of wafers is also increasing due to continuous improvement in production technology. The wafer test system is in the production process of wafers. The necessary procedures can ensure that the quality of each wafer at the factory can meet the requirements of the customer. At present, the wafer testing operation is carried out by using a wafer tester with automated operation, and by electronic testing of the wafer testing machine. After the needle is in contact with the wafer, the reaction is measured, and after being judged according to the actual test value, it is classified and separately collected. The above-mentioned B-plate measuring S-type machine has a measuring disc, and the circumference of the measuring disc is divided into a plurality of missing slots' and is provided with a nozzle or a suction cup at each position of the missing slot to obtain the suction or release of the wafer parts. Wei, so that the distance between the plate and the slot is small, the nozzles on the dial can absorb or release the corresponding parts (9) to carry out the necessary cyclic test or automatic packaging, and on the test The periphery of the test is equipped with a test group. The test set is provided with an electronic probe, which can be connected to the contact of the wafer component. The contact value of the wafer component is measured by the electrical parameter step and the scale range of the wafer is determined. Then, according to the different parameters of the wafer parts, the classification structure of a chess is used to classify each wafer. However, the above-mentioned wafer testing machine can achieve the expected performance of wafer testing, packaging, and grading and arranging for the parameter parameters of the electrical parameter level, but it is found in its actual operation and implementation. When the structure is classified by the classification structure, because the classification structure is a checkerboard type, the coordinates of the X-axis and the γ-axis are required for the mosquitoes to be moved, and the moving body is moved to the machine. The classification after the position of the crystal (4) is not only inconvenient in its overall structural design, but also because it needs to carry out f and direct movement separately, and it takes a long time to classify it relative to its decoration. There is still room for improvement in the use of the application. The reason is that the inventor has in view of this, and has been researching and developing the actual experience of the relevant industries for many years, and has researched and improved the existing transfer and missing, thus inventing the purpose of the value of the classification device for the wafer tester. . Stomach [Summary of the Invention] The classification device of the wafer testing machine of the present invention is mainly provided in the wafer testing machine, which is provided with a fiber-distributing device, the age_setting_power source belt_arm round orphan rotation and corresponding to the sorting device The swing arm is arranged in an arc with a number of different sorting slots, so that the money passed to the wafer is difficult to check. _ The surface of the electric moxibustion is a parameter range of the number of steps. 'The conduit of the wafer secret classification device /, 201014771 And the β pendulum is rotated in an arc to the edge of the knife-shaped groove corresponding to the wafer parameter range. The other end of the pipe is connected to the sorting groove, so that the wafer can be in the sorting slot corresponding to the parameter g class. Centralized collection; this way, not only can the wafers be tuned! The parameter step distance test (4) is separated from the set parameter range level in the set parameter range level, and the wafers that are not in the range parameter range can be easily and quickly graded according to different parameter range levels. Demand application, and more practical performance features in its overall implementation. [Embodiment] In order to make the technical contents, the object of the invention and the effects thereof achieved by the present invention more hereinafter and clearly disclosed, the details are as described below, and the drawings and the drawings are also referred to together. FIG. 1 is a perspective view of a first embodiment of the present invention, and a second partial view of the present invention. The present invention is mainly applied to a machine ( 1) A turntable (11) is arranged thereon, and a feeding track (丨2) is provided on one side of the corresponding turntable (11), and the feeding track (12) is used to transport the wafer (2) to the turntable (η). (11) The outer edge ring is arranged with a plurality of slots (111), and a corresponding detecting device (13) is provided on the machine table (1) corresponding to the turntable (Π), and the detecting device 〇3) is provided with an electrical parameter level Detecting the parameter range level of the passing wafer (2), and providing a deriving device (14) on the corresponding turntable (11) on the machine table (1), the deriving device (14) corresponding to the groove of the turntable (11) (ill The bottom end is provided with two corresponding air grooves (141), and between the two air grooves (141), air holes (142) are formed and corresponding to the exporting device (14) 6 201014771 The tank (141) and the air hole (142) are provided with a pressure supply unit (143) for supplying positive pressure, negative pressure or no air pressure to the air tank (141) and the air hole (142), on the machine (1) The lower end corresponding to the air hole (142) is provided with a lead-out hole (15), and the corresponding machine (1) lead-out hole (15) is provided with a sorting device (3), and the corresponding turntable (n) on the machine table (1) is also A packaging tape filling area (16) is provided, and the packaging tape loading area (〖6) is provided with a packaging tape (161) for packaging the good wafer (2); wherein: the classification device (3), please 4 is a cross-sectional structural view and a fifth diagram of the present invention. The partial enlarged cross-sectional structural view of the present invention is provided with a power source (31), which can be a stepping motor. A swing arm (32) is disposed at the output end of the power source (31), and the swing arm (32) is provided with a conduit (33), and one end of the conduit (33) is connected to the lead-out hole of the machine (1) (15), at the other end of the conduit (33), can be connected to the different sorting slots (34) arranged in an arc according to the swing of the swing arm (32), and the corresponding conduit (33) is provided with an inductor. (35 The sensor (35) is adapted to detect if a wafer (2) passes through the conduit (33). In this way, when the wafer (2) is transported from the feed rail (12) to the turntable (11), the wafer (2) is arranged to be dropped in the respective slots (111) on the turntable (11), so that The wafer (2) is moved by the cavity (111) of the turntable (11) to the detecting device (13) for detection' and transmits the parameter range level of the wafer (2) after the electrical parameter step detection to the export device ( 14), when the corrugated sheet (2) in the set parameter fine grade passes through the deriving device (14) 'the deriving device (14) uses the pressure supply sheet 70 (143) to provide a negative pressure 'to the wafer (2) Adsorbed to the gas channel (141) and passed through the current hole (142) [please - see the sixth figure of the present invention through the state diagram 7 201014771], so that the wafer (2) by the turntable (u) The container gii) is driven to the packaging tape loading area (16), and the wafer (2) is dropped onto the packaging tape (丨61) for packaging. In addition, please refer to the seventh figure of the present invention. The state of the invention is not shown. When the wafer is not in the set parameter range, the wafer is passed through the deriving device ((4), the deriving device (14) will utilize the pressure supply. The unit (143) does not supply air pressure to the air tank (141), and provides positive pressure or no air pressure to the air hole (142), so that the inferior wafer (2) passes through the lead-out hole due to positive pressure blowing or natural gravity ( 15) The catheter (10) of the person sorting device (3) will be dropped down, and the sensor (4) will be sensed (4) whether the sensor chip (2) has a through conduit (33). At the same time, the power source (31) of the sorting device (3) will also be driven. The swinging arm (32) secretly rotates to the sorting groove (10) of the parameter range level corresponding to the wafer (2) arranged in an arc shape (please refer to the eighth to tenth drawings for the classification state of the present invention (1) to (3). The other end of the conduit (33) is connected to the sorting tank (10) so that the wafer (2) is centrally collected in the sorting tank (34). However, the foregoing embodiments or drawings do not limit the product structure and the number of holes of the present invention. Or make the financial formula, any technology that has a financial support Appropriate changes or modifications of the omist '(10) are considered to be dilute from the age of the invention. By the above, the component composition and use description of the present invention can be seen, the invention and the financial structure under her, the present invention by (d) in The sorting device uses the power source to drive the swinging side of the swinging arc, and the corresponding arm of the sorting device is arranged in an arc shape with a plurality of different sorting slots, so that the detecting device on the machine receiving the wafer is detected as an electrical parameter level not in the sigh. At the parameter range level, the wafer can fall into the conduit of the classification device in the direction of 201014771, and the swing arm is rotated in an arc to the sorting slot of the corresponding wafer parameter range level in an arc arrangement, so that the other end of the conduit is The sorting slot is connected, so that the day of the next day is collected centrally in the sorting slot of the corresponding parameter range level, and not only the accurate parameter of the parameter level range of the wafer can be set in the set parameter range level or not. The parameter range is divided into levels, and the swing arm system is driven by the power source to rotate in an arc shape, and the corresponding classification slots are also arranged in an arc shape to simplify It is easy to quickly not set the parameter range level - the crystal of the towel - the grading of the towel - for the different needs, and the utility model is more effective in its overall application. In summary, the embodiment of the invention It can achieve the expected use effect, and the specific structure disclosed is not only seen in similar products, nor has it been disclosed before the application. Cheng has fully complied with the requirements and requirements of the Patent Law, and has filed invention patents according to law. Application, pleading for review, and granting patents, it is really sensible. 9 201014771 [Simple diagram of the diagram] First diagram: The three-dimensional exploded structure of the present invention The second diagram: The third diagram of the top view of the present invention: 4 is a partially enlarged plan view of the present invention. FIG. 5 is a cross-sectional structural view of the present invention. FIG. 6 is a partially enlarged cross-sectional structural view of the present invention. FIG. The inferior product of the invention passes through the state diagram. The eighth diagram: the classification state diagram of the present invention (1) The ninth diagram: the classification state diagram of the present invention (2) The tenth diagram: the present invention Schematic diagram of classification status (3) [Explanation of main component symbols] (1) Machine table (11) Turntable (111) Chest (12) Feed rail (13) Detection device (14) Derivation device (141) Air trough (142) Air vent (143) Pressure supply unit (15) Outlet hole (16) Packing tape loading area (161) Packing tape (2) Wafer (3) Sorting device (31) Power source (32) Swing arm (33) Catheter (34) Sorting slot (35) sensor