201011497 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子裝置及其殼體，及殼體的製造 方法。 【先前技術】 隨著消費者對各種電子裝置外觀圖案的要求提高，業 ❹者也在電子裝置的外觀上不斷地推陳出新，以求刺激消費 者的購貝慾望。於此，電子裝置例如以筆記型電腦為例作 說明。 如圖1A及圖1B所示，其中圖1A為習知筆記型電腦 的不意圖，圖1B為圖1A之筆記型電腦的上殼體沿A_A 直線的剖面示意圖。筆記型電腦i的顯示部包括一上殼體 11、一顯示模組12以及一下殼體13。上殼體n及下殼體 13分別位於顯示模組12的兩側，並彼此連接。其中，上 ❿ 殼體11係具有一圖案p。 形成圖案p於上殼體u的習知技術為，先於上殼體 11形成一開口 m，再於開口 ιη置入具有圖案p的塊體 14，藉此即可使上殼體U具有圖案p。 然而’由於圖案P係非直接形成於上殼體U，因此開 口 ill的周緣會顯現於圖案P的周邊，因而影響圖案卩的 視覺感受；且塊體14與上殼體n的接縫處亦可能使灰塵 等異物進入，而造成筆記型電腦1的損壞。另外，由於既 有製程方式的限制，使得單-上殼冑11 Μ構厚度無法有 201011497 效地減少，如此也造成上殼體11的透光度受限制。 【發明内容】 有鑑於此，本發明提供一種能提升視覺感受，且使凹 凸圖案清楚顯示的電子裝置及其殼體，及殼體的製造方 法，以改善現有技術之缺失。 根據本發明之一特色，殼體的製造方法包括以下步 驟：藉由射出壓縮成型方式形成一第一子殼體與其表面的 ® 至少一凹凸圖案，第一子殼體為透光材質；以及藉由覆蓋 成型方式於第一子殼體表面形成一第二子殼體以覆蓋凹 凸圖案。 根據本發明之另一特色，殼體包括第一子殼體以及第 二子殼體。藉由射出壓縮成型方式形成第一子殼體與其表 面的至少一凹凸圖案，第一子殼體為透光材質。第二子殼 體藉由覆蓋成型方式形成於第一子殼體表面以覆蓋凹凸 ❹ 圖案。 根據本發明之又一特色，電子裝置包括光源以及殼 體，殼體設置於光源的一側。殼體具有第一子殼體及第二 子殼體，藉由射出壓縮成型方式形成第一子殼體與其表面 的至少一凹凸圖案，第一子殼體為透光材質，第二子殼體 藉由覆蓋成型方式形成於第一子殼體表面以覆蓋凹凸圖 案，光源發出的光線可通過凹凸圖案。 在本發明之一實施例中，第一子殼體的最大厚度係小 於等於1毫米。 6 201011497 在本發明之一實施例中，第一子殼體表面的凹凸圖案 的最大厚度係小於等於0.5毫米。 承上所述，本發明的殼體係藉由射出壓縮成型 (Injection Compressing Molding, ICM)來形成第一子殼 體，藉此可形成厚度較薄之第一子殼體，以提升殼體的透 光度。且，由於射出壓縮成型可直接於模具上形成高精度 的凹凸圖案，因此除可於第一子殼體上直接形成凹凸圖案 外，且能於第一子殼體上形成更為精美的凹凸圖案。另 ® 外，再藉由覆蓋成型方式形成第二子殼體與第一子殼體結 合，除了可提升殼體的剛性外，且可利用第二子殼體作為 凹凸圖案的背景，以使凹凸圖案產生景深並具有立體感。 而本發明電子裝置的殼體亦可利用如上述之殼體，且可藉 由設置光源於殼體之凹凸圖案後，以照明凹凸圖案來增加 電子裝置的美感。 關於本發明之優點與精神可以藉由以下的發明詳述 φ 及所附圖式得到進一步的暸解。 【實施方式】 圖2為本發明一較佳實施例之殼體製造方法的步驟流 程圖，本發明所提供之殼體的製造方法包括步驟S1及步 驟S2。其中，殼體例如但不限於數位電視、手持式電腦、 超級行動電腦（Ultra-Mobile PC, UMPC)、筆記型電腦、 個人數位助理（PDA)、全球衛星定位裝置（GPS)、無線 數據服務（GPRS)裝置、數位相機、翻譯機、MP3播放 7 201011497 裝置、MP4播放裝置、收音裝置、數位錄影裝置、DVD 播放裝置、遊戲裝置或行動通訊裝置等各類型電子裝置之 殼體。 請同時參考圖2及圖3A至圖3C，步驟S1為藉由射 出壓縮成型方式形成一第一子殼體211，其表面具有至少 一凹凸圖案C，第一子殼體211為透光材質。本實施例雖 以凹凸圖案C形成於第一子殼體211的内表面為例說明， 然並不以此為限。 ❹ 以下請參考圖3A至圖3C，以簡單說明形成第一子殼 體211的步驟。請先參考圖3A所示，首先，射出壓縮成 型設備3的壓合模31及成型模32之間會略微閉合，並射 入用以形成第一子殼體的材料Ml至成型空間S内。其中， 材料Ml例如可為透光材質，其例如包括聚碳酸酯 (polyarbonate, PC ) 或聚曱基丙稀酸甲酯 (Polymethylmethacrylate, PMMA )等高分子聚合物，因此 φ 第一子殼體211係可為透光殼體。 接著，請參考圖3B所示，當材料Ml完全射入成型 空間S後，壓合模31及成型模32即彼此壓合，以使材料 Ml在成型空間S内受到壓縮。其中，形成於壓合模31或 成型模32上的凹凸圖案，即可於兩者壓合時，形成凹凸 圖案C於材料Ml上。 最後，請參考圖3C所示，壓合模31及成型模32完 全閉合後，即形成凹凸圖案C於第一子殼體211的内表 面。其中，第一子殼體211的最大厚度係小於等於1毫米， 8 201011497 而凹凸圖案C的最大厚度係小於等於0.5毫米。 綜上所述，由於射出壓縮成型設備3的成型空間S可 依不同要求作調整，且於材料射出期間或射出完畢後可控 制成型空間S的大小，使成型空間S與射出過程配合，讓 材料維持受壓狀態。藉此，可形成厚度較薄的第一子殼體 211，以提升其透光度。且，由於射出壓縮成型設備3可 直接於模具上形成高精度的凹凸圖案，因此可於第一子殼 體211上直接形成凹凸圖案C。 請同時參考圖2及圖3D，步驟S2為藉由覆蓋成型方 式於第一子殼體211表面形成一第二子殼體212以覆蓋凹 凸圖案C。其中，形成第二子殼體212的材料係可為透光 材質，亦可為非透光材質，於此亦不予以限制。 因此，將第一子殼體211置入覆蓋成型設備4後，即 可射入材料M2與第一子殼體211結合，並形成第二子殼 體212覆蓋凹凸圖案C。請參照圖3E，藉由第二子殼體 φ 212與第一子殼體211結合即形成雙層結構，除了可提升 殼體21的剛性外，且可利用第二子殼體212作為凹凸圖 案C的背景，以使凹凸圖案產生景深並具有立體感。 如圖4所示，其為本發明一較佳實施例之電子裝置2。 於本實施例中，電子裝置2以筆記型電腦為例作說明，然 其非用以限制本發明。電子裝置2包括殼體21a以及本體 22，其中本體22例如可具有一光源（圖中未表示）。殼體 21a設置於本體22及光源的一側，並具有上述實施例所述 的第一子殼體211及第二子殼體212，藉由射出壓縮成型 9 201011497 形成第一子殼體211與其表面（内表面及/或外表面）的至 少一凹凸圖案C。而本體22例如包括顯示模組。 其中，殼體21a沿B-B直線的剖面係如圖3D所示， 且殼體21a的結構及其製造方法係如圖2及圖3A至圖3D 的殼體21，由於殼體21已於前述實施例中詳述，於此不 再贅述。另外，當第二子殼體212亦為透光殼體時，則亦 可於第一子殼體211的凹凸圖案C後設置光源，以照亮凹 ❿ 凸圖案C’藉此可更增加電子裝置2的美感。而於本實施 例中，光源亦可藉由本體22之顯示模組的光源來達成。 另外’電子裝置2更可包括另一殼體23,其設置於本 體22的另一側，並與殼體21a連接。因此，殼體21a、本 體22 (包括顯示模組）及殼體23形成電子裝置2的顯示 部。 綜上所述’本發明的殼體係藉由射出壓縮成型來形成 第一子殼體，藉此可形成厚度較薄之第一子殼體，以提升 參 殼體的透光度。且，由於射出壓縮成型可直接於模具上形 成高精度的凹凸圖案，因此除可於第一子殼體上直接形成 凹凸圖案外，且能於第一子殼體上形成更為精美的凹凸圖 案。另外，再藉由覆蓋成型方式形成第二子殼體與第一子 殼體結合，除了可提升殼體的剛性外，且可利用第二子殼 體作為凹凸圖案的背景，以使凹凸圖案產生景深並具有立 體感。而本發明電子裝置的殼體亦可利用如上述之殼體， 且可藉由設置光源於殼體之凹凸圖案後，以照明凹凸圖案 來增加電子裝置的美感。 〃 201011497 藉由以上較佳具體實施例的詳述，係希望能更加清楚 描述本發明之特徵與精神，而並非以上述所揭露的較佳具 體實施例來對本發明之範疇加以限制。相反地，其目的是 希望能涵蓋各種改變及具相等性的安排於本發明所欲申 請之專利範圍的範轉内。因此，本發明所申請之專利範圍 的範疇應該根據上述的說明作最寬廣的解釋，以致使其涵 蓋所有可能的改變以及具相等性的安排。 【圖式簡單說明】 圖1A是習知筆記型電腦的示意圖； 圖1B為圖1A之筆記型電腦的上殼體沿A-A直線的 剖面示意圖； 圖2是本發明一較佳實施例之殼體的製造方法的步驟 流程圖； 圖3A至圖3E是本發明一較佳實施例之殼體的製造流 程示意圖；以及 圖4是本發明一較佳實施例之電子裝置的示意圖。 【主要元件符號說明】 I :筆記型電腦 II :上殼體 III :開口 12 :顯示模組 13 :下殼體 11 201011497 14 :塊體 2 :電子裝置 21、21a ' 23 :殼體 211 :第一子殼體 212 :第二子殼體 22 :本體 3 :射出壓縮成型設備 31 :壓合模201011497 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic device and a casing thereof, and a method of manufacturing the casing. [Prior Art] As consumers' demands for appearance patterns of various electronic devices have increased, industry leaders have continuously innovated the appearance of electronic devices in order to stimulate consumers' desire for purchase. Here, the electronic device is exemplified by, for example, a notebook computer. 1A and FIG. 1B, FIG. 1A is a schematic view of a conventional notebook computer, and FIG. 1B is a cross-sectional view of the upper casing of the notebook computer of FIG. 1A along a line A_A. The display portion of the notebook computer i includes an upper casing 11, a display module 12, and a lower casing 13. The upper casing n and the lower casing 13 are respectively located at two sides of the display module 12 and are connected to each other. The upper casing 11 has a pattern p. A conventional technique for forming the pattern p in the upper casing u is to form an opening m before the upper casing 11, and then insert the block 14 having the pattern p in the opening ι, whereby the upper casing U has a pattern. p. However, since the pattern P is not directly formed on the upper casing U, the periphery of the opening ill may appear on the periphery of the pattern P, thereby affecting the visual perception of the pattern ;; and the joint between the block 14 and the upper casing n is also It may cause foreign matter such as dust to enter, causing damage to the notebook computer 1. In addition, due to the limitations of the existing process, the thickness of the single-upper casing 11 cannot be reduced by 201011497, which also causes the transparency of the upper casing 11 to be limited. SUMMARY OF THE INVENTION In view of the above, the present invention provides an electronic device and a casing thereof capable of improving visual perception and clearly displaying a concave and convex pattern, and a manufacturing method of the casing to improve the deficiency of the prior art. According to a feature of the present invention, a method for manufacturing a housing includes the steps of: forming a first sub-shell and at least one concave-convex pattern of the surface thereof by injection compression molding, the first sub-shell being a light-transmitting material; A second sub-housing is formed on the surface of the first sub-housing by the overmolding method to cover the concave-convex pattern. According to another feature of the invention, the housing includes a first sub-housing and a second sub-housing. The at least one concave-convex pattern of the first sub-casing and the surface thereof is formed by injection compression molding, and the first sub-housing is a light-transmitting material. The second sub-shell is formed on the surface of the first sub-shell by overmolding to cover the embossed pattern. According to still another feature of the invention, the electronic device includes a light source and a housing, the housing being disposed on one side of the light source. The housing has a first sub-housing and a second sub-housing, and at least one concave-convex pattern of the first sub-housing and the surface thereof is formed by injection compression molding, the first sub-housing is a light-transmitting material, and the second sub-housing The surface of the first sub-casing is formed by the overmolding method to cover the concave-convex pattern, and the light emitted by the light source can pass through the concave-convex pattern. In one embodiment of the invention, the first sub-housing has a maximum thickness of less than or equal to 1 mm. 6 201011497 In one embodiment of the invention, the maximum thickness of the relief pattern on the surface of the first sub-shell is less than or equal to 0.5 mm. As described above, the housing of the present invention forms the first sub-housing by Injection Compression Molding (ICM), whereby the first sub-housing having a thin thickness can be formed to enhance the penetration of the housing. Luminosity. Moreover, since the injection compression molding can form a high-precision concave-convex pattern directly on the mold, in addition to forming the concave-convex pattern directly on the first sub-casing, a more beautiful concave-convex pattern can be formed on the first sub-housing. . In addition, the second sub-casing is combined with the first sub-casing by the overmolding method, in addition to improving the rigidity of the housing, and the second sub-casing can be used as the background of the concave-convex pattern to make the concave-convex The pattern creates a depth of field and a three-dimensional feel. The housing of the electronic device of the present invention can also utilize the housing as described above, and can increase the aesthetics of the electronic device by illuminating the concave and convex pattern by providing a light source to the concave and convex pattern of the housing. The advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the drawings. Embodiments Fig. 2 is a flow chart showing the steps of a method of manufacturing a casing according to a preferred embodiment of the present invention. The method of manufacturing a casing provided by the present invention includes a step S1 and a step S2. The housing is, for example but not limited to, a digital television, a handheld computer, an ultra mobile computer (Ultra-Mobile PC, UMPC), a notebook computer, a personal digital assistant (PDA), a global satellite positioning device (GPS), a wireless data service ( GPRS) device, digital camera, translator, MP3 player 7 201011497 device, MP4 player, radio, digital video device, DVD player, game device or mobile device. Referring to FIG. 2 and FIG. 3A to FIG. 3C, step S1 is a first sub-casing 211 formed by injection compression molding, the surface of which has at least one concave-convex pattern C, and the first sub-casing 211 is a light-transmitting material. Although the present embodiment is described by taking the concave-convex pattern C on the inner surface of the first sub-housing 211 as an example, it is not limited thereto. ❹ Referring now to Figures 3A to 3C, the steps of forming the first sub-casing 211 will be briefly explained. Referring first to Fig. 3A, first, the compression mold 31 and the molding die 32 which are ejected from the compression molding apparatus 3 are slightly closed, and are injected into the molding space S for forming the material M1 of the first sub-casing. The material M1 may be, for example, a light transmissive material, and includes, for example, a high molecular weight polymer such as polycarbonate (polyuronate, PC) or polymethylmethacrylate (PMMA). It can be a light transmissive housing. Next, referring to Fig. 3B, after the material M1 is completely injected into the molding space S, the press mold 31 and the molding die 32 are pressed against each other to compress the material M1 in the molding space S. Here, the uneven pattern formed on the press mold 31 or the molding die 32 can form the uneven pattern C on the material M1 when the two are pressed together. Finally, referring to Fig. 3C, after the press mold 31 and the molding die 32 are completely closed, the concave-convex pattern C is formed on the inner surface of the first sub-casing 211. Wherein, the maximum thickness of the first sub-casing 211 is less than or equal to 1 mm, 8 201011497 and the maximum thickness of the concavo-convex pattern C is less than or equal to 0.5 mm. In summary, since the molding space S of the injection compression molding apparatus 3 can be adjusted according to different requirements, and the size of the molding space S can be controlled during or after the material is ejected, the molding space S and the injection process are matched to allow the material. Maintain a pressurized state. Thereby, the first sub-housing 211 having a small thickness can be formed to increase its transmittance. Further, since the injection compression molding apparatus 3 can form a high-precision concave-convex pattern directly on the mold, the concave-convex pattern C can be directly formed on the first sub-casing 211. Referring to FIG. 2 and FIG. 3D simultaneously, step S2 is to form a second sub-housing 212 on the surface of the first sub-housing 211 by overmolding to cover the concave-convex pattern C. The material forming the second sub-housing 212 may be a light-transmitting material or a non-transparent material, and is not limited thereto. Therefore, after the first sub-casing 211 is placed in the cover molding apparatus 4, the incident material M2 is combined with the first sub-casing 211, and the second sub-casing 212 is formed to cover the concave-convex pattern C. Referring to FIG. 3E, the second sub-housing φ 212 is combined with the first sub-housing 211 to form a two-layer structure, in addition to improving the rigidity of the housing 21, and the second sub-housing 212 can be used as the concave-convex pattern. The background of C is such that the concave and convex pattern produces a depth of field and a three-dimensional effect. As shown in FIG. 4, it is an electronic device 2 according to a preferred embodiment of the present invention. In the present embodiment, the electronic device 2 is described by taking a notebook computer as an example, but it is not intended to limit the present invention. The electronic device 2 includes a housing 21a and a body 22, wherein the body 22 can have, for example, a light source (not shown). The housing 21a is disposed on one side of the body 22 and the light source, and has the first sub-housing 211 and the second sub-housing 212 described in the above embodiments. The first sub-housing 211 is formed by injection compression molding 9 201011497 At least one concave-convex pattern C of the surface (inner surface and/or outer surface). The body 22 includes, for example, a display module. The cross section of the housing 21a along the BB line is as shown in FIG. 3D, and the structure of the housing 21a and the manufacturing method thereof are the housing 21 of FIG. 2 and FIG. 3A to FIG. 3D, since the housing 21 has been implemented as described above. The details are detailed in the examples and will not be described here. In addition, when the second sub-housing 212 is also a light-transmissive housing, a light source may be disposed behind the concave-convex pattern C of the first sub-casing 211 to illuminate the concave convex pattern C', thereby further increasing the electrons. The beauty of the device 2. In this embodiment, the light source can also be achieved by the light source of the display module of the body 22. Further, the electronic device 2 may further include another housing 23 which is disposed on the other side of the body 22 and is connected to the housing 21a. Therefore, the casing 21a, the body 22 (including the display module), and the casing 23 form the display portion of the electronic device 2. As described above, the casing of the present invention is formed by injection compression molding to form the first sub-housing, whereby the first sub-housing having a thin thickness can be formed to enhance the transmittance of the ginseng casing. Moreover, since the injection compression molding can form a high-precision concave-convex pattern directly on the mold, in addition to forming the concave-convex pattern directly on the first sub-casing, a more beautiful concave-convex pattern can be formed on the first sub-housing. . In addition, the second sub-casing is combined with the first sub-casing by the overmolding method, in addition to improving the rigidity of the housing, and the second sub-casing can be used as the background of the concave-convex pattern to generate the concave-convex pattern. The depth of field has a three-dimensional effect. The housing of the electronic device of the present invention can also utilize the housing as described above, and the aesthetics of the electronic device can be increased by illuminating the concave and convex pattern by providing a light source on the concave and convex pattern of the housing. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the invention as claimed. Therefore, the scope of the patented scope of the invention should be construed as broadly construed in the BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view of a conventional notebook computer; FIG. 1B is a cross-sectional view of the upper casing of the notebook computer of FIG. 1A taken along line AA; FIG. 2 is a housing of a preferred embodiment of the present invention; FIG. 3A to FIG. 3E are schematic diagrams showing a manufacturing process of a casing according to a preferred embodiment of the present invention; and FIG. 4 is a schematic view of an electronic device according to a preferred embodiment of the present invention. [Description of main component symbols] I: Notebook computer II: Upper casing III: Opening 12: Display module 13: Lower casing 11 201011497 14: Block 2: Electronic device 21, 21a ' 23 : Housing 211: a sub-housing 212: second sub-housing 22: body 3: injection compression molding device 31: compression mold
32 :成型模 4:覆蓋成型設備 C :凹凸圖案 Ml、M2 :材料 P :圖案 S :成型空間 S1〜S2 :殼體製造方法的流程步驟32: Molding mold 4: Cover forming equipment C: Concavo-convex pattern Ml, M2: Material P: Pattern S: Molding space S1 to S2: Process steps of the shell manufacturing method
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