201010825 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種研磨工具及其製造之方法，特別是—種 利用鑽石顆粒製造之研磨工具及其製造之方法。 【先前技術】 研磨工具已被廣泛使用於材料的切削、研磨、拋光和磨光等 多種應用領域當中。而其中鑽石為目前已知最堅硬的磨料之_， 碜對於其它缺乏強度和耐磨性工具的運用而言，以鑽石做為一研磨 工具的材料是不可或缺的。在如石材加工業或精密磨削工業中， 由於鑽石優異的耐磨性能使切割、磨削等加工程序之效率提升， 並使這類加工行業的成本降低。 =般的研紅具’諸如—鑽石研雜，是由賴石顆粒(如 娜〇關篩目顆粒)混合以適當的基體(黏合劑)粉末，然後將此混 σ物以熱壓法壓人—模具巾所製作喊。而目前提升研磨工呈之 =能力與域力之方式，係賴齡序巾，令鑽石雜間相距 墊特ί的排列方向’然而此方法中鑽石顆粒與研磨 鑽石顆粒、=面僅她鑽石混合之績黏合_末來提供，同時 受限於兩者平面，造隸與基體财間之結合力 又㈣兩相翻味_之大小，目此在仙 ==_持_操作過程中所產=二 切削能力。 塾為^，進而影響研純之研磨及 通常需要係以提 而為了提高研紅具咐确率(euttingrate)， 201010825 高鑽石的_度_石雕湖的密度來進行。細制銳利度 局的鑽石f會因其破裂強度較低而有較高的鑽石破裂風險；此 外，就提崎石顆粒排列的密度而言，隨著所使關鑽石顆粒增 加’則會相對地造成研磨1具之製造成本提高。 【發明内容】 、鑒於以上的問題，本發明提供一種製造鑽石研磨工具的方 法’此鑽石顆粒係經由—加熱處雜序，使其表面之粗糙度增加， φ藉以提高鑽石雛與研雜之_結合性，並進—步增進研磨塾 之研磨及切削能力。 本發明揭露—種製造鑽石研紅具的方法，其储複數個鑽 石顆粒置人於域設備巾’並加熱至—介於攝氏溫度⑻_度至 1100度之溫度，H溫保持—定時間後，接著停止加熱程序，令 鑽石顆粒冷卻至室溫，鱗，經由加減理後之鑽石驗表面即 形成-波紋®;提供-表面具有結合層之基材，並將此表面具有 波紋面之鑽石顆粒設置於結合層上，令其藉由此結合層固著於基 —材上。 依據本發明所揭露之製造鑽石研磨玉具的方法，其中未經過 熱處理之鑽石顆粒的粒徑係介於125至500微米㈣，而經由熱 處理後，表面形成有波紋面之鑽石顆粒的粒徑係介於100至· 微米。因此，依據本發明之實驗條件數據顯示，於熱處理後的粒 徑減少約百分之25。 本發明係一種鑽石研磨工具，此研磨工具具有一基材、一結 合層以及複數個鑽石顆粒，且此等鑽石顆粒之表面具有一波紋 6 201010825 熱處理程 面。此複數個表面具有波紋面之讚石顆粒係由上述之加 序所形成。 本發騎縣之經由加祕_序所得之鑽石雛， 所具有之·面可大幅增加賴鑽石齡表面之_度，即相 於原始鑽石顆粒表面具有較大的表面積。因此’當其應用於 研磨墊之製造時’ _石難表面積的大幅增加，不但能提 石顆粒與研磨墊之間_持強度，同時因鑽石驗表面粗J的 增加亦明顯地加強了研磨塾的研磨及切削能力，進省^ 工所需之時間。 靨加 以上之關於本發_容之綱及町之實財式之說明係用 以不範與解釋本發明之原理，並且提供本發明之專利申請範圍更 進一步之解釋。 【實施方式】 請參閱「第1圖」所示為本發明實施例之鑽石研磨工具的剖 耱面不意圖。本發明所揭露之研磨工具1〇包括—基材刚、一結合 層110以及複數個鑽石顆粒2〇0，此鑽石顆粒200係藉由此結合層 110固著於基材100上，且此等鑽石顆粒200之表面具有一波紋面 210 (如「第8圖」所示）。 、 結合層110可為高分子樹脂、金屬電鍍層、金屬焊料、陶究 結合劑或其他可提供鑽石顆粒200與基材1〇〇足夠結合力之結合 劑所形成。高分子樹脂可為一種經由適當的加熱烘烤或紫外光(υγ) 照射即可硬化之熱硬化樹脂或光硬化性樹脂，也可以是一種經過 —段時間即自然硬化的常溫硬化性樹脂，使鑽石顆粒2〇〇穩固地 201010825 附著在基材100上。而金屬電錢層則是利用電錢錄(或其他金屬) 將鑽石馳2GG底部包義定於基材上。金屬烊料則是利用 高温真空爐硬焊法，使金屬焊料(通常為鎳鉻合金勝融而將鑽石顆 粒200焊接於金屬基材100上。另外亦有利用金屬粉末作為結合 劑層110，經由南溫燒結以固定鑽石顆粒2〇〇者。 、此__勘储由—加«理之程序，令其表面具有一 ，紋面210 ’此波紋面21〇可有效增加鑽石顆粒細之粗链度，並201010825 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to an abrasive tool and a method of manufacturing the same, and more particularly to an abrasive tool made using diamond particles and a method of manufacturing the same. [Prior Art] Grinding tools have been widely used in a variety of applications such as cutting, grinding, polishing, and polishing of materials. Among them, diamond is the hardest abrasive currently known. 碜 For other tools that lack strength and wear resistance, diamond is an indispensable material for grinding tools. In the stone processing industry or the precision grinding industry, the excellent wear resistance of diamonds increases the efficiency of machining processes such as cutting and grinding, and reduces the cost of such processing industries. = General research red ', such as - diamond grinding, is a mixture of Lai stone particles (such as Nayongguan mesh particles) with a suitable matrix (binder) powder, and then this mixed σ is pressed by hot pressing - The mold towel is made by shouting. At present, the way to improve the grinder's ability and domain strength is to lag the order of the diamonds, so that the diamonds are spaced apart from each other. However, in this method, the diamond particles are mixed with the diamond particles and the surface is only her diamonds. The performance bond _ is provided at the end, and is limited by the plane of the two, the combination of the squad and the base money is (4) the size of the two-phase scent, which is produced in the process of sin ==_ holding _ operation = Two cutting ability.塾 is ^, which in turn affects the grinding of the pure pure and usually needs to be carried out in order to improve the eutting rate of the red radiant, 201010825 high diamond _ degree _ stone lake density. Fine-grained diamonds f will have a higher risk of diamond breakage due to their lower burst strength; in addition, in terms of the density of the Tisaki stone particles, as the diamond particles are increased, the relative diamonds will be relatively The manufacturing cost of grinding 1 is increased. SUMMARY OF THE INVENTION The present invention provides a method for manufacturing a diamond grinding tool. Combining, and further improving the grinding and cutting ability of the grinding machine. The invention discloses a method for manufacturing a diamond research red tool, which stores a plurality of diamond particles placed in a domain equipment towel and is heated to a temperature between (8) and 1100 degrees Celsius, and the temperature of H is maintained for a certain period of time. Then, the heating process is stopped, the diamond particles are cooled to room temperature, the scales are formed by the addition and subtraction of the diamond surface to form a - corrugated®; the surface of the substrate having the bonding layer is provided, and the surface has a corrugated diamond particle It is disposed on the bonding layer so as to be fixed to the substrate by the bonding layer. According to the method for manufacturing a diamond abrasive jade according to the present invention, wherein the untreated heat diamond has a particle size of 125 to 500 micrometers (four), and after heat treatment, the particle size of the diamond particle having a corrugated surface is formed. Between 100 and · microns. Therefore, the experimental condition data according to the present invention shows that the particle diameter after heat treatment is reduced by about 25 percent. The present invention is a diamond abrasive tool having a substrate, a bonding layer, and a plurality of diamond particles, and the surface of the diamond particles has a corrugation 6 201010825 heat treatment surface. The plurality of zircon particles having a corrugated surface are formed by the above-described ordering. The diamond chicks obtained by the acquisition of the county are greatly increased by the surface of the diamond-aged surface, that is, the surface area of the original diamond particles has a large surface area. Therefore, 'when it is applied to the manufacture of the polishing pad', the large increase in the surface area of the stone is not only able to maintain the strength between the stone particles and the polishing pad, but also significantly enhance the grinding due to the increase in the surface roughness of the diamond. The grinding and cutting ability, the time required to save the work. The above description of the present invention is to explain the principles of the present invention and to provide a further explanation of the scope of the patent application of the present invention. [Embodiment] Please refer to Fig. 1 for a cross-sectional view of a diamond grinding tool according to an embodiment of the present invention. The abrasive tool 1 disclosed in the present invention comprises a substrate, a bonding layer 110 and a plurality of diamond particles 2〇0, and the diamond particles 200 are fixed on the substrate 100 by the bonding layer 110, and the like The surface of the diamond particle 200 has a corrugated surface 210 (as shown in Fig. 8). The bonding layer 110 may be formed of a polymer resin, a metal plating layer, a metal solder, a ceramic bonding agent or other bonding agent capable of providing sufficient bonding force between the diamond particles 200 and the substrate 1 . The polymer resin may be a thermosetting resin or a photocurable resin which can be hardened by appropriate heating baking or ultraviolet light (υγ) irradiation, or may be a room temperature curing resin which is naturally hardened over a period of time. The diamond particles 2 are firmly attached to the substrate 100 at 201010825. The metal money layer is made by using the money book (or other metal) to set the bottom of the diamond 2GG on the substrate. The metal coating is a high-temperature vacuum furnace brazing method, in which a metal solder (usually a nickel-chromium alloy is used to weld the diamond particles 200 to the metal substrate 100. In addition, metal powder is used as the bonding agent layer 110, via Sintering at the south temperature to fix the diamond particles 2, this __ exploration by - adding the principle of the rule, so that the surface has a, the surface 210 'this corrugated surface 21 〇 can effectively increase the fine chain of diamond particles Degree, and
提升研磨ji具1〇之切舰力；此加熱處理之程序麵將—併詳述 於研磨工具1〇之製造流程中。 土明二閱第2圖」所示為本發明實施例鑽石研磨工具之製造 流程示意圖。依據本發明研磨工具之製造，魏提供複數個鑽石 顆粒200 (如「篦1園 $ 「_ ^ ^弟3圖」和「弟7圖」所示）（S101)，此鑽石顆粒 的粒匕、力"於300至400微米㈣之間，並麵於一耐熱容器 00内例如為掛编(如「第4圖」所示）；將此舖灑有 鑽石顆粒200 之耐熱M 3GG置人—加熱裝置(如空氣爐）_中(如「第$圖」 备、）在Α氣被境下以每分鐘5°C之升溫速率進行加熱處理， ^度達到9241時，維持此加熱溫度6()分鐘(此加熱溫度與維持 =可視不同處理之需求而定）（s搬）；最後，關閉加熱源並使經 …處理後之鑽石顆粒冷卻至室溫，將此經加熱處理後之鑽 石顆粒200以―筛網5⑻篩選於一容器_内(如「第6圖」所示）， ^ 、、處理後之鑽石顆粒200粒徑約介於200至300微米(μπι) 01n 加熱處理後之鑽石顆粒200表面形成一波紋面 210 (如「第只圍 _ 園」所示）（S103);提供一基材100，此基材100上 8 201010825 具有一結合層no陶），此結合層 脂；然後將此經加埶處理播矣；目士 ^ 勹…更化同刀子树 缺由·……後具有波紋面210之鑽石顆粒200， 合層11 〇固著於基材i00上。 /、猎由此、、、。 传挑熱處理程序後’藉由-_ 5。。_之步驟， 係挑U錢·工具1G㈣之粒御 ❹ 磨料(即鑽石顆粒200)粒捏一致，便研厝j上之 具有磨料露出率-致之平坦2。並使研磨工具10在製造完成後 =進-步比較經加熱處理前、後之鐵石顆粒時(如表一所示）， ^=此絲熱處理叙鑽石齡之粒㈣比未經加熱處理之鑽 此但兩者之間在橢圓度上並無明顯差別，此意謂著若將 墊麵4理後之鑽石顆粒應用於一研磨塾上，將不會影響研磨 墊/、鑽石顆粒間的原有之抓合力。 -------- 表一 夫姆夬Γ7無P& "ΓΪ» 鑽石粒徑 (微米） 鑽石表面 粗糙度 橢圓度 平均切削另" (微米/小時） 个"工加熱處理 ^Γ ύϋ Φίι i：w 351.2 4.04 1.097834 卜35 、，工"υ热終理 —----- 請參間「筮 260.0 7 mi . r - 4.64 1.097841 150 此 ---------------π員他例γ π力口 :、处理别、後鑽石顆粒表面之掃描式電子顯微鏡之圖式。於圖中 j 觀察到’相較於未纟纟熱處理之鑽石顆粒*言，經由力口熱處 =後之鑽石齡表面具有―波紋面21G，相對的使表面積與粗链度 增加，不但增進研磨墊與鑽石顆粒間的抓合力，同時也能促使研 201010825 磨墊之研磨力和切削力的增加。 請再參閱「表一」所示，鑽石顆粒表面於加熱處理前、後之 平均切削力測試，係將加熱處理前、後之鑽石顆粒篩選出相同美 國網目數大小(40/50)之顆粒，並設置於研磨工具上，於正向言重 11.5公斤(kg)，上旋轉鋪速每分鐘10轉(1〇_)，下旋轉盤 每分鐘40轉(40 rpm)的條件下，對兩者進行切削力測試。此一測 試結果顯示出未經加熱處理之鑽石顆粒，其平均切削力約為每^ φ時35微米(35 _«*)，而在經過加熱處理後之鐵石顆*，其=均 切削力遽增為每小時150微米(15〇 _^，切削力的增加幅度將 近有5倍之多’因此，若應用本發明經加熱處理後之鑽石顆^所 製成之研磨工具，將可縮減研磨時間，並節省成本。 本發明製造鑽石研磨工具的方法，其中藉由—加熱處理 使鑽石顆錄面職—纽面，此赦面使驗加祕理後之錯 石顆粒表面之粗糙朗加，藉由此表面粗·使得且有此 瘺=加熱處理後之鐵石顆粒所製成之研磨工具的切削能力顯著的提 雖然本刺之實施_露如上所述，然並非用以限 明，任何熟習相關技藝者，在不脫離本發明之精神和範圍内二 =靖請範圍所述之形狀、構造、特徵及^二 ^更’因此本發明之專利保護範圍須視本說 = 利範圍所界絲鱗。 專 【圖式簡單說明】 弟1圖所7F為本㈣實施例之鑽石研磨工具之示意圖。 10 201010825 第2圖所示為本發明實施例鑽石研磨工具製造流程之示意圖。 第3圖所示為本發明實施例加熱處理前之鑽石顆粒之示意圖。 不意圖 第4圖所示為本發明實施例加熱處理前鑽石顆粒置於耐熱容器之 ，本刪麵編場⑽雜置入加熱 裝置之示意圖。 粒以篩網篩選 第6圖所福本發明實補經加祕理後之鱗石顆 之不意圖。 ❹ :7圖所示為本發明實施例未經加熱處理之鐵 式電子顯微鏡之示意圖。 ；表面之掃描 弟8圖 所示為本發明實施例經加_理後之 式電子顯微鏡之示意圖。 【主要元件符號說明】 10 ^ 研磨工具 基材 結合層 鑽石顆粒 波紋面 耐熱容器 加熱裝置 篩網 容器 鑽 石顆粒表面 100 110 200 210 300 400 500 600 S101 提供複數個鑽石顆粒 201010825 5102 5103 5104 S105 對鑽石顆粒進行加熱處理 冷卻鑽石顆粒至室溫，鑽石顆粒表面形成一波紋面 提供一基材，此基材之表面具有一結合層 將表面形成波紋面之鑽石顆粒設置於此結合層上Improve the cutting force of the grinding tool; the surface of this heat treatment will be--detailed in the manufacturing process of the grinding tool 1〇. Fig. 2 is a schematic view showing the manufacturing process of the diamond grinding tool according to the embodiment of the present invention. According to the manufacture of the grinding tool of the present invention, Wei provides a plurality of diamond particles 200 (as shown in "篦1园$"_^^弟三图" and "弟7图") (S101), the grain of the diamond particles, The force is between 300 and 400 microns (four), and is placed in a heat-resistant container 00, for example, as a hanging (as shown in "Fig. 4"); the heat-resistant M 3GG coated with diamond particles 200 is placed - The heating device (such as the air furnace) _ medium (such as "the first map"), in the case of helium gas is heated at a heating rate of 5 ° C per minute, when the degree reaches 9241, the heating temperature is maintained 6 ( ) minutes (this heating temperature and maintenance = depending on the needs of different treatments) (s moving); finally, the heating source is turned off and the treated diamond particles are cooled to room temperature, and the heat treated diamond particles are 200 is screened in a container _ by screen 5 (8) (as shown in Figure 6), ^, and the treated diamond particles 200 have a particle size of about 200 to 300 μm (μπι) 01n heat treated diamond A surface of the particle 200 is formed with a corrugated surface 210 (as shown in "the first circumference") (S103); a substrate 100 is provided, and the substrate 1 is provided. 00上8 201010825 has a combination layer no ceramic), this combination layer grease; then this is treated by twisting; 目 ^ 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 后 后 后 后 后 后 后200, the layer 11 is fixed on the substrate i00. /, hunting this,,,. After picking up the heat treatment procedure, 'by -_ 5. . _ The steps are to pick the U money · tool 1G (four) grain ❹ abrasive (ie diamond particles 200) grain pinch consistent, then the mortar on the j has the abrasive exposure rate - resulting in flat 2. And the grinding tool 10 is compared with the iron particles before and after the heat treatment after the completion of the manufacturing process (as shown in Table 1), ^= the silk heat treatment of the diamond age particles (four) than the unheated drill However, there is no significant difference in ellipticity between the two, which means that if the diamond particles after the mat surface 4 are applied to a grinding crucible, the original between the polishing pad and the diamond particles will not be affected. Grab the force. -------- Table 1 Fum 夬Γ 7 No P &" ΓΪ» Diamond particle size (micron) Diamond surface roughness elliptical average cutting another &(; micro / hour) " work heating treatment ^ Γ Φ Φίι i:w 351.2 4.04 1.097834 卜35,,工" 终热终理------ Please refer to the room "筮260.0 7 mi . r - 4.64 1.097841 150 This --------- ----- π member γ π force port:, the scanning electron microscope pattern of the surface of the diamond particles after treatment, in the figure j observed 'compared to the untreated heat treatment diamond particles * words Through the heat of the mouth, the diamond-aged surface has a corrugated surface 21G, which increases the surface area and the thick chain, which not only enhances the grip between the polishing pad and the diamond particles, but also promotes the grinding of the grinding pad 201010825. Increase the force and cutting force. Please refer to the “Table 1” for the average cutting force test on the surface of the diamond particles before and after the heat treatment. The diamond particles before and after the heat treatment are selected to the same size of the US mesh ( 40/50) granules, which are placed on the grinding tool and weigh 11.5 kg in the forward direction ( Kg), the upper rotation speed is 10 revolutions per minute (1 〇 _), and the lower rotation disk is 40 rpm (40 rpm), and the cutting force is tested. This test result shows that the diamond particles without heat treatment have an average cutting force of about 35 μm (35 _«*) per ^φ, and the iron particles* after heat treatment have a mean cutting force遽Increasing to 150 microns per hour (15 〇 _ ^, the cutting force is increased by nearly 5 times) Therefore, if the grinding tool made of the heat treated diamond of the present invention is applied, the grinding time can be reduced. The invention relates to a method for manufacturing a diamond grinding tool, wherein the diamond is recorded by a heat treatment, and the surface of the diamond is roughened by the surface of the faulty stone. Therefore, the surface is rough, and the cutting ability of the grinding tool made of the steel particles after the heat treatment is remarkable. Although the implementation of the thorn is as described above, it is not intended to be limited, and any familiarity is relevant. The present invention does not depart from the spirit and scope of the present invention. The shape, structure, and features of the invention are in accordance with the scope of the invention. Special [schematic description] 1F is a schematic view of the diamond grinding tool of the embodiment (4). 10 201010825 FIG. 2 is a schematic view showing a manufacturing process of a diamond grinding tool according to an embodiment of the present invention. FIG. 3 is a view showing a heat treatment process according to an embodiment of the present invention. Schematic diagram of the diamond particles. It is not intended to show the diamond particles in the heat-resistant container before the heat treatment in the embodiment of the present invention, and the schematic of the face-cutting machine (10) is placed in the heating device. The invention is not intended to supplement the scaly stones after the clarification. ❹: Figure 7 is a schematic view of an iron-type electron microscope without heat treatment in the embodiment of the present invention. The schematic diagram of the electron microscope of the embodiment of the present invention is added. [Main component symbol description] 10 ^ Abrasive tool substrate bonding layer diamond particle corrugated surface heat-resistant container heating device screen container diamond particle surface 100 110 200 210 300 400 500 600 S101 Provides multiple diamond particles 201010825 5102 5103 5104 S105 Heat treatment of diamond particles Cool diamond particles to room temperature, diamonds Forming a corrugated surface to provide a substrate surface, the substrate surface of this bonding layer having a surface forming a corrugated surface of the diamond particles provided thereto on the bonding layer