TW201005282A - Base plate viewing apparatus, base plate viewing method and control device - Google Patents

Abstract

The invention provides a base plate viewing apparatus, base plate viewing method and control device, capable of implementing the appropriate emendation even in the condition that the appropriate emendation is difficult to be implemented through the unite emendation under the large-size base plated and device. A defect correcting device with the functions of the viewing apparatus drives an optical system to move relatively to the relative position of the base plate according to first locating information of a defect position on the assigned base plate. An image processing part takes the image shot by a camera shooting part through the optical system after the relative movement and second locating information representing defect position. A coordinate emendation mapped picture generating part generates the emendation information for correcting the relative movement amount according to the first locating information. A coordinate emendation mapped picture storing part stores the coordinate emendation mapped picture containing the generated emendation information. In the coordinate emendation mapped picture, the emendation information is related with the region corresponding to first locating information in a plurality of predetermined regions.

Description

201005282 VI. Description of the Invention: I: TECHNICAL FIELD OF THE INVENTION The present invention relates to a device for observing a substrate for inspection, measurement, classification, correction, and the like. [Prior Art: j Background technology has been used in the manufacture of various substrates such as a liquid crystal display (LCD) or a PDP (Plasma Display Panel) FPD (Flat Panel Display) substrate or a semiconductor wafer. A measuring device or an inspection device that takes a picture of the substrate to perform measurement or inspection. Also, there is a defect correction device for correcting defects found by inspection. For example, the manufacturing steps of the FPD substrate include the following series of steps. The automatic giant defect detecting device uses a line type sensor (^鄕(4) to take a full substrate, and detects foreign matter or defects existing on the substrate according to the captured image' and outputs information related to the detected foreign matter or defect to a preview. The money checking device or the defect correcting device. The defect correcting device outputs the foreign matter or the detailed position of the defect to be corrected according to the automatic E-view defect detecting device or the preview micro-inspecting device, and performs the foreign matter silk or gamma. The correction is as follows: - the defect detecting device or the defect correction I is provided with a pedestal for holding or adsorbing the substrate which has been positioned at the reference position and held, and has a position opposite to the substrate of the microscope head (inspecting head) The work of the work 201005282 can, and the microscope head system has been extended to the observer according to the defect position specified by the defect position information from the upstream side inspection device. The defect detection device or the absence of the positive impact center ' indicates the position on the substrate It can be converted to the relative movement amount. For example, for each defect detection device or defect correction device The system has a specific point of 1 as the origin, the longitudinal direction of the rectangular pedestal is the axis, and the short-side direction is the γ-axis device coordinate system. 2, the relative movement is based on the X coordinate of the pedestal coordinate system. Similarly, in the case of a rectangular FPD substrate, a substrate having a specific point on the substrate as a reference origin, a longitudinal direction of the substrate as an X-axis, and a short-side direction as a Y-axis is defined. Coordinate system. The position on the substrate is represented by the combination of the X coordinate and the Y coordinate of the substrate coordinate system. Ideally, the coordinate transformation between the device coordinate system and the substrate coordinate system can only compensate the coordinates (fi, f2). By adding or subtracting, the compensation coordinates (fl, f2) are based on the coordinates of the device, and the base point of the substrate coordinate system when the substrate is held at a specific position on the pedestal reference. Further, under ideal conditions, the following The situation should also be established.

That is, the first device will use the coordinate of the position of the position P on the substrate by the device coordinate system of the i-th device as (Χι, Υι). The coordinates obtained by converting the coordinates (Xi D into the substrate coordinate system are (Xi, yi). "I. The second device will use the coordinates of the same position p as the device coordinate system of the second device as (Χ2, Υ2). And the coordinate obtained by converting the coordinate (parent 2, γ) into the substrate coordinate system is (X2, y2). At this time, under the ideal condition 201005282, it should be h = X2 and y^=: y2. If the position P on the substrate is defective, and the second and second devices are the defect detecting device and the defect correcting device, respectively, under the ideal conditions, the following should also be established. That is, the defect correcting device receives the substrate coordinates by the defect detecting device. The system represents the information of the coordinates (X1, yi) of the position P. Here, since (Xi, yi) - (X2, y2) 'the defect correction device is calculated by the addition of the compensation coordinate φ of the defect correction device to calculate the defect correction device The coordinate system of the device indicates the coordinate (X2, Y2) of the position p = (X丨+ f], yi + f2). Then, the defect correction device shifts the relative position of the corrector to the substrate by a coordinate (χ2, γ2) The amount The defect of ρ should be located on the optical axis of the optical system (ie, the center of the field of view) under ideal conditions. However, in reality, the defect detecting device and the defect correcting device of different devices may have strains or displacements, respectively. There is also a difference in the mounting position at which the substrate is positioned at the reference position. Moreover, due to external influences such as thermal management differences in the manufacturing process, the FDP substrate itself is strained due to expansion and contraction. With the enlargement of the FDP substrate, various devices It is also large-sized, so the influence of these strains or deviations cannot be ignored. Therefore, even if the same substrate coordinate system is used to compare the results of the same position detection by the defect detecting device and the defect correcting device, it is often not completely identical. In other words, in the above example, the actual In most cases, even if the coordinates received by the defect detecting device (xb yO, the defect on the substrate is taken by the microscope of the defect correcting device), if the reference position deviation between the devices is exceeded, the target defect in the defect correcting device is also Will be off the center of the microscope by 5 201005282. Sometimes 'even the defects will exceed In order to prevent the above situation, the conventional method adopts the following method. The defect correction device receives the target defect coordinate (Xi, yi) by the defect detecting device, and the second magnification is lower than the second magnification suitable for the defect correction. To search for a defect β, specifically, the defect correction device converts the defect coordinate to a coordinate on the substrate (x^y!) for the defect acquired by the upstream side inspection device, and uses the coordinate as a center to make the microscope The substrate is moved relative to the substrate to observe the defect, and the defect on the substrate is captured to obtain the captured image. Next, the defect correction device uses image processing to identify the defect position of the captured image. Here, due to the influence of strain, deviation or body difference, the defect It is not at the center of the recorded image. However, since the second magnification is low, the defect should be included in the field of view of the low magnification. When the defect position in the captured image is recognized by the low magnification lens, the defect correcting means performs fine adjustment of moving the relative position of the laser processing head including the microscope so that the defect is located in the center of the field of view. After the center of the defect is aligned with the field of view t center of the low magnification, the defect correcting device is switched to the object lens for correcting the magnification, and the laser processing head is used to correct the defect on the substrate. - The Hai method is a low-magnification lens with a magnification of about 5 times, and the deviation of the defect is observed at a low magnification field, and the microscope and the substrate are relatively moved to align the defect with the center of the field of view, and then switch to a high-magnification lens. In the defect, ^ pulls in the field of view and makes the heart take so much time. Therefore, this method is *ideal by the point of view of shortening the time required for inspection or correction. Further, since it is necessary to have the optical systems of the first and second magnifications at the same time, this method is not preferable from the viewpoint of the increase in the number of parts of the defective repair 201005282 positive device. Therefore, the defect detecting device and the defect correcting device should recognize the same position on the substrate as the same coordinates of the substrate coordinate system. In other words, it is desirable to eliminate the inconvenience caused by the difference in the body between the defect detection I and the defect correction device. For example, there is a technique in which a memory device of an SEM (Scanning Electron Microscope) pre-memorizes the coordinate error information of each defect inspection device, and the error information is corrected to correct the position coordinates of the defect output by each wire detecting device. The image is used to observe the coordinate value of the SEM. For example, the measurement is performed in advance, and the i-th order coefficient for correction is calculated by the least-multiplier approximation, and is memorized as error information (please refer to the patent document, and there is also a defect observation device which sets a plurality of measurement points on the substrate, For each measurement point, the position deviation amount between the detection coordinate system and the observation coordinate system is measured, and a defect position correction formula for correcting the defect position of the detection coordinate system is prepared according to the position deviation amount of each measurement point. The one-time defect position correction formula has three items of the compensation component, the expansion component, and the rotation component of the observation coordinate system with respect to the detection coordinate system (refer to Patent Document 2). [Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-227710 [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei 2 No. 31-253 C. In addition, in recent years, the size of the FPD substrate has been greatly increased, and as the size of the FPD has increased, the size of various devices has also increased. 201005282 With the enlargement of the device, the mechanical mechanism (ie mechanical) strain or deviation is also affected. Therefore, the unified correction by the preset one-time type may cause a situation in which the entire area of the substrate or the relative movement range cannot be properly corrected. Further, as the FPD substrate is enlarged, it is also used. A defect detecting device equipped with a plurality of detectors has a mounting error for each of the detectors. Therefore, even if one defect detecting device is uniformly corrected, it may be unsuitable. The object of the present invention is to provide a first substrate observation device in accordance with the aspect of the present invention, even if it is difficult to perform the correction by the enlargement of the substrate or the device. The first slab viewing device includes an optical mechanism that expands the viewing substrate, and a relative moving mechanism that specifies the first position information of the observation target position on the substrate to move the relative position of the optical mechanism relative to the substrate. The photographing mechanism is configured to reduce the aforementioned observation and output the image by using the relative moving mechanism relative to the substrate (four) of the substrate (four); In the image processing unit, the imaging unit obtains the positional stomach information based on the captured image, and the correction information generating unit generates the correction amount based on the second position information acquired by the image processing unit to generate the correction factor according to the first The position information is corrected according to the former; and the 'corrected information memory mechanism' is generated by the above-mentioned correction information generated by the above-mentioned repair = 201005282 and the field corresponding to the first position information in the plural field defined by the six counties. According to another aspect of the present invention, a recording device executed by the above-mentioned first substrate observation device and (4) a control device for loading the substrate may be provided. Further, according to another aspect of the present invention, a computer readable device may be provided. In the memory medium, the memory is stored in a circuit that is connected to the second substrate observation device so that the computer and the second substrate observation device have the same function as the entire magic substrate observation device. And the second substrate is disposed with an optical mechanism having an extended domain and a film that passes through the silk substrate and is photographed Institution. According to the first substrate observation device described above, since the correction information is generated and stored in the plural field, even if the substrate or the second substrate observation device is enlarged, it is possible to implement the H correction in the entire field.

Corrected. The same effect can be obtained by the above method, the control device, and the method of memorizing the memory medium. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Below, :', convenient. The "children's substrate" is tentatively defined as an FPD substrate formed of rectangular glass or the like, but may be another substrate such as a semiconductor wafer. Further, "defects" include adhesion of foreign defects such as opening defects, short-circuit defects, and dust of the pattern. Further, while assisting in understanding the embodiments of the present invention, the numerical values of the specific 9 201005282 are shown in several figures, but these numerical values are not representative of the number of actual tendency or effective digits. However, the description is made in the following order. First, the configuration of the defect correction device will be described with reference to the drawings, and then the coordinate system will be described with reference to Fig. 2. Then, the data format and the like will be described with reference to Figs. 4 to 7 at any time, and the operation of the defect correction device of the first embodiment will be described with reference to the flowchart of Fig. 3. Further, the eighth embodiment will be described with reference to Fig. 8 from the viewpoint of the data flow. Next, other embodiments will be described with reference to FIG. 9 to FIG. 11 or only by the article. Fig. 1 is a block diagram showing the function of the defect correction device of the first embodiment. The missing Fa correction device 100 is, for example, a laser repair device, and has a function of expanding the defect of the observation substrate 10 and correcting it. Since the enlarged observation of the defect can be performed as the correction pre-processing, the defect correction device 100 is one of the substrate observation devices. The defect correction device 1A includes a pedestal portion 101, a gantry 102, a defect correction portion 〇3, a microscopic observation optical system 1〇4, and an imaging unit 1〇6, and the pedestal portion 101 is made of air. When the substrate is transported in the transport direction (X direction) in the floating state, the gantry portion 1 〇 2 is mounted so as to straddle the substrate 1 placed on the pedestal portion 101, and the defect correcting portion 1 〇 3 is the modified substrate 1 In the case of the defect, the microscopic observation optical system 104 has an object lens that enlarges the observation substrate 1B, and the imaging unit 106 captures the image of the substrate 10 enlarged by the microscopic observation optical system 1〇4. The defect correcting unit 103 and the optical system 104 can also be housed in one optical unit 1〇5. The imaging unit 1〇6 is fixedly attached to the optical unit 1〇5. The optical unit 105 is movably attached to the horizontal beam of the frame portion 〇2, and is movable in the Y direction perpendicularly intersecting the transport direction (X direction) of the substrate 10 at 10 201005282. Therefore, the optical unit 105 and the substrate 10 are relatively moved in the x direction. Further, the defect correction device 100 of the first embodiment includes a PC (Personal Computer) 107 connected to the defect detecting devices 300 and 310 via the network 200. The network 200 is a network such as a LAN (Local Area Nerwork) or an Internet. PC 107 has CPU ( Central Processing Unit), ROM (Read

Non-electrical memory such as Only Memory), external memory such as RAM (Random Access Memory) in the working area (w〇rking Area), hard disk device, and interfaces connected to external devices, and such interfaces A computer connected to each other by a bus. The PC 107 may further include an input device including a pointing device and a keyboard for inputting from a user, an output device such as a display or a printer, and a drive device for a portable readable memory medium. The CPU executes a program stored in a ROM, a hard disk device, a portable memory medium, or the like, or a program provided through the network 200, to be executed in the RAM, thereby realizing various functions of the PC 107 described later. The PC107 can also be replaced by a workstation or a server computer. Further, the pcl〇7 may be incorporated in the defect correction device 100 as in the first embodiment, and the PC-free defect correction device may be directly or indirectly connected to the external PC. At this time, the external PC can function as a control device for controlling the defect correcting device. In Figure 1, the functions implemented by PC107 are represented in blocks. In other words, the 'PCH' 7 has a control unit (10), an image processing unit, and a coordinate correction map. 11 201005282 The part 110, the coordinate correction map storage unit U1, and the communication unit 112. In other implementations, the dedicated PCs can be replaced by dedicated hardware circuits to implement the various functional blocks. The above is an outline of the defect correction device 100. Next, the details of the figure will be explained. First, in the automatic giant inspection function in which the substrate is inspected by the line type sensor, the process of detecting the defect on the substrate 10 is performed. Thereafter, for the defect detected by the defect detecting device 300, the defect detecting device 310 having the preview function capable of determining the true defect that must be corrected or the pseudo defect that does not need to be corrected is used to detect the true defect. Information about defects such as defect types or defect coordinate positions detected by the defect detecting means 3 or 31 is stored in the external memory device 320 via the network 200. This information is referred to below as "defective information." The defect information example will be the same as Fig. 4, and the defect information includes the defect coordinates in addition to the defect type and size. When the defect detecting device 310 finishes the defect detecting process by the preview, the substrate 10 determined to be necessary to be corrected is transported to the defect correcting device 100, and is mounted on the pedestal portion 1〇1. The defect information of the substrate 1 to be loaded is read by the external memory device 320 by the external memory device 320, which is carried into the communication unit 112 of the PC1〇7, by moving the substrate 1 into the defect correction device. The sfl unit 112 can be implemented by, for example, an NIC (Network Interface Card) or a built-in communication interface. The communication unit 112 outputs the received defect information to the control unit 108. The control unit 108 executes the program by the CPU to execute the "defect information outputted by the communication unit 112 12 201005282" as follows to control the relative movement of the defect position corresponding to the correction target.

The pedestal portion 101 ejects air to float the substrate 10, and in a state where the substrate 101 is floated, is positioned at a reference position of the pedestal portion 101 by an alignment mechanism, and the positioned substrate 10 is adsorbed by the movement holding portion. The side edge portion and the dummy portion 1 (1) move the substrate 1G while moving the substrate 1G in the & direction. Further, the substrate may be placed on the pedestal portion 1〇1 while the substrate is placed at the reference position, the frame portion 102 may be moved toward the XJ direction, and the optical unit (10) may be moved in the Yr direction along the horizontal beam of the frame portion ι2. . The coordinate system will be described later with reference to Fig. 2, and the coordinate system based on the defect correction device 100 will be referred to as the "device coordinate system" of the defect correction device, and will be referred to as "2R". In the coordinate axis of the device coordinate system 2R, the jth diagram shows that the Xr pumping && axis split coordinate system 2R is perpendicular to the paper surface, which is the direction in which the optical unit 1〇5 moves, that is, the direction along the beam of the frame portion 1Q2. The coordinate system based on the substrate 10 is referred to as the "substrate coordinate system" and is marked with the symbol "ΣΒ". Among the coordinate axes of the substrate coordinate system, only the YR axis is shown in the drawing. The substrate coordinate system ςβ "χ axis is parallel to the A axis, and the y axis of the substrate coordinate system Σ B is driven by the YR^ parallel moving material part of the money substrate _Xr direction moving motor (aetuatG〇. Also, The optical monotony has a linear motor 4 single-axis drive actuator that moves the horizontal beam of the optical cylinder '1' 1G2 toward the YR direction. The work 4 P1G8 is designated as the defect seat of the defect position 13 201005282 according to the defect information. Each of the single-axis drive actuators indicates the respective movement amounts of the XR direction and the \ direction in which the heart coordinates and the Yr coordinates are combined. As a result, the movement holding portion and the optical unit 105 each have a single-axis drive actuator. And the control unit 108 functions as a moving mechanism for moving the relative position of the optical system to the relative position of the substrate 1G. (4) As described above, the moving holding portion and the optical unit 105 are relatively moved to make the observation light of the optical system UM (4) After the target coordinates, (4) (4) 8 is transmitted through the image processing unit 109 or directly by the imaging unit 1〇6, and the control unit 108 is not limited to the control of the relative movement, and the interlocking control between the parts of the defect correction device=10 is also performed. Or the operation control of the entire defect correction device 1 . After the relative movement, the imaging unit 106 images the defect to be observed through the optical system 1 to 4. The imaging unit 106 outputs the image signal obtained by the photoelectric conversion. Thereby, the video is output to the outside. Hereinafter, the image of the imaging unit 1〇6-output is referred to as “photographed image.” Here, the optical system 104 includes an object lens for enlarging the observation substrate 10 for use in photographing. The illumination light illuminates the light source on the substrate 10 and its optical element. Further, the defect correction unit 103 includes, for example, a laser light source for correcting the defect, and a slit or space for irradiating the laser only to correspond to the range of the correction defect. The imaging unit 106 is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, which can be used for shooting black and white luminance images or 14 201005282 for color images. The optical system 104 functions as a photographing optical system that images the imaging unit 1〇6, but some optical components of the optical system 1〇4 may also be used. The projection optical system that performs laser irradiation by the defect correcting unit 103. The subtraction (10) of the ib transmitted by the imaging unit 1G6 is processed by the image processing unit (10). The image processing unit should be connected to the image capturing unit for example. The image processing unit 1 〇 9 performs an existing image recognition process including, for example, identification of brightness distribution, feature point extraction, edge extraction, or photographing, which is determined in advance as The reference image of the substrate without defects is processed and compared. By the image recognition processing, the image processing unit 1〇9 recognizes the defect appearing in the captured image, and acquires information indicating the position and range of the image. The image processing unit 109 outputs the acquired information to the coordinate correction map creation unit 11A. According to the embodiment, the image processing unit 1〇9 can further classify the defect based on the captured image, or determine whether or not to correct it, and obtain various kinds of information necessary for the correction. Further, the control unit 1G8 converts the defect information into the coordinate correction map creation unit. Therefore, the coordinate correction map creation unit 11 () is based on the information indicating the position of the defect obtained by the image processing unit 1〇9 from the captured image, and the control unit 1〇8. Create or update the coordinate correction map by entering the defect information. The coordinate correction map can also be realized by the CPU of PC107. The details will be described later with reference to Figs. 5 to 8 and the coordinate correction map includes correction information for correcting the relative movement amount indicated by the control unit 108 based on the defect information. In other words, the coordinate correction map creating unit 11 functions as a correction information generating unit that generates the correction information 15 201005282. Further, the coordinate correction map is not uniformly corrected for any of the fields on the substrate 10, but is used to correct the position on the substrate 10 based on the defect as the observation and correction target. Therefore, the data of the coordinate correction map (hereinafter referred to as "coordinate correction map data") is the information that relates the correction information to the pre-defined plural fields. The coordinate correction map creating unit 110 outputs the coordinate correction map data to the coordinate correction map storage unit 111. The coordinate correction map memory unit lu memory coordinate correction map is the coordinate correction map data output by the creation unit 110. The coordinate correction map memory unit 111 can be realized by one or both of the RAM and the hard disk device of the PC 107, and functions as a correction information memory mechanism for memorizing the correction information. After the coordinate correction map data stored in the coordinate correction map memory unit 1 is inspected and corrected on the substrate 10, (4) the substrate (7) is subjected to the defect and the second substrate is not shown in the substrate 1G. The observation and correction are performed, and the defect detection device 3A or 31A is processed to detect the defect of the second substrate, and the defect information of the second substrate is transmitted to the defect correction device. Further, the second substrate is transported to the defect correcting device © 100 ' and mounted on the pedestal portion. In the same manner as described above, the control unit 108 controls the relative movement of the coordinates designated as the defect position on the second substrate based on the defect information. At this time, the control #108 refers to the coordinate correction map data stored in the coordinate correction map storage unit (1), and corrects the amount of movement indicated by the actuator that moves the movement holding unit and the optical unit 1〇5 toward the lamp direction. The movement amount correction of the first embodiment is performed indirectly as will be described later. 16 201005282 After the relative movement, the second substrate is the same as the substrate. Therefore, the coordinate correction map money travels each of the missing materials _ job (_ew), I is updated when the correction is judged to be a defect that must be corrected by the preview. The strain, deviation, or body difference of the missing correction device 1G0 and the defect detection skirt, etc., may change with time. For example, as the chamber changes, the various devices expand or contract, and the mounting between the components will gradually loosen. When a change in time is generated, according to the above-described conventional technique, it is necessary to reset the preset correction or error information. $, according to the first embodiment, the coordinate correction ® will be updated at any time when the defect on the substrate is enlarged. 'Because it can also be elastically matched with the change of time. The outline of the first embodiment has been described above with reference to Fig. 1, and the details will be described. Fig. 2 is a schematic view showing the coordinate system of the first embodiment. Fig. 2 is a perspective view showing the defect detecting device 3A and the defect correcting device 1A. Although the illustration of the defect detecting device 31 is omitted in Fig. 2, it may have the same structure as the defect detecting device 3. In the lower part of Fig. 2, the pedestal portion 1 (U, the truss 1 〇 2b, 1 〇 2c, and the horizontal beam 102a) of the pedestal portion 1 in which the substrate 10 is floated in a non-contact state by the air layer is displayed. 〇2, an optical unit 105 movable along the horizontal beam 1〇2a, and an imaging unit 1〇6 fixed to the optical unit 1〇5. In the second figure, the substrate 1 floating on the pedestal 1〇1〇 The illustration of the movement holding portion in which the end portion is held and moved in the conveying direction is omitted. The following 'simplified explanation is tentatively set as follows', but the generality of the description is not lost under the provisional provision. 17 201005282 *Substrate coordinates The coordinates (x, y) indicated by the system 标示 are marked as b (χ, y) in the suffix “B”. Similarly, the coordinate (XR, YR) indicated by the device coordinate system han is marked as R (Xr). Yr) * The observation target surface of the substrate 10 is a rectangle. * The X-axis and the y-axis of the substrate coordinate system Σ B based on the substrate 10 are parallel to the long side and the short side of the observation target surface of the substrate 10. The strain or deviation which becomes the error is removed, the XR axis is parallel to the \ axis, and the Yr axis is parallel to the 7 axis. In other words, the substrate 1 is The reference position when the defect correction device is placed on the pedestal portion 1〇1 is set so that the Xr axis and the Yr axis are parallel to the X axis and the y axis, respectively. * The device coordinate system 2RiZR axis and the pedestal portion 1 The upper surface of the crucible 1 is vertical. The pedestal portion 101 floats the substrate 1 in a non-contact state by air or the like, and can be moved toward the Xr direction while holding the side edge portion of the floating substrate crucible with the moving holding portion. The reference position of the pedestal 101 has been determined in advance. * Since the beam 102a is parallel to the Yr axis, the optical unit 105 can be directed to Yr.

Move in direction. The reference position of the optical unit 1〇5 along the beam l〇2a has been predetermined. * The optical axes of the optical unit 105 and the imaging unit 106 are parallel to the mandrel. * The origin of the substrate coordinate system is set to be the one of the observation surface of the substrate 1 ,, but it can be set arbitrarily. Device coordinate system 2 The origin of Han can also be set arbitrarily. Under the above premise, the control unit 1 8 instructs the uniaxial drive actuator for the movement holding portion to shift the amount of the movement rotary portion in the Xr direction, and instructs the optical single-axis drive actuator Move the optical unit 1 () 5 toward the ^ direction by 201005282 = amount. As a result, the relative shift of the optical system 1G4 with respect to the substrate ig can be realized. According to the above premise, the xy plane is parallel to the XrY# plane. And, b

y) The coordinate transformation between (xR, yr) and the original point B (0, 0) of the substrate structure system when the movement (four) portion and the optical single (four) 5 of the pedestal portion 101 are respectively located at the reference position, This is done by adding or subtracting the compensation coordinates R(n, f2) represented by the device coordinate system = R. In other words, ideally the relationship between equations (1) and (2) should be true. (1)

Yef2+y (2) However, as described above, the relationship between the equations (1) and (2) is not true due to the strain or mounting error of each individual actuator. Further, in the upper portion of Fig. 2, in the same form as the defect correcting device 1, only a part of the defect detecting device 3 is schematically illustrated. In other words, Fig. 2 only shows the pedestal portion 3〇1 in which the substrate 1 is floated and held, and the frame portion 3〇2 having the pillars 302b and 302c and the horizontal beam 302a, and the horizontal beam 3〇 in the defect detecting device 300. 2a installed multi-line sensor 3〇3a~3〇3e. In Fig. 2, the movement holding portion for moving the floating substrate 10 is omitted. The line sensors 303a to 303e are, for example, CCD image sensors or CMOS image sensors, functioning as detectors for defects. Similarly to the defect correcting device 1, the defect detecting device 300 is tentatively determined as follows. * The coordinate "p" of the coordinates (χΡ, γΡ) indicated by the device coordinate system ΣΡ 19 201005282 based on the defect detecting device 300 is denoted by Ρ(Χρ, Υρ). * Remove the strain or deviation that becomes the error, the Χρ axis is parallel to the 乂 axis, and the Υρ axis is parallel to the y axis. This is the same as that explained for the defect correction device 100. * The ZP axis of the device coordinate system is perpendicular to the upper surface of the pedestal portion 3〇1. * The movement holding portion is movable in the Xp direction when the end portion of the substrate 10 that has floated on the pedestal portion 3''1 is adsorbed and held. The base position of the pedestal portion 3〇1 has been determined in advance, and the floating substrate paste has been positioned at the reference position by the positioning mechanism.

* The line sensors 303a to 303e are optical axes parallel to the mandrel, and the Yp coordinates of the mounting position of the beam 302a are known. * The origin of the device coordinate system can also be set arbitrarily.

The defect detecting device 300-surface-controlled moving-holding single-axis driving actuator moves the substrate 1G at a constant speed toward the & direction, and the surface is repeated with a line type sensor 3〇3a~plate (4) secret, and the field is picked and picked. The image of the entire substrate 10 (hereinafter referred to as "synthetic substrate image") was acquired. The relationship between the coordinate system Σ P and the coordinate system of the substrate coordinate system and the same 'ideal equations (3) and (4) above should be established, but the effect of the actual strain or deviation does not hold. ” (1) (2) ’ and will synthesize

Xp = f3+x Yp= f4+y

The defect detecting device 300 converts the defective coordinates on the defective substrate image into the device coordinate system by the synthetic substrate image detecting method. According to the above formulas (3) and (4), the defect detecting device 3 converts the defective coordinate of the device coordinate system ΣΡ For the substrate coordinate system ΣΒ. 20 201005282 After the substrate 10 is carried out by the defect detecting device 300 and carried into the defect correcting device 100, the control unit 108 controls the relative movement of the substrate 10 and the optical system 1〇4. In order to achieve relative movement, the control unit 108 must perform a coordinate system conversion from the substrate coordinate system Σβ to the device coordinate system 根据 based on the defect coordinates b (x, y) calculated by the defect detecting device 300. Therefore, the control unit 108 subtracts the current position of the pedestal portion 〇1 from the reference position XR of the equation (丨) corresponding to the defect of the correction target, thereby offsetting the amount of movement in the Xr direction. Similarly, the control unit 108 subtracts the reference position of the current position of the optical unit 1〇5 from the coordinate YR of the equation (2) corresponding to the defect of the corrected object, thereby calculating the amount of movement of Yr*. However, the defect correcting device 100 and the defect detecting device 3 are individual devices each having a characteristic strain or deviation. Therefore, when the control unit 108 uses the movement amount value calculated as described above as the movement amount specifying the actual relative movement amount, the defect may not be located at the center of the captured image captured by the imaging unit 106. Sometimes, the defect may exceed the viewing range of the optical system 104 and is not included in the captured image. Therefore, when receiving the defect information affected by the strain or deviation unique to the defect detecting device 300, in the captured image obtained by relative movement and shooting based on the defect information, the defect correcting device 100 is placed in a position close to the center as much as possible in order to make the defect as close as possible to the center. The coordinate correction map will be used. Hereinafter, the defect correction device 1 described in Fig. 1 is operated, and H is more detailed! The implementation form - the form of identification and review of the implementation form. In other words, in the first embodiment, the coordinate correction map of the initial state of the defect correction device 1 at the start of the application 21 201005282 does not include any correction information, and the coordinate correction map will be corrected as the defect correction device 100 repeats the correction of the substrate. Order update. Therefore, the first embodiment is advantageous in that the coordinate correction map of the initial state is not required to be formed in advance, and even if the defect correction device 1 or the like changes temporally, it can be complemented by the update of the coordinate correction map. Fig. 3 is a flow chart showing the operation of the defect correcting device of the first embodiment. Fig. 3 shows the processing of 1 substrate. Further, the substrate 1A has been loaded into the defect correcting device 100' and placed on the pedestal portion HH to divide the XR axis and the YR axis.

Do not draw parallel X and y. In step S101, the communication unit 112 receives the defect information from the defect detecting device 300 via the network 200, and outputs the defect information to the control unit (10). Figure 4 shows an example of defect information. In Fig. 4, the defect information corresponding to one defect is a combination of an index (identification unit for identifying a defect), a defect indicating a defect position, a coordinate, a defect size, a defect classification, and a flag indicating whether or not the correction is performed. Items other than the defective coordinates may be omitted due to the embodiment. Figure 4 is an example of defect information about _ defects. The defect coordinates are represented by the combination of the X coordinate and the y coordinate of the substrate coordinate system, and in the example of Fig. 4, the unit is millimeter (mm). One point of the defect coordinate display is the defect center point detected by the defect detecting device 300 or 310. The defect size is the defect area in the example of Fig. 4. The defect detecting device 300 or 310 acquires the defect area by processing the captured image of the photographed substrate to identify the defect range, and calculates the area of the identified range. In addition to the area, a rectangle having a parallel X-axis or a y-axis of each side may be used, and the upper left corner vertex and the lower right corner vertex of the smallest rectangle including the defect range are respectively combined with the X coordinate and the y coordinate to indicate the defect size. The defect classification is performed by the defect detecting device 300 or 31〇 processing the captured image to perform classification of the judgment. The defect detecting device 3〇〇 or 31〇 classifies the detected defect into a foreign matter such as dust or an unnecessary photoresist (ph〇t〇resist), an opening defect which is not connected at the joint, and a joint which should not be connected. Short-circuit defects between connections and poor exposure of photolithography procedures. The flag indicating whether or not the correction is performed is a flag indicating whether or not the defect correction device 100 needs to be corrected for the detected defect. Returning to Fig. 3, in step si2 following step S101, the control unit 108 selects one unprocessed defect from the defect information received by the communication unit 112. Next, in step S103, the control unit 1 8 recognizes whether or not the defect selected in step si 〇 3 is included in one of the plural fields defined for the coordinate correction map. As mentioned above, the coordinate correction map data is the information that relates the revised information to the pre-defined plural fields. Figure 5 is a diagram illustrating the definition of the field of the coordinate correction map. In the first embodiment, as shown in the X-axis and the y-axis of the substrate coordinate system, a plurality of fields are defined for the substrate 1A. In the example of Fig. 5, the upper left corner of the substrate 1 is defined as the origin of the substrate coordinate system. The length of the substrate 10 in the X direction is nL, and the length in the y direction is !!^. Here, η and m are integers of 2 or more. The upper surface of the substrate 10 (i.e., the entire area on which the circuit pattern is formed) in Fig. 5 defines a field for the coordinate correction map. Each of the fields is a square having a length L of one side. The upper surface of the substrate 10 is divided into nm fields arranged in a lattice pattern of a second element. That is, the spacers 23 201005282 which are preset in the entire field on the substrate 1 are square-shaped, and the coordinate correction map associates the parties with the correction information. For example s ' nL = 1800mm, mL = 1500mm. L can be set appropriately with the substrate or the characteristics, for example, L = 50 mm, and η and m are as shown in the equations (5) and (6). , n== 1800/50 = 36 (5) 1500/50 = 30 (6), and refer to each field with the label M(i,j). Here, 丨 and j satisfy the ranges of (9) and (1〇), respectively, which satisfy the integers of the formulas (7) and (8). , the field M (i, j) is simultaneous ^ ^ i ^ π - 1 (7) 1 (8) iL^X< (i+i) L (9) jL^X< (j+1) L (10) In other words, i and j are indices for the respective directions of the grid and the direction of the 7 directions. Here, returning to the description of Fig. 3, in step s13, the processing by the control unit 1 〇 8 is as follows.缺陷 The defect coordinate of the defect selected in step S102 is set to B(x, y), which represents an integer rounded off by the decimal point of the number A by im[A]. In this way, the control unit 108 determines in step S103 which of the nm fields defined by the defect map B (x, y) belongs to Fig. 5. In other words, the control section 108 calculates the indices i and j' according to the equations (11) and (12) and recognizes that the defect selected in step S102 is included in the field M (i, j). i = int[x/L] x 24 201005282 (12) j = int[y/L] Next, in step S104, the control unit 108 reads and acquires the field M recognized in step 3103 by the coordinate correction map storage unit 111. (ij) coordinates correction map information. As shown in Section 6, the coordinate correction map data is the form in which the revised data is associated with the plural field. Figure 6 shows a diagram of the coordinate correction legend. The coordinate correction diagram in Fig. 6 is shown in a 4-shaped table, but the specific (4) form may be arbitrary depending on the embodiment. The first column and the second column in Fig. 6 are for the above-mentioned index soil and j 'column 3 and column 4 which are specific to the field, and are the correction information, specifically, the correction amount of the correction target mx and the y coordinate of the χ coordinate My. Although a part is omitted in Fig. 6, the correction information is associated with all fields defined in Fig. 5, respectively. However, as described above, the i-th embodiment is an embodiment in which the coordinate correction map is gradually learned from the state without knowledge, and "no knowledge" means that there is no correction information related to the field. Here, the flag indicating whether or not there is correction information related to the field can be added in the fifth column of Fig. 5, but the use of the flag can actually indicate the existence of the correction information. In other words, in the first embodiment, the control unit (10) determines the following rule by using the rule of thumb that the correction amount is hardly zero when the correction information is present. The control unit (10) considers that there is no correction information related to the field M D when the value of the correction amount and the mail value associated with a certain field M (i, j) are both zero. Further, if the value of the correction #mx_y is at least the value of the towel, the control unit 108 regards the learned correction information of the correction amount mx^my* as the field M (i, j) and records it. . 25 201005282 At this time, in order to initialize the uncorrected map to the initial state without knowledge, the coordinate correction map creation unit 11G generates the secret proof® of the correction amount mx#my (10) for all the fields of the leg and stores it in The coordinate correction map storage unit 111. Returning to the description of Fig. 3, in step S104, the control unit 108 obtains the coordinate correction map (4) towel, and obtains the index of the table field 1 (1, j) by the correction of the job part im! The value of the coordinate correction amount (10) and the y coordinate correction amount my. Next, in step S105, the control unit 1 〇8 uses the correction amount muscles obtained by the step s1 〇 4 to correct the defect coordinates B (X, y) of the defect selected in step S102 by the equations (1)) and ((4), and Calculate the corrected coordinate B (X,, y') according to the coordinate correction map data. (13) (14) X5 — x + mx y' = y+my and 'the first embodiment of the s towel, as described above, if If there is no correction information related to the field M(i, j), then the correction amount and the value are zero. Therefore, step S105 is not substantially corrected at this time. Alternatively, in other embodiments, if there is no In the field M (i, ^ related correction information, the control unit 108 can calculate the correction amount as follows. In other words, the control unit 108 reads the coordinate correction map data from the sacral map memory unit (1) to determine whether or not there is a surrounding area M ( i, j) correction information related to the eight fields adjacent to each other. When there is correction information related to i or more adjacent fields, the control unit 108 can calculate the average of the correction information instead of the field M(i, j) Correction information. 26 201005282 In step S106 subsequent to step S105, the control unit 108 proceeds to step S105. Calculating the seat; knowing Cx, y') is transformed into the device coordinate system SR' and performing; relative movement control 'This relative movement is used to observe and correct the defects in step S102. Specifically, the following is. 108 calculates the seat (Xr, YR) indicating the end point of the relative movement using equations (1) and (7) indicating the ideal relationship of the defect correction device 1 without deviation or strain. However, since the coordinate system of step S106 is changed

The image is a coordinate (X', y')'. Therefore, in step S106, the calculation of the following equations (15) and (16) is performed. XR=fl+X, (1) YR=f2+y, (2) Further, the control unit 1〇8 calculates the coordinates R (Xr, Yr) calculated by the equations (15) and (16), and the movement holding unit and the optical The difference in compensation of the current position of the unit 105 to the reference position is taken as the relative amount of movement from the current position. Next, in step S106, the control unit 1〇8 further instructs the uniaxial drive actuator of the movement holding unit to calculate the relative movement amount in the XR direction. Thereby, the movement holding portion of the substrate 10 is held to move relative to the optical system 104 in the Xr direction. Similarly, in step S106, the control unit 1A8 directs the calculated relative movement amount in the YR direction to the uniaxial drive actuator of the optical unit 1〇5. Thereby, the optical unit 1〇5 including the optical system 104 moves relative to the 'substrate 10 in the YR direction along the beam 102a of the frame portion 2'. As a result, in step 106, relative movement between the substrate 1 and the optical system 104 can be achieved. However, in other embodiments, the relative movement between the substrate 10 and the optical system 104 can be achieved by the method of 27 201005282. For example, the defect correcting device may be configured to relatively move the frame portion 102 in the Xr direction with respect to the non-movable pedestal portion 1〇1 that is fixed to the reference position by the substrate 10 to be inspected. Next, in step S107, the imaging unit 106 photographs the substrate 10' through the optical system 1〇4 and outputs the captured image to the image processing unit 1〇9. Fig. 7 is a view showing an example of a captured image. For convenience of explanation, Fig. 7 shows a cross line indicating the center of the captured image 401 obtained by the imaging unit 1〇6 by the image processing unit 109. In step S105, the coordinates are corrected. In most cases, as shown in FIG. 7, the defect 4〇2 selected in step S102 is displayed in the field of view of the imaging unit 1〇6 through the optical system 104, and is included in the shooting. Image 401. However, the image processing unit 109 performs image recognition processing using methods such as feature point extraction, edge extraction, or comparison of reference images, thereby detecting the defect 402 in the captured image 401, and identifying the center position and observation of the displayed defect 4〇2. The amount of deviation from the center of the field of view (the center of the field of view). Further, in order to recognize the range of the defect 402, the image processing unit 109 can use the value of the item "size" in the defect information of the fourth figure related to the defect selected in step 31〇2. On the other hand, since the coordinate correction map is in the initial state, when the substantial correction is not performed in step S105 of Fig. 3, the defect 4〇2 may not be included in the captured image 401. At this time, in step 81〇7, in order to obtain the captured image 401 including the defect 4〇2, the imaging of the substrate 10 is performed again by lowering the observation magnification. In other words, the optical unit 1〇5 of Fig. 1 has a plurality of lenses of different magnifications. When the image processing unit 109 cannot detect a defect in the first image obtained by the lens of the predetermined magnification 28 201005282 set by the transmission optical system 1〇4, the notification control unit immediately switches to the lens having a lower magnification than the shape magnification. Shooting. The control unit (10) that has received the notification controls the optical unit 1G5 and the imaging unit (10) to switch to a lens having a low magnification to be imaged by the second optical unit, and the image processing unit 1 to 9 acquires the second captured image by the imaging unit 106. Since the second photographing material is purer than the film, the observation field is wide, and the possibility of including the defect selected in step S102 is high. The image processing unit 1G9||the image touches the position of the image on the second captured image, and notifies the control unit 1 to 8 of the recognized position. On the other hand, when the image processing unit 109 cannot recognize the defect in the second captured image, the '-plane is centered on the defect coordinate specified by the control unit (10), and the relative position of the substrate (7) and the optical system 1G4 is moved in the χ γ-second direction—the field of view A small distance with the same degree of diameter, the surface is repeatedly photographed around the field of view where the imaging unit (10) first shot. The result of the repetition is obtained as a captured image including the defect selected by the step q2. Hereinafter, only the second captured image including the defect will be described in the observation field. The image processing unit 1〇9 notifies the control unit (10) of the amount of deviation from the field of view center to the defect center position for the defect identified in the second captured image, and the control unit 108 calculates the optical system ι based on the notified positional deviation amount. The relative movement of the relative position of the crucible 4 relative to the substrate 10 is slightly adjusted. Next, the control unit 108 instructs the relative movement of the movement holding portion of the pedestal portion 101 and the uniaxial drive actuator of each of the optical units 1A5. After the relative movement, the imaging unit 1〇6 performs imaging by the optical system 104, and the third captured image is rotated to the image processing unit 109 to obtain the defect 402. 29 201005282 In this way, in step S107 of FIG. 3, in any case, the image processing unit 109 can obtain the captured image 4 including the defect 4〇2 through the optical system 1〇4. Therefore, the 'image processing unit 109 pairs The acquired captured image 4〇1 performs image recognition processing to identify the position and range of the defect 402. However, as shown in FIG. 7 , the position of the captured image 401 is based on the number of pixels and the image coordinates based on the captured image 401. The center of the captured image 401 (the center of the field of view) is the origin of the image coordinate system 1; 1. Therefore, the image processing unit 109 further detects the defect 402 identified in the image 4〇1 in step S107. The coordinate coordinate system ΣΙ coordinate 1 (xb γ!) is converted into the coordinates (X, y) of the substrate coordinate system 。. The coordinate system between the image coordinate system χι and the substrate coordinate system Σ B is based on the optical system 1〇4 and The specification of the imaging unit 106 is performed, and the strain or deviation of the substrate 10 or the defect correction device 1 can be considered. A simple example of the coordinate conversion will be described later with reference to Fig. 8. For the following reasons, the defect 402 is not necessarily located at the center of the captured image 401. In other words, the coordinates B (x, y,) and the coordinates b (x", y") are not necessarily equal. * The accuracy of the coordinate correction map is insufficient. The correction information relating to the field M (i,j ) containing the position B (x,y) of the defect 402 has not been learned. *About the field M (i,j) containing the position B (X,y) of the defect 402, After the learning of the correction information, the defect correction device or the defect detecting device 3〇〇 changes temporally. 30 201005282 Therefore, in step S108 of FIG. 3, the coordinate correction map creation unit U calculates the defect 402 from the center of the field of view. The deviation of the offset (that is, the center of the captured image 401) is specifically as follows. In the first embodiment, each defect position is indicated by the center of gravity of each defect. Therefore, in Fig. 7, the center of the defect 402 is indicated by an arrow of the vector 403. The difference from the center of the captured image 401. The vector 403 is in the coordinate correction map corresponding to the error included in the correction information related to the field M (i, j) containing the defect 402. The center position of the defect 402 of the captured image 401 has been borrowed. The image processing unit 109 converts to The coordinate system of the board coordinate system B (x", y"). Here, the coordinates of the substrate coordinate system 中心 at the center of the image 401 are calculated by the equations (13) and (14) in step 31〇5. β (xy,) Therefore, the vector 403 of Fig. 7 is represented by the substrate coordinate system 26 as in equation (17). B (dx, dy) = (x''-x', y''_y,) (17 Therefore, in step S1〇8 of FIG. 3, the coordinate correction map creation unit 11 calculates the vector 4〇3 representing the component by ^(9), and outputs it to the control unit, and the coordinate (X, y) is used by the image processing unit. The 1()9 output to the coordinate correction map creation unit no' coordinate B(x, y') is input from the image processing unit 1G9 to the coordinate correction map creation unit 110. The value of the flag. Next, the control unit next performs correction of the defect as needed in steps _9 and S11G. That is, the control of the purchase of the master is in the middle of the paper, read the picture of Figure 4, "Is it necessary to amend the _ defect (4) job control, if the value of the reading = TM, if "I need no I, 丨 1" then go to Step S1J0, No need for right", then the process proceeds to step Slu. The image processing unit (10) can enter the image of the camera. The image is updated, and the shirt is missing. The correction is notified to the control unit 108. In step Siio, the control unit 108 instructs the defect correcting unit 1〇3 to correct the defect 4〇2, and the defect correcting unit 103 corrects the defect 4〇2 by, for example, laser irradiation. For example, in order to reduce the irradiation range of the laser, the position and range of the secret processing by the image processing unit 1G9 in step S107 can be instructed by the control unit 108 to instruct the defect correcting unit 103.

The step SU1 can be executed after the step 8109 judges that the defect is not required to be corrected, or is executed after the correction is made in step S110. In other embodiments, step S109 and step S110 can be performed in parallel with step sill. In step S111+, the coordinate correction map creating unit 11 updates the coordinate correction map data of Fig. 6 based on the deviation calculated by the equation (17) in step 31〇8. Details will be described later, the update mode is implemented in the form (4)*, and the third embodiment is updated as follows.

- When there is no correction information related to the field]^1(1, 』), the coordinate correction map creation unit 110 uses the values of dx and dy as the correction amount mx&my related to the field M(ij), respectively, in the coordinates. The map memory unit HI is corrected. Conversely, * when there is correction information related to the field 1 (1, j), the coordinate correction map is created. P110 updates the correction amounts mX and my related to the levy according to the equations (18) and (19). However, as mentioned above, it is considered that there is no correction information only when the correction amounts mx and my related to the domain aj) are zero. Mx = Ax/2 + mx ( 18) my=dy/2 + my (19) In the equations (18) and (19), the right side <mx&my is taken as the step sl1〇4 2010 201002282 ^ Corrected map data, the ^^ and ^^ on the left are updated with the coordinates of ^^, n. In other words, the coordinate correction map creation unit 110 uses the correction information of the field recognized by the equations (18) and (19) in the step S1G3, and the k-mark correction map memory unit Hi stores the calculated correction information again. Thus, when the update of the coordinate correction map data is completed, the processing proceeds to step S12. In step S112, the control unit 108 determines whether or not the defect information of the fourth figure received in step S101 has unprocessed defect information. If there is still Φ unprocessed defect information, the process returns to step S102. If all the N defects of Fig. 4 have been processed, the processing of Fig. 3 ends. The first embodiment has been described in detail, and the viewpoint of the data flow is summarized as follows. - Figure 8 is a data flow diagram of the first embodiment. 〇For the coordinates (X, y), as shown in the program of Fig. 8, the coordinates of the coordinate correction map are called, and the coordinates are 8 ( The X, y) communication unit 112 is received by the defect detecting device 300 as the first position information specifying the defect position to be observed. The program P11 corresponds to the steps 1〇3 to s1〇5 of Fig. 3. Further, in Fig. 8, in order to clearly show that the correction amounts 11^ and 〇1乂 are values depending on the field, they are indicated as "mx(i j)" and "my(i j)". However, the indices i and j are respectively attached to X and y, so the correction information including the correction amount mei (i, j·) and my (i, j) is used to correct the relative movement amount based on the second position information. . Next, for the coordinate b (χ, y,) converted by the program P11, in the program P12 corresponding to the step S106 of the third figure, the conversion for the relative movement 33 201005282 f is changed to the 'program P12' The coordinate system transformation from the substrate coordinate system 震 to the seismic coordinate system Σ R is performed. = The corrected information B' indicated by the corrected muscle and the (i, 』) indicates the substrate coordinate system ΣΒ φ, and the amount of the coordinate (x, y) as the first position information is corrected. Further, it can be seen from the program Pu and the program pi2 that the correction amount of the relative movement amount of the device coordinate system Σ R is not corrected. Next, for the coordinate R (Xr, Yr) converted by the program P12, the program P13 is taken and the defect coordinate 1 (χπ) indicated by the image coordinate system 2 is obtained based on the captured image. Furthermore, for the coordinate mark (Χι, Υι), in Cheng Lu, the coordinate system 变换 from the image coordinate system Σ ! to the substrate coordinate system Σ 变换 is changed g. The program Ρ13 and the program ρΐ4 are included in the step s1〇7 of the third figure. Here, when "T" of the superscript text indicates transposition, the change g of the program P14 is expressed by, for example, 3x3 rank G, by the equation (20). However, when the third row of the row G is represented by a row vector (〇, 〇, - (χ', υΜ) T = G (Xl5YIs 1) τ (20), the row G can be expressed by the optical system 1〇4 The enlargement and reduction ratio and the parallel movement determined by the specifications of the imaging unit 1〇6 can express the rotation and the shear strain caused by the strain of the defect correction device®1. Of course, in other embodiments, the conversion g can be borrowed. The transformation of the representation of the 3x3 rank and the line G. The coordinate B (X", y") converted by the program Ρ14 indicates the defect position to be observed by the substrate coordinate system ,, and is obtained as the coordinates of the second position information based on the captured image. The program Ρ15 corresponds to the step S108 of Fig. 3. In the program Ρ15, the coordinates converted by the program Ρ14 as the coordinates of the second position information β (χ,,, y) and the coordinates converted by the program P11 at 34 201005282 are calculated. The difference B (dx, dy) of (χ,,, γ") Next, in the program P16 corresponding to the step Sill of Fig. 3, the coordinate correction map data is updated. Specifically, the correction information is performed (ie, Repair 'positive mx (丨, J') and my (i, j)) update, The positive information is used to correct the relative movement amount based on the coordinate 0 (X, y) of the first position information according to the coordinate B (X, y). The updated value is based on the coordinate correction map memory unit. 111 reads the current correction information and the difference B (dx, _ dy) calculated in step P15. In other words, the updated correction information is indirectly based on the coordinate B (x,,, y,, as the second position information). The correction information updated in the program P16 is related to other defects on the substrate 1 of the succession process and other defects on the substrate, which are read and used in the program P11. In other words, by repeating the figure shown in FIG. The program P11 to the program P16, the defect. The correction device 100 gradually learns and updates the coordinate correction map data. As described above, according to the first embodiment, the influence of the difference between the defect detecting device 300 or 31〇 and the defect correcting device 100 is caused. The coordinate deviation, φ will be appropriately corrected as the coordinate correction map is learned. The correction of the coordinate correction map will be offset from the influence of the difference in the body'. The relative movement accuracy of step S106 in step 3 is improved. Therefore, the shooting in step S107 is performed. Time, The defect 402 of the figure 7 is near the center of the field of view. That is, as the coordinate correction map is learned, at the time of the first shooting, the defect correcting portion 103 causes the defect to be in the range of the correction. The lens is switched to a low magnification and is searched for. In the following, another embodiment will be described focusing on the difference from the first embodiment. 35 201005282 Fig. 9 shows the initialization flow of the coordinate correction map of the second embodiment. Fig. 1 shows a method in which learning is gradually repeated from an uninformed state. On the other hand, in the second embodiment, the standard substrate s which are arranged at a known position in a plurality of known patterns is used, and the initial data of the coordinate correction map is created by the coordinate correction map creating unit 110. Therefore, according to the second embodiment, the correction accuracy of the defect correction device 100 immediately after the start of use can be improved. Hereinafter, a plurality of known patterns arranged on a standard substrate are referred to as "standard patterns". Further, similarly to the first embodiment, the field of the coordinate correction map is defined as shown in Fig. 5. In order to simplify the description, the standard substrate is a substrate having at least one standard pattern in each of the nm areas of the fifth drawing, and the substrate 10 of the correction target is the same model (type). In step S201, the coordinate correction map creating unit 11 obtains the standard pattern information. The standard pattern data can be pre-stored in a hard disk device such as PC 107, or supplied from external memory device 320 or the like through network 200 and communication unit 112. The data of the standard-quasi-pattern contains information relating to the known position of the standard pattern indicated by the substrate coordinate system 标准 of the standard substrate. Next, in step S202, the coordinate correction map creation unit 110 initializes the value of the variable i of the index in the XX direction of Fig. 5 to 〇. The subsequent steps S203 to S211 are repeated to form a loop. In step S203, the coordinate correction map creating unit 110 initializes the value of the variable j of the index in the y direction of Fig. 5 to 〇. Next, in step S204, the coordinate correction map creating unit 110 reads the coordinates b (x〇, y〇) of the standard pattern included in the field M (i, j) from the data acquired in step S201. 36 201005282 Next, in step S205, the same direction as the step _sl〇6 of FIG. 3 is used to capture the relative shift of the standard pattern located at coordinates b (~, y〇), then in step S2〇6, Similarly to the step si7 of FIG. 3, the imaging system 104' capture unit 1〇6 captures the alignment pattern of the coordinates b (χ〇, Υ〇) on the standard substrate, and outputs the captured image to the image. Processing unit 109.

Then, in step S207, the image processing unit 1 〇9 captures the position and range of the standard pattern in the image by the image recognition processing, and recognizes the standard figure coordinate b (X1, yi) and outputs it to the coordinate correction map creating unit u. Since the details of step S206 and step S207 are similar to steps Si7 of Fig. 3, the description is omitted. Next, in step S208, the coordinate correction map creation unit 110 receives the coordinates 8 (χ〇, outside) from the communication unit 112 via the control unit-8. Further, the coordinate correction map is created as P 110 to calculate the deviation B (Dx, Dy) of the equation (21) from the coordinates 8 (x0, y0) and the coordinates β (Xi, yi). • (Dx, Dy) = (xi~x〇, yi-y〇) (21) Next, in step S209, the coordinate correction map creating unit i10 takes the deviation b (Dx, Dy) of the equation (21) as the corresponding field M. The coordinate correction map data of (i, j) is stored in the coordinate correction map storage unit 111. Next, in step S210, the coordinate correction map creating unit 110 determines whether or not the value of the index j in the y direction is equal to (m-1). If j == m - 1, the process proceeds to step S211, and if j is turned off, the process proceeds to step S212. In step S211, the coordinate correction map creating unit 11 determines whether or not the value of the index i in the x direction is equal to (n - 丨). If i = n - 1, since the processing of the combination of steps S204 to S2 〇 9 for all 丨 and 』 37 201005282 has ended, the initial learning of the coordinate correction map of Fig. 9 is also ended. At step 3211, if i; ^n - 1 ', the processing proceeds to step S213. The value of the index j is incremented by 1 in the coordinate correction map creating portion 11 of step S212, and the processing returns to step S204. Further, in step § 213, the coordinate correction map creating unit 110 adds the value of the index i to 1 ' to return to the step s2 〇 3. When the initial data of the coordinate correction map data is created as described above, the 'defect correction device 1' in the second embodiment also operates in the same manner as the first embodiment. On the other hand, in the second embodiment, the coordinate correction map creating unit ι10 learns the initial value of the correction information for each of the nm fields of the fifth figure. However, it is also possible to study only one of the fields in the nm field, while the rest of the field does not learn the implementation form. At this time, for the field where the initial value learning is not performed, the defect correction device 100 may copy the corrected 'information of the adjacent one field in which the initial value learning has been performed, or may modify the adjacent plural field in which the initial value learning has been performed. Properly allocate proportionally and calculate the proportionally assigned value as the initial value. Next, a third embodiment will be described. In the third embodiment, the correction information of the coordinate correction map is represented by the device coordinate system Σ R and is related to the field indicated by the device coordinate system 。. Therefore, in the third embodiment, part of the data flow and processing contents are different from those of the first embodiment. Hereinafter, in the third embodiment, each field is specified by indices i and j in the XR direction and the YR direction. That is, each of the fields of the third embodiment is a field defined by dividing the relative movement range. Further, in the coordinate correction map, the Xr coordinates related to the domain area M(i, j) specified by the indices i and j and the correction 38 201005282 of the YR coordinates are expressed as 111 and 11 (i, j) and mYR, respectively. i, j). The figure is a data flow chart of the third embodiment. Hereinafter, the difference from the eighth embodiment of the first embodiment will be mainly described. With respect to the first position information as the defect position of the designated observation target, the communication unit 112 receives the coordinate b (x, y) received by the defect detecting device 300, and first performs a transformation f for relative movement as in the program P21 to obtain the coordinate r ( Xr, Yr). The transformation f of the program P21 is the same as the transformation f of the program pl2 of Fig. 8. Next, in the program P22, the coordinate correction map data is converted m2, and the coordinates R (XR, YR') are obtained by the socket display (XR, YR). The transformation m2 of the program P22 is the same as the transformation m2 of the program pii of Fig. 8. Here, the correction information represented by the combination of the correction amounts mXR (i, j) and mYR (丨, j) indicates the amount of relative movement of the coordinate system of the correction device, and is determined by the coordinate R (XR, YR). The field Μ (丨, j) is related. Also, as in the program P21, the coordinates R (xR, yr) depend on the coordinates (X, y) as the information of the second position. Therefore, in the third embodiment, as in the first embodiment, the correction resource sfl is also used to correct the relative movement amount information based on the first position information. Next, the coordinates R (Xr, Yr,) converted by the program Ρ 22 are captured in the program P22, and the defective coordinate 1 (Xh YI ) indicated by the image coordinate system 21 is obtained based on the captured image. Then, for the coordinates! (X),) In the program P24, the coordinate system conversion h from the image coordinate system to the device coordinate system is performed. The coordinate system transformation h is the coordinate system transformation g of the program P14 of Fig. 8, which is represented by the equation (22) in the 3x3 row. However, when the third row of the row]^ is represented by a vector, it is (0, 0, 1). 39 201005282 (X, 'r, Y''r, 1) t = H(Xi, Yi, 1)T (22) The coordinate R(X"R, Y"R) transformed by the program P24 is used as the second position. The coordinate of the information indicates the position of the defect as the observation target by the device coordinate system SR, and is obtained based on the captured image. Next, in the flow P25, the coordinate correction map creating unit 11 calculates the coordinates B (X, R, Y' R) after the transformation of the map data by the equation (23) and the coordinates R (X) as the second position information. The difference B (dXR, dYR) of r, Y, 'r) (dXR, dYR) = (X,, R - x, r, Y, 'r - Y, r) (23) In program 26, according to The difference B (dXR, (JYR) calculated by the program P25 and the current correction information read by the coordinate correction map storage unit 111 are updated to correct the relative movement amount based on the coordinate 8 (X, y) as the first position information. Correction information (ie, correction amount mXR (i, j)) and mYR (i, j)). The updated correction information is indirectly based on the second position information. As described above, the device coordinate system ER can be used. The coordinate correction map is updated in the field. Of course, the initialization of the coordinate correction map similar to the second embodiment can be applied to the third embodiment. Next, the fourth embodiment will be described. The fourth embodiment is the implementation of the complex coordinate correction map. The following description will be made on the difference from the first embodiment. When the plurality of defect detecting devices 300 and 310 are present in the first embodiment, The trap detecting devices 300 and 310 may of course have a difference in body and have different strains or deviations. Therefore, when the defect detecting device 300 detects that the defective substrate 10 has been loaded into the defect correcting device 1 by the defect detecting device 300, the defect detecting device 310 When the defect detecting substrate 10 has been loaded into the defect correcting device 1〇〇40 201005282 by the defect detecting device 310, the appropriate correction method will be different.

Similarly, depending on the type of substrate 10 or the manufacturing steps, the manner in which strain or deviation occurs may vary. Since the size or shape of the substrate 10 varies depending on the type, the position of the strain such as warpage or bending and the degree of strain are likely to be different. Further, the singularity is produced by a plurality of steps, and depending on the pattern material or characteristics laminated on the substrate in each step, the inclination of the strain may vary depending on the steps. For example, there is a case where the substrate is 勉 after step A, the substrate is bent down after step B, and the substrate is slightly interesting after step C. At this time, since the correction is performed after steps a, b, and c, the correction by the same coordinate correction map may not be properly corrected. Therefore, in the fourth embodiment, the coordinate correction map memory unit lu recognizes each of the plurality of defect detecting devices, the plurality of substrates, and the plurality of steps, and the defective unit, the identification unit of the substrate, and the identification list of the steps. The combination produces a corresponding memory coordinate correction map. The defect correction device 100 can recognize the group of the three identification units as below. In other words, in the fourth embodiment, the identification unit of the defect detecting device that has generated the defect information, the defective unit of the defect_county, and the identification unit of the defect detecting target step are added to the defect information of Fig. 4. Therefore, the control unit 1G8 can recognize the three identification units by the defect f received by the communication unit 112. In this way, the red figure memory unit (1) will respectively correspond to the group of three fresh elements, and the coordinate correction map creation unit 110 will read and update the three identification target correction maps. . Of course, even if the difference between the types and the steps is ignored, the method may be such that the identification unit of the defect detecting device only corresponds to the coordinate correction map, without using the type or The identification unit of the step. As described above, the fourth embodiment has been described. Similarly, the second or third embodiment can also utilize a complex coordinate correction map. However, the present invention is not limited to the above embodiment, and various changes can be made. Several examples will be described below, and various combinations of strains from multiple viewpoints may be combined. The first point of view is the scope of the field defined in the coordinate correction map. Figure 11 shows the scope of the field defined in the coordinate correction map, and shows an example different from the third embodiment. In Fig. 5, the area of the coordinate correction map is defined in the entire area of the substrate 1〇. However, a part of the substrate 10 may not be defined in the field. For example, when the peripheral portion of the substrate 10 is a frame in which the circuit pattern is not formed, the peripheral portion of the substrate 10 may have no defined area as shown in Fig. 11(a). Similarly, when a four-sided display panel is manufactured from, for example, one glass substrate, a frame may be provided between the display and the panel. At this time, as shown in Fig. 11(b), not only the peripheral portion of the substrate 10 but also the frame portion between the display panels may not define the area of the coordinate correction map. 〇 Also, in Fig. 5, the fields of the respective fields are equal, and the plural fields separated by the sub-elements are arranged in a single element. However, the shape of each field may not be square, and the plural fields may be arranged in a single shape. For example, as shown in Fig. 11(c), the plural domain of the substrate coordinate system ΣΒ2 Υ can be arranged in a --dimensional shape, or as shown in the figure (4), can be used in the substrate coordinate system Σ The X-axis direction defines the complex term field j_' arranged in a single element as shown in the U (c) and (d) figures, and the fields are not necessarily 42 201005282. As shown in Figure 11 (e), the size or shape of the plural field is not fixed. For example, the central portion having a large influence of bending may be narrowly divided, and the peripheral portion having a small f-curve image may be relatively thick to define a plural field. Thus, since the range of fields defined in the coordinate correction map is different, according to the embodiment, the hearing correction map may not define two fields 第j as in the sixth figure, but define the field at the coordinates of the upper left corner and the lower right corner of the field. . The second point of the strain is the value L of the specified field size. The value L can be arbitrarily determined depending on the embodiment, but the substrate size or characteristics should be considered. For example, when a very large substrate is defined as 1^=1, the number of fields will be too large, so dataparseness will occur, and it will take a lot of time to learn the correction information for all fields. Therefore, the viewpoint of controlling the time taken from the state of no knowledge to the end of all learning is either a viewpoint that the size of the substrate can be appropriately changed as long as the size of the substrate can be appropriately changed, and it is preferable to define each field. However, if the value L is too large, an appropriate correction cannot be achieved. This is because, regardless of the defects in one area, the same correction is applied. For the change &, each field should be defined as "no matter how many points in the field, the difference in the way in which the deviation or strain occurs is only slightly different, even if the difference is ignored." Since this size depends on the structural (mechanical) nature of the substrate, it can be investigated experimentally. These points of view should be considered to define areas of appropriate size for the implementation. The third point of view of the strain is the coordinate correction map memory, which is memorized as a correction. 43 201005282 Information. The first solid surface towel, as in the sixth illustration, the coordinate correction map memory portion 111 stores the values of the correction amounts 11^ and 11^ of the X coordinate and the y coordinate. However, the correct amount of mx and my can be expressed as a function of the x coordinate and the y coordinate. For example, the 丨 丝 of the formulas (24) and (25) can be used as a function of the correction amount (10) and my, and other functions can be utilized. Mx=a1x+a2y+a3 (24) my=a4x + a5y+a6 (25) At this time, the coordinate correction map memory unit lu will specify the coefficients ai~a6 of the equations (24) and (25) and the fields ^^ ( i, j) produces an association, and the memory is a coordinate correction map. The fourth point of view is the way in which the coordinate correction map data is updated. In the first embodiment, as shown in the equations (13), (14), and (17) to (19), if the updated correction amount mx and my are used to temporarily correct the coordinates b (χ, y), the correction result can be obtained. The coordinates b (X,, y,) are the points in the coordinates b (χ, y, ,). In other words, the updates of the equations (18) and (19) are the corrections currently stored in the coordinate correction map memory unit 111. The information is uniformly updated with the coordinates of the defect 402 including the deviation 8 (dx, dy) calculated in the step sl8 of Fig. 3. However, the predetermined weighting Wl (〇<%$:) can also be used. The correction amounts mX and my as correction information are updated by the equations (26) and (27). mx = W]dx + mx (26) my = Widy+my (27) And 'to improve learning by avoiding data sparseness From the viewpoint of efficiency, when the field M (i, j) is recognized in step S103 of Fig. 3, the following processing can be performed by the coordinate correction map creating unit no in step S111. In other words, the implementation 44 201005282 can be the step SI 11 The coordinate correction map creation unit 110 not only updates the correction information related to the field 1 (1, j), but also updates other fields with the adjacent field PCT (i, j). (i+ α, j+ call) related correction information. However, both α and /5 are one of 1, 1, and 1. For example, the updated correction amount mx (iJ) is subtracted from the current one. The difference between the repair amount mx (i, j) is Δmx. For example, in the i-th embodiment, & dx/2. The coordinate correction map creation unit 110 can perform a predetermined weighting for you $(〇<2 $1), related to other areas of the elbow (^+^.+ /5) < correction amount mx (1+ α, j+call) plus W2Amx update. Correction of y coordinate my (i+ a, j+泠) The fifth aspect of the strain is about the use of devices other than the defect correction device. The above embodiments are all defects of relatively high resolution capability by the defect detecting device 300 or 310 having relatively low resolution. An embodiment relating to the correction of the defect correction device 1 when the correction device 1 transmits the defect information. However, the optical system having the higher resolution than the defect detecting device 300 or 31 and the imaging unit observes the substrate 10 If the device has the same PC as the PC 107 of the figure, it can also be used for the device other than the defect correction device. In the above-described embodiment, the third embodiment in which the defect is observed and corrected by the defect correction device 100 having the defect as the observation target and the correction target is applied to the line width of the circuit pattern formed on the substrate 10 as The line width measuring device of the observation object and the measurement object observes and measures the line width. At this time, the line width measuring device does not have the defect correcting unit 1〇3 of the first drawing, and the image processing unit 1〇9 45 201005282 also performs the line width. Measurement processing. Further, in Fig. 3, the line width measurement process is performed instead of step S109 and step S110. Of course, the information indicating the position of the measurement object can be used instead of the defect information of Fig. 4. However, the other aspects are substantially the same as those of the first embodiment, and the line width measuring device can also use the coordinate correction map of Fig. 6 relating to the plural field of Fig. 5 by the correction information. Similarly, the defects detected by the defect detecting device 300 or 310 having relatively low resolution are observed with relatively high resolution, whereby the above-described respective embodiments can be applied to the device for performing fine inspection or detailed classification. Further, the embodiments of the apparatus for the same resolution of the defect detecting device 300 or 310 can be applied to the respective embodiments. The sixth point of view is whether the coordinate correction map must be updated whenever a defect is observed. As described below, there are cases where the update can be omitted. If the appropriate threshold value q is set in advance, when the deviation B (dx, dy) of the equation (17) in the step S108 of Fig. 3 is larger than the critical value h, it is considered that an abnormality has occurred. Therefore, in the embodiment in which the sixth point of view is applied, the coordinate correction map creation unit 110 regards the deviation B (dx, dy) as being larger than the critical value, and is regarded as an abnormality. When the coordinate correction map creation unit 110 regards the occurrence of an abnormality, the update of the correction amounts mx and my related to the field M (i, j) to which the defect of the current observation target belongs is not performed, and a warning is displayed. On the other hand, when the deviation 8 (dx, dy) is smaller than the preset threshold t2, the coordinate correction map creation unit 110 judges that "the field M (i, j) has almost no influence of the temporal change, and thus the field M ( i, j) the associated correction amount mx and my need not be updated, and the update of the coordinate correction map can be omitted. 46 201005282 In the above, various embodiments have been described, and since the correction information corresponding to each of the fields divided into plural numbers is used, it is possible to perform the unified correction of the entire area even if the substrate or the device is enlarged. Appropriate corrections. Therefore, for example, the correction time of the defect correcting device 100 can be shortened, and the manufacturing efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a functional block diagram of a defect correction device according to a first embodiment. Figure 2 is a schematic diagram showing the coordinate system. Fig. 3 is a flow chart showing the operation of the defect correcting device of the first embodiment. Figure 4 is a diagram showing an example of defect information. Figure 5 is a diagram illustrating the definition of the field of the coordinate correction map. Figure 6 shows a diagram of the coordinate correction legend. Fig. 7 is a view showing an example of a captured image. Fig. 8 is a flow chart showing the data of the first embodiment. Fig. 9 is a flowchart showing the initialization of the coordinate correction map of the second embodiment. Fig. 10 is a data flow chart of the third embodiment. The 11th (a) to (e) diagrams show the definition of the field in the coordinate correction map. [Description of main component symbols] 10...substrate 101·.. pedestal part 100... defect correction agricultural setting 102..·frame part 47 201005282 102a...beam 200...network 102b, 102c·.·pillar 300,310... defect detecting device 103... Defect correction unit 301... pedestal unit 104···Optical system 302...Rack unit 105···Optical unit 302a...beam. 106...Capture unit 302b, 302c.··Pillar 107---PC 303a to 303e...Line type sensing 108: control unit 109: video processing unit 320: external memory device 401... captured image W 110... coordinate correction map creation unit 402... defect 11 and coordinate correction map storage unit 112··· communication unit 403...vector ❿ 48

Claims (1)

201005282 VII. Patent Application Scope of the Invention The present invention relates to a substrate observation apparatus comprising: an optical mechanism for expanding an observation relative movement, wherein the optical mechanism is set based on an observation target position on the substrate=7 Relative position relative to the aforementioned substrate The image processing means obtains the captured image by the imaging means, and acquires a second positional information indicating the position of the observation target based on the captured image; a correction # _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ And the relative positive movement amount generated by the relative movement mechanism; and the 6-Bei-Xin-Mei-Remembering mechanism, the correction information generated by the correction information generating means is corresponding to the first aspect in the plural domain defined in advance The domain of location information is associated and remembered. 2. The substrate observation apparatus according to claim 2, wherein the plurality of fields divide the relative movement range of the observation target range on the substrate or the relative movement mechanism of the observation target range into a checkered shape. definition. 3. The substrate observation device of claim 1, wherein the substrate is a standard substrate in which the known patterns are respectively arranged at known positions. The aforementioned observation object is each of the plurality of known patterns; the relative moving mechanism The information indicating the known position of the known pattern is used as the foregoing information to move the relative position of the optical mechanism relative to the substrate; the correction information generating mechanism generates the correction information for each of the plurality of known patterns; and The aforementioned correction information memory mechanism memorizes the aforementioned correction information that has been generated for each of the aforementioned plurality of known patterns. 4. The substrate observation apparatus according to claim 1, wherein the observation target is a defect on the substrate; and the first position information indicates that the defect detection device different from the substrate observation device detects the aforementioned substrate from the substrate Information about the location of the defect. 5. If the substrate observation device of the patent application No. 4 is applied, when the correction information storage mechanism has generated and memorized the correction information and the aforementioned field corresponding to the position information of the foregoing position, the relative (4) institution is performing the It is recalled that after the correction of the above correction information, the relative position of the optical mechanism relative to the substrate is moved. 6. The substrate observation device of claim 4, wherein the first information is represented by a coordinate of a substrate coordinate system based on the substrate. 7. The substrate observation device of claim 6, wherein the plurality of fields are defined by dividing the range of the observation object on the substrate into a plurality of numbers, 50 201005282 and using the area indicated by the substrate coordinate system. The above-mentioned correction information is stipulated in the stipulations of the stipulations of the stipulations of the stipulations of the stipulations. The production of oysters and inclusions - the field of silk _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 8. The substrate view (4) of the application _7 item, wherein the correction information is generated based on the difference between the second position information indicated by the substrate coordinate system and the second position information. The substrate observation device of the item, wherein the relative movement (four) of the plurality of collar mechanisms is plural to be used to indicate the relative movement amount and is represented by a device holder (10) based on the substrate observation device. (1) The first positive information indicates a correction-coordinate amount, wherein the coordinates indicate the position of the defect specified by the first position information by the eight systems; and the correction information storage mechanism uses the correction information generating mechanism The generated JF-lean SK is associated with the field including the coordinates described above, and the coordinate system is represented by the device coordinate system to indicate the defect of the aforementioned i-th position information index. 〇····················································· 11. A method for observing a substrate, wherein the optical device of the large observation substrate and the substrate observation device that transmits the image capturing mechanism through the optical mechanism _ the substrate are subjected to the following steps: Observing the i-th position information of the target position, moving the relative position of the optical mechanism relative to the substrate; and transmitting the image by capturing the observation target by the imaging mechanism through the optical mechanism that moves relative to the substrate; And acquiring, according to the acquired second position information, correction information, wherein the correction information is used to correct the position information according to the second position information according to the second position information; The amount of relative movement; and the previously generated correction information is associated with and stored in a field corresponding to the first position information in the predefined plural field. 12. A control device for controlling a substrate observation device having an optical mechanism for expanding an observation substrate and an imaging mechanism for capturing the substrate through the optical mechanism and outputting a captured image, comprising: a relative movement control mechanism; Controlling the substrate observation device to move the relative position of the optical mechanism relative to the substrate according to the second position information specifying the position of the observation target on the substrate; the imaging control mechanism controls the imaging mechanism to transmit The optical mechanism that moves relative to the substrate relative to the substrate moves the image to be observed; 201005282 The image processing mechanism obtains the image based on the image captured by the image capturing control unit according to the control of the image capturing control unit. The second position information of the position information; the correction information generating unit generates the correction information based on the second position information acquired by the image processing unit, and the correction information is used to correct the root information according to the first position information Dijon location information The amount of relative movement by the relative movement of the control mechanism is generated; and The correction information storage means associates and corrects the aforementioned correction information generated by the correction information generating means with the field corresponding to the first position information in the previously defined (4) field. 13--a computer-readable recording medium, which is a memory-programmer, characterized in that the program performs a step of a computer connected to a substrate observation device having an optical mechanism for observing a substrate through a drum and transmitting the optical The step of photographing the substrate and rotating the image of the image is performed by the step of: acquiring, by the substrate observation device, a captured image, wherein the image capturing device specifies the position of the observation target on the substrate a position information for moving the relative position of the optical mechanism relative to the substrate and photographing by the photographing mechanism; acquiring second position information indicating the position of the observation target based on the captured image; and obtaining the second position according to the acquired position Information to generate correction information for correcting the relative movement amount according to the foregoing position information according to the first position i; and 53 201005282 to generate the aforementioned correction information and the predefined plural field Correlate with the field of the first position information mentioned above and record it . 54