201004546 九、發明說明： 【發明所屬之技術領域】 •本發明是有關於一種陶瓷基板結構及其製造方法，且 .特別是有關於一種具有散熱功能之陶瓷基板結構及其製造 方法。 【先前技術】 近年來’來由於消費性電子與無線通訊產品的快速發 展，電子產品紛紛趨向具備多功能、外塑輕薄短小等需求 發展’因此’各種整合型技術開始受到重視，低溫共燒陶 究（Low-Temperature Cofired Ceramics ; LTCC)為電子產 品朝向輕薄短小的發展技術之一。低温共燒陶瓷技術，係 將被動元件埋入多層陶瓷基板中燒結形成整合式陶竟元 件’以有效減少元件的空間，使得元件高度集積，達成元 件/模組縮小化、電子產品小型化的目的 LTCC整合型元件，係以陶瓷材料作為基板，將被動 元件埋入多層陶瓷基板中燒結形成整合式陶瓷元件，以有 效減少元件的空間，使得元件高度集積，達到節省空間之 便0 一般在LTCC技術中常見的散熱方法，為一具有貫穿 的導熱通道(thermal via)之陶瓷基板結構1，如圖1，陶究 基板11具有複數個導熱通道（thermal via) 12並透過一焊 錫層15使陶瓷基板11與印刷電路板16彼此連接，而透過 這些導熱通道12的設計，可協助基板散熱。 然而，利用貫穿陶瓷基板之導熱通道(thermal via)的散 201004546 熱功能具有一定之功效，對於高功率之產品並不適用，所 以，一般針對高功率之產品，會採用金屬貼片的方法以增 強其散熱功率，然而此金屬貼片的方式，需要額外的製程 • 步驟與材料，而提高產品製程的複雜度與費用。 【發明内容】 有鑑於此，本發明所欲解決的問題在於提供一種具有 散熱功能之陶瓷基板結構及其製造方法。 為解決上述問題，本發明所提出之技術手段係在於， 本發明提供一種具有散熱功能之陶瓷基板結構，此陶瓷基 板結構包括一陶瓷基板，係具有相對之一第一表面及一第 二表面，第一表面具有一凹陷處；複數個導熱通道(thermal via)，係設於凹陷處底面並貫通至第二表面；一可焊金屬 層，係形成於凹陷處底面並上述之導熱通道連接；以及一焊 料層，係填滿於可焊金屬層上方的凹陷處内。 C./ 上述發明實施例中，導熱通道係為一金屬柱，可焊金 屬可為Ag-Pt、Ag-Pd、Ag或銅；亦可用表面電鑛的方法 行成可焊金屬Sn或無電電鍍的方法形成可焊金屬Ni、Pd 或Au，陶究基材可設置於一印刷電路板(Printed Circuit Board, PCB)之上，並可透過印刷電路板之焊錫層彼此連 接，且陶瓷基材可應用於高功率或高亮度之LED。 本發明另外提供一種具有散熱功能之陶瓷基板的製 程。首先，提供一陶瓷薄板，陶瓷薄板具有複數個導熱通 道(thermal via)。接著，塗佈或印刷一可焊金屬於導熱通道 6 201004546 3古μ形成—可焊金屬層。之後，提供—生胚片，生胚 片^有至少-孔洞（cavity)’孔洞尺寸大於導熱通道尺寸。 之後占堆4生胚片於陶究薄板上，孔洞形成—凹陷處，且 凹陷處外露出可焊金屬層。之後，進行燒結料薄板、生 ，片與可焊金屬層，以共同形成m板。之後，放入一 焊料於凹陷處内。以及進行一迴焊步驟，使焊料固化於凹 陷處内。 其中，焊料係選自含錫的任何錫膏原料。可焊金屬可 為Ag-Pt、Ag_Pd、Ag或銅；亦可用表面電鍍的方法行成 可焊金屬Sn，或無電電鍍的方法形成可焊金屬Ni、Pd或 Au在進行迴焊步驟之後，更可包含一步驟將陶瓷基板連接 於一印刷電路板上，而陶瓷基板與印刷電路板係透過一焊 錫層彼此連接。陶瓷薄板係為一低溫共燒陶瓷基板，且陶 莞基板可應用於高功率或高亮度之LED。 .運用本發明所獲得的功效係在於’本發明係透過習知 之孔洞製程在一生胚片上形成一孔洞，並搭配一具有可焊 金屬於導熱通道上方之陶瓷薄板’將並填入焊料於孔洞 内，因而提生金屬散熱體積’藉此可自然形成一散熱片， 改善基板散熱效率而提高散熱功率’擴大陶瓷基板應用於 高功率產品之應用範圍，如：高功率1C及LED等基板之 散熱，且此方式與金屬片貼合的方式相較下，可減少製程 步驟及製造成本，此外，本發明之陶瓷基板結構可直接與 基板藉由焊料層相接合，而減少導熱膠酯使用。 【實施方式】 7 201004546 以下將參照相關圖示，說明依本發明較佳實施例之具 有散熱功能之陶瓷基板結構，為使便於理解，下述實施例 中之相同元件係以相同之符號標示來說明。 請參考圖2,其係為本發明之具有散熱功能之陶瓷基 板結構。圖中，陶瓷基板結構2包括一陶瓷基板21、複數 個導熱通道（thermal via)22、一可焊金屬層23以及一焊 料層24。陶瓷基板21具有相對之一第一表面211及一第 二表面212，且第一表面211上有一凹陷處216，複數個導 熱通道（thermal via)22係設於凹陷處216底面並貫通至 第二表面212，可焊金屬層23係形成於凹陷處216底面並 與些導熱通道22連接，焊料層24係填滿於可焊金屬層23 上方的凹陷處216内。 承上述，本實施例之導熱通道係為一金屬柱，金屬柱 材料可以是任何含有金屬成份的金屬材料，此外，上述之 可焊金屬的材質可以是Ag-Pt、Ag-Pd、Ag或銅；亦可用 表面電鍍的方法行成可焊金屬Sn，或無電電鍍的方法形成 可焊金屬Ni、Pd或Au，或其他適當的金屬材料，或者也 可以是上述金屬材料的任意組合。 在上述實施例中，具有散熱功能之陶瓷基板結構2更 可設置於一印刷電路板（Printed Circuit Board, PCB)26 之上，其中可透過焊錫層25彼此連接。 在上述實施例中，具有散熱功能之陶瓷基板結構2可 應用於高功率或高亮度之LED，但可應用之相關產品並不 以此為限。 相較於習知技術而言（請參考圖1)，習知技術只單 201004546 純透過導熱通道進行散熱〜_,、、、，，~ q ， 料於孔洞内，因而提升金屬散熱體積，藉此可自然形成 散熱片’改善基板散熱效率而提高散熱功率，擴大陶瓷基 板應用於高功率產品之應用範圍，如：高功率1(：及LED等 基板之散熱，且此方式與金屬片貼合的方式相較下，可減 少製程步驟及製造成本，此外，本發明之陶瓷基板結構可 直接與基板藉由知料層相接合，而減少導熱膠醋使用。 以上僅介紹陶瓷基板的結構，而關於陶瓷基板的製 程，以下將配合圖3A至圖3F進行詳細的說明。 請依序參閱圖3A與圖3B，首先，提供一陶瓷薄板 2^3」此陶究薄板213具有複數個導熱通道22，其中，陶 莞薄板213可為低/皿共燒陶竟（L〇w 丁⑽㈣站⑽c〇_ f，LTCC)基板。接著，形成一可焊金屬層 溥板213上，JL中可焊本居 、岡是 ^ s 于金屬層Μ可透過塗佈或印刷一可和 金屬的方法，形成於導埶 可以是_、Ag-Pd :Α=上方，此可焊金屬的村質 行成可焊金屬Sn，或無可用表面電錢的方法 或如、或其他金屬材料==方法形成可焊金屬tPd 意組合。 或者也可以是上述金屬材料的任 接著’請參閱圖3C 此生胚片214具有至少 孔洞215尺寸至少大於 生胚片214上的方式可 器鑽孔等方法均可採用 與圖3D，另外提供一生胚片214， :孔洞215 ’其中，生胚片214的 導熱通道22尺寸。形成孔洞215於 以有报多種，舉例來說，雷射或機 之後，堆疊生胚片 214於陶瓷薄板213上 其中這些 201004546 孔洞215會座落在相對應於導熱通道22上的可焊金屬層 23上方’即這些形成在導熱通道22上方的可焊金屬層23 ' 會對應於這些孔洞215。 ’ 堆疊完畢後，燒結此堆疊在一起之陶瓷薄板213、生 胚片214與可焊金屬層23,以共同形成陶瓷基板21。燒結 完畢後’生胚片上的原有之孔洞215則形成一陶瓷基板21 的一凹陷處216 ,且凹陷處216外露出可焊金屬層23。 (： 請麥閱圖3E與圖3F，接著，放入一焊料241於凹陷 處内216 ’其令焊料241的材料可為任何一種含錫的錫膏 原料’最後進行一迴焊步驟，使焊料241固化於凹陷處内 216，而進行迴焊步驟時的溫度設定，則依錫膏原料的種類 而決定，在此不限定之。 如此，具有散熱功能之陶瓷基板21已完成，透過焊料 植於孔洞内的方式，此可自然形成一散熱片，因而提升陶 莞基板的散熱效率。 此外，此方法更可包含將陶瓷基板21連接於一印刷電 路板26上。其中，陶曼基板21與印刷電路板（或其它基 板)26係透過一烊錫層25彼此連接，連接陶莞基板21於印 刷電路板26的方法與習知技術相同，故不再重複介紹。 如此本發明所使用的焊料金屬散熱方法，藉由焊料 填充的方式，提高散熱體積此一設計，由此可提升陶£基 •板之散熱效率’擴大陶莞基板於高功率產品之應用範圍， 即本發明的陶瓷基板的可應用於高功率或高亮度之led 上’此外’透過焊錫層與基板接合，減少導熱膠醋使用， 201004546 亦具有降低成本之一功效。 發明專利範圍所涵蓋。 鄉白為本 【圖式簡單說明】 圖1係為習知陶瓷基板結構之結構剖面圖； 圖2係為本發明之具有散熱功能之陶瓷基板結構之結構剖 面圖；以及 圖3A〜圖3F係為本發明之具有散熱功能之陶瓷基板結構 的製作流程圖。 【主要元件符號說明】 1 陶瓷基板結構 11 陶瓷基板 12 導熱通道 15 焊錫層 16 印刷電路板 2 陶瓷基板結構 21 陶瓷基板 211第一表面 212第二表面 201004546 213 陶竟薄板 214 生胚片 215 孔洞 216 凹陷處 22 導熱通道 23 可焊金屬層 24 焊料層 241 焊料 25 焊錫層 26 印刷電路板201004546 IX. Description of the Invention: [Technical Field] The present invention relates to a ceramic substrate structure and a method of manufacturing the same, and, in particular, to a ceramic substrate structure having a heat dissipation function and a method of fabricating the same. [Prior Art] In recent years, due to the rapid development of consumer electronics and wireless communication products, electronic products have become more and more versatile, and the demand for thin plastics is short. Therefore, various integrated technologies have begun to receive attention. Low-Temperature Cofired Ceramics (LTCC) is one of the development technologies for electronic products that are light, thin and short. The low-temperature co-fired ceramic technology is to embed passive components in a multi-layer ceramic substrate to form an integrated ceramic component to effectively reduce the space of the components, so that the components are highly concentrated, and the components/modules are reduced and the electronic products are miniaturized. The LTCC integrated component uses ceramic material as the substrate, and the passive component is buried in the multilayer ceramic substrate to form an integrated ceramic component, so as to effectively reduce the space of the component and make the component highly accumulate, thereby saving space. Generally, the LTCC technology is used. A common heat dissipation method is a ceramic substrate structure 1 having a thermal via therethrough. As shown in FIG. 1, the ceramic substrate 11 has a plurality of thermal vias 12 and a ceramic substrate through a solder layer 15. 11 and the printed circuit board 16 are connected to each other, and the design of the heat conduction channels 12 can assist the heat dissipation of the substrate. However, the thermal function of the 201004546, which utilizes the thermal via of the ceramic substrate, has a certain effect and is not suitable for high-power products. Therefore, for high-power products, a metal patch is generally used to enhance Its heat dissipation, however, the way this metal patch requires additional process, steps and materials to increase the complexity and expense of the product process. SUMMARY OF THE INVENTION In view of the above, the problem to be solved by the present invention is to provide a ceramic substrate structure having a heat dissipation function and a method of fabricating the same. In order to solve the above problems, the technical means of the present invention is to provide a ceramic substrate structure having a heat dissipation function, the ceramic substrate structure comprising a ceramic substrate having a first surface and a second surface. The first surface has a recess; a plurality of thermal vias are disposed on the bottom surface of the recess and penetrate to the second surface; a solderable metal layer is formed on the bottom surface of the recess and connected to the heat conduction channel; A layer of solder is filled in the recess above the solderable metal layer. C./ In the above embodiment of the invention, the heat conduction channel is a metal pillar, and the weldable metal may be Ag-Pt, Ag-Pd, Ag or copper; or may be formed into a solderable metal Sn or electroless plating by surface electrowinning. The method can form a solderable metal Ni, Pd or Au. The ceramic substrate can be disposed on a printed circuit board (PCB) and can be connected to each other through a solder layer of the printed circuit board, and the ceramic substrate can be Used in high power or high brightness LEDs. The present invention further provides a process for a ceramic substrate having a heat dissipation function. First, a ceramic sheet is provided which has a plurality of thermal vias. Next, a solderable metal is coated or printed on the thermally conductive channel 6 201004546 3 to form a solderable metal layer. Thereafter, a green sheet is provided, and the green sheet has at least a cavity size larger than the size of the heat conduction channel. After that, the piles of the four raw sheets are placed on the ceramic sheet, the holes are formed into depressions, and the weldable metal layer is exposed outside the depressions. Thereafter, a sinter sheet, a green sheet, a sheet and a solderable metal layer are formed to collectively form an m-plate. After that, a solder is placed in the recess. And performing a reflow step to cure the solder in the recess. Wherein, the solder is selected from any solder paste material containing tin. The solderable metal may be Ag-Pt, Ag_Pd, Ag or copper; the surface metal plating method may be used to form the solderable metal Sn, or the electroless plating method may be used to form the solderable metal Ni, Pd or Au after the reflow step, The ceramic substrate can be connected to a printed circuit board in a step, and the ceramic substrate and the printed circuit board are connected to each other through a solder layer. The ceramic sheet is a low temperature co-fired ceramic substrate, and the ceramic substrate can be applied to high power or high brightness LEDs. The effect obtained by the present invention is that the present invention forms a hole in a green sheet through a conventional hole process and is filled with a soldered metal in a hole in a hole. Therefore, the metal heat dissipation volume is extracted, thereby naturally forming a heat sink, improving the heat dissipation efficiency of the substrate and improving the heat dissipation power, and expanding the application range of the ceramic substrate for high-power products, such as heat dissipation of high-power 1C and LED substrates. In this way, the process steps and the manufacturing cost can be reduced as compared with the manner in which the metal sheets are bonded. In addition, the ceramic substrate structure of the present invention can be directly bonded to the substrate by the solder layer to reduce the use of the thermal paste. [Embodiment] 7 201004546 Hereinafter, a ceramic substrate structure having a heat dissipation function according to a preferred embodiment of the present invention will be described with reference to the related drawings. For ease of understanding, the same components in the following embodiments are denoted by the same reference numerals. Description. Please refer to FIG. 2, which is a ceramic substrate structure with heat dissipation function of the present invention. In the figure, the ceramic substrate structure 2 comprises a ceramic substrate 21, a plurality of thermal vias 22, a solderable metal layer 23 and a solder layer 24. The ceramic substrate 21 has a first surface 211 and a second surface 212. The first surface 211 has a recess 216. A plurality of thermal vias 22 are disposed on the bottom surface of the recess 216 and extend through the second surface. The surface 212, the solderable metal layer 23 is formed on the bottom surface of the recess 216 and connected to the heat conduction channels 22, and the solder layer 24 is filled in the recesses 216 above the solderable metal layer 23. In the above, the heat conduction channel of the embodiment is a metal column, and the metal column material may be any metal material containing a metal component. Further, the material of the solderable metal may be Ag-Pt, Ag-Pd, Ag or copper. The surface can be formed into a solderable metal Sn, or electrolessly plated to form a solderable metal Ni, Pd or Au, or other suitable metal material, or any combination of the above metal materials. In the above embodiment, the ceramic substrate structure 2 having a heat dissipation function can be further disposed on a printed circuit board (PCB) 26, wherein the solder layer 25 can be connected to each other. In the above embodiment, the ceramic substrate structure 2 having a heat dissipation function can be applied to a high power or high brightness LED, but the related products to be applied are not limited thereto. Compared with the prior art (please refer to FIG. 1), the conventional technology only uses 201004446 to completely dissipate heat through the heat conduction channel~_,,,,,,~q, which is expected to be inside the hole, thereby increasing the heat dissipation volume of the metal. This can naturally form a heat sink to improve the heat dissipation efficiency of the substrate and improve the heat dissipation power, and expand the application range of the ceramic substrate for high-power products, such as high-power 1 (: and heat dissipation of substrates such as LEDs, and this method is bonded to the metal sheet. Compared with the method, the process steps and the manufacturing cost can be reduced, and the ceramic substrate structure of the present invention can be directly bonded to the substrate by the knowing layer to reduce the use of the thermal conductive vinegar. The above only describes the structure of the ceramic substrate, and The process of the ceramic substrate will be described in detail with reference to FIGS. 3A to 3F. Please refer to FIG. 3A and FIG. 3B in sequence. First, a ceramic thin plate 2^3 is provided. The ceramic sheet 213 has a plurality of heat conduction channels 22 Among them, the Taowan thin plate 213 can be a low/dish co-fired ceramic (L〇w Ding (10) (four) station (10) c〇_ f, LTCC) substrate. Then, a solderable metal layer 213 is formed, and the JL can be soldered. Home, Is a metal layer Μ can be coated or printed by a method of forming a metal, formed on the guide 埶, Ag-Pd: Α = above, the weldable metal is made into a weldable metal Sn, Or no method of surface electricity available or such as, or other metal materials == method to form a weldable metal tPd combination. Alternatively, it may be any of the above metal materials. Please refer to FIG. 3C. The green sheet 214 has at least a hole 215 size. A method such as drilling at least on the green sheet 214 can be used in conjunction with FIG. 3D, and a green sheet 214 is additionally provided: the hole 215' wherein the heat conductive passage 22 of the green sheet 214 is sized. The hole 215 is formed. There are a number of examples, for example, after laser or machine, stacking green sheets 214 on ceramic sheets 213 where the 201004546 holes 215 are seated above the solderable metal layer 23 corresponding to the heat conducting channels 22' The solderable metal layer 23' formed over the heat conduction channel 22 corresponds to the holes 215. After the stacking, the stacked ceramic sheets 213, the green sheets 214 and the solderable metal layer 23 are sintered to form a ceramic together. base 21. After the sintering is completed, the original hole 215 on the green sheet forms a recess 216 of the ceramic substrate 21, and the recess 216 exposes the solderable metal layer 23. (: Please refer to Figure 3E and Figure 3F, Next, a solder 241 is placed in the recess 216'. The material of the solder 241 can be any tin-containing solder paste material. Finally, a reflow step is performed to cure the solder 241 in the recess 216. The temperature setting during the soldering step is determined depending on the type of the solder paste material, and is not limited thereto. Thus, the ceramic substrate 21 having the heat dissipation function is completed, and the solder is implanted in the hole to naturally form a heat dissipation. The film thus enhances the heat dissipation efficiency of the ceramic board. Moreover, the method may further include attaching the ceramic substrate 21 to a printed circuit board 26. The method in which the Tauman substrate 21 and the printed circuit board (or other substrate) 26 are connected to each other through a tin-plated layer 25 and the method of connecting the ceramic substrate 21 to the printed circuit board 26 are the same as those in the prior art, and therefore will not be repeatedly described. Therefore, the solder metal heat dissipation method used in the present invention improves the heat dissipation volume by means of solder filling, thereby improving the heat dissipation efficiency of the ceramic substrate, and expanding the application range of the ceramics substrate in high power products. That is, the ceramic substrate of the present invention can be applied to a high-power or high-brightness LED to be 'in addition' bonded to the substrate through the solder layer to reduce the use of the thermal conductive vinegar, and 201004546 also has the effect of reducing the cost. Covered by the scope of the invention patent. Figure 1 is a structural sectional view of a conventional ceramic substrate structure; Figure 2 is a structural sectional view of a ceramic substrate structure having a heat dissipation function of the present invention; and Figures 3A to 3F It is a manufacturing flow chart of the ceramic substrate structure with heat dissipation function of the present invention. [Main component symbol description] 1 Ceramic substrate structure 11 Ceramic substrate 12 Thermal conduction channel 15 Solder layer 16 Printed circuit board 2 Ceramic substrate structure 21 Ceramic substrate 211 First surface 212 Second surface 201004546 213 Ceramic thin plate 214 Raw green sheet 215 Hole 216 Depression 22 Heat conduction channel 23 Solderable metal layer 24 Solder layer 241 Solder 25 Solder layer 26 Printed circuit board