TW200943508A - Multilayer package substrate and method for fabricating the same - Google Patents
Multilayer package substrate and method for fabricating the sameInfo
- Publication number
- TW200943508A TW200943508A TW97113142A TW97113142A TW200943508A TW 200943508 A TW200943508 A TW 200943508A TW 97113142 A TW97113142 A TW 97113142A TW 97113142 A TW97113142 A TW 97113142A TW 200943508 A TW200943508 A TW 200943508A
- Authority
- TW
- Taiwan
- Prior art keywords
- package substrate
- forming
- layer
- conductive via
- multilayer package
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A multilayer package substrate and a method for fabricating the same are provided. The method includes: forming a first dielectric layer and a first circuit layer thereon on a carrier board, wherein a first conductive via for electrical connection with the first circuit layer is formed in the first dielectric layer; forming a built-up structure on the first dielectric layer and the first circuit layer; removing the carrier board to expose a bottom portion formed in the first conductive via; forming a first solder mask layer on the first dielectric layer and above the first conductive via; and forming a first opening in the first solder mask layer to expose the bottom portion of the first conductive via, thus allowing the bottom portion to function as a first electrically contacting pad. With the method, a coreless multilayer package substrate is fabricated so as to form a fine-pitch circuit structure and streamline the fabrication process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97113142A TWI354356B (en) | 2008-04-11 | 2008-04-11 | Multilayer package substrate and method for fabric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97113142A TWI354356B (en) | 2008-04-11 | 2008-04-11 | Multilayer package substrate and method for fabric |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200943508A true TW200943508A (en) | 2009-10-16 |
| TWI354356B TWI354356B (en) | 2011-12-11 |
Family
ID=44869028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97113142A TWI354356B (en) | 2008-04-11 | 2008-04-11 | Multilayer package substrate and method for fabric |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI354356B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9159614B2 (en) | 2013-06-11 | 2015-10-13 | Zhen Ding Technology Co., Ltd. | Packaging substrate and method for manufacturing same |
| US9485863B2 (en) | 2012-06-18 | 2016-11-01 | Unimicron Technology Corp. | Carrier and method for fabricating coreless packaging substrate |
| TWI595613B (en) * | 2014-11-18 | 2017-08-11 | 矽品精密工業股份有限公司 | Semiconductor package and fabrication method thereof |
| US9780022B2 (en) | 2015-07-15 | 2017-10-03 | Phoenix Pioneer Technology Co., Ltd. | Substrate structure |
| TWI616981B (en) * | 2015-07-15 | 2018-03-01 | 恆勁科技股份有限公司 | Substrate structure |
| TWI620274B (en) * | 2015-07-15 | 2018-04-01 | 恆勁科技股份有限公司 | Manufacturing method of substrate structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112599424A (en) * | 2020-12-16 | 2021-04-02 | 南通越亚半导体有限公司 | Manufacturing method of ultrathin substrate structure |
-
2008
- 2008-04-11 TW TW97113142A patent/TWI354356B/en active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9485863B2 (en) | 2012-06-18 | 2016-11-01 | Unimicron Technology Corp. | Carrier and method for fabricating coreless packaging substrate |
| US9159614B2 (en) | 2013-06-11 | 2015-10-13 | Zhen Ding Technology Co., Ltd. | Packaging substrate and method for manufacturing same |
| TWI595613B (en) * | 2014-11-18 | 2017-08-11 | 矽品精密工業股份有限公司 | Semiconductor package and fabrication method thereof |
| US9780022B2 (en) | 2015-07-15 | 2017-10-03 | Phoenix Pioneer Technology Co., Ltd. | Substrate structure |
| TWI616981B (en) * | 2015-07-15 | 2018-03-01 | 恆勁科技股份有限公司 | Substrate structure |
| TWI620274B (en) * | 2015-07-15 | 2018-04-01 | 恆勁科技股份有限公司 | Manufacturing method of substrate structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI354356B (en) | 2011-12-11 |
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