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TW200936520A - Cutting wheel and manufacturing method thereof - Google Patents

Cutting wheel and manufacturing method thereof Download PDF

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Publication number
TW200936520A
TW200936520A TW97106802A TW97106802A TW200936520A TW 200936520 A TW200936520 A TW 200936520A TW 97106802 A TW97106802 A TW 97106802A TW 97106802 A TW97106802 A TW 97106802A TW 200936520 A TW200936520 A TW 200936520A
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TW
Taiwan
Prior art keywords
cutter wheel
cutting
wheel structure
substrate
layer
Prior art date
Application number
TW97106802A
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Chinese (zh)
Inventor
Xiao-Guo Zhang
Ming-Hui Wang
Original Assignee
Kinik Co
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Application filed by Kinik Co filed Critical Kinik Co
Priority to TW97106802A priority Critical patent/TW200936520A/en
Publication of TW200936520A publication Critical patent/TW200936520A/en

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Abstract

The present invention relates to the structure of a cutting wheel, which comprises a substrate and a cutting layer, wherein having a coating layer of the substrate and the cutting layer is formed on the coating layer. The present also discloses a method for manufacturing the same as above-mentioned.

Description

200936520 九、發明說明: 【發明所屬之技術領域】 本發明係關於-種切割玻璃之刀輪結構及 法,特別是有關於-種刀緣與刀輪基材之間具有不 5 之刀輪結構及其製作方法》 冋厚度 【先前技術】 ® 77輪之切割方式係使用硬度較高之材質作切判,因此 應用範圍廣泛,可用於玻璃切割、晶片切割、電路板切割、 10醫療切割器具、化學機械研磨(CMP)修整碟、家庭曰用刀 具、特殊電極、金屬複合散熱片及砂輪修刀等用途。傳統 之刀輪設計’多為使用同一硬質材料製成,其結構包括有 具有-定厚度之-切割刀輪,其兩側分別具有一環面,環 面的外徑延伸處為切割環端作為刀輪之切割端,可對玻 15 璃、晶圓等進行切割。 ❹ ,而且,傳統刀輪的製造,除了如前述係以同一硬質材 料製成之外,刀輪在研磨加工後會導致刀刃表面過於光 /月因此,在切割玻璃或基板表面時,刀輪會產生滑動, 使得玻璃表面無法產生有效的裂紋,如此一來,容易造成 20 玻璃的破碎,而增加生產成本。 日本公開專利第JP2007-031200號中揭露了一種利用 雷射或研磨方法,切削鐵石層使鑽石層形成兩斜面,而兩 斜面形成V字型之刀緣。雷射照射鑽石層產生條紋,其可防 止刀輪在玻璃表面滑動,且施加在刀具上的力道會成為垂 5 200936520 5 ❹ 10 15 ❹ 20 直方向的力量以切割玻璃。然而,JP2007-031200係使用燒 結形成鑽石膜,其成本生產成本較高,且無法大量製造所 需刀輪。另外,德國專利DE19753092係揭露一種利用化學 沉積法在刀輪表面鑛覆多晶鐵石層,然而,DE19753092係 直接在研磨成型後的刀輪上形成CVD鑽石層,因此,在刀 輪表面上係形成厚度均一之鑽石層。另外,曰本專利 JP6219762中揭露一種利用CVD成膜方法在刀輪表面上形 成一鑽石鍍覆層(1-10μιη) ’鑽石鍍覆層具有鑽石顆粒,且 刀輪基座的材質是由超硬合金’例如W或]vto所構成, JP6219762是先切割研磨成型成刀輪結構,之後在刀刀部上 形成厚度均一的錢石層。 承接上述,由於習知之刀輪基材與鑽石鍍覆層之間具 有固定之距離,因此,刀刃部之硬度不足,使得刀輪在切 割時不易刺入玻璃表面,而影響其切割品質及效率。 因此,目前仍亟需一種能提升切割效率及品質、有效 降低製作成本且易於操作等之刀輪及其製造方法。 【發明内容】 有鑑於上述課題,本發明之目的係在提供一種刀輪結 構,其可提尚刀輪的耐衝擊性、正向及侧向支撐力。 本發明之另一目的係在提供一種刀輪結構,其可有效 地提升切割品質與效率。200936520 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a cutter wheel structure and method for cutting glass, and more particularly to a cutter wheel structure having a cutting edge between a blade edge and a cutter wheel substrate. And its manufacturing method 冋 Thickness [Prior Art] ® 77-round cutting method is based on the use of higher hardness materials, so it can be used in a wide range of applications, such as glass cutting, wafer cutting, circuit board cutting, 10 medical cutting instruments, Chemical mechanical polishing (CMP) dressing discs, household cutting tools, special electrodes, metal composite heat sinks and grinding wheel repairs. The traditional cutter wheel design is mostly made of the same hard material, and its structure includes a cutting wheel with a certain thickness, each of which has a torus on both sides, and the outer diameter of the torus extends as a cutting ring end as a knife. The cutting end of the wheel can cut glass, wafers, etc. ❹ Moreover, the manufacture of the conventional cutter wheel, except that it is made of the same hard material as described above, causes the blade surface to be too light/month after the grinding process. Therefore, when cutting the surface of the glass or the substrate, the cutter wheel will Sliding occurs, so that the glass surface cannot produce effective cracks, which is easy to cause breakage of 20 glass and increase production cost. Japanese Laid-Open Patent Publication No. JP2007-031200 discloses a method of using a laser or a grinding method to cut a layer of iron to form a bevel of a diamond layer, and the two bevels form a V-shaped edge. The laser illuminates the diamond layer to create streaks that prevent the cutter wheel from sliding over the glass surface, and the force exerted on the tool will become a vertical force in the direction of the glass. However, JP2007-031200 uses a sintered diamond to form a diamond film, which is costly to produce and cannot manufacture a large number of required cutter wheels. In addition, the German patent DE19753092 discloses a method of depositing a polycrystalline iron layer on the surface of a cutter wheel by a chemical deposition method. However, DE19753092 forms a CVD diamond layer directly on the grinding wheel after the grinding, so that it is formed on the surface of the cutter wheel. A layer of diamond of uniform thickness. In addition, the patent JP6219762 discloses a diamond plating layer (1-10μιη) formed on the surface of the cutter wheel by a CVD film forming method. The diamond plating layer has diamond particles, and the material of the cutter wheel base is made of super hard. The alloy 'such as W or 'vto' is composed of JP6219762, which is first cut and ground into a cutter wheel structure, and then a carbon stone layer having a uniform thickness is formed on the blade portion. In view of the above, since the conventional cutter wheel substrate and the diamond plating layer have a fixed distance, the hardness of the blade portion is insufficient, so that the cutter wheel is not easily penetrated into the glass surface during cutting, which affects the cutting quality and efficiency. Therefore, there is still a need for a cutter wheel and a method of manufacturing the same that can improve cutting efficiency and quality, effectively reduce manufacturing costs, and are easy to operate. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a cutter wheel structure which can improve the impact resistance, forward and lateral support forces of the cutter wheel. Another object of the present invention is to provide a cutter wheel structure which can effectively improve cutting quality and efficiency.

一切割層,其t基材具有一鍍覆面,而 輪,包括一基 而切割層係形 6 200936520 成於基材之鑛覆面上。切割層之外圍具有—由兩研磨面所 構成之刀緣’研磨面與鍍覆面呈非平行排列。 依照本發明較佳實施例所述之刀輪結構,其中每一研 磨面具有相同的斜率或不同的斜率。 5 10 15 ❹ 20 依照本發明較佳實施例所述之刀輪結構,其中切割層 之刀緣係為平滑或非平滑之曲線,切割層之刀緣具有多個 銳角結構,切割層之刀緣為規則或不規則排列之凹凸結 構’凹凸結構為鈍角 '銳角及其組合。 依照本發明較佳實施例所述之刀輪結構,其中切割層 係選自化學氣相沉積(CVD)多晶鑽石膜、單晶鑽石膜: 奈米鑽石膜、鑽石顆粒與金屬黏合劑合成之燒結鐵石體、 立方氮化硼顆粒與金屬#合劑合成之燒結立方氮化侧體或 其組合。 依照本發明較佳實施例所述之刀輪結構,其中基材係 包括燒結物、陶瓷、硬質合金、硼碳化物、矽碳化物、鋁 氣化物、棚氣化物、矽氮化物、矽氧化物、硼氧化物、模 具鋼材、鎢鋼、高硬度合金鋼、高碳鋼及其組合。 依照本發明較佳實施例所述之刀輪結構,更包括一軸 孔貫穿設置於基材内。 依照本發明較佳實施例所述之刀輪結構,其中軸孔為 平滑曲線之封閉圖案或多邊形之封閉圖案或由複數個連續 設置之凹凸部所構成。 為達上述目的或其他目的,本發明另提供一種刀輪之 製作方法,其包括下列步驟:(a)提供一圓柱形基材,基材 7 200936520 具有一鍍覆面;(b)形成一切割層於基材之鍍覆面上;(幻切 割圓柱形基材為複數個刀輪單元;以及(d)研磨每一刀輪單 元之切割層,使切割層之外圍具有一由兩研磨面所構成之 刀緣’兩研磨面與鍍覆面呈非平行排列。 5 依照本發明較佳實施例所述之刀輪製作方法,其中每 一研磨面具有相同的斜率或不同的斜率。 根據本發明較佳實施例所述之刀輪製作方法,更包括 形成一轴孔之步驟於步驟(a)、(b)、(c)、或(d)之後完成,而 形成刀輪軸孔之步驟係包括放電切割或機械加工法。 10 根據本發明較佳實施例所述之刀輪製作方法,其中研 磨切割層使切割層之外圍具有一刀緣之步驟係包括機械研 磨或放電加工之方法。 依照本發明較佳實施例所述之刀輪製作方法,其中切 割層係選自化學氣相沉積(CVD)多晶鑽石膜、單晶鑽石 15膜、奈米鑽石膜、鑽石顆粒與金屬黏合劑合成之燒結鑽石 體、立方氮化硼顆粒與金屬黏合劑合成之燒結立方氮化硼 ❿ 體及其組合。 依照本發明較佳實施例所述之刀輪製作方法,其中基 材係包括燒結物、陶瓷及硬質合金及其組合,基材包括2 20碳化物、矽碳化物、鋁氮化物、硼氮化物、矽氮化物、矽 氧化物、硼氧化物、模具鋼材、鎢鋼、高硬度合金鋼、高 碳鋼及其組合。 依照本發明較佳實施例所述之刀輪製作方法,其中切 割層之刀緣係為平滑或非平滑之曲線。 8 200936520 依照本發明較佳實施例所述之刀輪製作方法,其中步 驟⑷之後更包括-步驟⑷’其係將切割層之刀緣加工形成 具有多個銳角結構、規則或不規則排列之凹凸結構。其中 凹凸結構為鈍角、銳角及其組合。 ' 5 依照本發明較佳實施例所述之刀輪製作方法,其中包 括形成具有平滑曲線封閉圖案或多邊形封閉圖案之軸孔。 其中軸孔由複數個連續設置之凹凸部所構成。 綜上所述,在本發明之刀輪及其製作方法中,係將切 割層形成於基材之表面,之後將所形成之結構切割成複數 1〇個刀輪單元,因此,切割層之研磨面與基材表面呈非平行 排列設置,如此-來,可大幅提高刀輪切割層的正向與側 面支撐力,並有效地增加刀輪切割的品質及效率。 ▲為讓本發明之上述和其他㈣、特徵和優點能更明顯 易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說 15 明如下。 © 【實施方式】 圖2繪示本發明一較佳實施例之刀輪結構的結構示意 圖。圖la至圖id為圖2之刀輪結構的製作流程示意圖。請同 2〇 料閱圖U至圖1d及圖2,首先,如圖la至圖lb所緣示,係 提供一圓柱狀基材100,基材具有一鍍覆面1〇1,接著,形 成一切割層110於基材鍍覆面1〇1之上。在本實施例中,基 材100之材料可以例如是但不限制於在此所描述的材料 t,基材100提供承載之性質,任何具有硬度可提供後續切 9 200936520 5 ❹ 10 15 割層支撐的材質均被考慮且涵蓋在本發明的範圍中,此種 材料例如是金屬或非金屬碳化物與金屬黏合劑合成之燒結 體、金屬或非金屬氮化物與金屬黏合劑合成之燒結體、金 屬或非金屬氧化物與金屬黏合劑合成之燒結體、陶瓷及硬 質合金等。其中燒結體例如是但不限制於硼碳化物、矽碳 化物、鋁氮化物、硼氮化物、矽氮化物,矽氧化物或硼氧 化物,硬質合金例如是但不限制於模具鋼材、鎢鋼、高硬 度合金鋼、高碳鋼等。 t月繼續參閱圖1 b,在本實施例中,切割層1 1 〇之材質沒 有特殊限制,只要為硬質材質且可作為切割之用途均被考 慮且涵蓋在本發明的範圍中。其中切割層110的材料例如是 但不限制於化學氣相沉積(CVD)鑽石膜、多晶鑽石膜、 單晶鑽石膜、奈米鑽石膜、鑽石顆粒與金屬黏合劑合成之 燒、鐵石體、立方氮化棚顆粒與金屬黏合劑合成之燒結立 方氮化硼體等。 接著,請參閱圖lc,沿著切割線L,將圖lb所形成之結 構切割形成複數個刀輪單元u,以使每一刀輪單元u具有 基材100以及在基材之鍍覆面1〇1上形成之切割層11〇。之 後,機械研磨或放電加工切割層110,使切割層110之外圍 形成有刀緣111,刀緣呈V字形且具有平滑曲線,係如圖2 所、’S示。值得注意的是,在本實施例中,研磨切割層1 1 〇使 其形成具有相同斜率之兩研磨面130,130,,且此硏磨面 130,130’係構成本發明之刀輪結構的刀緣lu。 20 200936520 5 ❹ 10 15 ❹ 由於本發明先在基材1 〇〇上形成切割層丨丨〇,之後再切 割並研磨切割層110以形成刀緣m,因此,構成刀緣之研 磨面130,130’與基材表面之間為非平行設置換言之本發 明之刀輪結構的刀緣與基材之間具有最大的距離,而沿著 刀緣向外侧延伸之研磨面與基材之間的距離係逐漸遞減 之。如此一來,本發明之刀輪結構的研磨面與基材之間的 厚度不同,切割刀緣111頂部具有最大厚度,可以承受更大 的正向壓力,並且有效地將壓力傳遞至待切物表面形成規 則缺陷或裂紋,因此,可大幅提高刀輪切割時之切割層的 正向與側面支撐力,以有效地增加刀輪的切割品質。 承接上述,要說明的是,在本實施例中,於前述任一 步驟之後,係在基材1 〇〇内形成軸孔丨2〇,軸孔i 2〇係貫穿設 置於基材100且具有平滑曲線之封閉圖案,而形成軸孔12〇 的方法例如是放電切割或或機械加工之方法。 除此之外,請參閱圖3,除了前述形成具有相同斜率之 研磨面之外,在本實施例中,可以形成具有不同斜率的研 磨面 130,131。 接著’請參閱圖4a及4b,為本發明另一較佳實施例之 刀輪結構的剖面示意圖,本實施例之刀輪結構與上述實施 例不同之處在於,本實施例之刀輪結構的刀緣丨“為非平滑 曲線,其係加工刀緣111使其具有多個銳角結構41〇,或是 具有複數個規則或不規則排列之凹凸結構4U,其中凹凸結 構411可以例如是鈍角、銳角及其組合。要說明的是,本實 施例之銳角結構410或是凹凸結構411的形狀並沒有特殊限 20 200936520 制,只要可以使刀輪具有切割效果的形狀均在本發明之範 疇中。由於本發明的刀輪結構在刀緣為非平滑曲線,且本 發明之刀輪結構的刀緣與基材之間的厚度不同,因此,刀 輪在切割時可加強刀緣的硬度’使得刀緣有效地刺入待切 物之表面,且可以避免刀輪在待切割物之表面上滑動,如 此一來,可提升刀輪的切割效率及切割品質。 另外,請參閲圖5a及5b,係為本發明又一較佳實施例A cut layer having a t-substrate having a plated surface and a wheel comprising a base and a cut layer system 6 200936520 formed on the ore cover of the substrate. The periphery of the cutting layer has a non-parallel arrangement of the abrasive surface of the blade edge formed by the two abrasive faces. A cutter wheel structure according to a preferred embodiment of the present invention, wherein each of the grinding faces has the same slope or a different slope. 5 10 15 ❹ 20 The cutter wheel structure according to the preferred embodiment of the present invention, wherein the cutting edge has a smooth or non-smooth curve, and the cutting edge has a plurality of acute angle structures, and the cutting edge of the cutting layer The concave-convex structure of the regular or irregular arrangement is an obtuse angle and an acute angle. The cutter wheel structure according to the preferred embodiment of the present invention, wherein the cutting layer is selected from the group consisting of a chemical vapor deposition (CVD) polycrystalline diamond film and a single crystal diamond film: a nano diamond film, a diamond particle and a metal binder. Sintered iron body, cubic boron nitride particles and metal # a mixture of sintered cubic nitride side bodies or a combination thereof. A cutter wheel structure according to a preferred embodiment of the present invention, wherein the substrate comprises a sintered body, a ceramic, a cemented carbide, a borocarbide, a tantalum carbide, an aluminum vapor, a shed gas, a tantalum nitride, a tantalum oxide. , boron oxide, mold steel, tungsten steel, high hardness alloy steel, high carbon steel and combinations thereof. The cutter wheel structure according to the preferred embodiment of the present invention further includes a shaft hole disposed through the substrate. A cutter wheel structure according to a preferred embodiment of the present invention, wherein the shaft hole is a closed pattern of a smooth curve or a closed pattern of a polygon or a plurality of continuously disposed concave and convex portions. In order to achieve the above object or other objects, the present invention further provides a method for manufacturing a cutter wheel, comprising the steps of: (a) providing a cylindrical substrate, the substrate 7 200936520 having a plated surface; and (b) forming a cutting layer. On the plated surface of the substrate; (the phantom-cut cylindrical substrate is a plurality of cutter wheel units; and (d) grinding the cutting layer of each cutter wheel unit such that the periphery of the cutting layer has a knife composed of two abrasive surfaces The two abrasive surfaces are arranged in a non-parallel manner with the plated surface. 5 A method for manufacturing a cutter wheel according to a preferred embodiment of the present invention, wherein each of the abrasive surfaces has the same slope or a different slope. According to a preferred embodiment of the present invention. The method for manufacturing a cutter wheel, further comprising the step of forming a shaft hole is completed after the step (a), (b), (c), or (d), and the step of forming the shaft hole of the cutter wheel comprises discharge cutting or mechanical The method of manufacturing a cutter wheel according to the preferred embodiment of the present invention, wherein the step of grinding the cutting layer to have a peripheral edge of the cutting layer comprises a method of mechanical grinding or electric discharge machining. The method for manufacturing a cutter wheel according to the embodiment, wherein the cutting layer is selected from the group consisting of a chemical vapor deposition (CVD) polycrystalline diamond film, a single crystal diamond 15 film, a nano diamond film, a diamond particle and a metal binder. a sintered cubic boron nitride body synthesized by a cubic boron nitride particle and a metal binder, and a combination thereof. The method for manufacturing a cutter wheel according to a preferred embodiment of the present invention, wherein the substrate comprises a sintered body, a ceramic and a cemented carbide And combinations thereof, the substrate comprises 2 20 carbide, niobium carbide, aluminum nitride, boron nitride, tantalum nitride, niobium oxide, boron oxide, mold steel, tungsten steel, high hardness alloy steel, high carbon steel The method for manufacturing a cutter wheel according to the preferred embodiment of the present invention, wherein the cutting edge of the cutting layer is a smooth or non-smooth curve. 8 200936520 A method for manufacturing a cutter wheel according to a preferred embodiment of the present invention , wherein the step (4) further comprises a step (4) of processing the edge of the cutting layer to form a concave-convex structure having a plurality of acute-angle structures, regular or irregularly arranged, wherein the concave-convex structure is obtuse, sharp The method of manufacturing a cutter wheel according to the preferred embodiment of the present invention includes forming a shaft hole having a smooth curved closed pattern or a polygonal closed pattern. The shaft hole is composed of a plurality of continuously disposed concave and convex portions. In summary, in the cutter wheel of the present invention and the manufacturing method thereof, the cutting layer is formed on the surface of the substrate, and then the formed structure is cut into a plurality of cutter wheel units, and thus, the cutting layer The grinding surface is arranged in a non-parallel arrangement with the surface of the substrate, so that the positive and side supporting forces of the cutting layer of the cutter wheel can be greatly improved, and the quality and efficiency of the cutting of the cutter wheel can be effectively increased. The above and other (four) features, advantages and advantages will be more apparent, and the preferred embodiments are described below, and in conjunction with the drawings, the details are as follows: © Embodiments FIG. 2 illustrates a preferred embodiment of the present invention. Schematic diagram of the structure of the cutter wheel structure of the embodiment. Figure la to Figure id is a schematic diagram of the manufacturing process of the cutter wheel structure of Figure 2. Please refer to FIG. 1 to FIG. 1d and FIG. 2 together. First, as shown in FIGS. 1a to 1b, a cylindrical substrate 100 is provided. The substrate has a plated surface 1〇1, and then a The cutting layer 110 is on the substrate plating surface 1〇1. In this embodiment, the material of the substrate 100 may be, for example, but not limited to, the material t described herein, the substrate 100 provides a bearing property, and any hardness may provide a subsequent cut 9 200936520 5 ❹ 10 15 cutting support The materials are all considered and are included in the scope of the present invention. Such materials are, for example, sintered bodies of metal or non-metal carbides and metal binders, sintered bodies of metals or non-metal nitrides and metal binders, and metals. Or sintered bodies, ceramics, and hard alloys synthesized from non-metal oxides and metal binders. The sintered body is, for example, but not limited to, a borocarbide, a lanthanum carbide, an aluminum nitride, a boron nitride, a tantalum nitride, a tantalum oxide or a boron oxide. The hard alloy is, for example but not limited to, a mold steel or a tungsten steel. , high hardness alloy steel, high carbon steel, etc. Referring to Fig. 1b, in the present embodiment, the material of the cutting layer 1 1 〇 is not particularly limited as long as it is a hard material and can be used as a cutting, and is encompassed in the scope of the present invention. The material of the cutting layer 110 is, for example, but not limited to, a chemical vapor deposition (CVD) diamond film, a polycrystalline diamond film, a single crystal diamond film, a nano diamond film, a composite of diamond particles and a metal binder, a stone body, Sintered cubic boron nitride body synthesized by cubic nitriding granules and metal binder. Next, referring to FIG. 1c, along the cutting line L, the structure formed by FIG. 1b is cut to form a plurality of cutter wheel units u such that each cutter wheel unit u has the substrate 100 and the plated surface of the substrate 1〇1. The cutting layer 11 上 formed thereon. Thereafter, the cut layer 110 is mechanically ground or electrically discharged so that the periphery of the cut layer 110 is formed with a blade edge 111 having a V-shape and a smooth curve as shown in Fig. 2 and 'S'. It should be noted that in the present embodiment, the cutting layer 1 1 is ground to form two abrasive surfaces 130, 130 having the same slope, and the honing surfaces 130, 130' constitute the cutter wheel structure of the present invention. Knife edge lu. 20 200936520 5 ❹ 10 15 ❹ Since the present invention first forms a dicing layer on the substrate 1 丨丨〇, then the dicing layer 110 is cut and ground to form the kerf m, thus forming the edging surface 130, 130 ' Non-parallel between the surface of the substrate and in other words the maximum distance between the edge of the cutter wheel structure of the present invention and the substrate, and the distance between the abrasive surface extending outward along the edge of the blade and the substrate Gradually decreasing. In this way, the thickness of the grinding surface of the cutter wheel structure of the present invention is different from the thickness of the substrate, and the top of the cutting edge 111 has a maximum thickness, can withstand a greater positive pressure, and effectively transmits pressure to the object to be cut. Regular defects or cracks are formed on the surface, so that the positive and side support forces of the cutting layer when the cutter wheel is cut can be greatly improved to effectively increase the cutting quality of the cutter wheel. In the above embodiment, in the present embodiment, after any of the foregoing steps, a shaft hole 丨 2 形成 is formed in the substrate 1 , and the shaft hole i 2 贯穿 is disposed through the substrate 100 and has The closed pattern of the smooth curve, and the method of forming the shaft hole 12〇 is, for example, a method of discharge cutting or machining. In addition to this, referring to Fig. 3, in addition to the aforementioned formation of the abrasive faces having the same slope, in the present embodiment, the grinding faces 130, 131 having different slopes can be formed. 4a and 4b are schematic cross-sectional views showing a structure of a cutter wheel according to another embodiment of the present invention. The cutter wheel structure of the present embodiment is different from the above embodiment in the structure of the cutter wheel of the present embodiment. The blade edge 丨 is a non-smooth curve which is formed by the blade edge 111 to have a plurality of acute angle structures 41 〇 or a plurality of regular or irregularly arranged relief structures 4U, wherein the relief structure 411 can be, for example, an obtuse angle or an acute angle And the combination thereof. It should be noted that the shape of the acute angle structure 410 or the concave-convex structure 411 of the present embodiment is not limited to 20 200936520, as long as the shape that can make the cutter wheel have a cutting effect is within the scope of the present invention. The cutter wheel structure of the present invention has a non-smooth curve at the edge of the blade, and the thickness of the blade edge of the cutter wheel structure of the present invention is different from that of the substrate. Therefore, the cutter wheel can strengthen the hardness of the blade edge when cutting. Effectively pierce the surface of the object to be cut, and can avoid the sliding of the cutter wheel on the surface of the object to be cut, thereby improving the cutting efficiency and cutting quality of the cutter wheel. In addition, please refer to FIG. 5a 5b, a further preferred embodiment of the system of the present invention

之刀輪結構的剖面示意圖,本實施例之刀輪結構與上述實 施例不同之處在於’本實施例之刀輪結構之軸孔12〇係為多 邊形之封閉圖案,纟中轴孔可以例如是由複數個連續設置 10 之凹凸部5(H所構成。當然,本發明之刀輪結構的軸孔並不 限定於圖式料示,任何具有連續設置之凹凸部結構,使 刀輪具切割效果的軸孔均在本發明之範_。由於本發明 15The cross-sectional view of the cutter wheel structure of the present embodiment is different from the above embodiment in that the shaft hole 12 of the cutter wheel structure of the embodiment is a polygonal closed pattern, and the middle shaft hole can be, for example, It is composed of a plurality of concavo-convex portions 5 (H) which are continuously disposed 10. Of course, the shaft hole of the cutter wheel structure of the present invention is not limited to the drawings, and any concavo-convex structure having continuous arrangement enables the cutter wheel to have a cutting effect. The shaft holes are all in the scope of the present invention.

之刀輪結構的減為多邊形之封_案且本發明之刀輪结 構的刀緣與基材之間的厚度不同,_,在㈣ 刀輪的震動頻率,以提升刀輪的切割效率。 上述實施例僅係為了方便說明而舉例而已, 主張之權利範圍自應以巾請專利範圍所述為準,^ 於上述實施例。 汗1重限 2〇 【圖式簡單說明】 圖1 a至1 d係為本發明—較佳實施例 流程示意圖。 圖2係為本發明一較佳實施例之刀 圖0 之刀 輪結構的製作 輪結構的結構示 意 12 200936520 圖3係為本發明一較佳實施例之刀輪 圖,其中研磨面具有不同斜率。 菁的-構示意 面示意圖 圖4a至4b係為本發明另—較佳實施例之刀輪結構的。 圖5a及5b係為本發明又—較佳實施例之 面示意圖》 輪結構的剖 【主要元件符號說明】 11 刀輪單元 411 凹凸結構 100 基材 501 凹凸部 101 鍍覆面 502 溝槽 110 切割層 L 切割線 111 刀緣 130, 130’,131研磨面 120 轴孔 410 銳角結構 ❹ 10 13The cutter wheel structure is reduced to a polygonal seal _ case and the thickness of the cutter wheel structure of the present invention is different from the thickness of the substrate, _, at (4) the vibration frequency of the cutter wheel to improve the cutting efficiency of the cutter wheel. The above embodiments are merely examples for convenience of description, and the scope of the claims is based on the above-mentioned embodiments.汗1重限2〇 [Simplified illustration of the drawings] Figures 1a to 1d are schematic views of the flow of the preferred embodiment of the invention. 2 is a structural schematic diagram of a manufacturing wheel structure of a cutter wheel structure of the blade of FIG. 0 according to a preferred embodiment of the present invention. 200936520 FIG. 3 is a view of a cutter wheel according to a preferred embodiment of the present invention, wherein the grinding surface has different slopes. . BRIEF DESCRIPTION OF THE DRAWINGS Figure 4a to 4b show the structure of a cutter wheel according to another preferred embodiment of the present invention. 5a and 5b are cross-sectional views of a preferred embodiment of the present invention. [Main element symbol description] 11 Cutter wheel unit 411 Concavo-convex structure 100 Substrate 501 Concave portion 101 Plated surface 502 Groove 110 Cutting layer L cutting line 111 knife edge 130, 130', 131 grinding surface 120 shaft hole 410 acute angle structure ❹ 10 13

Claims (1)

200936520 十、申請專利範圍: 1. 一種刀輪結構,包括: 一基材’具有一鍍覆面;以及 5 Ο 10 15 ❹ 一切割層,係形成於該基材之鍍覆面上,該切割層之 外圍具有一由兩研磨面所構成之刀緣,其中該些研磨面與 該锻覆面呈非平行排列。 2.如申請專利範圍第1項所述之刀輪結構,其中每一 該些研磨面具有相同的斜率。 3_如申請專利範圍第1項所述之刀輪結構,其中每一 該些研磨面之斜率不同。 4. 如申請專利範圍第〗項所述之刀輪結構,其中該切 割層之刀緣係為平滑或非平滑之曲線。 5. 如申請專利範圍第4項所述之刀輪結構,其中該切 割層之刀緣具有多個銳角結構。 6. 如申請專利範圍第4或5項所述之刀輪結構,其中該 切割層之刀緣為規則或不規則排列之凹凸結構。 7. 如申請專利範圍第6項所述之刀輪結構,其中該凹 凸結構為鈍角、銳角及其組合。 8.如_請專利範圍第!項所述之刀輪結構, 甘 割層係選自化學氣相沉積(CVD)多晶鑽石祺、單晶鑽石 膜、奈米鑽石膜、鐵石顆粒與金屬黏合劑合咸之^ 體、立方氮化硼顆粒與金屬黏合劑合 、·" 體及其組合。 舞“成之燒結立方氮化珊 20 200936520 9. 如申請專利範圍第1項所述之刀輪結構,其中該基材 係包括燒結物、陶瓷、硬質合金及其組合。 5 Ο 10 15 Ο 20 10. 如申請專利範圍第9項所述之刀輪結構,其中該基 材包括硼碳化物、矽碳化物、鋁氮化物、硼氮化物、矽氮 化物、矽氧化物、硼氧化物、模具鋼材、鎢鋼、高硬度合 金鋼、高碳鋼及其組合。 11. 如申請專利範圍第丨項所述之刀輪結構,更包括一 軸孔貫穿設置於該基材内。 12. 如申請專利範圍第1項所述之刀輪結構,其中該軸 孔為平滑曲線之封閉圖案。 13. 如申請專利範圍第1項所述之刀輪結構,其中該軸 孔為多邊形之封閉圖案。 如申請專利範圍第i項所述之刀輪結構,其中該軸 孔由複數個連續設置之凹凸部所構成。 15. —種刀輪之製作方法,包括下列步驟: (a) 提供一圓柱形基材,該基材具有一鍍覆面 (b) 形成一切割層於該基材之鍍覆面上; (c) 切割該圓柱形基材為複數個刀輪單元;以及 (d) 研磨每-該些刀輪單元之切割層,使㈣割層之外 呈;平磨面所構成之刀緣,兩研磨面與該鍵覆面 其中每一該些 16.如申請專利範圍第15項所述之方法, 研磨面具有相同的斜率。 15 200936520 17.如申請專利範圍第15項所述之方法,其中每一該 些研磨面之斜率不同。 5 Q 10 15 ❹ 20 A如申請專利_第15項所述之方法,更包括形成一 軸孔之步驟,形成該軸孔之㈣係於該步驟⑷、⑻、⑷' 或(d)之後完成。 19·如申請專利範圍第18項所述之方法,其中形成該刀 輪軸孔之步驟係包括放電切割或機械加工法。 20. 如申請專利範圍第15項所述之方法,其中研磨該切 割層使該㈣層之外圍具有—刀緣之步驟係包括機械研磨 或放電加工之方法。 21. 如申請專利範圍第15項所述之方法,其中該切割 層係選自化學氣相沉積(CVD)多晶鑽石膜、單晶鑽石膜、 奈米鑽石膜、鑽石顆粒與金屬黏合劑合成之燒結鑽石體、 立方氮化硼顆粒與金屬黏合劑合成之燒結立方氮化硼體及 其組合。 22·如申請專利範圍第15項所述之方法,其中該基材 係包括燒結物、陶瓷及硬質合金及其組合。 23. 如申請專利範圍第22項所述之方法,其中該基材 包括硼碳化物、矽碳化物、鋁氮化物、硼氮化物、矽氮化 物、矽氧化物、硼氧化物、模具鋼材、鎢鋼、高硬度合金 鋼、高碳鋼及其組合。 24. 如申請專利範圍第丨5項所述之方法,其中該切割 層之刀緣係為平滑或非平滑之曲線。 16 200936520 5 25·如申請專利範圍第15項所述之方法,其中該 之後更包括一步驟(e),係將該切割層之刀緣加工形成 具有多個銳角結構、規則或不規則排列之凹凸結構 %如申請專利範圍第25項所述之方法,:中該 結構為鈍角、銳角及其組合。 、β ❹ 10 27. 如申請專利範圍第18項所述之 成具有平滑曲線封閉圖案或多邊形封二中,括形 28. 如申請專利範圍第27項所述之方t之該軸孔。 由複數個連續設置之凹凸部所構成。方去,其中該軸孔 ❹ 17200936520 X. Patent application scope: 1. A cutter wheel structure comprising: a substrate having a plated surface; and a 5 Ο 10 15 ❹ cutting layer formed on a plated surface of the substrate, the cutting layer The periphery has a blade edge formed by two abrasive faces, wherein the abrasive faces are non-parallel to the forged face. 2. The cutter wheel structure of claim 1, wherein each of the abrasive faces has the same slope. 3_ The cutter wheel structure of claim 1, wherein each of the abrasive faces has a different slope. 4. The cutter wheel structure of claim 1, wherein the cutting edge of the cutting layer is a smooth or non-smooth curve. 5. The cutter wheel structure of claim 4, wherein the cutting edge of the cutting layer has a plurality of acute angle structures. 6. The cutter wheel structure of claim 4, wherein the cutting edge of the cutting layer is a regular or irregularly arranged relief structure. 7. The cutter wheel structure of claim 6, wherein the concave and convex structure is an obtuse angle, an acute angle, and a combination thereof. 8. Such as _ please patent scope! The cutter wheel structure described in the item is a chemical vapor deposition (CVD) polycrystalline diamond crucible, a single crystal diamond film, a nano diamond film, a stone particle and a metal binder, and a cubic nitrogen. Boron granules and metal binders, ·" bodies and combinations thereof. The sinter-sintered cubic nitrite 20 200936520 9. The cutter wheel structure of claim 1, wherein the substrate comprises a sinter, a ceramic, a cemented carbide, and combinations thereof. 5 Ο 10 15 Ο 20 10. The cutter wheel structure of claim 9, wherein the substrate comprises borocarbide, niobium carbide, aluminum nitride, boron nitride, tantalum nitride, niobium oxide, boron oxide, mold Steel, tungsten steel, high-hardness alloy steel, high-carbon steel and combinations thereof. 11. The cutter wheel structure according to the scope of claim 2, further comprising a shaft hole disposed in the base material. The cutter wheel structure of the first aspect, wherein the shaft hole is a closed curve of a smooth curve. The cutter wheel structure according to claim 1, wherein the shaft hole is a closed pattern of a polygon. The cutter wheel structure of the invention of claim i, wherein the shaft hole is composed of a plurality of continuously arranged concave and convex portions. 15. A method for manufacturing a cutter wheel, comprising the following steps: (a) providing a cylindrical substrate , the substrate has a plated surface (b) forming a cut layer on the plated surface of the substrate; (c) cutting the cylindrical substrate into a plurality of cutter wheel units; and (d) grinding each of the cutter layers of the cutter wheel unit And (4) outside the cut layer; the edge of the flat surface formed by the flat surface, the two polished surfaces and the key cover each of the 16. The method described in claim 15 has the same slope The method of claim 15, wherein the slope of each of the abrasive surfaces is different. 5 Q 10 15 ❹ 20 A, as in the method of claim 15, further comprising forming The step of forming a shaft hole, and forming the shaft hole (4) is completed after the step (4), (8), (4)' or (d). The method of claim 18, wherein the step of forming the shaft hole of the cutter wheel The method of claim 15, wherein the step of grinding the cutting layer to have a periphery of the (four) layer comprises a method of mechanical grinding or electrical discharge machining. 21. If the scope of patent application is 15 The method wherein the cutting layer is selected from the group consisting of a chemical vapor deposition (CVD) polycrystalline diamond film, a single crystal diamond film, a nano diamond film, a diamond particle and a metal binder, and a cubic boron nitride particle. The method of claim 15, wherein the substrate comprises a sintered body, a ceramic, a cemented carbide, and a combination thereof. The method of claim 22, wherein the substrate comprises borocarbide, niobium carbide, aluminum nitride, boron nitride, tantalum nitride, niobium oxide, boron oxide, mold steel, tungsten steel, High hardness alloy steel, high carbon steel and combinations thereof. 24. The method of claim 5, wherein the cutting edge of the cutting layer is a smooth or non-smooth curve. The method of claim 15, wherein the method further comprises a step (e) of processing the edge of the cutting layer to form a plurality of acute-angled structures, regular or irregularly arranged. The uneven structure % is as described in claim 25, wherein the structure is an obtuse angle, an acute angle, and a combination thereof. , β ❹ 10 27. As described in claim 18, having a smooth curved closed pattern or a polygonal seal, the shape is 28. The axial hole of the square t as described in claim 27 of the patent application. It consists of a plurality of concavities and convex portions that are continuously arranged. Fang go, where the shaft hole ❹ 17
TW97106802A 2008-02-27 2008-02-27 Cutting wheel and manufacturing method thereof TW200936520A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571340B (en) * 2013-05-24 2017-02-21 三星鑽石工業股份有限公司 Cutter wheel and its manufacturing method
TWI610896B (en) * 2016-11-10 2018-01-11 中國砂輪企業股份有限公司 Cutter wheel with two cutting edges
TWI693994B (en) * 2015-07-14 2020-05-21 日商迪思科股份有限公司 Method for shaping front end shape of cutting blade

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571340B (en) * 2013-05-24 2017-02-21 三星鑽石工業股份有限公司 Cutter wheel and its manufacturing method
TWI693994B (en) * 2015-07-14 2020-05-21 日商迪思科股份有限公司 Method for shaping front end shape of cutting blade
TWI610896B (en) * 2016-11-10 2018-01-11 中國砂輪企業股份有限公司 Cutter wheel with two cutting edges

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