200928120 . 九、發明說明： ;【發明所屬之技術領域】 本發明涉及一種散熱器組合。 【先前技術】 電腦主機板上的電子元件（如南北橋晶片）上需要安 裝散熱器。-種安裝方式係在主機板上設置複數卡扣件， 透過-設有複數彈性扣持臂的扣合農置將散熱器固持在該 電子元件上，再操作該彈性扣持臂與主機板上的卡扣件對 ❹應卡合而將該散熱器固定。 為了節約主機板的空間，通常該電子元件與對應的 卡^件之間的距離較小，在拆裝該散熱器時，需要用手 指靠近該散熱器的底部進行操作，操作不便。 【發明内容】 雲於以上内容’有必要提供一操作方便的散熱器組合。 一種散熱器組合，包括一散熱器及一用以將該散埶器 固定於一主機板的散熱器扣合裝置，該主機板設有一^卡 扣部’該散熱器扣合裝置係由一彈性金屬條彎折而成，其 包括一抵壓於該散熱器的抵壓部及一對扣持臂，該對扣持 臂分別自該抵壓部的兩端延伸，每一扣持臂包括一位於該 散熱盗上方的操作部及一連接於該操作部的扣鉤，該對扣 鉤可與該主機板的卡扣部對應卡扣。 相較習知有技術，該散熱器組合的散熱器扣合裝置包 括一位於該散熱器上方的操作部，使該散熱器的拆裝過程 方便、快捷。 200928120 .【實施方式】 / 請參照圖1 ’本發明散熱器組合的較佳實施方式包括一 -散熱器20及一用以將該散熱器2〇固定於一主機板的散 熱器扣合裝置10。該主機板4〇上設有一電子元件42及一 對卡扣部44。 請共同參照圖2，該散熱器扣合裝置1〇係由一彈性金 屬條彎折而成，其包括一桿狀的抵壓部12及一對分別自該 抵壓部12兩端向上反向傾斜延伸的扭臂141。該對扭臂i4i ©分別自其末端水平反向延伸形成一對操作部142。每一操作 部142的末端向下垂直延伸一扣鉤144，該對扣鉤144分別 位於該抵壓部12的兩侧。該對扭臂141與對應的操作部142 及扣鉤144共同於垂直該抵壓部12的平面内形成一對大致 呈η形的扣持臂14。 該散熱器20具有一基座22及複數設於該基座22頂面 上的間隔排列的散熱鰭片24,其中中部的兩列散熱鰭片24 之間形成一可收容該散熱器扣合裝置1〇的抵壓部12的安 φ裝槽26。 且裝時，將該散熱器2〇放置於該主機板4〇的電子元 件42上，使該散熱器2〇的一對對角分別靠近該主機板’扣 ，應的卡扣部44，將該散熱器扣合裝置1〇的抵壓部12收 容在該散熱器20的安裝槽26内，該對扣持臂14的操作部 142。位於該散熱器2〇的上方。下壓該散熱器扣合裝置忉 的操作。卩142，使該對扣持臂的扭臂141彈性變形，將 該對扣持臂14的扣鉤144鉤扣於該主機板4()對應的卡扣 部44 ’即完成該散熱器2〇的安裝。 200928120 - 拆卸時，下墨該散熱器扣合裝置1〇的操作部i42，使 該對扣W44麟該主機板4〇對應的卡扣部44，即可將該 -散熱器20從該主機板4〇上取下。 ° 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。.准’以上所述者僅為|發明之較佳實施方式，舉 凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 φ 【圖式簡單說明】 圖1係本發明散熱器組合的較佳實施方式與一主 的立體分解圖。 ^ 圖2係圖1的立體組合圖。 【主要元件符號說明】 散熱器扣合裝置 10 抵壓部 12 扣持臂 14 扭臂 141 操作部 142 扣鉤 144 散熱器 20 基座 22 散熱鰭片 24 安裝槽 26 主機板 40 電子元件 42 卡扣部 44200928120. IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat sink assembly. [Prior Art] A heat sink is required on an electronic component (such as a north-south bridge chip) on a computer motherboard. - The installation method is to set a plurality of fasteners on the motherboard, and to hold the heat sink on the electronic component through the fastening device with a plurality of elastic fastening arms, and then operate the elastic fastening arm and the motherboard The fasteners should be engaged to fix the heat sink. In order to save the space of the motherboard, usually the distance between the electronic component and the corresponding component is small. When the heat sink is removed, the finger is required to be operated near the bottom of the heat sink, which is inconvenient to operate. SUMMARY OF THE INVENTION Clouds in the above content 'need to provide a convenient heat sink combination. A heat sink assembly includes a heat sink and a heat sink fastening device for fixing the heat sink to a motherboard, the motherboard is provided with a fastening portion, and the heat sink fastening device is elastic The metal strip is bent and includes a pressing portion that presses against the heat sink and a pair of latching arms respectively extending from opposite ends of the pressing portion, each of the latching arms includes a An operating portion located above the heat sink and a hook connected to the operating portion, the pair of hooks being hooked to the buckle portion of the motherboard. Compared with the prior art, the heat sink fastening device of the heat sink assembly includes an operation portion located above the heat sink, so that the disassembly and assembly process of the heat sink is convenient and quick. 200928120. [Embodiment] / Please refer to FIG. 1 'The preferred embodiment of the heat sink assembly of the present invention includes a heat sink 20 and a heat sink fastening device 10 for fixing the heat sink 2 to a motherboard. . An electronic component 42 and a pair of latching portions 44 are disposed on the motherboard 4. Referring to FIG. 2 together, the heat sink fastening device 1 is formed by bending an elastic metal strip, and includes a rod-shaped pressing portion 12 and a pair of upwardly opposite ends from the pressing portion 12 A torsion arm 141 that extends obliquely. The pair of twist arms i4i © extend horizontally in opposite directions from their ends to form a pair of operation portions 142. A hook 144 is vertically extended downwardly from the end of each of the operating portions 142, and the pair of hooks 144 are respectively located at two sides of the pressing portion 12. The pair of twisting arms 141 and the corresponding operating portion 142 and the hooks 144 form a pair of substantially n-shaped latching arms 14 in a plane perpendicular to the pressing portion 12. The heat sink 20 has a pedestal 22 and a plurality of spaced-apart heat dissipating fins 24 disposed on a top surface of the pedestal 22, wherein a heat dissipating fin 24 is formed between the two rows of heat dissipating fins 24 in the middle portion. The φ groove 26 of the pressing portion 12 of the cymbal. And when mounted, the heat sink 2〇 is placed on the electronic component 42 of the motherboard 4,, so that a pair of diagonals of the heat sink 2〇 are respectively close to the motherboard, and the corresponding buckle portion 44 will be The pressing portion 12 of the heat sink fastening device 1 is housed in the mounting groove 26 of the heat sink 20, and the pair of the locking portion 14 is operated by the operating portion 142. Located above the radiator 2〇. The operation of the heat sink fastening device 下 is pressed down.卩142, the twisting arm 141 of the pair of latching arms is elastically deformed, and the hook 144 of the pair of latching arms 14 is hooked to the corresponding latching portion 44' of the motherboard 4 (ie) to complete the heat sink 2 installation. 200928120 - When disassembling, the operating portion i42 of the heat sink fastening device 1 is inked, and the corresponding button W44 is engaged with the corresponding locking portion 44 of the motherboard 4〇, and the heat sink 20 can be removed from the motherboard Take it off on the 4th floor. ° In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of a preferred embodiment of a heat sink assembly of the present invention and a main body. ^ Figure 2 is a perspective assembled view of Figure 1. [Description of main components] Radiator fastening device 10 Pressing part 12 Buckle arm 14 Torsion arm 141 Operating part 142 Clasp 144 Heat sink 20 Base 22 Heat sink fin 24 Mounting groove 26 Motherboard 40 Electronic component 42 Buckle Department 44