200925236 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種膠帶及其製造方法，尤指一種適用 於印刷電路板的複合高溫膠帶及其製造方法。 5 【先前技術】 ❹ 10 15 Φ 20 在現有的電子器件（例如電路板）的製造過程中，印刷電 路板上的特定區域需要塗布錫等，而電路板的其餘區域需 要使用例如保護膠帶之類的特定的遮蔽件加以保護。同 時’在製造過程中’印刷電路板需要在高溫環境下以較短 的接觸時間來進行鍍錫。 現有的保護膠帶通常採用橡膠型膠水作爲複合膠黏 劑。但是橡膠型的膠黏劑的缺點在於不能耐260度或者更高 的溫度。這樣，在經過印刷電路板的製造製程，例如熱風 整平高溫處理過後，會發生作爲基材的紙和ΡΕΤ分離的現 象。進一步地，由於現有技術中的橡膠型膠水需塗布達到 一定的厚度’這樣才能達到適當的黏接強度。這會造成最 終整個膠帶的厚度非常厚。因此，PCB板在熱風整平鍍錫、 波峰焊製程中’容易産生滲錫現象，而且有時錫會在膠帶 和PCB板黏接的邊緣産生堆積，從而導致《錫場”。目前 鍍錫製程採用的是含鉛製程，隨著環保指標的執行，有鉛 製程正逐步被無錯製程而取代。有錯製程和無錯製程的一 個重要區別在於’有鉛製程所要求的溫度通常要達到25〇 5 200925236 〜260度，而無鉛製程則要達到280度或者以上。目前的産 品已滿足不了這樣的要求。 爲此，已經有一些專利力圖解決上述問題。例如，在 1998年6月2曰公開的專利TW487727中公開了一種高溫保 5 護膠帶。在該膠帶中加入了 一金屬薄膜層。在高溫處理中， 使金屬薄膜層受熱均勻，從而避免膠帶邊緣翹曲，發生滲 錫現象。但是，所增加的金屬薄膜層增加了膠帶的厚度， 從而也增加了錫在PCB板和膠帶邊緣堆積的可能性。而且 〇 金屬的熱膨脹係數較大，與紙和薄膜的熱膨脹係數相差太 10 大，很可能造成整個膠帶基材的翹曲。 此外，四維膠帶公司的CM8R和CM8G高溫遮蔽紙塑複 合膠帶選用橡膠型膠水作爲複合膠黏劑，應用的最高溫度 爲250°C並可持續1分鐘。Scapa公司的産品Scapa 657熱風 整平膠帶的使用溫度最高也僅能達到105度。 15 【發明内容】 〇 現有技術中均無法解決問題上述問題，因此市場上需 要一種經過280度並持續2分鐘後，紙塑複合基材不分離， 且不翹曲的較薄的高溫遮蔽膠帶。 20 因此，本發明的一個目的是提供一種複合高溫膠帶及 其製造方法，所述複合高溫膠帶即使在經歷280度高溫並持 續2分鐘之後，紙塑複合基材仍然基本上不發生分離，且該 複合高溫膠帶基本上不發生翹曲。 6 200925236 本發明的一個實施例的另外一個目的是提供一種複合 尚溫膠帶及其製造方法，複合高溫膠帶可以減少錫在PCB 板和複合高溫膠帶的黏接邊緣處堆積。 5 Ο 10 15 ❹ 本發明的一個實施例的再一發明目的是提供一種應用 上述的複合高溫膠帶製造印刷電路板的方法。 爲實現上述一個或者更多個目的，本發明提供了一種 複合膠帶的製造方法，所述複合膠帶用於製造印刷電路 板，所述製造方法包括以下步驟：纟紙基材層#第一表面 設置一離型劑層；在紙基材層的第二表面設置由聚氨酯膠 黏劑$知膠黏劑或者=者的混合所形成的複合膠黏劑 層；在複合膠黏劑層的下側設置塑㈣；以及在塑膠層的 下側設置黏著層。 才據本發明的一方面，提供了一種用於製造印刷電路 板的複口膠帶’包括：紙基材層；設置在所述紙基材層的 第-表面的離型劑層；設置在所述紙基材層的第二表面的 由聚氨酉曰膠黏劑、聚酯膠黏劑或者二者的混合所形成的複 合膠黏劑層；設置在複合膠黏劑層的第二表面的塑膠層； 以及設置在塑膠層的第二表面的黏著層。 根據本發明的另外一方面，提供了一種印刷電路板的 ^包括如下步驟：將根據前述的複合膠帶钻貼至 :::路板上的受保護區域的粘貼步驟；將電路板鍍錫的 & '驟’以及取出印刷電路板並進行熱風聱平的整平步 20 200925236 具有下 本發明的複合膠帶與現有技術中的膠帶相 述的優點： (1) 由於複合膠黏劑層採用聚氨酯膠黏劑、 5 ❹ 10 15 劑或者其混合物形成，使得複合膠帶可以承受瞬門、 黏 度以上的高溫，且此後紙塑複合基材不會發：分：=2二 (2) 複合膠黏劑層使得基材的厚度可以 少錫等的堆積。 變涛從而減 【實施方式】 下面結合附圖1至3來詳細說明根據本發明的高溫 膠帶1。 13 圖1係為本發明的高溫複合膠帶i的剖視圖。高溫複合 膠帶1可用於電動或者電子元件的製造過帛中的高溫遮： 部件，特別是用於印刷電路板製造過程中的部分區域的高 溫保護。通常，在PCB板的製造過程中，需要提供一耐高 溫的保護膠帶，膠帶主要應用於PCB板的鍍錫過程中保護 PCB板上金手指或者其他插接孔，從而避免金手指鍵上錫 或插接孔堵塞等問題。此外，在用於鍍錫、熱風整平、波 峰焊等條件下，在使用的過程中不能發生膠帶脫落等問 題’同時在使用之後要便於剝離膠帶，且基本上不留下殘 膠0 根據本發明的高溫複合膠帶1可以應用於印刷電路板 的鍍錫、波峰焊等製程，並選擇性地對特定區域進行遮蔽， 例如金手指等。如圖1中所示，根據本發明的用於製造印刷 20 200925236 5 ❹ 10 15 ❹ 電路板（PCB)的複合膠帶1自上而下包括5層，分別爲紙 基材層12、離型劑層11、複合膠黏劑層13、塑膠層14以及 黏著層15。通常，紙基材層12由平板紙、美光紙或美紋紙 製成。所述離型劑層11形成在所述紙基材層12的上側。離 型劑通常採用丙稀酸類、含氟類的離型劑，該離型劑層可 以是丙烯酸乳液或其他可以離型有機矽壓敏粘合劑的離型 劑。 複合膠黏劑層13設置在所述紙基材層的下侧。該複合 膠黏劑層13包括聚氨酯膠黏劑、聚酯膠黏劑或者二者的混 合，聚氨酯膠黏劑或聚酯膠黏劑能夠承受高達280度以上的 兩溫，該聚氣酯膠黏劑或聚酯膠黏劑可以選用例如 ROHM&HASS的ADCOTE 76P1-38。含有聚酯樹脂的聚醋 或者聚氨酯膠黏劑固化後可以瞬間承受280度以上的高 溫。此外’採用对尚溫的聚醋、聚氨醋類膠黏劑，可使塗 布的聚酯、聚氨酯類膠黏劑量減少，從而可以使得所述複 合膠黏劑層13的厚度變薄，同時保證提供很強的黏接強度。 進一步地，塑膠層14設置在複合膠黏劑層的下侧。所 述塑膠層14包括聚對苯二甲酸乙二醇酯（PET)、聚對苯 二甲酸丁二醇酯（PBT)、聚酰亞胺（PI)或者聚萘二甲酸乙 一醇醋（PEN )等。較佳地’塑膠層14可以進行電暈處理， 以增加塑膠層的表面能。黏著層15設置在塑膠層14的下 侧，該黏著層15可以由有機矽壓敏粘合劑或者其他具有相 似化學性能的形成。 20 200925236 下面結合附圖2來說明根據本發明的上述實施例的複 合膠帶1的製造方法。圖2係為本發明的複合膠帶的製造方 法的流程圖。如上所述，複合膠帶1可以用於製造印刷電路 板。首先’在紙基材層12的一側設置一離型劑層ii(si〇)。 5 其次’在該紙基材層12的另一側設置由聚氨醋膠黏劑、聚 酯膠黏劑或者二者的混合所形成的複合膠黏劑層丄3 (S20 )。接著’在複合膠黏劑層13的下側設置塑膠層14 (S30)。最後，在塑膠層14的下側設置黏著層15(S40)。 Φ 需要說明的是，上述的複合膠帶1的製造步驟只是出於說明 10 的目的。熟悉此技術領域之人員顯然可以知道，可以將紙 基材層12、離型劑層11、複合膠黏劑層13、塑膠層14以及 黏著層15按照適當的製程來分別組合製造，例如先設置紙 基材層12、離型劑層11的疊層，然後設置複合膠黏劑層13、 塑膠層14以及黏著層15的疊層，最後形成根據本發明的複 15 合膠帶1，顯然熟悉此技術領域之人員也可以採用其他組合 生産步驟》 φ 下面結合圖3來說明根據本發明複合膠帶1在電子元件 (例如印刷電路板）的製造方法中的應用。圖3顯示了根據 本發明的印刷電路板的製造方法的流程圖。 20 在印刷電路板的製造過程中，需要對印刷電路板的表 面進行鍍錫。如果需要’需要對PCB板表面進行打磨、抛 光等。爲此’需要對印刷電路板上的不需要鍍錫的區域（例 如金手指或者PCB板表面上的鍍金區域等）進行遮蔽。根 據本發明的複合膠帶1可以實現這種遮蔽的目的。然後，可 200925236 5 ❹ 10 15 ❹ 20 將印刷電路板送入高溫錫爐中進行鍍錫。由於錫爐中溫度 很尚，通常要達到280度高溫，普通的膠帶難以承受如此高 的溫度，並容易發生脫落和翹曲等問題。在鍍錫之後，需 要取出PCB板，採用高速、高溫的熱風來對pCB板的表面 進行風吹，並吹掉PCB板表面殘餘的錫，即進行所謂的“熱 風整平。由於通常的膠帶較厚，錫會在膠帶和PCB板黏 接的邊緣産生堆積，從而導致“錫壩”。此外，根據製程 上的要求，在鍍錫步驟之前，需要對PCB板進行必要的酸 洗、水洗、乾燥、上助焊劑等程序，在熱風整平步驟之後， 需要對PCB板水洗、乾燥等程序。 根據本發明的印刷電路板的製造方法包括如下的步 驟。將根據本發明的複合膠帶1粘貼至印刷電路板上的受保 護區域的粘貼（S100)。可選地，在該步驟之後，可以對 所述複合膠帶進行加熱和加壓（S1〇1) ^其次，對印刷電 路板進行酸洗、水洗、乾燥 '上助焊劑等程序（S2〇1)。 再者，將粘貼有該複合膠帶1的印刷電路板送入鑛錫爐中進 行電路板鍵錫（S200)。然後’取出印刷電路板並進行熱 風整平（S300)，接下來，從所述受保護區域移除所述複 合膠帶1(S400) ’最後再通過水洗，乾燥等程序（S4〇1)。 但疋’需要注意的是’在圖3中’如果需要，步驟S401可 以在S400之前進行。 採用根據本發明的一個實施例的複合膠帶1，在錫爐的 鑛錫製程過程中，即使在經過280度並持續2分鐘的高溫 後，紙塑複合基材不發生分離，同時可以使基材盡可能的 11 200925236 :緣::::在熱風整平製程中，—接 此外’本發明的膠帶,的複合結構可適 1 竟下保護和延遲熱傳導的作用，例如可以應用到印 板鑛錫製程中的部分區域保護。 要說！J的是，本發明的複合膠帶可以廣泛地 ㈣而且/ 領域，其不僅可以應用於pcb板的 ❹ 15 鍍錫，而且也可以應用於真空電鍍、變 需要高溫絕緣等。 夂贫電機等 上述實施例僅係為了方便說明而舉例而已，本發 主張之權利範圍自應以巾請專利_所述為準，而非僅限 於上述實施例》 【圖式簡單說明】 圖1係本發明的複合膠帶的剖視圖。 圖2係本發明的複合膠帶的製造方法的流程圖。 圖3係本發明的電路板印刷電路板的製造方法的流程圖。 【主要元件符號說明】 12紙基材層 15黏著層 1南溫複合膠帶 11離型劑層 13複合膠黏劑層 14塑膠層 12200925236 IX. Description of the Invention: [Technical Field] The present invention relates to a tape and a method of manufacturing the same, and more particularly to a composite high-temperature tape suitable for a printed circuit board and a method of manufacturing the same. 5 [Prior Art] ❹ 10 15 Φ 20 In the manufacturing process of existing electronic devices (such as circuit boards), specific areas on the printed circuit board need to be coated with tin, etc., and the rest of the board needs to use, for example, protective tape. The specific shield is protected. At the same time, during the manufacturing process, the printed circuit board needs to be tinned in a high temperature environment with a short contact time. The existing protective tape usually uses a rubber type glue as a composite adhesive. However, the rubber type adhesive has a drawback in that it cannot withstand temperatures of 260 degrees or higher. Thus, after the manufacturing process of the printed circuit board, for example, the hot air leveling and high temperature treatment, the separation of the paper and the crucible as the substrate occurs. Further, since the rubber type glue of the prior art needs to be coated to a certain thickness, the proper bonding strength can be attained. This will result in a very thick thickness of the entire tape. Therefore, the PCB board is prone to tin infiltration during the hot air leveling tin plating and wave soldering process, and sometimes tin will accumulate on the edge of the bonding of the tape and the PCB board, resulting in a "tin field." The lead-containing process is used. With the implementation of environmental indicators, the lead process is gradually being replaced by a process without error. An important difference between the wrong process and the error-free process is that the temperature required for the lead process usually reaches 25 〇5 200925236 ~260 degrees, and lead-free process to reach 280 degrees or more. The current products can not meet such requirements. To this end, there are some patents to try to solve the above problems. For example, published on June 2, 1998 Patent TW487727 discloses a high-temperature protective tape. A metal film layer is added to the tape. In the high-temperature treatment, the metal film layer is uniformly heated, thereby avoiding warping of the edge of the tape and causing tin penetration. The increased thickness of the metal film increases the thickness of the tape, which in turn increases the likelihood of tin build-up on the edges of the PCB and tape. The expansion coefficient is large, and the difference between the thermal expansion coefficient of paper and film is too large, which may cause warpage of the entire tape substrate. In addition, the CM8R and CM8G high temperature shielding paper-plastic composite tape of Siwei Tape Co., Ltd. uses rubber type glue as the compound glue. Adhesive, the maximum temperature of application is 250 ° C and can last for 1 minute. Scapa's Scapa 657 hot air leveling tape can only reach 105 degrees. The content of the invention can not be solved in the prior art. The above problem is solved. Therefore, there is a need in the market for a thin high-temperature masking tape which does not separate and does not warp after the paper-plastic composite substrate has passed through 280 degrees for 2 minutes. 20 Therefore, it is an object of the present invention to provide a composite. The high temperature adhesive tape and the manufacturing method thereof, the composite high temperature adhesive tape does not substantially separate even after experiencing a high temperature of 280 degrees and lasts for 2 minutes, and the composite high temperature adhesive tape does not substantially warp. 6 200925236 Another object of an embodiment of the present invention is to provide a composite temperature-sensitive adhesive tape and a method for manufacturing the same, composite high-temperature adhesive It is possible to reduce the accumulation of tin at the bonding edges of the PCB board and the composite high temperature tape. 5 Ο 10 15 再 Still another object of one embodiment of the present invention is to provide a method of manufacturing a printed circuit board using the above composite high temperature tape. To achieve one or more of the above objects, the present invention provides a method of manufacturing a composite tape for manufacturing a printed circuit board, the manufacturing method comprising the steps of: setting a first surface of the paper substrate layer # a release agent layer; a composite adhesive layer formed of a mixture of a polyurethane adhesive and a known adhesive on the second surface of the paper substrate layer; a plastic layer disposed on the lower side of the composite adhesive layer (d); and an adhesive layer on the underside of the plastic layer. According to an aspect of the invention, there is provided a lap tape for manufacturing a printed circuit board comprising: a paper substrate layer; a release agent layer disposed on a first surface of the paper substrate layer; a composite adhesive layer formed of a polyurethane adhesive, a polyester adhesive, or a mixture of the two on the second surface of the paper substrate layer; disposed on the second surface of the composite adhesive layer a plastic layer; and an adhesive layer disposed on the second surface of the plastic layer. According to another aspect of the present invention, there is provided a printed circuit board comprising the steps of: affixing a composite tape according to the foregoing to a protected area of a ::: a road board; and plating the board with tin &; 'STEP' and the step of removing the printed circuit board and performing the hot air leveling step 20 200925236 The advantages of the composite tape of the present invention compared with the prior art tape: (1) Since the composite adhesive layer is made of polyurethane glue The adhesive, 5 ❹ 10 15 agent or a mixture thereof is formed, so that the composite tape can withstand the high temperature above the instantaneous door and the viscosity, and thereafter the paper-plastic composite substrate does not emit: minute:=2 two (2) composite adhesive layer The thickness of the substrate can be reduced by the accumulation of tin or the like. The transition is reduced as follows. [Embodiment] The high-temperature tape 1 according to the present invention will be described in detail below with reference to Figs. 13 is a cross-sectional view of a high temperature composite tape i of the present invention. The high temperature composite tape 1 can be used for high temperature shielding in the manufacture of electric or electronic components: components, especially for high temperature protection in parts of the printed circuit board manufacturing process. Generally, in the manufacturing process of the PCB board, it is necessary to provide a high temperature resistant protective tape, which is mainly used to protect the gold finger or other plug holes on the PCB board during the tin plating process of the PCB board, thereby avoiding the tin finger on the gold finger or Problems such as plugging holes. In addition, under the conditions of tin plating, hot air leveling, wave soldering, etc., the problem of tape peeling and the like cannot occur during use. At the same time, it is easy to peel off the tape after use, and basically no residual glue is left. The high-temperature composite tape 1 of the invention can be applied to a process such as tin plating and wave soldering of a printed circuit board, and selectively shields a specific region, such as a gold finger. As shown in FIG. 1, the composite tape 1 for manufacturing a printing 20 200925236 5 ❹ 10 15 电路 circuit board (PCB) according to the present invention comprises five layers from top to bottom, respectively a paper substrate layer 12, a release agent. The layer 11, the composite adhesive layer 13, the plastic layer 14, and the adhesive layer 15. Typically, the paper substrate layer 12 is made of flat paper, glossy paper or textured paper. The release agent layer 11 is formed on the upper side of the paper substrate layer 12. The release agent is usually a release agent of acrylic acid or fluorine-containing type, and the release agent layer may be an acrylic emulsion or other release agent capable of releasing the organic ruthenium pressure-sensitive adhesive. A composite adhesive layer 13 is disposed on the lower side of the paper substrate layer. The composite adhesive layer 13 comprises a polyurethane adhesive, a polyester adhesive or a mixture of the two, and the polyurethane adhesive or the polyester adhesive can withstand two temperatures of up to 280 degrees or more, and the polyester adhesive is adhesive. For the agent or polyester adhesive, for example, ADCOTE 76P1-38 of ROHM & HASS can be used. Polyester or polyurethane adhesive containing polyester resin can withstand high temperatures of 280 degrees or more in an instant. In addition, the use of the polyester vinegar and polyurethane adhesive for the temperature can reduce the adhesive amount of the coated polyester and polyurethane, so that the thickness of the composite adhesive layer 13 can be thinned while ensuring Provides strong bonding strength. Further, the plastic layer 14 is disposed on the lower side of the composite adhesive layer. The plastic layer 14 comprises polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyimide (PI) or polyethylene naphthalate (PEN). Wait. Preferably, the plastic layer 14 can be corona treated to increase the surface energy of the plastic layer. The adhesive layer 15 is disposed on the underside of the plastic layer 14, which may be formed of an organic enamel pressure sensitive adhesive or other similar chemical properties. 20 200925236 Next, a method of manufacturing the composite tape 1 according to the above embodiment of the present invention will be described with reference to FIG. Fig. 2 is a flow chart showing a method of producing a composite tape of the present invention. As described above, the composite tape 1 can be used to manufacture a printed circuit board. First, a release agent layer ii (si〇) is disposed on one side of the paper substrate layer 12. 5 Next, a composite adhesive layer 3 (S20) formed of a polyurethane adhesive, a polyester adhesive or a mixture of the two is provided on the other side of the paper substrate layer 12. Next, a plastic layer 14 is provided on the lower side of the composite adhesive layer 13 (S30). Finally, an adhesive layer 15 is provided on the lower side of the plastic layer 14 (S40). Φ It should be noted that the above-described manufacturing steps of the composite tape 1 are only for the purpose of the description 10. It will be apparent to those skilled in the art that the paper substrate layer 12, the release agent layer 11, the composite adhesive layer 13, the plastic layer 14, and the adhesive layer 15 can be separately combined and manufactured according to an appropriate process, for example, first set. Lamination of the paper substrate layer 12 and the release agent layer 11, and then lamination of the composite adhesive layer 13, the plastic layer 14, and the adhesive layer 15, and finally forming the composite 15 tape 1 according to the present invention, which is obviously familiar with Other combinations of production steps can also be employed by those skilled in the art. φ The application of the composite tape 1 in the method of manufacturing electronic components (e.g., printed circuit boards) according to the present invention will now be described with reference to FIG. Fig. 3 is a flow chart showing a method of manufacturing a printed circuit board according to the present invention. 20 In the manufacturing process of printed circuit boards, the surface of the printed circuit board needs to be tinned. If necessary, it is necessary to polish, polish, etc. the surface of the PCB. To do this, it is necessary to shield the areas of the printed circuit board that do not need tin plating (such as gold fingers or gold-plated areas on the surface of the PCB). The purpose of such shielding can be achieved by the composite tape 1 according to the present invention. Then, 200925236 5 ❹ 10 15 ❹ 20 The printed circuit board is sent to a high temperature tin furnace for tin plating. Since the temperature in the tin furnace is very high, it usually reaches a high temperature of 280 degrees, and ordinary tape is difficult to withstand such a high temperature, and is prone to problems such as shedding and warpage. After tin plating, it is necessary to take out the PCB board, use high-speed, high-temperature hot air to wind the surface of the pCB board, and blow off the residual tin on the surface of the PCB board, that is, the so-called "hot air leveling. Because the usual tape is thicker Tin will accumulate on the edge of the bonding between the tape and the PCB, resulting in a “tin dam.” In addition, according to the requirements of the process, the PCB must be subjected to the necessary pickling, washing, and drying before the tinning step. The procedure of the flux, etc., after the hot air leveling step, requires a process of washing, drying, etc. the PCB. The method of manufacturing a printed circuit board according to the present invention includes the following steps. Pasting the composite tape 1 according to the present invention to a printed circuit Pasting the protected area on the board (S100). Optionally, after the step, the composite tape may be heated and pressurized (S1〇1). Second, the printed circuit board is pickled, washed, Drying the procedure of the flux (S2〇1). Further, the printed circuit board to which the composite tape 1 is attached is fed into a tin furnace to perform a circuit board key tin (S200). The road board is subjected to hot air leveling (S300), and then the composite tape 1 (S400) is removed from the protected area. Finally, the water washing, drying, and the like are performed (S4〇1). It is 'in Figure 3' that step S401 can be performed before S400 if necessary. The composite tape 1 according to one embodiment of the present invention is used in the tin-making process of the tin furnace, even after 280 degrees and continues for 2 After a minute of high temperature, the paper-plastic composite substrate does not separate, and the substrate can be made as far as possible. 11 200925236 : Edge:::: In the hot air leveling process, the composite structure of the tape of the present invention can be The effect of protecting and delaying heat conduction, for example, can be applied to partial area protection in the tin ore process of the printing plate. It is said that the composite tape of the present invention can be widely applied (four) and/or in the field, which can be applied not only The ❹ 15 of the pcb board is tin-plated, and can also be applied to vacuum plating, which requires high-temperature insulation, etc. The above embodiments are only for convenience of description, and the claims are based on the claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a composite tape of the present invention. Fig. 2 is a flow chart showing a method of manufacturing a composite tape of the present invention. 3 is a flow chart of a method for manufacturing a circuit board printed circuit board of the present invention. [Description of main component symbols] 12 paper substrate layer 15 adhesive layer 1 south temperature composite tape 11 release agent layer 13 composite adhesive layer 14 plastic Layer 12