200918980 九、發明說明： 【發明所屬之技術領域】 置，尤其涉及一種小尺寸成像 本發明涉及一種成像裝 裝置及其組裝方法。 【先前技術】 隨著科技之不斷發展，攜帶式電子裝置如移動電話， 心用|廣泛，同呀亦日漸趨向於輕巧、美觀和多功能 化’其中照相功能係近年流行之移動電話之附加功能。應 用於移f電話之數位成像裝置不僅要具有輕薄短小之要 求，其$需滿足1M象清晰之要求。而成像裝置中之影像感 測晶片與透鏡組之間之光轴同心、問題係決定成像裝置圖 像，否清晰之主要因素之―，因此，提高透鏡組與影像感 測晶片之間之定位精度將有利於成像裝置成像之品質。 如圖1所示之一成像裝置100之封裝結構’該成像裝 置100包括一基板30、一影像感測晶片32、一塊透明玻 璃38、一鏡頭模組40及複數條導線39。其中，該基板 30具有一承載面31，所述承載面31週緣設有複數個基板 坏墊3 01，所述影像感測晶片3 2固設於所述承載面3 〇 1 上。所述影像感測晶片32包括感測區322及環繞感測區 322之非感區323。該非感測區323上設有複數個晶片焊 墊321 ’所述晶片焊墊321藉由複數條導線39與所述基 板焊墊301電性連接。 所述鏡頭模組40固設於基板30之承載面31上。該 鏡頭模組40包括鏡筒36、鏡座35與透鏡組37。所述透 7 200918980 鏡組37固定於鏡筒36内，鏡筒36外側壁與鏡座35内側 壁设有螺紋，所述鏡筒36藉由螺紋套設於鏡座35内。所 .述鏡座35具有第一開口端351，所述透明玻璃38固設於 • 第一開口端351。 ° 、 惟，實際應用中，所述基板3〇之厚度可能會存在不 一致之問題。這樣影像感測晶片32固設於基板30之承載 面31上後，會發生傾斜。同時，鏡筒％與鏡座％分開 製作，透鏡組37固設於鏡筒36内，鏡筒36藉由螺紋虫^ 合於鏡座35後，各個零件之尺寸誤差及它們相互間之沾 合而引起之誤差都疊加起來，累計誤差較大。鏡頭模2 40固设於基板3〇之承載面31後，將導致鏡頭模組之 透鏡組37與影像感測晶片32之感測區322之光學中心產 生角度偏差，導致影像感測晶片32呈現之影像產生慧形 像差，造成影像模糊失真，從而影響整個成像裝置玉〇〇 品質。 【發明内容】 有鑒於此，有必要提供一種能減小成像裝置之封裝體 積，並可避免影像感測器與鏡頭模組之間光軸偏心問題2 成像裝置及其組裝方法。 -種成像裝置’其包括：-基板、一影像感測晶片及 :鏡頭模組。所述基板包括一承載面，該承載面用於承靠 影像感測晶片及與該影像感測晶片對應設置之鏡頭模 組。所述影像感測晶片有一感測區和環繞感測區之非感測 區。所述鏡頭模組包括一鏡座及一透鏡組。所述鏡座包括 8 200918980 一第一收容室與一第二收容室以及設於第一收容室與第 二收容室之間之鏡座肩部。所述第一收容室用於收容所述 •透鏡組。所述第二收容室用於收容所述影像感測晶片。所 - 述鏡座肩部承靠於所述影像感測晶片之非感測區上，所述 鏡頭模組之鏡座固設於所述基板承載面上。 一種成像裝置之組裝方法，其包括以下步驟： 提供一基板，其具有一承載面； 將影像感測晶片組裝於基板之承載面上，所述影像感 測晶片包括一感測區及環繞感測區之非感測區； 提供一鏡頭模組，該鏡頭模組包括一鏡座及透鏡組， 所述鏡座包括一第一收容室與一第二收容室以及設於第 一收容室與第二收容室之間之鏡座肩部，所述第一收容室 用於收容所述透鏡組’所述第二收容室用於收容所述影像 感測晶片； ' 將鏡頭模組固設於基板之承載面上，所述鏡座肩心 罪於所述影像感測晶片之非感測區上。 相對於先前技術’所述成像裝置中鏡座之鏡座肩 接承晶於影像感測晶片之非感測區。不但可以減小成像^ 置之體積，同時，組裝鏡頭模組至基板時，所述鏡頭模: 可以以鏡翻狀赠絲準，並依影像相晶片之㉚ :區，輪廓為定位參考，如此，可避免影像傳感晶片㈣ 頭杈組之間光轴偏心問題，提高生產良 、、: 【實施方式】 步之詳細說明。 以下將結合附圖對本發明作進— 200918980 請參閱圖2，為本發明第一實施例之成像裝置200， 其包括：一基板60、膠體81、一影像感測晶片90及導電 •膠80及一鏡頭模組50。 * 所述基板60可以由玻璃纖維、強化塑膠或陶瓷等材 質所製成，其具有一承載面61。本實施例中，所述承載 面61上設有複數個基板焊墊62。 所述膠體81為軟膠或雙面膠中之一種。本實施例 中，所述膠體81塗佈於所述基板60之承載面61上。 所述影像感測晶片 90可為CCD (Charge Coupled Device,電荷I禺合組件感測器）或CMOS (Complementary Metal Oxide Semiconductor,互補性金屬氧化物感測器）， 其用以將鏡頭模組50攝取到之光訊號變成電訊號，該影 像感測晶片90具有一感測區91和環繞感測區91之非感 測區92。本實施例中，所述非感測區92邊緣設有複數個 晶片焊墊93。所述影像感測晶片90藉由所述膠體81固 設於所述基板60之承載面61上。 所述導電膠80塗佈於所述基板之承載面61邊緣且覆 蓋所述基板焊墊62。 所述鏡頭模組50包括：一鏡筒54、一鏡座55及透 鏡組53。優選地，該透鏡組53包括兩個光學鏡片51及 一濾光片52,所述濾光片52夾設於所述兩個光學鏡片51 之間。所述鏡座55包括一第一收容室57與一第二收容室 58，所述第一收容室57用於收容所述透鏡組53，所述第 二收容室58用於收容所述影像感測晶片90。本實施例 10 200918980 中，所述鏡筒54固設於第一收容室57，所述鏡筒54與 所述鏡座55 —體成型。所述第一收容室57與第二收容室 58之間設有連接第一收容室57與第二收容室58之鏡座 肩部56。所述鏡座肩部56包括一肩部内侧壁71，所述第 二收容室58包括一内側壁72及一底端面73。所述第二 收容室58之底端面73與所述影像感測晶片90之晶片焊 墊93正對，優選地，該底端面73之投影覆蓋該晶片焊墊 93。本實施例中，所述第二收容室58之高度小於所述影 像感測晶片90之高度，所述鏡座肩部56承靠於影像感測 晶片90之非感測區92上且所述鏡座55藉由所述塗佈於 鏡座55之第二收容室58之底端面73與基板承載面61之 間之導電膠80粘接於所述基板60之承載面61上。 實際應用中，所述鏡頭模組50之透鏡組53可以只包 括一光學鏡片51及一濾光片52，亦可以包括兩個以上光 學鏡片51及一濾光片52,所述透鏡組50内還可以不設 置濾光片52，所述鏡筒54之外侧壁與第一收容室57之 内側壁分別設有螺紋，該鏡筒54藉由螺紋螺合於所述第 一收容室57，並不限於本實施例。 本實施例中，所述成像裝置200還包括複數條金屬跡 線70，所述複數條金屬跡線70係由黃金等抗氧化、導電 佳之材料製成。所述複數條金屬跡線70係藉由濺鍍之方 式固設於鏡座肩部56之内侧壁71與鏡座55之第二收容 室内侧壁72及鏡座底端面73。因此，所述鏡座肩部56 承靠於影像感測晶片90之非感測區92後，所述複數條金 11 200918980 屬跡線70—端與晶片㈣93電性連接，另一端則藉由所 述導電膠80與基板承載面61上之基板焊墊62對應電性 連接，以使影像感㈨晶片9〇之訊號藉由複數 70及導電膠80傳遞至基板6〇。 ㈣線 實際應用中，亦可以用表面貼裝技術（SMT打件方 式）、覆晶形式、内引腳貼合、自動載帶貼合、倒貼封裝 或熱壓合連接方式使影像感測晶片9〇結構性及電性連接 於基板60。 請參閱圖3，為本發明實施例之成像裝置2〇〇之組裝 方法，包括以下步驟： " ^供一基板60·’其具有一承載面61 ; 將影像感測晶片90組裝於基板6〇之承載面61上， 所述影像感測晶片包括一感測區91及環繞感測區91之非 感測區92， 所述影像感測晶片90可以膠合之方式固設於基板 之承載面61上，亦可以使用表面貼裝技術、覆晶形式、 内引腳貼合、自動載帶貼合、倒貼封裝或熱壓合連接方式 使影像感測晶片結構性及電性連接於基板。 提供一鏡頭模組50，該鏡頭模組包括一鏡座55及透 鏡組53 ’所述鏡座55包括一第一收容室57與一第二收 容室58以及設於第一收容室57與第二收容室58之間之 鏡座肩部56,所述第一收容室57用於收容所述透鏡組 53，所述第二收容室58用於收容所述影像感測晶片90 ; 當影像感測晶片90藉由膠合之方式固設於基板之承 12 200918980 載面61上時，還進一步包括以下步驟. ^ ^鄉.所述鏡座肩部56 包括-肩部内側壁7i ’所述第二收容室％包括一 72及一底端面73’將複數條金屬跡線7〇藉由濺鍍之方 固設於鏡座肩部56之内侧壁71與鏡座55之第二收容1 内側壁72及鏡座底端面73。 & i 將鏡頭模組50固設於基板60之承載面61上，所述 鏡座肩部56承靠於所述影像感測晶片9〇之非感測區％ 上。 心’、BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus and an assembling method thereof. [Prior Art] With the continuous development of technology, portable electronic devices, such as mobile phones, are widely used, and they are becoming lighter, more beautiful, and more versatile. The camera function is an additional feature of mobile phones that have been popular in recent years. . The digital imaging device applied to the mobile phone must not only have the requirements of being thin and light, but also need to meet the requirements of 1M image clarity. In the imaging device, the optical axis between the image sensing chip and the lens group is concentric, and the problem is determined by the image of the imaging device, which is the main factor of clarity. Therefore, the positioning accuracy between the lens group and the image sensing wafer is improved. Will benefit the quality of imaging of the imaging device. The packaging device 100 of the imaging device 100 shown in FIG. 1 includes a substrate 30, an image sensing chip 32, a transparent glass 38, a lens module 40, and a plurality of wires 39. The substrate 30 has a bearing surface 31. The periphery of the bearing surface 31 is provided with a plurality of substrate bad pads 310. The image sensing wafers 3 2 are fixed on the bearing surface 3 〇 1 . The image sensing die 32 includes a sensing region 322 and a non-sensitive region 323 surrounding the sensing region 322. The non-sensing area 323 is provided with a plurality of wafer pads 321 ′. The wafer pads 321 are electrically connected to the substrate pads 301 by a plurality of wires 39. The lens module 40 is fixed on the bearing surface 31 of the substrate 30 . The lens module 40 includes a lens barrel 36, a lens holder 35 and a lens group 37. The through-hole 7 200918980 lens assembly 37 is fixed in the lens barrel 36. The outer side wall of the lens barrel 36 and the inner wall of the lens holder 35 are provided with a thread, and the lens barrel 36 is sleeved in the lens holder 35 by a screw. The mirror holder 35 has a first open end 351, and the transparent glass 38 is fixed to the first open end 351. ° However, in practical applications, the thickness of the substrate 3 may be inconsistent. When the image sensing wafer 32 is fixed on the bearing surface 31 of the substrate 30, tilting occurs. At the same time, the lens barrel % is separately formed from the lens holder %, and the lens group 37 is fixed in the lens barrel 36. After the lens barrel 36 is coupled to the lens holder 35 by the thread insects, the dimensional errors of the respective parts and their mutual adhesion The errors caused are superimposed and the cumulative error is large. After the lens module 2 40 is fixed on the bearing surface 31 of the substrate 3 , the lens group 37 of the lens module and the optical center of the sensing region 322 of the image sensing chip 32 are angularly offset, resulting in the image sensing chip 32 being presented. The image produces coma aberration, which causes image blurring, which affects the quality of the entire imaging device. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an imaging device and an assembly method thereof that can reduce the package volume of an imaging device and avoid optical axis eccentricity between the image sensor and the lens module. An imaging device' includes: a substrate, an image sensing chip, and a lens module. The substrate includes a bearing surface for supporting the image sensing chip and the lens module disposed corresponding to the image sensing wafer. The image sensing chip has a sensing area and a non-sensing area surrounding the sensing area. The lens module includes a lens holder and a lens group. The lens holder includes 8 200918980 a first receiving chamber and a second receiving chamber, and a mirror shoulder portion disposed between the first receiving chamber and the second receiving chamber. The first receiving chamber is configured to receive the lens group. The second receiving chamber is configured to receive the image sensing wafer. The shoulder of the lens holder bears against the non-sensing area of the image sensing chip, and the lens holder of the lens module is fixed on the substrate bearing surface. A method for assembling an image forming apparatus, comprising the steps of: providing a substrate having a bearing surface; assembling the image sensing wafer on a bearing surface of the substrate, the image sensing wafer comprising a sensing area and surrounding sensing a non-sensing area of the area; providing a lens module, the lens module comprising a lens holder and a lens group, the lens holder comprising a first receiving chamber and a second receiving chamber, and the first receiving chamber and the first a lens holder shoulder between the two receiving chambers, the first receiving chamber is for receiving the lens group, the second receiving chamber is for receiving the image sensing wafer; and the lens module is fixed on the substrate The mirror mount is on the non-sensing area of the image sensing chip. The mirror mount shoulder of the mirror mount in the imaging device of the prior art is bonded to the non-sensing area of the image sensing wafer. Not only can the volume of the imaging device be reduced, but also, when the lens module is assembled to the substrate, the lens module can be given a mirror-like shape, and according to the 30: region of the image phase wafer, the contour is a positioning reference. It can avoid the optical axis eccentricity problem between the image sensing chip (4) and the head 杈 group, and improve the production quality, and: [Embodiment] Detailed description of the steps. The present invention will be described with reference to the accompanying drawings - 200918980. Referring to FIG. 2, an image forming apparatus 200 according to a first embodiment of the present invention includes a substrate 60, a colloid 81, an image sensing wafer 90, and a conductive adhesive 80. A lens module 50. * The substrate 60 may be made of a material such as glass fiber, reinforced plastic or ceramic, and has a bearing surface 61. In this embodiment, the carrier surface 61 is provided with a plurality of substrate pads 62. The colloid 81 is one of soft rubber or double-sided tape. In this embodiment, the colloid 81 is coated on the bearing surface 61 of the substrate 60. The image sensing chip 90 can be a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) for using the lens module 50. The captured optical signal becomes an electrical signal. The image sensing wafer 90 has a sensing region 91 and a non-sensing region 92 surrounding the sensing region 91. In this embodiment, a plurality of die pads 93 are disposed at the edges of the non-sensing region 92. The image sensing wafer 90 is fixed on the bearing surface 61 of the substrate 60 by the colloid 81. The conductive paste 80 is applied to the edge of the bearing surface 61 of the substrate and covers the substrate pad 62. The lens module 50 includes a lens barrel 54, a lens holder 55, and a lens assembly 53. Preferably, the lens group 53 includes two optical lenses 51 and a filter 52 interposed between the two optical lenses 51. The lens holder 55 includes a first accommodating chamber 57 for accommodating the lens group 53 and a second accommodating chamber 58 for accommodating the image sense. The wafer 90 is measured. In the embodiment 10 200918980, the lens barrel 54 is fixed to the first accommodating chamber 57, and the lens barrel 54 is integrally formed with the lens holder 55. A mirror seat shoulder portion 56 that connects the first housing chamber 57 and the second housing chamber 58 is disposed between the first housing chamber 57 and the second housing chamber 58. The mirror shoulder portion 56 includes a shoulder inner side wall 71, and the second receiving chamber 58 includes an inner side wall 72 and a bottom end surface 73. The bottom end surface 73 of the second receiving chamber 58 is opposite to the wafer pad 93 of the image sensing wafer 90. Preferably, the projection of the bottom end surface 73 covers the wafer pad 93. In this embodiment, the height of the second receiving chamber 58 is smaller than the height of the image sensing wafer 90, and the mirror shoulder 56 bears against the non-sensing area 92 of the image sensing wafer 90. The mirror holder 55 is adhered to the bearing surface 61 of the substrate 60 by the conductive paste 80 applied between the bottom end surface 73 of the second receiving chamber 58 of the lens holder 55 and the substrate carrying surface 61. In a practical application, the lens group 53 of the lens module 50 may include only one optical lens 51 and one filter 52, and may also include two or more optical lenses 51 and a filter 52. The filter 52 may not be provided, and the outer side wall of the lens barrel 54 and the inner side wall of the first receiving chamber 57 are respectively provided with threads, and the lens barrel 54 is screwed into the first receiving chamber 57 by screws. It is not limited to this embodiment. In this embodiment, the image forming apparatus 200 further includes a plurality of metal traces 70 made of a material resistant to oxidation and conductivity such as gold. The plurality of metal traces 70 are fixed to the inner side wall 71 of the lens holder shoulder portion 56 and the second receiving chamber side wall 72 of the lens holder 55 and the bottom end surface 73 of the mirror holder by sputtering. Therefore, after the lens holder shoulder 56 bears against the non-sensing area 92 of the image sensing chip 90, the plurality of gold 11 200918980 traces are electrically connected to the wafer (four) 93 and the other end is The conductive paste 80 is electrically connected to the substrate pad 62 on the substrate carrying surface 61 so that the image of the image sensor 9 is transmitted to the substrate 6 by the plurality 70 and the conductive paste 80. (4) In the actual application of the line, the image sensing chip can also be made by surface mount technology (SMT punching method), flip chip form, inner pin bonding, automatic tape bonding, flip chip packaging or thermocompression bonding. The crucible is structurally and electrically connected to the substrate 60. Referring to FIG. 3, a method for assembling an image forming apparatus 2 according to an embodiment of the present invention includes the following steps: < ^ for a substrate 60·' having a bearing surface 61; assembling the image sensing wafer 90 to the substrate 6 The image sensing chip includes a sensing area 91 and a non-sensing area 92 surrounding the sensing area 91. The image sensing wafer 90 can be glued to the bearing surface of the substrate. In the 61st, the image sensing chip can also be structurally and electrically connected to the substrate by using surface mount technology, flip chip form, inner pin bonding, automatic tape bonding, flip chip bonding or thermocompression bonding. A lens module 50 is provided. The lens module includes a lens holder 55 and a lens assembly 53. The lens holder 55 includes a first receiving chamber 57 and a second receiving chamber 58 and is disposed in the first receiving chamber 57 and a lens holder shoulder 56 between the two receiving chambers 58, the first receiving chamber 57 is for receiving the lens group 53, and the second receiving chamber 58 is for receiving the image sensing wafer 90; When the test wafer 90 is fixed on the substrate 12 200918980 carrying surface 61 by gluing, the method further includes the following steps. ^ ^乡. The mirror seat shoulder 56 includes a shoulder inner side wall 7i 'the first The second receiving chamber% includes a 72 and a bottom end surface 73'. The plurality of metal traces 7' are fixed to the inner side wall 71 of the lens holder shoulder portion 56 and the inner side wall of the second housing 1 of the lens holder 55 by sputtering. 72 and the bottom end 73 of the mirror base. & i The lens module 50 is fixed on the bearing surface 61 of the substrate 60, and the lens holder shoulder portion 56 bears against the non-sensing area % of the image sensing wafer 9A. heart',
當影像感測晶片90藉由膠合之方式固設於基板的之 承載面61上時，因為所述複數條金屬跡線7〇係固設於鏡 座肩部56之内側壁71與鏡座55之第二收容室内側壁= 及鏡座55之第二收容室58之底端面73之間，所述影像 感測晶片90非感測區92設置有複數個晶片焊墊93，所 述基板60之承載面61邊緣四週對應複數個晶片焊墊％ 設置有複數個基板焊墊61，所述成像模組200還進一步 以下步驟：提供導電膠80，將導電膠80塗佈於基板6〇 之承載面61與鏡座55底部58之底端面73之間且該導電 膠80覆蓋所述基板焊墊62，所以，所述鏡座肩部56.承 罪於影像感測晶月90之非感測區92後，所述複數條金屬 跡線70 —端與晶片焊墊93電性連接，另一端則藉由所述 導電膠80與基板承載面61上之基板焊墊62對應電性連 接’以使影像感測晶片90之訊號藉由複數條金屬跡線7〇 及導電膠80傳遞至基板60。將鏡頭模組50至基板60之 承載面61上時，所述鏡頭模組5〇可以以鏡頭模組5〇之 13 200918980 軸線為基準，並依所述影像感測晶片90之非感測區92輪 廓為定位參考，將鏡頭模組50藉由所述導電膠80固設於 基板60之承載面61上。 請參閱圖4，為本發明第二實施例之成像裝置300。 所述成像裝置300之結構與所述成像裝置200之結構大體 相同，其相同之處採用相同之標號表示且不再冗述，該成 像裝置300之結構與成像裝置200之結構主要差異在於， 所述鏡頭模組50包括一鏡座55及透鏡組53，所述鏡座 55包括第一收容室57及第二收容室58，該透鏡組53包 括兩個光學鏡片51及一濾光片52，所述渡光片52央設 於所述兩個光學鏡片51之間，所述透鏡組53直接固設於 第一收容室57。相同地，所述第一收容室與第二收容 室58之間形成有一鏡座肩部56。所述第二收容室58之 高度小於所述影像感測晶片90之高度，所述鏡座肩部56 承罪於影像感測晶片90上且該第二收容室58藉由所述導 電膠80枯接於所述基板60之承載面61上。 ’ 組裝成像裝置300之步驟與組裝成像裝置2〇〇之步驟 類似，這裏不再贅述。 所述成像裝置中健55之鏡座肩部％直接承讀 於影像感測晶片90之非感測區91。不但可以減 置⑽之體積，同時，組裝鏡頭模組5〇至基板6〇時，戶; 述鏡頭I组50可以以鏡頭模組5()之_為^，並^ 像感測晶片90非感測區92之輪廓為定位參 ^ 避免影像傳感晶片90與鏡頭模組5G之間光軸偏心^題可 14 200918980 提而生產良率。 綜上所述’本發明符合發明專利要仕 ^ 干，羑依法接φ击 利申請。惟，以上所述者僅為本發明之較佳實施方從出專 發明之範圍並不以上述實施方式為限，舉 ' =式本 干'热忠本案枯蓺 之人士援依本發明之精神所作之等效修； 蓋於以下申請專利範圍内。 交化白應述 【圖式簡單說明】 圖1係一種先前之成像裝置之剖視圖； 圖2係本發明第一實施例之成像裝置之剖視圖； 圖3係本發明第一實施例之成像裝置之組裝流程圖； 圖4係本發明第二實施例之成像裝置之剖視圖1广回， 【主要元件符號說明】 成像裝置 100 ，200 光學鏡片 37 >51 透鏡組 53 透明玻璃 38 鏡座 35 >55 第—收容室 57 基板 30 »60 基板焊塾 62，301 肩部内側壁 71 底端面 73 膠體 感測區 81 91，322 鏡頭模組 40 >50 濾光片 52 鏡筒 36 >54 導線 39 鏡座肩部 56 第二收容室 58 基板承載面 31，61 金屬跡線 70 内側壁 72 導電膠 80 影像感測晶片 32-90 非感測區 92 ^ 323 15 200918980 晶片焊墊 93，321 16When the image sensing wafer 90 is fixed on the bearing surface 61 of the substrate by gluing, the plurality of metal traces 7 are fixed to the inner side wall 71 of the lens holder shoulder 56 and the mirror holder 55. Between the second receiving chamber side wall = and the bottom end surface 73 of the second receiving chamber 58 of the lens holder 55, the image sensing wafer 90 non-sensing area 92 is provided with a plurality of wafer pads 93, and the substrate 60 A plurality of substrate pads 61 are disposed around the edge of the bearing surface 61. The imaging module 200 further includes the following steps: providing a conductive adhesive 80 and applying the conductive adhesive 80 to the bearing surface of the substrate 6 61 is between the bottom end surface 73 of the bottom 58 of the lens holder 55 and the conductive adhesive 80 covers the substrate pad 62. Therefore, the mirror shoulder portion 56. is insulted by the non-sensing area of the image sensing crystal 90 After the 92, the plurality of metal traces 70 are electrically connected to the die pad 93, and the other end is electrically connected to the substrate pad 62 on the substrate carrying surface 61 by the conductive paste 80. The signal of the image sensing wafer 90 is transmitted to the substrate 60 by a plurality of metal traces 7 and conductive paste 80. When the lens module 50 is placed on the bearing surface 61 of the substrate 60, the lens module 5 can be based on the axis of the lens module 5, 200918980, and the non-sensing area of the wafer 90 is sensed according to the image. The outline of the 92 is a positioning reference, and the lens module 50 is fixed on the bearing surface 61 of the substrate 60 by the conductive adhesive 80. Please refer to FIG. 4, which is an image forming apparatus 300 according to a second embodiment of the present invention. The structure of the imaging device 300 is substantially the same as that of the imaging device 200, and the same reference numerals are used for the same reference numerals and are not redundant. The structure of the imaging device 300 and the structure of the imaging device 200 are mainly different in that The lens module 50 includes a lens holder 55 and a lens assembly 53. The lens holder 55 includes a first receiving chamber 57 and a second receiving chamber 58. The lens assembly 53 includes two optical lenses 51 and a filter 52. The light-receiving sheet 52 is disposed between the two optical lenses 51 , and the lens group 53 is directly fixed to the first receiving chamber 57 . Similarly, a mirror seat shoulder 56 is formed between the first receiving chamber and the second receiving chamber 58. The height of the second accommodating chamber 58 is smaller than the height of the image sensing wafer 90. The mirror shoulder portion 56 bears the image sensing wafer 90 and the second accommodating chamber 58 is made of the conductive adhesive 80. It is adhered to the bearing surface 61 of the substrate 60. The steps of assembling the image forming apparatus 300 are similar to those of assembling the image forming apparatus 2, and will not be described again here. The mirror shoulder portion % of the image 55 in the imaging device directly encloses the non-sensing region 91 of the image sensing wafer 90. Not only can the volume of (10) be reduced, but also when the lens module 5 is assembled to the substrate 6〇, the lens I group 50 can be used as the lens module 5(), and the image sensing chip 90 is not The contour of the sensing area 92 is a positioning parameter to avoid the optical axis eccentricity between the image sensing chip 90 and the lens module 5G. In summary, the invention conforms to the invention patents and is required to be used in accordance with the law. However, the above is only the preferred embodiment of the present invention, and the scope of the invention is not limited to the above embodiment, and the person who is loyal to the case is immersed in the spirit of the present invention. The equivalent repair is made; it is covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a prior art imaging device; FIG. 2 is a cross-sectional view of an image forming apparatus according to a first embodiment of the present invention; FIG. 3 is an assembly flow of an image forming apparatus according to a first embodiment of the present invention. Figure 4 is a cross-sectional view of an image forming apparatus according to a second embodiment of the present invention. [Main component symbol description] Imaging device 100, 200 Optical lens 37 > 51 Lens group 53 Transparent glass 38 Mirror holder 35 > 55 — accommodating chamber 57 substrate 30 » 60 substrate welding 塾 62, 301 shoulder inner side wall 71 bottom end surface 73 colloid sensing area 81 91, 322 lens module 40 > 50 filter 52 lens barrel 36 > 54 wire 39 mirror Seat shoulder 56 Second receiving chamber 58 Substrate bearing surface 31, 61 Metal trace 70 Inner side wall 72 Conductive adhesive 80 Image sensing wafer 32-90 Non-sensing area 92 ^ 323 15 200918980 Wafer pad 93,321 16