200908124 九、發明說明： 【發明所屬之技術領域】 本發明大致係關於基材處理，而更明確地，係關於 潔基材邊緣的方法與設備。 【先前技術】 基材係用於半導體元件製造中。處理過程中，基材 緣會變髒而負面地影響半導體元件。以研磨膜接觸基材 緣好清潔邊緣之傳統系統無法完全地清潔邊緣。舉例 言，研磨帶或薄膜在清潔過程中無法充分地接觸邊緣的 個斜角。此外，研磨帶可能在研磨處理過程中（特別是最 程度地拉緊研磨帶時）脫落。無法充分地清潔基材會影響 導體元件的製造産量。因此，樂見有清潔基材邊緣之改 方法與設備。 【發明内容】 本發明之態樣中，提供一種用於研磨基材邊緣的 備。該設備包括適於接觸基材邊緣之研磨頭，其中該研 頭包括一對前導向滾軸與兩對後挾持滾軸。 本發明其他態樣中，提供一種用於研磨基材邊緣的 統。該系統包括一基材支撐件，適於旋轉基材；一研磨頭 適於接觸基材邊緣，其中該研磨頭包括一對前滾軸與兩 後滾軸；一控制器，適於操作基材邊緣之研磨。 本發明又其他態樣中，提供一種用於研磨基材邊緣 清 邊 邊 而 兩 低 半 良200908124 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates generally to substrate processing and, more particularly, to methods and apparatus for cleaning the edges of substrates. [Prior Art] A substrate is used in the manufacture of a semiconductor device. During processing, the edge of the substrate becomes dirty and negatively affects the semiconductor components. The traditional system that cleans the edges with the abrasive film in contact with the substrate does not completely clean the edges. For example, the abrasive tape or film does not adequately contact the bevel of the edge during the cleaning process. In addition, the abrasive tape may fall off during the grinding process, particularly when the abrasive tape is most tightly stretched. Failure to adequately clean the substrate can affect the manufacturing yield of the conductor components. Therefore, it is good to have methods and equipment for cleaning the edges of the substrate. SUMMARY OF THE INVENTION In an aspect of the invention, an apparatus for polishing an edge of a substrate is provided. The apparatus includes a polishing head adapted to contact an edge of a substrate, wherein the grinding head includes a pair of front guide rollers and two pairs of rear clamping rollers. In other aspects of the invention, a system for abrading the edges of a substrate is provided. The system includes a substrate support adapted to rotate the substrate; a polishing head adapted to contact the edge of the substrate, wherein the polishing head includes a pair of front rollers and two rear rollers; and a controller adapted to operate the substrate Grinding of the edges. In still another aspect of the present invention, there is provided a method for polishing an edge of a substrate to be edged and two low and half good
設 磨 系 ， 對 的 5 200908124 方法。該方法包括旋轉基材；以研磨頭接觸基材邊緣’其 中該研磨頭包括一對前滾軸與兩對後滾軸；將研磨帶配置 (route)於第一對後滾軸之間、圍繞第一與第二前滾軸並接 著繞送到第二對後滾軸之間，使得研磨帶在第一與第二前 滾軸之間的該段長度接觸並研磨基材邊緣。 由隨後之詳細描述、附屬之申請專利範圍與附圖可更 加完全了解本發明的其他特徵與態樣。 【實施方式】 本發明提供用於清潔與/或研磨基材邊緣之改良方 法、系統與设備。當基材旋轉或以其他方式移動（例如，擺 動）時，藉由利用研磨性研磨帶接觸基材邊緣（某些實施例 中係透過襯墊）而研摩基材邊緣。然而，研磨帶可能自研磨 頭脫落，即便係以最小的研磨帶張力值操作該設備。根據 本發明’某些實施例中提供之研磨頭可具有頂位於相 對且平行於底板之平面中。—對前導向滾軸可位於頂板與 〇 底板之間。第-與第二對後滚軸亦可位於頂板與底板之間 並相對於各自的前滚軸。後 便/袞軸可用以挾持繞送到滾軸之 間的研磨帶，使得研磨帶 . 維持對準（alignment)於滾轴上而 不需要沿著研磨帶長度的張 ^ 張力。前滾軸與後滾軸可經配置 以將研磨帶圍繞或越過襯 会 势而配置。某些實施例中’各對 傻展袖中的兩個後滚轴之 ^ ^ 间的間隔係受到限制，使得研磨 听可藉由滾轴之壁而在側 廢黑 面方向中受限。這有助於確保研 湛V不自研磨頭脫落， 使係Μ最小的研磨帶張力數值刼 6 200908124 作該設備。 本發明提供清潔與/或研磨基材邊緣之改良方法與設 備。參照第1圖’基材100可包括兩個主要表面102、102, 與邊緣104。基材1〇〇的各個主要表面1〇2、1〇2,可包括元 件區106、106’與排除區108、108’（然而一般而言，兩個 主要表面102、102’僅有一個包括元件區與排除區）。排除 區1〇8、108’可作為元件區1〇6、1〇6’與邊緣1〇4之間的缓 , 衝。基材100的邊緣104可包括外邊緣與斜角丨12、 114。斜角Π2' 114可位於外邊緣11〇與兩個主要表面 102、102’的排除區108、108’之間。本發明適於清潔與/ 或研磨基材100之外邊緣110與至少—斜角112、114而不 影響元件區1 06、1 〇6，。某些實施例中，亦可清潔或研磨 所有或部分的排除區1 〇 8、丨〇 8，。 如第2圖所示，描述邊緣研磨設傷2 〇 〇的實施例。設 備20 0包括基座或框架2〇2 ’其包括支待研磨帶201 一段 長度的頭204。研磨帶201可繃緊於前與後滚軸210、212 』 之間並進一步由襯墊2〇3所支撐。襯聲2〇3可透過致動器 (諸如’氣壓式滑座、液壓式撞杆、伺服馬遠驅動之推進器 等）（未顯示）而裝設於頭2 04。第2圖的邊緣研磨設備200 亦可包括耦接至傳動器2〇8 (諸如，馬建、逾輪、傳送帶、 鍵條等）的真空吸盤2〇5。不像適於旋轉基材1 〇〇使得基材 邊緣104倚靠研磨帶2〇1而旋轉且包括_或更多驅動滾軸 (未顯示）與導向滚軸（未顯示）的某些實施例，利用真空吸 盤205的優點為真空吸盤205不需要接觸即將研磨之基材 200908124 動滚軸上且再度沉 清潔滾轴的需求。 緣104的可能性。 ，可達成高速旋轉 與捲取（take-up)捲 邊緣1 〇4。因此，可排除微粒累積於驅 積於基材邊緣1 04上的可能性。亦排除 再者’亦可排除傷害滚軸或劃傷基材邊 藉由將基材100固持於真空吸盤2〇5中 而不具有明顯震動。 藉由一組捲軸（包括供應捲軸2〇9 捲輛209、211可由一 軸211)將研磨帶201提供給頭2〇4Set the grinding system, the 5 200908124 method. The method includes rotating a substrate; contacting the edge of the substrate with the polishing head, wherein the polishing head includes a pair of front rollers and two pairs of rear rollers; routing the abrasive belt between the first pair of rear rollers, surrounding The first and second front rollers are then wound between the second pair of rear rollers such that the length of the length of the abrasive belt between the first and second front rollers contacts and grinds the edge of the substrate. Further features and aspects of the present invention will become more fully apparent from the Detailed Description of the appended claims. [Embodiment] The present invention provides improved methods, systems and apparatus for cleaning and/or grinding the edges of a substrate. When the substrate is rotated or otherwise moved (e. g., oscillated), the edge of the substrate is grounded by contacting the edge of the substrate (in some embodiments through the liner) with an abrasive polishing tape. However, the abrasive tape may come off the polishing head, even if the device is operated with a minimum abrasive tape tension value. Abrading heads provided in accordance with certain embodiments of the present invention may have a top that lies in a plane that is opposite and parallel to the bottom plate. - The front guide roller can be located between the top plate and the bottom plate. The first and second pairs of rear rollers may also be located between the top and bottom plates and relative to the respective front rollers. The rear/twist shaft can be used to hold the abrasive belt between the rollers so that the abrasive belt maintains alignment on the roller without the tension along the length of the belt. The front and rear rollers can be configured to orient the abrasive belt around or over the lining. In some embodiments, the spacing between the two rear rollers in each pair of staggered sleeves is limited such that the lapping can be limited in the direction of the side black side by the wall of the roller. This helps to ensure that the R-V does not come off the grinding head, so that the minimum tension of the belt tension is 刼 6 200908124. The present invention provides improved methods and apparatus for cleaning and/or grinding the edges of a substrate. Referring to Figure 1, substrate 100 can include two major surfaces 102, 102, and edges 104. Each of the major surfaces 1 〇 2, 1 〇 2 of the substrate 1 可 may include the element regions 106, 106 ′ and the exclusion regions 108 , 108 ′ (however, in general, only one of the two major surfaces 102 , 102 ′ includes Component area and exclusion area). The exclusion zone 1〇8, 108' can be used as a buffer between the component regions 1〇6, 1〇6' and the edge 1〇4. The edge 104 of the substrate 100 can include an outer edge and bevels 12, 114. The beveled Π 2' 114 may be located between the outer edge 11'' and the exclusion zones 108, 108' of the two major surfaces 102, 102'. The present invention is suitable for cleaning and/or grinding the outer edge 110 of the substrate 100 with at least - beveled edges 112, 114 without affecting the component regions 106, 1 〇 6, . In some embodiments, all or part of the exclusion zone 1 〇 8, 丨〇 8, may also be cleaned or ground. As shown in Fig. 2, an embodiment in which the edge grinding is set to 2 〇 is described. The device 20 0 includes a base or frame 2 〇 2 ' which includes a head 204 that supports a length of the belt 201 to be polished. The abrasive belt 201 can be tensioned between the front and rear rollers 210, 212" and further supported by the liner 2〇3. The lining 2 〇 3 can be mounted on the head 2 04 through an actuator such as a 'pneumatic slide, a hydraulic ram, a servo-horse driven pusher, etc. (not shown). The edge grinding apparatus 200 of Fig. 2 may also include a vacuum chuck 2〇5 coupled to the actuator 2〇8 (such as a horse built, a wheel, a conveyor belt, a key strip, etc.). Unlike certain embodiments suitable for rotating the substrate 1 such that the substrate edge 104 is rotated against the abrasive tape 2〇1 and includes _ or more drive rollers (not shown) and guide rollers (not shown), The advantage of utilizing the vacuum chuck 205 is that the vacuum chuck 205 does not need to be in contact with the substrate 20908124 to be ground on the moving roller and the need to clean the roller again. The possibility of edge 104. , can achieve high-speed rotation and take-up volume edge 1 〇 4. Therefore, the possibility that particles accumulate on the edge 106 of the substrate can be excluded. It is also excluded that the damage roller or the scratched substrate can be excluded by holding the substrate 100 in the vacuum chuck 2〇5 without significant vibration. The abrasive tape 201 is supplied to the head 2 by a set of reels (including the supply reel 2 〇 9 reels 209, 211 by a shaft 211)
或更多傳動器2 1 3、2 1 5 (例如’伺服馬達)所驅動，該傳動 器可提供索引此力’以允許特定數量的未使用研磨帶2〇1 向别推進或持續提供至基材邊緣丨〇4 ;與/或提供繃緊能 力’以允許研磨帶201延展（stretched taught)並施加壓力 於基材邊緣1 04 » 前與後滾軸210、212可適於施加不同量的張力於研磨 帶201與隨之的基材邊緣1〇4，因此獲得對邊緣研磨處理 的精確控制，其可用以補償不同邊緣幾何圖案與基材1 〇〇 中的改變（隨著材料自基材邊緣i 〇4移除）。 基材100可接觸研磨帶201長達約15至約150秒’這 係取決於應用之研磨帶類型、研磨帶的砂礫、旋轉速率、 所需之研磨量等。可應用較多或較少的時間。襯塾203(與 隨之的研磨帶201)與基材邊緣104之間的接觸搭配基材 100的特定旋轉速率可提供研磨帶2〇1與基材邊緣104之 間的相對移動，造成基材邊緣1〇4的研磨。取決於致動器 施加的力量大小、所選之墊的彈性、可膨脹之墊的膨脹量 與/或研磨帶上的張力量，可應用一受控之壓力量來研磨基 8Or more actuators 2 1 3, 2 1 5 (eg 'servo motor'), which can provide an index of this force 'to allow a certain number of unused abrasive belts 2〇1 to be propelled or continuously supplied to the base Material edge 丨〇4; and/or provide a taut capability' to allow the abrasive tape 201 to stretched and apply pressure to the edge of the substrate. 104 » The front and rear rollers 210, 212 may be adapted to apply different amounts of tension The abrasive tape 201 and the consequent edge of the substrate are 1〇4, thus obtaining precise control of the edge grinding process, which can be used to compensate for variations in the different edge geometry patterns and the substrate 1 (as the material is from the edge of the substrate) i 〇4 removed). The substrate 100 can contact the abrasive belt 201 for from about 15 to about 150 seconds' depending on the type of abrasive belt applied, the grit of the abrasive belt, the rate of rotation, the amount of milling required, and the like. More or less time can be applied. The contact between the liner 203 (and the accompanying abrasive belt 201) and the substrate edge 104 in conjunction with the specific rotation rate of the substrate 100 provides for relative movement between the abrasive belt 2〇1 and the substrate edge 104, resulting in a substrate Grinding of the edge 1〇4. Depending on the amount of force applied by the actuator, the elasticity of the selected pad, the amount of expansion of the expandable pad, and/or the amount of tension on the abrasive belt, a controlled amount of pressure can be applied to grind the base 8
200908124 材邊緣 1 0 4。因此，本發明可提供邊緣研磨處理的 制，其可用來補償不同的邊緣幾何圖案與基材1 00 化（隨著材料自基材邊緣1 04移除）。 基材100可旋轉於水平面中。基材邊緣104可 垂直於研磨帶201、墊203與/或研磨頭204。額外 的實施例中，基材1 〇 〇可旋轉於垂直平面、另一非 中與/或在不同旋轉平面之間移動。 第3圖係描述根據本發明之邊緣清潔系統3 0 0 示例性實施例的平面圖。第3圖描述之邊緣研磨系 包括三個頭3 04，各自附著於研磨設備3 0 3。此處顯 磨設備3 0 3具有與參照第2圖描述於上之研磨設備 似的特徵。如第2圖與第3圖所示，可用任何可實 合來使用任何數目與類型的頭 304。可使用一或更 設備3 03來執行基材[邊緣/凹槽]研磨。一或更多 中，可應用複數個研磨設備 3 0 3，其中各個研磨設 有相似或不同的特徵與/或機構。最近的實例中，特 磨設備3 0 3可用於特定的操作。例如，一或更多複 磨設備3 0 3可適於執行相對粗糙/粗劣的研磨與/或 而另外的一或更多複數個研磨設備可適於執行相對 研磨與/或調節。可依序應用研磨設備3 0 3，因此例 執行粗糙的研磨步驟並接著應用細微的研磨步驟而 需要或根據研磨方法使得調節成為相對粗糙的研磨 所示，複數個研磨設備3 0 3可位於單一腔室或模組 者一或更多研磨設備3 0 3可位於不同的腔室或模組 準確控 中的變 對準或 或替代 水平面 的另一 統3 00 示之研 200相 行的組 多研磨 實施例 備可具 定的研 數個研 調節， 細微的 如首先 可依照 。如圖 中，或 中。當200908124 Material edge 1 0 4. Accordingly, the present invention can provide an edge grinding process that can be used to compensate for different edge geometry patterns and substrate 100 (as material is removed from substrate edge 104). The substrate 100 can be rotated in a horizontal plane. The substrate edge 104 can be perpendicular to the abrasive tape 201, the pad 203, and/or the polishing head 204. In an additional embodiment, the substrate 1 〇 can be rotated in a vertical plane, in another non-center, and/or between different planes of rotation. Figure 3 is a plan view depicting an exemplary embodiment of an edge cleaning system 300 in accordance with the present invention. The edge grinding system depicted in Figure 3 includes three heads 384, each attached to a grinding apparatus 300. Here, the sharpening device 303 has features similar to those of the grinding device described above with reference to Fig. 2. As shown in Figures 2 and 3, any number and type of headers 304 can be used in any combination. Substrate [edge/groove] grinding can be performed using one or more equipment 03. In one or more, a plurality of abrasive devices 300 can be applied, wherein each of the abrasives has similar or different features and/or mechanisms. In the most recent example, the special grinding device 330 can be used for a specific operation. For example, one or more regrind devices 330 may be adapted to perform relatively coarse/poor grinding and/or another one or more plurality of grinding devices may be adapted to perform relative grinding and/or conditioning. The grinding apparatus 330 can be applied in sequence, thus performing a rough grinding step and then applying a fine grinding step to require or according to the grinding method to make the adjustment a relatively rough grinding, the plurality of grinding equipment 300 can be located in a single The chamber or module one or more of the grinding devices 310 can be located in different chambers or modules in the precise control of the alignment or alternative to the horizontal plane. The embodiment can be adjusted in a number of studies, and the fineness can be as follows. As shown in the figure, or in the middle. when
200908124 應用多個腔室時，可應用機器人或另一類型的傳送 腔室之間移動基材，以便依序或另外地應用不同腔 研磨設備。 此外，上述之多頭實施例中，各個頭3 0 4可使 結構或類型的研磨帶2 0 1 (諸如，不同的砂礫、材料、 壓力等）。可同時、個別與/或以任何順序來應用任 的頭304。頭304可置於不同位置與不同方位（諸如 材邊緣104對準、垂直於基材邊緣104、與基材邊 夾一角度等），好讓研磨帶201去研磨基材100之邊 的不同部分。 某些實施例中，一或更多頭304可適於藉由框 而圍繞或沿著基材邊緣 1 04擺動或移動（例如，圍 100之切線軸與/或相對於基材 100之周圍而角’ (angularly translate))以便研磨基材100的不同部分 的頭304可用於不同的基材100、不同類型的基材。 進一步描述於下，系統3 0 0可進一步包括控制 (諸如，程式化電腦、程式化處理器、微控制器、閘 邏輯電路、嵌入式即時處理器等），其可控制用來旋 100之傳動器與/或用來將研磨墊203壓向基材邊緣 致動器。注意控制器3 0 6可耦接（諸如，電性、機械 壓式、液壓式等）至各個複數個致動器。同樣地， 306可適於自一或更多傳動器與/或致動器接收反饋 其表示施加用來旋轉基材1 0 0 (例如，旋轉固持基 之真空吸盤）與/或啟動致動器去將研磨墊 203壓 機構於 室中的 用不同 張力、 何數目 ，與基 緣104 緣104 架202 繞基材 向轉移 。不同 器306 陣列、 轉基材 104的 性、氣 控制器 信號， 材 100 向基材 10 200908124 1 0 0的能量大小。這些反饋信號可用來測定何時已經移除 薄膜之特定層與/或是否已經發生足夠數量的研磨。 轉向第4圖’提供與研磨帶201 —起使用（第5圖所示） 以清潔基材100之邊緣104的不範性研磨頭4〇〇。研磨帶 201接觸基材邊緣104的表面包括研磨材料以促進研磨。 一或更多實施例中’研磨帶201可由一或更多不同材料所 製成’包括諸如氧化鋁、氧化矽、碳化矽等。亦可應用其 他材料。某些實施例中’雖然可應用其他的尺寸，但形成 研磨材料之研磨微粒的尺寸範圍係約0.5微米至約3微 米。雖然可應用其他的寬度’但可應用範圍約〇.2英忖至 約1 · 5英叶不同寬度之研磨帶。一或更多實施例中，研磨 帶2 0 1可為約0 · 0 0 2至約0.0 2英叶厚並在使用塾之實施例 中可禁得起約1至5 lbs.的張力，而在不具有墊之實施例 中可禁得起約3至8 lbs.的張力。可應用具有不同厚度與 強度的其他帶。供應與捲取捲軸209、211 (第2圖）的直徑 可約為1英吋至約4英吋並能夠固持約5 〇 0 〇英吋的研磨帶 201 ;且可由諸如聚氨酯（p〇lyUrethane)、聚二氟乙烯 (polyvinyl diflU0ride，PVDF)等任何可實施之材料所構 成。可應用其他材料。供應與捲取捲軸捲軸209、210亦可 具有其他尺寸並固持其他數量的研磨帶201。 研磨頭4〇〇可包括頂板4〇2，其係位於相對且平行於 底板404之平面中。一對前滚軸4〇6a、4〇6b可位於頂板 4〇2 〃底板404之間’使得前滚軸406a、406b能夠在垂直 ' 上垂直於頂板與底板402、404之平面中旋轉。 200908124 換句話說，旋轉轴可垂直於（或大致上如此）頂板 402、404之水平面，因此旋轉平面可平行於頂板 402、404。第一與第二對後滚軸408a與408b可位 與底板4 0 2、4 0 4之間，並分別相對於各個前滚軸 406b，並可在與前滾軸406相同的旋轉方向中旋轉 滚軸可設計成最大的直徑以減少摩擦。滾軸可 軸承材料所構成，包括（但不限於）PTFE與PEEK。 f、 轉向第5圖，描述第4圖所示之斜角研磨模組 頭4 0 0 (移除頂板4 0 2以便清楚顯示）之概要頂視圖 軸與後滾軸406a、406b & 408a、408b可經配置而 帶201 (未顯示於第4圖但出現於第5圖）圍繞襯塾 配置。滾軸406a、406b、408a、408b的排列可準確 2 〇 1圍繞襯墊2 0 3而對準。某些實施例中，後滾軸 4 0 8b可自我鎖定。某些實施例中，第一對中兩個 4 0 8 a與第二對中兩個後滾軸4 0 8 b之間的距離係非 的。因此，繞送到各個第一與第二對後滚軸4 0 8 a 〇 的研磨帶201係因滚軸408a、408b之壁而被限於 向。這有助於確保帶201不自研磨頭400脫落，即 以最小的帶2 0 1張力值操作設備。可應用其他 408a、 408b 方向 。 某些實施例中，後滚軸408a、408b如此緊密的 得後滾軸408a、408b可有效地夾住研磨帶201並避 帶201沿著後滾軸4〇8a、4〇8b之縱向移動，並因此 磨帶201沿著前滾軸4〇6a、4〇6b之縱向移動以及避 與底板 、底板 於頂板 406a 與 〇 由塑膠 的研磨 。前滾 將研磨 203而 地將帶 408a、 後滾軸 常有限 與 408b 橫向方 便係在 後滾轴 配置使 .免研磨 ,避免研 :免研磨 12 200908124 帶201自襯墊203滑落。換句話說，不需要依靠沿著研磨 ττ 201長度（即’研磨帶2〇1之縱向）施加於研磨帶201的 而強度來保持研磨帶201對準於前滾軸406a、406b與襯墊 2〇3上’本發明藉由利用兩對後滾軸4〇8a、408b而可促進 將研磨帶201對準於前滾軸4〇6a、406b與襯墊203上， 兩對後滚軸408a、408b各自夾住前滾轴406a、406b任一 側上之研磨帶2〇1，其可讓研磨帶2〇1移動通過研磨頭400 但不橫向離開滚轴朝向頂板4〇2或底板4〇4。 某些實施例中，前滾軸406a、406b可鄰近襯墊203 而配置（例如，如此配置以引導研磨帶2 0 1至幾乎與襯墊 203共平面的平面）以減少爲使研磨帶201接觸基材1〇〇之 邊緣’襯墊203須對研磨帶201造成的位移量。可應用其 他前滾轴方向。前滾軸舆後滾轴4〇6a、406b、408a、408b 排列可減少襯墊203上研磨帶20 1張力效果。某些實施例 中（例如，利用滾軸襯墊203之實施例），可移除前滾軸 406a、406b並將研磨帶201正好繞送到概塾203上。 某些實施例中’裝設於頭400之研磨帶2〇1的捲軸可 由一或更多的傳動器2 1 3、2 1 5 (例如’伺服馬達）所驅動（第 2圖）。傳動器213、215可提供索引能力與繃緊能力兩者， 索引能力可讓特定數量的未使用研磨帶2〇1前進或持續提 供至基材邊緣104 ;而繃緊能力可讓研磨帶2〇1延展並施 加壓力於基材邊緣104。替代地或額外地，可利用裝設於 頭400之概塾203並由致動器推動與/或由可膨脹墊的膨脹 而將研磨帶2 0 1之研磨側壓向基材邊緣〗〇 4。此處所述之 13 200908124 實施例中，研磨頭400可圍繞基材100之邊緣104擺動以 研磨整個基材邊緣104。擺動角度可包括例如大於或小於 9〇°。可應用其他適當的擺動角度。操作中，隨著基材1〇〇 選轉時圍繞基材1 0 0之外邊緣11 0的切線軸角向轉移頭 4 00並因此使研磨帶201之一部分接觸且符合基材1〇〇之 邊緣104輪廓而達到擺動移動。例如，研磨頭400可在上 斜角11 2處開始研磨，經調整以研磨外邊緣11 〇接著再度 經調整以研磨下斜面114。當研磨頭400圍繞邊緣1〇4而 擺動時，可旋轉整個基材1〇〇以便研磨基材1〇〇之整個周 圍邊緣104。如上所述’基材1〇〇可藉由真空吸盤或傳動 滚袖而旋轉。可應用其他適當的基材旋轉裝置。某些實施 例中’頭400可適於持續或間歇地在不同位置間擺動。如 上所述頭400可由程式化或使用者操作之控制器3〇6所200908124 When multiple chambers are used, the substrate can be moved between the robot or another type of transfer chamber for sequential or additional application of different chamber grinding equipment. Moreover, in the above-described multi-head embodiment, each of the heads 3 0 4 may have a structure or type of abrasive belt 20 1 (such as different grit, material, pressure, etc.). Any of the headers 304 can be applied simultaneously, individually, and/or in any order. The head 304 can be placed in different positions and in different orientations (such as the edge of the material 104, perpendicular to the edge of the substrate 104, at an angle to the edge of the substrate, etc.) so that the abrasive tape 201 can be polished to different portions of the side of the substrate 100. . In some embodiments, one or more of the heads 304 can be adapted to swing or move around or along the edge of the substrate 104 by a frame (eg, a tangential axis of the perimeter 100 and/or relative to the periphery of the substrate 100) The head 304 for grinding different portions of the substrate 100 can be used for different substrates 100, different types of substrates. Further described, the system 300 can further include controls (such as a stylized computer, a programmed processor, a microcontroller, a gate logic circuit, an embedded instant processor, etc.) that can control the drive used to rotate 100 And/or used to press the polishing pad 203 against the substrate edge actuator. Note that the controller 306 can be coupled (e.g., electrically, mechanically, hydraulically, etc.) to each of the plurality of actuators. Likewise, 306 can be adapted to receive feedback from one or more actuators and/or actuators that it is meant to apply to rotate the substrate 1000 (eg, a vacuum chuck holding the holding base) and/or actuate the actuator The polishing pad 203 is pressed into the chamber with different tensions and numbers, and the base 104 edge 104 is transferred around the substrate. The different 306 arrays, the properties of the substrate 104, the gas controller signal, the energy of the material 100 to the substrate 10 200908124 1 0 0 . These feedback signals can be used to determine when a particular layer of film has been removed and/or whether a sufficient amount of grinding has occurred. Turning to Fig. 4' provides an irregular grinding head 4 that is used with the polishing tape 201 (shown in Fig. 5) to clean the edges 104 of the substrate 100. The surface of the abrasive belt 201 that contacts the edge 104 of the substrate includes an abrasive material to facilitate grinding. In one or more embodiments, the abrasive belt 201 can be made of one or more different materials, including, for example, alumina, cerium oxide, tantalum carbide, and the like. Other materials can also be applied. In some embodiments, although other dimensions are applicable, the abrasive particles forming the abrasive material range in size from about 0.5 microns to about 3 microns. Although other widths can be applied, a range of abrasive tapes having a width ranging from about 2 inches to about 15,000 inches can be applied. In one or more embodiments, the abrasive tape 210 can be from about 0. 0 0 2 to about 0.02 inches thick and can withstand a tension of about 1 to 5 lbs. in embodiments using ruthenium, without Tensiles of about 3 to 8 lbs. can be withheld in embodiments having a pad. Other tapes with different thicknesses and strengths can be applied. The supply and take-up reels 209, 211 (Fig. 2) may have a diameter of from about 1 inch to about 4 inches and can hold about 5 〇 0 〇 of the abrasive belt 201; and may be made of, for example, polyurethane (p〇lyUrethane) Polyurethane (polyvinyl diflU0ride, PVDF) and other materials can be implemented. Other materials can be applied. The supply and take-up reel spools 209, 210 can also be of other sizes and hold other numbers of abrasive belts 201. The polishing head 4 can include a top plate 4〇2 that lies in a plane that is opposite and parallel to the bottom plate 404. A pair of front rollers 4〇6a, 4〇6b may be located between the top plate 4〇2 〃 bottom plate 404' such that the front rollers 406a, 406b are rotatable in a plane perpendicular to the top and bottom plates 402, 404 in a vertical direction. 200908124 In other words, the axis of rotation can be perpendicular (or substantially) to the horizontal plane of the top plates 402, 404, and thus the plane of rotation can be parallel to the top plates 402, 404. The first and second pairs of rear rollers 408a and 408b are positionable between the bottom plates 4 0 2, 4 0 4 and respectively with respect to the respective front roller shafts 406b and are rotatable in the same rotational direction as the front roller shaft 406 The roller can be designed to the largest diameter to reduce friction. The rollers are constructed of bearing materials including, but not limited to, PTFE and PEEK. f. Turning to FIG. 5, a schematic top view axis and rear roll axes 406a, 406b & 408a of the bevel grinding module head 400 (removing the top plate 420 for clear display) shown in FIG. 4 are described. 408b can be configured with strap 201 (not shown in Figure 4 but appearing in Figure 5) around the liner configuration. The arrangement of rollers 406a, 406b, 408a, 408b can be aligned exactly 2 〇 1 around pad 203. In some embodiments, the rear roller 4 0 8b is self-locking. In some embodiments, the distance between two 4 0 8 a of the first pair and the two rear rollers 4 0 8 b of the second pair is not. Therefore, the polishing tape 201 wound around each of the first and second pair of rear rollers 4 0 8 〇 is restricted by the walls of the rollers 408a and 408b. This helps to ensure that the belt 201 does not come off the grinding head 400, i.e., operates the apparatus with a minimum belt tension value of 210. Other 408a, 408b directions can be applied. In some embodiments, the rear rollers 408a, 408b are so tight that the rear rollers 408a, 408b effectively clamp the abrasive belt 201 and avoid the belt 201 moving longitudinally along the rear rollers 4A, 8a, 4b, 8b. Therefore, the belt 201 is moved longitudinally along the front rollers 4〇6a, 4〇6b and from the bottom plate, the bottom plate 406a and the top plate 406a. The front roll will grind 203 and the belt 408a, the rear roller is often limited and the 408b is horizontally attached to the rear roller. The grinding is avoided, and the grinding is avoided. 12: 200908124 The belt 201 is slid from the liner 203. In other words, it is not necessary to rely on the strength applied to the abrasive tape 201 along the length of the abrasive ττ 201 (i.e., the longitudinal direction of the abrasive tape 2〇1) to keep the abrasive tape 201 aligned with the front rollers 406a, 406b and the liner 2 The present invention facilitates aligning the abrasive belt 201 with the front rollers 4〇6a, 406b and the liner 203 by utilizing two pairs of rear rollers 4〇8a, 408b, two pairs of rear rollers 408a, Each of the 408b clamps the abrasive belt 2〇1 on either side of the front rollers 406a, 406b, which allows the abrasive belt 2〇1 to move through the polishing head 400 but does not laterally exit the roller toward the top plate 4〇2 or the bottom plate 4〇4 . In some embodiments, the front rollers 406a, 406b can be disposed adjacent to the liner 203 (eg, configured to direct the abrasive belt 210 to a plane that is nearly coplanar with the liner 203) to reduce contact with the abrasive belt 201. The amount of displacement of the edge of the substrate 1 'pad 203 to the abrasive tape 201. Other front roller directions can be applied. The arrangement of the front roller rear rollers 4〇6a, 406b, 408a, 408b reduces the tension effect of the abrasive tape 20 1 on the liner 203. In some embodiments (e.g., using an embodiment of the roller pad 203), the front rollers 406a, 406b can be removed and the abrasive tape 201 can be routed exactly to the profile 203. In some embodiments, the spool of the abrasive belt 2〇1 mounted on the head 400 can be driven by one or more actuators 2 1 3, 2 1 5 (e.g., 'servo motors' (Fig. 2). The actuators 213, 215 provide both indexing and tightening capabilities, and the indexing capability allows a certain amount of unused abrasive tape 2〇1 to be advanced or continuously provided to the substrate edge 104; and the tightening capability allows the abrasive tape to be 2〇 1 Extend and apply pressure to the edge 104 of the substrate. Alternatively or additionally, the abrasive side of the abrasive strip 210 can be pressed against the edge of the substrate by the profile 203 mounted on the head 400 and pushed by the actuator and/or by the expansion of the inflatable pad. . In the embodiment of 13 200908124 described herein, the abrading head 400 can be swung around the edge 104 of the substrate 100 to grind the entire substrate edge 104. The swing angle may include, for example, greater than or less than 9 〇. Other suitable swing angles can be applied. In operation, as the substrate 1 is selectively rotated, the tangential axis of the outer edge 11 0 of the substrate 100 is turned toward the transfer head 4 00 and thus a portion of the abrasive tape 201 is brought into contact with the substrate 1 The edge 104 is contoured to achieve a oscillating movement. For example, the abrading head 400 can begin grinding at an upper bevel 11 2 , adjusted to grind the outer edge 11 , and then again adjusted to grind the lower bevel 114 . When the polishing head 400 is swung around the edge 1〇4, the entire substrate 1 can be rotated to grind the entire peripheral edge 104 of the substrate 1〇〇. As described above, the substrate 1 can be rotated by a vacuum chuck or a drive sleeve. Other suitable substrate rotation devices can be applied. In some embodiments the 'head 400 can be adapted to oscillate between different positions continuously or intermittently. As described above, the head 400 can be programmed by a user or a user.
或者，當基材100未旋轉 丨/或稍微調整。又其他實施例中，當頭 1以及圍繞基材1 〇〇周圍旋轉時，基材 滾袖與後滾軸 406a、406b、408a、408b J的旋轉過程中，帶201與基材100之 •下係始终如一的。 可以連續循環裝設於頭400上與/ 地（或間歇地）前進以研磨與/或提高基 效果。例如’帶2 01的前進可用以產 。某些實施例中，帶20 1可來回擺動 疋或旋轉基材100上之研磨效果。某些 14Alternatively, when the substrate 100 is not rotated, it is slightly adjusted. In still other embodiments, the belt 201 and the substrate 100 are rotated during rotation of the base roll sleeve and the rear rollers 406a, 406b, 408a, 408b J as the head 1 and the periphery of the substrate 1 are rotated. Consistent. It can be continuously circulated on the head 400 and/or (or intermittently) advanced to grind and/or enhance the base effect. For example, the advance of the band 2 01 can be used to produce. In some embodiments, the belt 20 1 can swing back and forth or rotate the abrasive effect on the substrate 100. Some 14
200908124 實施例中，研磨過程中可保持帶2 0 1不 張力與/或強度可根據不同因素而有所改 帶201的角度與/或位置、研磨時間、基 將研磨之層、移除之材料數量、即將旋 轉基材之傳動器所用之電流量等。可應 磨移動與/或方法的任何組合。這些方法 理的額外控制，其可用於在帶201圍繞 1 04旋轉/移動時補償即將移除之材料 化。 第6圖係描述裝載用於斜角研磨| 2 0 1的示範方法之流程圖。步驟S 6 0 2中 帶 201。選擇之研磨帶種類可根據例如 之液體化學物質、研磨帶耐久性、研磨處 步驟 S604中，將研磨帶 201之捲軸 3 0 0。某些實施例中，系統3 0 0可包括帶 以提供研磨帶）與捲取捲軸 2 1 1 (用以4 帶）。可將研磨帶2 0 1之供應捲軸2 0 9插 捲軸位置。接著在步驟S 6 0 6中，研磨 一對後滚軸4 0 8 a之間。將研磨帶2 0 1繞 軸408a與408b的兩個滚軸之間可避免 研磨處理之研磨帶201橫向移動。接著 可將研磨帶 201圍繞第一前滾軸406a 著，分別在步驟S 6 1 0與S 6 1 2中，可將 襯墊203上及圍繞第二前滾軸406b之 動。再者，帶201 .變，包括諸如研磨 材所用之材料、即 轉之基材速度、旋 用上述可施行之研 提供對邊緣研磨處 或相對於基材邊緣 中的幾何形狀與變 \統 3 0 0之研磨帶 ，選擇適當的研磨 特定的研磨、使用 i理等而有所改變。 插入斜角研磨系統 的供應捲軸209(用 J收使用過的研磨 入系統3 0 0之供應 帶2 0 1可繞送到第 送到形成各對後滾 或減少可能會中斷 在步驟S608中， 之外側而配置。接 研磨帶2 0 1繞送到 外側。可藉由襯墊 15 200908124 203將襯墊203上之研磨帶2〇1部分壓向基材wo之邊緣 104上。基材10〇之旋轉以及研磨帶2〇1倚靠基材1〇〇之 邊緣104的移動係研磨基材邊缘1〇4的方法。步驟Μ" 中，研磨帶2(Π可接著繞送到第二對後滾轴4〇“之間。步 驟S616中’接著將研磨帶2〇1之鬆脫端固定至捲取捲軸 211。清潔一或更多基材ι〇〇之後，用 I便用於上述之清潔的研磨 帶201部分會磨損。因此，可驅動捲 捲取捲軸211自供應捲 軸209朝向捲取捲輛211拉取固定數旦 致里的研磨帶201。此 方式中’可在捲取捲軸211盘供廣接± "供應捲軸209之間提供未使 用的研磨帶2 0 1部分。可以相似於上、七 上迤之方式，應用未使 用的研磨帶20 1部分接著清潔一或 尺多基材100。因此， 可用未使用部分來取代磨損部分的 Μ磨帶201而極小或不 會影響基材處理產量。某些實施例ψ j Τ ’研磨帶201可被視 為「磨損」’例如在應用至預定數目砧 的基材之後。舉例而言， 實施之研磨類型會影響基材之預宏 數目。替代之實施例 中’研磨帶2 01可被視為「磨損 ' 例如在研磨微粒/材料 之尺寸或數目已經減少特定數量之接 货。舉例而言，在控制 器3 06自感測器接收反饋信號之後 Ύ作出此判定。 應當理解此處描述之本發明的 遭緣研磨設備可用於除 了適於斜角與邊緣研磨與/或移除款 I材上薄膜那些以外之 設備。再者，熟悉技術之人士可明& 頌得知此處所述之設備 可用於研磨與/或移除以任何方向 嗜如，水平、垂直、傾 斜等）支撐之基材的邊緣上之薄膜。 再者，應該理解雖然僅揭露清、私 ^圓形基材的實施例， 16 200908124 但本發明可經改良以清潔具有其他形狀的基材（諸如， 顯示器的玻璃或聚合物板）。再者，雖然上方顯示藉由 處理單一基材，但在某些實施例中，設備可同時處理 個基材。 上述僅揭露本發明之示範性實施例。熟悉技術之 可輕易得知位於本發明範圍内上述設備與方法的修飾 此，雖然已經參照其之示範性實施例而揭露本發明， 當理解其他實施例可能會位於隨後之申請專利範圍所 之本發明的精神與範圍内。 【圖式簡單說明】 第1圖係基材部分之橫截面概要圖。 第2圖係描述根據本發明之邊緣清潔設備的示例 施例之透視圖。 第3圖係描述根據本發明之邊緣清潔系統的示例 施例之平面圖。 第4圖係根據本發明之研磨頭的透視圖。 第5圖係根據本發明之斜角研磨模組的研磨頭之 圖。 第6圖係描述根據本發明對基材邊緣應用研磨帶 程圖。 【主要元件符號說明】 100 基材 102、102’ 主要表面 平板 設備 複數 人士 。因 但應 界定 性實 性實 概要 之流 17 200908124 104 邊 緣 106 、1065 元件區 108、 108’ 排除 區 110 外邊! 112、 114 斜角 200 邊緣研 •磨設備 201 研 磨 帶 202 框架 203 襯 墊 204 、304、 400 研 磨 頭 205 真 空 吸 盤 208 、213、 215 傳 動 器 209 供 應 捲 軸 2 10 ' 4 0 6a 、406b 前 滚 軸 211 捲 取 捲 軸 212 、408a > 408b 後 滚 軸 300 邊 緣 清 潔系 統 303 研磨’ 設備 306 控 制 器 402 頂板 404 底 板 L) 18200908124 In the embodiment, the belt can be maintained during the grinding process. The tension and/or strength can be changed according to different factors. The angle and/or position of the belt 201, the grinding time, the layer to be ground, and the material to be removed. The amount, the amount of current used to drive the actuator of the substrate, and the like. Any combination of movement and/or methods can be applied. Additional control of these methods can be used to compensate for the material being removed as the belt 201 rotates/moves around 104. Figure 6 is a flow chart depicting an exemplary method of loading a bevel grind|200. In step S 6 0 2, there is a band 201. The type of the abrasive tape to be selected may be a reel 300 of the abrasive tape 201 according to, for example, a liquid chemical, a polishing tape durability, and a grinding step S604. In some embodiments, system 300 can include a belt to provide a belt and a take-up spool 2 1 1 (for 4 belts). The supply spool 2 0 9 of the abrasive belt 2 0 1 can be inserted into the reel position. Next, in step S606, a pair of rear rollers 4 0 8 a are ground. The abrasive belt 201 is prevented from moving laterally between the two rollers of the shafts 408a and 408b by the grinding belt 210. The abrasive tape 201 can then be wrapped around the first front roller 406a, and the pad 203 can be moved over and around the second front roller 406b in steps S6 1 0 and S 6 1 2 , respectively. Furthermore, the strips include, for example, the materials used for the abrasive material, i.e., the speed of the substrate to be rotated, and the use of the above-described provable geometry to provide edge-grinding or geometrical shapes in the edge of the substrate. The 0 0 grinding belt is changed by selecting an appropriate grinding specific grinding, using the same, and the like. Inserting the supply reel 209 of the bevel grinding system (the supply belt 200 of the grinding system 300 used by J can be wound to the first delivery to form each pair of reels or the reduction may be interrupted in step S608, Arranged on the outside. The abrasive tape 20 is wound around the outside. The abrasive tape 2〇1 on the liner 203 can be pressed against the edge 104 of the substrate wo by the liner 15 200908124 203. The substrate 10〇 The rotation and the movement of the polishing tape 2〇1 against the edge 104 of the substrate 1 are a method of grinding the edge 1〇4 of the substrate. In the step quot", the polishing tape 2 (Π can then be wound to the second pair of rolls) The shaft 4 〇 "between. In step S616", the loose end of the grinding belt 2〇1 is then fixed to the take-up reel 211. After one or more substrates are cleaned, I is used for the above cleaning. The portion of the abrasive tape 201 is worn. Therefore, the driveable take-up reel 211 can be pulled from the supply reel 209 toward the take-up reel 211 to fix the polishing tape 201 for a few deniers. In this manner, the reel can be supplied on the take-up reel 211. Width ± " supply reel 209 provides an unused abrasive belt 2 0 1 part. Can be similar to the upper In the manner of the seven tops, the unused abrasive tape 20 1 is applied to the one or more multi-substrate 100. Therefore, the worn portion of the honing tape 201 can be replaced with an unused portion with little or no effect on the substrate processing yield. Certain embodiments ψ j Τ 'The abrasive belt 201 can be considered "wearing", for example, after application to a predetermined number of anvil substrates. For example, the type of grinding performed can affect the number of pre-macroes of the substrate. In the embodiment, the 'grinding tape 201' can be regarded as "wearing", for example, when the size or number of abrasive particles/materials has been reduced by a certain amount of receiving. For example, the controller 306 receives a feedback signal from the sensor. This determination is then made. It should be understood that the edge grinding apparatus of the present invention described herein can be used in addition to those suitable for beveling and edge grinding and/or removal of films on the I material. It will be appreciated by those skilled in the art that the devices described herein can be used to grind and/or remove films on the edges of substrates that are supported in any direction, horizontally, vertically, tilted, etc. This understanding, while only revealing examples of clear, private, circular substrates, 16 200908124, can be modified to clean substrates having other shapes (such as glass or polymer sheets of displays). The display is by processing a single substrate, but in some embodiments, the device can process a substrate at the same time. The foregoing merely discloses an exemplary embodiment of the invention. It will be readily apparent to those skilled in the art that the above-described devices are within the scope of the invention. The present invention has been described with reference to the exemplary embodiments thereof, and it is understood that other embodiments may be within the spirit and scope of the invention as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a substrate portion. Figure 2 is a perspective view showing an exemplary embodiment of an edge cleaning apparatus in accordance with the present invention. Figure 3 is a plan view depicting an exemplary embodiment of an edge cleaning system in accordance with the present invention. Figure 4 is a perspective view of a polishing head in accordance with the present invention. Fig. 5 is a view of the polishing head of the bevel grinding module according to the present invention. Figure 6 depicts the application of an abrasive tape pattern to the edge of a substrate in accordance with the present invention. [Description of main component symbols] 100 Substrate 102, 102' Main surface Tablet device Plural. Therefore, it should be defined as a streamlined summary of reality 17 200908124 104 Edge 106, 1065 Component area 108, 108' Exclusion area 110 Outside! 112, 114 Bevel 200 Edge grinding equipment 201 Grinding belt 202 Frame 203 Pad 204, 304, 400 grinding head 205 vacuum chuck 208, 213, 215 actuator 209 supply reel 2 10 ' 4 0 6a, 406b front roller 211 take-up reel 212, 408a > 408b rear roller 300 edge cleaning system 303 grinding 'equipment 306 Controller 402 Top Plate 404 Backplane L) 18