200906267 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種電子裝置機殼及其製造方法。 【先前技術】 隨著行動通訊技術之發展，各式各樣之電子裝 動電話等競相湧現，令消費者可隨時隨地充分享受行：： 術帶來之種種便利，由此可攜式電子裝置 ： 費者所青睞。 勺飧大消 一機殼係電子裝置主要零元件之一，其廣泛用於電話、 计异器、電腦等電子裝置上。妙、 “、、、，為了提昇電子裝置之穿 飾性，一般電子裝置機殼上都印有圖案。 凌 方、去電子裝置機殼上形成圖案之方法為藉由油印之 方法將圖案印刷於電子裝置 子穿置機Μ夕冰主 外设上。由於圖案暴露於電 千衣置機设之外表，該圖案易於磨損。 电 電子般採用模内裝飾製程將圖案形成於 ::產？上。挺内裝飾係指產品於模具内射出成型 :土表面同時形成具有裝飾圖案之工藝技術，盆一 身又係預先形成一具有裝飾圖 、 進行熱壓成型以形成預層，然後對該薄膜層 再置於射出成型模呈之模二狀：：該薄膜層進行裁切後 内，薄膜層與溶融材料相^並开取^呈將古溶融材料注入模穴 雖铁，按用Τ π 、σ σ亚形成具有裝飾圖案之產品。 裝置之裝部性”隹如 ：，可提升電子 這就希望電子裝置機殼向㈣越向輕型化發展， 毕二潯方向叙展。而電子裝置機殼 200906267 之材貝-般為塑膠，如此，當電子裝置機殼輕薄化時，通 過模内裝飾制裎處理之塑膠殼體不能滿足剛性要求。 【發明内容】 ^ ;此有必要k供一種可避免圖案磨損及可提升 剛性之電子裝置機殼。 」杈开 另外，還有必要提供—種製造上述電子裝置機殼之方 法。 —-種電子裝置機殼，該電子裝置機殼包括—鑲件層及 一基體，該鑲件層與該基體通過模内注射之方法一體成 ΐ ,ϊ鑲件層包括—薄膜層及—硬質層，㈣膜層形成於 §亥硬質層上。 :種電子裝置機殼之製造方法，包括以下步驟： 提供-薄膜層.及一硬質層，將該薄膜層形成於該硬質 層上而形成一鑲件層； 提供一注射模具，該注射模具包括—母模及一盥該母 拉配合之-公模，.該母模或該公模之—方開設有__模穴， 另一方設置有_模仁； 、 =件層置於所述模穴内，且將該薄膜層與形成該 核八之板具壁相貼； 將該母模與該公模合模，該模穴與該模仁形成一 腔，該模腔與該電子裝置機殼之形狀及尺悄應；、 於上述模腔内注射熔融之熱塑性塑 ^ 同時上述镶件層與該基體一體成型為該電子==體’ 、部所述左射模具後開模，將該電子裝置機殼取出。 200906267 與習知技術相比，所述電子裝置機殼，由於圖案形 於該薄膜層之第—表面上，該第一表面面向該硬質層，如 此，可避免圖案因使用等因素而磨損。同日寺，該薄膜層與 該硬質層接合形成㈣件層後，該鑲件層再與絲體通過 权内主射之方法—體成型。如此，當電子裝置機殼輕薄化 時’通過該硬質件層可滿足剛性要求。 【實施方式】 睛麥閱圖 所不為本發明較佳員他例（冤子裝 殼2〇,該電子裝置機殼2〇包括一鑲件層^及 該基體24包括一外矣而B 〜士 4 祜外表面242及一内表面244，外表面242 ^吏用電子裝置機殼20時之外觀面，而内表面244為愈外 表面242相對之表面。該鑲件層22設置於基體& 面上，該鑲件層22鱼竽美俨74、s、風#〜, ，、及基胜24通過杈内注射之方法—I# 成型。 该鑲件層22包括_薄膜層 膜層222形成於該硬質層224上。 §亥硬質層2 2 4之材枓ότ p ,. 設有-通孔勝該=4Γ 璃或陶―泛， 機殼20之電子穿置之ss 42之位置與使用該電子裝! ^ ^子裝置之顯不視窗（圖未示）對應。 該薄膜層222之㈡刺_ π^ 物， 之材枓可廷用聚碳酸脂類高分子聚名 上形成有—圖安（㈣ 纟面2222，㈣-表面222: 224。 （圖未示），該第一表面2222面向硬質層 該基體24之材料可 選自聚氯乙烯、聚對苯二甲酸乙二 200906267 .醇酯、丙烯睛-苯乙烯-丁二烯共聚合物、聚碳酸酯、聚醯 亞胺、聚醚醯亞胺、聚苯硫、聚颯、聚苯乙烯、乙二醇改 性聚醋及聚丙烯聚合物中之一種或多種。 本發明較佳實施例之電子裝置機殼20之製造方法包 括如下步驟： 請參閱圖2，提供一薄膜層222，該薄膜層222之材料 可選用聚碳酸脂類高分子聚合物，其有一第一表面2222， 該第一表面2222上形成有圖案（圖未示）； 請參閱圖2，提供一硬質層224，該硬質層224可選用 金屬、玻璃或陶瓷，其開設有一通孔2242，該通孔2242 之位置與使用該電子裝置機殼20之電子裝置之顯示視窗 (圖未示）對應； 請參閱圖2，將上述薄膜層222以其第一表面2222與 該硬質層224接合之方式形成一鑲件層22，該接合方式可 為粘膠粘合； 提供一注射模具，請參閱圖3所示，該注射模具包括 一母模32及一與該母模32配合之一公模34，該母模32 開設一模穴322，該公模34設置有一模仁342 ; 請參閱圖3，將該鑲件層22置於所述母模32之模穴 322内，且該薄膜層222與形成該模穴322之模具壁相貼； 請參閱圖4，將該母模32與該公模34合模，該母模 32之模穴322與該公模34之模仁342形成一模腔36，該 模腔36與該電子裝置機殼20之形狀及尺寸對應； 請參閱圖5,於上述模腔36内注射熔融之熱塑性塑 9 200906267 膠，該熱塑性塑膠可為氣乙$，該炫融熱塑性塑膠充填 所述杈腔36，並成型成所述基體24，同時所述鑲件層u 與該基體24 —體成型為該電子裝置機殼2〇 ; 最後，冷卻所述注射模具後開模（圖未示），將形 之5亥電子褒置機殼2〇取出。 可以理解’可以於該母模32上設置一模仁（圖未示）， 而於該公模34上開設一模穴（圖未示）。 可以理解，該母模32之模穴322内還可有真空吸管 324 (如圖2所示），將該鑲件層22固定於該母模μ 穴322内。 m 一另11亥熱塑性塑膠可選自聚氯乙烯、聚對苯二甲酸乙 二醇醋、兩烯睛-笨乙烯_丁二烯共聚合物、聚碳酸醋、 醯亞胺、聚醚醯亞胺 '聚苯硫、聚颯、聚苯乙烯、乙二醇 改性聚醋：聚丙烯聚合物中之一種或多種。 — 斤述电子衣置機殼2〇，由於圖案形成於該 之第一表面上，兮笙 t 2 邊弟一表面面向該硬質層224，如此，可 避免圖㈣使料因素而磨損。 .此外，當遠模仁342為可活動之模仁時，熔融之熱塑 & 土膠成型為该電子裝置機殼2G後’還可通過推動該模仁 342對該電子驻吳地+ 、 攻置機设20進行模内壓縮處理’以消除薄 層222與基體+ b日 、 ^ 4之間之應力，從而增強該電子裝置機殼 2◦之透光效果。 上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以卜私 上所4者僅為本發明之較佳實施例，本發 200906267 .明之範圍並不以上述實施例為限，舉凡熟習本案技藝之人 士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡單說明】 ‘圖1係本發明電子裝置機殼之示意圖； 1 圖2係製造本發明電子裝置機殼之鑲件層之示意圖； 圖3係製造本發明電子裝置機殼之模具及薄膜層放進 該模具之母模時之示意圖； 圖4係本發明電子裝置機殼之薄膜層放入母模時，公 模與母模合模時之示意圖； 圖5係圖4注入溶融之熱塑性塑膠後，成型該電子裝 置機殼之示意圖。 【主要元件符號說明】 電子裝置機殼 20 内表面 244 鑲件層 22 母模 32 薄膜層 222 模穴 322 第一表面 2222 真空吸管 324 硬質層 224 公模 34 通孔 2242 模仁 342 基體 24 模腔 36 外表面 242200906267 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic device casing and a method of manufacturing the same. [Prior Art] With the development of mobile communication technology, a variety of electronically mounted telephones are emerging, so that consumers can fully enjoy the convenience of anytime and anywhere:: the convenience brought by the technology, thereby the portable electronic device : The fee is favored by the fee. One of the main components of a computer-based electronic device, which is widely used in electronic devices such as telephones, counters, and computers. Miao, ",,,, in order to improve the wearing of electronic devices, the general electronic device casing is printed with a pattern. The method of forming a pattern on the Lingfang and the electronic device casing is to print the pattern by the stencil printing method. The electronic device is placed on the main peripheral of the Μ 冰 ice. Since the pattern is exposed to the outside of the electric device, the pattern is prone to wear. The electro-electronics adopts an in-mold decoration process to form the pattern on the production: The inner decoration refers to the injection molding of the product in the mold: the surface of the soil simultaneously forms a decorative technique with a decorative pattern, and the basin is pre-formed with a decorative pattern, hot pressed to form a pre-layer, and then the film layer is repositioned. The injection molding die is in the form of a mold: after the film layer is cut, the film layer and the molten material are combined and opened, and the ancient molten material is injected into the cavity, although iron is used, and Τ π and σ σ are used. Forming a product with a decorative pattern. The installation of the device is as follows: For example, the electronic device can be upgraded to a lighter shape, and the direction of the second device is shown. The electronic device casing 200906267 is made of plastic, so that when the electronic device casing is light and thin, the plastic casing treated by the in-mold decoration cannot meet the rigidity requirement. SUMMARY OF THE INVENTION ^ It is necessary to provide an electronic device casing that can avoid pattern wear and increase rigidity. In addition, it is also necessary to provide a method of manufacturing the above-mentioned electronic device casing. - an electronic device casing, the electronic device casing comprising - an insert layer and a base body, the insert layer and the base body are integrally formed by in-mold injection, the ϊ insert layer comprises - a film layer and - a hard The layer, (4) film layer is formed on the hard layer of the sea. The manufacturing method of the electronic device casing comprises the steps of: providing a film layer and a hard layer, the film layer is formed on the hard layer to form an insert layer; and an injection mold is provided, the injection mold includes a master mold and a male mold, the male mold, the male mold or the male mold is opened with a __ mold cavity, and the other side is provided with a _ mold core; a hole in the hole, and the film layer is attached to the wall of the core plate; the master mold is clamped with the male mold, and the cavity forms a cavity with the mold core, the cavity and the electronic device casing The shape and the ruler are responsive; and the molten thermoplastic is injected into the cavity; and the insert layer and the base are integrally formed into the electron==body', and the left-hand mold is opened, and the electron is opened. The device housing is removed. 200906267 Compared with the prior art, the electronic device casing has a pattern formed on the first surface of the film layer, and the first surface faces the hard layer, thereby preventing the pattern from being worn due to factors such as use. In Tongji Temple, after the film layer is joined to the hard layer to form a (four) layer, the insert layer is then formed into a body by a method of directing the main body. Thus, when the electronic device casing is light and thin, the rigidity requirement can be satisfied by the hard material layer. [Embodiment] The eyeglasses are not preferred by the present invention. The electronic device casing 2 includes an insert layer and the base body 24 includes an outer casing and B. The outer surface 242 and the inner surface 244, the outer surface 242 is the outer surface of the electronic device casing 20, and the inner surface 244 is the opposite surface of the outer surface 242. The insert layer 22 is disposed on the substrate & On the surface, the insert layer 22 is made of 俨 、 74, s, wind # 〜, , and 基 胜 24 by means of intra-orbital injection - I#. The insert layer 22 includes a _ film layer 222 Formed on the hard layer 224. §Hard hard layer 2 2 4 material 枓ότ p ,. With - through hole wins the = 4 Γ glass or ceramic - pan, the housing 20 electronically placed ss 42 position and Use this electronic device! ^ ^ The sub-device's display window (not shown) corresponds to the film layer 222 (b) thorn _ π ^ material, the material 枓 廷 ting with polycarbonate polymer name formed on - Tuan ((4) 纟 2222, (4) - surface 222: 224. (not shown), the first surface 2222 faces the hard layer. The material of the substrate 24 may be selected from the group consisting of polyvinyl chloride and polyterephthalic acid. B2200906267. Alcohol ester, acrylonitrile-styrene-butadiene copolymer, polycarbonate, polyimine, polyether quinone, polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol One or more of the polyacetate and the polypropylene polymer. The manufacturing method of the electronic device casing 20 of the preferred embodiment of the present invention comprises the following steps: Referring to FIG. 2, a film layer 222 is provided, and the material of the film layer 222 is provided. A polycarbonate polymer having a first surface 2222 having a pattern (not shown) is formed on the first surface 2222. Referring to FIG. 2, a hard layer 224 is provided, and the hard layer 224 is optional. Metal, glass or ceramic, which has a through hole 2242 corresponding to a display window (not shown) of an electronic device using the electronic device casing 20; Referring to FIG. 2, the film layer 222 is Forming an insert layer 22 by bonding the first surface 2222 to the hard layer 224, the bonding manner may be adhesive bonding; providing an injection mold, as shown in FIG. 3, the injection mold includes a female mold 32 and one of the mating with the female mold 32 a die 34, the die 32 defines a cavity 322, the die 34 is provided with a die 342; Referring to Figure 3, the insert layer 22 is placed in the cavity 322 of the master 32, and the film The layer 222 is attached to the mold wall forming the cavity 322; referring to FIG. 4, the female mold 32 is clamped with the male mold 34, and the cavity 322 of the female mold 32 and the mold core 342 of the male mold 34 are formed. a cavity 36 corresponding to the shape and size of the electronic device casing 20; referring to FIG. 5, a molten thermoplastic 9 200906267 glue is injected into the cavity 36, and the thermoplastic plastic can be a gas. The dazzling thermoplastic thermoplastic fills the cavity 36 and is formed into the base body 24, and the insert layer u and the base body 24 are integrally formed into the electronic device casing 2; finally, the injection is cooled. After the mold is opened (not shown), the shape of the 5H electronic device is removed. It can be understood that a mold core (not shown) can be disposed on the female mold 32, and a mold cavity (not shown) is formed on the male mold 34. It will be appreciated that a vacuum tube 324 (shown in Figure 2) may be provided in the cavity 322 of the female mold 32 to secure the insert layer 22 within the female mold cavity 322. m 11 11H thermoplastics can be selected from polyvinyl chloride, polyethylene terephthalate, diene-pure ethylene-butadiene copolymer, polycarbonate, sulphide, polyether Amine polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol modified polyacetate: one or more of polypropylene polymers. — The electronic clothing casing 2 is formed. Since the pattern is formed on the first surface, a surface of the 兮笙t 2 faces the hard layer 224, so that the material of the figure (4) can be prevented from being worn. In addition, when the far mold core 342 is a movable mold core, the molten thermoplastic & mastic material is formed into the electronic device casing 2G, and the electrons can be moved to the ground by the mold core 342. The tapping machine 20 performs in-mold compression processing to eliminate the stress between the thin layer 222 and the substrate + b day, ^ 4, thereby enhancing the light transmission effect of the electronic device casing 2 . As described above, the present invention complies with the patent requirements of the invention and submits a patent application according to law. However, the present invention is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be equivalent to the spirit of the present invention. Modifications or variations are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an electronic device casing of the present invention; FIG. 2 is a schematic view showing an insert layer for manufacturing an electronic device casing of the present invention; FIG. 4 is a schematic view showing the mold layer of the electronic device casing of the present invention when the film layer of the electronic device casing is placed in the master mold, and the male mold and the mother mold are closed; FIG. 5 is a schematic diagram of the injection molding of FIG. After the thermoplastic plastic, a schematic diagram of the casing of the electronic device is formed. [Main component symbol description] Electronic device housing 20 inner surface 244 insert layer 22 female mold 32 film layer 222 cavity 322 first surface 2222 vacuum pipette 324 hard layer 224 male mold 34 through hole 2242 mold core 342 base body 24 cavity 36 outer surface 242