200905451 九、發明說明： 【發明所屬之技術領域】 本發明涉及—種散⑽、統及其構造方法， 带 腦機箱_散熱純及其構造方法。 " 【先前技術】 電腦機箱内裝有很多部件，如電源、光碟機、硬碟及 主顺等，於使用過程中，各個部件都會產生熱量而使整 们機相内的溫度升高，當機箱内的溫度過高時，各個部件 :能就無法正常工作，所以爲了保障這些部件能正常工 作，部件的散熱就顯得很重要。 W採用的散熱方法是於部件上加裝散熱片，再於] :的基礎上加裝風扇模組使它們進一步 、、 :由^目開孔和風散的導流，把熱流排放到心 4 t種設計中，各個部件同屬-機箱⑽空間且^ 的熱置不—樣，如此一來，部件之間勢必會相：200905451 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a seed dispersion (10), a system and a construction method thereof, a brain chassis _ heat dissipation pure and a construction method thereof. " [Previous technology] There are many components in the computer case, such as power supply, CD player, hard disk, and main control. During use, each component generates heat and raises the temperature inside the machine. When the temperature inside the chassis is too high, the components can not work normally, so in order to ensure that these components can work normally, the heat dissipation of the components is very important. The heat dissipation method adopted by W is to install a heat sink on the component, and then add a fan module on the basis of :: to further, and: the heat flow is discharged to the heart 4 t by the opening of the opening and the wind. In the design, each component belongs to the same space as the chassis (10) and the heat of the ^ is not the same, so that the components are bound to be:
干擾，不觀料的散熱，部件上的 I 於其散熱。 直+田也不； 發明内容】 荃於以上内容 有必要提供 埶屮士， ”一^—代Ί六—裡1分隔區域進朽 …、成本較低的散熱系統及其構造方法。 -種散熱系統，應用於裝有多個 内，該散熱系統包括至少兩個分別容置發熱元 ,‘、、、或均故有用於將其内發熱元件産生的查 稭由·-軋流通排出的散熱裝置。 、‘、 200905451 -種散熱系統的構造方法，用於— 散熱區域，該散埶系姑+ 电恥機忒内的 殼内發熱元件法包括以下步驟：根據機 熱區域根據其内部發敎 —或，母個政 熱裝置；利用該散妖裝置使1對庫^孰設置至少一散 空氣流動排出。使其對應散熱區域内的熱量藉由 相較于習知技術，該散熱系統及其構造方法包括至少 兩個散熱區域’各個區域内的發熱元 個區物熱元件的散熱效率。 讀“口 【實施方式】 h閱旧’本發明較佳實施方式中的散熱I统及其 j k方去可應用於伺服器、工作站及個人電腦機箱内。該 政熱系統的構造方法是先根據電腦機箱内的發熱元件的 分佈，將電腦機箱分成多個散熱區域，再根據各個區域内 的發熱元件總功率的大小配置相應的用於散發對應散敎 區域内熱量的散熱裝置明強電職箱⑽熱 熱效果。 請參閱圖2和圖3，一機殼丨包括一頂蓋板、一底板 11及與該底板11兩侧相垂直的—前蓋板13和一後蓋板 15。该機殼1内主要發熱元件包括一電源12、一光碟機 14、硬碟16及一主機板2。該主機板2的一端裝設有兩 CPU (Central Processing Unit)及靠近所述 CPU 的記憶體 條25，母一 CPU上都設有一散熱片23，該主機板2的另 & 包括多個 PCI (Peripheral Component Interconnect) 200905451 擴展插槽27。 於本發明較佳實施例的散熱系統根據發熱元件的分 佈將該機殼1用兩平行的隔離體271分隔成三個散熱二 10、20及30，該散熱區域2〇置於該散熱區域1〇與該散 =域30之間，每—散熱區域均包括分職於該機殼^ :盍板13上的一進風口和該後蓋板15上的一出風口。該 二個散熱區域10、2G和3G内的散熱裝置分別爲不同功率 的風扇模組121、131和133。 該散熱區域10内的發熱元件包括裝設於該機殼丨内 勺私源12光碟機14及硬碟16 ,該風扇模組丨21裝設於 靠近該電源12的一端的後蓋板15上，該散熱區域1〇内 發熱元件工作産生的熱量藉由該風扇模組121 動從其對應的出風π排出。 “ 該散熱區域20内的發熱元件包括插接在該主板2的 PCI擴展插槽27中的擴展卡，該風扇模組131裝設在該 機殼1對應所述PCI擴展插槽27的前蓋板13上，該風扇 模、、且131上设有一固定架132 ’該散熱區域2〇内發熱元件 工作産生的熱量通過該風扇模組丨3丨形成空氣流動從其對 應的出風口排出。 该散熱區域30内的發熱元件包括裝設在該主板2上 的兩cpu和記憶體條25，兩風扇模組133裝設在該機殼 1對應CpU的前蓋板13上，該機殼1的後蓋板15上還裝 a又有置於該散熱區域3〇内的兩風扇模組153，該散熱區域 30内發熱TL件工作産生的熱量通過該前蓋板13上的風扇 200905451 杈組133與該後蓋板 從其對應的出風π排出。風心·153形成空氣流動 =”圖3，峨竭％時， 先把5亥風扇模組13 1、133固令产斗 把該固定架U2固定在該風=亥機殼1的前蓋板13上’ 的-端固定在該機殼〗：後 風扇模組131_定_ ^ ’另-端固定在該 散熱區域1〇,再把另Γ=—側上與機殼1形成封閉的 i的德… 體271的-端也固定在該機殼 132 上，另—端固定在該風扇模組131的固定架 隔離體目 =另側上與機殼1形成封閉的散熱區域3〇，兩 的^ 間形成該封閉的散熱區域2G，最後把機殼1 2、盖板裝上’該機殼1分爲三個散熱區域10、20和30Interference, unobserved heat dissipation, and I on the component dissipate heat. Straight + Tian is not; Inventive content 荃 In the above content, it is necessary to provide a gentleman, "一 ^ - Ί Ί — 里 里 里 分隔 分隔 分隔 分隔 分隔 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The system is applied to a plurality of heat dissipating systems, and the heat dissipating system includes at least two heat dissipating devices respectively for accommodating the heat generating elements, ',, or both for discharging the straw generated by the heat generating elements therein , ', 200905451 - a method of constructing a heat dissipation system for use in a heat dissipating area, the method of heating elements in the shell of the divergent system + electric shame machine includes the following steps: according to the internal heat of the machine heat region - Or, the parental thermal device; using the demon device to set a pair of reservoirs to discharge at least one of the scattered air flows, so that the heat in the corresponding heat dissipation region is compared with the conventional technology, the heat dissipation system and its structure The method includes heat dissipation efficiency of the heat generating element in each of the at least two heat dissipating regions 'in each region. READ "Embodiment" h read the old heat dissipation system in the preferred embodiment of the present invention and its jk side Applicable In the server, workstation and PC chassis. The construction method of the political heat system is to divide the computer case into a plurality of heat dissipating areas according to the distribution of the heating elements in the computer case, and then configure corresponding corresponding to the dissipating area according to the total power of the heating elements in each area. The heat dissipation device of the internal heat is used to heat the electric box (10). Referring to Figures 2 and 3, a casing 丨 includes a top cover, a bottom plate 11 and a front cover 13 and a rear cover 15 perpendicular to the sides of the bottom plate 11. The main heating element in the casing 1 includes a power source 12, a disk player 14, a hard disk 16, and a motherboard 2. One end of the motherboard 2 is provided with two CPUs (Central Processing Unit) and a memory strip 25 adjacent to the CPU. A heat sink 23 is disposed on the mother CPU, and the other motherboards of the motherboard 2 include multiple PCIs. (Peripheral Component Interconnect) 200905451 Expansion slot 27. The heat dissipating system of the preferred embodiment of the present invention divides the casing 1 into three heat dissipating electrodes 10, 20, and 30 by two parallel spacers 271 according to the distribution of the heat generating components, and the heat dissipating region 2 is disposed in the heat dissipating region 1 Between the 〇 and the scatter field 30, each of the heat dissipation regions includes an air inlet port on the casing 2 and a ventilating opening on the rear cover plate 15. The heat dissipating devices in the two heat dissipating regions 10, 2G and 3G are fan modules 121, 131 and 133 of different powers, respectively. The heat generating component in the heat dissipating region 10 includes a private disk 12 and a hard disk 16 mounted in the casing, and the fan module 21 is mounted on the rear cover 15 adjacent to one end of the power source 12. The heat generated by the operation of the heat generating component in the heat dissipating region 1 is discharged from the corresponding air outlet π by the fan module 121. The heat generating component in the heat dissipation area 20 includes an expansion card inserted in the PCI expansion slot 27 of the motherboard 2, and the fan module 131 is mounted on the front cover of the casing 1 corresponding to the PCI expansion slot 27. On the board 13, the fan module and 131 are provided with a fixing frame 132. The heat generated by the operation of the heat generating component in the heat dissipating area 2 is formed by the fan module 丨3丨, and the air flow is discharged from the corresponding air outlet. The heating element in the heat dissipating area 30 includes two cpus and a memory strip 25 mounted on the main board 2. The two fan modules 133 are mounted on the front cover 13 of the casing 1 corresponding to the CpU. The rear cover 15 further includes a fan module 153 disposed in the heat dissipation area 3, and heat generated by the heat TL in the heat dissipation area 30 passes through the fan 200905451 on the front cover 13 The rear cover is discharged from the corresponding air outlet π. The wind core 153 forms an air flow = "Fig. 3, when the exhaustion is %, the 5H fan module 13 1 , 133 is first fixed to the bucket to fix the bracket U2 is fixed on the front cover 13 of the wind=Hai casing 1 and the end is fixed to the casing: Rear fan module 1 31_定_ ^ 'The other end is fixed in the heat dissipating area 1〇, and the other side of the body 形成 is formed on the other side of the body 271. The end of the body 271 is also fixed on the casing 132. The other end is fixed on the fixing body of the fan module 131 on the other side to form a closed heat dissipating area 3〇 with the casing 1 , and the closed heat dissipating area 2G is formed between the two, and finally the casing 1 2 , the cover is mounted 'The case 1 is divided into three heat dissipation areas 10, 20 and 30
Lit個區域⑽熱元件互不干擾且各元件玉作時産生的 熱置能很快地排出。 所述’本發明符合發明翻之要件，綠法提出 π °惟’以上僅為本發明之較佳實施例，舉凡熟悉 木技藝之人士’於爰依本發明精神所作之等效修飾或變 化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發日錄佳實施方式巾散熱系統及其構造方法之 平面示意簡圖。 圖2係圖1中散熱系統及其構造方法之立體分解圖。 圖3 ir、圖1中散熱系統及其構造方法之立體組装圖。 10 200905451 【主要元件符號說明】 機殼 1 主機板 2 散熱區域 10 底板 11 電源 12 前蓋板 13 光碟機 14 後盖板 15 硬碟 16 散熱區域 20 散熱片 23 記憶體條 25 擴展插槽 27 風扇模組 121 散熱區域 30 風扇模組 131 固定架 132 風扇模組 133 風扇模組 153 隔離體 271 11The Lit regions (10) do not interfere with each other and the thermal energy generated by each component is quickly discharged. The present invention is in accordance with the requirements of the invention, and the green method proposes that the above is only a preferred embodiment of the present invention, and equivalent modifications or changes made by those skilled in the art of wood technology in accordance with the spirit of the present invention are All should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a heat dissipation system and a construction method thereof. 2 is an exploded perspective view of the heat dissipation system of FIG. 1 and its construction method. Fig. 3 is a perspective assembled view of the heat dissipation system and its construction method in Fig. 1. 10 200905451 [Main component symbol description] Case 1 Motherboard 2 Heat dissipation area 10 Base plate 11 Power supply 12 Front cover 13 Optical drive 14 Rear cover 15 Hard disk 16 Heat dissipation area 20 Heat sink 23 Memory strip 25 Expansion slot 27 Fan Module 121 heat dissipation area 30 fan module 131 fixing frame 132 fan module 133 fan module 153 isolation body 271 11