200903482 九、發明說明 【發明所屬之技術領域】 本發明是有關例如爲了製造一經由接著劑來貼合一對 的基板之記錄媒體’而對貼合前之接著劑往基板的塗佈施 以改良的貼合方法及貼合裝置。 【先前技術】 現在’光碟或光磁碟等的光學讀取式的記錄媒體爲多 種多樣的規格普及著，如再生專用、或可重新改寫所被記 錄的資訊者等。例如，DVD等的光碟，基本上是在2片的 基板的一方或雙方設有資訊的記錄領域，經由接著劑來貼 合下製造。而且’貼合用的接著劑的層，爲了正確地進行 利用雷射光線的讀寫，而其厚度會被要求非常高的精度。 參照圖7來説明如此貼合型的碟片的製造程序之一例 。首先，預先射出成型2片的聚碳酸酯樹脂（ Polycarbonate)製的基板P，在濺射室中藉由濺射來形成 雷射反射用的金屬膜（記錄膜）。然後，如圖7 ( A )所 示，在2片的基板P的接合面，塗佈紫外線硬化型的接著 劑，藉由旋轉塗佈（spin-coat )來展延接著劑。所謂旋轉 塗佈是在基板P的中心周圍，藉由塗佈裝置K來滴下塗佈 接著劑之後，使基板P高速旋轉，藉此於基板P上形成接 著劑的薄膜（接著層R)，使多餘的接著劑飛散者。 如圖7 ( B )所示，如此形成接著層R的一對基板P 是以彼此的接著層R能夠形成平行相向的狀態之方式，一 -4- 200903482 方以中心銷G的夾盤（chuck ) E來保持，另一方載置於 轉盤或基座等的載置面F的狀態下，導入真空處理室C的 下部。然後，如圖7(C)所示，真空處理室C會下降而 密閉，藉此形成減壓室S，且從該減壓室S藉由排氣裝置 來排氣，而使基板P周圍的壓力從大氣壓形成真空。 在該被減壓的空間中，保持一方的基板P之夾盤E會 關閉而於基板P落下的同時，推壓部T會藉由汽缸等的驅 動源來下降推壓，藉此貼合於另一方的基板P。之所以貼 合時形成真空，是爲了儘可能地排除被接著的面之間的氣 體分子。 然後，被貼合的基板P的周圍，如圖7 ( D )所示， 導入大氣而回到大氣壓，或加壓成大氣壓以上後，回到大 氣壓。在如此解放成大氣壓的情況下，殘留於接著層R的 氣泡會藉由與真空的差壓而慢慢地被壓縮。至氣泡充分壓 縮爲止，針對放置數秒〜數十秒於大氣的基板P，如圖7 (E )所示，藉由光源u來對全體照射紫外線，而使接著 層R硬化。藉此，2片的基板P會被強固地接著，完成碟 片。 如以上，有關貼合塗佈接著劑的基板而製造的碟片， 必須是在被使用於資訊的讀寫之雷射照射於碟片時，以能 夠安定形成點的方式，成爲無彎曲或變形的平坦者。因此 ’在該碟片中，貼合時的接著層的膜厚期望儘可能形成均 » 〇 但’藉由上述那樣的旋轉塗佈來塗佈接著劑時，旋轉 -5- 200903482 的基板上的接著劑難以藉由離心力來展延。因此，對於基 板的內周部而言，外周部的膜厚會變厚（例如，1〇μιη程 度），難以在基板全體使膜厚均一化。 因應於此’提案一藉由旋轉塗佈來均一塗佈樹脂的技 術，亦即在旋轉塗佈中，停止碟片的旋轉之前，對碟片上 的樹脂照射紫外線’而來改變全體的黏度，藉此限制往外 周部之樹脂的流動（參照專利文獻1 )。並且，亦提案有 一在進行複數次的旋轉塗佈時，其間使樹脂的一部份硬化 ，而來抑止流動的手法（參照專利文獻2 )。 專利文獻1 :特開2002-319192號公報 專利文獻2:国際公開第2005/118159號 專利文獻3:特開2006-48855號公報 【發明內容】 (發明所欲解決的課題） 可是，接著層的膜厚的周內變動（不均一），可知越 是從碟片的內周往外周越會變大。但，近年來隨著HD( High Definition DVD) 、BD ( Blu-ray Disc)之記錄密度 的提升，最終的碟片所被要求之接著層的均一性是非常嚴 格的。例如，在以往的DVD中，不均一容許範圍爲30μιη 程度，但在HD或BD中爲ΙΟμιη程度，被要求更高的精度 。因此，抑止周內不均一的必要性更高。 又，隨著記錄密度的提升，爲了防止讀取錯誤’有關 附著的塵埃或發生的氣泡的大小、量也會被要求更爲低減 -6- 200903482 。有關氣泡的低減，以往是在真空中貼合或藉由貼合後的 加壓來對應。如此的加壓手段是利用大氣壓，在大氣中暴 露一定時間（大氣放置）（參照專利文獻3 )。 然而，可知若進行如此的大氣放置，則在其一方接著 層的周內變動會擴大。這可想像成是因爲從接著劑的塗佈 後到硬化爲止的時間變長，硬化途中的接著劑流動的機會 增加所致。例如，在貼合後未進行放置時，與進行放置（ 2 0s )時，各一例測定平均的周內變動率的結果，如圖8 所示。根據此圖8可知，在進行放置時，周內變動會全體 惡化，及外周部的變動大。 而且，在進行旋轉塗佈的塗佈時，如上述，多餘的接 著劑會飛散。如此飛散後的接著劑是回收再利用。但，如 專利文獻1那樣，若在旋轉中全面性進行紫外線照射，則 在飛散的接著劑中含有被紫外線照射而開始硬化者。如此 一來’爲了再利用，而必須分離硬化開始的接著劑與未硬 化的接著劑，這是非常困難的。 本發明是爲了解決上述那樣以往技術的問題點而提案 者’其目的是在於提供一種可一面確保塗佈時的接著層的 均一性，一面抑止氣泡，且可抑止製造中的接著層的變動 之貼合方法及貼合裝置。 (用以解決課題的手段） 爲了達成上述目的’本發明之貼合方法，係經由利用 電磁波的照射引起硬化的接著劑來貼合第丨基板與第2基 200903482 板之貼合方法，其特徵爲： 在上述第1基板及上述第2基板的至少一方的面塗佈 接著劑， 對塗佈後的接著劑照射電磁波於大氣中， 貼合上述第1基板與上述第2基板， 對上述第1基板與上述第2基板之間的接著劑照射電 磁波。 其他的形態之貼合裝置，係經由利用電磁波的照射引 起硬化的接著劑來貼合第1基板與第2基板之貼合裝置， 其特徵係具有： 塗佈部’其係於上述第1基板及上述第2基板的至少 一方的面塗佈接著劑； 前照射部’其係對塗佈後的接著劑照射電磁波於大氣 中； 貼合部’其係貼合上述第1基板與上述第2基板；及 後照射部，其係對上述第1基板與上述第2基板之間 的接著劑照射電磁波。 就以上的發明而言，是在第1基板與第2基板的貼合 前，在大氣中對接著劑照射電磁波，因此接著劑會暫時硬 化，可一面維持接著力一面防止流動，抑止周內變動。並 且，藉由暫時硬化，可抑止除氣（outg as )的發生，減少 氣泡的殘留。 其他的形態之貼合方法，係經由利用電磁波的照射引 起硬化的接著劑來貼合第1基板與第2基板之貼合方法， ~ 8 - 200903482 其特徵爲： 在上述第1基板及上述第2基板的至少一方的面塗佈 接著劑， 對塗佈後的接著劑的一部份照射電磁波， 在塗佈後的接著劑上更重疊塗佈一次以上接著劑， 對重疊塗佈後的接著劑照射電磁波， 貼合上述第1基板與上述第2基板， 對上述第1基板與上述第2基板之間的接著劑照射電 磁波。 其他的形態之貼合裝置，係經由利用電磁波的照射引 起硬化的接著劑來貼合第1基板與第2基板之貼合裝置， 其特徵係具有： 塗佈部，其係於上述第1基板及上述第2基板的至少 一方的面塗佈複數次接著劑； 第1照射部，其係於上述塗佈部之複數次的塗佈之間 的其中之一，對接著劑的一部份照射電磁波； 第2照射部，其係對藉由上述塗佈部來塗佈複數次後 的接著劑照射電磁波； 貼合部，其係貼合上述第1基板與上述第2基板；及 第3照射部，其係對上述第1基板與上述第2基板之 間的接著劑照射電磁波。 就以上的形態而言，即使是必須較厚地塗佈接著劑時 ，還是可藉由在一部份照射電磁波後重疊塗佈，來抑止接 著劑的流動，均一地塗佈。並且，可藉由貼合前的電磁波 -9- 200903482 的照射，來抑止周內變動。 其他的形態，係上述塗佈部爲旋轉塗佈裝置，上述第 1照射部係針對接著劑，於旋轉中心的周圍以點照射電磁 波。 就以上的形態而言，是在重疊塗佈使用旋轉塗佈裝置 ，藉此厚度的調整容易，且藉由在旋轉中心的周圍照射電 磁波，可抑止接著劑流動至外周側，而形成均一的重疊塗 佈。 〔發明的效果〕 如以上説明，若根據本發明，則能提供一種可一面確 保塗佈時的接著層的均一性，一面抑止氣泡，且可抑止製 造中的接著層的變動之貼合方法及貼合裝置。 【實施方式】 其次，參照圖面來具體説明有關用以實施本發明的最 佳形態（以下稱爲實施形態）。本實施形態是在一對的基 板塗佈接著劑，使接著劑暫時硬化後貼合，藉此來抑止接 著劑的周內變動者。 [第1實施形態] [構成] 首先，參照圖1來説明本實施形態的貼合裝置（以下 稱爲本裝置）的構成。另外’本裝置是構成碟片的製k裝 -10- 200903482 置的一部份者，有關配設於本裝置的上游工程之基板的成 型裝置及金屬膜的形成裝置、在各裝置間交接基板的機構 等是可適用習知的所有技術，因此省略説明。 本裝置是具有第1旋轉塗佈裝置1、第2旋轉塗佈裝 置2、構成於轉盤（turntable ) 3的前照射部4、貼合部5 、後照射部6等。第1旋轉塗佈裝置丨是對貼合的一方基 板P 1 ’藉由旋轉塗佈來塗佈紫外線硬化型的接著劑B1之 裝置。此第1旋轉塗佈裝置1是具備載置基板P1的轉盤 1 1、及使轉盤1 1旋轉的驅動源1 2，藉由使基板p 1旋轉 來使從接著劑供給部（未圖示）滴下的接著劑B1展延之 裝置。 第2旋轉塗佈裝置2是如圖1所示，對貼合的另一方 基板P2 ’藉由旋轉塗佈來塗佈紫外線硬化型的接著劑之 裝置。此第2旋轉塗佈裝置2是具備載置基板p2的轉盤 21及使轉盤21旋轉的驅動源22，藉由使基板p2旋轉來 使從接著劑供給部（未圖示）滴下的接著劑B 2展延之裝 置。 在轉盤3具有：對應於前照射部4投入基板pi的第 1 ί又入位置31、將藉由反轉裝置（未圖示）來使反轉成接 著面可對向的基板Ρ2投入的第2投入位置32、對應於貼 η部5的貼合位置3 3、對應於後照射部6的紫外線照射位 置34、及將完成碟片D搬出至下個工程的搬出位置35。 此轉盤3可藉由未圖示的驅動機構，對準上述各位置來間 歇旋轉。 -11 - 200903482 前照射部4是藉由UV照射裝置來對塗佈於基板p } 的接著劑B 1照射紫外線於大氣中，而使暫時硬化的裝置 。另外，在請求項及實施形態所謂的「大氣中」是意指硬 化阻礙環境、例如含氧氣體環境中。一般是以大氣中較爲 簡易’但只要是含氧、或其他阻礙硬化的環境即可。 貼合部5是在真空中貼合基板Pi，P2的裝置。另外 ’貼合部5具有：藉由昇降機構作動的真空處理室、使真 空處理室內減壓的真空源、藉由昇降機構作動來推壓基板 p 1 ’ P2的推壓部等，因爲是習知的技術，所以省略'説明 〇 後照射部6是藉由UV照射裝置來對貼合的基板P 1， P2照射紫外線於真空中，而使基板P 1，P2之間的接著劑 B 1，B2完全硬化的裝置。另外，後照射部6亦具有：藉 由昇降機構作動的真空處理室、使真空處理室內減壓的真 空源等，因爲是習知的技術，所以省略説明。 另外，之所以在真空中照射是爲了排除氧等之硬化阻 礙的要因，但並非是一定要是無氧的環境。因爲貼合後的 基板PI，P2的接著接觸面是大致一體化，不被環境左右 硬化。在大氣中貼合時，外周端面是接觸於大氣，此部份 是以製造線上的保管時間（數日）至完全硬化。若進行上 述般之真空中的照射，則具有針對該外周端面照樣可更確 實地使硬化之優點。藉由使用惰性氣體（N 2 )來排除（清 除（purge ))氧，亦可取得同樣的效果。 來自上述接著劑供給部之接著劑的供給量、轉盤的旋 -12- 200903482 轉及其速度、照射裝置的發光、加熱裝置、昇降機構及真 空源的作動等是藉由控制裝置來控制。此控制裝置，例如 可藉由專用的電子電路或以所定的程式動作的電腦等來實 現。因此，用以在以下説明的程序下控制本裝置的動作之 電腦程式及記錄彼之記錄媒體亦爲本發明之一形態。 [作用] 參照圖1及圖2以及圖3的流程圖來説明利用以上那 樣的本裝置之基板的貼合程序。另外，在前工程中，在一 方的基板P1是藉由灘射來形成半透明的反射膜，在另一 方的基板P2濺射全反射的金屬膜。 如圖1所示，基板P1是在第1旋轉塗佈裝置1中， 於中心孔的周圍滴下塗佈紫外線硬化型的接著劑，藉由高 速旋轉轉盤1 1來使接著劑展延（步驟2 0 1 )。例如，塗佈 壓爲 0_2MPa，塗佈時間爲 〇.6sec。予以例如藉由 iOOOOrpm的高速旋轉在lsec間甩開。 其次’如圖1所示’基板P1是以上述那樣塗佈的接 著劑B1的面能夠形成上面的方式來投入轉盤3 (步驟2〇2 )。然後’在前照射部4中，藉由UV照射裝置在大氣中 全面照射紫外線，使暫時硬化成接著劑B1的塗佈形狀不 會崩潰的程度（步驟203)。 另外’ 一般的紫外線硬化型的樹脂（接著劑），若在 大氣中，則即使全面照射紫外線，在通常的照射強度下也 不會完全硬化。這是因爲在樹脂的表面附近，藉由空氣中 -13- 200903482 的氧而硬化被阻礙所致。亦即，若在大氣中進行紫外線照 射，則可原封不動維持表面的接著性，使暫時硬化。例如 ，被證實即使在lOOOmWxl〜2s也不會全部硬化。但，有 關該暫時硬化時的照射條件並非限於上述者。 並且’如圖1所示，在另一方的基板P2，於第2旋 轉塗佈裝置2中，進行通常的旋轉塗佈之接著劑B2的塗 佈（步驟2〇4 )。例如，塗佈壓爲0.2MPa，塗佈時間爲 0_6sec，在高速旋轉4600rpm下於lsec間甩開。而且，基 板P2會藉由反轉裝置來反轉（步驟2〇5)，以接著劑B2 的塗佈面能夠形成下面之方式，投入於基板P1的上方（ 步驟2 0 6 )。 然後，2片的基板PI，P2會被搬送至貼合部5，和以 往技術同様，進行真空中的貼合（步驟207 )。所被貼合 的基板P1，P2會被送至後照射部6，在真空中全面照射 紫外線，接著劑Bl，B2會完全硬化（步驟208 )。此時 ，可從被濺射反透過的金屬膜之基板P 1側來照射紫外線 。藉由接著劑硬化而完成的碟片D會從搬出位置35搬出 (步驟209 )。 [效果] 若根據以上的本實施形態，則因爲是使塗佈於所被貼 合的基板P1之接著劑B1暫時硬化後，與基板P2貼合， 所以可一面維持接著力，一面抑止接著劑B 1的流動，抑 止貼合後的接著層厚的周內變動。 -14- 200903482 並且，在使接著劑B1暫時硬化時’是預先一 領域會硬化’因此在真空中貼合基板p 1 ’ P2時可 氣的發生，降低氣泡的殘留。而且，因爲執行暫時 所以可抑止周內變動，因此例如貼合後亦可確保放 ，藉此氣泡的發生亦可抑止。 又，由於用以暫時硬化之紫外線的照射是在旋 終了而無接著劑B1的飛散之後進行，因此不會有 佈時飛散的接著劑開始硬化的情況，回收後之接著 利用沒有問題。另外，在與旋轉塗佈不同的場所照 同樣的效果。 [第2實施形態] [構成] 本實施形態，基本上是與上述第1實施形態同 。但，如圖3所示，第1旋轉塗佈裝置1是具備： P 1上的接著劑B 1照射紫外線（U V )的照射裝置1 : 照射部）、進行加熱的加熱裝置1 4。照射裝置1 3 板P 1的中心孔的周圍照射紫外線之裝置，來自光 #線可藉由光纖來引導。光源亦可使用紫外線L E D 能夠調整照射強度。此加熱裝置1 4是加熱基板p ! 附近的裝置。此加熱裝置1 4，例如可使用紅外線（ 射單元或加熱器。另外’本實施形態的前照射部4 於請求項的第2照射部、後照射部6是對應於第3 部份的 抑止除 硬化， 置時間 轉塗佈 旋轉塗 劑的再 射亦具 樣構成 對基板 i (第1 是在基 源的紫 ，而使 的外周 IR)照 是對應 照射部 -15 - 200903482 [作用] 參照圖1及圖2以及圖3的流程圖來説明利用以上那 樣的本裝置之基板的貼合程序。另外，在前工程中，在—· 方的基板P1是藉由濺射來形成半透明的反射膜，在另一 方的基板P2濺射全反射的金屬膜。 如圖1所示’基板P1是在第1旋轉塗佈裝置1中， 於中心孔的周圍滴下塗佈紫外線硬化型的接著劑，藉由高 速旋轉轉盤1 1來使接著劑展延（步驟4 01 )。例如，接著 劑的黏度爲使用430mPas者，塗佈壓爲〇_2MPa，塗佈時 間爲0.15sec。予以例如在l〇〇〇〇rpm的高速旋轉下於8sec 間甩開。 其次，如圖3所示，使基板p1旋轉成接著劑不流動 的程度（例如，120rpm-300rpm)，在中心孔的周圍，藉 由照射裝置1 3來點照射紫外線。藉此，在展延後的接著 劑形成使硬化成環狀的部份（硬化部）（步驟402 )。此 時’在UV光強度強的部份雖完全硬化，但隨著往外周行 進’受到接著劑之氧阻礙的影響，表面不會凝固，內部凝 固，往外周，內部亦漸漸形成不硬化。 其次’在如此被展延，形成有硬化部的基板P1的接 著劑上’再度滴下塗佈紫外線硬化型的接著劑，藉由高速 旋轉轉盤1 1來使接著劑展延（步驟4 0 3 )。例如，使用與 第1次同様的接著劑，藉由塗佈壓爲0 · 2 Μ P a，塗佈時間 爲0.6 s e c，1 〇 〇 0 rpm的高速旋轉來以i s e c甩開。此時，利 -16- 200903482 用加熱裝置14來部份地加熱，而使展延。例如，熱源爲 使用加熱器（3卩〇1116&16 1')，波長爲7〇〇〜3〇〇〇11111，設定 輸出爲350W，加熱範圍爲基板pi的徑方向41mm〜53mm ，加熱時間爲1 s e c。 如以上在基板P1塗佈接著劑，藉此被加熱，黏度降 低的接著劑是藉由使基板P 2旋轉下產生的離心力來甩開 ，容易排出至外周。或可取得熱能來增大揮發量。因此， 留在外周的接著劑會變薄，可抑止其厚度增大，所以可使 全體厚度均一化。另外，亦可同時賦予外周熱風，進行接 著劑的加熱輔助。 之後’如圖1所示’基板P1是以上述那樣塗佈的接 著劑B1的面能夠形成上面的方式來投入轉盤3 (步驟404 )。然後’在前照射部4中，藉由UV照射裝置在大氣中 全面照射紫外線，使暫時硬化成接著劑B 1的塗佈形狀不 會崩潰的程度（步驟4 0 5 )。例如，與通常正式硬化時的 條件（50mW/cm2x5S )作比較，同樣的強度下約進行一半 的照射時間（2 s )的照射。 又，如圖1所示，在另一方的基板P2，於第2旋轉 塗佈裝置2中，進行通常的旋轉塗佈之接著劑B2的塗佈 (步驟 406 )。例如，塗佈壓爲 〇.2MPa，塗佈時間爲 0.6sec，在高速旋轉6000rpm下於lsec間甩開。而且，基 板P2會藉由反轉裝置來反轉（步驟407 )，以接著劑B2 的塗佈面能夠形成下面之方式，投入於基板P1的上方（ 步驟4 0 8 )。 -17- 200903482 然後，2片的基板P 1 ’ P 2會被搬送至貼合部5，和以 往技術同樣，進行真空中的貼合（步驟409 )。所被貼合 的基板P 1，P2會被送至後照射部6，在真空中全面照射 紫外線，接著劑B 1，B 2會完全硬化（步驟41 0 )。此時 ，可從被濺射反透過的金屬膜之基板P 1側來照射紫外線 。藉由接著劑硬化而完成的碟片D會從搬出位置35搬出 (步驟4 1 1 )。 [效果] 若根據以上那樣的本實施形態，則即使增厚塗佈於被 貼合之基板P1的接著劑B1時，藉由使接著劑B1暫時硬 化，接著劑B1的流動會被抑止，可抑止貼合基板P1，P2 後之接著層厚的周內變動。圖5是表示如此貼合後之接著 層的周內分布。藉此，有關按上述實施形態製作的實施例 、及不暫時硬化貼合的以往例（其他的條件是與實施例同 樣），若比較其一例平均的周內變動率，則可知實施例的 周內變動要比以往例更小。 又，塗佈厚可藉由改變接著劑的塗佈量、旋轉條件、 展延次數來容易調節。特別是想要增加塗佈厚時，如上述 ，形成硬化部，一邊加熱一邊進行重疊塗佈，藉此可確保 均一的厚度，因此可提高周內變動的抑止效果。亦可厚厚 地塗佈於基板P2，或厚厚地塗佈於基板PI，P2的雙方。 此時，亦可在第2旋轉塗佈裝置2也設置照射裝置1 3 ’藉 此於基板P2的接著劑亦形成硬化部，亦可藉由設置加熱 -18- 200903482 裝置14來抑止厚度的增大。 而且，與上述第1實施形態同樣，因爲暫時硬化所以 除氣的發生會被抑止，可減少氣泡殘留的同時，只要確保 放置時間’便可更抑止氣泡。又，用以暫時硬化之紫外線 的照射是在旋轉塗佈終了後，在與旋轉塗佈不同的場所進 行’有關一邊使基板P 1旋轉的點照射，也只不過是照射 所被限定的一部份領域而已，因此接著劑的回收沒有問題 [其他的實施形態] 本發明並非限於上述實施形態。上述實施形態中是在 雙方的基板塗佈接著劑，只對一方的接著劑進行紫外線照 射（暫時硬化、點照射）。但，請求項之接著劑的塗佈及 電磁波的照射是至少對一方的基板進行即可。因此，亦可 只對一方的基板進行接著劑的塗佈。 並且，在雙方的基板塗佈接著劑時，亦可對雙方的接 著劑進行紫外線照射。例如圖6所示，亦可設置：對基板 P 1進行紫外線的照射之第1前照射部4a、及對基板P2進 行紫外線的照射之第2前照射部4b，藉此針對接著劑B 1 ’ B2的雙方來進行暫時硬化之後，進行貼合。藉此，可 取得周內變動之更深一層的抑止效果，且亦可取得氣泡低 減效果。 又，有關所使用的接著劑，並非限於紫外線硬化型的 樹脂，亦可使用其他藉由電磁波（亦含雷射光）來硬化的 -19- 200903482 樹脂、熱硬化型的樹脂等 所照射的電磁波的種類， 線）、所定波長的雷射光 爲了塗厚接著劑，而形成 多接著劑的滴下量之一次 並且，貼合並非一定要在 用以塗佈接著劑的塗 第1基板及第2基板可使 用複數台的旋轉塗佈裝置 於旋轉塗佈裝置，只要是 或將來可利用的所有裝置 又，前照射部只要是 無論設置於何處皆可。例 設置於從旋轉塗佈裝置到 可設置於轉盤上的基板P ] 有關基板，其大小、 來所被採用的所有者。因 體用的碟片，當然可適用 記錄媒體。又，非只是記 接著劑來貼合的所有基板 」並非限於圓盤狀等，實 各種。因此’按照樹脂的種類， 亦可適用紫外線、紅外線（含熱 等各種。在上述的實施形態中， 硬化部來重疊塗佈，但亦可爲增 塗佈。亦可省略展延時的加熱。 真空中進行。 佈部可爲卓數或複數。例如，在 用共通的旋轉塗佈裝置。亦可使 來進行重疊塗佈。塗佈部並非限 可塗佈接著劑的裝置，包含現在 〇 在旋轉塗佈後到貼合爲止之間， 如，可設置於旋轉塗佈裝置，或 轉盤爲止的搬送途中。如上述， [，P2的其中之一方，或雙方。 形狀、材質等爲自由，可適用將 此，可適用於所有規格的記錄媒 於追記型的記錄媒體、寫入型的 錄媒體的碟片，還可適用於藉由 。亦即，請求項所記載的「基板 爲廣泛包含平面狀的製品之槪念 【圖式簡單說明】 -20- 200903482 圖1是表示本發明的貼合裝置的第1實施形態的構成 説明圖。 圖2是表示圖1的實施形態的處理程序的流程圖。 圖3是表示本發明的貼合裝置的第2實施形態的旋轉 塗佈裝置的簡略縱剖面圖。 圖4是表示圖3的實施形態的處理程序的流程圖。 圖5是表示根據本發明的實施形態來製造的實施例與 以往例的接著層厚的周內分布的説明圖。 圖6是表示在本發明的貼合裝置中，將前照射部設置 2個時之一實施形態的説明圖。 圖7是表示以往的基板貼合程序的説明圖，圖（A ) 是表示接著劑的展延，圖（B)是表示往真空處理室的導 入，圖（C)是表示貼合，圖（D)是表示大氣開放，圖（ E )是表示接著劑硬化的工程。 圖8是表示藉由以往技術來製造的碟片的接著層厚的 周內分布的説明圖。 【主要元件符號說明】 1 :第1旋轉塗佈裝置 3，1 1，21 :轉盤 2:第2旋轉塗佈裝置 4 :前照射部 4a .·第1前照射部 4b :第2前照射部 -21 - 200903482 5 :貼合部 6 :後照射部 1 2，2 2 :驅動源 1 3 :照射裝置 1 4 :加熱裝置 3 1 :第1投入位置 3 2 :第2投入位置 3 4 :紫外線照射位置 3 5 :搬出位置 -22。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The bonding method and the bonding device. [Prior Art] Optical recording type recording media such as optical disks or optical disks are popularized in various specifications, such as reproduction-only, or it is possible to rewrite the recorded information. For example, a disc such as a DVD is basically produced by attaching an adhesive to one or both of the two substrates. Further, in order to accurately perform reading and writing using laser light, the layer of the adhesive for bonding is required to have a very high precision. An example of a manufacturing procedure of the disc of such a bonding type will be described with reference to Fig. 7 . First, two substrates of a polycarbonate resin (polycarbonate) are formed by injection molding, and a metal film (recording film) for laser reflection is formed by sputtering in a sputtering chamber. Then, as shown in Fig. 7(A), an ultraviolet curable adhesive is applied to the joint surface of the two substrates P, and the adhesive is stretched by spin-coating. In the spin coating, a coating film is applied to the periphery of the substrate P by dropping the adhesive agent by the coating device K, and then the substrate P is rotated at a high speed to form a film (adhesive layer R) of the adhesive on the substrate P. Excess adhesive scatterers. As shown in Fig. 7(B), the pair of substrates P on which the subsequent layer R is formed in such a manner that the bonding layers R of the respective layers can be formed in a parallel direction, the chuck of the center pin G (chuck) E is held, and the other side is placed on the lower surface of the vacuum processing chamber C while being placed on the mounting surface F of the turntable or the base. Then, as shown in FIG. 7(C), the vacuum processing chamber C is lowered and sealed, whereby the decompression chamber S is formed, and the decompression chamber S is exhausted by the exhaust device to surround the substrate P. The pressure creates a vacuum from atmospheric pressure. In the space to be decompressed, the chuck E holding one of the substrates P is closed and the substrate P is dropped, and the pressing portion T is pushed down by a driving source such as a cylinder, thereby adhering to The other substrate P. The reason for forming a vacuum when bonding is to exclude the gas molecules between the adjacent faces as much as possible. Then, as shown in Fig. 7(D), the periphery of the bonded substrate P is introduced into the atmosphere to return to atmospheric pressure, or pressurized to atmospheric pressure or higher, and then returned to atmospheric pressure. In the case where the pressure is released to atmospheric pressure, the bubbles remaining in the adhesive layer R are gradually compressed by the differential pressure with the vacuum. As the bubble P is sufficiently compressed, the substrate P placed in the atmosphere for several seconds to several tens of seconds is irradiated with ultraviolet rays by the light source u as shown in Fig. 7(E) to cure the adhesive layer R. Thereby, the two sheets of the substrate P are firmly adhered to complete the disc. As described above, the disc manufactured by laminating the substrate coated with the adhesive must be formed so that it can be stably formed when the laser used for reading and writing of information is irradiated onto the disc, so that it is not bent or deformed. Flatter. Therefore, in the disc, the film thickness of the adhesive layer at the time of bonding is desirably formed as much as possible. However, when the adhesive is applied by spin coating as described above, the substrate on the substrate of -5 - 200903482 is rotated. It is difficult for the subsequent agent to be extended by centrifugal force. Therefore, in the inner peripheral portion of the substrate, the film thickness of the outer peripheral portion is increased (e.g., 1 μm), and it is difficult to uniformize the film thickness over the entire substrate. In response to this proposal, a technique of uniformly coating a resin by spin coating, that is, in spin coating, before the rotation of the disc is stopped, the resin on the disc is irradiated with ultraviolet rays to change the overall viscosity. This restricts the flow of the resin to the outer peripheral portion (see Patent Document 1). Further, there has been proposed a method of suppressing the flow by suppressing a part of the resin during the spin coating of a plurality of times (see Patent Document 2). Patent Document 1: JP-A-2002-319192, JP-A-2005-118159, JP-A-2005-118855, JP-A-2006-48855, SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The intra-week variation (non-uniformity) of the film thickness is more likely to increase from the inner circumference to the outer circumference of the disc. However, in recent years, as the recording density of HD (High Definition DVD) and BD (Blu-ray Disc) has increased, the uniformity of the final layer required for the final disc is very strict. For example, in the conventional DVD, the non-uniform tolerance range is about 30 μm, but in the case of HD or BD, the degree of ΙΟμηη is required to be higher. Therefore, the need to suppress unevenness during the week is even higher. Further, as the recording density is increased, in order to prevent the reading error, the size and amount of the attached dust or the generated bubble are also required to be further reduced -6-200903482. The reduction of the bubble is conventionally performed by bonding in a vacuum or by pressurization after bonding. Such a pressurizing means is exposed to the atmosphere for a certain period of time (atmosphere placement) by atmospheric pressure (see Patent Document 3). However, it has been found that if such an atmosphere is placed, the variation will increase in the week of one of the subsequent layers. This is conceivable because the time from the application of the adhesive to the hardening becomes longer, and the chance of the adhesive flow during the hardening increases. For example, when not placed after bonding, and when placed (20 s), the average intra-week variation rate is measured for each case, as shown in Fig. 8. As can be seen from Fig. 8, when the placement is performed, the fluctuations in the week are all deteriorated, and the fluctuations in the outer peripheral portion are large. Further, at the time of coating by spin coating, as described above, excess adhesive may scatter. The adhesive that is so scattered is recycled. However, as disclosed in Patent Document 1, when ultraviolet irradiation is performed in a comprehensive manner during the rotation, the scattered adhesive contains ultraviolet rays and starts to be cured. As a result, it is very difficult to separate the hardening-starting adhesive and the unhardened adhesive for reuse. The present invention has been made to solve the problems of the prior art as described above. The object of the present invention is to provide a method for suppressing the change of the adhesive layer during production while suppressing the uniformity of the adhesive layer during coating. Fitting method and laminating device. (Means for Solving the Problem) In order to achieve the above-mentioned object, the bonding method of the present invention is a method of bonding a second substrate and a second substrate 200903482 by an adhesive which is cured by irradiation with electromagnetic waves, and is characterized in that it is bonded to the second substrate 200903482. An adhesive is applied to at least one surface of the first substrate and the second substrate, and an electromagnetic wave is applied to the adhesive after applying the coating to the atmosphere, and the first substrate and the second substrate are bonded to each other. The adhesive between the substrate and the second substrate irradiates electromagnetic waves. In another aspect, the bonding apparatus is a bonding apparatus that bonds a first substrate and a second substrate via an adhesive that is cured by irradiation of electromagnetic waves, and is characterized in that the coating portion is attached to the first substrate. And applying an adhesive to at least one surface of the second substrate; the pre-irradiation portion illuminates an electromagnetic wave in the atmosphere with the applied adhesive; and the bonding portion affixes the first substrate and the second portion a substrate; and a post-irradiation portion that irradiates an electromagnetic wave to an adhesive between the first substrate and the second substrate. In the above invention, since the adhesive is irradiated with electromagnetic waves in the atmosphere before bonding between the first substrate and the second substrate, the adhesive is temporarily hardened, and the flow can be prevented while maintaining the adhesion force, and the variation in the week can be suppressed. . Moreover, by temporarily hardening, the occurrence of outg as can be suppressed, and the residual of bubbles can be reduced. The bonding method of the other aspect is a bonding method of bonding the first substrate and the second substrate via an adhesive which is cured by irradiation with electromagnetic waves, and is characterized in that: the first substrate and the first Applying an adhesive to at least one surface of the substrate, and irradiating a part of the applied adhesive with an electromagnetic wave, and applying a coating agent or more to the adhesive after the application, and applying the coating after the overlap coating The agent irradiates an electromagnetic wave, and the first substrate and the second substrate are bonded to each other, and an electromagnetic wave is applied to the adhesive between the first substrate and the second substrate. In another aspect, the bonding apparatus is a bonding apparatus that bonds a first substrate and a second substrate via an adhesive that is cured by irradiation of electromagnetic waves, and is characterized in that the coating unit is attached to the first substrate. And applying a plurality of adhesives to at least one surface of the second substrate; and the first irradiation portion is one of a plurality of coatings applied to the coating portion, and irradiating a portion of the adhesive Electromagnetic wave; the second illuminating unit irradiates the electromagnetic wave with the adhesive applied by the coating unit for a plurality of times; the bonding unit that bonds the first substrate and the second substrate; and the third irradiation The portion irradiates an electromagnetic wave to the adhesive between the first substrate and the second substrate. In the above embodiment, even when it is necessary to apply the adhesive thickly, it is possible to uniformly coat the adhesive by suppressing the flow of the adhesive by superimposing and coating the electromagnetic waves. Moreover, the fluctuation of the week can be suppressed by the irradiation of the electromagnetic wave -9-200903482 before bonding. In another aspect, the coating unit is a spin coating device, and the first irradiation unit irradiates electromagnetic waves at a point around the center of rotation with respect to the adhesive. In the above embodiment, the spin coating apparatus is used for the overlap coating, whereby the thickness adjustment is easy, and by irradiating electromagnetic waves around the center of rotation, it is possible to suppress the flow of the adhesive to the outer peripheral side, thereby forming a uniform overlap. Coating. [Effects of the Invention] As described above, according to the present invention, it is possible to provide a bonding method capable of suppressing the uniformity of the adhesive layer at the time of application, suppressing the bubbles, and suppressing variations in the adhesive layer during production. Fitting device. [Embodiment] Next, a best mode for carrying out the invention (hereinafter referred to as an embodiment) will be specifically described with reference to the drawings. In the present embodiment, an adhesive is applied to a pair of substrates, and the adhesive is temporarily cured and bonded, thereby suppressing the change in the week of the adhesive. [First Embodiment] [Configuration] First, a configuration of a bonding apparatus (hereinafter referred to as the present apparatus) according to the present embodiment will be described with reference to Fig. 1 . In addition, the present device is a part of a device for forming a disc, and a device for forming a substrate for the upstream of the device, and a device for forming a metal film, and transferring the substrate between the devices. The mechanism and the like are all applicable techniques, and thus the description is omitted. This apparatus includes a first spin coating device 1, a second spin coating device 2, a front irradiation portion 4 formed on a turntable 3, a bonding portion 5, a rear irradiation portion 6, and the like. The first spin coating device 装置 is a device for applying an ultraviolet curable adhesive B1 to one of the bonded substrates P 1 ' by spin coating. The first spin coating apparatus 1 is a turntable 11 including a substrate P1 and a drive source 1 2 for rotating the turntable 11. The substrate p1 is rotated to provide an adhesive supply unit (not shown). Dropped adhesive B1 extended device. As shown in Fig. 1, the second spin coater 2 is a device which applies an ultraviolet curable adhesive to a bonded other substrate P2' by spin coating. In the second spin coating apparatus 2, the turntable 21 on which the substrate p2 is placed and the drive source 22 that rotates the turntable 21 are provided, and the substrate p2 is rotated to cause the adhesive B to be dropped from the adhesive supply unit (not shown). 2 extension of the device. The turntable 3 has a first input position 31 that is inserted into the substrate pi by the front irradiation unit 4, and a substrate Ρ2 that is reversed to the opposite surface by the inverting device (not shown). The input position 32, the bonding position 3 3 corresponding to the attaching portion 5, the ultraviolet irradiation position 34 corresponding to the rear irradiation portion 6, and the carry-out position 35 for carrying out the completion of the disc D to the next project. The turntable 3 can be rotated by aligning the above positions by a drive mechanism (not shown). -11 - 200903482 The front illuminating unit 4 is a device that irradiates the adhesive B 1 applied to the substrate p } to the atmosphere by a UV irradiation device to temporarily cure the adhesive. Further, the term "in the atmosphere" in the claims and the embodiment means that the environment is hardened, such as an oxygen-containing gas atmosphere. Generally, it is relatively simple in the atmosphere, but it may be an environment containing oxygen or other hardening. The bonding unit 5 is a device that bonds the substrates Pi and P2 in a vacuum. Further, the "bonding portion 5" includes a vacuum processing chamber that is operated by a lifting mechanism, a vacuum source that decompresses the vacuum processing chamber, and a pressing portion that presses the substrate p1 'P2 by the lifting mechanism, because Since the technique is known, the explanation is omitted. The post-irradiation unit 6 irradiates the bonded substrates P 1, P2 with ultraviolet rays in a vacuum by a UV irradiation device, and causes the adhesive B 1 between the substrates P 1, P2. B2 completely hardened device. Further, the rear irradiation unit 6 also includes a vacuum processing chamber that is operated by the elevating mechanism, a vacuum source that decompresses the vacuum processing chamber, and the like. Since it is a conventional technique, the description thereof is omitted. In addition, the reason why the irradiation in a vacuum is to eliminate the hardening resistance of oxygen or the like is not necessarily an anaerobic environment. Because of the bonded substrate PI, the subsequent contact faces of P2 are substantially integrated and are not hardened by the environment. When it is bonded in the atmosphere, the outer peripheral end face is in contact with the atmosphere, and this part is the storage time (several days) on the manufacturing line to complete hardening. When the irradiation in the above-described vacuum is performed, there is an advantage that the outer peripheral end surface can be more reliably cured. The same effect can be obtained by excluding (purging) oxygen using an inert gas (N 2 ). The supply amount of the adhesive from the adhesive supply unit, the rotation of the turntable -12-200903482 and its speed, the light emission of the irradiation device, the heating device, the lifting mechanism, and the operation of the vacuum source are controlled by the control device. This control device can be realized, for example, by a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the device and a recording medium for recording the same under the procedures described below are also an aspect of the present invention. [Operation] The bonding procedure of the substrate of the present apparatus using the above will be described with reference to the flowcharts of Figs. 1 and 2 and Fig. 3 . Further, in the prior art, one substrate P1 was formed by a beach to form a translucent reflective film, and the other substrate P2 was sputtered with a totally reflective metal film. As shown in FIG. 1, in the first spin coating apparatus 1, the substrate P1 is coated with an ultraviolet curing type adhesive around the center hole, and the adhesive is stretched by rotating the turntable 1 1 at high speed (step 2). 0 1 ). For example, the coating pressure is 0_2 MPa, and the coating time is 〇.6 sec. It is opened for a period of 1 sec, for example, by a high-speed rotation of iOOOOrpm. Next, as shown in Fig. 1, the substrate P1 is put into the turntable 3 so that the surface of the adhesive B1 applied as described above can be formed (step 2〇2). Then, in the front irradiation unit 4, ultraviolet rays are totally irradiated in the atmosphere by the UV irradiation device to temporarily harden the coating form of the adhesive B1 so as not to collapse (step 203). Further, in the case of the general ultraviolet curable resin (adhesive), even if it is irradiated with ultraviolet rays in the atmosphere, it is not completely cured under normal irradiation intensity. This is because hardening is inhibited by oxygen in the air in the vicinity of the surface of the resin. In other words, if ultraviolet light is irradiated in the atmosphere, the adhesion of the surface can be maintained as it is, and the surface can be temporarily cured. For example, it has been confirmed that even at 1000mWxl~2s, it will not harden completely. However, the irradiation conditions at the time of temporary hardening are not limited to the above. Further, as shown in Fig. 1, on the other substrate P2, in the second spin coater 2, the usual spin coating of the adhesive B2 is applied (step 2〇4). For example, the coating pressure is 0.2 MPa, the coating time is 0-6 sec, and it is cleaved at a high speed rotation of 4600 rpm for 1 sec. Further, the substrate P2 is reversed by the inverting means (step 2〇5), and is applied to the upper side of the substrate P1 so that the coated surface of the adhesive B2 can be formed in the following manner (step 206). Then, the two substrates PI and P2 are conveyed to the bonding portion 5, and the bonding is performed in a vacuum in the same manner as in the prior art (step 207). The bonded substrates P1, P2 are sent to the post-irradiation portion 6, and the ultraviolet rays are completely irradiated in a vacuum, and the adhesives B1, B2 are completely cured (step 208). At this time, ultraviolet rays can be irradiated from the side of the substrate P 1 of the metal film which is sputter-transflected. The disc D which is completed by the adhesive hardening is carried out from the carry-out position 35 (step 209). [Effects] According to the above-described embodiment, since the adhesive B1 applied to the bonded substrate P1 is temporarily cured and bonded to the substrate P2, the adhesive can be maintained while maintaining the adhesive force. The flow of B 1 suppresses the intra-week variation of the thickness of the subsequent layer after lamination. Further, when the adhesive B1 is temporarily cured, 'it is hardened in the prior art', so that the gas is generated when the substrate p 1 'P2 is bonded in a vacuum, and the residual of the bubbles is reduced. Further, since the execution is temporarily suspended, it is possible to suppress the fluctuation within the week. Therefore, for example, it is also possible to ensure the release after the bonding, whereby the occurrence of the bubble can be suppressed. Further, since the irradiation of the ultraviolet ray for temporary hardening is performed after the end of the blasting without the scattering of the adhesive B1, there is no possibility that the adhesive which scatters when the cloth starts to be solidified, and there is no problem in the subsequent use after the recovery. In addition, the same effect is obtained in a place different from the spin coating. [Second Embodiment] [Configuration] This embodiment is basically the same as the above-described first embodiment. However, as shown in FIG. 3, the first spin coating apparatus 1 is provided with an irradiation device 1 that irradiates ultraviolet rays (U V ) with an adhesive B 1 on P 1 : an irradiation unit, and a heating device 14 that performs heating. A device for irradiating ultraviolet rays around the center hole of the plate P1 of the irradiation device 13 is guided by the optical fiber. The light source can also be adjusted to the intensity of the illumination using UV L E D . This heating device 14 is a device that heats the substrate p!. For example, the infrared ray irradiation unit or the heater can be used as the heating device 14. The second illuminating unit 4 of the request unit and the rear illuminating unit 6 are corresponding to the third portion. Hardening, re-spraying of the time-shifting coating of the spin coating agent also constitutes the pair of substrates i (the first is the violet at the base source, and the outer peripheral IR) is the corresponding illuminating section -15 - 200903482 [Action] 1 and the flowcharts of Fig. 2 and Fig. 3, the bonding procedure of the substrate using the above device is described. In the prior art, the substrate P1 on the side is formed by sputtering to form a translucent reflection. The film is sputtered with a metal film that is totally reflected on the other substrate P2. As shown in Fig. 1, the substrate P1 is coated with an ultraviolet curable adhesive around the center hole in the first spin coating device 1. The adhesive is stretched by rotating the turntable 1 1 at a high speed (step 4 01 ). For example, the adhesive has a viscosity of 430 mPas, a coating pressure of 〇 2 MPa, and a coating time of 0.15 sec. 〇〇〇 rpm rotates at high speed for 8 sec. As shown in FIG. 3, the substrate p1 is rotated to such an extent that the adhesive does not flow (for example, 120 rpm to 300 rpm), and ultraviolet rays are irradiated around the center hole by the irradiation device 13. Thereby, after the stretching The adhesive forms a portion (hardened portion) which is hardened into a ring shape (step 402). At this time, 'the portion having a strong UV light intensity is completely hardened, but as it travels toward the periphery', it is hindered by the oxygen of the adhesive. As a result, the surface does not solidify, and the inside solidifies, and the inside is gradually formed without hardening. Secondly, 'on the adhesive thus formed on the substrate P1 having the hardened portion, the ultraviolet curing type adhesive is applied again. The adhesive is stretched by rotating the turntable 1 1 at a high speed (step 4 0 3 ). For example, using the adhesive of the first time, the coating pressure is 0 · 2 Μ P a , and the coating time is 0.6 sec, 1 〇〇 0 rpm high-speed rotation to open with isec. At this time, Lee-16-200903482 is partially heated by the heating device 14 to extend. For example, the heat source is a heater (3卩〇1116&16 1'), wavelength is 7〇〇~3〇〇 11111, the output is set to 350 W, the heating range is 41 mm to 53 mm in the radial direction of the substrate pi, and the heating time is 1 sec. The adhesive is applied by applying an adhesive to the substrate P1 as described above, and the adhesive having a reduced viscosity is obtained by using the substrate. The centrifugal force generated by the rotation of P 2 is opened and easily discharged to the outer circumference, or heat energy can be obtained to increase the amount of volatilization. Therefore, the adhesive remaining on the outer periphery is thinned, and the thickness thereof can be suppressed, so that the entire thickness can be made. In addition, it is also possible to simultaneously apply external hot air to perform heating assistance of the adhesive. Thereafter, the substrate P1 is placed on the turntable 3 so that the surface of the adhesive B1 applied as described above can be formed as shown in Fig. 1 (step 404). Then, in the front irradiation unit 4, ultraviolet rays are totally irradiated to the atmosphere by the UV irradiation device to temporarily harden the coating form of the adhesive B 1 so as not to collapse (step 405). For example, compared with the condition (50 mW/cm2x5S) at the time of normal hardening, about half of the irradiation time (2 s) is irradiated at the same intensity. Further, as shown in Fig. 1, in the other substrate P2, the application of the usual spin coating adhesive B2 is performed in the second spin coater 2 (step 406). For example, the coating pressure is 〇2 MPa, the coating time is 0.6 sec, and it is cleaved at a high speed rotation of 6000 rpm for 1 sec. Further, the substrate P2 is reversed by the inverting means (step 407), and the coated surface of the adhesive B2 can be formed in the following manner and placed above the substrate P1 (step 408). -17- 200903482 Then, the two substrates P 1 ' P 2 are conveyed to the bonding portion 5, and are bonded in a vacuum as in the prior art (step 409). The bonded substrates P 1, P2 are sent to the post-irradiation portion 6, and the ultraviolet rays are completely irradiated in a vacuum, and the adhesives B 1, B 2 are completely cured (step 41 0). At this time, ultraviolet rays can be irradiated from the side of the substrate P 1 of the metal film which is sputter-transflected. The disc D which is completed by the adhesive hardening is carried out from the carry-out position 35 (step 4 1 1 ). [Effects] According to the present embodiment described above, even when the adhesive B1 applied to the bonded substrate P1 is thickened, the adhesive B1 is temporarily suppressed by the adhesive B1, and the flow of the adhesive B1 can be suppressed. The intra-week variation of the thickness of the subsequent layer after the bonding of the substrates P1 and P2 is suppressed. Fig. 5 is a view showing the intra-week distribution of the subsequent layer after the bonding. Therefore, the examples produced in the above-described embodiments and the conventional examples in which the bonding is not temporarily cured (other conditions are the same as in the examples), and when the average intra-cycle variation rate is compared, the week of the example is known. The internal changes are smaller than in the past. Further, the coating thickness can be easily adjusted by changing the coating amount, the rotation condition, and the number of extensions of the adhesive. In particular, when it is desired to increase the coating thickness, as described above, the hardened portion is formed and superposed while being heated, whereby a uniform thickness can be secured, so that the effect of suppressing the variation in the week can be improved. It may be applied to the substrate P2 in a thick manner or applied to both of the substrates PI and P2 in a thick manner. In this case, the second rotating coating apparatus 2 may be provided with the irradiation apparatus 1 3', whereby the adhesive agent may be formed on the substrate P2, and the thickness of the device may be suppressed by providing the heating device -18-200903482. Big. Further, similarly to the above-described first embodiment, since the occurrence of degassing is suppressed by the temporary hardening, it is possible to reduce the residual air bubbles and to suppress the air bubbles as long as the placement time is ensured. In addition, after the end of the spin coating, the irradiation of the ultraviolet ray to be temporarily hardened is performed at a point different from the spin coating, and the substrate P 1 is irradiated at the point of rotation, and is only a part of the irradiation. There is no problem in the recovery of the adhesive agent. [Other embodiments] The present invention is not limited to the above embodiment. In the above embodiment, an adhesive is applied to both substrates, and only one of the adhesives is subjected to ultraviolet irradiation (temporary curing, spot irradiation). However, the application of the adhesive of the request and the irradiation of the electromagnetic waves may be performed on at least one of the substrates. Therefore, it is also possible to apply an adhesive to only one of the substrates. Further, when the adhesive is applied to both of the substrates, both of the adhesives may be irradiated with ultraviolet rays. For example, as shown in FIG. 6, the first pre-irradiation portion 4a that irradiates the substrate P1 with ultraviolet rays and the second pre-irradiation portion 4b that irradiates the substrate P2 with ultraviolet rays may be provided, whereby the adhesive B1' is applied thereto. After both sides of B2 are temporarily hardened, they are bonded together. In this way, a deeper suppression effect during the week can be obtained, and the bubble reduction effect can also be obtained. In addition, the adhesive to be used is not limited to the ultraviolet curable resin, and other electromagnetic waves irradiated by electromagnetic waves (including laser light), -19-200903482 resin, thermosetting resin, or the like may be used. Type, line), laser light of a predetermined wavelength, in order to apply a thick adhesive, to form a drop amount of the multi-adhesive agent, and the bonding may not necessarily be applied to the first substrate and the second substrate for applying the adhesive. A plurality of rotary coating devices are used in the spin coating device, and any of the devices that are available or can be used in the future, the front irradiation portion may be provided no matter where it is placed. The example is set from the spin coating device to the substrate P that can be placed on the turntable. The size of the substrate, the owner of which is used. For the disc used for the body, of course, the recording medium can be applied. Further, it is not limited to all the substrates which are bonded together by the following agents, and is not limited to a disk shape. Therefore, depending on the type of the resin, ultraviolet light or infrared light (including heat or the like may be applied. In the above embodiment, the hardened portion is applied in a superposed manner, but the coating may be applied. The heating may be omitted. The cloth portion may be of a multiplicity or a plurality. For example, a common spin coating device may be used for overlapping coating. The coating portion is not limited to a device capable of applying an adhesive, and includes a twist now. Between the application and the bonding, for example, it can be placed in the middle of the transfer of the spin coating device or the turntable. As described above, [, one of P2, or both. The shape, material, etc. are free and applicable. This can be applied to discs of any type of recording medium, such as a write-once type recording medium or a write-type recording medium, and can be applied to, for example, the "substrate is widely included in the plane. Illustrated in the first embodiment of the bonding apparatus of the present invention. Fig. 2 is a flow chart showing the processing procedure of the embodiment of Fig. 1. Fig. 3 is a schematic longitudinal cross-sectional view showing a spin coating apparatus according to a second embodiment of the bonding apparatus of the present invention. Fig. 4 is a flowchart showing a processing procedure of the embodiment of Fig. 3. Fig. 5 is a flowchart showing An illustration of the intra-circumference distribution of the thickness of the laminate layer of the embodiment of the present invention and the conventional example. FIG. 6 is a view showing an embodiment in which the front irradiation unit is provided in the bonding apparatus of the present invention. Fig. 7 is an explanatory view showing a conventional substrate bonding procedure, wherein (A) shows the extension of the adhesive, (B) shows the introduction into the vacuum processing chamber, and (C) shows the adhesion. Fig. 8 is an explanatory view showing the atmosphere in which the adhesive is cured, and Fig. 8 is an explanatory view showing the distribution of the thickness of the subsequent layer thickness of the disk manufactured by the prior art. Description of the component symbols: 1 : 1st spin coating apparatus 3, 1, 1, 21: Turntable 2: 2nd spin coating apparatus 4: front irradiation part 4a. · 1st front irradiation part 4b: 2nd front irradiation part-21 - 200903482 5 : Bonding part 6 : Rear irradiation part 1 2, 2 2 : Driving source 1 3 : Irradiation device 1 4: heating device 3 1 : first input position 3 2 : second input position 3 4 : ultraviolet irradiation position 3 5 : carry-out position -22