200900516 九、發明說明 【發明所屬之技術領域】 本發明，係有關於對位裝置，與具備有該對位裝置之 成膜裝置。 【先前技術】 在先前之對位機構的鈎與基板之間’或是在基板授受 機構之升降銷與基板之間，於與基板接觸之接觸部分處’ 係被配置有由耐熱性高之 PEEK (聚醚醚酮：200900516 IX. Description of the Invention [Technical Field] The present invention relates to a registration device and a film formation device including the alignment device. [Prior Art] The heat-resistant PEEK is disposed between the hook of the previous alignment mechanism and the substrate or between the lift pin of the substrate receiving mechanism and the substrate at the contact portion with the substrate. (Polyetheretherketone:
Polyetheretherketone)樹脂或是聚醯亞胺樹脂（Ε· I. duPolyetheretherketone) resin or polyimine resin (Ε· I. du
Pont de Nemours and Company 製「VESPEL」（登錄商標 ))所構成之樹脂接觸部。 又，樹脂接觸部之形狀，亦爲了使其與高溫之基板的 接觸面積變小，而成形爲突起狀或是半球狀。 於圖1 〇 ( a )所示之對位機構中，係在被水平設置於 桿1 22之下端的鈎1 23之前端，設置有半球狀之樹脂接觸 部1 1 0，而基板1 07，係在樹脂接觸部1 1 0上，以點接觸 而被承載。 又，在圖1 〇 ( b )所示之升降銷1 1 6處，係於其上端 被設置有半球狀之樹脂接觸部112，而基板107也是與樹 脂接觸部作點接觸。 關於先前技術之升降銷等，例如係被記載於下述之專 利文獻中。 〔專利文獻1〕日本特開2004-98448號公報 200900516 【發明內容】 〔發明所欲解決之課題〕 耐熱性樹脂’由於摩擦係數係爲小，因此，其與基板 間之摩擦力係爲小。又’由於係爲點接觸，因此，摩擦力 係變得更小’故而’在鈎1 2 3或是升降銷Π 6上，會產生 基板1 〇 7之橫向滑動，其結果，會產生對位之精確度降低 ’或者是基板107從升降銷116上脫落之問題。 本發明’係爲了解決上述先前技術中之缺點所創作者 ，而係爲提供一種使基板不會產生橫向滑動之技術者。 〔用以解決課題之手段〕 爲了解決上述課題，本發明，係爲一種對位裝置，係 具備有真空槽、和被配置於前述真空槽內之遮罩保持裝置 、和以特定之圖案而被形成有貫通孔，並被配置於前述遮 罩保持裝置處之遮罩、和被配置於前述真空槽內，並被配 置有基板之基板保持裝置，前述遮罩與前述基板，係可相 對移動地被構成，並以能夠使前述遮罩與前述基板進行對 位的方式而被構成，其特徵爲：在前述基板保持裝置之與 前述基板相接觸的部分，係被配置有由以氟素橡膠、腈橡 膠（NBR )、氫化腈橡膠（HNBR )、矽橡膠（VMQ )、 三元乙丙橡膠（EPDM)、氯丁二烯橡膠（CR)、丙烯酸 橡膠（ACM ) 、丁基橡膠（BR)、胺酯橡膠（U)、氯磺 化聚乙烯橡膠（CSM)、環氧氯丙烷橡膠（CO、ECO )、 200900516 天然橡膠（NR)、全氯（perfluoro )彈性體所成之橡膠群 中選擇一種以上而成的板狀之第1接觸構件，前述基板， 係被承載於前述第1接觸構件上。 又，本發明，係爲一種對位裝置，其中，前述基板保 持裝置係被連接於水平移動機構，並被構成爲在水平面內 移動。 又，本發明，係爲一種對位裝置，其中，係具備有靜 止摩擦係數爲較前述第1接觸構件更小的第2接觸構件， 在前述基板之相對向的2邊中，前述第1接觸構件係被配 置於一邊側，而前述第2接觸構件係被配置於另外一邊側 〇 又，本發明，係爲一種成膜裝置，其特徵爲：具備有 上述之任一的對位裝置；和被配置於前述真空槽內之成膜 源。 〔發明效果〕 由於在接觸構件上基板係不會橫向滑動’因此’能夠 正確地進行對位，而能夠形成位置精確度高之薄膜。 【實施方式】 圖1之符號1 ’係代表本發明之第1例的成膜裝置’ 其構成，係在具備有本發明之對位裝置的真空槽11之內 部的底壁側，配置有成膜源14 ° 在真空槽]1之內部的成膜源1 4之上方位置’係被配 -6- 200900516 置有遮罩保持裝置12、和基板保持裝置13。 基板保持裝置1 3係具備有水平移動機構21， 移動機構21處，複數的桿22，係朝向垂直下方而迎 於此，桿2 2係爲4根，並以位置於四角形之 方式而被配置。 各桿22之下端，係被水平設置有板狀之鈎23。 各鈎23，係以於其上乘載四角形之基板7的方 朝向各桿所被配置之四角形的中央方向、又或是朝 四角形之四邊的方向，在各鈎23之前端的表面處 圖6所示一般，被成在有由板狀之氟素橡膠（ Performance Elastomers LCC 製「Viton」（登錄商 所成之接觸構件1 〇。 接觸構件1 〇，係經由推壓板2 5，而被固定於銘 表面。 接觸構件1 〇之表面係爲平面，並成爲水平。 在鈎23之上方，係被配置有磁石保持裝置26 磁石保持裝置26處，於較鈎23爲更上方之位置處 有磁石5。 又，鈎保持裝置12，係被配置在鈎23之下方 在鈎保持裝置12處，係於較鈎23爲更下方之位置 平地保持有遮罩6。 當藉由此成膜裝置1而在基板表面上形成薄膜 先，係經由真空幫浦27而將真空槽11內作真空排 其成爲真空氣體環境，而後，在真空槽內，將 在水平 ί伸。 頂點的 式，而 向沿著 ，係如 Dupont 標）） I 23之 ，在此 而保持 位置。 處，水 時，首 氣並使 成膜面 -7- 200900516 朝向垂直下方，而搬入基板，並不與桿22接觸地而將基 板插入至磁石5與遮罩6之間，而乘載於鈎23之接觸構 件10上。 圖2之符號7，係展示被載置於鈎2 3上之狀態的基板 ，基板之成膜面的邊緣附近，係與接觸構件1 〇之表面部 分性的密著，而基板7係與接觸構件1 0作面接觸。在此 狀態下，基板7係成爲水平，而基板7與遮罩6係相互分 離。 在基板之上方，係被配置有攝像機15，並對基板7上 之特定的攝影範圍作攝影，而經由畫像處理來辨識出被包 含於攝影範圍內之被配置在基板7上的基板對位記號，而 測定基板對位記號之位置或是基板7之水平面內的方向， 並記憶之。 遮罩保持裝置12，係被連接於未圖示之升降機構，並 構成爲能在保持了遮罩6之狀態下而於上下方向移動。 藉由該升降機構，如圖3所示一般，在不與基板7接 觸的範圍內，而使遮罩6在垂直方向移動，並經由攝像機 1 5來對遮罩6上之特定的攝影範圍作攝影，而測定被配置 在遮罩6上之遮罩對位記號之位置、或是遮罩6之在水平 面上之方向，並由測定結果與所記憶之基板7的位置或方 向，來求取出遮罩6與基板7之相對性的位置關係。 在此狀態下，於遮罩6與基板7之間係存在有空隙， 並使遮罩與基板7相互不接觸地對相對性移動，而能夠進 行遮罩6與基板7之對位。 -8- 200900516 例如，係使基板與遮罩6在水平面內相對性的移動， 並使基板對位記號位置於遮罩對位記號的正上方。可使基 板與遮罩6中的其中一方作移動，亦可使雙方作移動。在 本發明之第1例的成膜裝置中，係成爲：遮罩保持裝置係 在水平方向上被固定，並以基板保持裝置〗3來將溝23在 水平方向上移動，而進行對位。 被配置於鈎23上之基板7，係被乘載於接觸構件i 〇 上。由於接觸構件1 〇係爲氟素橡膠，因此其靜止摩擦係 數係爲大。又，由於接觸構件1 〇係爲板狀，而基板7與 接觸構件1 〇之接觸面積爲大，因此，基板7與接觸構件 10之間的靜止摩擦力係爲大，當在水平面內鈎23移動之 時，基板7在接觸構件1 0上係不會橫向滑動，故而，鈎 23之移動量與基板7之移動量係爲相等，若是爲了進行對 位而使鈎23移動，則基板7與遮罩6係被作對位。 當在基板處產生彎曲的情況時，係亦可進行以下之將 彎曲消除的動作。 接觸構件1 〇，係在基板7之相對向的2邊側各被配置 有2個。複數之鈎23，係被構成爲可朝同一方向移動，亦 可朝相異方向移動。在進行對位前，在將基板7乘載於接 觸構件1 0上的狀態下，若是使鈎23朝向使鈎23彼此間 之間隔變廣的方向而移動，則在基板7上係被施加有張力 ，而能夠消除基板7之彎曲。若是在解除了彎曲的狀態下 進行對位，則能夠進行更爲正確之對位。 遮罩6係以磁性材料所構成，在進行了對位後，若是 -9- 200900516 如圖4所示一般，使遮罩6朝向垂直上方移動， 5朝向下方移動’而使遮罩在與基板接觸的狀態 引於磁石5處，則遮罩6與基板7係密著。 在此狀態下，遮罩6係被固定於基板7上， 若是如圖5所示一般，使桿2 2旋轉，而使鈎2 3 脫離’則基板7係與遮罩以及磁石5 —同地被乘 保持裝置1 2上。 在遮罩6處，係被形成有特定圖案之貫通孔 孔底面，基板7之成膜面的特定位置係露出。 成膜原14，係被配置於基板7之垂直下方位 是預先將被配置在成膜源14內之蒸鍍材料作加 由遮罩保持裝置12，來使遮罩6與基板7與磁石 水平面內作旋轉，同時從成膜源14而放出蒸鍍 氣，則蒸氣係到達露出於貫通孔底面之基板7的 於該部分形成薄膜。 成膜源14，係可爲放出有機蒸氣之有機蒸鍍 爲放出金屬或介電質之蒸氣的無機蒸鍍源。 在上述成膜裝置1中，於進行對位時，雖係 在水平面內作移動，但是，接觸構件1 0 ’係並非 使用於此種成膜裝置1中的情況° 例如，亦可構成爲如同圖7所示之第2例的 一般，在遮罩保持裝置12處設置水平移動機構 遮罩保持裝置12來作水平移動° 在此成膜裝置2中’亦於鈎2 3之前端設置 並使磁石 下而被吸 接下來， 從基板7 載於遮罩 ，在貫通 置處，若 熱’並藉 5 —起在 材料之蒸 表面，並 源，亦可 使基板7 被限定在 成膜裝置 2 7，並使 有接觸構 -10- 200900516 件1 〇，若是以使其接觸於接觸構件1 0上的方式而配置基 板7，則當將基板7配置於基板保持裝置1 3處時，或是在 將基板保持裝置13上之基板7經由磁石5而使其密著在 遮罩6處時，基板7係不會發生橫向滑動，而能夠進行位 置精確度良好之成膜。 在上述實施例中，本發明之對位裝置（成膜裝置1、2 )，雖係於其真空槽11之內部配置有成膜源14，但是， 不具備有成膜源1 4之對位裝置，係亦包含於本發明之範 圍內。 又，本發明，係並非限定於在使基板7水平移動之鈎 2 3處設置接觸構件1 〇的對位裝置。 例如，於圖8 ( a ) 、 （ b )中所示之對位裝置3，在 真空槽1 1之內部係並未配置有成膜源，而係在進行了對 位後，經由被連接於真空槽11之成膜裝置來在基板表面 上形成薄膜’但是，在此對位裝置3中，於被配置在真空 槽11之內部的基板保持裝置13處，係被設置有升降機購 28、和被連接於升降機構28處之升降銷16，而於升降銷 16之前端，係被設置有由氟素橡膠所構成之接觸構件18 〇 此對位裝置3，係與圖7同樣的，具備有使遮罩6水 平移動之水平移動機構2 7。從該水平移動機構2 7，係朝 向垂直下方而延伸有腕19，於該腕16之下端處，係乘載 有遮罩6’而於遮罩6之上方，係被配置有磁石5。 若是將被配置在基板搬送機器人之手上的基板7，以 -11 - 200900516 使其之上端位置於較遮罩爲更下方的方式而搬入至遮罩6 與磁石5間之位置’則係使升降銷1 6移動至上方，並於 上端乘載基板7。 圖8(a)，係爲將基板搬送機器人之手從遮罩6與磁 石5之間而拔去的狀態。 接觸構件1 8 ’係如圖9所示一般而在上端形成平坦面 1 7，而該平坦面1 7係被設爲水平，所搬入之基板7係與 接觸構件1 8作面接觸。 若是在此狀態下經由水平移動機構2 7而使遮罩6在 水平面內移動，並進行基板7與遮罩6之對位，並使升降 銷16下降’而將基板7乘載於遮罩6上，再將磁石5乘 載於基板7上，則磁石5係吸引遮罩6，而如同圖之（b ) 所示一般，使基板7與遮罩6密著。 當將基板7從手上而舉起時，或是當將基板7乘載於 遮罩ό上時’經由面接觸，在接觸構件〗〇與基板7之間 係產生大的靜止摩擦力，基板7係不會在升降銷16上橫 向滑動，而對位精確度係爲高，又，亦不會有基板7從升 降銷1 6上脫落的情形。 如此這般’在本發明之對位裝置中，在使基板升降移 動之升降銷1 6等的基板7所被配置之構件處，係可配置 接觸構件1 0。 另外’在上述實施例中，於接觸構件1 0、1 8之材料 中’雖係使用了氟素橡膠，但是。亦可使用腈橡膠（NBR ) '氫化腈橡膠（HNBR)、矽橡膠（VMQ)、三元乙丙 -12- 200900516 橡膠（EPDM)、氯丁二稀橡膠（CR)、两稀酸橡膠（ ACM) 、丁基橡膠（BR)、胺酯橡膠（U)、氯磺化聚乙 烯橡膠（CSM)、環氧氯丙烷橡膠（CO、ECO)、天然橡 膠（NR )、全氯（perfluoro )彈性體等之橡膠。 可藉由1個種類之橡膠’來構成1個的接觸構件10, 亦可組合相異種類之橡膠，來構成1個的接觸構件1 〇。又 ’亦可配置藉由相異種類的橡膠所構成之2個以上的接觸 構件1 〇。 另外，在上述實施例中，雖係在基板7之相對向的2 邊處配置了接觸構件1 〇，但是，本發明係並非限定於此， 亦可將與上述接觸構件10爲相同材質之靜止摩擦係數爲 大的第1接觸構件配置於基板7之其中一邊側，而在與該 邊相對向之邊側，則配置靜止摩擦係數爲較第1接觸構件 更小的第2接觸構件。 若是使用靜止摩擦係數爲大之第1接觸構件側的對位 記號來進行基板與遮罩之對位，則就算是基板產生彎曲的 情況時，當藉由遮罩與磁石來挾持基板時，亦由於係以解 消基板之彎曲量的方式而使基板7在第1接觸構件上並不 移動且在第2接觸構件上滑動，因此，在進行了對位之對 位側，基板7之位置係並不會偏移，而能夠進行將彎曲解 消後的正確之對位。 【圖式簡單說明】 〔圖1〕本發明之第I例的成膜裝置。 -13- 200900516 〔圖2〕用以說明該成膜裝置之對位工程的圖（丨）。 〔圖3〕用以說明該成膜裝置之對位工程的圖（2 )。 〔圖4〕用以說明該成膜裝置之對位工程的圖（3 )。 〔圖5〕用以說明該成膜裝置之對位工程的圖（4)。 〔圖6〕鈎與接觸構件的擴大圖。 〔圖7〕本發明之第2例的成膜裝置。 〔圖8〕 ( a ) 、( b ):用以說明本發明之對位裝置 的圖。 〔圖9〕升降銷上端的擴大圖。 〔圖10〕 （a) 、（b):用以說明先前技術的圖。 【主要元件符號說明】 1、2 :成膜裝置 3 :對位裝置 6 :遮罩 7 :基板 I 0、1 8 :接觸構件 II :真空槽 1 2 :遮罩保持裝置 1 3 :基板保持裝置 1 4 :成膜源 21、27:水平移動機構 23 :鈎 -14-A resin contact portion made of "VESPEL" (registered trademark) manufactured by Pont de Nemours and Company. Further, the shape of the resin contact portion is also formed into a projection shape or a hemispherical shape in order to reduce the contact area with the substrate having a high temperature. In the alignment mechanism shown in Fig. 1 (a), a hemispherical resin contact portion 110 is provided at a front end of the hook 1 23 which is horizontally disposed at the lower end of the rod 1 22, and the substrate 107, It is carried on the resin contact portion 110, and is carried by point contact. Further, in the lift pin 1 16 shown in Fig. 1 (b), a hemispherical resin contact portion 112 is provided at the upper end thereof, and the substrate 107 is also in point contact with the resin contact portion. The lift pins and the like of the prior art are described, for example, in the following patent documents. [Problem to be Solved by the Invention] The heat-resistant resin ′ has a small friction coefficient, and therefore the frictional force between the substrate and the substrate is small. In addition, since the contact is made by the point contact, the frictional force becomes smaller. Therefore, on the hook 1 2 3 or the lift pin 6 , the lateral sliding of the substrate 1 〇 7 occurs, and as a result, the alignment occurs. The accuracy is reduced 'or the problem that the substrate 107 is detached from the lift pins 116. The present invention has been made in order to solve the above-mentioned shortcomings of the prior art, and to provide a technique for causing the substrate to not cause lateral sliding. [Means for Solving the Problems] In order to solve the above problems, the present invention provides a aligning device including a vacuum chamber, a mask holding device disposed in the vacuum chamber, and a specific pattern. a mask having a through hole formed in the mask holding device, and a substrate holding device disposed in the vacuum chamber and disposed with the substrate, wherein the mask and the substrate are relatively movable And configured to be capable of aligning the mask with the substrate, wherein a portion of the substrate holding device that is in contact with the substrate is provided with fluororubber, Nitrile rubber (NBR), hydrogenated nitrile rubber (HNBR), niobium rubber (VMQ), EPDM, chloroprene rubber (CR), acrylic rubber (ACM), butyl rubber (BR), One of rubber groups made of urethane rubber (U), chlorosulfonated polyethylene rubber (CSM), epichlorohydrin rubber (CO, ECO), 200900516 natural rubber (NR), and perfluoro elastomer Above The plate-like first contact member, the substrate, the system is carried on the first contact member. Further, the present invention is a aligning device in which the substrate holding device is connected to a horizontal moving mechanism and configured to move in a horizontal plane. Moreover, the present invention is a aligning device including a second contact member having a static friction coefficient smaller than that of the first contact member, and the first contact in the two opposite sides of the substrate The member is disposed on one side, and the second contact member is disposed on the other side, and the present invention is a film forming apparatus characterized by comprising any one of the above-described alignment devices; A film forming source disposed in the vacuum chamber. [Effect of the Invention] Since the substrate does not slide laterally on the contact member, the alignment can be accurately performed, and a film having high positional accuracy can be formed. [Embodiment] The symbol 1' of the first example of the present invention is configured to be disposed on the bottom wall side of the inside of the vacuum chamber 11 including the alignment device of the present invention. The film source 14° is placed at a position above the film formation source 14 inside the vacuum chamber 1 and is placed in a -6-200900516 with a mask holding device 12 and a substrate holding device 13. The substrate holding device 13 is provided with a horizontal movement mechanism 21, and the plurality of rods 22 are oriented vertically downward, and the rods 2 are four, and are arranged in a square shape. . The lower end of each rod 22 is horizontally provided with a plate-like hook 23. Each of the hooks 23 is formed such that the direction of the base plate 7 on which the quadrilateral is loaded is directed toward the central direction of the square in which the rods are arranged, or the direction toward the four sides of the square, at the surface of the front end of each of the hooks 23 as shown in FIG. In general, it is formed of a plate-shaped fluorocarbon rubber ("Viton" manufactured by Performance Elastomers LCC (contact member 1 made by the registrar. The contact member 1 〇 is fixed to the surface of the face via the push plate 25). The surface of the contact member 1 is flat and horizontal. Above the hook 23, the magnet holding device 26 is disposed at the magnet holding device 26, and the magnet 5 is located above the hook 23. The hook holding device 12 is disposed below the hook 23 at the hook holding device 12, and is held flat with a mask 6 at a position lower than the hook 23. When the film forming device 1 is used on the surface of the substrate First, the film is formed on the vacuum chamber 27, and the vacuum chamber 11 is vacuum-discharged into a vacuum gas atmosphere, and then, in the vacuum chamber, it will be horizontally stretched. Dupont mark)) I 23, here to maintain the position. At the time of water, the first gas and the film-forming surface -7-200900516 are directed vertically downward, and are carried into the substrate, and the substrate is inserted into the magnet 5 and the mask 6 without contacting the rod 22, and is carried by the hook. 23 on the contact member 10. Reference numeral 7 in Fig. 2 shows a substrate placed on the hook 2 3, and the vicinity of the edge of the film formation surface of the substrate is partially adhered to the surface of the contact member 1 while the substrate 7 is in contact with The member 10 is in surface contact. In this state, the substrate 7 is horizontal, and the substrate 7 and the mask 6 are separated from each other. Above the substrate, a camera 15 is disposed, and a specific imaging range on the substrate 7 is photographed, and the substrate alignment mark disposed on the substrate 7 included in the imaging range is recognized by image processing. The position of the substrate registration mark or the direction in the horizontal plane of the substrate 7 is measured and memorized. The mask holding device 12 is connected to an elevating mechanism (not shown), and is configured to be movable in the vertical direction while the mask 6 is held. With the elevating mechanism, as shown in FIG. 3, the mask 6 is moved in the vertical direction in a range not in contact with the substrate 7, and the specific imaging range on the mask 6 is made via the camera 15. Photographing, and measuring the position of the mask alignment mark disposed on the mask 6, or the direction of the mask 6 on the horizontal plane, and taking out the measurement result and the position or direction of the memorized substrate 7, The relative positional relationship between the mask 6 and the substrate 7. In this state, a gap is formed between the mask 6 and the substrate 7, and the mask and the substrate 7 are relatively moved without being in contact with each other, and the mask 6 and the substrate 7 can be aligned. -8- 200900516 For example, the relative movement of the substrate and the mask 6 in the horizontal plane is made, and the substrate registration mark is positioned directly above the mask alignment mark. One of the substrate and the mask 6 can be moved, and both sides can be moved. In the film forming apparatus of the first example of the present invention, the mask holding device is fixed in the horizontal direction, and the groove 23 is moved in the horizontal direction by the substrate holding device 3 to be aligned. The substrate 7 disposed on the hook 23 is carried on the contact member i 。. Since the contact member 1 is made of fluororubber, its static friction coefficient is large. Further, since the contact member 1 is in the form of a plate, and the contact area between the substrate 7 and the contact member 1 is large, the static friction between the substrate 7 and the contact member 10 is large, and when hooked in the horizontal plane 23 When moving, the substrate 7 does not slide laterally on the contact member 10, so the amount of movement of the hook 23 is equal to the amount of movement of the substrate 7, and if the hook 23 is moved for alignment, the substrate 7 and The mask 6 is aligned. When a bending occurs at the substrate, the following action of eliminating the bending can be performed. The contact members 1 are arranged in two on the opposite sides of the substrate 7. The plurality of hooks 23 are configured to be movable in the same direction or in different directions. Before the alignment of the substrate 7 is carried out on the contact member 10, the hooks 23 are moved in a direction in which the distance between the hooks 23 is widened, and the substrate 7 is applied thereto. The tension can eliminate the bending of the substrate 7. If the alignment is performed while the bending is released, a more accurate alignment can be performed. The mask 6 is made of a magnetic material. After the alignment, if it is -9-200900516, as shown in FIG. 4, the mask 6 is moved vertically upward, 5 is moved downward, and the mask is placed on the substrate. When the state of the contact is directed to the magnet 5, the mask 6 is adhered to the substrate 7. In this state, the mask 6 is fixed to the substrate 7. If the rod 2 2 is rotated as shown in FIG. 5, and the hook 2 3 is disengaged, the substrate 7 is in the same manner as the mask and the magnet 5. It is taken up by the holding device 1 2 . At the mask 6, a bottom surface of the through hole having a specific pattern is formed, and a specific position of the film formation surface of the substrate 7 is exposed. The film formation unit 14 is disposed in the vertical direction of the substrate 7 so that the vapor deposition material disposed in the film formation source 14 is added to the mask holding device 12 in advance to make the mask 6 and the substrate 7 and the magnet surface level. When the inside is rotated and the vapor deposition gas is discharged from the film formation source 14, the vapor reaches the substrate 7 exposed on the bottom surface of the through hole, and a thin film is formed in the portion. The film formation source 14 may be an organic vapor deposition source that emits organic vapor to evaporate a vapor of a metal or a dielectric. In the above-described film forming apparatus 1, although the movement is performed in the horizontal plane when the alignment is performed, the contact member 10' is not used in the film forming apparatus 1. For example, it may be configured as In the second example shown in Fig. 7, generally, a horizontal moving mechanism mask holding device 12 is provided at the mask holding device 12 for horizontal movement. In this film forming device 2, 'the front end of the hook 2 3 is also disposed and After the magnet is sucked up, it is carried from the substrate 7 to the mask, and if it passes through the heat, and the source is vaporized on the surface of the material, the substrate 7 can be limited to the film forming apparatus 2 7. When the substrate 7 is placed so as to be in contact with the contact member 10, the substrate 7 is disposed so as to be in contact with the contact member 10, or when the substrate 7 is placed on the substrate holding device 13 When the substrate 7 on the substrate holding device 13 is adhered to the mask 6 via the magnet 5, the substrate 7 does not slide laterally, and film formation with good positional accuracy can be performed. In the above embodiment, the alignment device (film formation devices 1, 2) of the present invention has the film formation source 14 disposed inside the vacuum chamber 11, but does not have the alignment of the film formation source 14 Devices are also included within the scope of the invention. Further, the present invention is not limited to the positioning device in which the contact member 1 is provided at the hook 2 3 which horizontally moves the substrate 7. For example, in the alignment device 3 shown in FIGS. 8( a ) and ( b ), the film formation source is not disposed inside the vacuum chamber 1 1 but is connected to the position after being aligned. The film forming apparatus of the vacuum chamber 11 forms a film on the surface of the substrate. However, in the alignment device 3, the substrate holding device 13 disposed inside the vacuum chamber 11 is provided with a lift 28, and The lifting pin 16 is connected to the lifting mechanism 28, and the contact member 18 made of fluorocarbon rubber is provided at the front end of the lifting pin 16, and the positioning device 3 is provided in the same manner as in FIG. A horizontal moving mechanism 27 that moves the mask 6 horizontally. From the horizontal moving mechanism 27, a wrist 19 is extended vertically downward, and at the lower end of the wrist 16, a shield 6' is carried and a magnet 5 is disposed above the mask 6. If the substrate 7 to be placed on the hand of the substrate transfer robot is moved to the position between the mask 6 and the magnet 5 so that the upper end position is lower than the mask from -11 to 200900516, The lift pin 16 moves to the upper side and carries the substrate 7 at the upper end. Fig. 8(a) shows a state in which the hand of the substrate transfer robot is removed from between the mask 6 and the magnet 5. The contact member 18' is generally formed as a flat surface 17 at the upper end as shown in Fig. 9, and the flat surface 17 is horizontally placed, and the loaded substrate 7 is in surface contact with the contact member 18. In this state, the mask 6 is moved in the horizontal plane via the horizontal moving mechanism 27, the substrate 7 is aligned with the mask 6, and the lift pins 16 are lowered, and the substrate 7 is carried on the mask 6. Then, the magnet 5 is loaded on the substrate 7, and the magnet 5 attracts the mask 6, and as shown in (b) of the figure, the substrate 7 and the mask 6 are adhered. When the substrate 7 is lifted from the hand, or when the substrate 7 is carried on the mask ', a large static friction force is generated between the contact member 〇 and the substrate 7 via the surface contact, the substrate The 7 series does not slide laterally on the lift pins 16, but the alignment accuracy is high, and there is no case where the substrate 7 is detached from the lift pins 16. In the alignment device of the present invention, the contact member 10 can be disposed at a member where the substrate 7 such as the lift pin 16 that moves the substrate up and down is disposed. Further, in the above embodiment, the fluorocarbon rubber was used in the materials of the contact members 10 and 18, however. Nitrile rubber (NBR) 'Hydrogenated nitrile rubber (HNBR), ruthenium rubber (VMQ), EPDM-12-200900516 rubber (EPDM), chloroprene rubber (CR), two dilute acid rubber (ACM) ), butyl rubber (BR), amine ester rubber (U), chlorosulfonated polyethylene rubber (CSM), epichlorohydrin rubber (CO, ECO), natural rubber (NR), perfluoro elastomer Wait for the rubber. One contact member 10 may be formed of one type of rubber ‘, or a different type of rubber may be combined to constitute one contact member 1 〇. Further, two or more contact members 1 构成 composed of different types of rubber may be disposed. Further, in the above-described embodiment, the contact member 1 is disposed on the opposite sides of the substrate 7, but the present invention is not limited thereto, and the same material as the contact member 10 may be stationary. The first contact member having a large friction coefficient is disposed on one side of the substrate 7, and the second contact member having a static friction coefficient smaller than that of the first contact member is disposed on the side opposite to the side. When the alignment of the substrate and the mask is performed using the alignment mark on the side of the first contact member having a large static friction coefficient, even when the substrate is bent, when the substrate is held by the mask and the magnet, Since the substrate 7 does not move on the first contact member and slides on the second contact member so as to cancel the amount of bending of the substrate, the position of the substrate 7 is aligned on the alignment side of the alignment. Without offset, the correct alignment can be performed after the bending is cancelled. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A film forming apparatus of a first example of the present invention. -13- 200900516 [Fig. 2] A diagram (丨) for explaining the alignment of the film forming apparatus. Fig. 3 is a view (2) for explaining the alignment of the film forming apparatus. Fig. 4 is a view (3) for explaining the alignment of the film forming apparatus. Fig. 5 is a view (4) for explaining the alignment of the film forming apparatus. [Fig. 6] An enlarged view of the hook and the contact member. Fig. 7 is a film formation apparatus of a second example of the present invention. [Fig. 8] (a), (b): A diagram for explaining the alignment device of the present invention. [Fig. 9] An enlarged view of the upper end of the lift pin. [Fig. 10] (a), (b): A diagram for explaining the prior art. [Description of main component symbols] 1, 2: Film forming apparatus 3: Registration device 6: Mask 7: Substrate I 0, 1 8 : Contact member II: Vacuum chamber 1 2 : Mask holding device 1 3 : Substrate holding device 1 4 : film forming source 21, 27: horizontal moving mechanism 23: hook-14-